IDT F2970NCGK 75 ohm sp2t rf switch 5 mhz to 3000 mhz Datasheet

75 Ohm SP2T RF Switch
5 MHz to 3000 MHz
Description
F2970
Datasheet
Features
The F2970 is a high reliability, low insertion loss, 75 Ω absorptive
SP2T RF switch designed for a multitude of cable systems and
other RF applications. This device covers a broad frequency
range from 5 MHz to 3000 MHz. In addition to providing low
insertion loss, the F2970 also delivers excellent linearity and
isolation performance while providing a 75 Ω termination for the
unselected port.
Low Insertion Loss:
0.32 dB @ 1200 MHz
High Isolation:
70 dB @ 1200 MHz (RF1/RF2 to RFC)
Excellent Linearity:
IIP3 of 63 dBm
Selectable Logic Control
Operating Temperature: -40 °C to +105 °C
4 mm x 4 mm 20-pin LQFN package
The F2970 uses a single positive supply voltage and supports
3.3 V logic.
Competitive Advantage
Block Diagram
The F2970 provides broadband RF performance to support the
CATV market along with high power handling, and high isolation.
Figure 1. Block Diagram
RFC
Low Insertion Loss
High Isolation
Excellent Linearity
Extended Temperature: -40 °C to +105 °C
Typical Applications
RF1
CATV/Broadband Applications
Headend
Fiber/HFC Distribution Nodes
Distribution Amplifiers
Switch Matrix
DTV Tuner Input Select
DVR/PVR/Set-top box
CATV Test Equipment
© 2016 Integrated Device Technology, Inc.
RF2
75Ω
75Ω
C1
1
C2
November 11, 2016
F2970 Datasheet
Pin Assignments
Figure 2. Pin Assignments for 4 mm x 4 mm x 0.75 mm 20-pin LQFN, NCG20 – Top View
Pin Descriptions
Table 1. Pin Descriptions
Number
Name
1, 2, 4, 5, 6,
7, 9, 10, 11,
12, 14, 15,
18, 19
GND
3
RF1
8
RFC
13
RF2
16
17
C2
C1
20
VDD
EP
Description
Ground these pins as close to the device as possible.
RF1 Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be
used.
RFC Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be
used.
RF2 Port. Matched to 75 ohms. If this pin is not 0V DC, then an external coupling capacitor must be
used.
Control pin to set switch state. See Table 8.
Control pin to set switch state. See Table 8.
Power Supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as
possible to pin.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple
ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the specified RF performance.
© 2016 Integrated Device Technology, Inc.
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November 11, 2016
F2970 Datasheet
Absolute Maximum Ratings
Stresses beyond those listed below may cause permanent damage to the device. Functional operation of the device at these or any other
conditions beyond those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
VDD to GND
VDD
-0.3
V
C1, C2 to GND
Vlogic
-0.3
RF1, RF2, RFC to GND
VRF
-0.3
4.0
Lower of
(VDD+0.3, 3.9)
+0.3
Maximum Input CW Power [a]
RF1 or RF2 as an input
(Connected to RFC)
RFC as an input
(Connected to RF1 or RF2)
RF1 or RF2 as an input
(Terminated states)
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
ElectroStatic Discharge – HBM
(JEDEC/ESDA JS-001-2012)
ElectroStatic Discharge – CDM
(JEDEC 22-C101F)
a. Levels based on: VDD = 2.7 V to 3.6 V, 5 MHz
© 2016 Integrated Device Technology, Inc.
V
V
30
PABS
30
dBm
26
Tjmax
TST
TLEAD
-65
VESDHBM
VESDCDM
≤ FRF ≤ 3000 MHz, Tc = 105 °C, ZS = ZL = 75 ohms.
