ETC2 iqs572 Proximity, touch and snap* on each channel Datasheet

ProxSense®
IQS550/572/525-B000 – Capacitive Trackpad/Touchscreen Controller
Projected capacitive controller with proximity, touch, snap, trackpad outputs and gestures
The IQS5xx-B000 is a projected capacitive touch and proximity trackpad/touchscreen
controller implementation on the IQS550, IQS572 and IQS525 platforms. The IQS5xxB000 features best in class sensitivity, signal-to-noise ratio and automatic tuning of
electrodes. Low power proximity detection allows extreme low power operation.
Main Features













Proximity, touch and snap* on each channel
Multi-touch support up to 5 fingers
Single and multi-finger gestures
3584 x 2304 max resolution (IQS550)
Scale, orientation and electrode layout selection
I2C communication interface
ATI: automatic tuning for optimum sensitivity
Supply Voltage 1.65V to 3.6V
Proximity low power operation (<10uA)
3 Active and 2 low power modes
Event and streaming modes
Internal voltage regulator and reference capacitor
On-chip noise detection and suppression
IQS550
IQS572
IQS525
Maximum channels
150
72
25
Typical report rate
(with single touch / all channels active)
100Hz
135Hz
190Hz
Maximum resolution
(for shown Tx Rx configurations)
3584 x 2304 2048 x 1792 1280 x 768
(15 x 10)
(9 x 8)
(6 x 4)
Applications






Compact Capacitive Keyboards
Remote Control Trackpads
Appliances
Navigation devices
Kiosks and POS terminals
E-readers
TA
-40°C to 85°C
QFN(7x7)-48
IQS550
QFN(4x4)-28
IQS572
QFN(4x4)-28
IQS525
*patented
Copyright © Azoteq (Pty) Ltd
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IQS5xx-B000 Trackpad Datasheet
Revision 2.0
Page 1 of 79
November 2016
IQ Switch®
ProxSense® Series
Contents
1
Overview ............................................................................................................................................................ 7
2
Packaging and Pin-out ........................................................................................................................................ 8
3
2.1
IQS550 - QFN48 ................................................................................................................................................. 8
2.2
IQS572 - QFN28 ............................................................................................................................................... 10
2.3
IQS525 - QFN28 ............................................................................................................................................... 12
®
ProxSense Module ...........................................................................................................................................14
3.1
Channel Definition ........................................................................................................................................... 14
3.2
Alternate Low-Power Channel (ALP) .............................................................................................................. 14
3.3
Count Value ..................................................................................................................................................... 14
3.3.1 Trackpad Count Values ............................................................................................................................... 14
3.3.2 ALP Count Values ........................................................................................................................................ 14
3.3.3 Max Count ................................................................................................................................................... 15
3.3.4 Delta Value .................................................................................................................................................. 15
3.4
Reference Value............................................................................................................................................... 15
3.4.1 Reference Update Time .............................................................................................................................. 15
3.4.2 ALP Long-Term Average .............................................................................................................................. 15
3.4.3 Reseed......................................................................................................................................................... 15
3.5
Channel Outputs .............................................................................................................................................. 15
3.5.1 Proximity ..................................................................................................................................................... 15
3.5.2 Touch .......................................................................................................................................................... 16
3.5.3 Snap ............................................................................................................................................................ 16
3.5.4 Output Debounce ....................................................................................................................................... 16
3.5.5 Maximum Touch ......................................................................................................................................... 16
3.6
Auto Tuning (ATI) ............................................................................................................................................ 17
3.6.1 ATI C Multiplier ........................................................................................................................................... 17
3.6.2 ATI Compensation & Auto ATI .................................................................................................................... 17
3.7
Automatic Re-ATI ............................................................................................................................................ 17
3.7.1 Description .................................................................................................................................................. 17
3.7.2 Conditions for Re-ATI to activate ................................................................................................................ 17
3.7.3 ATI Error ...................................................................................................................................................... 18
3.7.4 Design requirements ................................................................................................................................... 18
3.8
4
Sensing Hardware Settings.............................................................................................................................. 18
Sensing Modes ..................................................................................................................................................19
4.1
Report Rate ..................................................................................................................................................... 19
4.1.1 Previous Cycle Time .................................................................................................................................... 20
5
4.2
Mode Timeout ................................................................................................................................................. 20
4.3
Manual Control ............................................................................................................................................... 20
Trackpad ...........................................................................................................................................................20
5.1
Configuration................................................................................................................................................... 20
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IQS5xx-B000 Trackpad Datasheet
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IQ Switch®
ProxSense® Series
5.1.1
5.1.2
5.1.3
5.1.4
Size Selection .............................................................................................................................................. 20
Individual Channel Disabling ....................................................................................................................... 20
Rx / Tx Mapping .......................................................................................................................................... 20
Rx / Tx Selections ........................................................................................................................................ 21
5.2
Trackpad Outputs ............................................................................................................................................ 21
5.2.1 Number of Fingers ...................................................................................................................................... 21
5.2.2 Relative XY .................................................................................................................................................. 21
5.2.3 Absolute XY ................................................................................................................................................. 21
5.2.4 Touch Strength ............................................................................................................................................ 21
5.2.5 Area ............................................................................................................................................................. 21
5.2.6 Tracking / Identification .............................................................................................................................. 21
5.3
Max Number of Multi-touches ........................................................................................................................ 21
5.4
XY Resolution ................................................................................................................................................... 21
5.5
Palm Rejection ................................................................................................................................................. 21
5.6
Stationary Touch ............................................................................................................................................. 22
5.7
Multi-touch Finger Split ................................................................................................................................... 22
5.8
XY Output Flip & Switch ................................................................................................................................... 22
5.9
XY Position Filtering ......................................................................................................................................... 22
5.9.1 MAV Filter ................................................................................................................................................... 22
5.9.2 IIR Filter ....................................................................................................................................................... 22
6
7
Gestures ............................................................................................................................................................23
6.1
Single Tap ........................................................................................................................................................ 23
6.2
Press and Hold ................................................................................................................................................. 23
6.3
Swipe (X-, X+, Y-, Y+) ........................................................................................................................................ 24
6.4
2 Finger Tap ..................................................................................................................................................... 24
6.5
Scroll ................................................................................................................................................................ 24
6.6
Zoom................................................................................................................................................................ 25
6.7
Switching Between Gestures ........................................................................................................................... 25
Additional Features ...........................................................................................................................................25
7.1
Non-volatile Defaults....................................................................................................................................... 25
7.2
Automated Start-up ........................................................................................................................................ 25
7.3
Suspend ........................................................................................................................................................... 26
2
7.3.1 I C Wake ...................................................................................................................................................... 26
7.3.2 Switch Input Pin Wake ................................................................................................................................ 26
7.4
Reset ................................................................................................................................................................ 26
7.4.1 Reset Indication .......................................................................................................................................... 26
7.4.2 Software Reset ............................................................................................................................................ 26
7.4.3 Hardware Reset .......................................................................................................................................... 26
7.5
Watchdog Timer (WDT)................................................................................................................................... 26
7.6
RF Immunity .................................................................................................................................................... 26
7.7
Additional Non-Trackpad Channels ................................................................................................................ 26
7.8
Bootloader ....................................................................................................................................................... 26
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IQ Switch®
ProxSense® Series
7.8.1
Bootloader Status ....................................................................................................................................... 26
7.9
Version Information ........................................................................................................................................ 27
7.9.1 Product Number ......................................................................................................................................... 27
7.9.2 Project Number ........................................................................................................................................... 27
7.9.3 Major and Minor Versions .......................................................................................................................... 27
8
7.10
Unique ID ......................................................................................................................................................... 27
7.11
Switch Input ..................................................................................................................................................... 27
2
I C .....................................................................................................................................................................27
8.1
Data Ready (RDY) ............................................................................................................................................ 27
8.2
Slave Address................................................................................................................................................... 27
8.3
16-bit Addressing ............................................................................................................................................ 27
2
8.4
I C Read ........................................................................................................................................................... 27
8.4.1 Default Read Address.................................................................................................................................. 28
2
8.5
I C Write .......................................................................................................................................................... 28
8.6
I C Timeout ...................................................................................................................................................... 28
8.7
End of Communication Session / Window ...................................................................................................... 28
2
8.8
Event Mode Communication ........................................................................................................................... 28
8.8.1 Events.......................................................................................................................................................... 28
8.8.2 Force Communication ................................................................................................................................. 28
8.9
Memory Map Registers ................................................................................................................................... 29
8.10
Memory Map Bit / Register Definitions ........................................................................................................... 36
8.10.1
Gesture Events 0 ..................................................................................................................................... 37
8.10.2
Gesture Events 1 ..................................................................................................................................... 37
8.10.3
System Info 0 .......................................................................................................................................... 38
8.10.4
System Info 1 .......................................................................................................................................... 39
8.10.5
Individual Channel Status / Config Bit Definitions .................................................................................. 39
8.10.6
Count / Delta / Reference Data .............................................................................................................. 40
8.10.7
System Control 0 .................................................................................................................................... 41
8.10.8
System Control 1 .................................................................................................................................... 42
8.10.9
System Config 0 ...................................................................................................................................... 42
8.10.10 System Config 1 ...................................................................................................................................... 43
8.10.11 Alternate Channel Setup ........................................................................................................................ 44
8.10.12 ALP Rx select ........................................................................................................................................... 45
8.10.13 ALP Tx select ........................................................................................................................................... 45
8.10.14 RxToTx .................................................................................................................................................... 45
8.10.15 Hardware Settings A ............................................................................................................................... 46
8.10.16 Hardware Settings B ............................................................................................................................... 46
8.10.17 Hardware Settings C ............................................................................................................................... 47
8.10.18 Hardware Settings D ............................................................................................................................... 47
8.10.19 XY Config 0 .............................................................................................................................................. 48
8.10.20 Single Finger Gestures ............................................................................................................................ 48
8.10.21 Multi-finger Gestures ............................................................................................................................. 49
9
Circuit Diagram .................................................................................................................................................50
10
Electrical Characteristics ....................................................................................................................................55
10.1
Absolute Maximum Ratings ............................................................................................................................ 55
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IQ Switch®
ProxSense® Series
10.2
Operating Conditions ...................................................................................................................................... 56
10.2.1
General Operating Conditions ................................................................................................................ 56
10.2.2
Power-up / Power-down Operating Conditions ..................................................................................... 56
10.2.3
Supply Current Characteristic ................................................................................................................. 57
®
10.2.4
ProxSense Current Consumption .......................................................................................................... 57
10.2.5
Expected Total Current Consumption Scenarios .................................................................................... 57
10.2.6
I/O Port Pin Characteristics .................................................................................................................... 59
10.2.7
Output Driving Current ........................................................................................................................... 60
10.2.8
NRST Pin ................................................................................................................................................. 60
2
10.2.9
I C Characteristics ................................................................................................................................... 61
10.2.10 Package Moisture Sensitivity .................................................................................................................. 63
10.2.11 Electrostatic Discharge (ESD) .................................................................................................................. 63
10.2.12 Thermal Characteristics .......................................................................................................................... 63
10.2.13 ProxSense Electrical Characteristics ....................................................................................................... 64
11
12
Mechanical Dimensions ....................................................................................................................................65
11.1
IQS550 QFN(7x7)-48 Mechanical Dimensions ................................................................................................. 65
11.2
IQS550 Landing Pad Layout............................................................................................................................. 66
11.3
IQS572/IQS525 QFN(4x4)-28 Mechanical Dimensions .................................................................................... 67
11.4
IQS572/IQS525 Landing Pad Layout ................................................................................................................ 68
Packaging Information ......................................................................................................................................69
12.1
Tape Specification ........................................................................................................................................... 69
12.1.1
IQS550 Tape Description ........................................................................................................................ 70
12.1.2
IQS572 and IQS525 Tape Description ..................................................................................................... 70
12.2
Reel Specification ............................................................................................................................................ 71
12.2.1
Dry Packing ............................................................................................................................................. 72
12.2.2
Baking ..................................................................................................................................................... 72
13
14
12.3
Handling of the IQS5xx .................................................................................................................................... 73
12.4
Reflow for IQS5xx ............................................................................................................................................ 74
Device Marking .................................................................................................................................................75
13.1
IQS550 Marking ............................................................................................................................................... 75
13.2
IQS572/IQS525 Marking .................................................................................................................................. 76
Ordering Information ........................................................................................................................................76
14.1
IQS550 Ordering .............................................................................................................................................. 76
14.2
IQS572 Ordering .............................................................................................................................................. 77
14.3
IQS525 Ordering .............................................................................................................................................. 77
Changes: ....................................................................................................................................................................... 78
Release v1.00 ........................................................................................................................................................... 78
Release v1.01 ........................................................................................................................................................... 78
Release v2.00 ........................................................................................................................................................... 78
15
Contact Information ..........................................................................................................................................79
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IQS5xx-B000 Trackpad Datasheet
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IQ Switch®
ProxSense® Series
List of Abbreviations
ALP
Alternate Low Power
ATI
Automatic Tuning Implementation
EMI
Electromagnetic Interference
ESD
Electrostatic Discharge
GND
Ground
GUI
Graphical User Interface
IC
Integrated Circuit
ICI
Internal Capacitor Implementation
IIR
Infinite Impulse Response
LP
Low Power
LTA
Long Term Average
MAV
Moving Average
ND
Noise Detect
THR
Threshold
TP
Trackpad
WDT
Watchdog Timer
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IQ Switch®
ProxSense® Series
1 Overview
The IQS550 / IQS572 / IQS525 are capacitive sensing controllers designed for multi-touch
applications using projected capacitance touch panels. The device offers high sensitivity
proximity wake-up and contact detection (touch) through a selectable number of sensor lines
(Rxs and Txs).
The device has an internal voltage regulator and Internal Capacitor Implementation (ICI) to
reduce external components. Advanced on-chip signal processing capabilities provide stable
high performance with high sensitivity.
A trackpad consists of an array of sensors that are scanned at regular intervals. The controller
uses the principle of projected capacitance charge transfer on the trackpad. When a
conductive object such as a human finger approaches the sense plate it will decrease the
detected capacitance. Thresholds are applied to the sensor data to identify areas that exhibit
proximity and touch deviation. The contours of the touch areas are then translated to
Cartesian position coordinates that are continuously monitored to identify gestures. A user
has access to all of the data layers – the raw sensor data, the sensor proximity/touch status
data, the XY coordinates as well as the gesture outputs.
Multiple filters are implemented to detect and suppress noise, track slow varying
environmental conditions and avoid effects of possible drift. The Auto Tuning (ATI) allows for
the adaptation to a wide range of touch screens without using external components.
An innovative addition, known as a snap*, is also available on each channel.
another channel output, additional to the proximity and touch.
This adds
The trackpad application firmware on the IQS5xx is very flexible in design, and can incorporate
standard touch sensors, trackpad / touchscreen areas (giving XY output data) and
conventional snap-dome type buttons, all providing numerous outputs such as proximity,
touch, snap, touch strength, area and actual finger position all in one solution.
The IQS550, IQS572 and IQS525 devices ship with the bootloader only, since the designer
must program custom IQS5xx-B000 firmware during production testing. The custom firmware
is the IQS5xx-B000 trackpad firmware together with customer specific hardware settings
exported by the GUI program.
This datasheet applies to the following IQS550 version:
Product Number 40 / Project Number 15 / Version Number 2
This datasheet applies to the following IQS572 version:
Product Number 58 / Project Number 15 / Version Number 2
This datasheet applies to the following IQS525 version:
Product Number 52 / Project Number 15 / Version Number 2
*patented
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IQ Switch®
ProxSense® Series
2 Packaging and Pin-out
2.1 IQS550 - QFN48
37 VSSIO
38 VDDIO
39 Tx4
40 Tx5
41 Tx6
42 Tx7
43 Tx8
44 Tx9
45 Tx10
46 Tx11
47 Tx12
48 Tx13
The IQS550 is available in a QFN(7x7)-48
package.
Tx14 1
36 Tx3
PGM 2
35 Tx2
SW_IN 3
34 Tx1
N/C 4
33 Tx0
IQS550
Xxxxx xx
Xxx xxx
SDA 5
SCL 6
VDDHI 7
VSS 8
VREG 9
32 Rx9B
31 Rx9A
30 Rx8B
29 Rx8A
28 Rx7B
Figure 2.1
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Rx5B 24
Rx5A 23
Rx4B 22
Rx4A 21
Rx3B 20
Rx3A 19
Rx2B 18
25 Rx6A
Rx2A 17
N/C 12
Rx1B 16
26 Rx6B
Rx1A 15
RDY 11
Rx0B 14
27 Rx7A
Rx0A 13
NRST 10
QFN Top View
IQS5xx-B000 Trackpad Datasheet
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IQ Switch®
ProxSense® Series
Table 2.1
QFN48 Pin-out
Pin
Name
Description
1
Tx14
2
Pin
Name
Description
25
Rx6A
Receiver electrode
Transmitter electrode
26
Rx6B
Note1
PGM
Programming Pin
27
Rx7A
Receiver electrode
3
SW_IN
Wake-up from suspend
and switch input
28
Rx7B
Note1
4
n/c
~
29
Rx8A
Receiver electrode
SDA
I2C Data
30
Rx8B
Note1
5
6
SCL
I2C Clock
31
Rx9A
Receiver electrode
32
Rx9B
Note1
33
Tx0
Transmitter electrode
34
Tx1
Transmitter electrode
35
Tx2
Transmitter electrode
7
VDDHI
Supply Voltage
8
VSS
Ground Reference
9
VREG
Internal Regulator
Voltage
10
NRST
Reset (active LOW)
36
Tx3
Transmitter electrode
11
RDY
I2C RDY
37
VSSIO
I/O Ground Reference
12
n/c
~
38
VDDIO
I/O Supply Voltage
13
Rx0A
Receiver electrode
39
Tx4
Transmitter electrode
14
Rx0B
Note1
40
Tx5
Transmitter electrode
15
Rx1A
Receiver electrode
41
Tx6
Transmitter electrode
16
Rx1B
Note1
42
Tx7
Transmitter electrode
17
Rx2A
Receiver electrode
43
Tx8
Transmitter electrode
18
Rx2B
Note1
44
Tx9
Transmitter electrode
19
Rx3A
Receiver electrode
45
Tx10
Transmitter electrode
20
Rx3B
Note1
46
Tx11
Transmitter electrode
21
Rx4A
Receiver electrode
47
Tx12
Transmitter electrode
22
Rx4B
Note1
48
Tx13
Transmitter electrode
23
Rx5A
Receiver electrode
24
Rx5B
Note1
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Note1: Any of these can be configured through I2C as the
ProxSense® electrode.
IQS5xx-B000 Trackpad Datasheet
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IQ Switch®
ProxSense® Series
2.2 IQS572 - QFN28
22 TX4
23 TX5
24 TX6
25 TX7
26 TX8
27 PGM
28 SW_IN
The IQS572 is available in a QFN(4x4)-28
package. The production version is shown
below.
n/c 1
21 TX3
SDA 2
20 TX2
IQS572
VSS 5
xx xxx
VDDHI 4
xx xxx
xxx xx
SCL 3
19 TX1
18 TX0
17 RX7 / TX9
Figure 2.2
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RX4 / TX12 14
RX3 / TX13 13
RX2 / TX14 12
RX1 11
15 RX5 / TX11
RX0 10
NRST 7
n/c 9
16 RX6 / TX10
RDY 8
VREG 6
IQS572 QFN Top View
IQS5xx-B000 Trackpad Datasheet
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IQ Switch®
ProxSense® Series
Table 2.2
IQS572 QFN28 Pin-out
15
Rx5
Receiver electrode
Pin
Name
Description
16
Rx6
Receiver electrode
1
n/c
~
17
Rx7
Receiver electrode
2
SDA
I2C Data
18
Tx0
Transmitter electrode
3
SCL
I2C Clock
19
Tx1
Transmitter electrode
4
VDDHI
Supply Voltage
20
Tx2
Transmitter electrode
5
VSS
Ground Reference
21
Tx3
Transmitter electrode
6
VREG
Internal Regulator
Voltage
22
Tx4
Transmitter electrode
7
NRST
Reset (active LOW)
23
Tx5
Transmitter electrode
8
RDY
I2C RDY
24
Tx6
Transmitter electrode
9
n/c
~
25
Tx7
Transmitter electrode
10
Rx0
Receiver electrode
26
Tx8
Transmitter electrode
11
Rx1
Receiver electrode
27
PGM
Programming Pin
12
Rx2
Receiver electrode
28
SW_IN
Wake-up from suspend
and switch input
13
Rx3
Receiver electrode
14
Rx4
Receiver electrode
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IQ Switch®
ProxSense® Series
2.3 IQS525 - QFN28
22 PD4
23 PD5
24 PD6
25 PD7
26 PB0
27 PGM
28 SW_IN
The IQS525 is available in a QFN(4x4)-28
package. The production version is shown
below.
n/c 1
21 PD3
SDA 2
20 PD2
IQS525
VSS 5
xx xxx
VDDHI 4
xx xxx
xxx xx
SCL 3
19 TX0
18 TX1
17 RX7 / TX2
Figure 2.3
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RX4 / TX5 14
RX3 / TX6 13
RX2 / TX7 12
RX1 / TX8 11
15 RX5 / TX4
RX0 / TX9 10
NRST 7
n/c 9
16 RX6 / TX3
RDY 8
VREG 6
IQS525 QFN Top View
IQS5xx-B000 Trackpad Datasheet
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IQ Switch®
ProxSense® Series
Table 2.3
QFN28 Pin-out
Pin
Name
Description
1
n/c
~
2
SDA
I2C Data
3
SCL
I2C Clock
4
VDDHI
Supply Voltage
5
VSS
Ground Reference
VREG
Internal Regulator
Voltage
6
15
Rx5 /
TX4
Receiver / Transmitter
electrode
16
Rx6 /
TX3
Receiver / Transmitter
electrode
17
Rx7 /
TX2
Receiver / Transmitter
electrode
18
Tx1
Transmitter electrode
19
Tx0
Transmitter electrode
20
PD2
General purpose I/O
21
PD3
General purpose I/O
7
NRST
Reset (active LOW)
22
PD4
General purpose I/O
8
RDY
I2C RDY
23
PD5
General purpose I/O
9
n/c
~
24
PD6
General purpose I/O
10
Rx0
Receiver electrode
25
PD7
General purpose I/O
11
Rx1
Receiver electrode
26
PB0
General purpose I/O
12
Rx2
Receiver electrode
27
PGM
Programming Pin
13
Rx3
Receiver electrode
28
SW_IN
14
Rx4
Receiver electrode
Wake-up from suspend
and switch input
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IQ Switch®
ProxSense® Series
3 ProxSense® Module

