Product Folder Sample & Buy Support & Community Tools & Software Technical Documents ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 ADS58J63 Quad-Channel, 14-Bit, 500-MSPS Telecom Receiver Device 1 Features 3 Description • • • • • • • The ADS58J63 is a low-power, wide-bandwidth, 14bit, 500-MSPS, quad-channel, telecom receiver device. The ADS58J63 supports a JESD204B serial interface with data rates up to 10 Gbps with one lane per channel. The buffered analog input provides uniform input impedance across a wide frequency range and minimizes sample-and-hold glitch energy. The ADS58J63 provides excellent spurious-free dynamic range (SFDR) over a large input frequency range with very low power consumption. The digital signal processing block includes complex mixers followed by low-pass filters with decimate-by-2 and -4 options supporting up to 200-MHz receive bandwidth. The ADS58J63 also supports a 14-bit, 500-MSPS output in burst-mode making the device suitable for a DPD observation receiver. • • • • • Quad Channel 14-Bit Resolution Maximum Clock Rate: 500 MSPS Input Bandwidth (3 dB): 900 MHz On-Chip Dither Analog Input Buffer with High-Impedance Input Output Options: – Rx: Decimate-by-2 and -4 Options with LowPass Filter – 200-MHz Complex Bandwidth or 100-MHz Real Bandwidth Support – DPD FB: Burst Mode with 14-Bit Output 1.9-VPP Differential Full-Scale Input JESD204B Interface: – Subclass 1 Support – 1 Lane per ADC Up to 10 Gbps – Dedicated SYNC pin for pair of channels Support for Multi-Chip Synchronization 72-Pin VQFN Package (10 mm × 10 mm) Key Specifications: – Power Dissipation: 675 mW/ch – Spectral Performance (Un-decimated) – fIN = 190 MHz IF at –1 dBFS: – SNR: 70.4 dBFS – NSD: –154.4 dBFS/Hz – SFDR: 86 dBc (HD2, HD3), 95 dBFS (non HD2, HD3) – fIN = 370 MHz IF at –3 dBFS: – SNR: 68.5 dBFS – NSD: –152.5 dBFS/Hz – SFDR: 81 dBc (HD2, HD3), 86 dBFS (non HD2, HD3) The JESD204B interface reduces the number of interface lines, thus allowing high system integration density. An internal phase locked loop (PLL) multiplies the incoming analog-to-digital converter (ADC) sampling clock to derive the bit clock, which is used to serialize the 14-bit data from each channel. Device Information(1) PART NUMBER PACKAGE ADS58J63 VQFN (72) Simplified Block Diagram INAP/M Digital Block Interleaving Correction 14bit ADC INBP/M Digital Block Interleaving Correction 14bit ADC K*FS/16 2x FS/8 DBP/M Burst Mode TRIGCD TRDYAB SYSREFP/M TRDYCD PLL x10/x20 SYNCbAB SYNCbCD Digital Block Interleaving Correction 14bit ADC Burst Mode DCP/M 2x FS/4 Digital Block Interleaving Correction 14bit ADC JESD204B 4x K*FS/16 DDP/M 2x FS/8 Configuration Registers SCLK INDP/M RESET SCAN_EN • • DAP/M JESD204B TRIGAB INCP/M • 2x FS/4 4x 2 Applications Multi-Carrier GSM Cellular Infrastructure Base Stations Multi-Carrier Multi-Mode Cellular Infrastructure Base Stations Telecommunications Receiver Telecom DPD Observation Receiver 10.00 mm x 10.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. CLKINP/M • BODY SIZE (NOM) SEN SDIN SDOUT 1 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 7 1 1 1 2 3 5 Absolute Maximum Ratings ...................................... 5 ESD Ratings.............................................................. 5 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 6 Electrical Characteristics........................................... 6 AC Performance ...................................................... 7 Digital Characteristics ............................................. 10 Timing Characteristics............................................. 11 Typical Characteristics: 14-Bit Burst Mode ............. 12 Typical Characteristics: Mode 2............................ 19 Typical Characteristics: Mode 0............................ 20 Detailed Description ............................................ 21 7.1 Overview ................................................................. 21 7.2 7.3 7.4 7.5 7.6 8 Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming .......................................................... Register Maps ......................................................... 21 22 23 34 45 Application and Implementation ........................ 71 8.1 Application Information............................................ 71 8.2 Typical Application .................................................. 75 9 Power Supply Recommendations...................... 76 10 Layout................................................................... 77 10.1 Layout Guidelines ................................................. 77 10.2 Layout Example .................................................... 77 11 Device and Documentation Support ................. 78 11.1 11.2 11.3 11.4 Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 78 78 78 78 12 Mechanical, Packaging, and Orderable Information ........................................................... 78 4 Revision History Changes from Original (June 2015) to Revision A • 2 Page Changed From Product Preview To Production datasheet ................................................................................................... 1 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 5 Pin Configuration and Functions SYNCbCDP SYNCbCDM IOVDD DDP DDM DGND DCP DCM IOVDD DGND DBM DBP DGND DAM DAP IOVDD SYNCbABM SYNCbABP RMP Package VQFN-72 Top View 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 TRDYCD 1 54 TRDYAB TRIGCD 2 53 TRIGAB DGND 3 52 DGND IOVDD 4 51 IOVDD SDIN 5 50 PDN SCLK 6 49 RES SEN 7 48 RESET DVDD 8 47 DVDD AVDD 9 46 AVDD AVDD3V 10 45 AVDD3V SDOUT 11 44 AVDD ADS58J63 GND PAD (backside) 39 AVDD3V AVDD 17 38 AVDD INCM 18 37 INBM 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 INBP 16 AVDD AVDD3V SYSREFM AVDD SYSREFP 40 AGND 15 AVDD3V AVDD AVDD INAM AGND 41 CLKINM 14 CLKINP INDM AGND INAP AVDD 42 AVDD3V 13 NC INDP NC AVDD AGND 43 AVDD 12 INCP AVDD Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 3 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com Pin Functions PIN NAME NUMBER I/O DESCRIPTION INPUT/REFERENCE INAP/M 42, 41 I Differential analog input for channel A INBP/M 36, 37 I Differential analog input for channel B INCP/M 19, 18 I Differential analog input for channel C INDP/M 13, 14 I Differential analog input for channel D CLKINP/M 27, 28 I Differential clock input for ADC SYSREFP/M 33, 34 I External sync input RESET 48 I Hardware reset. Active high. This pin has an internal 150-kΩ pull-down resistor. SCLK 6 I Serial interface clock input SDIN 5 I Serial interface data input. CLOCK/SYNC CONTROL/SERIAL SEN 7 I Serial interface enable SDOUT 11 O Serial interface data output. PDN 50 I/O Power down. Can be configured via SPI register setting. RES 49 – Reserve Pin. Connect to GND 22, 23 – No connect TRDYAB 54 O Trigger ready output for burst mode for channel A,B. Can be configured via SPI to TRDY signal for all four channels in burst mode. Can be left open if not used. TRIGAB 53 I Manual burst mode trigger input channel A,B. Can be configured via SPI to manual trigger input signal for all four channels in burst mode. Can be connected to GND if not used. TRDYCD 1 O Trigger ready output for burst mode for channel C,D. Can be configured via SPI to TRDY signal for all four channels in burst mode. Can be left open if not used. TRIGCD 2 I Manual burst mode trigger input channel C,D. Can be configured via SPI to manual trigger input signal for all four channels in burst mode. Can be connected to GND if not used. DAP/M 58, 59 O JESD204B Serial data output for channel A DBP/M 61, 62 O JESD204B Serial data output for channel B DCP/M 66, 65 O JESD204B Serial data output for channel C DDP/M 69, 68 O JESD204B Serial data output for channel D SYNCbABP/M 55, 56 I Synchronization input for JESD204B port channel A,B. Can be configured via SPI to SYNCb signal for all four channels. Needs external termination. SYNCbCDP/M 72, 71 I Synchronization input for JESD204B port channel C,D. Can be configured via SPI to SYNCb signal for all four channels. Needs external termination. AVDD3V 10, 16, 24, 31, 39, 45 I Analog 3 V for analog buffer AVDD 9, 12, 15, 17, 20, 25, 30, 35, 38, 40, 43, 44, 46 I Analog 1.9-V power supply DVDD 8, 47 I Digital 1.9-V power supply IOVDD 4, 51, 57, 64, 70 I Digital 1.15-V power supply for the JESD204B transmitter AGND 21, 26, 29, 32 I Analog ground DGND 3, 52, 60, 63, 67 I Digital ground NC DATA INTERFACE POWER SUPPLY 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) Supply voltage range: MIN MAX UNIT AVDD3V –0.3 3.6 V AVDD –0.3 2.1 V DVDD –0.3 2.1 V IOVDD –0.2 1.4 V Voltage between AGND and DGND Voltage applied to input pins –0.3 0.3 V INA/BP, INA/BM, INC/DP, INC/DM –0.3 3 V CLKINP, CLKINM –0.3 AVDD + 0.3 V SYSREFP, SYSREFM, TRIGAB, TRIGCD –0.3 AVDD + 0.3 V SCLK, SEN, SDIN, RESET, SPI_MODE, SYNCbABP/M, SYNCbCDP/M, PDN –0.2 2 V –65 150 °C Storage temperature, Tstg (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge VALUE UNIT ±1 kV Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN AVDD3V Supply voltage range: Analog inputs: 3 3.6 V 1.8 1.9 2 V DVDD 1.8 1.9 2 V IOVDD 1.1 1.15 1.2 V 1.9 Input common-mode voltage VPP VCM ± 0.025 Input clock amplitude differential (VCLKP – VCLKM) 250 V 500 MHz Sine wave, ac-coupled 1.5 VPP LVPECL, ac-coupled 1.6 VPP LVDS, ac-coupled 0.7 VPP Input device clock duty cycle, default after reset (1) (2) UNIT 2.85 Differential input voltage range Temperature: MAX AVDD Input clock frequency, device clock frequency Clock inputs: NOM Operating free-air, TA 45% 50% 55% 85 ºC 105 (2) 125 ºC –40 Operating junction, TJ SYSREF needs to be applied for the device bring up. Prolonged use above this junction temperature can increase the device failure-in-time (FIT) rate. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 5 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 6.4 Thermal Information ADS58J63 THERMAL METRIC (1) RMP (VQFNP) UNIT 72 PINS RθJA Junction-to-ambient thermal resistance 22.3 RθJC(top) Junction-to-case (top) thermal resistance 5.1 RθJB Junction-to-board thermal resistance 2.4 ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 2.3 RθJC(bot) Junction-to-case (bottom) thermal resistance 0.4 (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 50% clock duty cycle, AVDD3V = 3 V, AVDD/DVDD = 1.9 V, IOVDD = 1.15 V, –1 -dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP ADC Sampling Rate Resolution MAX UNIT 500 MSPS 14 Bits POWER SUPPLY AVDD3V 2.85 3 3.6 V AVDD 1.8 1.9 2 V DVDD 1.8 1.9 2 V IOVDD 1.1 1.15 1.2 V IAVDD3V 3-V analog supply current 340 mA IAVDD 1.9-V analog supply current 365 mA 190 mA 184 mA 533 mA 2x Decimation (4 ch) 2.68 W Burst Mode (4 ch) 2.67 W 250 mW 1.9 VPP IDVDD 1.9-V digital supply current IIOVDD 1.15-V SERDES supply current Pdis Total power dissipation 2x Decimation (4 ch) Burst Mode (4 ch) 370-MHz, full-scale input on all four channels Global power-down power dissipation ANALOG INPUTS Differential input full-scale voltage VCM ± 0.025 Input common-mode voltage Diffrential input resistance at fIN =370MHz 0.5 kΩ Differential input capacitance at fIN =370MHz 2.5 pF 900 MHz Analog input bandwidth (3 dB) 6 V Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 Electrical Characteristics (continued) Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 50% clock duty cycle, AVDD3V = 3 V, AVDD/DVDD = 1.9 V, IOVDD = 1.15 V, –1 -dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ISOLATION Isolation between near channels (CHA and CHB are near to each other. CHC and CHD are near to each other) Crosstalk (1) fIN = 10 MHz 105 dBFS fIN = 100 MHz 104 dBFS fIN = 170 MHz 96 dBFS fIN = 270 MHz 97 dBFS fIN = 370 MHz 93 dBFS fIN = 470 MHz 85 dBFS fIN = 10 MHz 110 dBFS = 100 MHz 107 dBFS = 170 MHz 96 dBFS = 270 MHz 97 dBFS = 370 MHz 95 dBFS fIN = 470 MHz 94 dBFS fIN Isolation between far channels f IN (for CHA and CHB, CHC and f IN CHD are far channels) fIN CLOCK INPUT CLKINP and CLKINM pins are connected to internal biasing voltage through 400 Ω Internal clock biasing (1) 1.15 V Crosstalk is measured with a –1-dBFS input signal on aggressor channel and no input on the victim channel. 6.6 AC Performance over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX 14-Bit Burst Mode (DDC Mode 8) fIN = 10 MHz 70.8 fIN = 70 MHz fIN = 190 MHz SNR Signal-to-noise ratio AIN = – 1 dBFS AIN = – 3 dBFS 65.6 fIN = 300 MHz fIN = 350 MHz fIN = 370 MHz Noise spectral density TYP 70.5 74 69.5 73.2 70.3 73.6 69 72.6 68.7 72 fIN = 10 MHz 154.8 154.8 fIN = 70 MHz 154.5 154.5 153.5 153.5 154.3 154.3 153 153.0 152.7 152.7 152.4 152.4 151.5 151.5 AIN = – 3 dBFS 149.5 fIN = 350 MHz fIN = 370 MHz 148.5 fIN = 470 MHz Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 dBFS 68.4 70.7 fIN = 300 MHz UNIT 74.1 67.5 AIN = – 1 dBFS MAX Decimate-by-2 Filter (DDC Mode 2) fIN = 470 MHz fIN = 190 MHz NSD 64.6 MIN dBFS/ Hz 7 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com AC Performance (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS Signal-to-noise and distortion ratio SFDR 73.9 73.9 AIN = – 1 dBFS 69.4 73.1 AIN = – 3 dBFS 70.2 73.5 fIN = 300 MHz 68.9 72.5 fIN = 350 MHz 68.6 71.7 fIN = 370 MHz 68.2 fIN = 470 MHz 66.9 69.7 fIN = 10 MHz 89 88 fIN = 70 MHz 87 95 86 97 88 96 82 94 82 82 AIN = – 1 dBFS AIN = – 3 dBFS 78 fIN = 300 MHz 75 73 74 fIN = 10 MHz 89 91 94 103 86 101 88 101 82 97 82 82 fIN = 190 MHz AIN = – 1 dBFS AIN = – 3 dBFS 78 fIN = 300 MHz fIN = 350 MHz fIN = 370 MHz 73 74 fIN = 10 MHz 93 88 fIN = 70 MHz 87 99 98 100 AIN = – 1 dBFS AIN = – 3 dBFS 97 98 fIN = 300 MHz 95 100 fIN = 350 MHz 90 96 fIN = 370 MHz 78 75 83 83 fIN = 10 MHz 94 98 94 95 93 Non HD2, HD3 Spurious-free dynamic range (excluding HD2, HD3) 97 93 96 92 94 91 94 fIN = 190 MHz AIN = – 1 dBFS AIN = – 3 dBFS 87 fIN = 300 MHz fIN = 350 MHz fIN = 370 MHz 80 fIN = 470 MHz 8 dBc dBc dBc dBc 90 87 Submit Documentation Feedback dBFS 85 fIN = 470 MHz fIN = 70 MHz UNIT 81 fIN = 470 MHz fIN = 190 MHz Third harmonic distortion 75 MAX 81 fIN = 470 MHz fIN = 70 MHz HD3 TYP 70.4 fIN = 370 MHz Second harmonic distortion MIN 70.7 fIN = 350 MHz HD2 MAX fIN = 70 MHz fIN = 190 MHz Spurious-free dynamic range TYP fIN = 10 MHz fIN = 190 MHz SINAD MIN 93 Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 AC Performance (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IMD3 Total harmonic distortion Third-tone intermodulation distortion TYP MAX MIN TYP fIN = 10 MHz 88 86 fIN = 70 MHz 85 92 AIN = – 1 dBFS 85 92 AIN = – 3 dBFS fIN = 190 MHz THD MIN 86 91 fIN = 300 MHz 81 89 fIN = 350 MHz 79 82 fIN = 370 MHz 78 fIN = 470 MHz 72 fIN = 185 MHz, fIN = AIN = – 7 dBFS 190 MHz 89 fIN = 365 MHz, fIN = AIN = – 7 dBFS 370 MHz 82 fIN = 465 MHz, fIN = AIN = – 7 dBFS 470 MHz 77 MAX Product Folder Links: ADS58J63 dBc 73 dBFS Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated UNIT 9 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 6.7 Digital Characteristics Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 500 MSPS, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, and –1-dBFS differential input, unless otherwise noted. PARAMETER DIGITAL INPUTS (RESET, SCLK, SEN, SDIN, PDN) TEST CONDITIONS MIN 0.8 VIH High-level input voltage All digital inputs support 1.2-V and 1.8-V logic levels VIL Low-level input voltage All digital inputs support 1.2-V and 1.8-V logic levels IIH High-level input current IIL Low-level input current TYP MAX UNITS (1) V 0.4 SEN RESET, SCLK, SDIN, PDN SEN RESET, SCLK, SDIN, PDN V 0 µA 100 µA 50 µA 0 µA DIGITAL INPUTS (SYSREFP, SYSREFM, SYNCbABM, SYNCbABP, SYNCbCDM, SYNCbCDP) VD Differential Input Voltage V(CM_DIG) Common-mode voltage for SYSREF 0.35 0.45 1.4 V 1.3 V DVDD V DIGITAL OUTPUTS (SDOUT, PDN) VOH High-level output voltage VOL Low-level output voltage DVDD – 0.1 0.1 V DIGITAL OUTPUTS (JESD204B Interface: DxP, DxM) (2) VOD Output differential voltage VOC Output common-mode voltage Transmitter short-circuit current zos (2) 10 Transmitter pins shorted to any voltage between –0.25 V and 1.45 V Single-ended output impedance Output capacitance (1) With default swing setting. Output capacitance inside the device, from either output to ground 700 mVPP 450 mV –100 100 mA 50 Ω 2 pF The RESET, SCLK, SDATA, and PDN pins have a 20-kΩ (typical) internal pulldown resistor to ground, and the SEN pin has a 20-kΩ (typical) pull up resistor to IOVDD. 