TI1 M38510/32503BRA Octal d-type transparent latches and edge-triggered flip-flop Datasheet

SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
D
D
D
D
D
D
Choice of Eight Latches or Eight D-Type
Flip-Flops in a Single Package
3-State Bus-Driving Outputs
Full Parallel Access for Loading
Buffered Control Inputs
Clock-Enable Input Has Hysteresis to
Improve Noise Rejection (’S373 and ’S374)
P-N-P Inputs Reduce DC Loading on Data
Lines (’S373 and ’S374)
SN54LS373, SN54LS374, SN54S373,
SN54S374 . . . J OR W PACKAGE
SN74LS373, SN74S374 . . . DW, N, OR NS PACKAGE
SN74LS374 . . . DB, DW, N, OR NS PACKAGE
SN74S373 . . . DW OR N PACKAGE
(TOP VIEW)
OC
1Q
1D
2D
2Q
3Q
3D
4D
4Q
GND
description
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
8Q
8D
7D
7Q
6Q
6D
5D
5Q
C†
† C for ’LS373 and ’S373; CLK for ’LS374 and ’S374.
SN54LS373, SN54LS374, SN54S373,
SN54S374 . . . FK PACKAGE
(TOP VIEW)
The eight latches of the ’LS373 and ’S373 are
transparent D-type latches, meaning that while
the enable (C or CLK) input is high, the Q outputs
follow the data (D) inputs. When C or CLK is taken
low, the output is latched at the level of the data
that was set up.
2D
2Q
3Q
3D
4D
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
8D
7D
7Q
6Q
6D
4Q
GND
C†
5Q
5D
The eight flip-flops of the ’LS374 and ’S374 are
edge-triggered D-type flip-flops. On the positive
transition of the clock, the Q outputs are set to the
logic states that were set up at the D inputs.
20
2
1D
1Q
OC
VCC
8Q
These 8-bit registers feature 3-state outputs
designed specifically for driving highly capacitive
or relatively low-impedance loads. The
high-impedance
3-state
and
increased
high-logic-level drive provide these registers with
the capability of being connected directly to and
driving the bus lines in a bus-organized system
without need for interface or pullup components.
These devices are particularly attractive for
implementing buffer registers, I/O ports,
bidirectional bus drivers, and working registers.
1
† C for ’LS373 and ’S373; CLK for ’LS374 and ’S374.
Schmitt-trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374 devices simplify system design
as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered
output-control (OC) input can be used to place the eight outputs in either a normal logic state (high or low logic
levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines
significantly.
OC does not affect the internal operation of the latches or flip-flops. That is, the old data can be retained or new
data can be entered, even while the outputs are off.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
ORDERING INFORMATION
TA
PDIP – N
0°C to 70°C
ORDERABLE
PART NUMBER
PACKAGE†
SOIC – DW
SOP – NS
SSOP – DB
CDIP – J
–55°C to 125°C
CFP – W
LCCC – FK
TOP-SIDE
MARKING
Tube
SN74LS373N
SN74LS373N
Tube
