TI1 LM335M/NOPB Lm135/lm235/lm335, lm135a/lm235a/lm335a precision temperature sensor Datasheet

LM135, LM135A, LM235, LM235A, LM335, LM335A
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SNIS160D – MAY 1999 – REVISED MARCH 2013
LM135/LM235/LM335, LM135A/LM235A/LM335A Precision Temperature Sensors
Check for Samples: LM135, LM135A, LM235, LM235A, LM335, LM335A
FEATURES
1
•
•
•
•
2
Directly Calibrated in °Kelvin
1°C Initial Accuracy Available
Operates from 400 μA to 5 mA
Less than 1Ω Dynamic Impedance
•
•
•
•
Easily Calibrated
Wide Operating Temperature Range
200°C Overrange
Low Cost
DESCRIPTION
The LM135 series are precision, easily-calibrated, integrated circuit temperature sensors. Operating as a 2terminal zener, the LM135 has a breakdown voltage directly proportional to absolute temperature at +10 mV/°K.
With less than 1Ω dynamic impedance the device operates over a current range of 400 μA to 5 mA with virtually
no change in performance. When calibrated at 25°C the LM135 has typically less than 1°C error over a 100°C
temperature range. Unlike other sensors the LM135 has a linear output.
Applications for the LM135 include almost any type of temperature sensing over a −55°C to 150°C temperature
range. The low impedance and linear output make interfacing to readout or control circuitry especially easy.
The LM135 operates over a −55°C to 150°C temperature range while the LM235 operates over a −40°C to
125°C temperature range. The LM335 operates from −40°C to 100°C. The LM135/LM235/LM335 are available
packaged in hermetic TO transistor packages while the LM335 is also available in plastic TO-92 packages.
Schematic Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM135, LM135A, LM235, LM235A, LM335, LM335A
SNIS160D – MAY 1999 – REVISED MARCH 2013
www.ti.com
Absolute Maximum Ratings (1) (2)
Reverse Current
15 mA
Forward Current
10 mA
Storage Temperature
8-Pin SOIC Package
−65°C to 150°C
TO-92 Package
−60°C to 150°C
TO Package
−60°C to 180°C
Specified Operating Temp. Range
Continuous
Intermittent (3)
LM135, LM135A
−55°C to 150°C
150°C to 200°C
LM235, LM235A
−40°C to 125°C
125°C to 150°C
LM335, LM335A
−40°C to 100°C
100°C to 125°C
Lead Temp. (Soldering, 10 seconds)
8-Pin SOIC Package:
(1)
(2)
(3)
300°C
Vapor Phase (60 seconds):
215°C
Infrared (15 seconds):
220°C
TO-92 Package:
260°C
TO Package:
300°C
Refer to RETS135H for military specifications.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Continuous operation at these temperatures for 10,000 hours for NDV package and 5,000 hours for LP package may decrease life
expectancy of the device.