50-Ω, single-ended external termination to IOVDD. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 6.8 Timing Characteristics Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC sampling rate = 500 MSPS, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, and –1-dBFS differential input, unless otherwise noted. MIN TYP MAX UNITS SAMPLE TIMING CHARACTERISTICS Aperture delay 0.75 1.6 Aperture delay matching between two channels on the same device ns ±70 Aperture delay matching between two devices at the same temperature and supply voltage ps ±270 ps Aperture jitter 135 fS rms Wake-up time to valid data after coming out of global power-down 150 µs Data Latency (1) ADC sample to digital output 77 Input Clock Cycles OVR Latency ADC sample to OVR bit 44 Input Clock Cycles tPDI Clock propagation delay Input clock rising edge cross-over to output clock rising edge cross-over 4 ns tSU_SYSREF Setup time for SYSREF, referenced to input clock rising edge 300 tH_SYSREF Hold time for SYSREF, referenced to input clock rising edge 100 900 ps ps JESD OUTPUT INTERFACE TIMING CHARACTERISTICS Unit interval 100 400 ps Serial output data rate 2.5 10 Gbps Total jitter for BER of 1E-15 and lane rate = 10 Gbps 26 Random jitter for BER of 1E-15 and lane rate = 10 Gbps tR, tF (1) 0.75 ps ps rms Deterministic jitter for BER of 1E-15 and lane rate = 10 Gbps 12 ps, pk-pk Data rise time, data fall time: rise and fall times measured from 20% to 80%, differential output waveform, 2.5 Gbps ≤ bit rate ≤ 10 Gbps 35 ps Overall ADC Latency = Data Latency + tPDI N+1 SAMPLE N+2 N TPD Data Latency: 77 Clock Cycles CLKINP CLKINM DAP/M DBP/M DCP/M DDP/M D 20 SAMPLE N-1 D 1 SAMPLE N D 20 SAMPLE N+1 Figure 1. Latency Timing Diagram Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 11 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 6.9 Typical Characteristics: 14-Bit Burst Mode 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. -40 -60 -80 -40 -60 -80 -100 -100 -120 -120 0 50 100 150 Input Frequency (MHz) 200 0 250 FIN = 10 MHz , AIN = –1 dBFS SNR = 71 dBFS, SFDR = 89 dBc, SFDR = 89 dBc (Non23) 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) 200 250 D002 Figure 3. FFT for 140-MHz Input Signal 0 -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 50 100 150 Input Frequency (MHz) 200 250 0 50 D003 FIN = 190 MHz , AIN = –1 dBFS SNR = 69.4 dBFS, SFDR = 88 dBc, SFDR = 96 dBc (Non23) 100 150 Input Frequency (MHz) 200 250 D004 FIN = 230 MHz , AIN = –1 dBFS SNR = 69.4 dBFS, SFDR = 85 dBc, SFDR = 96 dBc (Non23) Figure 4. FFT for 190-MHz Input Signal Figure 5. FFT for 230-MHz Input Signal 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) 100 150 Input Frequency (MHz) FIN = 140 MHz , AIN = –1 dBFS SNR = 70 dBFS, SFDR = 88 dBc, SFDR = 91 dBc (Non23) Figure 2. FFT for 10-MHz Input Signal -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 50 100 150 Input Frequency (MHz) 200 250 0 D005 FIN = 300 MHz , AIN = - 3 dBFS SNR = 69.4 dBFS, SFDR = 80 dBc, SFDR = 95 dBc (Non23) 50 100 150 Input Frequency (MHz) 200 250 D006 FIN = 370 MHz , AIN = - 3 dBFS SNR = 68.4 dBFS, SFDR = 84 dBc, SFDR = 86 dBc (Non23) Figure 6. FFT for 300-MHz Input Signal 12 50 D001 Submit Documentation Feedback Figure 7. FFT for 370-MHz Input Signal Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 Typical Characteristics: 14-Bit Burst Mode (continued) 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 50 100 150 Input Frequency (MHz) 200 250 0 50 D007 FIN = 470 MHz , AIN = - 3 dBFS SNR = 67.4 dBFS, SFDR = 73 dBc, SFDR = 80 dBc (Non23) 250 D008 Figure 9. FFT for Two-Tone Input Signal 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) 200 FIN1 = 185 MHz, FIN2 = 190 MHz, IMD = 89 dBFS Each tone at -7 dBFS Figure 8. FFT for 470-MHz Input Signal -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 50 100 150 Input Frequency (MHz) 200 250 0 50 D009 FIN1 = 185 MHz, FIN2 = 190 MHz, IMD = 103 dBFS Each tone at -36 dBFS 100 150 Input Frequency (MHz) 200 250 D010 FIN1 = 370 MHz, FIN2 = 365 MHz, IMD = 81.7 dBFS Each tone at -7 dBFS Figure 10. FFT for Two-Tone Input Signal Figure 11. FFT for Two-Tone Input Signal 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) 100 150 Input Frequency (MHz) -40 -60 -80 -40 -60 -80 -100 -100 -120 -120 0 50 100 150 Input Frequency (MHz) 200 250 0 50 D011 FIN1 = 370 MHz, FIN2 = 365 MHz, IMD = 102 dBFS Each tone at -36 dBFS Figure 12. FFT for Two-Tone Input Signal 100 150 Input Frequency (MHz) 200 250 D012 FIN1 = 470 MHz, FIN2 = 465 MHz, IMD = 76.7 dBFS Each tone at -7 dBFS Figure 13. FFT for Two-Tone Input Signal Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 13 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com Typical Characteristics: 14-Bit Burst Mode (continued) Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. 0 -88 -90 -20 Amplitude (dBFS) -92 IMD (dBFS) -40 -60 -80 -94 -96 -98 -100 -100 -102 -120 0 50 100 150 Input Frequency (MHz) 200 -104 -35 250 -31 D013 FIN1 = 470 MHz, FIN2 = 465 MHz, IMD = 98.8 dBFS Each tone at -36 dBFS -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -7 D014 FIN1 = 185 MHz, FIN2 = 190 MHz Figure 14. FFT for Two-Tone Input Signal Figure 15. Intermodulation Distortion Vs Input Amplitude -80 -74 -84 -80 IMD (dBFS) IMD (dBFS) -88 -92 -86 -92 -96 -98 -100 -104 -35 -31 -27 -23 -19 -15 Each Tone Amplitude (dBFS) -11 -104 -35 -7 -31 D015 FIN1 = 365 MHz, FIN2 = 370 MHz -7 D016 Figure 17. Intermodulation Distortion Vs Input Amplitude 96 96 Ain = -1 dBFS Ain = -3 dBFS 93 Interleaving Spur (dBc) 92 SFDR (dBc) -11 FIN1 = 465 MHz, FIN2 = 470 MHz Figure 16. Intermodulation Distortion Vs Input Amplitude 88 84 80 90 87 84 81 76 78 72 0 40 80 120 160 200 240 280 320 360 400 440 480 Input Frequency (MHz) D017 0 40 Figure 18. Spurious-Free Dynamic Range vs Input Frequency 14 -27 -23 -19 -15 Each Tone Amplitude (dBFS) Submit Documentation Feedback 80 120 160 200 240 280 320 360 400 440 480 Input Frequency (MHz) D018 Figure 19. IL Spur Vs Input Frequency Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 Typical Characteristics: 14-Bit Burst Mode (continued) Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. 71.5 72 AIN = -1 dBFS AIN = -3 dBFS 71.2 SNR (dBFS) SNR (dBFS) 70.5 AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 69.5 68.5 67.5 AVDD = 1.95 V AVDD = 2 V 70.4 69.6 68.8 66.5 0 40 68 -40 80 120 160 200 240 280 320 360 400 440 480 Input Frequency (MHz) D019 -15 10 35 Temperature (°C) 60 85 D020 FIN = 190 MHz, AIN = – 1 dBFS Figure 20. Signal-to-Noise Ratio vs Input Frequency Figure 21. Signal-to-Noise Ratio vs AVDD Supply and Temperature 93 72 AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V AVDD = 1.95 V AVDD = 2 V AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V 71 AVDD = 1.95 V AVDD = 2 V SNR (dBFS) SFDR (dBc) 91 89 70 69 68 87 67 85 -40 -15 10 35 Temperature (°C) 60 66 -40 85 -15 D021 FIN = 190 MHz, AIN = – 1 dBFS 10 35 Temperature (°C) 60 85 D022 FIN = 370 MHz, AIN = – 3 dBFS Figure 22. Spurious-Free Dynamic Range vs AVDD Supply and Temperature Figure 23. Signal-to-Noise Ratio vs AVDD Supply and Temperature 71.4 84 AVDD = 1.8 V AVDD = 1.85 V AVDD = 1.9 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V AVDD = 1.95 V AVDD = 2 V 71 DVDD = 1.9 V DVDD = 1.95 V DVDD = 2 V SNR (dBFS) SFDR (dBc) 83 82 70.6 70.2 81 69.8 80 -40 -15 10 35 Temperature (°C) 60 85 69.4 -40 D023 FIN = 370 MHz, AIN = – 3 dBFS -15 10 35 Temperature (°C) 60 85 D024 FIN = 190 MHz, AIN = – 1 dBFS Figure 24. Spurious-Free Dynamic Range vs AVDD Supply and Temperature Figure 25. Signal-to-Noise Ratio vs DVDD Supply and Temperature Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 15 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com Typical Characteristics: 14-Bit Burst Mode (continued) Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. 92 71 DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V 91 DVDD = 1.9 V DVDD = 1.95 V DVDD = 2 V DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V DVDD = 1.95 V DVDD = 2 V SNR (dBFS) SFDR (dBc) 70 90 89 69 88 68 87 86 -40 -15 10 35 Temperature (°C) 60 67 -40 85 -15 D025 FIN = 190 MHz, AIN = – 1 dBFS 60 85 D026 FIN = 370 MHz, AIN = – 3 dBFS Figure 26. Spurious-Free Dynamic Range vs DVDD Supply and Temperature Figure 27. Signal-to-Noise Ratio vs DVDD Supply and Temperature 72.2 84 DVDD = 1.75 V DVDD = 1.8 V DVDD = 1.85 V DVDD = 1.9 V DVDD = 1.95 V DVDD = 2 V AVDD3V = 2.85 V AVDD3V = 3 V AVDD3V = 3.1 V AVDD3V = 3.2 V 71.7 83 82 AVDD3V = 3.3 V AVDD3V = 3.4 V AVDD3V = 3.5 V AVDD3V = 3.6 V 71.2 SNR (dBFS) SFDR (dBc) 10 35 Temperature (°C) 70.7 70.2 81 69.7 80 -40 -15 10 35 Temperature (°C) 60 69.2 -40 85 FIN = 370 MHz, AIN = – 3 dBFS 85 D028 73 AVDD3V = 2.85 V AVDD3V = 3 V AVDD3V = 3.1 V AVDD3V = 3.2 V 91 AVDD3V = 3.3 V AVDD3V = 3.4 V AVDD3V = 3.5 V AVDD3V = 3.6 V 90 89 70 69 87 68 10 35 Temperature (°C) 60 85 AVDD3V = 3.3 V AVDD3V = 3.4 V AVDD3V = 3.5 V AVDD3V = 3.6 V 71 88 -15 AVDD3V = 2.85 V AVDD3V = 3 V AVDD3V = 3.1 V AVDD3V = 3.2 V 72 SNR (dBFS) SFDR (dBc) 60 Figure 29. Signal-to-Noise Ratio vs AVDD3V Supply and Temperature 92 67 -40 D029 FIN = 190 MHz, AIN = – 1 dBFS -15 10 35 Temperature (°C) 60 85 D030 FIN = 370 MHz, AIN = – 3 dBFS Figure 30. Spurious-Free Dynamic Range vs AVDD3V Supply and Temperature 16 10 35 Temperature (°C) FIN = 190 MHz, AIN = – 1 dBFS Figure 28. Spurious-Free Dynamic Range vs DVDD Supply and Temperature 86 -40 -15 D027 Figure 31. Signal-to-Noise Ratio vs AVDD3V Supply and Temperature Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 Typical Characteristics: 14-Bit Burst Mode (continued) 74 84 AVDD3V = 2.85 V AVDD3V = 3 V AVDD3V = 3.1 V AVDD3V = 3.2 V SNR (dBFS) SFDR (dBc) 83 AVDD3V = 3.3 V AVDD3V = 3.4 V AVDD3V = 3.5 V AVDD3V = 3.6 V 82 72 150 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 125 70 100 68 75 66 50 SFDR (dBc,dBFS) Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. 81 10 35 Temperature (°C) 60 64 -70 85 25 -60 -50 D031 FIN = 370 MHz, AIN = – 3 dBFS 120 69.5 90 68 60 66.5 30 -40 -30 Amplitude (dBFS) -20 -10 110 73 100 71 90 69 80 67 70 65 0.2 0 D033 Figure 34. Performance vs Amplitude Figure 35. Performance vs Clock Amplitude 125 73 95 SNR SFDR 72 100 69 75 66 50 63 25 0 2.2 SNR (dBFS) SNR SFDR SFDR (dBc) SNR (dBFS) D034 FIN = 190 MHz, AIN = – 1 dBFS 75 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) 60 2.2 0.6 1 1.4 1.8 Differential Clock Amplitude (Vpp) FIN = 370 MHz 60 0.2 D032 SNR SFDR 0 -50 0 Figure 33. Performance vs Amplitude SNR (dBFS) 71 -60 -10 75 SFDR (dBc,dBFS) SNR (dBFS) 72.5 180 SNR (dBFS) SFDR (dBc) SFDR (dBFS) 150 65 -70 -20 FIN = 190 MHz Figure 32. Spurious-Free Dynamic Range vs AVDD3V Supply and Temperature 74 -40 -30 Amplitude (dBFS) SFDR (dBc) -15 72 90 71 85 70 80 69 75 68 30 35 D035 FIN = 370 MHz, AIN = – 3 dBFS 40 45 50 55 60 Input Clock Duty Cycle (%) 65 SFDR (dBc) 80 -40 70 70 D036 FIN = 190 MHz, AIN = – 1 dBFS Figure 36. Performance vs Clock Amplitude Figure 37. Performance vs Clock Duty Cycle Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 17 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com Typical Characteristics: 14-Bit Burst Mode (continued) Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. 0 71 90 SNR SFDR 87 70 84 69 81 68 78 67 75 66 72 -100 69 70 -120 65 30 35 40 45 50 55 60 Input Clock Duty Cycle (%) 65 Amplitude (dBFS) -20 SFDR (dBc) SNR (dBFS) 72 -40 -60 -80 0 50 D037 FIN = 370 MHz, AIN = – 3 dBFS 100 150 Input Frequency (MHz) 200 250 D038 FIN = 190 MHz , AIN = –1 dBFS SFDR = 49 dBc, fPSRR = 5 MHz, APSRR = 50 mVPP Figure 38. Performance vs Clock Duty Cycle Figure 39. Power-Supply Rejection Ratio FFT for test signal on AVDD Supply -10 0 PSRR with 50-mVPP Signal on AVDD PSRR with 50-mVPP Signal on AVDD3V -15 -20 Amplitude (dBFS) -20 PSRR (dB) -25 -30 -35 -40 -40 -60 -80 -45 -100 -50 -55 -120 0 50 100 150 200 250 Frequency of Signal on Supply (MHz) 300 0 FIN = 190 MHz, AIN = – 1 dBFS 100 150 Input Frequency (MHz) 200 250 D040 FIN = 190 MHz , AIN = – 1 dBFS SFDR = 81 , fCMRR = 5 MHz, ACMRR = 50 mVPP Figure 41. Common-Mode Rejection Ratio FFT Figure 40. Power-Supply Rejection Ratio vs Supplies 4 -20 Power Consumption (W) -25 -30 CMRR (dB) 50 D039 -35 -40 -45 -50 3.2 AVDD_Power (W) DVDD_Power (W) AVDD3V_Power (W) IOVDD_Power (W) TotalPower (W) 2.4 1.6 0.8 -55 -60 0 50 100 150 200 250 Frequency of Input Common-Mode Signal (MHz) 300 0 250 D041 300 350 400 Sampling Speed (MSPS) 450 500 D042 FIN = 190 MHz, AIN= – 1dBFS 50-mVPP test-Signal on input common mode Figure 42. Common-Mode Rejection Ratio 18 Submit Documentation Feedback Figure 43. Power vs Chip Clock Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 6.10 Typical Characteristics: Mode 2 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) Low pass or high pass decimation-by-2 filter selected as per input frequency. Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 25 50 75 Input Frequency (MHz) 100 125 0 FIN = 100 MHz , AIN = – 1 dBFS SNR = 74.1 dBFS, SFDR = 98 dBc, SFDR = 100 dBc (Non23) 50 75 Input Frequency (MHz) 100 125 D044 FIN = 150 MHz , AIN = – 1 dBFS SNR = 73.8 dBFS, SFDR = 99 dBc, SFDR = 99 dBc (Non23) Figure 44. FFT for 100-MHz Input Signal Figure 45. FFT for 150-MHz Input Signal 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) 25 D043 -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 25 50 75 Input Frequency (MHz) 100 125 0 D045 FIN = 185 MHz , AIN = – 1 dBFS SNR = 73.2 dBFS, SFDR = 98 dBc, SFDR = 98 dBc (Non23) 25 50 75 Input Frequency (MHz) 100 125 D045 FIN = 230 MHz , AIN = – 1 dBFS SNR = 72.4 dBFS, SFDR = 91 dBc, SFDR = 98 dBc (Non23) Figure 46. FFT for 185-MHz Input Signal Figure 47. FFT for 230-MHz Input Signal Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 19 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 6.11 Typical Characteristics: Mode 0 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) Low-pass decimation-by-2 filter selected, Complex FFT plotted,mixer frequency 125 MHz. Typical values are at TA = 25°C, full temperature range is from TMIN = –40°C to TMAX = 85°C, ADC Sampling Frequency = 500 Msps, 14-bit Resolution, No Decimation Filter, 50% clock duty cycle, AVDD3V = 3 V, AVDD = DVDD = 1.9 V, IOVDD = 1.15 V, –1-dBFS differential input for IF ≤ 250 MHz, and –3-dBFS differential input for IF > 250 MHz, unless otherwise noted. -40 -60 -80 -60 -80 -100 -100 -120 -125 -40 -75 -25 25 Input Frequency (MHz) 75 -120 -125 125 -75 -25 25 Input Frequency (MHz) D047 FIN = 270 MHz , AIN = – 3 dBFS SNR = 69.5 dBFS, SFDR = 83 dBc, SFDR = 87 dBc (Non23) 75 125 D048 FIN = 370 MHz , AIN = – 3 dBFS SNR = 68.1 dBFS, SFDR = 82 dBc, SFDR = 82 dBc (Non23) Figure 48. FFT for 270-MHz Input Signal Figure 49. FFT for 370-MHz Input Signal 0 Amplitude (dBFS) -20 -40 -60 -80 -100 -120 -125 -75 -25 25 Input Frequency (MHz) 75 125 D049 FIN = 470 MHz , AIN = – 3 dBFS SNR = 66.3 dBFS, SFDR = 75 dBc, SFDR = 75 dBc (Non23) Figure 50. FFT for 470-MHz Input Signal 20 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7 Detailed Description 7.1 Overview The ADS58J63 is a low power, wide bandwidth 14-bit 500 MSPS quad channel telecom receiver IC. It supports the JESD204B serial interface with data rates up to 10 Gbps supporting 1 lane per channel. The buffered analog input provides uniform input impedance across a wide frequency range while minimizing sample-and-hold glitch energy. The ADS58J63 provides excellent spurious-free dynamic range (SFDR) over a large input frequency range with very low power consumption. Its digital block includes a 2x and 4x decimation low pass filter with FS/4 and k×FS/16 mixers to support a receive bandwidth up to 200 MHz and a output burst mode for use as DPD observation receiver. The JESD204B interface reduces the number of interface lines allowing high system integration density. An internal phase locked loop (PLL) multiplies the incoming ADC sampling clock to derive the bit clock which is used to serialize the 14bit data from each channel. 7.2 Functional Block Diagram INAP/M Digital Block Interleaving Correction 14bit ADC 2x DAP/M FS/4 4x INBP/M Digital Block Interleaving Correction 14bit ADC K*FS/16 JESD204B 2x FS/8 DBP/M Burst Mode TRIGAB TRIGCD TRDYAB SYSREFP/M TRDYCD PLL x10/x20 CLKINP/M SYNCbAB SYNCbCD INCP/M Digital Block Interleaving Correction 14bit ADC Burst Mode DCP/M 2x FS/4 INDP/M Digital Block Interleaving Correction 14bit ADC JESD204B 4x K*FS/16 DDP/M 2x FS/8 SEN SDIN SDOUT SCLK RESET SCAN_EN Configuration Registers Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 21 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.3 Feature Description 7.3.1 Analog Inputs The ADS58J63 analog signal inputs are designed to be driven differentially. The analog input pins have internal analog buffers that drive the sampling circuit. As a result of the analog buffer, the input pins present a high impedance input across a very wide frequency range to the external driving source which enables great flexibility in the external analog filter design as well as excellent 50 Ω matching for RF applications. The buffer also helps to isolate the external driving circuit from the internal switching currents of the sampling circuit which results in a more constant SFDR performance across input frequencies. The common-mode voltage of the signal inputs is internally biased to 1.9 V using 600-Ω resistors which allows for AC coupling of the input drive network. Each input pin (INP, INM) must swing symmetrically between (VCM + 0.475 V) and (VCM – 0.475 V), resulting in a 1.9-Vpp (default) differential input swing. The input sampling circuit has a 3-dB bandwidth that extends up to 900 MHz. 7.3.2 Recommended Input Circuitry In order to achieve optimum AC performance the following circuitry is recommended at the analog inputs. T1 T2 0.1uF 10 INxP 0.1uF 0.1uF 25 25 Rin 3.3 pF Cin 25 25 INxM 1:1 1:1 0.1uF 10 Device Figure 51. Analog Input Driving Circuit 22 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.4 Device Functional Modes 7.4.1 Digital Features The ADS58J63 supports decimation by 2 and 4 and burst mode output. The 4 channels can be configured as pairs (A and B and C and D) to either burst or decimation mode (must be same decimation mode for all 4 channels). Table 1. Overview of Operating Modes DIGITAL MIXER DECIMATION BANDWIDTH AT 491Msps BANDWIDTH AT 368Msps OUTPUT FORMAT MAX OUTPUT RATE 0 ±FS/4 2 200 MHz 150 MHz Complex 250 Msps 2 – 2 100 MHz 75 MHz Real 250 Msps 4 N×Fs/16 2 100 MHz 75 MHz Real 250 Msps OPERATING MODE 5 DESCRIPTION Decimation N×Fs/16 2 200 MHz 150 MHz Complex 250 Msps 6 N×Fs/16 4 100 MHz 75 MHz Complex 125 Msps 7 N×Fs/16 2 100 MHz 75 MHz Real 500 Msps – – 245.76 MHz 184.32 MHz Real 500 Msps 8 Burst Mode Figure 52 shows signal processing in Digital Down-Conversion (DDC) Block in ADS58J63. I data Filter N Real data IL E n g i n e CH x 500MSPS data, x(n) 0 2 4 5 6 7 8 cos(2nfmix2/fS ) cos(2nfmix1/fS ) 2 sin(2nfmix1/fS ) Filter Upscaled Zeropadded data sin(2nfmix2/fS ) To JESD Encoder N Q data 14-bit Burst Mode 14/9-bit Burst Mode data Mode Selection Figure 52. Digital Down-Conversion (DDC) Block Table 2 shows characteristics of different blocks of DDC signal processing blocks active in different modes. Table 2. Features of DDC Block in Different Modes Mode fmix1 Filter and Decimation fmix 2 Output 0 fS/4 LPF cut off freq at fS/4, decimation by 2 not used I, Q data at 250 MSPS each is given out 2 not used LPF or HPF cut off at fS/4, decimation by 2 not used Straight 250 MSPS data is given out 4 k fS/16 LPF cutoff at fS/8, decimation by 2 fS/8 Real data at 250 MSPS is given out 5 k fS/16 LPF cutoff at fS/8, decimation by 2 not used I, Q data at 250 MSPS each is given out 6 k fS/16 LPF cutoff at fS/8, decimation by 4 not used I, Q data at 125 MSPS each is given out 7 k fS/16 LPF cutoff at fS8, decimation by 2 fS/8 Real data is up-scaled, zero-padded and given out at 500 MSPS 8 not used not used not used Straight 500 MSPS Burst mode data is given out Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 23 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.4.2 Mode 0 – Decimation by 2 with IQ Outputs for up to 220 MHz of IQ Bandwidth In this configuration, the DDC block includes a fixed frequency ±Fs/4 complex digital mixer preceding the digital filter – so the IQ passband is ± ~110 MHz (3 dB) centered at Fs/4. Mixing with +FS/4 inverts the spectrum. The stop band attenuation is approximately 90 dB and the passband flatness is ±0.1 dB. Figure 53 shows mixing operation in DDC Mode 0. ± Fs/4 14-bit ADC 500 Msps IQ: 500 Msps 2x IQ: 250 Msps FS/4 FS/2 FS/4 Figure 53. Mixing in Mode 0 CORNERS LOW PASS –0.1 dB 0.204 × Fs –0.5 dB 0.211 × Fs –1 dB 0.216 × Fs –3 dB 0.226 × Fs 20 0.5 0 0 -20 -0.5 Magnitude (dB) Magnitude (dB) Table 3. Filter Specification Details – Mode 0 -40 -60 -1.5 -80 -2 -100 -2.5 -120 -3 0 0.1 0.2 0.3 Frequency Response 0.4 0.5 0 0.05 D052 Figure 54. Frequency Response of Filter in Mode 0 24 -1 0.1 0.15 Frequency Response 0.2 0.25 D053 Figure 55. Zoomed view of Frequency Response Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.4.3 Mode 2 – Decimation by 2 for up to 110 MHz of Real Bandwidth In this configuration, the DDC block only includes a 2x decimation filter (high pass or low pass) with real outputs. The passband is ~110 MHz (3 dB). Figure 56 shows filtering operation in DDC Mode 2. 14-bit ADC 500 Msps 2x 250 Msps FS/4 FS/2 FS/4 Figure 56. Filtering in Mode 2 CORNERS LOW PASS HIGH PASS –0.1 dB 0.204 × Fs 0.296 × Fs –0.5 dB 0.211 × Fs 0.290 × Fs –1 dB 0.216 × Fs 0.284 × Fs –3 dB 0.226 × Fs 0.274 × Fs 20 0.5 0 0 -20 -0.5 Magnitude (dB) Magnitude (dB) Table 4. Filter Specification Details – Mode 2 -40 -60 -1 -1.5 -80 -2 -100 -2.5 -120 -3 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 Frequency Response 0.4 0.45 0.5 0 0.05 D056 Figure 57. Frequency Response for Decimate-by-2 Low Pass and High Pass Filter (in Mode 2) 0.1 0.15 Frequency Response 0.2 0.25 D057 Figure 58. Zoomed View of Frequency Response Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 25 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.4.4 Mode 4/7 – Decimation by 2 with Real Outputs for up to 110 MHz of Bandwidth In this configuration, the DDC block includes a selectable N×Fs/16 complex digital mixer (N from –8 to +7) preceding the decimation by 2 digital filter also with an IQ passband of ± ~55 MHz (3 dB) centered at N×Fs/16. A positive value for N inverts the spectrum. In addition a Fs/8 complex digital mixer is added after the decimation filter transforming the output back to real format while centering the output spectrum within the Nyquist zone. In addition the ADS58J63 supports a 0-pad feature where a sample with value = 0 gets added after each sample. In that way the output data rate gets interpolated to 500 Msps (real) with a 2nd image inverted at Fs/2Fin. The stop band attenuation is approximately 90 dB for in-band aliases from negative frequencies and ~55 dB for out of band aliases. The passband flatness is ±0.1 dB. 2nd Image FS/8 N*Fs/16 Fs/8 0 Pad 14-bit ADC 500 Msps IQ: 500 Msps Real: 500 Msps IQ: 250 Msps 2x Real: 250 Msps FS/4 FS/2 Example: N= -4 FS/8 FS/4 FS/2 0 FS/8 FS/4 FS/4 Figure 59. Mixing and Filtering in Mode 4/7 LOW PASS –0.1 dB 0.102 × Fs –0.5 dB 0.105 × Fs –1 dB 0.108 × Fs –3 dB 0.113 × Fs 20 0.5 0 0 -20 -0.5 Magnitude (dB) Magnitude (dB) Table 5. Filter Specification Details – Mode 4/7 CORNERS -40 -60 -1.5 -80 -2 -100 -2.5 -3 -120 0 0.05 0.1 0.15 Frequency Response 0.2 0.25 0 0.05 D050 Figure 60. Frequency Response for Decimate-by-2 LowPass Filter (in Mode 4 and Mode 7) 26 -1 0.1 0.15 Frequency Response 0.2 0.25 D051 Figure 61. Zoomed View of Frequency Response Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.4.5 Mode 5 – Decimation by 2 with IQ Outputs for up to 110 MHz of IQ Bandwidth In this configuration, the DDC block includes a selectable N×Fs/16 complex digital mixer (N from –8 to +7) preceding the decimation by 2 digital filter – so the IQ passband is ± ~55 MHz (3 dB) centered at N×Fs/16. A positive value for N inverts the spectrum. The stop band attenuation is approximately 90 dB for in-band aliases from negative frequencies. The passband flatness is ±0.1 dB. N*Fs/16 500 Msps 14-bit ADC IQ: 500 Msps 2x IQ: 250 Msps Example: N= -4 FS/4 FS/2 FS/8 FS/4 Figure 62. Mixing and Filtering in Mode 5 CORNERS LOW PASS –0.1 dB 0.102 × Fs –0.5 dB 0.105 × Fs –1 dB 0.108 × Fs –3 dB 0.113 × Fs 20 0.5 0 0 -20 -0.5 Magnitude (dB) Magnitude (dB) Table 6. Filter Specification Details – Mode 5 -40 -60 -1 -1.5 -80 -2 -100 -2.5 -3 -120 0 0.05 0.1 0.15 Frequency Response 0.2 0.25 0 0.05 D050 Figure 63. Frequency Response for Decimate-by-2 LowPass Filter (in Mode 5) 0.1 0.15 Frequency Response 0.2 0.25 D051 Figure 64. Zoomed View of Frequency Response Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 27 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.4.6 Mode 6 – Decimation by 4 with IQ Outputs for up to 110 MHz of IQ Bandwidth In this configuration, the DDC block includes a selectable n×Fs/16 complex digital mixer (n from –8 to +7) preceding the decimation by 4 digital filter – so the IQ passband is ± ~55 MHz (3 dB) centered at n×Fs/16. A positive value for N inverts the spectrum. The decimaiton by 4 filter is a cascade of two decimation by 2 filters with frequency response shown in Figure 66. The stop band attenuation is approximately 90 dB for in-band aliases from negative frequencies and ~55 dB for out of band aliases. The passband flatness is ±0.1 dB. N*Fs/16 500 Msps 14-bit ADC IQ: 500 Msps 2x IQ: 250 Msps IQ: 125 Msps 2x Example: N= -6 3FS/8 FS/4 FS/2 FS/8 FS/4 Figure 65. Mixing and Filtering in Mode 6 CORNERS LOW PASS –0.1 dB 0.102 × Fs –0.5 dB 0.105 × Fs –1 dB 0.108 × Fs –3 dB 0.113 × Fs 20 0.5 0 0 -20 -0.5 Magnitude (dB) Magnitude (dB) Table 7. Filter Specification Details – Mode 6 -40 -60 -1.5 -80 -2 -100 -2.5 -3 -120 0 0.05 0.1 0.15 Frequency Response 0.2 0.25 0 0.05 D050 Figure 66. Frequency Response for Decimate-by-2 LowPass Filter (in Mode 6) 28 -1 0.1 0.15 Frequency Response 0.2 0.25 D051 Figure 67. Zoomed View of Frequency Response Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.4.7 Mode 8 – Burst Mode In burst mode the output data is alternated between low resolution (L, 9-bit) and high resolution (H, 14-bit) output. The burst mode can be configured via SPI register writes independently for channel A/B and channel C/D. The high resolution output is 14 bit and the number (#) of high and low resolution samples is set with two user programmable counters – one for high resolution (HC) and one for low resolution (LC). There is one counter pair (HC, LC) for channel A/B and one pair for channel C/D. The internal logic checks if the maximum duty cycle is exceeded and if necessary resets the counters to its default values. Each output cycle starts with a low resolution and the counter values can be reconfigured for the next cycle during prior to the start of the next cycle. Enable Burst Mode New cycle starts again L times out DA DB DC DD L H L H Update Counter Values HRES 14-bit high resolution 9-bit low resolution D 13 D 12 D D 11 10 D 9 D 8 D 7 D 6 D 5 D 4 D 3 D 2 D 1 D OVR HR 0 16-bit data going into 8b/10b encoder Figure 68. Timing Diagram for 14-bit Burst Mode (DDC Mode 8) The counter values for high and low resolution can be programmed to: High resolution counter (HC): 1 to 225 Low resolution counter (LC); 1 to 228 The output duty cycle limit is illustrated in Table 8. Table 8. Output Duty Cycle Limit HIGH RESOLUTION OUTPUT LOW RESOLUTION OUTPUT MAXIMUM ALLOWED DUTY CYCLE (high : low resolution output) DEFAULT VALUE HC DEFAULT VALUE LC 14 bit 9 bit 1/3 1 3 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 29 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.4.8 Trigger Input The burst mode can be operated in auto trigger or manual trigger mode. In manual trigger mode the TRIGGER input (TRIGAB, TRIGCD) is used to release the high resolution data (HC) burst after the low resolution data counter LC has timed out. In auto trigger mode the high resolution data is released immediately after completion of the last low resolution sample. Using SPI control the ADS58J63 can be configured to use TRIGAB or TRIGCD as the manual trigger input. 