SN74LS374N
SN74LS374N
Tube
SN74S373N
SN74S373N
Tube
SN74S374N
SN74S374N
Tube
SN74LS373DW
Tape and reel
SN74LS373DWR
Tube
SN74LS374DW
Tape and reel
SN74LS374DWR
Tube
SN74S373DW
Tape and reel
SN74S373DWR
Tube
SN74S374DW
Tape and reel
SN74S374DWR
Tape and reel
SN74LS373NSR
74LS373
Tape and reel
SN74LS374NSR
74LS374
Tape and reel
SN74S374NSR
74S374
Tape and reel
SN74LS374DBR
LS374A
Tube
SN54LS373J
SN54LS373J
Tube
SNJ54LS373J
SNJ54LS373J
Tube
SN54LS374J
SN54LS374J
Tube
SNJ54LS374J
SNJ54LS374J
Tube
SN54S373J
SN54S373J
Tube
SNJ54S373J
SNJ54S373J
Tube
SN54S374J
SN54S374J
Tube
SNJ54S374J
SNJ54S374J
Tube
SNJ54LS373W
SNJ54LS373W
Tube
SNJ54LS374W
SNJ54LS374W
Tube
SNJ54S374W
SNJ54S374W
Tube
SNJ54LS373FK
SNJ54LS373FK
Tube
SNJ54LS374FK
SNJ54LS374FK
Tube
SNJ54S373FK
SNJ54S373FK
Tube
SNJ54S374FK
SNJ54S374FK
LS373
LS374
S373
S374
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
Function Tables
’LS373, ’S373
(each latch)
INPUTS
OC
C
D
OUTPUT
Q
L
H
H
H
L
H
L
L
L
L
X
Q0
H
X
X
Z
’LS374, ’S374
(each latch)
INPUTS
OC
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
L
X
Q0
H
X
X
Z
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
logic diagrams (positive logic)
’LS373, ’S373
Transparent Latches
OC
C
1
OC
11
CLK
C1
1D
3
4
3D
4D
5D
6D
7D
8D
16
1D
13
14
17
8D
18
for ’S373 Only
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
1D
16
1D
1D
for ’S374 Only
Pin numbers shown are for DB, DW, J, N, NS, and W packages.
12
1D
C1
8Q
9
1D
C1
7Q
7D
19
8
6
1D
C1
6Q
6D
1D
C1
18
15
7
5
1D
C1
5Q
5D
1D
C1
17
12
4
2
1D
C1
4Q
4D
1D
C1
14
9
3
C1
3Q
3D
1D
C1
13
6
11
C1
2Q
2D
1D
C1
8
5
1
C1
1Q
1D
1D
C1
7
2
1D
C1
2D
’LS374, ’S374
Positive-Edge-Triggered Flip-Flops
19
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
schematic of inputs and outputs
’LS373
EQUIVALENT OF DATA INPUTS
EQUIVALENT OF ENABLE- AND
OUTPUT-CONTROL INPUTS
TYPICAL OF ALL OUTPUTS
VCC
VCC
VCC
17 kΩ NOM
Req = 20 kΩ NOM
100 Ω NOM
Input
Input
Output
’LS374
EQUIVALENT OF DATA INPUTS
VCC
EQUIVALENT OF CLOCK- AND
OUTPUT-CONTROL INPUTS
TYPICAL OF ALL OUTPUTS
VCC
VCC
17 kΩ NOM
30 kΩ NOM
100 Ω NOM
Input
Input
Output
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
(’LS devices)
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Off-state output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
SN54LS’
MIN
NOM
4.5
5
SN74LS’
MAX
MIN
NOM
MAX
5
4.75
5
5.25
UNIT
VCC
VOH
Supply voltage
High-level output voltage
5.5
5.5
V
IOH
IOL
High-level output current
–1
–2.6
mA
24
mA
Low-level output current
tw
Pulse duration
tsu
Data setup time
th
Data hold time
12
CLK high
15
15
CLK low
15
15
’LS373
5↓
5↓
’LS374
20↑
20↑
’LS373
’LS374‡
20↓
20↓
5↑
0↑
V
ns
ns
ns
TA
Operating free-air temperature
–55
125
0
70
°C
‡ The th specification applies only for data frequency below 10 MHz. Designs above 10 MHz should use a minimum of 5 ns (commercial only).