Sensing
method
(CHARGE_TYPE):
projected capacitive or self capacitive.
The IQS5xx contains a ProxSense® module
that uses patented technology to measure and
process the capacitive sensor data. The
trackpad sensors are scanned one Tx
transmitter at a time, until all have completed,
with all enabled Rxs charging in each Tx time
slot. The channel outputs (proximity, touch
and snap) are the primary outputs from the
sensors. These are processed further to
provide secondary trackpad outputs that
include finger position, finger size as well as
on-chip gesture recognition.

Sensors: which Rxs (RX_GROUP / ALP Rx
select) / Txs (ALP Tx select) are active
during conversions.

Reverse sensing: If enabled, negative
deviations can also trigger proximity
detection (PROX_REVERSE).

Count value filtering: gives reliable
proximity detection in noisy environments.

Single channel: since the alternate channel
is processed as only a single channel,
much less processing is done, allowing for
lower overall power consumption.
The additional snap state is a unique sensor
output that utilises capacitive technology to
sense the depression of a metal dome snap
button onto the customized sensor area. This
gives an additional output above the traditional
proximity and touch channel outputs.
Since all Rxs return a count measurement, it
means that the ALP channel can be a
combination of numerous measurements. To
reduce processing time (and this decrease
current consumption) the measurements are
For more information on capacitive sensing added together, and processed as a single
and charge transfers, please refer to the „channel‟.
Azoteq Application Note AZD004.
3.3 Count Value
For more information regarding design
guidelines refer to the Application Note The capacitive sensing measurement returns
a count value for each channel. Count values
AZD068.
are inversely proportional to capacitance, and
3.1 Channel Definition
all outputs are derived from this them.
A channel for a projected capacitive sensor 3.3.1 Trackpad Count Values
consists of a Tx electrode that is in close
The individual trackpad channel count values
proximity to an Rx electrode.
(Count values) are unfiltered.
On a trackpad sensor (typically a diamond
shape pattern), each intersection of an Rx and 3.3.2 ALP Count Values
Tx row/column forms a capacitive sensing The combined count value (ALP count value)
element which is referred to as a channel. used for this channel is a summation of the
Each channel has an associated count value, individual count values (ALP individual count
reference value, proximity, touch and snap (if values) from each active Rx.
enabled) status. The maximum number of Tx
and Rx electrodes on the IQS550 device is A count value filter is implemented on this
channel to give stable proximity output for
15x10, thus giving 150 channels in total.
system wake-up from a low-power mode. It is
3.2 Alternate Low-Power
recommended to leave this count filter
enabled (ALP_COUNT_FILTER).
Channel (ALP)
If lower power consumption is required (ALP),
LP1 and LP2 can be configured to utilise a
single custom channel sensor, instead of
sensing the trackpad channels. This channel
has a lot of setup flexibility:
Copyright © Azoteq (Pty) Ltd
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The amount of filtering can be modified (ALP
count beta) if required. This beta is used as
follows to determine the damping factor of the
filter:
Count damping factor = Beta / 256
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If the beta is small, the filtering is stronger, 3.4.2 ALP Long-Term Average
and if the beta is larger, the filtering is weaker.
The ALP channel does not have a snapshot
3.3.3 Max Count
reference value as used on the trackpad, but
utilises a filtered long-term average value
Each channel is limited to having a count
(ALP LTA value).
The LTA tracks the
value smaller than the configurable limit (Max
environment closely for accurate comparisons
count limit). If the ATI setting or hardware
to the measured count value, to allow for small
causes measured count values higher than
proximity deviations to be sensed. The speed
this, the conversion will be stopped, and a
of LTA tracking can be adjusted with the ALP
value of „0‟ will be read for that relevant count
LTA beta. There is an ALP1 and ALP2, which
value. Note that a „0‟ is also returned for a
are implemented in LP1 and LP2 respectively.
disabled channel.
This is to allow different settings for different
3.3.4 Delta Value
report rates, so that the LTA tracking rate can
remain the same.
The delta values (Delta values) are simply:
3.4.3 Reseed
Delta = Count - Reference
3.4 Reference Value
User interaction is detected by comparing
count values to reference values. The count
value
of
a
sensor
represents
the
instantaneous capacitance of the sensor. The
reference value of a sensor is the count value
of the sensor that is slowly updated to track
changes in the environment, and is not
updated during user interaction.
The reference value is a two-cycle averaged
of the count value, stored during a time of no
user activity, and thus is a non-affected
reference. The trackpad reference values are
only updated from LP1 and LP2 mode when
modes are managed automatically. Thus, if
the system is controlled manually, the
reference must also be managed and updated
manually by the host.
3.4.1 Reference Update Time
Since the Reference (or LTA for ALP channel)
is critical for the device to operate correctly,
there could be known events or situations
which would call for a manual reseed. A
reseed takes the latest measured counts, and
seeds the reference/LTA with this value,
therefore updating the value to the latest
environment. A reseed command can be
given by setting the corresponding bit
(RESEED or ALP_RESEED).
3.5 Channel Outputs
For the trackpad channels, user interaction
typically causes the count values to increase.
The amount of deviation relative to the
reference can be used to determine the output
state of the channel, dependent on the
sensitivities configured.
For a snap actuation, the count values
decrease, and a negative deviation cause a
snap output.
The reference value is updated or refreshed
If the measured count value exceeds the
according
to
a
configurable
interval
selected threshold value for consecutive
(Reference update time), in seconds.
cycles, equal in number to the selectable
To ensure that the reference value is not debounce parameter, the output becomes set.
updated during user interaction, it only
3.5.1 Proximity
executes from the LP1 and LP2 states, where
This output (Prox status) is set when a
no user interaction is assumed.
channels‟ count value deviates from the
Setting the Reference update time to „0‟ will
reference value by more than the selected
disable the updating of the reference values.
threshold (Prox threshold).
The proximity threshold is the smallest
difference between the count value and the
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reference value that would result in a proximity pattern. The design must be configured so
output. Small threshold values are thus more that a snap on the metal dome will result in a
sensitive than large threshold values.
channels‟ count value falling well below the
Note: For the trackpad channels (projected reference for that channel.
capacitive) the samples will increase with user
interaction, thus the actual threshold is the reference
value PLUS the threshold parameter.
However, if an ALP channel is implemented in self
capacitive mode, the samples will decrease during
user interaction, thus the actual threshold is the
reference value MINUS the threshold parameter.
If required, the function must be enabled
(Snap enabled channels) for each channel on
which snap is designed. Only channels with
snap must be marked as such, since channels
are handled differently if they are snap
channels, compared to non-snap channels.
3.5.2 Touch
One global snap threshold (Snap threshold) is
implemented as a delta value BELOW the
This output (Touch status) is set when a
reference. When a snap is performed, a
channels‟ count value increases by more than
sensor saturation effect causes the deviation
the selected threshold.
to be negative.
The touch threshold for a specific channel is
Because it is only necessary to read the
calculated as follows:
individual snap registers if a state change has
Threshold = Reference x (1 + Multiplier / 128) occurred, a status bit (SNAP_TOGGLE) is
added to indicate this. This is only set when
A smaller fraction will thus be a more sensitive
there is a change of status of any snap
threshold.
channel.
A trackpad will have optimal XY data if all of
A reseed is executed if a snap is sensed for
the channels in the trackpad exhibit similar
longer than the Snap timeout time (in
deltas under similar user inputs. In such a
seconds). A setting of 0 will never reseed.
case all of the channels will have identical
The timeout is reset if any snap is set or
thresholds. In practise, sensor design and
cleared.
hardware restrictions could cause deltas
which are not constant over the entire 3.5.4 Output Debounce
trackpad. It could then be required to select
All the channel outputs (proximity, touch and
individual multiplier values. These (Individual
snap) are debounced according to the
touch multiplier adjustment) are signed 8-bit
selectable debounce values (Prox debounce /
values and indicate how much the unsigned 8Touch snap debounce). Note that a debounce
bit global value (Global touch multiplier) must
value of 1 means that two samples satisfying
be adjusted. The threshold used for a specific
the condition must be met consecutively
channel (set and clear) is as follows:
before the output is activated. The default
touch debounce is set to 0 / no debouncing.
Multiplier = Global + Individual adjust
This is due to the fact that with a 15x10
A hysteresis can also be implemented
sensor, debouncing adds too much delay, and
because there are different touch multiplier
fast movements on the touch panel cannot be
parameters for setting a touch and clearing a
debounced fast enough to provide reliable XY
touch. This hysteresis allows the channels to
output data.
not flicker in and out of touch with noise.
3.5.5 Maximum Touch
3.5.3 Snap
An additional output is provided (Max Touch),
When adding a metal snap-dome overlay to
and indicates the column and row of the
the trackpad pattern, an additional snap output
channel with the largest touch deviation. This
(Snap status) is available. The device is able
is usually only utilised when implementing
to distinguish between a normal „touch‟ on the
discrete buttons, to reject any adjacent keys if
overlay and an actual button „snap‟, which
they are located in close proximity to each
depresses the metal dome onto the Rx/Tx
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IQS5xx-B000 Trackpad Datasheet
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IQ Switch®
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other. If the Rxs and Txs are switched
(SWITCH_XY_AXIS), the columns are the Txs,
and the rows are the Rxs. If no touches are
seen, then this will output 0xFF.
3.6 Auto Tuning (ATI)
The ATI is a sophisticated technology
implemented in the new ProxSense® devices
to allow optimal performance of the devices
for a wide range of sensing electrode
capacitances, without modification to external
components. The ATI settings allow tuning of
two parameters, ATI C Multiplier and ATI
Compensation, to adjust the sample value for
an attached sensing electrode.
The ATI routine will run for the channels of the
current mode, for example, if the system is
currently sensing the alternate low-power
channel, the auto ATI will apply to it, similarly
the algorithm will configure the trackpad
channels if they are currently active.
The ALP channel has individual compensation
values (ALP ATI compensation) for each
enabled Rx.
The ALP ATI target value applies to each of
the individual count values configured for the
ALP channel.
Note: This routine will only execute after the
communication window is terminated, and the
2
For detailed information regarding the on-chip I C communication will only resume again
ATI technology, please refer to AZD027 and once the ATI routine has completed.
AZD061.
3.7 Automatic Re-ATI
The main advantage of the ATI is to balance
3.7.1 Description
out small variations between trackpad
hardware and IQS5xx variation, to give similar When enabled (REATI or ALP_REATI) the ATI
algorithm will be repeated if certain conditions
performance across devices.
are met. One of the most important features
3.6.1 ATI C Multiplier
of the Re-ATI is that it allows easy and fast
All trackpad channels can be adjusted globally recovery from an incorrect ATI, such as when
by modifying the global parameter (Global ATI performing ATI during user interaction with the
C).
sensor. This could cause the wrong ATI
Compensation to be configured, since the
Although it is recommended to keep the same
user affects the capacitance of the sensor. A
ATI C value for all trackpad channels, if
Re-ATI would correct this.
different values are required (possibly for
different trackpads), individual adjustments When a Re-ATI is performed on the IQS5xx, a
can be made. The ATI C value for each status bit will set momentarily to indicate that
channel can be adjusted using 8-bit signed this has occurred (REATI_OCCURRED /
values (ATI C individual adjust) as follows:
ALP_REATI_OCCURRED).
ATI C = Global + Individual Adjust
3.7.2 Conditions for Re-ATI to activate
The ALP channel has its own global ATI C 1. Reference drift
parameter (ALP ATI C).
A Re-ATI is performed when the reference of
a channel drifts outside of the acceptable
3.6.2 ATI Compensation & Auto ATI
range around the ATI Target.
The ATI Compensation value for each channel
(ATI compensation) is set by means of an The boundaries where Re-ATI occurs for the
automated ATI procedure. The algorithm is trackpad channels and for the ALP channels
executed after the AUTO_ATI bit is set. The are independently set via the drift threshold
ATI Compensation values are chosen so that value (Reference drift limit / ALP LTA drift
each count value is close to the selected limit). The Re-ATI boundaries are calculated
from the delta value as follows:
target value (ATI target / ALP ATI target).
The AUTO_ATI bit clears automatically on chip
when the algorithm has completed.
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Re-ATI Boundary = ATI target ± Drift limit
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IQ Switch®
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For example, assume that the ATI target is  Count is already outside the Re-ATI range
configured to 800 and that the reference drift
upon completion of the ATI algorithm.
value is set to 50. If Re-ATI is enabled, the
If any of these conditions are met, the
ATI algorithm will be repeated under the
corresponding error flag will be set
following conditions:
(ATI_ERROR / ALP_ATI_ERROR). The flag
Reference > 850 or
status is only updated again when a new ATI
algorithm is performed.
Reference < 750
The ATI algorithm executes in a short time, so Re-ATI will not be repeated immediately if
an ATI Error occurs. A configurable time
goes unnoticed by the user.
(Re-ATI retry time) will pass where the Re-ATI
2. Very large count values
is momentarily suppressed. This is to prevent
The configurable Max count limit is used to the Re-ATI repeating indefinitely. An ATI error
sense for unexpectedly large count values. A should however not occur under normal
Re-ATI is triggered if the max count limit is circumstances.
exceeded for 15 consecutive cycles.
3.7.4 Design requirements
This limit is configured to be a value higher The Re-ATI can be very useful when ATI
than the maximum count possible through parameters are selected for which successful
user interaction, plus worst case noise on the Re-ATI operation can be expected. With the
count value, plus headroom. The monitoring conditions for Re-ATI mentioned above, it is
of this assists in correcting for a Re-ATI which clear that when the designer sets the ATI
occurred during a snap press. If this does parameters, it is beneficial to select the ATI C
occur, after removing the snap, the counts are and ATI Target so that the resulting ATI
typically very high. If this was not monitored a Compensation values are near the centre of
stuck touch could occur.
the range. This ensures that with changing
sensitivity, the ATI Compensation has the
3. Decreased count value
ability to increase/decrease in value without it
A considerable decrease in the count value of easily becoming 0 or 255. In general, ATI
a non-snap channel is abnormal, since user Compensation values between 100 and 150
interaction increases the count value. are desirable as they provide ample room for
Therefore if a decrease larger than the adjustment. Note that the range is dependent
configurable threshold (Minimum count Re- on the sensitivity requirements, and on the
ATI delta) is seen on such a channel, it is capacitance of the sensor.
closely monitored. If this is continuously seen
for 15 cycles, it will trigger a Re-ATI. If the 3.8 Sensing Hardware Settings
channel is a snap channel, this decrease is Settings specific to the ProxSense® Module
allowed since snap does cause count values charge transfer characteristics can be
to decrease.
changed.
3.7.3 ATI Error
The charge transfer frequency (fcc) can be
After the ATI algorithm is performed, a check calculated as:
is done to see if there was any error with the
16.106
𝑓𝑐𝑐 =
[Hz]
7−𝐶𝐾_𝐹𝑅𝐸𝑄
algorithm. An ATI error is reported if one of
(2
× (2 + 𝑈𝑃 + 𝑃𝐴𝑆𝑆 + 𝐼𝑁𝐶_𝑃𝐻𝐴𝑆𝐸)
the following is true for any channel after the where
ATI has completed:
𝑈𝑃 = 2(𝑈𝑃𝐿𝐸𝑁 −2) (if UPLEN > 4)
 ATI Compensation <= ReATI lower
𝑈𝑃 = 𝑈𝑃𝐿𝐸𝑁 (if UPLEN ≤ 4)
compensation limit

ATI Compensation
compensation limit
Copyright © Azoteq (Pty) Ltd
All Rights Reserved.
>=
ReATI
upper
𝑃𝐴𝑆𝑆 = 2(𝑃𝐴𝑆𝑆𝐿𝐸𝑁 −2)
𝑃𝐴𝑆𝑆 = 𝑃𝐴𝑆𝑆𝐿𝐸𝑁
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(if PASSLEN > 4)
(if PASSLEN ≤ 4)
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IQ Switch®
ProxSense® Series
Note: CK_FREQ, UPLEN and PASSLEN are the
numerical values of the settings.
4 Sensing Modes
The IQS5xx automatically switches between
different charging modes dependent on user
16.106
interaction and other aspects. This is to allow
𝑓𝑐𝑐 =
= 1.77𝑀𝐻𝑧 for fast response, and also low power
7−7
(2
× (2 + 4 + 3 + 0)
consumption when applicable. The current
The other hardware parameters are not mode can be read from the device
discussed as they should only be adjusted (CHARGING_MODE).
under guidance of Azoteq support engineers.
The modes are best illustrated by means of
the following state diagram.
For example, the default frequency is:
Fing
dde
er a
p
Sna
m
d/re
adde
Mo v
e
o ve d
d/rem
o ve d
t de
me n
(th
Movement: reset timer
tecte
d
ut
Timeo touch)
tionary
us sta
Idle-Touch
Mode
Sensing:
Trackpad
Timeout
Action: reseed trackpad
No touch
Touch or snap
Active
Mode
No Touch and no snap
Sensing:
Trackpad
Idle
Mode
Sensing:
Trackpad
da
up
ce
en
et
e
ef
er
m
pl
lR
co
na
Pr
o
x
Up
da
te
io
as
O
cc
Update complete
LP2
Occasional Reference update
LP1 and LP2:
These can be either the trackpad
(only prox processing is done) or an
alternative LP channel setup
(flexible)
Prox
Timeout
Action: reseed LP channel (trackpad / ALP)
te
These modes are always the
trackpad channels sensing. Prox,
touch and snap are processed.
LP1
Sensing:
Trackpad or
customisable
ALP channel
Timeout
Figure 4.1
Sensing:
Trackpad or
customisable
ALP channel
System Mode State Diagram
rate, and the other modes are configured
according to the power budget of the design,
The report rate for each mode can be adjusted and the expected response time.
as required by the design. A faster report rate
will have a higher current consumption, but The report rate is configured by selecting the
will give faster response to user interaction. cycle time (in milliseconds) for each mode:
Active mode typically has the fastest report
4.1 Report Rate
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IQ Switch®
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
Report rate Active mode