Temperature Accuracy (1)
LM135/LM235, LM135A/LM235A
Parameter
Conditions
LM135A/LM235A
LM135/LM235
Units
Min
Typ
Max
Min
Typ
Max
2.97
2.95
2.98
3.01
V
1
3
°C
Operating Output Voltage
TC = 25°C, IR = 1 mA
2.98
2.99
Uncalibrated Temperature Error
TC = 25°C, IR = 1 mA
0.5
1
Uncalibrated Temperature Error
TMIN ≤ TC ≤ TMAX, IR = 1 mA
1.3
2.7
2
5
°C
Temperature Error with 25°C
TMIN ≤ TC ≤ TMAX, IR = 1 mA
0.3
1
0.5
1.5
°C
Calibration
Calibrated Error at Extended
TC = TMAX (Intermittent)
2
2
°C
Temperatures
Non-Linearity
(1)
IR = 1 mA
0.3
0.5
0.3
1
°C
Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
Temperature Accuracy (1)
LM335, LM335A
Parameter
Conditions
LM335A
LM335
Units
Min
Typ
Max
Min
Typ
Max
2.95
2.98
3.01
2.92
2.98
3.04
V
1
3
2
6
°C
Operating Output Voltage
TC = 25°C, IR = 1 mA
Uncalibrated Temperature Error
TC = 25°C, IR = 1 mA
Uncalibrated Temperature Error
TMIN ≤ TC ≤ TMAX, IR = 1 mA
2
5
4
9
°C
Temperature Error with 25°C
TMIN ≤ TC ≤ TMAX, IR = 1 mA
0.5
1
1
2
°C
Calibration
Calibrated Error at Extended
TC = TMAX (Intermittent)
2
2
°C
Temperatures
Non-Linearity
(1)
2
IR = 1 mA
0.3
1.5
0.3
1.5
°C
Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
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SNIS160D – MAY 1999 – REVISED MARCH 2013
Electrical Characteristics (1)
Parameter
Conditions
LM135/LM235
LM335
LM135A/LM235A
LM335A
Min
Operating Output Voltage
400 μA ≤ IR ≤ 5 mA
Change with Current
At Constant Temperature
Dynamic Impedance
IR = 1 mA
Typ
Max
2.5
10
Min
Units
Typ
Max
3
14
mV
0.5
0.6
Ω
+10
+10
mV/°C
Still Air
80
80
sec
100 ft/Min Air
10
10
sec
Output Voltage Temperature
Coefficient
Time Constant
Stirred Oil
Time Stability
(1)
TC = 125°C
1
1
sec
0.2
0.2
°C/khr
Accuracy measurements are made in a well-stirred oil bath. For other conditions, self heating must be considered.
Thermal Resistance
8-Pin SOIC
TO-92
TO
θJA (Junction to Ambient)
165°C/W
202°C/W
400°C/W
θJC (Junction to Case)
N/A
170°C/W
N/A
CONNECTION DIAGRAMS
Figure 1. 8-Pin SOIC
Surface Mount Package
Top View
Package Number M08A
(1)
Figure 2. TO-92
Plastic Package
Bottom View
Package Z03A
Figure 3. TO
Metal Can Package (1)
Bottom View
Package Number H03H
Case is connected to negative pin.
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LM135, LM135A, LM235, LM235A, LM335, LM335A
SNIS160D – MAY 1999 – REVISED MARCH 2013
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Typical Performance Characteristics
4
Reverse Voltage Change
Calibrated Error
Figure 4.
Figure 5.
Reverse Characteristics
Response Time
Figure 6.
Figure 7.
Dynamic Impedance
Noise Voltage
Figure 8.
Figure 9.
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SNIS160D – MAY 1999 – REVISED MARCH 2013
Typical Performance Characteristics (continued)
Thermal Resistance Junction to Air
Thermal Time Constant
Figure 10.
Figure 11.
Thermal Response in Still Air
Thermal Response in Stirred Oil Bath
Figure 12.
Figure 13.
Forward Characteristics
Figure 14.
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SNIS160D – MAY 1999 – REVISED MARCH 2013
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APPLICATION INFORMATION
CALIBRATING THE LM135
Included on the LM135 chip is an easy method of calibrating the device for higher accuracies. A pot connected
across the LM135 with the arm tied to the adjustment terminal allows a 1-point calibration of the sensor that
corrects for inaccuracy over the full temperature range.
This single point calibration works because the output of the LM135 is proportional to absolute temperature with
the extrapolated output of sensor going to 0V output at 0°K (−273.15°C). Errors in output voltage versus
temperature are only slope (or scale factor) errors so a slope calibration at one temperature corrects at all
temperatures.
The output of the device (calibrated or uncalibrated) can be expressed as:
(1)
where T is the unknown temperature and To is a reference temperature, both expressed in degrees Kelvin. By
calibrating the output to read correctly at one temperature the output at all temperatures is correct. Nominally the
output is calibrated at 10 mV/°K.
To insure good sensing accuracy several precautions must be taken. Like any temperature sensing device, self
heating can reduce accuracy. The LM135 should be operated at the lowest current suitable for the application.
Sufficient current, of course, must be available to drive both the sensor and the calibration pot at the maximum
operating temperature as well as any external loads.