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TEST CONDITIONS†
PARAMETER
MIN
SN54LS’
TYP‡ MAX
2
MIN
SN74LS’
TYP‡ MAX
2
UNIT
VIH
VIL
High-level input voltage
VIK
Input clamp voltage
VCC = MIN,
II = –18 mA
VOH
High level output voltage
High-level
VCC = MIN,,
VIL = VIL max,
VIH = 2 V,,
IOH = MAX
VOL
Low level output voltage
Low-level
VCC = MIN,,
VIL = VIL max
VIH = 2 V,,
VCC = MAX,,
VO = 2.7 V
VIH = 2 V,,
20
20
m
A
m
A
Low-level input voltage
Off-state output current,,
IOZH
high-level voltage applied
24
2.4
IOL = 12 mA
IOL = 24 mA
0.8
V
–1.5
–1.5
V
34
3.4
0.25
V
0.7
24
2.4
31
3.1
0.4
V
0.25
0.4
0.35
0.5
IOZL
Off-state output current,,
low-level voltage applied
VCC = MAX,,
VO = 0.4 V
VIH = 2 V,,
–20
20
–20
20
II
Input current at maximum
input voltage
VCC = MAX
MAX,
VI = 7 V
01
0.1
01
0.1
VI = 2.7 V
VI = 0.4 V
20
20
IIH
IIL
High-level input current
Low-level input current
VCC = MAX,
VCC = MAX,
IOS
Short-circuit output current§
VCC = MAX
ICC
Supply current
VCC = MAX,,
Output control at 4.5 V
–0.4
–30
–130
–30
V
mA
m
A
–0.4
mA
–130
mA
’LS373
24
40
24
40
’LS374
27
40
27
40
mA
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡ All typical values are at VCC = 5 V, TA = 25°C.
§ Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second.
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS
’LS373
MIN
TYP
’LS374
MAX
RL = 667 Ω, CL = 45 pF,
See Note 3
fmax
MIN
TYP
35
50
MAX
MHz
tPLH
tPHL
Data
Any Q
RL = 667 Ω, CL = 45 pF,,
See Note 3
12
18
12
18
tPLH
tPHL
C or CLK
Any Q
RL = 667 Ω, CL = 45 pF,,
See Note 3
20
30
15
28
18
30
19
28
tPZH
tPZL
Any Q
RL = 667 Ω, CL = 45 pF,,
See Note 3
15
28
20
26
OC
25
36
21
28
25
15
28
Any Q
RL = 667 Ω, CL = 5 pF
15
OC
12
20
12
20
tPHZ
tPLZ
UNIT
ns
ns
ns
ns
NOTE 3: Maximum clock frequency is tested with all outputs loaded.
fmax = maximum clock frequency
tPLH = propagation delay time, low-to-high-level output
tPHL = propagation delay time, high-to-low-level output
tPZH = output enable time to high level
tPZL = output enable time to low level
tPHZ = output disable time from high level
tPLZ = output disable time from low level
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
schematic of inputs and outputs
’S373 and ’S374
’S373 and ’S374
TYPICAL OF ALL OUTPUTS
EQUIVALENT OF EACH INPUT
VCC
VCC
50 Ω NOM
2.8 kΩ NOM
Input
Output
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
(’S devices)
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Off-state output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V
Package thermal impedance, θJA (see Note 2): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Voltage values are with respect to network ground terminal.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
SN54S’
SN74S’
MIN
NOM
MAX
MIN
NOM
MAX
4.5
5
5.5
4.75
5
5.25
UNIT
VCC
VOH
Supply voltage
High-level output voltage
5.5
5.5
V
IOH
High-level output current
–2
–6.5
mA
tw
Pulse duration,
duration clock/enable
tsu
Data setup time
th
Data hold time
TA
Operating free-air temperature
High
6
6
Low
7.3
7.3
’S373
0↓
0↓
’S374
5↑
5↑
’S373
10↓
10↓
’S374
2↑
2↑
–55
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
125
0
V
ns
ns
ns
70
°C
9
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (SN54S373, SN54S374, SN74S373, SN74S374)
TEST CONDITIONS†
PARAMETER
MIN
VIH
VIL
TYP‡
MAX
2
VIK
VCC = MIN,
II = –18 mA
VCC = MIN
MIN,
VIH = 2 V
V,
VIL = 0
0.8
8V
V,
IOH = MAX
VOL
IOZH
VCC = MIN,
VCC = MAX,
VIH = 2 V,
VIH = 2 V,
VIL = 0.8 V,
VO = 2.4 V
IOL = 20 mA
IOZL
II
VCC = MAX,
VCC = MAX,
VIH = 2 V,
VI = 5.5 V
VO = 0.5 V
IIH
IIL
VCC = MAX,
VCC = MAX,
VI = 2.7 V
VI = 0.5 V
IOS§
VCC = MAX
VOH
SN54S’
SN74S’
ICC
V
2.4
3.4
2.4
3.1
VCC = MAX
’S374
0.8
V
–1.2
V
V
0.5
V
50
m
A
–50
m
A
1
–40
’S373
UNIT
mA
50
m
A
–250
m
A
–100
mA
Outputs high
160
Outputs low
160
Outputs disabled
190
Outputs high
110
Outputs low
140
Outputs disabled
160
CLK and OC at 4 V, D inputs at 0 V
180
mA
† For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
‡ All typical values are at VCC= 5 V, TA = 25°C.