Report rate Idle touch mode

Report rate Idle mode

Report rate LP1 mode
5 Trackpad

Report rate LP2 mode
5.1 Configuration
4.1.1 Previous Cycle Time
5.1.1 Size Selection
The achieved report rate can be read
(Previous cycle time) from the device each
cycle; this is the previous cycles‟ length in
milliseconds.
If the desired rate is not
achievable, that is, if processing and sensing
takes longer than the specified time, a status
flag (RR_MISSED) indicates that the rate could
not be achieved.
The total number of Rx and Tx channels used
for trackpad purposes must be configured
(Total Rx / Total Tx). This gives a rectangular
area of channels, formed by rows and
columns of Rx and Tx sensors.
The default method allows the IQS5xx to
automatically switch between modes and
update reference values as shown in Figure
4.1. This requires no interaction from the
master to manage the IQS5xx.
Rx Mapping = {3, 0, 8, 1, 2}
reference values by reseeding (RESEED) or
manually writing to the reference registers
(Reference values).
5.1.2 Individual Channel Disabling
If the sensor is not a completed rectangle (this
could be due to board cut-outs or trackpad
4.2 Mode Timeout
shape), channels not implemented but falling
The timeout values can be configured, and within the Total Rx / Total Tx rectangle, must
once these times have elapsed, the system be individually disabled (Active channels).
will change to the next state according to the 5.1.3 Rx / Tx Mapping
state diagram.
The Rxs and Txs of the trackpad can be
These times are adjusted by selecting a assigned to the trackpad in any order to
desired value (in seconds), for the specific simplify PCB layout and design. Rxs and Txs
timeout:
can however not be interchanged (for example
you cannot use both Rxs and Txs for the
 Timeout - Active mode
columns of the trackpad).
 Timeout - Idle touch mode
For both the mapping registers (Rx mapping /
 Timeout - Idle mode
Tx mapping) the first byte relates to the
mapping of the first row/column, the next byte
 Timeout - LP1 mode
in the memory map is the next row/column,
Note: the timeout for LP1 is set in multiples of and so on.
20s (thus a setting of ‘30’ translates to 600s,
Example: If a 5x5 trackpad was to be
or 10min).
designed with Rx/Tx mapping to columns and
A timeout value of 255 will result in a „never‟ rows as shown in Table 5.1, the Rx and Tx
timeout condition.
mapping registers would need to be set as
follows:
4.3 Manual Control
Tx Mapping = {0, 1, 13, 12, 11}
Each value shown here is a byte in the
memory map. The rest of the mapping bytes
are „don‟t care‟ since they are not used.
The master can manage various states and
implement custom power modes when Manual
Control is enabled (MANUAL_CONTROL). The
master needs to control the mode
(MODE_SELECT), and also manage the
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IQ Switch®
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Table 5.1
Mapping Example
Column number
(mapped Rx)
Row
number
(mapped Tx)
0
(Rx3)
1
(Rx0)
2
(Rx8)
3
(Rx1)
4
(Rx2)
For all the multi-touch inputs, the absolute
finger position (Absolute X/Y), in the selected
resolution (Resolution X/Y) of the trackpad, is
available.
5.2.4 Touch Strength
This value (Touch strength) indicates the
strength of the touch by giving a sum of all the
deltas associated with the finger, and
therefore varies according to the sensitivity
setup of the sensors.
0 (Tx0)
1 (Tx1)
2 (Tx13)
5.2.3 Absolute XY
5x5
Trackpad
5.2.5 Area
3 (Tx12)
The number of channels associated with a
finger is provided here. This area is usually
equal to or smaller than the number of touch
channels under the finger.
4 (Tx11)
5.1.4 Rx / Tx Selections
On the IQS525 and IQS572, some Rxs can be
configured to take on Tx functionality. The
preferred option is to keep them as Rxs, but if
more Txs are needed in the design, they can
be configured as such in the RxToTx register.
This allows for elongated trackpads or sliders
to be implemented on the two devices. The
corresponding Rx or Tx number is then used
in the mapping registers to configure the order
of the electrodes.
5.2.6 Tracking / Identification
The fingers are tracked from one cycle to the
next, and the same finger will be located in the
same position in the memory map. The
memory location thus identifies the finger.
5.3 Max Number of Multi-touches
The maximum number of allowed multitouches is configurable (Max multi-touches)
up to 5 points. If more than the selected value
5.2 Trackpad Outputs
is sensed, a flag is set (TOO_MANY_FINGERS)
The channel count variation (deltas) and touch and the XY data is cleared.
status outputs are used to calculate finger
5.4 XY Resolution
location data.
The output resolution for the X and Y
5.2.1 Number of Fingers
coordinates are configurable (X/Y Resolution).
This gives an indication of the number of The on-chip algorithms use 256 points
active finger inputs on the trackpad (Number between each row and column.
The
of fingers).
resolution is defined as the total X and total Y
output range across the complete trackpad.
5.2.2 Relative XY
If there is only one finger active, a Relative X
and Relative Y value is available. This is a
signed 2‟s complement 16-bit value. It is a
delta of the change in X and Y, in the scale of
the selected output resolution.
5.5 Palm Rejection
A maximum finger size/area (Palm reject
threshold) can be set up to allow for palm
rejection or similar input suppression. This
feature can be enabled or disabled
Note: Gestures also use these registers to (PALM_REJECT), and when a palm reject
condition is sensed, a status flag will indicate
indicate swipe, scroll and zoom parameters.
this result (PALM_DETECT). All XY outputs
are also suppressed during palm detection.
Palm reject is latched on for the timeout period
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IQ Switch®
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(Palm reject timeout) to prevent erratic 5.9 XY Position Filtering
behaviour before and after the palm is seen.
Stable XY position data is available from the
This timeout sets in increments of 32ms.
IQS5xx due to two on-chip filters, namely the
5.6 Stationary Touch
Moving Average (MAV) filter, and the Infinite
Impulse Response (IIR) filter. The filters are
A stationary touch is defined as a point that
applied to the raw positional data in the
does not move outside of a certain boundary
aforementioned order. It is recommended to
within a specific time.
This movement
keep both of the filters enabled for optimal XY
boundary or threshold can be configured
data.
(Stationary touch movement threshold), and is
defined as a movement in either X or Y in the 5.9.1 MAV Filter
configured resolution.
If enabled (MAV_FILTER), raw XY points from
The device will switch to Idle-Touch mode the last two cycles are averaged to give the
when a stationary point is detected, where a filter output.
lower duty cycle can be implemented to save
5.9.2 IIR Filter
power in applications where long touches are
expected.
The IIR filter, if enabled (IIR_FILTER), can be
configured to select between a dynamic and a
If movement is detected, a status flag
static filter (IIR_SELECT).
(TP_MOVEMENT) is set.
The damping factor is calculated from the
5.7 Multi-touch Finger Split
selected Beta as follows:
The position algorithm looks at areas
Damping factor = Beta / 256
(polygons) of touches, and calculates
positional data from this. Two fingers in close 5.9.2.1 Dynamic Filter
proximity to each other could have areas Relative to the speed of movement of a cotouching, which would merge them incorrectly ordinate, the filter dynamically adjusts the
into a single point. A finger split algorithm is amount of filtering (damping factor) performed.
implemented to separate these merged When fast movement is detected, and quick
polygons into multiple fingers. There is a response is required, less filtering is done.
finger split aggression factor which can be Similarly when a co-ordinate is stationary or
adjusted to determine how aggressive this moving at a slower speed, more filtering can
finger splitting must be implemented. A value be applied.
of „0‟ will not split polygons, and thus merge
any fingers with touch channels adjacent The damping factor is adjusted depending on
the speed of movement. Three of these
(diagonally also) to each other.
parameters are adjustable to fine-tune the
5.8 XY Output Flip & Switch
dynamic filter if required (XY dynamic bottom
By default, X positions are calculated from the beta / XY dynamic lower speed / XY dynamic
first column (usually Rx0) to the last column. upper speed).
Y positions are by default calculated from the The speed is defined as the distance (in the
first row (usually Tx0) to the last row. The X selected resolution) travelled in one cycle
and/or Y output can be flipped (FLIP_X / (pixels/cycle).
FLIP_Y), to allow the [0, 0] co-ordinate to be
defined as desired. The X and Y axes can
also be switched (SWITCH_XY_AXIS) allowing
X to be the Txs, and Y to be along the Rxs.
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IQ Switch®
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All gestures are calculated relative to their
starting coordinates, i.e., the first coordinate at
which the touch was detected. Furthermore, if
at any time during a gesture, more than the
required number of touches is detected, the
gesture will be invalidated.
No filtering
Filter damping
factor (beta)
Lower Beta
(more filtering)
6.1 Single Tap
Top Speed
Bottom Speed
Speed of
movement
Figure 5.1
Dynamic Filter Parameters
5.9.2.2 Static Filter
The single tap gesture requires that a touch is
made and released in the same location and
within a short period of time. Some small
amount of movement from the initial
coordinate must be allowed to compensate for
shift in the finger coordinate during the
release. This bound is defined in register Tap
distance, which specifies the maximum
deviation in pixels the touch is allowed to
move before a single tap gesture is no longer
valid.
Co-ordinates filtered with a fixed but
configurable damping factor (XY static beta)
are obtained when using the static filter. It is
recommended that the dynamic filter is used
due to the advantages of a dynamically
Similarly, the Tap time register defines the
changing damping value.
maximum duration in ms that will result in a
valid gesture. That is, the touch should be
6 Gestures
released before the time period in Tap time is
The IQS5xx has an on-chip gesture reached.
recognition feature. The list of recognisable A valid single tap gesture will be reported
gestures includes:
(SINGLE_TAP) in the same processing cycle
 1 finger gestures (GESTURE_EVENTS_0): as the touch release was detected, and will be
cleared on the next cycle. No movement will
o A single tap
be reported in the relative XY registers
(Relative X and Relative Y) during this
o A press and hold
gesture.
o Swipe X+
Since the gesture reports after the finger is
o Swipe Xremoved, the location of the tap gesture is
placed in the Absolute X/Y registers of finger 1
o Swipe Y+
at this time. With Number of fingers set to 0,
o Swipe Ythis will not look like an active finger, and is
 2 finger gestures (GESTURE_EVENTS_1): just a repetition of the location of the tap that
has occurred for the main controller to utilise.
o 2 simultaneous taps
o Scroll
6.2 Press and Hold
The same register that defines the bounds for
the single tap gesture (Tap distance) is used
Each single finger gesture can individually be for the press and hold gesture. If the touch
enabled and disabled by setting or clearing deviates more than the specified distance, the
the corresponding bits in the register gesture is no longer valid.
SINGLE_FINGER_GESTURES. The multi finger
gestures can be enabled and disabled via the However, if the touch remains within the given
bound for longer that the period in ms, defined
register MULTI_FINGER_GESTURES.
as the sum of the register values in Tap time
and Hold time, a press and hold gesture will
o Zoom
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IQ Switch®
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be reported (PRESS_AND_HOLD).
The
gesture will continue to be reported until the
touch is released or if a second touch is
registered.
No data will be reported in Relative X and
Relative Y before the defined maximum hold
period is reached, however, the relative data
will be reported thereafter. This allows for
features such as drag-n-drop.
6.3 Swipe (X-, X+, Y-, Y+)
All four swipe gestures work in the same
manner, and are only differentiated in their
direction. The direction is defined with respect
to the origin (0, 0) of the trackpad, typically at
Rx0, Tx0 (Channel 0). If the touch is moving
away from the origin, it is considered a
positive swipe (+) and if it is moving towards
the origin, it is a negative swipe (-). Whether
the swipe is of the type X or Y is defined by
which axis the touch is moving approximately
parallel to.
[pixels] and Swipe consecutive time [ms].
Once the initial swipe gesture conditions are
met as defined above, the parameters of
Swipe initial distance [pixels] and Swipe initial
time [ms] will be replaced with these. Also,
the gesture engine will reset its properties,
thus evaluating the current touch‟s movement
as if its initial coordinate was at the point at
which the previous swipe gesture was
recognised and as if it first occurred at that
point in time.
The consecutive events allow for the
continuous stream of swipe events for a single
action by the user. However, once the initial
conditions are satisfied, the direction of the
swipe gesture is fixed. For example, if a
swipe X+ gesture is recognised by the engine,
the consecutive swipe gestures will also be of
type X+. And the 3rd condition will only be
evaluated against the X axis.
In the case that only a single event is desired,
the settings in Swipe consecutive distance can
A swipe gesture event is only reported when a be set to its maximum value and Swipe
moving touch meets all three of the following consecutive time set to zero. This would
make it impossible to meet these conditions
conditions:
on a standard trackpad.
1. A minimum distance is travelled from its
initial coordinates, as defined in pixels by 6.4 2 Finger Tap
the value in register Swipe initial distance.
The simultaneous tap gesture simply requires
2. The distance in (1) is covered within the two tap gestures to occur simultaneously. For
time specified in Swipe initial time (in ms). this reason the gesture uses the same
3. The angle of the swipe gesture, as parameters (Tap distance and Tap time) as
determined by its starting coordinate and that of the tap gesture. It is also confined to
the coordinate at which conditions (1) and the same conditions for the output to be
(2) were first met, does not exceed the reported (2_FINGER_TAP).
threshold in Swipe angle with regards to at 6.5 Scroll
least 1 of the axes. The value in register
Swipe angle is calculated as 64 tan 𝜃, A scroll gesture is identified by two
where 𝜃 is the desired angle (in degrees). simultaneous and parallel moving touches. A
scroll gesture will be reported (SCROLL) once
The respective swipe gesture will be reported the average distance travelled by the two
for 1 cycle (SWIPE_X-, X+, Y- Y+) when all of touches in pixels exceeds the value stored in
these conditions are met.
The relative register Scroll initial distance. Thereafter, a
distance travelled will be reported in registers scroll gesture will continuously be reported
Relative X and Relative Y throughout.
until one of the touches is released or if a
It is also possible to generate consecutive zoom gesture is validated.
swipe gesture events during the same swipe Similar to the swipe gestures, the scroll
gesture by defining the swipe gesture settings gestures are also bounded by a given angle to
in registers Swipe consecutive distance the axis (Scroll angle). The value in this
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IQ Switch®
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register is calculated as 64 tan 𝜃, where 𝜃 is
the desired angle (in degrees). This condition
is only enforced during the initial validation
stage of the scroll gesture.
can be made and validated. However, for the
scroll and zoom gestures, it is possible to
alternate between the gestures and their
directions without releasing any touches.
The direction of the scroll gesture is defined
by the reported relative X (horizontal scroll)
and Y (vertical scroll) data. For instance, a
positive relative X value will correspond with
the direction of a swipe X+ gesture. Unlike
the swipe gestures, a scroll gesture may
alternate between a positive and negative
direction without requiring the validation of the
initial conditions. However, switching between
the axes will require the validation.
A switch
includes
At any given stage during a scroll gesture,
only the axis applicable to the gesture will
have a non-zero value in its relative data
register. For example, a scroll parallel to the
X-axis will have a non-zero Relative X value
and a zero Relative Y value. This value
relates to the movement of the scroll gesture.
6.6 Zoom
Zoom gestures require two touches moving
toward (zoom out) or away (zoom in) from
each other. Similar to the scroll and swipe
gestures, the zoom requires that an initial
distance threshold in the register Zoom initial
distance [pixels] is exceeded before a zoom
gesture is reported (ZOOM). Thereafter, the
register Zoom Consecutive Distance defines
the distance threshold for each zoom event
that follows the initial event. The direction/axis
along which the two touches move is not
relevant.
between
multi-touch
gestures