3
140
150
260
2000
(Class 2)
1500
(Class C3)
°C
°C
°C
V
V
November 11, 2016
F2970 Datasheet
Recommended Operating Conditions
Table 3. Recommended Operating Conditions
Parameter
Supply Voltage
Operating Temp Range
RF Frequency Range
Symbol
VDD
TCASE
FRF
Condition
Exposed Paddle Temperature
Min
2.7
-40
5
Typ
Max
Units
3.6
+105
3000
27
27
24
21
21
21
17
17
V
°C
MHz
TC = 85°C
TC = 105°C
PRF
dBm
RF1 / RF2 Input, Terminated TC = 85°C
State
TC = 105°C
RFC Input switching between TC = 85°C
RF Continuous
RF1 and RF2
TC = 105°C
Input Power
PRFSW
dBm
RF1 or RF2 as input, switched TC = 85°C
(RF Hot Switching CW) [a]
between RFC and Term.
TC = 105°C
RF1 Port Impedance
ZRF1
Single ended
75
RF2 Port Impedance
ZRF2
Single ended
75
Ω
RFC Port Impedance
ZRFC
Single ended
75
a. Levels based on: VDD = 2.7 V to 3.6 V, 5 MHz FRF 3000 MHz, ZS = ZL = 75 ohms. See Figure 3 for power handling
derating vs RF frequency.
RF Continuous
Input CW Power
(Non-Switched) [a]
RFC connected to RF1 or RF2
≤
≤
Figure 3. Maximum RF Input Operating Power vs. RF Frequency
© 2016 Integrated Device Technology, Inc.
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November 11, 2016
F2970 Datasheet
Electrical Characteristics
Table 4. Electrical Characteristics
Typical Application Circuit: VDD = 3.0 V, TC = +25 °C, FRF = 1200 MHz, Driven Port = RF1 or RF2, Input Power = 0 dBm, ZS = ZL = 75 ohms.
PCB board trace and connector losses are de-embedded unless otherwise noted.
Parameter
Symbol
Logic Input High Threshold [c]
VIH
Logic Input Low Threshold [c]
VIL
Logic Current
VDD DC Current [c]
IIH, IIL
IDD
Condition
2.7 V
≤ VDD ≤ 3.6 V
Minimum
Typical
Maximum
Units
0.7 x VDD [a]
VDD
V
-0.3 [b]
0.3 x VDD
V
For each control pin
180
500
nA
Logic Inputs at GND or VDD
20
30
µA
5 – 250 MHz
0.25
250 – 750 MHz
0.30
750 – 1000 MHz
0.30
Insertion Loss
IL
1000 – 1200 MHz
0.32
0.57
1200 – 2000 MHz
0.32
2000 – 3000 MHz
0.35
5 – 250 MHz
79
84
250 – 750 MHz
69
74
750 – 1000 MHz
67
72
Isolation
ISORFC
(RFC to RF1 / RF2)
1000 – 1200 MHz
65
70
1200 – 2000 MHz
62
67
2000 – 3000 MHz
57
5 – 250 MHz
79
84
250 – 750 MHz
69
74
750 – 1000 MHz
66
71
Isolation
ISOR12
(RF1 to RF2)
1000 – 1200 MHz
63
68
1200 – 2000 MHz
57
62
2000 – 3000 MHz
53
5 – 250 MHz
25
250 – 750 MHz
20
750 – 1000 MHz
18
RF1, RF2, RFC Return Loss
RLIL
(Insertion Loss State)
1000 – 1200 MHz
18
1200 – 2000 MHz
18
2000 – 3000 MHz
18
a. Items in min/max columns in bold italics are Guaranteed by Test.
b. Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization.
c. Increased IDD current will result if logic low level is above ground and up to VIL max. Similarly, increased IDD current will
result if logic high level is below VDD and down to VIH min.
© 2016 Integrated Device Technology, Inc.
5
dB
dB
dB
dB
November 11, 2016
F2970 Datasheet
Electrical Characteristics
Table 5. Electrical Characteristics
Typical Application Circuit: VDD = 3.0 V, TC = +25 °C, FRF = 1200 MHz, Driven Port = RF1 or RF2, Input Power = 0 dBm, ZS = ZL = 75 ohms.
PCB board trace and connector losses are de-embedded unless otherwise noted.
