Sample & Buy Product Folder Support & Community Tools & Software Technical Documents OPT3002 SBOS745 – MAY 2016 1 Features 3 Description • • The OPT3002 light-to-digital sensor provides the functionality of an optical power meter within a single device. This optical sensor greatly improves system performance over photodiodes and photoresistors. The OPT3002 has a wide spectral bandwidth, ranging from 300 nm to 1000 nm. Measurements can be made without the need to manually select the fullscale ranges by using the built-in, full-scale setting feature. This capability allows light measurement over a 23-bit effective dynamic range. The results are compensated for dark-current effects, as well as other temperature variations. Wide Optical Spectrum: 300 nm to 1000 nm Automatic Full-Scale Setting Feature Simplifies Software and Configuration Measurement Levels: – 0.01 Lux to 83k Lux for WLED 23-Bit Effective Dynamic Range With Automatic Gain Ranging 12 Binary-Weighted, Full-Scale Range Settings: < 0.2% (typ) Matching Between Ranges Low Operating Current: 1.8 µA (typ) Operating Temperature: –40°C to +85°C Wide Power-Supply: 1.6 V to 3.6 V 5.5-V Tolerant I/O Flexible Interrupt System Small Form Factor: 2.0 mm × 2.0 mm × 0.65 mm 1 • • • • • • • • • 2 Applications • • • • • • • • Intrusion and Door-Open Detection Systems System Wake-Up Circuits Medical and Scientific Instrumentation Display Backlight Controls Lighting Control Systems Tablet and Notebook Computers Thermostats and Home Automation Appliances Outdoor Traffic and Street Lights Use the OPT3002 in optical spectral systems that require detection of a variety of wavelengths, such as optically-based diagnostic systems. The interrupt pin system features autonomous operation. Power consumption is very low, allowing the OPT3002 to be used as a low-power, battery-operated, wake-up sensor when an enclosed system is opened. The OPT3002 is fully integrated and provides the optical power reading directly from the I2C- and SMBus-compatible, two-wire, serial interface. Measurements are either continuous or single-shot. While in autonomous mode, the OPT3002 power consumption is as low as 0.8 µW at 0.8 SPS on a 1.8-V supply. Device Information(1) PART NUMBER OPT3002 PACKAGE USON (6) BODY SIZE (NOM) 2.00 mm x 2.00 mm (1) For all available packages, see the package option addendum at the end of the datasheet. Spectral Response Block Diagram VDD 1 OPT3002 0.9 VDD Normalized Response 0.8 OPT3002 0.7 SCL 0.6 Light 0.5 Optical Filter ADC I2C Interface SDA INT ADDR 0.4 0.3 GND 0.2 0.1 0 300 400 500 600 700 Wavelength (nm) 800 900 1000 D001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW OPT3002 Light-to-Digital Sensor OPT3002 SBOS745 – MAY 2016 www.ti.com 4 Device and Documentation Support 4.1 Documentation Support 4.1.1 Related Documentation For related documentation see the following: • SBEA002—OPT3001: Ambient Light Sensor Application Guide • SBOU160—OPT3002EVM User's Guide • SLUA271—QFN/SON PCB Attachment Application Report 4.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. PRODUCT PREVIEW Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 4.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: OPT3002 PACKAGE OPTION ADDENDUM www.ti.com 10-May-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) OPT3002DNPR PREVIEW USON DNP 6 3000 TBD Call TI Call TI -40 to 85 OPT3002DNPT PREVIEW USON DNP 6 250 TBD Call TI Call TI -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-May-2016 Addendum-Page 2 PACKAGE OUTLINE DNP0006A USON - 0.65 mm max height PLASTIC SMALL OUTLINE NO-LEAD 4221434/A 03/2014 NOTES: 1. 2. 3. 4. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. This drawing is subject to change without notice. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. Optical package with clear mold compound. www.ti.com EXAMPLE BOARD LAYOUT DNP0006A USON - 0.65 mm max height PLASTIC SMALL OUTLINE NO-LEAD 4221434/A 03/2014 NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . www.ti.com EXAMPLE STENCIL DESIGN DNP0006A USON - 0.65 mm max height PLASTIC SMALL OUTLINE NO-LEAD 4221434/A 03/2014 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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