Alternating between scroll axes

Alternating between zoom in and out

Going from a scroll to a zoom gesture

Going from a zoom to a scroll gesture

Releasing any one of the two touches

Having more than 2 touches on the
trackpad at any given moment.
A release of 1 of the touches will require a
new touch be generated before any multitouch gesture can be validated. The multitouch gestures require 2, and only 2, touches
at all time during the gesture.
7 Additional Features
7.1 Non-volatile Defaults
The designer can use the supplied GUI to
easily configure the optimal settings for
different setups. The design specific firmware
is then exported by the GUI, and programmed
onto the IQS5xx. These parameters are used
as the default values after start-up, without
requiring any setup from the master.
Two registers (Export file version number) are
available so that the designer can label and
identify the exported HEX file with the
Switching from a zoom in to a zoom out
corresponding settings.
This allows the
gesture, or vice versa, requires that the initial
master to verify if the device firmware has the
conditions be met in the opposite direction
intended configuration as required.
before the switch can occur.
Alternating
between a zoom and a scroll gesture requires 7.2 Automated Start-up
the same.
The IQS5xx is programmed with the trackpad
The size of each zoom event will be reported application firmware, bundled with settings
in Relative X, where the negative sign specifically configured for the current
indicates a zoom out gesture and a positive hardware as described in Section 7.1. After
sign a zoom in gesture.
power-up the IQS5xx will automatically use
the settings and configure the device
6.7 Switching Between Gestures
accordingly.
For all single finger gestures it is necessary to
release all touches before any new gesture
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7.3 Suspend
7.5 Watchdog Timer (WDT)
The IQS5xx can be placed into a suspended
state (SUSPEND).
No processing is
performed, minimal power is consumed
(<1uA), and the device retains existing data.
A watchdog timer is implemented to prevent
any stuck conditions which could occur from
ESD events or similar scenarios.
The
watchdog timeout is set to about 500ms. The
watchdog can be disabled (WDT), however,
An automatic reseed of the trackpad is
this needs to be programmed into the nontriggered after the IQS5xx is woken from
volatile defaults, since this only takes effect
suspend, since it cannot be guaranteed that
after a reset.
the reference values are still relevant.
7.3.1 I2C Wake
7.6 RF Immunity
The device can be woken from suspend by
addressing it on the I2C bus. It will respond
with a not-acknowledge (NACK) on the first
addressing attempt and with an acknowledge
(ACK) on the second addressing attempt,
providing that there was at least a time
difference of ~150us between the two
addressing attempts. The suspend bit must
then be disabled in that communication
session to resume operations.
The IQS5xx has immunity to high power RF
noise. To improve the RF immunity, extra
decoupling capacitors are suggested on VREG
and VDDHI.
7.3.2 Switch Input Pin Wake
The SW_IN input pin can be used to wake the
device from suspend (when enabled). The
input can be connected to an alternate longrange proximity sensing IC (such as IQS211),
or a mechanical switch/button for example.
For more details on the input see Section
7.11.
7.4 Reset
Place a 100pF in parallel with the 1uF ceramic
on VREG. Place a 1uF ceramic on VDDHI. All
decoupling capacitors should be placed as
close as possible to the VDDHI and VREG pads.
PCB ground planes also improve noise
immunity.
7.7 Additional Non-Trackpad
Channels
Unused projected capacitance channels can
be used to design additional buttons or sliders.
Note that the channels will still provide XY
data output, which can be ignored (or utilised)
by the master.
7.8 Bootloader
7.4.1 Reset Indication
A bootloader is included to allow easy
application firmware upgrading via the I2C
After a reset, the SHOW_RESET bit will be set
bus, without the need to access the PGM and
by the system to indicate the reset event
NRST pins for reprogramming.
occurred. This bit will clear when the master
sets the ACK_RESET, if it becomes set again, For more information, refer to the
the master will know a reset has occurred, and documentation “IQS5xx I2C Bootloader v2.x
Technical User Guide.pdf”.
can react appropriately.
7.8.1 Bootloader Status
7.4.2 Software Reset
2
The IQS5xx can be reset by means of an I C The bootloader status register can be used to
confirm the availability/presence of the
command (RESET).
bootloader (Bootloader status).
7.4.3 Hardware Reset
The NRST pin (active low) can be used to
reset the IQS5xx. For more details see
Section 10.2.6.
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IQ Switch®
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Table 7.1
Bootloader Status
Register value
Status
0xA5
Bootloader is available
0xEE
No bootloader
A change in the state of the SW_IN can also
trigger an event, see Section 8.8.1. This input
can be used as an additional switch or
proximity sensor, and has the ability to wake
the IQS5xx from the extreme (<1uA) low
power suspend state.
8 I2 C
*Note the bootloader is available on the standard
IQS5xx-B000 firmware; this could possibly be
The IQS5xx communicates via the standard
unavailable on custom firmware versions.
I2C communication protocol.
7.9 Version Information
Clock stretching can occur, thus monitoring
the availability of the SCL is required, as per
2
The different IQS5xx devices can be identified standard I C protocol.
by their relevant product numbers.
8.1 Data Ready (RDY)
7.9.1 Product Number
Table 7.2
Product Number
Product Number
(decimal)
Device
40
IQS550
58
IQS572
52
IQS525
An additional RDY I/O indicates (active HIGH)
when the communication window is available
with new data for optimal response. Polling
can however be used, but is not
recommended. RDY should be connected to
an interrupt-on-change input for easier
implementation and optimal response time.
8.2 Slave Address
The default 7-bit device address is „1110100‟.
The device address can be modified during
7.9.2 Project Number
programming. The full address byte will thus
The project number for the generic B000
be 0xE9 (read) or 0xE8 (write).
project is 15 (decimal) for all devices.
7.9.3 Major and Minor Versions
8.3 16-bit Addressing
2
These will vary as the B000 is updated, this The I C employs a 16-bit address to access all
datasheet relates to the version as indicated individual registers in the memory map.
at the bottom of the Overview Section 1.
8.4 I2C Read
7.10 Unique ID
The master can read from the device at the
A 12-byte unique ID can be read from memory current address if the address is already set
map address 0xF000 – 0xF00B. This number up, or when reading from the default address.
Current Address Read
gives each individual IC a unique identifier.
7.11 Switch Input
Start
S
Control Byte
Data n
ACK
Data n+1
ACK
Stop
NACK
S
The SW_IN (switch input) pin, when enabled
Figure 8.1 Current Address Read
(SW_INPUT), will display the state of the input
pin to the master controller (SWITCH_STATE). The master can perform a random read by
This state is updated before each I2C session. specifying the address.
A WRITE is
The input can be configured as active LOW or performed to set up the address, and a
active HIGH (SW_INPUT_SELECT). For active repeated start is used to initiate the READ
LOW, an internal pull-up resistor (typical value section.
of 40kΩ) is connected to the SW_IN pin.
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IQ Switch®
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Control Byte
S
Adr + WRITE
...
Address [7..0]
Address [15..8]
Start
ACK
ADR - high
Start
Control Byte
S
Adr + READ
ACK
ADR - low
Data n
Figure 8.2
the communication window, RDY will go low
and the IQS5xx will continue with a new
sensing and processing cycle.
...
Stop
NACK
ACK
ACK
8.8 Event Mode Communication
P
The device can be set up to bypass the
communication window when no activity is
sensed (EVENT_MODE).
This is usually
enabled since the master does not want to be
interrupted unnecessarily during every cycle if
no activity occurred. The communication will
resume (RDY will indicate available data) if an
enabled event occurs. It is recommended that
the RDY be placed on an interrupt-on-pinchange input on the master.
Random Read
8.4.1 Default Read Address
When a new communication window begins,
the configurable default read address is used
if a current address read is performed (no
address is specified). If an application will
always read from a specific register, the
IQS5xx can be configured to point to the
required register, negating the need to specify 8.8.1 Events
the address at each new communication
Numerous events can be individually enabled
window, allowing for faster data reading.
to trigger communication, they are:
2
8.5 I C Write

Trackpad events (TP_EVENT): event
triggered if there is a change in X/Y value,
or if a finger is added or removed from the
trackpad

Proximity events (PROX_EVENT): event
only triggers if a channel has a change in a
proximity state

Touch events (TOUCH_EVENT): event only
triggers if a channel has a change in a
touch state
If the communication window is not serviced 
within the I2C timeout period (in milliseconds),
the session is ended (RDY goes LOW), and

processing continues as normal. This allows
the system to continue and keep reference
values up to date even if the master is not
responsive.

Snap (SNAP_EVENT): event only triggers if
a channel has a change in a snap state
The master uses a Data Write to write settings
to the device. A 16-bit data address is always
required, followed by the relevant data bytes
to write to the device.
Start
Control Byte
S
Adr + WRITE
Address [15..8]
ACK
ADR - high
Data n
Address [7..0]
ACK
ADR - low
Figure 8.3
ACK
Data n+1
ACK
Stop
ACK
P
Data Write
8.6 I2C Timeout
8.7 End of Communication
Session / Window