If the sensor is used in an ambient where the thermal resistance is constant, self heating errors can be calibrated
out. This is possible if the device is run with a temperature stable current. Heating will then be proportional to
zener voltage and therefore temperature. This makes the self heating error proportional to absolute temperature
the same as scale factor errors.
WATERPROOFING SENSORS
Meltable inner core heat shrinkable tubing such as manufactured by Raychem can be used to make low-cost
waterproof sensors. The LM335 is inserted into the tubing about ½″ from the end and the tubing heated above
the melting point of the core. The unfilled ½″ end melts and provides a seal over the device.
Typical Applications
Figure 15. Basic Temperature Sensor
Figure 17. Wide Operating Supply
Figure 16. Calibrated Sensor
*Calibrate for 2.982V at 25°C
6
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SNIS160D – MAY 1999 – REVISED MARCH 2013
Figure 18. Minimum Temperature Sensing
Figure 20. Remote Temperature Sensing
Wire length for 1°C error due to wire drop
Figure 19. Average Temperature Sensing
(1)
IR = 1 mA
IR = 0.5 mA (1)
AWG
FEET
FEET
14
4000
8000
16
2500
5000
18
1600
3200
20
1000
2000
22
625
1250
24
400
800
For IR = 0.5 mA, the trim pot must be deleted.
Figure 21. Isolated Temperature Sensor
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LM135, LM135A, LM235, LM235A, LM335, LM335A
SNIS160D – MAY 1999 – REVISED MARCH 2013
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Figure 22. Simple Temperature Controller
Figure 23. Simple Temperature Control
Figure 24. Ground Referred Fahrenheit Thermometer
*Adjust R2 for 2.554V across LM336.
Adjust R1 for correct output.
Figure 25. Centigrade Thermometer
*Adjust for 2.7315V at output of LM308
8
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SNIS160D – MAY 1999 – REVISED MARCH 2013
Figure 26. Fahrenheit Thermometer
*To calibrate adjust R2 for 2.554V across LM336.
Adjust R1 for correct output.
Figure 27. THERMOCOUPLE COLD JUNCTION COMPENSATION
Compensation for Grounded Thermocouple
*Select R3 for proper thermocouple type
THERMO-COUPLE
R3 (±1%)
SEEBECK COEFFICIENT
J
377Ω
52.3 μV/°C
T
308Ω
42.8 μV/°C
K
293Ω
40.8 μV/°C
S
45.8Ω
6.4 μV/°C
Adjustments: Compensates for both sensor and resistor tolerances
1. Short LM329B
2. Adjust R1 for Seebeck Coefficient times ambient temperature (in degrees K) across R3.
3. Short LM335 and adjust R2 for voltage across R3 corresponding to thermocouple type.
J 14.32 mV K 11.17 mV
T 11.79 mV S 1.768 mV
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SNIS160D – MAY 1999 – REVISED MARCH 2013
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Figure 28. Single Power Supply Cold Junction Compensation
*Select R3 and R4 for thermocouple type
THERMO-COUPLE
R3
R4
SEEBECK COEFFICIENT
J
1.05K
385Ω
52.3 μV/°C
T
856Ω
315Ω
42.8 μV/°C
K
816Ω
300Ω
40.8 μV/°C
S
128Ω
46.3Ω
6.4 μV/°C
Adjustments:
1. Adjust R1 for the voltage across R3 equal to the Seebeck Coefficient times ambient temperature in degrees Kelvin.
2. Adjust R2 for voltage across R4 corresponding to thermocouple.
10
J
14.32 mV
T
11.79 mV
K
11.17 mV
S
1.768 mV
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SNIS160D – MAY 1999 – REVISED MARCH 2013
Figure 29. Centigrade Calibrated Thermocouple Thermometer
Terminate thermocouple reference junction in close proximity to LM335.