Parameter
Symbol
RF1, RF2 Return Loss
(Terminated State)
RLTERM
Input 1dB Compression [c]
ICP1dB
Condition
5 – 250 MHz
250 – 750 MHz
750 – 1000 MHz
1000 – 1200 MHz
1200 – 2000 MHz
2000 – 3000 MHz
5 – 250 MHz
250 – 2000 MHz
F1 = 5 MHz
F2 = 6 MHz
Input IP2
(Insertion Loss State)
Input IP3
(Insertion Loss State)
IIP2
IIP3
CTB / CSO
Non-RF Driven Spurious [d]
Switching Time [e]
Maximum Switching Rate [f]
Maximum Video Feed-through
on RF Ports
SpurMAX
TSW
Min
Typ
29 [b]
30
27
22
20
20
20
17
31
32
103
F1 = 895 MHz
F2 = 900 MHz
129
F1 = 5 MHz
F2 = 6 MHz
63
F1 = 185 MHz
F2 = 190 MHz
63
F1 = 1790 MHz
F2 = 1795 MHz
63
dB
dBm
dBm
dBm
77 & 110 channels
POUT = 44 dBmV
-90
dBc
Out any RF port when externally
terminated into 75 Ω
-128
dBm
50% control to 90% RF
50% control to 10% RF
2.7
2.7
µs
SWRATE
VIDFT
Units
95
Pin = 13 dBm / tone F1 = 185 MHz
(F1 + F2 Frequency) F2 = 190 MHz
Pin = 13 dBm / tone
Max
25
Peak transient during switching
measured with 20 ns risetime,
0 to 3.3 V control pulse
Rise
1.0
Fall
1.5
kHz
mVpp
a. Items in min/max columns in bold italics are Guaranteed by Test.
b. Items in min/max columns that are not bold/italics are Guaranteed by Design Characterization.
c. The input 1 dB compression point is a linearity figure of merit. Refer to the Recommended Operating Conditions
section and Figure 3 for the maximum operating power levels.
d. Spurious due to on-chip negative voltage generator. Spurious fundamental = approx. 2.2 MHz.
e. FRF = 1000 MHz.
f. Minimum time required between switching of states = 1/ (Maximum Switching Rate).
© 2016 Integrated Device Technology, Inc.
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November 11, 2016
F2970 Datasheet
Thermal Characteristics
Table 6. Package Thermal Characteristics
Parameter
Junction to Ambient Thermal Resistance.
Junction to Case Thermal Resistance.
(Case is defined as the exposed paddle)
Moisture Sensitivity Rating (Per J-STD-020)
Symbol
Value
Units
θJA
53
°C/W
θJC
13.8
°C/W
MSL 1
Typical Operating Conditions (TOC)
VDD = +3.0 V
ZL = ZS = 75Ω
TCASE = 25°C
FRF = 1200 MHz
Small signal parameters measured with PIN = 0 dBm
Two tone parameters measured with PIN = 13 dBm/tone
Driven Port is RF1 or RF2
All temperatures are referenced to the exposed paddle.
Evaluation Kit traces and connector losses are de-embedded.
© 2016 Integrated Device Technology, Inc.
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November 11, 2016
F2970 Datasheet
Typical Performance Characteristics [1]
Insertion Loss vs. Frequency over
Temperature and VDD [RF1]
Figure 5.
0
0
-0.1
-0.1
-0.2
-0.2
-0.3
-0.3
Loss (dB)
Loss (dB)
Figure 4.
-0.4
-0.5
-0.6
-0.7
-0.8
2.7V -40C
3V -40C
3.6V -40C
2.7V 25C
3V 25C
3.6V 25C
2.7V 105C
3V 105C
3.6V 105C
Insertion Loss vs. Frequency over
Temperature and VDD [RF2]
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
3.6V -40C
3V 25C
3.6V 25C
2.7V 105C
3V 105C
3.6V 105C
-1
0
500
1000
1500
2000
2500
3000
0
500
Frequency (MHz)
Figure 6.
1000
1500
2000
2500
3000
Frequency (MHz)
Isolation vs. Frequency over Temp
and VDD [RF1 to RF2, RF1 Selected]
Figure 7.