Unlike the previous A000 implementation, an
I2C
STOP
will
not
terminate
the
communication window. When all required
I2C transactions have been completed, the
communication session must be terminated
manually. This is achieved by sending the
End Communication Window command, by
writing a single byte (any data) to the address
0xEEEE, followed by a STOP. This will end
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Re-ATI (REATI_EVENT): one cycle is given
to
indicate
the
Re-ATI
occurred
(REATI_OCCURRED).
Proximity on ALP (ALP_PROX_EVENT):
event given on state change
Switch input (SW_INPUT_EVENT): event
triggers if there is a change in the input pin
state.
The proximity/touch/snap events are therefore
mostly aimed at channels that are used for
traditional buttons, where you want to know
only when a status is changed.
8.8.2 Force Communication
The master can initiate communication with
the IQS5xx, even while RDY is LOW. The
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IQ Switch®
ProxSense® Series
IQS5xx will clock stretch until an appropriate before retrying), and the IQS5xx will be ready
time to complete the I2C transaction. The and ACK the transaction.
master firmware will not be affected (as long
Figure 8.4 shows a forced communication
as clock stretching is correctly handled).
transaction. Communication starts with RDY
For optimal program flow, it is suggested that = LOW. The IQS5xx is in a low power state
RDY is used to sync on new data from the on the first request, and a NACK is sent. After
IQS5xx.
The forced method is only the second request the IQS5xx responds with
recommended if the master must perform I2C an ACK. The IQS5xx clock stretches until an
and Event Mode is active.
appropriate time to communicate (to prevent
interference
with
the
capacitive
NOTE: If the IQS5xx is in a low-power state
measurements). When appropriate, the clock
when the master forces the communication,
is released and the transaction completes as
the first addressing will respond with a NACK.
normal. RDY is not set during a forced
The master must repeat the addressing (wait
communication transaction.
2
a minimum of 150us after the I C STOP
Figure 8.4
Forced communication
8.9 Memory Map Registers
The registers available in the memory map,
via I2C, are provided in this section. The
memory map starts with a READ-ONLY
section, followed by a READ/WRITE section.
The read/write permissions are indicated by
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the shading in the „R‟ (read) and/or „W‟ (write)
columns.
Certain registers in the memory map have
defaults loaded from non-volatile memory,
which can be configured during programming;
these are highlighted also in the „E2‟ column.
IQS5xx-B000 Trackpad Datasheet
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IQ Switch®
ProxSense® Series
Table 8.1
Address
Bit7
Bit6
Bit5
Bit4
Direct-Addressable Memory Map
Bit3
Bit2
0x0000 0x0001
Product number (2 bytes)
0x0002 0x0003
Project number (2 bytes)
0x0004
Major version
0x0005
Minor version
0x0006
Bootloader status
0x0007 0x000A
Open (4 bytes)
Bit0
R W E2
(See 7.9)
Max touch row
(See 3.5.5)
Previous cycle time [ms]
0x000C
Details
(See 7.8.1)
Max touch column
0x000B
Bit1
(See 4.1.1)
0x000D
-
-
SWIPE
_Y-
SWIPE
_Y+
SWIPE
_X+
SWIPE
_X-
PRESS
_AND_
HOLD
SINGLE
_TAP
Gesture
Events 0
0x000E
-
-
-
-
-
ZOOM
SCROLL
2_
FINGER_
TAP
Gesture
Events 1
0x000F
SHOW_
RESET
ALP_
REATI_
OCCUR
RED
ALP_
ATI_
ERROR
REATI_
OCCUR
RED
ATI_
ERROR
0x0010
-
-
SWITCH
_STATE
SNAP_
TOGGLE
RR_
MISSED
CHARGING_MODE
TOO_
MANY_
FINGERS
0x0011
Number of fingers
0x0012 0x0013
Relative X [pixels] (2 bytes)
PALM_
DETECT
TP_
MOVEMENT
System Info
0
System Info
1
(See 5.2.1)
(See 5.2.2)
0x0014 0x0015
Relative Y [pixels] (2 bytes)
0x0016 0x0017
Absolute X position [pixels] (2 bytes)
(See 5.2.3)
0x0018 0x0019
Absolute Y position [pixels] (2 bytes)
0x001A 0x001B
Touch strength (2 bytes)
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IQ Switch®
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Address
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Touch area / size
0x001C
Details
R W E2
(See 5.2.5)
Repeat:
0x001D
Absolute X
Absolute Y
Touch strength
Touch area / size
:
0x0038
For fingers 2 - 5
0x0039 0x0058
Prox status (32 bytes)
0x0059 0x0076
Touch status (30 bytes)
0x0077 0x0094
Snap status (30 bytes)
0x0095 0x01C0
Count values (300 bytes)
(See 8.10.5)
(See 8.10.6)
0x01C1 0x02EC
Delta values (300 bytes)
0x02ED 0x02EE
ALP count value (2 bytes)
(See 3.3.2)
0x02EF 0x0302
ALP individual count values (20 bytes)
0x0303 0x042E
Reference values (300 bytes)
(See 8.10.6)
0x042F 0x0430
ALP LTA (2 bytes)
(See 3.4.2)
0x0431
ACK_
RESET
-
AUTO_
ATI
ALP_
RESEED
RESEED
0x0432
-
-
-
-
-
MODE_SELECT
System
Control 0
RESET
System
Control 1
-
0x0433 0x0434
Open (2 bytes)
0x0435 0x043E
ALP ATI compensation (10 bytes)
SUSPEND
(See 3.6.2)
0x043F 0x04D4
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ATI compensation (150 bytes)
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IQ Switch®
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Address
Bit7
Bit6
Bit5
0x04D5 0x56A
Bit4
Bit3
Bit2
Bit1
Bit0
Details
R W E2
ATI C individual adjust (150)
0x056B
-
-
Global ATI C
0x056C
-
-
ALP ATI C
0x056D 0x056E
(See 3.6.1)
ATI target (2 bytes)
(See 3.6.2)
0x056F 0x0570
ALP ATI target (2 bytes)
0x0571
Reference drift limit
0x0572
ALP LTA drift limit
0x0573
Re-ATI lower compensation limit
0x0574
Re-ATI upper compensation limit
0x0575 0x0576
Max count limit (2 bytes)
(See 3.3.3
and 3.7.2)
0x0577
Re-ATI retry time [s]
(See 3.7.3)
0x0578 0x0579
Open (2 bytes)
0x057A 0x057B
Report rate [ms] – Active mode (2 bytes)
0x057C 0x057D
Report rate [ms] – Idle touch mode (2 bytes)
0x057E 0x057F
Report rate [ms] – Idle mode (2 bytes)
0x0580 0x0581
Report rate [ms] – LP1 mode (2 bytes)
0x0582 0x0583
Report rate [ms] – LP2 mode (2 bytes)
0x0584
Timeout [s] – Active mode
0x0585
Timeout [s] – Idle touch mode
(See 3.7.2)
(See 3.7.3)
(See 4.1)
(See 4.2)
0x0586
Timeout [s] – Idle mode
0x0587
Timeout [x 20s] – LP1 mode
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IQ Switch®
ProxSense® Series
Address
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Details
0x0588
Reference update time [s]
(See 3.4.1)
0x0589
Snap timeout [s]
(See 3.5.3)
0x058A
I2C timeout [ms]
(See 8.6)
0x058B 0x058D
Open (3 bytes)
0x058E
MANUAL_
CONTROL
SETUP_
COMPLETE
WDT
SW_
INPUT_
EVENT
ALP_
REATI
REATI
SW_
INPUT_
SELECT
SW_
INPUT
System
Config 0
0x058F
PROX_
EVENT
TOUCH_
EVENT
SNAP_
EVENT
ALP_
PROX_
EVENT
REATI_
EVENT
TP_
EVENT
GESTURE
_EVENT
EVENT_
MODE
System
Config 1
0x0590 –
0x0591
Open (2 bytes)
0x0592 0x0593
Snap threshold (2 bytes)
0x0594
Prox threshold - trackpad
0x0595
Prox threshold - ALP channel
0x0596
Global touch multiplier - set
0x0597
Global touch multiplier - clear
0x0598 0x062D
Individual touch multiplier adjustments (150 bytes)
0x062E
Minimum count Re-ATI delta
0x062F 0x0631
Open (3 bytes)
R W E2
(See 3.5.3)
(See 3.5.1)
0x0632
-
-
-
-
ALP_
COUNT
_FILTER
IIR_
SELECT
(See 3.5.2)
(See 3.7.2)
MAV_
FILTER
IIR_
FILTER
Filter
Settings 0
0x0633
XY static beta
(See 5.9.2.2)
0x0634
ALP count beta
(See 3.3.2)
0x0635
ALP1 LTA beta
0x0636
ALP2 LTA beta
0x0637
XY dynamic filter – bottom beta
(See 3.4.2)
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(See 5.9.2.1)
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IQ Switch®
ProxSense® Series
Address
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
0x0638
XY dynamic filter– lower speed
0x0639 –
0x063A
XY dynamic filter– upper speed (2 bytes)
0x063B –
0x063C
Open (2 bytes)
0x063D
Total Rx
0x063E
Total Tx
0x063F 0x0648
Rx mapping (10 bytes)
Bit1
Bit0
Details
R W E2
(See 5.1.1)
(See 5.1.3)
0x0649 0x0657
Tx mapping (15 bytes)
0x0658
CHARGE
_TYPE
RX_
GROUP
PROX_
REVERSE
ALP
-
-
-
-
0x0659
-
-
-
-
-
-
ALP_
RX9
ALP_
RX8
ALP Channel
Setup 0
ALP Rx
Select
0x065A
ALP_
RX7
ALP_
RX6
ALP_
RX5
ALP_
RX4
ALP_
RX3
ALP_
RX2
ALP_
RX1
ALP_
RX0
0x065B
-
ALP_
TX14
ALP_
TX13
ALP_
TX12
ALP_
TX11
ALP_
TX10
ALP_
TX9
ALP_
TX8
ALP_
TX7
ALP_
TX6
ALP_
TX5
ALP_
TX4
ALP_
TX3
ALP_
TX2
ALP_
TX1
ALP_
TX0
Rx7/Tx2
Rx6/Tx3
Rx5/Tx4
Rx4/Tx5
Rx3/Tx6
Rx2/Tx7
Rx1/Tx8
Rx0/Tx9
Rx7/Tx9
Rx6/Tx10
Rx5/Tx11
Rx4/Tx12
Rx3/Tx13
Rx2/Tx14
-
-
-
RX_
FLOAT
0
0
Hardware
Settings A
0x065C
ALP Tx
Select
RxToTx
0x065D
Open
0x065E
0x065F
-
0x0660
-
CK_FREQ
-
-
ANA_
DEAD_
TIME
INCR_
PHASE
Hardware
Settings B1
0x0661
-
CK_FREQ
-
-
ANA_
DEAD_
TIME
INCR_
PHASE
Hardware
Settings B2
(ALP)
0x0662
-
STAB_ TIME
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ND
-
OPAMP_BIAS
VTRIP
IQS5xx-B000 Trackpad Datasheet
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Hardware
Settings C1
Page 34 of 79
November 2016
IQ Switch®
ProxSense® Series
Address
0x0663
Bit7
Bit6
STAB_ TIME
Bit5
Bit4
Bit3
Bit2
OPAMP_BIAS
Bit1
Bit0
VTRIP
Details
Hardware
Settings C2
(ALP)
0x0664
-
UPLEN
-
PASSLEN
Hardware
Settings D1
0x0665
-
UPLEN
-
PASSLEN
Hardware
Settings D2
(ALP)
0x0666 0x0668
0x0669
R W E2
Open (3 bytes)
-
-
-
-
SWITCH
_XY_
AXIS
PALM_
REJECT
FLIP_Y FLIP_X
XY Config 0
0x066A
Max multi-touches
(See 5.3)
0x066B
Finger split aggression factor
(See 5.7)
0x066C
Palm reject threshold
0x066D
Palm reject timeout [x 32ms]
0x066E 0x066F
X Resolution [pixels] (2 bytes)
(See 5.5)
(See 5.4)
0x0670 0x00671
Y Resolution [pixels] (2 bytes)
0x0672
Stationary touch movement threshold [pixels]
0x0673 0x0674
Open (2 bytes)
0x0675 0x0676
Default read address (2 bytes)
(See 8.4.1)
0x0677 0x0678
Export file version number (2 bytes)
(See 7.1)
0x0679
0x067A
PROX_DB_SET
SNAP_DB_
SET
0x067B 0x0698
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TOUCH_DB_
SET
PROX_DB_CLEAR
SNAP_DB_
CLEAR
TOUCH_DB_
CLEAR
Active channels (30 bytes)
IQS5xx-B000 Trackpad Datasheet
Revision 2.0
(See 5.6)
Prox
debounce
Touch snap
debounce
(See 8.10.5)
Page 35 of 79
November 2016
IQ Switch®
ProxSense® Series
Address
Bit7
Bit6
Bit5
0x0699 0x06B6
Bit4
Bit3
Bit2
Bit1
Bit0
Details
R W E2
Snap enabled channels (30 bytes)
0x06B7
-
-
SWIPE
_Y-
0x06B8
-
-
-
SWIPE
_Y+
SWIPE
_X+
SWIPE
_Y-
TAP_
AND_
HOLD
SINGLE
_TAP
Single Finger
Gestures
-
-
ZOOM
SCROLL
2_
FINGER_
TAP
Multi Finger
Gestures
0x06B9 0x06BA
Tap time [ms] (2 bytes)
0x06BB 0x06BC
Tap distance [pixels] (2 bytes)
0x06BD 0x06BE
Hold time [ms] (2 bytes)
0x06BF 0x06C0
Swipe initial time [ms] (2 bytes)
0x06C1 0x06C2
Swipe initial distance [pixels] (2 bytes)
0x06C3 0x06C4
Swipe consecutive time [ms] (2 bytes)
0x06C5 0x06C6
Swipe consecutive distance [pixels] (2 bytes)
0x06C7
Swipe angle [64tan(deg)]
0x06C8 0x06C9
Scroll initial distance [pixels] (2 bytes)
0x06CA
Scroll angle [64tan(deg)]
0x06CB 0x06CC
Zoom initial distance [pixels] (2 bytes)
(see 6.1 and
6.4)
(see 6.2)
(see 6.3)
(see 6.5)
(see 6.6)
0x06CD 0x06CE
Zoom consecutive distance [pixels] (2 bytes)