7.4.9 Manual Trigger Mode Upon enabling manual trigger mode, the ADS58J63 starts transmission of low resolution data. As soon as the LC counter is finished, the manual trigger is unlocked, the trigger ready flag (TRDY) is raised and the high resolution output H can be triggered. Once the low resolution counter LC is finished, the next high resolution output or burst mode sequence can be triggered again. The HRES flag is embedded in the JESD204B output data stream. The counter values can be updated until a new burst mode cycles starts with transmission of low resolution samples. Example of burst mode with manual trigger: Enable Burst Mode LC times out Ready for trigger DA DB DC DD Trigger Event L New cycle starts again H L H Update Counter Values TRDYAB/CD TRIGAB/CD HRES 14 bit high resolution 9 bit low resolution D 13 D 12 D D 11 10 D 9 D 8 D 7 D 6 D 5 D 4 D 3 D 2 D 1 D OVR HR 0 16 bit data going into 8b/10b encoder Figure 69. Timing Diagram for Manual Trigger Mode 30 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.4.10 Auto Trigger Mode Upon enabling auto trigger mode, the ADS58J63 starts transmission of low resolution data. As soon as the low resolution samples counter (LC) is finished, the ADS58J63 immediately begins transmitting the high resolution output H. The HRES flag can also be embedded in the JESD204B output data stream. The counter values can be updated until a new burst mode cycles starts with transmission of low resolution samples. Any input on the trigger input pins is ignored. Example of burst mode with automatic trigger: Enable Burst Mode New cycle starts again LC times out DA DB DC DD L H L H Update Counter Values HRES 14-bit high resolution 9-bit low resolution D 13 D 12 D D 11 10 D 9 D 8 D 7 D 6 D 5 D 4 D 3 D 2 D 1 D OVR HR 0 16-bit data going into 8b/10b encoder Figure 70. Timing Diagram for Auto Trigger Mode Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 31 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.4.11 Over-range Indication The ADS58J63 provides a fast over-range indication (FOVR) which can be presented in the digital output data stream via SPI configuration. When the FOVR indication is embedded in the output data stream, it replaces the LSB (normal 0) of the 16 bit going to the 8b/10b encoder. One threshold is set per channel pair A/B and C/D. 14-bit data output D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 0 0/ OVR 16-bit data going into 8b/10b encoder Figure 71. Timing Diagram for FOVR The fast OVR is triggered if the input voltage exceeds the programmable overrange threshold and it gets presented after just 44 input clock cycles enabling a quicker reaction to an overrange event. The input voltage level at which the overload is detected is referred to as the threshold. It is programmable using the FOVR THRESHOLD bits. The input voltage level at which fast OVR is triggered is: Full-scale × [the decimal value of the FOVR Threshold bits] / 255) The default threshold is E3h (227) which corresponds to a threshold of –1 dBFS. In terms of full scale input, the fast OVR threshold can be calculated as shown in Equation 1: 20 × log (<FOVR Threshold>/255). (1) Following is an example register write to set the FOVR threshold for all 4 channels: Table 9. Register Sequence for FOVR Configuration 32 ADDRESS DATA COMMENT 11h 80h Go to Master page 59h 20h Enable FOVR 11h FFh Go to ADC page Set FOVR threshold for chCD to 255 5Fh FFh 4004h 68h 4003h 00h Go to main digital page 60ABh 01h Enable bit D0 overwrite 60ADh 03h Select FOVR to replace bit D0 6000h 01h 6000h 00h Issue and clear digital reset Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.4.12 Power-Down Mode The ADS58J63 provides a highly-configurable power-down mode. Power-down can be enabled using the PDN pin or SPI register writes. A power-down mask can be configured, which allows a trade-off between wake-up time and power consumption in power-down mode. Two independent power-down masks can be configured: MASK 1 and MASK 2 as shown in Table 10. See the master page registers in Table 15 for further details. Table 10. Register Address for Power-Down Modes REGISTER ADDRESS REGISTER DATA COMMENT A[7:0] (Hex) 7 6 5 4 3 2 0 0 1 0 MASTER PAGE (80h) 20 21 23 24 MASK 1 MASK 2 PDN ADC CHAB PDN BUFFER CHCD PDN ADC CHAB PDN BUFFER CHCD 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PDN MASK 0 0 0 0 OVERRIDE PDN PIN PDN MASK SEL 53 0 MASK SYSREF 55 0 0 CONFIG 0 PDN ADC CHCD PDN BUFFER CHAB GLOBAL PDN 26 PDN ADC CHCD PDN BUFFER CHAB To save power, the device can be put in complete power down by using the GLOBAL PDN register bit. However, when JESD link must remain up while putting the device in power down, the ADC and analog buffer can be powered down by using the PDN ADC CHx and PDN BUFFER CHx register bits after enabling the PDN MASK register bit. The PDN MASK SEL register bit can be used to select between MASK 1 or MASK 2. Table 11 shows power consumption for different combinations of the GLOBAL PDN, PDN ADC CHx, and PDN BUFF CHx register bits. Table 11. Power Consumption in Different Power-Down Settings REGISTER BIT COMMENT IAVDD3V (mA) IAVDD (mA) IDVDD (mA) IIOVDD (mA) TOTAL POWER (W) Default After reset, with a full-scale input signal to both channels 0.340 0.365 0.184 0.533 2.675 GBL PDN = 1 The device is in complete power-down state 0.002 0.006 0.012 0.181 0.247 GBL PDN = 0, PDN ADC CHx = 1 (x = AB or CD) The ADCs of one pair of channels are powered down 0.277 0.225 0.123 0.496 2.063 GBL PDN = 0, PDN BUFF CHx = 1 (x = AB or CD) The input buffers of one pair of channels iarepowered down 0.266 0.361 0.187 0.527 2.445 GBL PDN = 0, PDN ADC CHx = 1, PDN BUFF CHx = 1 (x = AB or CD) The ADCs and input buffers of one pair of channels are powered down 0.200 0.224 0.126 0.492 1.830 GBL PDN = 0, PDN ADC CHx = 1, PDN BUFF CHx = 1 (x = AB and CD) The ADCs and input buffers of all channels are powered down 0.060 0.080 0.060 0.448 0.960 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 33 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.5 Programming 7.5.1 Device Configuration The ADS58J63 can be configured using a serial programming interface, as described below. In addition, the device has one dedicated parallel pin (PDN) for controlling the power down modes. The ADS58J63 supports a 24-bit (16-bit address, 8-bit data) SPI operation and uses paging (see detailed register map info) to access all register bits. 7.5.1.1 Details of Serial Interface The ADC has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial interface enable), SCLK (serial interface clock) and SDIN (serial interface data) pins. Serial shift of bits into the device is enabled when SEN is low. Serial data on SDIN are latched at every SCLK rising edge when SEN is active (low). The interface can work with SCLK frequencies from 5 MHz down to very low speeds (of a few hertz) and also with non-50% SCLK duty cycle. Register Address[11:0] SDIN R/W M P CH A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 tDH tSCLK tDSU SCLK tSLOADS tSLOADH SEN RESET Figure 72. Serial Interface Timing Diagram Table 12. Programing Details of Serial Interface SPI BITS OPTIONS Read/write bit 0 = SPI write 1 = SPI read back M SPI bank access 0 = Analog SPI bank (Master and ADC page) 1 = JDigital SPI bank (Main Digital, Analog JESD, and Digital JESD pages) P JESD page selection bit 0 = Page access 1 = Register access SPI access for a specific channel of the digital SPI bank 0 = Channel AB 1 = Channel CD By default, both channels are being addressed. SPI address bits — SPI data bits — R/W CH ADDR [11:0] DATA [7:0] 34 DESCRIPTION Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.5.1.2 Serial Register Write: Analog Bank The analog SPI bank contains of two pages (the master and ADC page). The internal register of the ADS58J63 analog SPI bank can be programmed by: 1. Drive the SEN pin low. 2. Initiate a serial interface cycle specifying the page address of the register whose content must be written. – Master page: write address 0011h with 80h. – ADC page: write address 0011h with 0Fh. 3. Write the register content as shown in Figure 73. When a page is selected, multiple writes into the same page can be done. SDIN 0 0 0 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET Figure 73. Serial Register Write Timing Diagram 7.5.1.3 Serial Register Readout: Analog Bank The content from one of the two analog banks can be read out by: 1. Drive the SEN pin low. 2. Select the page address of the register whose content must be read. – Master page: write address 0011h with 80h. – ADC page: write address 0011h with 0Fh. 3. Set the R/W bit to 1 and write the address to be read back. 4. Read back the register content on the SDOUT pin, as shown in Figure 74. When a page is selected, multiple read backs from the same page can be done. SDIN 1 0 0 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] = XX A3 A2 A1 A0 D7 D6 D5 D7 D6 D5 D4 D3 D2 D1 D0 D4 D3 D2 D1 D0 SCLK SEN RESET SDOUT SDOUT[7:0] Figure 74. Serial Register Read Timing Diagram Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 35 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.5.1.4 JESD Bank SPI Page Selection The JESD SPI bank contains four pages (main digital, interleaving engine, digital, and analog JESD pages). The individual pages can be selected by: 1. Drive the SEN pin low. 2. Set the M bit to 1 and specify the page with two register writes. Note that the P bit must be set to 0, as shown in Figure 75. – Write address 4003h with 00h (LSB byte of page address). – Write address 4004h with the MSB byte of the page address. – For Main digital page: write address 4004h with 68h. – For Digital JESD page: write address 4004h with 69h. – For Analog JESD page: write address 4004h with 6Ah. – For Interleaving engine page: write address 4004h with 61h. SDIN 0 1 0 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET Figure 75. SPI Page Selection 7.5.1.5 Serial Register Write: Analog Bank The analog SPI bank contains two pages (Master and ADC page). The internal register of the ADS58J63 analog SPI bank can be programmed following these steps: 1. Drive the SEN pin low. 2. Initiate a serial interface cycle specifying the page address of the register whose content has to be written – Master page: write address 11h with 80h – ADC page: write address 11h with 0Fh 3. Write register content. Once a page is selected, multiple writes into the same page can be done. SDIN 0 1 1 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET Figure 76. Serial Register Write Timing Diagram 36 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.5.1.6 Serial Register Readout: Analog Bank SPI read out of content in one of the two analog banks can be accomplished with the following steps: 1. Drive the SEN pin low. 2. Select the page address of the register which content has to be read. – Master page: write Address = 11h with 80h – ADC page: write Address 11h with 0Fh. 3. Set the R/W bit to '1' and write the address to be read back. 4. Read back register content on the SDOUT pin. Once a page is selected, multiple read backs from the same page can be done. SDIN 1 1 1 0 R/W M P CH Register Address[11:0] A11 A10 A9 A8 A7 A6 A5 A4 Register Data[7:0] = XX A3 A2 A1 A0 D7 D6 D5 D7 D6 D5 D4 D3 D2 D1 D0 D4 D3 D2 D1 D0 SCLK SEN RESET SDOUT SDOUT[7:0] Figure 77. Serial Register Read Timing Diagram 7.5.1.7 Digital Bank SPI Page Selection The Digital SPI bank contains five pages (Main digital, Interleaving Engine, Decimation filter, JESD digital, and JESD analog). The individual pages can be selected following these steps: 1. Drive the SEN pin low. 2. Set the M bit to ‘1’ and specify the page with two register writes (Note: P bit set to 0) – Write address 4003h with 00h (LSB byte of page address) – Write address 4004h MSB byte of page address spacer – Main digital page: write Address = 4004h with 68h (default) – Digital JESD page: write Address = 4004h with 69h – Analog JESD page: write Address = 4004h with 6Ah – Interleaving Engine page: write Address = 4004h with 61h – Decimation Filter page: write Address = 4004h with 61h and 4003h with 41h SDIN 0 1 0 0 R/W M P CH Register Address <11:0> A11 A10 A9 A8 A7 A6 A5 A4 Register Data <7:0> A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET Figure 78. SPI Timing Diagram for Digital Bank Page Selection Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 37 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.5.1.8 Serial Register Write – Digital Bank The ADS58J63 is a quad channel device and the JESD204B portion is configured individually for 2 channel (A/B and C/D) using the CH bit. Note the P bit needs to be set to 1 for register writes. 1. Drive the SEN pin low. 2. Select the digital bank page (Note: M bit = 1, P bit = 0) – Write address 4003h with 00h – Main digital page: write Address = 4004h with 68h (default) – Digital JESD page: write Address = 4004h with 69h – Analog JESD page: write Address = 4004h with 6Ah – Interleaving Engine page: write Address = 4004h with 61h – Decimation Filter page: write Address = 4004h with 61h and 4003h with 41h 3. Set M and P bit to 1 and select ChAB (CH=0) or ChCD (CH=1) and write register content. Once a page is selected, multiple writes into the same page can be done. By default, register writes are applied to both channel pairs (broadcast mode). To disable broadcast mode and enable individual channel writes, write address 4005h with 01h (default is 00h). SDIN 0 1 1 0 R/W M P CH Register Address <11:0> A11 A10 A9 A8 A7 A6 A5 A4 Register Data <7:0> A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET Figure 79. Serial Register Write Timing Diagram 7.5.1.9 Individual Channel Programming By default, register writes are applied to both channels. To enable individual channel writes, write address 4005h with 01h (default is 00h). 