-40
-40
-50
-50
-60
-60
Isolation (dB)
Isolation (dB)
3V -40C
2.7V 25C
-0.9
-1
-70
-80
-90
-100
Isolation vs. Frequency over Temp
and VDD [RF2 to RF1, RF2 Selected]
-70
-80
-90
-100
2.7V -40C
2.7V 25C
3V 105C
-110
3V -40C
3V 25C
3.6V 25C
3.6V -40C
2.7V 105C
3.6V 105C
-110
-120
2.7V -40C
3V -40C
3.6V -40C
2.7V 25C
2.7V 105C
3V 25C
3V 105C
3.6V 25C
3.6V 105C
-120
0
500
1000
1500
2000
2500
3000
0
500
Frequency (MHz)
Figure 8.
1000
1500
2000
2500
3000
Frequency (MHz)
Isolation vs. Frequency over Temp
and VDD [RF2 to RFC, RF1 Selected]
Figure 9.
-40
-40
-50
-50
-60
-60
Isolation (dB)
Isolation (dB)
2.7V -40C
-70
-80
-90
Isolation vs. Frequency over Temp
and VDD [RF1 to RFC, RF2 Selected]
-70
-80
-90
-100
-100
2.7V -40C
2.7V 25C
2.7V 105C
-110
3V -40C
3V 25C
3V 105C
3.6V -40C
3.6V 25C
3.6V 105C
2.7V -40C
2.7V 25C
2.7V 105C
-110
3V -40C
3V 25C
3V 105C
3.6V -40C
3.6V 25C
3.6V 105C
-120
-120
0
500
1000
1500
2000
2500
0
3000
© 2016 Integrated Device Technology, Inc.
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
8
November 11, 2016
F2970 Datasheet
Typical Performance Characteristics [2]
Figure 11. RF2 Return Loss vs. Frequency over
Temperature and VDD [RF2 Selected]
0
0
-10
-10
-20
-20
Return Loss (dB)
Return Loss (dB)
Figure 10. RF1 Return Loss vs. Frequency over
Temperature and VDD [RF1 Selected]
-30
-40
-50
-60
2.7V -40C
2.7V 25C
2.7V 105C
-70
3V -40C
3V 25C
3V 105C
3.6V -40C
3.6V 25C
3.6V 105C
-30
-40
-50
-60
2.7V -40C
2.7V 25C
2.7V 105C
-70
-80
500
1000
1500
2000
2500
3000
0
500
Frequency (MHz)
1000
1500
2000
2500
3000
Frequency (MHz)
Figure 12. RF1 Return Loss vs. Frequency over
Temperature and VDD [RF2 Selected]
Figure 13. RF2 Return Loss vs. Frequency over
Temperature and VDD [RF1 Selected]
0
0
-5
-5
-10
-10
-15
-15
Return Loss (dB)
Return Loss (dB)
3.6V -40C
3.6V 25C
3.6V 105C
-80
0
-20
-25
-30
-35
-40
-45
2.7V -40C
3V -40C
3.6V -40C
2.7V 25C
3V 25C
3.6V 25C
2.7V 105C
3V 105C
3.6V 105C
-20
-25
-30
-35
-40
-45
-50
2.7V -40C
3V -40C
3.6V -40C
2.7V 25C
3V 25C
3.6V 25C
2.7V 105C
3V 105C
3.6V 105C
-50
0
500
1000
1500
2000
2500
3000
0
500
Frequency (MHz)
1000
1500
2000
2500
3000
Frequency (MHz)
Figure 14. RFC Return Loss vs. Frequency over
Temperature and VDD [RF1 Selected]
Figure 15. RFC Return Loss vs. Frequency over
Temperature and VDD [RF2 Selected]
0
0
-5
-5
-10
-10
-15
-15
Return Loss (dB)
Return Loss (dB)
3V -40C
3V 25C
3V 105C
-20
-25
-30
-35
-40
-20
-25
-30
-35
-40
2.7V -40C
2.7V 25C
2.7V 105C
-45
3V -40C
3V 25C
3V 105C
3.6V -40C
3.6V 25C
3.6V 105C
2.7V -40C
2.7V 25C
2.7V 105C
-45
-50
3V -40C
3V 25C
3V 105C
3.6V -40C
3.6V 25C
3.6V 105C
-50
0
500
1000
1500
2000
2500
3000
0
Frequency (MHz)
© 2016 Integrated Device Technology, Inc.