0x06CF
Open (1 byte)
8.10 Memory Map Bit / Register Definitions
The bit definitions for the registers in the memory map are explained in this section. Also
certain parameters that have a multiple number of bytes (registers) are also explained here.
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IQ Switch®
ProxSense® Series
8.10.1 Gesture Events 0
Gesture Events 0
Bit
7
6
5
4
3
2
1
0
-
-
SWIPE_
Y-
SWIPE_
Y+
SWIPE_
X+
SWIPE_
X-
PRESS_
AND_
HOLD
SINGLE_
TAP
1
0
SCROLL
2_
FINGER_
TAP
Name
Bit 7-6:
Unused
Bit 5:
SWIPE_Y-: Swipe in negative Y direction status
0 = No gesture
1 = Swipe in negative Y-direction occurred
Bit 4:
SWIPE_Y+: Swipe in positive Y direction status
0 = No gesture
1 = Swipe in positive Y-direction occurred
Bit 3:
SWIPE_X+: Swipe in positive X direction status
0 = No gesture
1 = Swipe in positive X-direction occurred
Bit 2:
SWIPE_X-: Swipe in negative X direction status
0 = No gesture
1 = Swipe in negative X direction occurred
Bit 1:
PRESS_AND_HOLD: Press and hold gesture status
0 = No gesture
1 = Press and hold occurred
Bit 0:
SINGLE_TAP: Single tap gesture status
0 = No gesture
1 = Single tap occurred
8.10.2 Gesture Events 1
Gesture Events 1
Bit
7
6
5
4
3
2
Name
-
-
-
-
Bit 7-3:
Unused
Bit 2:
ZOOM: Zoom gesture status
-
ZOOM
0 = No gesture
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IQ Switch®
ProxSense® Series
1 = Zoom gesture occurred
Bit 1:
SCROLL: Scroll status
0 = No gesture
1 = Scroll gesture occurred
Bit 0:
2_FINGER_TAP: Two finger tap gesture status
0 = No gesture
1 = Two finger tap occurred
8.10.3 System Info 0
System Info 0
Bit
7
6
5
4
3
SHOW_
RESET
ALP_
REATI_
OCCURR
ED
ALP_
ATI_
ERROR
REATI_
OCCURR
ED
ATI_
ERROR
Name
Bit 7:
2
1
0
CHARGING_MODE
SHOW_RESET: Indicates a reset
0 = Reset indication has been cleared by host, writing to „Ack Reset‟ bit
1 = Reset has occurred, and indication has not yet been cleared by host
Bit 6:
ALP_REATI_OCCURRED: Alternate Low Power channel Re-ATI status
0 = No Re-ATI
1 = Re-ATI has just completed on the alternate LP channel
Bit 5:
ALP_ATI_ERROR: Alternate Low Power channel ATI error status
0 = Most recent ATI process was successful
1 = Most recent ATI process had errors
Bit 4:
REATI_OCCURRED: Trackpad Re-ATI status
0 = No Re-ATI
1 = Re-ATI has just completed on the trackpad
Bit 3:
ATI_ERROR: Error condition seen on latest ATI procedure
0 = Most recent ATI process was successful
1 = Most recent ATI process had errors
Bit 2-0:
CHARGING_MODE: Indicates current mode
000 = Active mode
001 = Idle-Touch mode
010 = Idle mode
011 = LP1 mode
100 = LP2 mode
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IQ Switch®
ProxSense® Series
8.10.4 System Info 1
System Info 1
Bit
7
6
5
4
3
2
1
0
-
-
SWITCH
_STATE
SNAP_
TOGGLE
RR_
MISSED
TOO_
MANY_
FINGERS
PALM_
DETECT
TP_
MOVEMENT
Name
Bit 7-6:
Unused
Bit 5:
SWITCH_STATE: Status of input pin SW_IN
0 = SW_IN is LOW
1 = SW_IN is HIGH
Bit 4:
SNAP_TOGGLE: Change in any snap channel status
0 = No change in any channels‟ snap status
1 = At least one channel has had a change in snap status
Bit 3:
RR_MISSED: Report rate status
0 = Report rate has been achieved
1 = Report rate was not achieved
Bit 2:
TOO_MANY_FINGERS: Total finger status
0 = Number of fingers are within the max selected value
1 = Number of fingers are more than the max selected
Bit 1:
PALM_DETECT: Palm detect status
0 = No palm reject detected
1 = Palm reject has been detected
Bit 0:
TP_MOVEMENT: Activity or movement on trackpad status
0 = No finger or no movement of fingers on trackpad
1 = Movement of finger(s) seen on trackpad
8.10.5 Individual Channel Status / Config Bit Definitions
For all status outputs or configuration parameters where one bit relates to one channel, the
structure is defined as shown in the tables below. Each row has a 16-bit value where the
status/config of each bit corresponds to the status/config of the corresponding column.
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IQ Switch®
ProxSense® Series
Table 8.2
Status Bytes
Address
Data
X
Status/Config [Row0] – High Byte
X+1
Status/Config [Row0] – Low Byte
X+2
Status/Config [Row1] – High Byte
X+3
Status/Config [Row1] – Low Byte
:
X+28
Status/Config [Row14] – High Byte
X+29
Status/Config [Row14] – Low Byte
*Note that the proximity status bits have two extra bytes appended to the end to include the
proximity status bit of the ALP channel. Its status is located at Bit0.
Table 8.3
Status/Config Bit Definitions
High byte
Row Z
Low byte
-
-
-
-
-
-
Col9
Col8
Col7
Col6
Col5
Col4
Col3
Col2
Col1
Col0
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
*Note that if the XY axes are switched, these registers do NOT switch. This means that the
bits will always link to Rxs, and the registers will always link to Txs.
For the example above the parameter shown in the grey box in the table above is associated
with the Zth Tx and the 6th Rx.
The bit definitions for these parameters are shown in the table below.
Table 8.4
Channel Status/Config Bit Definitions
Parameter
Bit = 0
Bit = 1
Prox status
Channel does not have a proximity
Channel does have a prox
Touch status
Channel does not have a touch
Channel does have a touch
Snap status
Channel does not have a snap
Channel does have a snap
Active channels
Channel disabled
Channel enabled
Snap enabled channels
Snap feature disabled on channel
Snap feature enabled on channel
8.10.6 Count / Delta / Reference Data
For the count, delta and reference values (2 bytes per channel), the structure is defined as
shown in the table below.
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IQ Switch®
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Table 8.5
Count / Delta / Reference Value Bytes
Byte
number
Data
Description
X
Count/Delta/Reference value[0][0] – High Byte
X+1
Count/Delta/Reference value[0][0] – Low Byte
Count, delta or reference @
first Tx, and first Rx (thus top
left)
X+2
Count/Delta/Reference value[0][1] – High Byte
X+3
Count/Delta/Reference value[0][1] – Low Byte
:
:
:
X+298
Count/Delta/Reference value[14][9] – High Byte
X+299
Count/Delta/Reference value[14][9] – Low Byte
Count, delta or reference @
last Tx, and last Rx (thus
bottom right)
Count, delta or reference @
first Tx, and 2nd Rx
8.10.7 System Control 0
System Control 0
Bit
7
6
5
4
3
Name
ACK_
RESET
-
AUTO_
ATI
ALP_
RESEED
RESEED
Bit 7:
2
1
0
MODE_SELECT
ACK_RESET: Acknowledge a reset
0 = nothing
1 = Acknowledge the reset by clearing SHOW_RESET bit
Bit 6:
unused
Bit 5:
AUTO_ATI: Run ATI algorithm
0 = nothing
1 = Run ATI algorithm (affected channels depending on current mode)
Bit 4:
ALP_RESEED: Reseed alternate low power channel
0 = nothing
1 = reseed the LTA of the alternate LP channel
Bit 3:
RESEED: Reseed trackpad channels
0 = nothing
1 = Reseed reference values of trackpad
Bit 2-0:
MODE_SELECT: Select mode (only applies in Manual Mode)
000 = Active mode
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IQ Switch®
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001 = Idle-Touch mode
010 = Idle mode
011 = LP1 mode
100 = LP2 mode
8.10.8 System Control 1
System Control 1
Bit
7
6
5
4
3
2
1
0
Name
-
-
-
-
-
-
RESET
SUSPEND
Bit 7-2:
Unused
Bit 1:
RESET: Reset the IQS5xx
0 = nothing
1 = Reset the device after the communication window terminates
Bit 0:
SUSPEND: Suspend IQS5xx
0 = nothing
1 = Place IQS5xx into suspend after the communication window terminates
8.10.9 System Config 0
System Config 0
Bit
Name
Bit 7:
7
6
5
4
3
2
1
0
MANUAL_
CONTROL
SETUP_
COMPLETE
WDT
SW_
INPUT_
EVENT
ALP_
REATI
REATI
SW_
INPUT_
SELECT
SW_
INPUT
MANUAL_CONTROL: Override automatic mode switching
0 = Modes are automatically controlled by IQS5xx
1 = Manual control of modes are handled by host
Bit 6:
SETUP_COMPLETE: Device parameters are set up
0 = IQS5xx will remain in I2C setup window (no processing yet)
1 = Setup is complete, run auto-start procedure
Bit 5:
WDT: Watchdog timer enable/disable
0 = Watchdog is disabled (only disables after a reset)
1 = Watchdog is enabled
Bit 4:
SW_INPUT_EVENT: Enable switch state change triggering event
0 = Toggle of SW_IN does not trigger an event
1 = Toggle of SW_IN triggers an event
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IQ Switch®
ProxSense® Series
Bit 3:
ALP_REATI: Enable/Disable automatic Re-ATI on alternate LP channel
0 = Re-ATI is disabled for alternate LP channel
1 = Re-ATI is enabled for alternate LP channel
Bit 2:
REATI: Enable/Disable automatic Re-ATI on trackpad
0 = Re-ATI is disabled for alternate trackpad channels
1 = Re-ATI is enabled for alternate trackpad channels
Bit 1:
SW_INPUT_SELECT: Select I/O polarity
0 = SW_IN is active LOW
1 = SW_IN is active HIGH
Bit 0:
SW_INPUT: Enable/disable the input switch function on pin SW_IN
0 = Input disabled
1 = Input enabled
8.10.10
System Config 1
System Config 1
Bit
Name
Bit 7:
7
6
5
4
3
2
1
0
PROX_
EVENT
TOUCH_
EVENT
SNAP_
EVENT
ALP_
PROX_
EVENT
REATI_
EVENT
TP_
EVENT
GESTURE
_EVENT
EVENT_
MODE
PROX_EVENT: Enable proximity triggering event
0 = Toggle of proximity status does not trigger an event
1 = Toggle of proximity status triggers an event
Bit 6:
TOUCH_EVENT: Enable touch triggering event
0 = Toggle of touch status does not trigger an event
1 = Toggle of touch status triggers an event
Bit 5:
SNAP_EVENT: Enable snap triggering event
0 = Toggle of snap status does not trigger an event
1 = Toggle of snap status triggers an event
Bit 4:
ALP_PROX_EVENT: Enable alternate LP channel proximity triggering event
0 = Toggle of alternate channel proximity status does not trigger an event
1 = Toggle of alternate channel proximity status triggers an event
Bit 3:
REATI_EVENT: Enable Re-ATI generating an event
0 = Re-ATI occurring does not trigger an event
1 = Re-ATI occurring triggers an event
Bit 2:
TP_EVENT: Enable trackpad events
0 = Trackpad actions will not trigger event
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IQ Switch®
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1 = Trackpad actions trigger event
Bit 1:
GESTURE_EVENT: Enable gesture events
0 = Gestures will not trigger event
1 = Gestures will trigger event
Bit 0:
EVENT_MODE: Enable event mode communication
0 = I2C is presented each cycle
1 = I2C is only initiated when an enabled event occurs
Filter Settings 0
Bit
7
6
5
4
3
2
1
0
-
-
-
-
ALP_
COUNT_
FILTER
IIR_
SELECT
MAV_
FILTER
IIR_
FILTER
Name
Bit 7-4:
Unused
Bit 3:
ALP_COUNT_FILTER: Enable alternate LP channel count filtering
0 = Alternate LP channel counts are unfiltered
1 = Alternate LP channel counts are filtered
Bit 2:
IIR_SELECT: Select the IIR filtering method for the XY data points
0 = Damping factor for IIR filter is dynamically adjusted relative to XY movement
1 = Damping factor for IIR filter is fixed
Bit 1:
MAV_FILTER: Enable moving averaging filter
0 = XY MAV filter disabled
