Material Content Data Sheet Sales Product Name IPZ40N04S5-8R4 MA# MA001338272 Package PG-TSDSON-8-32 Issued 15. June 2015 Weight* 35.21 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver silver tin lead phosphorus zinc iron copper phosphorus zinc iron copper 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7723-14-0 7440-66-6 7439-89-6 7440-50-8 0.222 0.63 0.003 0.01 0.012 0.04 353 0.249 0.71 7065 10.102 28.69 29.45 286879 294385 0.031 0.09 0.09 875 875 0.037 0.11 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.63 6311 6311 88 1065 1.931 5.48 16.779 47.63 53.22 476471 532370 0.400 1.14 1.14 11367 11367 0.086 0.24 0.24 2432 2432 0.009 0.03 0.007 0.02 0.353 1.00 0.001 0.00 0.002 0.01 67 0.047 0.13 1334 1.908 5.42 0.001 0.00 0.004 0.01 103 0.073 0.21 2068 2.958 8.40 54834 262 210 1.05 10013 5.56 54172 2. 3. 8.62 83988 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 55590 26 Important Remarks: 1. 10485 17 86185 1000000