Adjustments:
1. Apply signal in place of thermocouple and adjust R3 for a gain of 245.7.
2. Short non-inverting input of LM308A and output of LM329B to ground.
3. Adjust R1 so that VOUT = 2.982V @ 25°C.
4. Remove short across LM329B and adjust R2 so that VOUT = 246 mV @ 25°C.
5. Remove short across thermocouple.
Figure 30. Fast Charger for Nickel-Cadmium Batteries
†Adjust D1 to 50 mV greater VZ than D2.
Charge terminates on 5°C temperature rise. Couple D2 to battery.
Figure 31. Differential Temperature Sensor
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SNIS160D – MAY 1999 – REVISED MARCH 2013
www.ti.com
Figure 32. Differential Temperature Sensor
Figure 33. Variable Offset Thermometer‡
†Adjust for zero with sensor at 0°C and 10T pot set at 0°C
*Adjust for zero output with 10T pot set at 100°C and sensor at 100°C
‡Output reads difference between temperature and dial setting of 10T pot
12
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LM135, LM135A, LM235, LM235A, LM335, LM335A
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SNIS160D – MAY 1999 – REVISED MARCH 2013
Figure 34. Ground Referred Centigrade Thermometer
Figure 35. Air Flow Detector*
*Self heating is used to detect air flow
DEFINITION OF TERMS
Operating Output Voltage: The voltage appearing across the positive and negative terminals of the device at
specified conditions of operating temperature and current.
Uncalibrated Temperature Error: The error between the operating output voltage at 10 mV/°K and case
temperature at specified conditions of current and case temperature.
Calibrated Temperature Error: The error between operating output voltage and case temperature at 10 mV/°K
over a temperature range at a specified operating current with the 25°C error adjusted to zero.
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REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
•
14
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 13
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM135AH
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
-55 to 150
LM135AH
LM135AH/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 150
LM135AH
LM135H
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
-55 to 150
LM135H
LM135H/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-55 to 150
LM135H
LM235AH
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
-40 to 125
LM235AH
LM235AH/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-40 to 125
LM235AH
LM235H
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
-40 to 125
LM235H
LM235H/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-40 to 125
LM235H
LM335A MWC
ACTIVE
WAFERSALE
YS
0
1
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
LM335AH
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
-40 to 100
LM335AH
LM335AH/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-40 to 100
LM335AH
LM335AM
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 100
LM335
AM
LM335AM/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 100
LM335
AM
LM335AMX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 100
LM335
AM
LM335AMX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 100
LM335
AM
LM335AZ/LFT1
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SN
Level-1-NA-UNLIM
LM335AZ/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
-40 to 100
LM335
AZ
LM335H
ACTIVE
TO
NDV
3
1000
TBD
Call TI
Call TI
-40 to 100
LM335H
Addendum-Page 1
LM335
AZ
Samples
PACKAGE OPTION ADDENDUM
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9-Jun-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM335H/NOPB
ACTIVE
TO
NDV
3
1000
Green (RoHS
& no Sb/Br)
POST-PLATE
Level-1-NA-UNLIM
-40 to 100
LM335H
LM335M
ACTIVE
SOIC
D
8
95
TBD
Call TI
Call TI
-40 to 100
LM335
M
LM335M/NOPB
ACTIVE
SOIC
D
8
95
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 100
LM335
M
LM335MX
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Call TI
-40 to 100
LM335
M
LM335MX/NOPB
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 100
LM335
M
LM335Z/LFT7
ACTIVE
TO-92
LP
3
2000
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM335Z/NOPB
ACTIVE
TO-92
LP
3
1800
Green (RoHS
& no Sb/Br)
SNCU
Level-1-NA-UNLIM
LM335
Z
-40 to 100
LM335
Z
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
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Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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Addendum-Page 3
PACKAGE MATERIALS INFORMATION
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21-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM335AMX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM335AMX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM335MX
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
LM335MX/NOPB
SOIC
D
8
2500
330.0
12.4
6.5
5.4
2.0
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM335AMX
SOIC
D
8
2500
367.0
367.0
35.0
LM335AMX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
LM335MX
SOIC
D
8
2500
367.0
367.0
35.0
LM335MX/NOPB
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NDV0003H
H03H (Rev F)
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