1 = XY MAV filter enabled
Bit 0:
IIR_FILTER: Enable IIR filter
0 = XY IIR filter disabled
1 = XY IIR filter enabled
8.10.11
Alternate Channel Setup
ALP Channel Setup 0
Bit
7
6
5
4
3
2
1
0
Name
CHARGE
_TYPE
RX_
GROUP
PROX_
REVERSE
ALP
-
-
-
-
Bit 7:
CHARGE_TYPE: Charge type selection
0 = Projected capacitive charging
1 = Self capacitive charging
Bit 6:
RX_GROUP: Select Rx group
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IQ Switch®
ProxSense® Series
0 = Rx group A
1 = Rx group B
Bit 5:
PROX_REVERSE: Enable reverse proximity sensing
0 = Allow proximity to only trigger in conventional direction (positive for
projected, negative for self capacitive)
1 = Proximity detects change in counts in both directions
Bit 4:
ALP: Enable alternate low power channel
0 = LP1 and LP2 use trackpad channels
1 = LP1 and LP2 use alternate channel configuration
Bit 3-0:
Unused
8.10.12
ALP Rx select
Bit Z:
ALP_RxZ: Select Rx for alternate low power channel
0 = RxZ is not part of ALP channel
1 = RxZ is part of ALP channel
8.10.13
ALP Tx select
Bit Z:
ALP_TxZ: Select Tx for alternate low power channel
0 = TxZ is not part of ALP channel
1 = TxZ is part of ALP channel
8.10.14
RxToTx
RxToTx(1)
Bit
7
6
5
4
3
2
1
0
IQS525
Rx7/Tx2
Rx6/Tx3
Rx5/Tx4
Rx4/Tx5
Rx3/Tx6
Rx2/Tx7
Rx1/Tx8
Rx0/Tx9
IQS572
Rx7/Tx9
Rx6/Tx10
Rx5/Tx11
Rx4/Tx12
Rx3/Tx13
Rx2/Tx14
0
0
Bit 7-0:
Rx/Tx: Change an Rx electrode to a Tx electrode
0 = Activate indicated Rx
1 = Activate indicated Tx
1: This register is only available on the IQS572 and IQS525 firmware
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IQ Switch®
ProxSense® Series
8.10.15
Hardware Settings A
Hardware Settings A
Bit
Name
7
6
5
4
3
2
1
0
-
-
ND
-
-
RX_
FLOAT
0
0
3
2
1
0
-
-
ANA_
DEAD_
TIME
INCR_
PHASE
Bit 7-6:
Unused
Bit 5:
ND: Enable hardware noise detection
0 = noise detect disabled
1 = noise detect enabled
Bit 4-3:
Unused
Bit 2:
RX_FLOAT: Select Rx status when inactive
0 = Rx is grounded when inactive
1 = Rx is floating when inactive
Bit 1-0
Internal use, set to 0
8.10.16
Hardware Settings B
Hardware Settings B
Bit
7
6
5
4
Name
-
CK_FREQ
Bit 7:
Unused
Bit 6-4:
CK_FREQ: Configure Prox module clock source
000 = 125kHz
001 = 250kHz
010 = 500kHz
011 = 1MHz
100 = 2MHz
101 = 4MHz
110 = 8MHz
111 = 16MHz
Bit 3-2:
Unused
Bit 1:
ANA_DEAD_TIME: Analog dead time between up and pass phase
0 = Analog dead time disabled (dead time is half a prox clock cycle)
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IQ Switch®
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1 = Analog dead time enabled (dead time is ~10ns, and UP increased by one
cycle)
Bit 0:
INCR_PHASE: Increase the phase length of UP and PASS
0 = Phase (UP / PASS) not incremented
1 = Phase (UP / PASS) increased by one half of a prox clock cycle
8.10.17
Hardware Settings C
Hardware Settings C
Bit
Name
7
6
STAB_ TIME
Bit 7-6:
5
4
3
2
OPAMP_BIAS
1
0
VTRIP
STAB_TIME: Stabilisation time after module power-on before conversion starts
00 = 1.7ms
01 = 500us
10 = 120us
11 = no not use
Bit 6-4:
OPAMP_BIAS: Opamp bias strength
00 = 2.5uA
01 = 5uA
10 = 7.5uA
11 = 10uA
Bit 3-0:
VTRIP: Charge transfer trip voltage
Trip voltage = [0.5 + (VTRIP x 0.0267)] x Vreg
8.10.18
Hardware Settings D
Hardware Settings D
Bit
7
Name
-
6
5
4
UPLEN
-
Bit 7:
Unused
Bit 6-4:
UPLEN: Length of UP phase
Bit 3:
Unused
Bit 2-0:
PASSLEN: Length of PASS phase
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IQ Switch®
ProxSense® Series
8.10.19
XY Config 0
XY Config 0
Bit
7
6
5
4
3
2
1
0
-
-
-
-
PALM_
REJECT
SWITCH
_XY_
AXIS
FLIP_Y
FLIP_X
Name
Bit 7-4:
Unused
Bit 3:
PALM_REJECT: Enable palm reject sensing and suppression
0 = Large fingers (palms) are allowed
1 = Large fingers (palms) will block XY outputs.
Bit 2:
SWITCH_XY_AXIS: Switch X and Y outputs
0 = Columns Rx0-Rx9 gives change in X, rows Tx0-Tx14 gives change in Y
1 = Columns Tx0-Tx14 gives change in X, rows Rx0-Rx9 gives change in Y
Bit 1:
FLIP_Y: Flip Y output values
0 = Keep default Y values
1 = Invert Y output values
Bit 0:
FLIP_X: Flip X output values
0 = Keep default X values
1 = Invert X output values
8.10.20
Single Finger Gestures
Single Finger Gestures
Bit
7
6
5
4
3
2
1
0
-
-
SWIPE_
Y-
SWIPE_
Y+
SWIPE_
X+
SWIPE_
Y-
PRESS_
AND_
HOLD
SINGLE_
TAP
Name
Bit 7-6:
Unused
Bit 5:
SWIPE_Y-: Swipe in negative Y direction
0 = Gesture disabled
1 = Gesture enabled
Bit 4:
SWIPE_Y+: Swipe in positive Y direction
0 = Gesture disabled
1 = Gesture enabled
Bit 3:
SWIPE_X+: Swipe in positive X direction
0 = Gesture disabled
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1 = Gesture enabled
Bit 2:
SWIPE_X-: Swipe in negative X direction
0 = Gesture disabled
1 = Gesture enabled
Bit 1:
PRESS_AND_HOLD: Press and hold gesture
0 = Gesture disabled
1 = Gesture enabled
Bit 0:
SINGLE_TAP: Single tap gesture
0 = Gesture disabled
1 = Gesture enabled
8.10.21
Multi-finger Gestures
Multi-finger Gestures
Bit
Name
7
6
5
4
3
2
1
0
-
-
-
-
-
ZOOM
SCROLL
2F_
TAP
Bit 7-3:
Unused
Bit 2:
ZOOM: Zoom gestures
0 = Gestures disabled
1 = Gestures enabled
Bit 1:
SCROLL: Scroll gestures
0 = Gestures disabled
1 = Gestures enabled
Bit 0:
2F_TAP: Two finger tap gesture
0 = Gesture disabled
1 = Gesture enabled
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IQ Switch®
ProxSense® Series
37 VSSIO
39 Tx4
38 VDDIO
40 Tx5
41 Tx6
42 Tx7
43 Tx8
44 Tx9
36 Tx3
PGM 2
35 Tx2
SW_IN 3
34 Tx1
N/C 4
33 Tx0
VDDHI 7
VSS 8
32 Rx9B
IQS550
Xxxxx xx
Xxx xxx
SCL 6
31 Rx9A
30 Rx8B
Rx5B 24
Rx5A 23
Rx4B 22
Rx4A 21
Rx3B 20
Rx3A 19
Rx2B 18
25 Rx6A
Rx2A 17
26 Rx6B
N/C 12
Rx1B 16
27 Rx7A
RDY 11
Rx1A 15
NRST 10
Rx0B 14
28 Rx7B
Rx0A 13
Transmitters
and
receivers
to
touchscreen
29 Rx8A
VREG 9
Figure 9.1
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45 Tx10
Tx14 1
SDA 5
Digital
Interface
(i2c)
46 Tx11
48 Tx13
Supply
Voltage
47 Tx12
9 Circuit Diagram
IQS550 Overview Diagram
IQS5xx-B000 Trackpad Datasheet
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22 TX4
23 TX5
SDA 2
20 TX2
IQS572
xx xxx
xx xxx
xxx xx
VSS 5
19 TX1
18 TX0
17 RX7 / TX9
RX4 / TX12 14
RX3 / TX13 13
RX2 / TX14 12
22 PD4
23 PD5
24 PD6
25 PD7
26 PB0
27 PGM
N/C 1
21 PD3
SDA 2
20 PD2
IQS525
VSS 5
xx xxx
VDDHI 4
xx xxx
xxx xx
SCL 3
19 TX0
18 TX1
17 RX7 / TX2
Transmitters
and
receivers
to trackpad /
touchscreen
RX4 / Tx5 14
RX3 / Tx6 13
RX2 / Tx7 12
RX1 / Tx8 11
15 RX5 / TX4
RX0 / Tx9 10
NRST 7
N/C 9
16 RX6 / TX3
RDY 8
VREG 6
Figure 9.3
Transmitters
and
receivers
to trackpad /
touchscreen
IQS572 Overview Diagram
28 SW_IN
Supply
Voltage
RX1 11
15 RX5 / TX11
RX0 10
NRST 7
N/C 9
16 RX6 / TX10
RDY 8
VREG 6
Figure 9.2
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24 TX6
21 TX3
VDDHI 4
Digital
Interface
(i2c)
25 TX7
N/C 1
SCL 3
Digital
Interface
(i2c)
26 TX8
Supply
Voltage
27 PGM
28 SW_IN
IQ Switch®
ProxSense® Series
IQS525 Overview Diagram
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IQ Switch®
ProxSense® Series
Figure 9.4
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IQS550 Application Circuit
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IQ Switch®
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Figure 9.5
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IQS572 Application Circuit
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IQ Switch®
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Figure 9.6
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IQS525 Application Circuit
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IQ Switch®
ProxSense® Series
10 Electrical Characteristics
10.1 Absolute Maximum Ratings
Exceeding these maximum ratings may cause permanent damage to the device.
Table 10.1
Voltage Characteristics
Symbol
Rating
Min
Max
VDDHI VSS
External supply voltage
-0.3
4.0
Receiver channel pins (Rx0A...Rx9B)
VSS–0.3
VREG (-1.55)
PXS off
VSS–0.3
4.0
PXS
on(1)
VSS–0.3
VREG (-1.55)
VSS–0.3
4.0
Input voltage on transmit pins
(Tx0...Tx14))
VIN
Input voltage on any pin(2)
Unit
V
®
1. If the ProxSense peripheral is on, no injection must be performed on any pin having the transmit
function (Tx) as an alternate function, even if this alternate function is not specified
2. IINJ(PIN) must never be exceeded. This is implicitly insured if V IN maximum is respected. If VIN
maximum cannot be respected, the injection current must be limited externally to the I INJ(PIN) value. A
positive injection is induced by VIN>VDDHI while a negative is induced by VIN<VSS.
Table 10.2
Current Characteristics
Symbol
Rating
Max.
IVDDHI
Total current into VDDHI power line (source)
80
IVSS
Total current out of VSS ground line (sink)
80
Output current sunk by any other I/O and control pin
25
Output current source by any I/Os and control pin
-25
Injected current on any pin(2)
±5
Total injected current (sum of all I/O and control pins)(2)
±25
IIO
Unit
mA
IINJ(PIN)(1)
(1)
∑ IINJ(PIN)
1. IINJ(PIN) must never be exceeded. This is implicitly insured if V IN maximum is respected. If VIN
maximum cannot be respected, the injection current must be limited externally to the IINJ(PIN) value. A
positive injection is induced by VIN>VDDHI while a negative injection is induced by VIN<VSS. For true
open-drain pads, there is no positive injection current, and the corresponding V IN maximum must
always be respected.
2. When several inputs are submitted to a current injection, the maximum ΣI INJ(PIN) is the absolute sum
of the positive and negative injected currents (instantaneous values). These results are based on
characterization with ΣIINJ(PIN) maximum current injection on four I/O port pins of the device.
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IQ Switch®
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Table 10.3
Thermal Characteristics
Symbol
Rating
Max.
TSTG
Storage temperature range
-65 to +150
TJ
Maximum junction temperature
150
Unit
°C
10.2 Operating Conditions
10.2.1 General Operating Conditions
Table 10.4
General Operating Conditions
Symbol
Parameter
Conditions
Min
fMASTER(1)
Master clock frequency
1.65V ≤ VDDHI
≤3.6V
-
VDDHI
Standard operating
voltage
-
1.65
PD(2)
Power dissipation at TA
= 85°C
-
-
TA
Temperature range
1.65V ≤ VDDHI
≤3.6V
-40
TJ
Junction temperature
range
-40°C ≤ VDDHI ≤
85°C
-40
Typ
16
-
-
Max
Unit
-
MHz
3.6
V
625
mW
85
°C
105
°C
1. fMASTER = fCPU
2. To calculate PDmax(TA) use the formula given in thermal characteristics PDmax=(TJmax −TA)/θJA with
TJmax in this table and θJA in Table 10.15.
10.2.2 Power-up / Power-down Operating Conditions
Table 10.5
Symbol
Parameter
tVDDHI
VDDHI rise time rate
tTEMP
Reset release decay
VPOR
VPDR
Operating Conditions at Power Up / Down
Conditions
Min
Typ
Max
Unit
20
-
1300
µs/V
-
1
-
Ms
Power on reset threshold
1.44
-
1.65(1)
V
Power down reset threshold
1.30
-
1.60(2)
V
VDDHI rising
1. Tested in production
2. Data based on characterisation results, not tested in production.
