Kemet CBR06C308BAGAC Ceramic, high q, microwave (cbr), 0.3 pf, /-0.1 pf, 250 v, 0603, c0g, smd, fixed, rf, ultra high q, low esr, class i Datasheet

KEMET Part Number: CBR06C308BAGAC
(CBR06C308BAGACTU)
Ceramic, High Q, Microwave (CBR), 0.3 pF, +/-0.1 pF, 250 V, 0603, C0G, SMD, Fixed, RF, Ultra High Q, Low ESR, Class I
General Information
Style:
Series:
Chip Size:
Description:
Features:
SMD Chip
Microwave (CBR)
0603
SMD, Fixed, RF, Ultra High Q,
Low ESR, Class I
Ultra High Q, Low ESR, Class I
RoHS:
Yes
Termination:
Tin
Marking:
No
Miscellaneous:
Notes:
Minimum Q = 806
Solder Wave or Solder Reflow
Dimensions
L
1.6mm +/-0.1mm
W
0.8mm +/-0.1mm
T
0.8mm +/-0.07mm
B
0.4mm +/-0.15mm
Specifications
Capacitance:
Capacitance Tolerance:
+/-0.1 pF
Voltage DC:
250 VDC
Temperature Range:
Temperature Coefficient:
Packaging Specifications
Packaging:
Packaging Quantity:
Dissipation Factor:
Aging Rate:
T&R, 180mm, Plastic Tape
4000
0.3 pF
Insulation Resistance:
Dielectric Strength:
Quality Factor:
-55/+125C
C0G
0.246%
0% Loss/Decade Hour
10 GOhms
500 V
806
Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute - and
we specifically disclaim - any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the
requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us
with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained.
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