Material Content Data Sheet Sales Product Name SAK-C167SR-LM HA+ MA# MA000972160 Package PG-MQFP-144-8 Issued 29. August 2013 Weight* 4197.93 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon magnesium silicon nickel copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7439-95-4 7440-21-3 7440-02-0 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 25.986 0.62 0.976 0.02 232 1007 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.62 6190 6190 4.227 0.10 19.510 0.46 625.625 14.90 15.48 149032 154919 7.263 0.17 0.17 1730 1730 10.438 0.25 4648 2487 441.893 10.53 3027.140 72.13 82.91 721102 828853 19.066 0.45 0.45 4542 4542 10.582 0.25 0.25 2521 2521 1.045 0.02 4.180 0.10 105264 249 0.12 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 996 1245 1000000