7.5.1.10 Serial Register Readout – Digital Bank SPI read out of content in one of the three digital banks can be accomplished with the following steps: 1. Drive the SEN pin low. 2. Select the digital bank page (Note: M bit = 1, P bit = 0) – Write address 4003h with 00h – Main digital page: write Address = 4004h with 68h – Digital JESD page: write Address = 4004h with 69h – Analog JESD page: write Address = 4004h with 6Ah – Interleaving Engine page: write Address = 4004h with 61h – Decimation Filter page: write Address = 4004h with 61h and 4003h with 41h 3. Set the R/W bit, M and P bit to '1' and select ChAB) or ChCD and write the address to be read back. 4. Read back register content on the SDOUT pin. Once a page is selected, multiple read backs from the same page can be done. 38 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SDIN SBAS717A – JUNE 2015 – REVISED JUNE 2015 1 1 1 0 R/W M P CH Register Address <11:0> A11 A10 A9 A8 A7 A6 A5 A4 Register Data <7:0> = XX A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 SCLK SEN RESET SDOUT SDOUT <7:0> Figure 80. Serial Register Read Timing Diagram Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 39 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.5.2 JESD204B Interface The ADS58J63 supports device subclass 1 with a maximum output data rate of 10 Gbps for each serial transmitter. An external SYSREF signal is used to align all internal clock phases and the local multi frame clock to a specific sampling clock edge. This allows synchronization of multiple devices in a system and minimizes timing and alignment uncertainty. The ADS58J63 supports single (for all 4 JESD links) or dual (for channel A/B and C/D) SYNCb inputs and can be configured via SPI. JESD204B Block Transport Layer Frame Data Mapping Link Layer 8b/10b encoding Scrambler 1+x14+x15 DX Comma characters Initial lane alignment Test Patterns SYNCb Figure 81. JESD Interface Block Diagram Depending on the ADC sampling rate, the JESD204B output interface can be operated with 1 lane per channel. The JESD204B setup and configuration of the frame assembly parameters is handled via SPI interface. The JESD204B transmitter block consists of the transport layer, the data scrambler and the link layer. The transport layer maps the ADC output data into the selected JESD204B frame data format and manages if the ADC output data or test patterns are being transmitted. The link layer performs the 8b/10b data encoding as well as the synchronization and initial lane alignment using the SYNC input signal. Optionally data from the transport layer can be scrambled. SYSREF SYNCbAB INA JESD 204B JESD204B DA INB JESD 204B JESD204B DB INC JESD 204B JESD204B DC IND JESD 204B JESD204B DD Sample SYNCbCD Clock Figure 82. JESD204B Transmitter Block 40 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.5.2.1 JESD204B Initial Lane Alignment (ILA) The initial lane alignment process is started by the receiving device by de-asserting the SYNCb signal. Upon detecting a logic low on the SYNC input pins, the ADS58J63 starts transmitting comma (K28.5) characters to establish code group synchronization. Once synchronization is completed the receiving device re-asserts the SYNCb signal and the ADS58J63 starts the initial lane alignment sequence with the next local multi frame clock boundary. The ADS58J63 transmits 4 multi-frames each containing K frames (K is SPI programmable). Each of the multi-frames contains the frame start and end symbols and the 2nd multi-frame also contains the JESD204 link configuration data. SYSREF LMFC Clock LMFC Boundary Multi Frame SYNCb Transmit Data xxx K28.5 K28.5 Code Group Synchronization ILA ILA Initial Lane Alignment DATA DATA Data Transmission Figure 83. ILA Sequence 7.5.2.2 JESD204B Frame Assembly The JESD204B standard defines the following parameters: • L is the number of lanes per link. • M is the number of converters per device. • F is the number of octets per frame clock period. • S is the number of samples per frame. Table 13 lists the available JESD204B formats and valid ranges for the ADS58J63. The ranges are limited by the Serdes line rate and the maximum ADC sample frequency. Table 13. Available JESD204B Formats and Valid Ranges for the ADS58J63 L M F S OPERATING MODE DIGITAL MODE OUTPUT FORMAT JESD MODE (69h, 01h) JESD PLL MODE (6Ah, 01h6) MAX ADC OUTPUT RATE (Msps) MAX fSERDES (Gbps) 4 8 4 1 0,5 2x Decimation Complex 40 x 40 x 250 10.0 4 4 2 1 2,4 2x Decimation Real 20 x 20 x 250 5.0 2 4 4 1 2,4 2x Decimation Real 40 x 40 x 250 10.0 4 8 4 1 6 4x Decimation Complex 40 x 20 x 125 5.0 2 8 8 1 6 4x Decimation Complex 80 x 40 x 125 10.0 4 4 2 1 7 2x Decimation with ‘0-Pad’ Real 20 x 40 x 500 10.0 4 4 2 1 8 Burst Mode Real 20 x 40 x 500 10.0 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 41 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com The detailed frame assembly is shown in Table 14. Table 14. Detailed Frame Assembly LMFS = 4841 LMFS = 4421 AI0[15:8] AI0[7:0] AQ0[15:8 ] AQ0[7:0] A0[15:8] A0[7:0] A1[15:8] A1[7:0] A0[15:8] A0[7:0] 0000 0000 0000 0000 DB BI0[15:8] BI0[7:0] BQ0[15:8 ] BQ0[7:0] B0[15:8] B0[7:0] B1[15:8] B1[7:0] B0[15:8] B0[7:0] 0000 0000 0000 0000 DC CI0[15:8] CI0[7:0] CQ0[15:8 ] CQ0[7:0] C0[15:8] C0[7:0] C1[15:8] C1[7:0] C0[15:8] C0[7:0] 0000 0000 0000 0000 DD DI0[15:8] DI0[7:0] DQ0[15:8 ] DQ0[7:0] D0[15:8] D0[7:0] D1[15:8] D1[7:0] D0[15:8] D0[7:0] 0000 0000 0000 0000 DB A0[15:8] A0[7:0] B0[15:8] B0[7:0] AI0[15:8] AI0[7:0] AQ0[15:8] AQ0[7:0] BI0[15:8] BI0[7:0] BQ0[15:8] BQ0[7:0] DC C0[15:8] C0[7:0] D0[15:8] D0[7:0] CI0[15:8] CI0[7:0] CQ0[15:8] CQ0[7:0] DI0[15:8] DI0[7:0] DQ0[15:8] DQ0[7:0] LMFS = 2441 42 LMFS = 4421 (0-Pad) DA LMFS = 2881 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.5.2.3 JESD Output Switch The ADS58J63 provides a digital cross point switch in the JESD204B block which allows internal routing of any output of the 2 ADCs within one channel pair to any of the 2 JESD204B serial transmitters in order to ease layout constraints. The cross point switch routing is configured via SPI (address 21h in JESD digital page). JESD SWITCH ADCA DAP/M ADCB DBP/M JESD SWITCH ADCC DCP/M ADCD DDP/M Figure 84. Switching the Output Lanes 7.5.2.3.1 Serdes Transmitter Interface Each of the 10 Gbps serdes transmitter outputs requires AC coupling between transmitter and receiver. The differential pair should be terminated with 100 Ω as close to the receiving device as possible to avoid unwanted reflections and signal degradation. 0.1 uF DA/B/C/DP Rt= ZO Transmission Line Zo VCM Receiver Rt= ZO DA/B/C/DM 0.1 uF Figure 85. Serdes Transmitter Connection to Receiver 7.5.2.3.2 SYNCb Interface The ADS58J63 supports single (either SYNCb input controls all 4 JESD204B links) or dual (1 SYNCb input controls 2 JESD204B lanes (DA/DB and DC/DD) SYNCb control. When using single SYNCb control, the unused input should be connected to differential logic low (SYNCbxxP = 0 V, SYNCbxxM = IOVDD). Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 43 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.5.2.3.3 Eye Diagram Figure 86 to Figure 89 show the serial output eye diagrams of the ADS58J63 at 5 Gbps and 10 Gbps with default and increased output voltage swing against the JESD204B mask. 44 Figure 86. Eye at 5-Gbps Bit Rate with Default Output Swing Figure 87. Eye at 5-Gbps Bit Rate with Increased Output Swing Figure 88. Eye at 10-Gbps Bit Rate with Default Output Swing Figure 89. Eye at 10-Gbps Bit Rate with Increased Output Swing Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6 Register Maps The conceptual diagram of Serial Registers is shown in Figure 90. SPI CYCLE Initiated M, P, CH, Bits Decoder M=0 M=1 Analog Page Selection JESD Bank Page Address Value 6800h Addr 20h Addr 74h Addr 59h Addr 18h Addr 0h ADC Page [Test Patterns and Fast OVR] Master Page [PDN, OVR, DC Coupling] Main Digital Page [Nyquist Zone, OVR Select] Addr 78h Value 6100h Decimation Filter Page [Signal Processing Modes 0 to 8] IL Engine Page [Engine bypass, DC Correction] Value 6900h Addr 02h Value 6900h Addr 12h Addr 0h Addr 00h Addr 68h Addr F7h Value 6141h JESD Analog Page [PLL configuration, Output Swing, Pre-emphasis] JESD Digital Page [JESD config] Addr 1Bh Addr 22h Figure 90. Serial Interface Registers 7.6.1 Detailed Register Info The ADS58J63 contains two main SPI banks. The analog SPI bank gives access to the ADC cores while the digital SPI bank controls the serial interface. The analog SPI bank is divided into two pages (MASTER and ADC) while the digital SPI bank is divided into five pages (Main digital, Interleaving Engine, Decimation filter, JESD digital, and JESD analog). Table 15. Register Map Register Address Register Data A7-A0 in hex D7 D6 D5 D4 D3 D2 D1 D0 0 RESET 0 0 0 0 0 0 RESET 0 0 DIS BROADCAST 3 JESD BANK PAGE SEL [7:0] 4 JESD BANK PAGE SEL [15:8] 5 0 0 0 0 0 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 45 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com Register Maps (continued) Table 15. Register Map (continued) Register Address A7-A0 in hex Register Data D7 D6 D5 D4 11 D3 D2 D1 D0 0 0 ANALOG PAGE SELECTION [7:0] MASTER PAGE (80h) 20 PDN ADC CHAB 21 PDN ADC CHCD PDN BUFFER CHCD PDN BUFFER CHAB 23 0 0 PDN ADC CHAB 24 PDN ADC CHCD 0 0 0 0 26 GLOBAL PDN PDN BUFFER CHCD OVERRIDE PDN PIN PDN MASK SEL 0 0 0 0 0 3A 0 BUFFER CURR INCREASE 0 0 0 0 0 0 39 PDN BUFFER CHAB 0 0 0 0 0 0 53 CLK DIV ALWAYS WRITE 1 MASK SYSREF 0 0 0 0 0 0 55 0 0 0 PDN MASK 0 0 0 0 56 0 0 0 0 INPUT BUFF CURR EN 0 0 0 59 0 0 ALWAYS WRITE 1 0 0 0 0 0 ADC PAGE (0Fh) 5F FOVR CHCD THRESH 60 0 0 0 PULSE BIT CHC 0 0 0 0 61 0 0 0 HD3 NYQ2 CHCD 0 0 0 PULSE BIT CHD 6C 0 0 0 PULSE_BIT_CHA 0 0 0 0 6D 0 0 0 HD3_NYQ2_CHAB 0 0 0 PULSE BIT CHB 0 0 0 0 0 0 0 0 74 TEST PATTERN ON CHANNEL 75 CUSTOM PATTERN 1 [13:6] 76 CUSTOM PATTERN 1 [5:0] 77 CUSTOM PATTERN 2 [13:6] 78 CUSTOM PATTERN 2 [5:0] INTERLEAVING ENGINE PAGE (6100h) 18 0 0 0 0 0 68 0 0 0 0 0 0 IL BYPASS DC CORR DIS 0 DECIMATION FILTER PAGE (6141h) 0 CHB/C FINE MIX DDC MODE 1 0 0 0 0 DDC MODE6 EN1 2 0 0 CHA/D HPF EN CHA/D COARSE MIX 0 0 0 0 0 0 42 0 0 0 0 0 ALWAYS WRITE 1 CHB/C HPF EN CHB/C COARSE MIX CHA/D FINE MIX MAIN DIGITAL PAGE (6800h) 46 0 0 IL RESET NYQUIST ZONE 4E CTRL NYQUIST ZONE 0 0 0 0 0 0 0 AB 0 0 0 0 0 0 0 OVR EN AD 0 0 0 0 Submit Documentation Feedback OVR ON LSB Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 Register Maps (continued) Table 15. Register Map (continued) Register Address Register Data A7-A0 in hex D7 D6 D5 D4 D3 D2 D1 D0 F7 0 0 0 0 0 0 0 DIG RESET 0 CTRL K JESD MODE EN DDC MODE6 EN2 TESTMODE EN 0 LANE ALIGN FRAME ALIGN 1 SYNC REG SYNC REG EN SYNCB SEL AB/CD 0 DDC MODE6 EN3 0 LINK LAYER RPAT LMFC MASK RESET 0 JESD DIGITAL PAGE (6900h) 2 LINK LAYER TESTMODE 3 FORCE LMFC COUNT 5 SCRAMBLE EN 0 0 6 0 0 0 17 19 HIRES FLAG ON LSB 0 0 0 0 0 0 RATIO INVALID 0 FRAMES PER MULTI FRAME (K) 0 TRIG SET AB/CD 0 0 AUTO TRIG EN LC [23:16] LC [15:8] 1C 0 LC [27:24] 1B LC [7:0] 0 0 0 0 HC [27:24] 1E HC [23:16] 1F HC [15:8] 20 HC [7:0] 21 22 0 RELEASE ILANE SEQ 1A 1D 0 LMFC COUNT INIT 0 TX LINK DIS JESD MODE OUPUT CHA MUX SEL 0 OUTPUT CHB MUX SEL 0 0 OUTPUT CHC MUX SEL 0 OUT CHA INV OUTPUT CHD MUX SEL OUT CHB INV OUT CHC INV OUT CHD INV 0 JESD ANALOG PAGE (6A00h) 12 SEL EMP LANE A/D 0 13 SEL EMP LANE B/C 0 16 0 1B 0 JESD SWING 0 0 0 0 0 0 0 0 JESD PLL MODE 0 0 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 47 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.2 Example Register Writes Global Power Down ADDRESS DATA 11h 80h Set Master Page COMMENT 00h26 80h Set Global Power Down Change decimation mode 0 (default) to mode 4 adjusting both the LMFS configuration (LMFS = 4841 to 4421) as well as serial output data rate (10 Gbps to 5 Gbps). 48 ADDRESS DATA COMMENT 4004h 69h 4003h 00h 6000h 40h Enables JESD mode overwrite 6001h 01h Select digital to 20x mode 4004h 6Ah Select analog JESD page 6016h 00h Set serdes PLL to 20x mode 4004h 61h Select decimation filter page 4003h 41h 6000h CCh Select mode 4 Digital mixer for chAB set to –4 (FS/4) 6002h 0Ch Digital mixer for chCD set to –4 (FS/4) Select digital JESD page Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3 Register Descriptions 7.6.3.1 Register 0h (offset = 0h) [reset = 0h] Figure 91. Register 0h A7-A0 in Hex 0 7 RESET 6 0 5 0 4 0 3 0 2 0 1 0 0 RESET 1 0 LEGEND: W = Write only; -n = value after reset Table 16. Register 0h Field Description Bit (1) (1) Name Type Reset Description D7 RESET R/W 0 0 = Normal operation 1 = Internal software reset, clears back to 0 D0 RESET R/W 0 0 = Normal operation 1 = Internal software reset, clears back to 0 Both bits (D7, D0) must be set simultaneously to exercise reset 7.6.3.2 Register 3h/4h (offset = 3h/4h) [reset = 0h] Figure 92. Register 3h/4h A7-A0 in Hex 3 4 7 6 5 4 3 JESD BANK PAGE SEL [7:0] JESD BANK PAGE SEL [16:8] 2 LEGEND: W = Write only; -n = value after reset Table 17. Register 3h/4h Field Description Bit D7 - D0 Name Type JESD BANK PAGE SEL R/W Reset Description 0 Program these bits to access desired page in JESD Bank 6100h = Interleaving Engine Page selected 6141h = Decimation Filter Page Selected 6800h = Main Digital Page Selected 6900h = JESD Digtial Page selected 6A00h = JESD Analog Page selected 7.6.3.3 Register 5h (offset = 5h) [reset = 0h] Figure 93. Register 5h A7-A0 in Hex 7 6 5 4 3 2 1 5 0 0 0 0 0 0 0 0 DIS BROADCAST LEGEND: W = Write only; -n = value after reset Table 18. Register 5h Field Description Bit D0 Name DIS BROADCAST Type R/W Reset Description 0 0 = Normal operation. Channel A and B are programmed as a pair. Channel C and D are programmed as a pair. 1 = channel A and B can be individually programmed based on bit 'CH'. Similarly channel C and D can be individually programmed based on bit 'CH'. 7.6.3.4 Register 11h (offset = 11h) [reset = 0h] Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 49 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com Figure 94. Register 11h A7-A0 in Hex 11 7 6 5 4 3 ANALOG PAGE SELECTION [7:0] 2 1 0 LEGEND: R/W = Read/Write; -n = value after reset Table 19. Register 11h Field Descriptions Bit Name D7-D0 Type ANALOG PAGE SELECTION [7:0] R/W Reset Description 0 Register page (only one page at a time can be addressed). Master page = 80h ADC page = 0Fh The 5 digital pages (Main digital, Interleaving Engine, Analog JESD, Digital JESD, and Decimation filter) are selected via the M bit. See Serial Interface Read/Write section for more details. 7.6.3.5 Master Page (80h) 7.6.3.5.1 Register 20h (address = 20h) [reset = 0h] , Master Page (080h) Figure 95. Register 20h A7-A0 in Hex 7 6 5 PDN ADC CHAB R/W-0h 4 3 2 1 PDN ADC CHCD R/W-0h 0 LEGEND: R/W = Read/Write; -n = value after reset Table 20. Registers 20h Field Descriptions 50 Bit Field Type Reset Description 7-4 PDN ADC CHAB R/W 0h 3-0 PDN ADC CHCD R/W 0h There are two power-down masks that are controlled via the PDN mask register bit in address 55h. The power-down mask 1 or mask 2 are selected via register bit 5 in address 26h. Power-down mask 1: addresses 20h and 21h. Power-down mask 2: addresses 23h and 24h. See Power-Down Mode for details. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.5.2 Register 21h (address = 21h) [reset = 0h] , Master Page (080h) Figure 96. Register 21h A7-A0 in Hex 7 6 PDN BUFFER CHCD R/W-0h 5 4 PDN BUFFER CHAB R/W-0h 3 0 W-0h 2 0 R/W-0h 1 0 R/W-0h 0 0 W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 21. Register 21h Field Descriptions Bit Field Type Reset Description 7-6 PDN BUFFER CHCD R/W 0h 5-4 PDN BUFFER CHAB R/W 0h 3 0 W 0h There are two power-down masks that are controlled via the PDN mask register bit in address 55h. The power-down mask 1 or mask 2 are selected via register address 26h, bit 5. Power-down mask 1: addresses 20h and 21h. Power-down mask 2: addresses 23h and 24h. See Power-Down Mode for details. 2-0 0 W 0h Must write 0. 7.6.3.5.3 Register 23h (address = 23h), Master Page (080h) Figure 97. Register 23h A7-A0 in Hex 7 PDN BUFFER CHAB 6 5 R/W-0h 4 R/W-0h 3 W-0h 2 1 PDN BUFFER CHCD R/W-0h R/W-0h 0 W-0h LEGEND: R/W = Read/Write; -n = value after reset Table 22. Register 23h Field Descriptions Bit Field Type Reset Description 7-4 PDN ADC CHAB R/W 0h 3-0 PDN ADC CHCD R/W 0h There are two power-down masks that are controlled via the PDN mask register bit in address 55h. The power-down mask 1 or mask 2 are selected via register bit 5 in address 26h. Power-down mask 1: addresses 20h and 21h. Power-down mask 2: addresses 23h and 24h. See Power-Down Mode for details. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 51 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.5.4 Register 24h (address = 24h) [reset = 0h] , Master Page (080h) Figure 98. Register 24h A7-A0 in Hex 7 6 PDN BUFFER CHCD R/W-0h 5 4 PDN BUFFER CHAB R/W-0h 3 0 W-0h 2 0 R/W-0h 1 0 R/W-0h 0 0 R/W-0h LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 23. Register 24h Field Descriptions Bit Field Type Reset Description 7-6 PDN BUFFER CHCD R/W 0h 5-4 PDN BUFFER CHAB R/W 0h 3 0 W 0h There are two power-down masks that are controlled via the PDN mask register bit in address 55h. The power-down mask 1 or mask 2 are selected via register address 26h, bit 5. Power-down mask 1: addresses 20h and 21h. Power-down mask 2: addresses 23h and 24h. See Power-Down Mode for details. 2-0 0 W 0h Must write 0. 7.6.3.5.5 Register 26h (address = 26h), Master Page (080h) Figure 99. Register 26h A7-A0 in Hex 7 GLOBAL PDN R/W-0h 6 OVERRIDE PDN PIN R/W-0h 5 PDN MASK SEL R/W-0h 4 0 3 0 2 0 1 0 0 0 R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h LEGEND: R/W = Read/Write; -n = value after reset Table 24. Register 26h Field Descriptions Bit Type Reset Description 7 GLOBAL PDN R/W 0h Bit 6 (OVERRIDE PDN PIN) must be set before this bit can be programmed. 0 = Normal operation 1 = Global power-down via the SPI 6 OVERRIDE PDN PIN R/W 0h This bit ignores the power-down pin control. 0 = Normal operation 1 = Ignores inputs on the power-down pin 5 PDN MASK SEL R/W 0h This bit selects power-down mask 1 or mask 2. 0 = Power-down mask 1 1 = Power-down mask 2 0 R/W 0h Must write 0 4-0 52 Field Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.5.6 Register 3Ah (address = 3Ah) [reset = 0h] , Master Page (80h) Figure 100. Register 3Ah A7-A0 in Hex 7 6 5 3Ah 0 BUFFER CURR INCREASE 0 4 MASTER PAGE (80h) 0 3 2 1 0 0 0 0 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 25. Register 3Ah Field Descriptions Bit 7, [5-0] 6 Name Type Reset Description 0 W 0h Must write 0 BUFFER CURR INCREASE R/W 0h 0 = normal operation 1 = Increases AVDD3V current by 30 mA., improves HD3, helpful for second Nyquist application. Ensure that regiset bit INPUT BUF CUR EN is also set to 1. 7.6.3.5.7 Register 39h (address = 39h) [reset = 0h] , Master Page (80h) Figure 101. Register 39h A7-A0 in Hex 7 39h 6 5 ALWAYS WRITE 1 0 4 MASTER PAGE (80h) 0 3 2 1 0 0 0 0 0 3 2 1 0 0 0 0 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 26. Register 39h Field Descriptions Bit Name Type Reset Description [7:5] ALWAYS WRITE 1 R/W 0h Always set these bits to 11. [5-0] 0 W 0h Must write 0 7.6.3.5.8 Register 53h (address = 53h) [reset = 0h] , Master Page (80h) Figure 102. Register 53h Register A7-A0 in Hex 7 6 5 53h CLK DIV MASK SYSREF 0 4 MASTER PAGE (80h) 0 LEGEND: R/W = Read/Write; -n = value after reset Table 27. Register 53h Field Descriptions Bit Name Type Reset Description 7 CLK DIV R/W 0 Configures input clock divider 0 = Divide by 4 1= Divide by 2 (must be enabled for proper operation of ADS58J63) 6 MASK SYSREF R/W 0 0 = normal operation 1 = ignores SYSREF input Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 53 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.5.9 Register 55h (address = 55h) [reset = 0h] , Master Page (80h) Figure 103. Register 55h A7-A0 in Hex 7 6 5 55h 0 0 0 4 MASTER PAGE (80h) PDN MASK 3 2 1 0 0 0 0 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 28. Register 55h Field Descriptions Bit 4 Name Type Reset Description PDN MASK R/W 0 Power down via register bit 0 = normal operation 1 = power down enabled powering down internal blocks specified in the selected power down mask 7.6.3.5.10 Register 56h (address = 56h) [reset = 0h] , Master Page (80h) Figure 104. Register 56h A7-A0 in Hex 7 6 5 56h 0 0 0 4 3 MASTER PAGE (80h) 0 INPUT BUFF CURR EN 2 1 0 0 0 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 29. Register 56h Field Descriptions Bit 3 Name Type Reset Description INPUT BUFF CURR EN R/W 0 0 = normal operation 1 = Increases AVDD3V current by 30 mA., improves HD3, helpful for second Nyquist application. Ensure that regiset bit BUFFER CURR INCREASE is also set to 1. 7.6.3.5.11 Register 59h (address = 59h) [reset = 0h] , Master Page (80h) Figure 105. Register 59h A7-A0 in Hex 7 6 39h 0 0 5 4 MASTER PAGE (80h) ALWAYS 0 WRITE 1 3 2 1 0 0 0 0 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 30. Register 59h Field Descriptions Bit 5 54 Name Type Reset Description ALWAYS WRITE 1 R/W 0h Always set these bits to 1. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.6 ADC Page (0Fh) 7.6.3.6.1 Register 5Fh (address = 5Fh) [reset = 0h] , ADC Page (0Fh) Figure 106. Register 5Fh A7-A0 in Hex 7 6 5 5Fh 4 3 ADC Page (0Fh) FOVR CHCD THRESH 2 1 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 31. Register 5Fh Field Descriptions Bit D [7:0] Name Type Reset Description FOVR CHCD THRESH R/W 0h Controls the location of FAST OVR threshold for channel C and D. Refer to Over-range Indication. 7.6.3.6.2 Register 60h (address = 60h) [reset = 0h] , ADC Page (0Fh) Figure 107. Register 60h A7-A0 in Hex 7 6 5 60Fh 0 0 0 4 ADC Page (0Fh) PULSE BIT CHC 3 2 1 0 0 0 0 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 32. Register 60h Field Descriptions Bit 4 (1) Name Type Reset Description PULSE BIT CHC R/W 0h Pulse (1) this bit to improve HD3 for 2nd Nyquist frequiencies (fIN > 250 MHz) for channel C. Before pulsing this bit, register bit HD3 NYQ2 CHCD must be set to 1. Pulsing = Set the bit to 1 and then reset to 0. 7.6.3.6.3 Register 60h (address = 61h) [reset = 0h], ADC Page (0Fh) Figure 108. Register 61h A7-A0 in Hex 7 6 5 61Fh 0 0 0 4 ADC Page (0Fh) HD3 NYQ2 CHCD 3 2 1 0 0 0 0 PULSE BIT CHD LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 33. Register 61h Field Descriptions Bit (1) Name Type Reset Description 4 HD3 NYQ2 CHCD R/W 0h Se this bit to improve HD3 for 2nd Nyquist frequiencies (fIN > 250 MHz) for channel C and D. Once this bit is set, it is required to pulse the PULSE BIT CHx register bits to see the improvement in corresponding channels. 0 PULSE BIT CHD R/W 0h Pulse (1) this bit to improve HD3 for 2nd Nyquist frequiencies (fIN > 250 MHz) for channel D. Before pulsing this bit, register bit HD3 NYQ2 CHCD must be set to 1. Pulsing = Set the bit to 1 and then reset to 0. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 55 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.6.4 Register 6Ch (address = 6Ch) [reset = 0h], ADC Page (0Fh) Figure 109. Register 6Ch A7-A0 in Hex 7 6 5 6Ch 0 0 0 4 ADC Page (0Fh) PULSE BIT CHA 3 2 1 0 0 0 0 0 LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 34. Register 6Ch Field Descriptions Bit 4 (1) Name Type Reset Description PULSE BIT CHA R/W 0h Pulse (1) this bit to improve HD3 for 2nd Nyquist frequiencies (fIN > 250 MHz) for channel A. Before pulsing this bit, register bit HD3 NYQ2 CHCAB must be set to 1. Pulsing = Set the bit to 1 and then reset to 0. 7.6.3.6.5 Register 6Dh (address = 6Dh) [reset = 0h], ADC Page (0Fh) Figure 110. Register 6Dh A7-A0 in Hex 7 6 5 6Dh 0 0 0 4 ADC Page (0Fh) HD3 NYQ2 CHAB 3 2 1 0 0 0 0 PULSE BIT CHB LEGEND: R/W = Read/Write; W = Write only; -n = value after reset Table 35. Register 6Dh Field Descriptions Bit (1) 56 Name Type Reset Description 4 HD3 NYQ2 CHAB R/W 0h Se this bit to improve HD3 for 2nd Nyquist frequiencies (fIN > 250 MHz) for channel A and B. Once this bit is set, it is required to pulse the PULSE BIT CHx register bits to see the improvement in corresponding channels. 0 PULSE BIT CHB R/W 0h Pulse (1) this bit to improve HD3 for 2nd Nyquist frequiencies (fIN > 250 MHz) for channel B. Before pulsing this bit, register bit HD3 NYQ2 CHAB must be set to 1. Pulsing = Set the bit to 1 and then reset to 0. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.6.6 Register 74h(address = 74h) [reset = 0h], ADC Page (0Fh) Figure 111. Register 74h A7-A0 in Hex D7 74 D6 D5 D4 ADC Page (0Fh) TEST PATTERN ON CHANNEL D3 D2 D1 D0 0 0 0 0 LEGEND: R/W = Read/Write; -n = value after reset Table 36. Register 74h Field Descriptions Bit D7-D4 Field Type TEST PATTERN ON CHANNEL R/W Reset Description 0000 Test pattern output on channel A and B 0000 Normal Operation using ADC output data 0001 Outputs all 0s 0010 Outputs all 1s 0011 Outputs toggle pattern: Output data are an alternating sequence of 101010101010 and 010101010101 0100 Output digital ramp: output data increments by one LSB every clock cycle from code 0 to 16384 0110 Single pattern: output data is custom pattern 1 (75h and 76h) 0111 Double pattern: output data alternates between custom patter 1 and custom pattern 2 1000 Deskew pattern: output data is 2AAAh 1001 SYNC pattern: output data is 3FFFh See ADC Test Pattern for more details. 7.6.3.6.7 Register 75h/76h/77h/78h (address = 75h/76h/77h/78h) [reset = 0h], ADC Page (0Fh) Figure 112. Register 75h/76h/77h/78h A7-A0 in Hex D7 D6 D5 D4 D3 ADC Page (0Fh) CUSTOM PATTERN 1[13:6] CUSTOM PATTERN 1[ 5:0] CUSTOM PATTERN 2[13:6] CUSTOM PATTERN 2[ 5:0] 75 76 77 78 D2 D1 D0 0 0 0 0 LEGEND: R/78W = Read/Write; -n = value after reset Table 37. Register 75h/76h/77h/78h Field Descriptions Bit Name Type Reset Description 7-0 CUSTOM PATTERN R/W 0 Address 75/76/77/78 Sets the custom pattern (13:6, 5:0) for all channels. See ADC Test Pattern for more details. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 57 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.7 Interleaving Engine Page (6100h) 7.6.3.7.1 Register 18h (address = 18h) [reset = 0h], Interleaving Engine Page (6100h) Figure 113. Register 18h A7-A0 in hex D7 D6 18 0 0 D5 D4 D3 INTERLEAVING ENGINE PAGE (6100h) 0 0 0 D2 D1 0 D0 IL BYPASS LEGEND: R/W = Read/Write; -n = value after reset Table 38. Register 18h Field Descriptions Bit D1-D0 Name Type Reset Description IL BYPASS R/W 00 Allows bypassing of the interleaving correction. To be used when ADC test patterns are enabled. 00 = interleaving correction enabled 11= interleaving correction bypassed 7.6.3.7.2 Register 68h (address = 68h) [reset = 0h], Interleaving Engine Page (6100h) Figure 114. Register 68h A7-A0 in hex D7 D6 68 0 0 D5 D4 D3 INTERLEAVING ENGINE PAGE (6100h) 0 0 0 D2 D1 DC CORR DIS D0 0 LEGEND: R/W = Read/Write; -n = value after reset Table 39. Register 68h Field Descriptions 58 Bit Name Type Reset Description D2 DC CORR DIS R/W 0 Enables DC offset correction loop. 00 = DC offset correction enabled 11 = DC offset correction disabled Others = Do not use Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.8 Decimation Filter Page (6141h) Registers 7.6.3.8.1 Register 0h (address = 0h) [reset = 0h] Figure 115. Register 0h A7-A0 in hex D7 0 D6 D5 D4 DECIMATION FILTER PAGE (6141h) CHB/C FINE MIX D3 D2 D1 D0 DDC MODE LEGEND: R/W = Read/Write; -n = value after reset Table 40. 0h Field Descriptions Bit Field D7-D4 CHB/C FINE MIX Type R/W Reset Description 0000 Selects fine mixing frequency for N × fS/16 mixer where N is a 2's complement number varynig from -8 to 7. 0000 = N is 0 0001 = N is 1 0010 = N is 2 ... 0111 = N is 7 1000 = N is -8 ... 1111 = N is -1 Selects the DDC Mode for all channels D3-D0 DDC MODE R/W 0h SETTING MODE 000 0 fS/4 mixing with decimation by 2, complex output 001 – N/A 010 2 Decimation by 2, high or low pass filter, real output 011 – N/A 100 4 Decimation by 2, N × fS/16 mixer, real output 101 5 Decimation by 2, N × fS/16 mixer, complex output 6 Decimation by 4, N × fS/16 mixer, complex output. Ensure that register bits DDC MODE 6 EN [3:1 ] are also set to '111'. 110 DESCRIPTION 111 7 Decimation by 2, N × fS/16 mixer, insert 0, real output 1000 8 14-bit burst mode selected. Others – Do not use Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 59 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.8.2 Register 1h (address = 1h) [reset = 0h] Figure 116. Register 1h A7-A0 in hex D7 D6 1 0 0 D5 D4 D3 DECIMATION FILTER PAGE (6141h) 0 0 DDC MODE6 EN1 D2 D1 D0 ALWAYS WRITE 1 CHB/C HPF EN CHB/C COARSE MIX LEGEND: R/W = Read/Write; -n = value after reset Table 41. Register 1h Field Descriptions Bit Name Type Reset 0 W 0 D3 DDC MODE6 EN1 R/W 0 Set this bit aong with register bits DDC MODE6 EN2 and DDC MODE6 EN3 for proper operation of Mode 6. 0 = Default 1 = Use for proper operation of DDC Mode 6. D2 ALWAYS WRITE 1 R/W 0 Always write this bit to 1. D1 CHB/C HPF EN R/W 0 Enables high pass filter for DDC Mode 2 for channel B and C. 0 = Low pass filter enabled 1 = High pass filter enabled D0 CHB/C COARSE MIX R/W 0 Selects fS/4 mixer phase for DDC Mode 0 for channel B and C. 0 = Mix with +fS/4 1 = Mix with –fS/4 D7-D4 Description 7.6.3.8.3 Register 2h (address = 2h) [reset = 0h] Figure 117. Register 2h A7-A0 in hex D7 D6 2 0 0 D5 D4 D3 DECIMATION FILTER PAGE (6141h) CHA/D HPF CHA/D EN COARSE MIX D2 D1 D0 CHA/D FINE MIX LEGEND: R/W = Read/Write; -n = value after reset Table 42. 