500
1000
1500
2000
2500
3000
Frequency (MHz)
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November 11, 2016
F2970 Datasheet
Typical Performance Characteristics [3]
Figure 17. Eval Board Through Line Return Loss
vs. Frequency over Temperature
0.00
0
-0.05
-10
-0.10
-20
Return Loss (dB)
Loss (dB)
Figure 16. Evaluation Board Loss vs. Frequency
over Temperature
-0.15
-0.20
-0.25
-40C
25C
-0.30
-30
-40
-40C
-50
25C
105C
-60
105C
-70
-0.35
0
500
1000
1500
2000
2500
0
3000
500
1000
1500
2000
2500
3000
Frequency (MHz)
Frequency (MHz)
Figure 18. Switching Time Insertion Loss to
Isolation
Figure 19. Switching Time Isolation to
Insertion Loss
Figure 20. Idd vs. Control Voltage; VDD=2.7V
(C1 set to GND and VDD)
Figure 21. Idd vs. Control Voltage; VDD=2.7V
(C1 set to 0.6V and 2.1V)
0.14
0.14
0.12
C1=GND -40C
C1=VDD -40C
C1=GND 25C
C1=VDD 25C
C1=GND 105C
C1=VDD 105C
0.10
C1=2.1V -40C
C1=2.1V 25C
C1=2.1V 105C
0.10
Idd (mA)
Idd (mA)
C1=0.6V -40C
C1=0.6V 25C
C1=0.6V 105C
0.12
0.08
0.06
0.08
0.06
0.04
0.04
0.02
0.02
0.00
0.00
0
0.5
1
1.5
2
2.5
3
0
C2 Voltage (V)
© 2016 Integrated Device Technology, Inc.
0.5
1
1.5
2
2.5
3
C2 Voltage (V)
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F2970 Datasheet
Typical Performance Characteristics [4]
Figure 22. Idd vs. Control Voltage; VDD=3.0V
(C1 set to GND and VDD)
Figure 23. Idd vs. Control Voltage; VDD=3.0V
(C1 set to 0.9V and 2.1V)
0.14
0.14
0.12
C1=GND -40C
C1=VDD -40C
C1=GND 25C
C1=VDD 25C
C1=GND 105C
C1=VDD 105C
0.10
0.08
0.06
0.08
0.06
0.04
0.04
0.02
0.02
0.00
0.00
0
0.5
1
1.5
2
2.5
3
0
0.5
1
C2 Voltage (V)
1.5
2
2.5
3
C2 Voltage (V)
Figure 24. Idd vs. Control Voltage; VDD=3.6V
(C1 set to GND and VDD)
Figure 25. Idd vs. Control Voltage; VDD=3.6V
(C1 set to 0.9V and 2.7V)
0.14
0.14
0.12
C1=GND -40C
C1=VDD -40C
C1=GND 25C
C1=VDD 25C
C1=GND 105C
C1=VDD 105C
0.12
C1=0.9V -40C
C1=2.7V -40C
C1=0.9V 25C
C1=2.7V 25C
C1=0.9V 105C
C1=2.7V 105C
0.10
Idd (mA)
0.10
Idd (mA)
C1=2.1V -40C
C1=2.1V 25C
C1=2.1V 105C
0.10
Idd (mA)
Idd (mA)
C1=0.9V -40C
C1=0.9V 25C
C1=0.9V 105C
0.12
0.08
0.06
0.08
0.06
0.04
0.04
0.02
0.02
0.00
0.00
0
0.5
1
1.5
2
2.5
3
3.5
4
0
C2 Voltage (V)
© 2016 Integrated Device Technology, Inc.
