LVR Series Low-TCR Current Sense Chips The resistors are constructed using outstanding TCR level material, which makes LVR resistors excellent for current sensing application in battery charger circuit & DC-DC converter. The composition of the resistive material is adjusted to give the LVR series resistors more resistive stability than the competition in very small package sizes. a p p l i c at i o n s • Consumer goods • Computer • Telecom / Datacom • Industrial / Power supply • Alternative Energy • Car electronics • Battery S e r i e s S p e c i f i c at i o n s Series Size Power Rating Resistance Range TCR (ppm/°C) Tolerance LVR02A 0201 0.1W 5mΩ - 10mΩ 150ppm/°C 1%, 5% LVR04A 0402 0.125W 2.5mΩ 5mΩ - 20mΩ ±350 ppm/°C ±150 ppm/°C 1%, 5% characteristics Derating Percent Rated Power 100 80 70° 60 40 20 125° 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 Ambient Temperature, °C 300 270° 250 ramp up rate <3K/s 200 ramp down rate <6K/s 190° 150 100 ramp up rate <3K/s 50 0 12 -55° Reflow Soldering Conditions Temperature °C Operating –55°C to +125°C Temp. Range Power Standard rated power at 70°C; see chart above Rating Rated The DC or AC (rms) continuous working voltage corVoltage responding to the rated power is determined by the following formula: V = √(PxR) or max. working voltage whichever is less, where: V = Cont. rated DC or AC (rms) working voltage (V) P = Rated power (W) R = Resistance value (Ω) Resistance range TCR Temperature Size Coeff. of 0201 5mΩ - 10mΩ ±150 ppm/°C Resistance 0402 2.5mΩ ±350 ppm/°C 5mΩ - 20mΩ ±150 ppm/°C Terminations Cu, Ni, matte Tin Preheating 0 50 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • [email protected] 100 150 Time (sec.) 200 250 LVR Series Low-TCR Current Sense Chips p e r f o r m a n c e d ata Test Method Short time IEC60115-1 4.13 overload High MIL-STD-202-Method Temperature 108 Exposure Moisture MIL-STD-202-Method Resistance 106 Operational MIL-STD-202 Method Life/ 108 Endurance IEC 60115-1 4.25.1 Solderability - J-STD-002 test B Wetting Moisture MIL-STD-202 Method Resistance 106 Thermal MIL-STD-202 Method Shock 107 Board Flex/ IEC 60115-1 4.33 Bending Resistance MIL-STD-202 Method to Soldering 210 Heat IEC 60115-1 4.18 Procedure 2.5 times of rated power for 5 seconds at room temperature 1,000 hours at maximum operating temperature depending on specification, unpowered. No direct impingement of forced air to the parts Tolerances: 125±5ºC Requirements ±(1%+0.0005Ω) No visible damage ±(1.0%+0.0005Ω) Each temperature / humidity cycle is defined at 8 hours (method 106F), ±(0.5%+0.0005Ω) 3 cycles / 24 hours for 10d with 25ºC / 65ºC 95% R.H, without steps 7a & 7b, unpowered 1,000 hours at 70±2ºC applied RCWV. 1.5 hours on, 0.5 hour off, still air ±(1.0%+0.0005Ω) required Electrical Test not required. Magnification 50X. SMD conditions: 1st step : method B, aging 4 hours at 155°C dry heat; 2nd step: leadfree solder bath at 245±3°C; Dipping time: 3± 0.5 seconds Each temperature / humidity cycle is defined at 8 hours (Method 106G), 3 cycles / 24 hours for 10d. with 25°C / 65°C 95% R.H, without steps 7a & 7b, un-powered Parts mounted on test board, without condensation on parts. Measurement at 24±2 hours after test conclusion. -55/+125°C. Number of cycles required is 300. Parts mounted on test board. Maximum transfer time is 20 seconds. Dwell time is 15 minutes. Device mounted on PCB test board as described, only 1 board bending required. 2 mm bending. Bending time: 60±1 seconds. Ohmic value checked during bending Condition B, no pre-heat of samples. Leadfree solder, 260±5°C, 10±1seconds immersion time. Procedure 2 for SMD: devices fluxed and cleaned with isopropanol 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • [email protected] 13 Well tinned (>95% covered) No visible damage ±(0.5% + 0.0005Ω) No visible damage ±(1.0% + 0.0005Ω) ±(1.0 % + 0.0005Ω) ±(0.5% + 0.0005Ω) No visible damage LVR Series Low-TCR Current Sense Chips dimensions (mm) H l1 Size Res. Range 0201 5mΩ - 10mΩ 0402 W 2.5mΩ 5mΩ ≤ R ≤ 10mΩ 12mΩ ≤ R ≤ 20mΩ L W H l1 0.60 ±0.03 0.31 ±0.04 0.30 ±0.05 0.15 ±0.06 1.00 ±0.10 1.00 ±0.10 1.00 ±0.10 0.55 ±0.10 0.55 ±0.10 0.55 ±0.10 0.30 ±0.10 Max. 0.30 Max. 0.40 0.25 ±0.10 0.25 ±0.10 0.25 ±0.10 Typical sensing traces Reflow Soldering footprint Size 0201 0402 A B C D 1.0 0.3 0.35 0.4 2.0 0.4 0.8 D 0.6 C B A Ta p e a n d r e e l (mm) T D0 P2 W2 P0 E cover tape D F W CN A B0 P1 A0 W1 Paper/PE tape Size A0 B0 W E F P0 P1 P2 ØD0 T 0201 0402 0.35 ±0.10 0.59 ±0.10 0.65 ±0.10 1.10 ±0.10 8.0 ±0.20 8.00 ±0.10 1.75 ±0.10 1.75 ±0.10 3.5 ±0.05 3.50 ±0.10 4.0 ±0.10 4.00 ±0.10 2.0 ±0.05 4.00 ±0.10 2.0 ±0.05 2.00 ±0.10 1.5 +0.1/-0 0.35 ±0.10* 1.55 ±0.05 0.48 ±0.03 Qty. per reel (178mm) 10,000 10,000 Reel dimensions Qty./reel 8mm tape A N C D W1 W2 max. 10,000 7" (Ø178mm) 178.0 ±1.0 60.0 +1/-0 13.50 ±0.5 21.0 ±0.8 9.0 ±0.5 12.0 ±0.2 O R DE R IN G INFO R MATION RoHS Compliant LVR02R005FER Series Tolerance Tape Size Ohms J = 5% & reel 02 = 0201 5% in E24 04 = 0402 values, 1% and F = 1% lower tolerances available in E24 and E96 values rev 10/17-1 14 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • [email protected]