§ Not more than one output should be shorted at a time and duration of the short circuit should not exceed one second.
switching characteristics, VCC = 5 V, TA = 25°C (see Figure 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
TEST CONDITIONS
’S373
MIN
’S374
MAX
RL = 280 Ω, CL = 15 pF,
See Note 3
fmax
MIN
TYP
75
100
MAX
Data
Any Q
RL = 280 Ω, CL = 15 pF,,
See Note 3
7
12
7
12
tPLH
tPHL
C or CLK
Any Q
RL = 280 Ω, CL = 15 pF,,
See Note 3
7
14
8
15
12
18
11
17
tPZH
tPZL
Any Q
RL = 280 Ω, CL = 15 pF,,
See Note 3
8
15
8
15
OC
11
18
11
18
tPHZ
tPLZ
Any Q
RL = 280 Ω, CL = 5 pF
6
9
5
9
OC
8
12
7
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
MHz
tPLH
tPHL
NOTE 3. Maximum clock frequency is tested with all outputs loaded.
fmax = maximum clock frequency
tPLH = propagation delay time, low-to-high-level output
tPHL = propagation delay time, high-to-low-level output
tPZH = output enable time to high level
tPZL = output enable time to low level
tPHZ = output disable time from high level
tPLZ = output disable time from low level
10
TYP
ns
ns
ns
ns
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
PARAMETER MEASUREMENT INFORMATION
SERIES 54LS/74LS DEVICES
VCC
Test
Point
VCC
RL
From Output
Under Test
CL
(see Note A)
CL
(see Note A)
High-Level
Pulse
1.3 V
S2
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
3V
Timing
Input
1.3 V
5 kΩ
Test
Point
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
S1
(see Note B)
CL
(see Note A)
RL
(see Note B)
RL
From Output
Under Test
VCC
From Output
Under Test
Test
Point
1.3 V
0V
tw
Low-Level
Pulse
1.3 V
tsu
0V
In-Phase
Output
(see Note D)
3V
1.3 V
1.3 V
0V
tPZL
tPLZ
tPHL
VOH
1.3 V
1.3 V
Waveform 1
(see Notes C
and D)
VOL
tPZH
tPLH
VOH
1.3 V
1.3 V
VOL
Waveform 2
(see Notes C
and D)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈1.5 V
1.3 V
VOL
tPHL
Out-of-Phase
Output
(see Note D)
1.3 V
0V
Output
Control
(low-level
enabling)
1.3 V
tPLH
1.3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.3 V
3V
Data
Input
1.3 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
Input
th
VOL + 0.5 V
tPHZ
VOH
1.3 V
VOH – 0.5 V
≈1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.
F. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω, tr ≤ 1.5 ns, tf ≤ 2.6 ns.