2h Field Descriptions Bit Name D7-D6 Type Reset Description R/W 0 Enables high pass filter for DDC Mode 2 for channel A and D. 0 = Low pass filter enabled 1 = High pass filter enabled R/W 0 Selects fS/4 mixer phase for DDC Mode 0 for channel A and D. 0 = Mix with +fS/4 1 = Mix with –fS/4 0000 Selects fine mixing frequency for N × fS/16 mixer where N is a 2's complement number varynig from -8 to 7. 0000 = N is 0 0001 = N is 1 0010 = N is 2 ... 0111 = N is 7 1000 = N is -8 ... 1111 = N is -1 0 CHA/D HPF EN D5 CHA/D COARSE MIX D4 D3-D0 60 CHA/D FINE MIX R/W Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.9 Main Digital Page (6800h) Registers 7.6.3.9.1 Register 0h (address = 0h) [reset = 0h], Main Digital Page (6800h) Figure 118. Register 0h A7-A0 in hex D7 D6 0 0 0 D5 D4 D3 MAIN DIGITAL PAGE (6800h) 0 0 0 D2 D1 D0 0 0 IL RESET LEGEND: R/W = Read/Write; -n = value after reset Table 43. Register 0h Field Descriptions Bit D0 (1) Name Type IL RESET R/W Reset Description 0 Resets the interleaving engine. This bit is not a self-clearing bit and must be pulsed (1). Any register bit in Main Digital Page (6800h) takes effect only after this bit is pulsed. Also, note that pulsing this bit clears registers in interleaving page (6100h). 0 = normal operation 0 → 1 → 0 = interleaving engine reset. Pulsing = Set the bit to 1 and then reset to 0. 7.6.3.9.2 Register 42h(address = 42h) [reset = 0h], Main Digital Page (6800h) Figure 119. Register 42h A7-A0 in hex D7 D6 42 0 0 D5 D4 D3 MAIN DIGITAL PAGE (6800h) 0 0 0 D2 D1 D0 NYQUIST ZONE LEGEND: R/W = Read/Write; -n = value after reset Table 44. Register 42h Field Descriptions Bit D2-D0 Name Type NYQUIST ZONE R/W Reset Description 000 Provide Nyquist zone information to IL engine. Ensure that register bit CTRL NYQUIST is set to 1. 000 = 1st Nyquist zone (input frequencies between 0 to fS/2) 001 = 2nd Nyquist zone (input frequencies between fS/2 to fS) 010 = 3rd Nyquist zone (input frequencies between fS to 3fS/2) ... 111 = 8th Nyquist zone (input frequencies between 7fS/2 to 4fS) 7.6.3.9.3 Register 4Eh (address = 4Eh) [reset = 0h], Main Digital Page (6800h) Figure 120. Register 4Eh A7-A0 in hex D7 D6 4E CTRL NYQUIST 0 D5 D4 D3 MAIN DIGITAL PAGE (6800h) 0 0 0 D2 D1 D0 0 0 0 LEGEND: R/W = Read/Write; -n = value after reset Table 45. Register 4Eh Field Descriptions Bit Name Type D7 CTRL NYQUIST R/W Reset Description 0 Enables Nyquist zone control using register bits NYQUIST ZONE. 0 = Selection disabled 1 = Selection enabled Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 61 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.9.4 Register ABh (address = ABh) [reset = 0h], Main Digital Page (6800h) Figure 121. Register ABh A7-A0 in hex D7 D6 AB 0 0 D5 D4 D3 MAIN DIGITAL PAGE (68h) 0 0 0 D2 D1 D0 0 0 OVR EN D1 D0 LEGEND: R/W = Read/Write; -n = value after reset Table 46. Register ABh Field Descriptions Bit Field Type Reset Description D0 OVR EN R/W 0 Set this bit to enable register bit OVR ON LSB. 0 = normal operation 1 = OVR ON LSB enabled 7.6.3.9.5 Register ADh (address = ADh) [reset = 0h], Main Digital Page (6800h) Figure 122. Register ADh A7-A0 in hex D7 D6 AD 0 0 D5 D4 D3 MAIN DIGITAL PAGE (68h) 0 0 D2 OVR ON LSB LEGEND: R/W = Read/Write; -n = value after reset Table 47. Register ADh Field Descriptions Bit Field D0 Type OVR EN R/W Reset Description 0 Set this bit to bring OVR on two LSBs of 16-bit output. Ensure that register bit OVR EN is set to 1 0000 = Bits D0 and D1 of 16-bit data are noise bits 0011 = OVR comes on bit D0 of 16-bit data 1100 = OVR comes on bit D1 of 16-bit data 1111 = OVR comes on both D0 and D1 bits of 16-bit data 7.6.3.9.6 Register F7h (address = F7h) [reset = 0h], Main Digital Page (68h) Figure 123. Register F7h A7-A0 in hex D7 D6 F7 0 0 D5 D4 D3 MAIN DIGITAL PAGE (68h) 0 0 0 D2 D1 D0 0 0 DIG RESET LEGEND: R/W = Read/Write; -n = value after reset Table 48. Register F7h Field Descriptions 62 Bit Field Type Reset Description D0 DIG RESET R/W 0 Self clearing reset for the digital block. Does not include the interleaving correction. 0 = normal operation 1 = digital reset Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.10 JESD Digital Page (6900h) Registers 7.6.3.10.1 Register 0h (address = 0h) [reset = 0h], JESD Digital Page (6900h) Figure 124. Register 0h A7-A0 in hex D7 D6 0 CTRL K JESD MODE EN D5 D4 D3 JESD DIGITAL PAGE (6900h) DDC MODE6 TESTMODE 0 EN2 EN D2 D1 D0 LANE ALIGN FRAME ALIGN TX LINK DIS LEGEND: R/W = Read/Write; -n = value after reset Table 49. Register 0h Field Descriptions Bit Name Type Reset Description D7 CTRL K R/W 0 Enable bit for a number of frames per multi frame. 0 = Default is 5 frames per multi frame 1 = Frames per multi frame can be set in register 06h D6 JESD MODE EN R/W 0 Allows changing the JESD MODE setting in register 01h (D1-D0) 0 = Disabled 1 = Enables changing the JESD MODE setting D5 DDC MODE6 EN2 R/W 0 Set this bit aong with register bits DDC MODE6 EN1 and DDC MODE6 EN3 for proper operation of Mode 6. 0 = Default 1 = Use for proper operation of DDC Mode 6. D4 TESTMODE EN R/W 0 This bit generates the long transport layer test pattern mode, as per section 5.1.6.3 of the JESD204B specification. 0 = Test mode disabled 1 = Test mode enabled D2 LANE ALIGN R/W 0 This bit inserts the lane alignment character (K28.3) for the receiver to align to lane boundary, as per section 5.3.3.5 of the JESD204B specification. 0 = Normal operation 1 = Inserts lane alignment characters D1 FRAME ALIGN R/W 0 This bit inserts the lane alignment character (K28.7) for the receiver to align to lane boundary, as per section 5.3.3.5 of the JESD204B specification. 0 = Normal operation 1 = Inserts frame alignment characters D0 TX LINK DIS R/W 0 This bit disables sending the initial link alignment (ILA) sequence when SYNC is deasserted. 0 = Normal operation 1 = ILA disabled Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 63 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.10.2 Register 1h (address = 1h) [reset = 0h], JESD Digital Page (6900h) Figure 125. Register 1h A7-A0 in hex D7 D6 1 SYNC REG SYNC REG EN D5 D4 D3 JESD DIGITAL PAGE (6900h) SYNCB SEL 0 DDC MODE6 AB/CD EN3 D2 D1 0 D0 JESD MODE LEGEND: R/W = Read/Write; -n = value after reset Table 50. Register 1h Field Descriptions Bit Name Type Reset Description D7 SYNC REG R/W 0 SYNC Register (Bit D6 must be enabled) 0 = Normal operation 1 = ADC output data are replaced with K28.5 characters. D6 SYNC REG EN R/W 0 Enables bit for SYNC operation 0 = Normal operation 1 = ADC output data over-write enabled D5 SYNCB SEL AB/CD R/W 0 Selects which SYNCb input controls the JESD interface. Needs to be configured for chAB and chCD 0 = SYLNCbAB 1 = SYNCbCD D5 DDC MODE6 EN3 R/W 0 Set this bit aong with register bits DDC MODE6 EN1 and DDC MODE6 EN2 for proper operation of Mode 6. 0 = Default 1 = Use for proper operation of DDC Mode 6. 0 Selects number of serial JESD output lanes per ADC. Also need to set the JESD MODE EN (00h) and JESD PLL MODE register (JESD ANALOG page, register 16h) accordingly. 01 = 20x mode 10 = 40x mode 11 = 80x mode All others = Not used D1-D0 JESD MODE R/W 7.6.3.10.3 Register 2h (address = 2h) [reset = 0h], JESD Digital Page (6900h) Figure 126. Register 2h A7-A0 in hex 2 D7 D6 D5 D4 D3 JESD DIGITAL PAGE (6900h) LINK LAYER TESTMODE LINK LAYER LMFC MASK RPAT RESET D2 D1 D0 0 0 0 LEGEND: R/W = Read/Write; -n = value after reset Table 51. Register 2h Field Descriptions Bit Name Reset Description LINK LAYER TESTMODE R/W 000 These bits generate a pattern according to clause 5.3.3.8.2 of the JESD204B document. 000 = Normal ADC data 001 = D21.5 (high-frequency jitter pattern) 010 = K28.5 (mixed-frequency jitter pattern) 011 = Repeat initial lane alignment (generates a K28.5 character and continuously repeats lane alignment sequences) 100 = 12 octet RPAT jitter pattern D4 LINK LAYER RPAT R/W 0 This bit changes the running disparity in the modified RPAT pattern test mode (only when the link layer test mode = 100). 0 = Normal operation 1 = Changes disparity D3 LMFC MASK RESET R/W 0 0 = Default 1 = Resets LMFC mask D7-D5 64 Type Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.10.4 Register 3h (address = 3h) [reset = 0h], JESD Digital Page (6900h) Figure 127. Register 3h A7-A0 in hex D7 3 FORCE LMFC COUNT D6 D5 D4 JESD DIGITAL PAGE (69h) LMFC COUNT INIT D3 D2 D1 D0 RELEASE ILANE SEQ LEGEND: R/W = Read/Write; -n = value after reset Table 52. 3h Field Descriptions Bit Name Type Reset Description D7 FORCE LMFC COUNT R/W 0 Force LMFC count. 0 = Normal operation 1 = Enables using a different starting value for the LMFC counter 00000 SYSREF coming to the digital block will reset the LMFC count to 0 and K28.5 will stop coming when the LMFC count reaches 31. The initial value to which LMFC count resets to can be set using LMFC COUNT INIT. This way the Rx can get synchronized early since it will get the LANE ALIGNMENT SEQUENCE early. Register bit FORCE LMFC COUNT must be enabled. 00 Delays the generation of lane alignment sequence by 0, 1, 2, or 3 multi frames after code group synchronization. 00 = 0 01 = 1 10 = 2 11 = 3 D6-D2 D1-D0 LMFC COUNT INIT R/W RELEASE ILANE SEQ R/W 7.6.3.10.5 Register 5h (address = 5h) [reset = 0h], JESD Digital Page (6900h) Figure 128. Register 5h A7-A0 in hex D7 D6 5h SCRAMBLE EN 0 D5 D4 JESD DIGITAL PAGE (69h) 0 0 D3 D2 D1 D0 0 0 0 0 LEGEND: R/W = Read/Write; -n = value after reset Table 53. 5h Field Descriptions Bit Name Type D7 SCRAMBLE EN R/W Reset Description Scramble enable bit in the JESD204B interface. 0 = Scrambling disabled 1 = Scrambling enabled Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 65 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.10.6 Register 6h (address = 6h) [reset = 0h], JESD Digital Page (6900h) Figure 129. Register 6h A7-A0 in hex D7 D6 6 0 0 D5 D4 JESD DIGITAL PAGE (69h) 0 D3 D2 D1 D0 FRAMES PER MULTI FRAME (K) LEGEND: R/W = Read/Write; -n = value after reset Table 54. 6h Field Descriptions Bit Name Type Reset Description FRAMES PER MULTI FRAME (K) R/W 00000 set the number of multi frames. Actual K is the value in hex + 1 (that is, 0Fh is K = 16). D7-D5 D4-D0 7.6.3.10.7 Register 17h (address = 17h) [reset = 0h], JESD Digital Page (6900h) Figure 130. Register 17h A7-A0 in hex 17 D7 D6 HIRES FLAG ON LSB D5 D4 JESD DIGITAL PAGE (69h) 0 TRIG SET AB/CD D3 D2 D1 D0 AUTO TRIG EN 0 RATIO INVALID 0 LEGEND: R/W = Read/Write; -n = value after reset Table 55. 17h Field Descriptions Bit Name D7 - D6 HIRES FLAG ON LSB Type Reset Description 0 Applicable only in 14-bit Burst mode. Program two LSBs of 16-bit data as flag for 14-bit high resolution samples. Flag is '1' when the sample belongs to 14bit resolution. 00 = LSB Bits D0 and D1 of 16-bit data noise bits. 01 = Bit D0 carries high-resolution flag. 10 = Bit D1 carries high-resolution flag. 11 = Both bits D0 and D1 carry high-resolution flag. R/W 0 Determines if triggerAB or triggerCD pin is used for burst mode. Needs to be configured individually for chAB and chCD with paging. 0 = uses TRIGGERAB pin 1 = uses TRIGGERCD pin R/W 0 Enables automatic trigger in burst mode (ignores TRIGGERAB/CD inputs) 0 = auto trigger disabled 1= auto trigger enabled R/W 0 Alarm flag when duty cycle ratio between high and low resolution counter is set incorrectly. R/W TRIG SET AB/CD D4 D3 D1 66 AUTO TRIG EN RATIO INVALID Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.10.8 Register 19h/1Ah/1Bh/1Ch (address = 19h/1Ah/1Bh/1Ch) [reset = 0h], JESD Digital Page (6900h) Figure 131. Register 19h/1Ah/1Bh/1Ch A7-A0 in hex D7 D6 19 1A 1B 1C 0 0 D5 D4 D3 JESD DIGITAL PAGE (69h) 0 0 LC[23:16] LC[15:8] LC[7:0] D2 D1 D0 LC[27:24] Table 56. 19h/1Ah/1Bh/1Ch Field Descriptions Bit Name Type Reset Description R/W 0 Sets the low resolution counter value. While programming LC[27:0], first program LC[7:0], then LC[15:8], then LC[23:16], and then LC[27:24] in the same order. LC [xx:xx] D7-D0 7.6.3.10.8.1 Register 1Dh/1Eh/1Fh/20h (address = 1Dh/1Eh/1Fh/20h) [reset = 0h], JESD Digital Page (6900h) Figure 132. Register 1Dh/1Eh/1Fh/20h A7-A0 in hex D7 D6 1D 1E 1F 20 0 0 D5 D4 D3 JESD DIGITAL PAGE (69h) 0 0 HC[23:16] HC[15:8] HC[7:0] D2 D1 D0 HC[27:24] Table 57. 1Dh/1Eh/1Fh/20h Field Descriptions Bit Name Type Reset Description R/W 0 Sets the high resolution counter value. While programming HC[27:0], first program HC[7:0], then HC[15:8], then HC[23:16], and then HC[27:24] in the same order. HC [xx:xx] D7-D0 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 67 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.10.8.2 Register 21h (address = 21h) [reset = 0h], JESD Digital Page (6900h) Figure 133. Register 21h A7-A0 in hex 21 D7 D6 D5 OUTPUT CHA MUX SEL D4 D3 D2 JESD DIGITAL PAGE (69h) OUTPUT CHB MUX SEL OUTPUT CHC MUX SEL D1 D0 OUTPUT CHD MUX SEL LEGEND: R/W = Read/Write; -n = value after reset Table 58. 21h Field Descriptions Bit Name Reset Description D7-D6 OUTPUT CHA MUX SEL R/W 00 Serdes lane swap with chB 00 = ChA is output on lane DA 10 = ChA is output on lane DB 01/11 = Do not use D5-D4 OUTPUT CHB MUX SEL R/W 00 Serdes lane swap with chA 00 = ChB is output on lane DB 10 = ChB is output on lane DA 01/11 = Do not use 00 Serdes lane swap with chD 00 = ChC is output on lane DC 10 = ChC is output on lane DD 01/11 = Do not use 00 Serdes lane swap with chC 00 = ChD is output on lane DD 10 = ChD is output on lane DC 01/11 = Do not use D3-D2 D1-D0 68 Type OUTPUT CHC MUX SEL OUTPUT CHD MUX SEL R/W R/W Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 7.6.3.10.8.3 Register 22h (address = 22h) [reset = 0h], JESD Digital Page (6900h) Figure 134. Register 22h A7-A0 in hex D7 D6 22 0 0 D5 D4 D3 JESD DIGITAL PAGE (6900h) 0 0 OUT CHA INV D2 D1 D0 OUT CHB INV OUT CHC INV OUT CHD INV D1 D0 0 0 0 0 LEGEND: R/W = Read/Write; -n = value after reset Table 59. 22h Field Descriptions Bit Name Type Reset D7-D4 Description 0 D3 OUT CHA INV R/W 0 Polarity inversion of JESD output of chA 0 = normal operation 1 = output polarity inverted D2 OUT CHB INV R/W 0 Polarity inversion of JESD output of chB 0 = normal operation 1 = output polarity inverted D1 OUT CHC INV R/W 0 Polarity inversion of JESD output of chC 0 = normal operation 1 = output polarity inverted D0 OUT CHD INV R/W 0 Polarity inversion of JESD output of chD 0 = normal operation 1 = output polarity inverted 7.6.3.11 JESD Analog Page (6A00h) Register 7.6.3.11.1 Register 12h/13h (address 12h/13h) [reset = 0h], JESD Analog Page (6Ah) Figure 135. Register 12h/13h A7-A0 in hex D7 D6 D5 D4 JESD ANALOG PAGE (6A00h) SEL EMP LANE DA/DD SEL EMP LANE DB/DC 12 13 D3 D2 LEGEND: R/W = Read/Write; -n = value after reset Table 60. 