0.5
1
1.5
2
2.5
3
3.5
4
C2 Voltage (V)
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November 11, 2016
F2970 Datasheet
Evaluation Kit Picture
Figure 26. Top View
Figure 27. Bottom View
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November 11, 2016
F2970 Datasheet
Evaluation Kit / Applications Circuit
Figure 28. Electrical Schematic
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November 11, 2016
F2970 Datasheet
Table 7. Bill of Material (BOM)
Part Reference
QTY
Description
Manufacturer Part #
Manufacturer
C1 – C6
6
Not Installed
C7
1
1000 pF ±5%, 50V, C0G Ceramic Capacitor (0603)
GRM1885C1H102J
Murata
R1 – R3
3
0 ohm ±1%, 1/10W, Resistor (0402)
ERJ-2RKF1000X
Panasonic
J1 – J5
5
Connector Type F
222181
Amphenol RF
J7
1
Conn Header Vert 8x2 Pos Gold
961216-6404-AR
3M
U1
1
1
SP2T Switch 4 mm x 4 mm LQFN
Printed Circuit Board
F2970NCGK
F2970 EVKIT REV 01
IDT
IDT
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November 11, 2016
F2970 Datasheet
Control Mode
Table 8 Switch Control Truth Table
C1
C2
RFC – RF1
RFC – RF2
75 Ohm Terminated Ports
0
0
1
1
0
1
0
1
ON
OFF
OFF
ON
OFF
ON
ON
OFF
RF2
RF1
RF1
RF2
Evaluation Kit Operation
Default Start-up
Control pins do not include internal pull-down resistors to logic LOW or pull-up resistors to logic HIGH.
Power Supplies
A common Vcc power supply should be used for all pins requiring DC power. All supply pins should be bypassed with external capacitors to
minimize noise and fast transients. Supply noise can degrade noise figure and fast transients can trigger ESD clamps and cause them to fail.
Supply voltage change or transients should have a slew rate smaller than 1V / 20 uS. In addition, all control pins should remain at 0V (+/0.3V) while the supply voltage ramps or while it returns to zero.
Control Pin Interface
If control signal integrity is a concern and clean signals cannot be guaranteed due to overshoot, undershoot, ringing, etc., the following circuit
at the input of each control pin is recommended. This applies to control pins 16 & 17 as shown below.
Figure 29. Control Pin Interface Schematic
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November 11, 2016
F2970 Datasheet
External Supply Setup
Set up a VCC power supply in the voltage range of 2.7 V to 3.6 V with the power supply output disabled.
Logic Control Setup
External logic control is applied to J8 CTL1 (pins 5 and 7) and CTL2 (pins 9 and 11). See Table 8 for the logic truth table.
Turn On Procedure
Setup the supplies and EVKIT as noted in the External Supply Setup and Logic Control Setup sections above.
Enable the VCC supply.
Set the desired logic setting to achieve the desired configuration (see Table 8). Note that external control logic should not be applied without
VCC being present.
Turn Off Procedure
Set the logic control to a logic low.
Disable the VCC supply.
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November 11, 2016
F2970 Datasheet
Package Drawings
Figure 30. Package Outline Drawing
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F2970 Datasheet
Recommended Land Pattern
Figure 31. Recommended Land Pattern
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F2970 Datasheet
Ordering Information
Orderable Part Number
Package
MSL Rating
Shipping Packaging
Temperature
F2970NCGK
F2970NCGK8
F2970EVBI
4.00 x 4.00 x 0.75 mm LQFN
4.00 x 4.00 x 0.75 mm LQFN
Evaluation Board
MSL1
MSL1
Bulk
Tape and Reel
-40° to +105°C
-40° to +105°C
Marking Diagram
1. Line 1 and 2 are the part number.
2. Line 3 - “ZE” are for die version.
3. Line 3 - “YWW” is last digit of the year plus work week.
4. Line 3 - “PBG” denotes the production process.
© 2016 Integrated Device Technology, Inc.
19
November 11, 2016
F2970 Datasheet
Revision History
Revision
O
Revision Date
Description of Change
2016-November-10 Initial Release
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operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided
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© 2016 Integrated Device Technology, Inc.
20
November 11, 2016