G. The outputs are measured one at a time with one input transition per measurement.
H. All parameters and waveforms are not applicable to all devices .
Figure 1. Load Circuits and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
PARAMETER MEASUREMENT INFORMATION
SERIES 54S/74S DEVICES
VCC
Test
Point
VCC
RL
(see Note B)
From Output
Under Test
CL
(see Note A)
High-Level
Pulse
1.5 V
S2
LOAD CIRCUIT
FOR 3-STATE OUTPUTS
3V
Timing
Input
1.5 V
1 kΩ
Test
Point
LOAD CIRCUIT
FOR OPEN-COLLECTOR OUTPUTS
LOAD CIRCUIT
FOR 2-STATE TOTEM-POLE OUTPUTS
S1
(see Note B)
CL
(see Note A)
RL
CL
(see Note A)
RL
From Output
Under Test
VCC
From Output
Under Test
Test
Point
1.5 V
0V
tw
Low-Level
Pulse
1.5 V
tsu
Data
Input
1.5 V
VOLTAGE WAVEFORMS
PULSE DURATIONS
1.5 V
1.5 V
In-Phase
Output
(see Note D)
tPHL
VOH
1.5 V
Out-of-Phase
Output
(see Note D)
0V
1.5 V
1.5 V
Waveform 1
(see Notes C
and D)
tPLZ
VOH
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
≈1.5 V
1.5 V
VOL
tPZH
tPLH
1.5 V
0V
tPZL
VOL
tPHL
1.5 V
3V
Output
Control
(low-level
enabling)
0V
tPLH
3V
1.5 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
Input
th
Waveform 2
(see Notes C
and D)
VOL + 0.5 V
tPHZ
VOH
1.5 V
VOH – 0.5 V
≈1.5 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS
NOTES: A. CL includes probe and jig capacitance.
B. All diodes are 1N3064 or equivalent.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. S1 and S2 are closed for tPLH, tPHL, tPHZ, and tPLZ; S1 is open and S2 is closed for tPZH; S1 is closed and S2 is open for tPZL.
E. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO ≈ 50 Ω; tr and tf ≤ 7 ns for Series
54/74 devices and tr and tf ≤ 2.5 ns for Series 54S/74S devices.
F. The outputs are measured one at a time with one input transition per measurement.
G. All parameters and waveforms are not applicable to all devices .
Figure 2. Load Circuits and Voltage Waveforms
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS373, SN54LS374, SN54S373, SN54S374,
SN74LS373, SN74LS374, SN74S373, SN74S374
OCTAL D-TYPE TRANSPARENT LATCHES AND EDGE-TRIGGERED FLIP-FLOPS
SDLS165B – OCTOBER 1975 – REVISED AUGUST 2002
TYPICAL APPLICATION DATA
Bidirectional Bus Driver
Output
Control 1
1D
2D
3D
4D
5D
6D
7D
8D
Bidirectional
Data Bus 1
’LS374
or
’S374
C
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
Bidirectional
Data Bus 2
Clock 1
Clock 2
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
C
’LS374
or
’S374
1D
2D
3D
4D
5D
6D
7D
8D
Output
Control 2
Clock 1
H
Clock 2
H
Bus
Exchange
Clock
Clock Circuit for Bus Exchange
Expandable 4-Word by 8-Bit General Register File
’LS374 or ’S374
1/2 SN74LS139
or SN74S139
G
Enable Select
A
B
Y0
Y1
Y2
Y3
’LS374 or ’S374
’LS374 or ’S374
’LS374 or ’S374
1/2 SN74LS139
or SN74S139
Y0
A
Y1
B
Clock
Select
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Y2
Y3
G
Clock
13
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
78011022A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
78011022A
SNJ54LS
374FK
7801102RA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
7801102RA
SNJ54LS374J
7801102SA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
7801102SA
SNJ54LS374W
JM38510/32502B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
32502B2A
JM38510/32502BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32502BRA
JM38510/32502BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32502BSA
JM38510/32502SRA
ACTIVE
CDIP
J
20
20
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32502SRA
JM38510/32502SSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32502SSA
JM38510/32503B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
32503B2A
JM38510/32503BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32503BRA
JM38510/32503BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32503BSA
M38510/32502B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
32502B2A
M38510/32502BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32502BRA
M38510/32502BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32502BSA
M38510/32502SRA
ACTIVE
CDIP
J
20
20
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32502SRA
M38510/32502SSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32502SSA
M38510/32503B2A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
JM38510/
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
32503B2A
M38510/32503BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32503BRA
M38510/32503BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32503BSA