12h/13h Field Descriptions Bit D7-D2 Name SEL EMP LANE DA/DD SEL EMP LANE DB/DC Type R/W Reset Description 000000 Selects the amount of de-emphasis for the JESD output transmitter. The de-emphasis value in dB is measured as the ratio between the peak value after the signal transition to the settled value of the voltage in one bit period. 0 = 0 dB 1 = –1 dB 3 = –2 dB 7 = –4.1 dB 15 = –6.2 dB 31 = –8.2 dB 63 = –11.5 dB Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 69 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 7.6.3.11.2 16h (address = 16h) [reset = 0h], JESD Analog Page (6A00h) Figure 136. Register 16h A7-A0 in hex D7 D6 16 0 0 D5 D4 D3 JESD ANALOG PAGE (6A00h) 0 0 0 D2 0 D1 D0 JESD PLL MODE LEGEND: R/W = Read/Write; -n = value after reset Table 61. 16h Field Descriptions Bit Name Type Reset Description JESD PLL MODE R/W 0 Selects the JESD PLL multiplication factor 0 = 20x mode 1 = 40x mode D7-D1 D0 7.6.3.11.3 Register 1Bh (address = 1Bh) [reset = 0h], JESD Analog Page (6Ah) Figure 137. Register 1Bh A7-A0 in hex D7 1B D6 D5 D4 JESD ANALOG PAGE (6Ah) JESD SWING 0 D3 D2 D1 D0 0 0 0 0 LEGEND: R/W = Read/Write; -n = value after reset Table 62. 1Bh Field Descriptions Bit 70 Name D7-D5 JESD SWING D4-D3 0 Type R/W Reset Description 000 Programs SERDES output swing 0 = 860 mVPP 1 = 810 mVPP 2 = 770 mVPP 3 = 745 mVPP 4 = 960 mVPP 5 = 930 mVPP 6 = 905 mVPP 7 = 880 mVPP Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information 8.1.1 Start-Up Sequence The following steps are recommended as the power up sequence with the ADS58J63 in 2x complex decimation mode (DDC Mode 0) with LMFS = 4841 (shown in Table 63). Table 63. Recommended Power-Up Sequence REGISTER ADDRESS REGISTE R DATA COMMENT Supply all supply voltages. There is no required power supply sequence for the 1.15V supply, 1.9-V supply and 3-V supply, and these may be supplied in any order. — — — Pulse a hardware reset (low to high to low) on pin 48. — — — 00h 4004h 4003h 4002h 4001h 60F7h 81h 68h 00h 00h 00h 01h 11h 53h 80h 80h Select master page Set clock divider to /2 STEP DESCRIPTION 1 2 Alternatively it can be reset with: Analog reset and Digital reset 3 Set input clock divider 4 Reset interleaving correction engine. Register access default into page 68h 6000h 6000h 01h 00h Channel AB (and channel CD since device is in broadcast mode) 5 Default registers for JESD analog page 4003h 4004h 6016h 00h 6Ah 02h Select JESD analog page m PLL mode 40x for Channel AB and CD 6 Default registers for JESD digital page 4003h 4004h 6000h 6006h 00h 69h 80h 0Fh Select JESD digital page m Set CTRL K for channel AB and CD Set K to 16 7 Enable single SYNCb input (SYNCAB) 4005h 7001h 01h 22h Disable broadcast mode Use SYNCAB for channel C/D 8 Pulse SYNCb (pin 55/56) from low to high to transmit data from k28.5 sync mode — — — Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 71 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 8.1.2 Hardware Reset Power Supplies t1 RESET t2 t3 SEN Figure 138. Hardware Reset Timing Diagram Table 64. Timing Requirements for Figure 138 MIN t1 Power-on delay Delay from power up to active high RESET pulse t2 Reset pulse duration Active high RESET pulse duration t3 Register write delay Delay from RESET disable to SEN active TYP MAX UNIT 1 ms 10 ns 100 ns 8.1.3 SNR and Clock Jitter The signal to noise ratio of the ADC is limited by three different factors: the quantization noise is typically not noticeable in pipeline converters and is 84 dB for a 14-bit ADC. The thermal noise limits the SNR at low input frequencies while the clock jitter sets the SNR for higher input frequencies. (2) The SNR limitation resulting from sample clock jitter can be calculated following: (3) The total clock jitter (TJitter) has two components – the internal aperture jitter (120 fs for ADS58J63) which is set by the noise of the clock input buffer and the external clock jitter. It can be calculated as following: (4) External clock jitter can be minimized by using high-quality clock sources and jitter cleaners as well as band-pass filters at the clock input while a faster clock slew rate also improves the ADC aperture jitter. The ADS58J63 has a thermal noise of approximately 72 dBFS and an internal aperture jitter of 120 fs. 72 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 8.1.4 ADC Test Pattern The ADS58J63 provides several different options to output test patterns instead of the actual output data of the ADC in order to simplify bring up of the JESD204B digital interface link. The output data path is shown in Figure 139 Transport Layer ADC Section DDC ADC Interleaving Correction Burst Mode Data Mapping Frame Construction Link Layer Scrambler 1+x14+x15 JESD204B Long Transport Layer Test Pattern ADC Test Pattern PHY Layer 8b/10b encoding Serializer JESD204B Link Layer Test Pattern Figure 139. ADC Test Pattern 8.1.4.1 ADC Section The ADC test pattern replaces the actual output data of the ADC. The following test patterns are available in register 74h. In order to get the test pattern output propoerly, the interleaving correction needs to be disabled (6100h, address 18h) and burst mode enabled (DDC disabled). Burst mode only supports LMFS = 4421 (DDC Modes have different configurations) and test pattern switches between 9-bit (low resolution) and 14-bit (high resolution) output. See Table 65 Table 65. ADC Test Pattern Settings Bit D7-D4 Name TEST PATTERN Default Description 0000 Test pattern output on channel A and B 0000 Normal Operation using ADC output data 0001 Outputs all 0s 0010 Outputs all 1s 0011 Outputs toggle pattern: Output data are an alternating sequence of 101010101010 and 010101010101 0100 Output digital ramp: output data increments by one LSB every clock cycle from code 0 to 16384 0110 Single pattern: output data is custom pattern 1 (75h and 76h) 0111 Double pattern: output data alternates between custom patter 1 and custom pattern 2 1000 Deskew pattern: output data is 2AAAh 1001 SYNC pattern: output data is 3FFFh 8.1.4.2 Transport Layer Pattern The Transport Layer maps the ADC output data into 8bit octets and constructs the JESD204B frames using the LMFS parameters. Tail bits or ‘0’s are added when needed. Alternatively the JESD204B long transport layer test pattern can be substituted as shown in Table 66 . Table 66. Transport Layer Test-mode Bit D4 Name TESTMODE EN Default Description 0 Generates long transport layer test pattern mode according to clause 5.1.6.3 of JESD204B specification 0 = test mode disabled 1 = test mode enabled Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 73 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 8.1.4.3 Link Layer Pattern The Link Layer contains the scrambler and the 8b/10b encoding of any data passed on from the Transport Layer. Additionally it also handles the initial lane alignment sequence which can be manually restarted. The Link Layer test patterns are intended for testing the quality of the link (jitter testing etec). The test patterns do not pass through the 8b/10b encoder and contain the options shown in Table 67. Table 67. Link Layer Test-mode Bit Name D7-D5 LINK LAYER TESTMODE Default Description 000 Generates pattern according to clause 5.3.3.8.2 of the JESD204B document 000 normal ADC data 001 D21.5 (high frequency jitter pattern) 010 K28.5 (mixed frequency jitter pattern) 011 Repeat initial lane alignment (generates K28.5 character and repeat lane alignment sequences continuously) 100 12 octet RPAT jitter pattern Furthermore a 215 PRBS can be enabled by setting up a custom test pattern (AAAA) in the ADC section and running that through the 8b/10b encoder with scrambling enabled. 74 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 8.2 Typical Application The ADS58J63 is designed for wideband receiver applications demanding excellent dynamic range over a large input frequency range. A typical schematic for an AC coupled dual receiver (dual FPGA with dual SYNC) is shown below. DVDD 5 25 10 k 25 0.1 uF Driver 0.1 uF 3.3 pF GND 25 SPI Master 25 5 GND 0.1 uF 25 5 GND INCP AVDD AVDD 0.1 uF GND AGND NC NC GND 0.1 uF AVDD3V AVDD3V AVDD AVDD 0.1 uF GND 10 nF AGND CLKINP 100 CLKINM AGND GND 0.1 uF AVDD Low Jitter Clock Generator AVDD AVDD3V AVDD3V 0.1 uF GND AGND SYSREFP 100 SYSREFM AVDD AVDD 5 INBP 10 8 7 6 5 3 2 4 TRDYCD IOVDD SDIN SCLK SEN DVDD 9 TRIGCD 11 AVDD SDOUT 12 DGND 13 AVDD INDP AVDD INDM 14 100 20 71 21 70 22 69 23 68 24 67 25 66 26 65 27 64 ADS58J63 28 29 Differential 1 63 62 GND PAD (backside) 30 61 31 60 32 59 33 58 34 57 35 56 36 55 SYNCbCDP 50 SYNCbCDM 50 Vterm=1.2 V FPGA IOVDD IOVDD 10 nF GND DDP 10 nF DDM DGND 10 nF GND DCP DCM IOVDD IOVDD 0.1 uF GND DGND DBM DBP DGND 10 nF GND DAM DAP IOVDD IOVDD 10 nF 10 nF GND SYNCbABM 50 SYNCbABP 50 FPGA Vterm=1.2 V 25 AVDD3V AVDD GND 53 54 100 TRDYAB 52 TRIGAB 51 DGND 50 IOVDD 49 PDN 48 SCAN_EN 47 RESET 46 DVDD 45 AVDD 44 AVDD 43 AVDD 42 INAP 41 INAM 40 AVDD 3.3 pF 25 5 39 AVDD3V GND 38 AVDD3V 37 0.1 uF 25 15 DVDD 72 INBM Driver 0.1 uF 16 0.1 uF AVDD 19 AVDD 25 17 AVDD3V 3.3 pF 18 25 AVDD 25 0.1 uF INCM 25 0.1 uF IOVDD GND 0.1 uF AVDD3V AVDD AVDD3V 5 Driver 0.1 uF AVDD3V GND Differential DVDD AVDD AVDD3V 0.1 uF GND 0.1 uF GND 0.1 uF IOVDD GND 5 25 Driver 25 0.1 uF 0.1 uF 25 GND 3.3 pF 5 25 GND = AGND + DGND connected in Layout NOTE: GND = AGND and DGND connected in the PCB layout. Figure 140. Application Diagram ADS58J63 8.2.1 Design Requirements By using the simple drive circuit of Figure 140 (when AMP drives ADC) or Figure 51 (when transformers drive ADC), uniform performance can be obtained over a wide frequency range. The buffers present at the analog inputs of the device help isolate the external drive source from the switching currents of the sampling circuit. 8.2.2 Detailed Design Procedure For optimum performance, the analog inputs must be driven differentially. This architecture improves the common-mode noise immunity and even-order harmonic rejection. A small resistor (5 Ω to 10 Ω) in series with each input pin is recommended to damp out ringing caused by package parasitics, as shown in Figure 140. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 75 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com Typical Application (continued) 8.2.3 Application Curves 0 0 -20 -20 Amplitude (dBFS) Amplitude (dBFS) Figure 141 and Figure 142 show the typical performance at 190 MHz and 230 MHz, respectively. -40 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 50 100 150 Input Frequency (MHz) 200 250 0 D003 FIN = 190 MHz , AIN = –1 dBFS SNR = 69.4 dBFS, SFDR = 88 dBc, SFDR = 96 dBc (Non23) 50 100 150 Input Frequency (MHz) 200 250 D004 FIN = 230 MHz , AIN = –1 dBFS SNR = 69.4 dBFS, SFDR = 85 dBc, SFDR = 96 dBc (Non23) Figure 141. FFT for 190-MHz Input Signal Figure 142. FFT for 230-MHz Input Signal 9 Power Supply Recommendations The device requires a 1.9-V nominal supply for DVDD, a 1.9-V nominal supply for AVDD, and a 3-V nominal supply for AVDD3V. There is no specific sequence for power-supply requirements during device power-up. AVDD, DVDD, and AVDD3V can power-up in any order. 76 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 ADS58J63 www.ti.com SBAS717A – JUNE 2015 – REVISED JUNE 2015 10 Layout 10.1 Layout Guidelines The device evaluation module (EVM) layout can be used as a reference layout to obtain the best performance. A layout diagram of the EVM top layer is provided in Figure 143. Complete layout of EVM is available at ADS58J63's EVM folder. Some important points to remember during board layout are: • Analog inputs are located on opposite sides of the device pinout to ensure minimum crosstalk on the package level. To minimize crosstalk onboard, the analog inputs must exit the pinout in opposite directions, as shown in the reference layout of Figure 143 as much as possible. • In the device pinout, the sampling clock is located on a side perpendicular to the analog inputs in order to minimize coupling between them. This configuration is also maintained on the reference layout of Figure 143 as much as possible. • Keep digital outputs away from the analog inputs. When these digital outputs exit the pinout, the digital output traces must not be kept parallel to the analog input traces because this configuration can result in coupling from the digital outputs to the analog inputs and degrade performance. All digital output traces to the receiver [such as a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC)] must be matched in length to avoid skew among outputs. • At each power-supply pin (AVDD, DVDD, or AVDDD3V), keep a 0.1-µF decoupling capacitor close to the device. A separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF capacitors can be kept close to the supply source. 10.2 Layout Example Figure 143. ADS58J63 EVM Layout Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 77 ADS58J63 SBAS717A – JUNE 2015 – REVISED JUNE 2015 www.ti.com 11 Device and Documentation Support 11.1 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.2 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.3 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 78 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: ADS58J63 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADS58J63IRMPR ACTIVE VQFN RMP 72 1500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ58J63 ADS58J63IRMPT ACTIVE VQFN RMP 72 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 AZ58J63 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE OUTLINE RMP0072A VQFN - 0.9 mm max height SCALE 1.700 VQFN 10.1 9.9 B A PIN 1 ID 10.1 9.9 0.9 MAX 0.05 0.00 C 0.08 C (0.2) SEATING PLANE 4X (45 X0.42) 19 36 18 4X 8.5 37 SYMM 8.5 0.1 PIN 1 ID (R0.2) 1 68X 0.5 54 55 72 SYMM 72X 0.5 0.3 72X 0.30 0.18 0.1 0.05 C B C A 4221047/B 02/2014 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT RMP0072A VQFN - 0.9 mm max height VQFN ( 8.5) SYMM 72X (0.6) SEE DETAILS 55 72 1 54 72X (0.24) (0.25) TYP (9.8) SYMM (1.315) TYP 68X (0.5) ( 0.2) TYP VIA 37 18 19 36 (1.315) TYP (9.8) LAND PATTERN EXAMPLE SCALE:8X 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK OPENING METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) METAL SOLDER MASK DEFINED SOLDER MASK DETAILS 4221047/B 02/2014 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB application report in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com EXAMPLE STENCIL DESIGN RMP0072A VQFN - 0.9 mm max height VQFN (9.8) 72X (0.6) (1.315) TYP 72 55 1 54 72X (0.24) (1.315) TYP (0.25) TYP SYMM (1.315) TYP (9.8) 68X (0.5) METAL TYP 37 18 ( 0.2) TYP VIA 19 36 36X ( 1.115) (1.315) TYP SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 62% PRINTED SOLDER COVERAGE BY AREA SCALE:8X 4221047/B 02/2014 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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