SN54LS373J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS373J
SN54LS374J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS374J
SN54S373J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54S373J
SN54S374J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54S374J
SN74LS373DW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS373
SN74LS373DWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS373
SN74LS373DWRE4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS373
SN74LS373DWRG4
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS373
SN74LS373N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS373N
SN74LS373N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
0 to 70
SN74LS373NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS373N
SN74LS373NSR
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS373
SN74LS374DBR
ACTIVE
SSOP
DB
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS374A
SN74LS374DW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS374
SN74LS374DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS374
SN74LS374DWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS374
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
SN74LS374DWRG4
ACTIVE
SOIC
DW
20
SN74LS374J
OBSOLETE
CDIP
J
20
SN74LS374N
ACTIVE
PDIP
N
20
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TBD
Call TI
Call TI
0 to 70
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
Device Marking
(4/5)
LS374
SN74LS374N
SN74LS374N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
0 to 70
SN74LS374NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS374N
SN74LS374NSR
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS374
SN74LS374NSRG4
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS374
SN74S373DW
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
S373
TBD
Call TI
Call TI
0 to 70
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74S373J
OBSOLETE
CDIP
J
20
SN74S373N
NRND
PDIP
N
20
SN74S373N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
0 to 70
SN74S374J
OBSOLETE
CDIP
J
20
TBD
Call TI
Call TI
0 to 70
SN74S374N
ACTIVE
PDIP
N
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
20
SN74S373N
SN74S374N
SN74S374N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
0 to 70
SNJ54LS373FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
373FK
SNJ54LS373J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS373J
SNJ54LS373W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS373W
SNJ54LS374FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
78011022A
SNJ54LS
374FK
SNJ54LS374J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
7801102RA
SNJ54LS374J
SNJ54LS374W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
7801102SA
SNJ54LS374W
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SNJ54S373FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54S
373FK
SNJ54S373J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S373J
SNJ54S374FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54S
374FK
SNJ54S374J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S374J
SNJ54S374W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54S374W
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS373, SN54LS373-SP, SN54LS374, SN54LS374-SP, SN54S373, SN54S374, SN74LS373, SN74LS374, SN74S373, SN74S374 :
• Catalog: SN74LS373, SN54LS373, SN74LS374, SN54LS374, SN74S373, SN74S374
• Military: SN54LS373, SN54LS374, SN54S373, SN54S374
• Space: SN54LS373-SP, SN54LS374-SP
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LS373DWR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
12.0
24.0
Q1
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
SN74LS373NSR
SO
NS
20
2000
330.0
24.4
9.0
13.0
2.4
4.0
24.0
Q1
SN74LS374DBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
SN74LS374DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
SN74LS374NSR
SO
NS
20
2000
330.0
24.4
9.0
13.0
2.5
4.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS373DWR
SOIC
DW
20
2000
367.0
367.0
45.0
SN74LS373NSR
SO
NS
20
2000
367.0
367.0
45.0
SN74LS374DBR
SSOP
DB
20
2000
367.0
367.0
38.0
SN74LS374DWR
SOIC
DW
20
2000
367.0
367.0
45.0
SN74LS374NSR
SO
NS
20
2000
367.0
367.0
45.0
Pack Materials-Page 2
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
SCALE 1.200
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
20
1
13.0
12.6
NOTE 3
18X 1.27
2X
11.43
10
11
B
7.6
7.4
NOTE 4
20X
0.51
0.31
0.25
C A B
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
11
10
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
Similar pages