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10.2.3 Supply Current Characteristic
Table 10.6
Current Consumption(1)
Symbol
Parameter
Conditions
Typ
Max
IDD(CORE)
Run current for processor core
16MHz master frequency
2.8
3.5
(TA = -40 °C to 85 °C)
IDD(LP STATE)
IDD(SUSPEND)
Unit
mA
Supply current in low-power
sleep state (which is added to
cycle time to obtain desired
report rate)
TA = -40 °C to 25 °C
1
2
uA
TA = 85 °C
1.4
3.2
uA
Supply current in suspend state
TA = -40 °C to 25 °C
0.4
1.2
uA
TA = 85 °C
1
2.5
uA
1. Data based on characterisation results, unless otherwise specified.
10.2.4 ProxSense® Current Consumption
The break-down of the consumption from the ProxSense peripheral is shown below.
Table 10.7
ProxSense® Current Consumption(1)
Symbol
ProxSense transmitter (Tx)
ProxSense receiver (Rx)
Typ
Unit
IDD(PXS)
1
1
0.6
mA
1
4
1.1
mA
1
10
2.3
mA
1. Data based on characterisation results, unless otherwise specified.
10.2.5 Expected Total Current Consumption Scenarios
The specific parameters configured on varying designs have a great impact on the obtained
current consumption. Due to this, the following table is purely illustrative of the expected
consumption for similar configurations. The device configurations used below are examples of
practical setups expected in applications.
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IQ Switch®
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Table 10.8
Total Current Consumption(1)
Current (Typ)
Symbol
IDD(Total)
Sensors
Report Rate
Unit
IQS550
IQS572
IQS525
Trackpad(2)
10ms
3.75
2.73
1.46
mA
Trackpad(2)
15ms
2.52
1.85
0.99
mA
Trackpad(2)
20ms
1.9
1.38
0.74
mA
Trackpad(2)
40ms
975
690
370
uA
Trackpad(2)
80ms
483
346
185
uA
Trackpad(2)
160ms
243
174
96
uA
Trackpad(2)
320ms
121
89
48
uA
Trackpad(2)
640ms
67
55
26
uA
ALP(3)
80ms
48
uA
ALP(3)
160ms
25
uA
ALP(3)
320ms
13
uA
ALP(3)
640ms
7
uA
ALP(4)
80ms
43
uA
ALP(4)
160ms
22
uA
ALP(4)
320ms
12
uA
ALP(4)
640ms
7
uA
ALP(5)
80ms
41
uA
ALP(5)
160ms
21
uA
ALP(5)
320ms
12
uA
ALP(5)
640ms
6
uA
1. Based on bench measurements, not characterised
2. Tested with maximum number of sensors active (IQS550 – 15x10 / IQS572 – 9x8 / IQS525 – 5x5);
ATI Target of 500 counts; Max number of multi-touches = 2 / default hardware (conversion) settings /
2
1 finger touch (8mm diameter) active / streaming 27 bytes (XY data and gestures) / I C pull-ups of
4.7kΩ / VDDHI = 3.3V
3. Tested with ALP channel configured in projected capacitive mode; ATI Target of 500; Alternating Txs
enabled, all Rxs enabled; Event-Mode enabled
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4. Tested with ALP channel configured in projected capacitive mode; ATI Target of 500; All Txs
enabled, single Rxs around trackpad enabled; Event-Mode enabled
5. Tested with ALP channel configured in self capacitive mode; ATI Target of 800; single Rx enabled;
Event-Mode enabled
10.2.6 I/O Port Pin Characteristics
General characteristics
Subject to general operating conditions for VDDHI and TA unless otherwise specified. All
unused pins must be kept at a fixed voltage: using the output mode of the I/O for example or
an external pull-up or pull-down resistor.
Table 10.9
Standard I/O Static Characteristic (1) (2)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
VIL
Input low level voltage(3)
Standard I/Os
VSS-0.3
-
0.3VDDHI
V
VIH
Input high level voltage(3)
Standard I/Os
0.7
VDDHI
-
VDDHI
+0.3
Vhys
Schmitt trigger voltage
hysteresis(4)
Standard I/Os
-
200
-
mV
IIkg
Input leakage current(5)
VSS ≤ VIN ≤ VDDHI
Standard I/Os
-1
-
1
uA
VSS ≤ Vin ≤ VREG(6)
Rx, Tx I/Os
-1
-
1
VIN = VSS
30
45
60
kΩ
-
5
-
pF
RPU
Weak pull-up equivalent
resistor(7)
CIO(8)
I/O pin capacitance
1.
2.
3.
4.
5.
6.
7.
8.
VDDHI = 3.0 V, TA = -40 to 85°C unless otherwise specified.
Not applicable to Rx and Tx pins.
Data based on characterisation results, not tested in production.
Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not
tested.
The maximum value may be exceeded if negative current is injected on adjacent pins.
®
VIN must not exceed VREG value if ProxSense is enabled, even on port B and D (Tx), VREG = 1.55V.
RPU pull-up equivalent resistor based on a resistive transistor (corresponding I PU current
characteristics)
Data guaranteed by design, not tested in production
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IQ Switch®
ProxSense® Series
10.2.7 Output Driving Current
Subject to general operating conditions for VDDHI and TA unless otherwise specified.
Table 10.10 Output Driving Current (high sink ports)
I/O type
Symbol
VOL(1)
Parameter Conditions
Output low level voltage for an I/O pin
Conditions
Min.
Max.
IIO = +2mA,
VDDHI = 1.8V
-
0.45
IIO = +2mA,
VDDHI = 3.0V
-
0.45
IIO = +10mA,
VDDHI = 3.0V
-
0.7
IIO = -1mA,
VDDHI = 1.8V
VDDHI
-0.45
-
IIO = -1mA,
VDDHI = 3.0V
VDDHI
-0.45
-
IIO = -10mA,
VDDHI = 3.0V
VDDHI
-0.7
-
Unit
Standard
VOH(2)
ProxSense
I/O
Output high level voltage for an I/O
pin
VOL
Output low level voltage for Tx and Rx
ProxSense I/Os
IRX = TBD
-
TBD
VOH
Output high level voltage for Tx
ProxSense I/O
ITX = 1mA
1.45
-
VOH
Output high level voltage for Rx
ProxSense I/O
IPXS_RX =
0.5mA
1.35
-
1. The IIO current sunk must always respect the absolute maximum rating and the sum of I IO (I/O ports
and control pins) must not exceed IVSS.
2. The IIO current sourced must always respect the absolute maximum rating and the sum of IIO (I/O
ports and control pins) must not exceed IVDDHI.
10.2.8 NRST Pin
The NRST pin input driver is CMOS. A permanent pull-up is present, thus an external
component is not needed if NRST is unconnected in the design.
Subject to general operating conditions for VDDHI and TA unless otherwise specified.
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V
IQ Switch®
ProxSense® Series
Table 10.11 NRST Pin Characteristics
Symbol
Parameter
VIL(NRST)
Conditions
Min.
Typ.
Max.
NRST Input low level voltage(1)
VSS
-
0.8
VIH(NRST)
NRST Input high level voltage(1)
1.4
-
VDDHI
VOL(NRST)
NRST Output low level voltage
-
-
VDDHI 0.8
RPU(NRST)
NRST pull-up equivalent resistor(2)
30
45
60
VF(NRST)
NRST input filtered pulse(3)
-
-
50
tOP(NRST)
NRST output pulse width
20
-
-
VNF(NRST)
NRST input not filtered pulse(3)
300
-
-
IOL = 2mA
Unit
V
kΩ
ns
1. Data based on characterization results, not tested in production.
2. The RPU pull-up equivalent resistor is based on a resistive transistor.
3. Data guaranteed by design, not tested in production.
The reset network shown in Figure 10.1 protects the device against parasitic resets. The user
must ensure that the level on the NRST pin can go below the V IL max. level specified in Table
10.11. Otherwise the reset is not taken into account internally.
Figure 10.1 Recommended NRST Pin Configuration
10.2.9 I2C Characteristics
Subject to general operating conditions for VDDHI, fMASTER, and TA unless otherwise specified.
The IQS5xx I2C interface meets the requirements of the Standard I2C communication protocol
described in the following table with the restrictions mentioned below.
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IQ Switch®
ProxSense® Series
Table 10.12 I2C Characteristics
Symbol
Standard I2C
(100kHz)
Parameter
(1)
Min
(1)
Max
Fast I2C
(400kHz)
(1)
Min
Unit
(1)
Max
tw(SCLL)
SCL clock low time
4.7
-
1.3
-
µs
tw(SCLH)
SCL clock high time
4.0
-
0.6
-
µs
tsu(SDA)
SDA setup time
250
-
100
-
ns
th(SDA)
SDA data hold time
0(2)
-
0
900(2)
ns
tr(SDA)
SDA rise time
-
1000
-
300
ns
tr(SCL)
SCL rise time
-
1000
-
300
ns
tf(SDA)
SDA fall time
-
300
-
300
ns
tf(SCL)
SCL fall time
-
300
-
300
ns
th(STA)
START condition hold time
4.0
-
0.6
-
µs
tsu(STA)
Repeated START condition setup time
4.7
-
0.6
-
µs
tsu(STO)
STOP condition setup time
4.0
-
0.6
-
µs
Cb
Capacitive load for each bus line
-
400
-
400
pF
1. Data based on protocol requirement, not tested in production
Figure 10.2 Typical Bus Application and Timing Diagram
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10.2.10
Package Moisture Sensitivity
Table 10.13 Moisture Sensitivity Level (MSL)
Parameter
IQS550
IQS572
IQS525
Package Moisture Sensitivity Level (MSL)
3
3
3
10.2.11
Electrostatic Discharge (ESD)
Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied
to the pins of each sample according to each pin combination. The sample size depends on
the number of supply pins in the device (3 parts*(n+1) supply pin). Two models can be
simulated: human body model and charge device model. This test conforms to the JESD22A114A/A115A standard.
Table 10.14 ESD Absolute Maximum Ratings
Symbol
Ratings
Conditions
VESD(HBM)
Electrostatic
discharge voltage
(human body model)
VESD(CDM)
Electrostatic
discharge voltage
(charge device
model)
Max Value
Unit
2000(2)
TA = +25 °C
V
1000
1. Data based on characterisation results, not tested in production.
2. Device sustained up to 3000 V during ESD trials.
10.2.12
Thermal Characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in Table 10.4.
The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated using the
following equation:
TJmax = TAmax + (PDmax x θJA)
Where:
● TAmax is the maximum ambient temperature in °C
● θJA is the package junction-to-ambient thermal resistance in °C/W
● PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)
● PINTmax is the product of IDD and VDDHI, expressed in watts. This is the maximum chip internal power.
●
PI/Omax
represents
the
maximum
power
dissipation
on
output
pins
where:
PI/Omax = Σ (VOL*IOL) + Σ((VDDHI −VOH)*IOH), taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low
and high level in the application.
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IQ Switch®
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Table 10.15 Thermal Characteristics(1)
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction ambient
32
°C/W
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection environment.
10.2.13
ProxSense Electrical Characteristics
Table 10.16 Rx / Tx Characteristics
Symbol
Parameter
CRG
Rx capacitance to
ground
CTG
Tx capacitance to
ground
CM
Mutual capacitance
between Rx and Tx
Rrx
Rtx
Conditions
IQS550
IQS572
IQS525
60
60
60
Unit
pF
40
pF
4
pF
16MHz
Prox Clock
2
kΩ
4MHz Prox
Clock
20
kΩ
16MHz
Prox Clock
2
kΩ
4MHz Prox
Clock
20
kΩ
Total Rx resistance
Total Tx resistance
Data based on characterisation results, not tested in production.
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IQ Switch®
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11 Mechanical Dimensions
11.1 IQS550 QFN(7x7)-48 Mechanical Dimensions
P
1
48
B
Tt
Z
W
Wt
Area „Z‟
H
1
A
Tp
48
r
Pin 1 corner
C 0.5 x 45°
T
Figure 11.1 QFN(7x7)-48 Package
Table 11.1
Dimensions from Figure 11.1
Dimension (mm)
Dimension (mm)
Label
Label
Min
P
Typical
Max
0.500
Min
Typical
Max
H
0.500
0.550
0.600
6.900
7.00
7.100
T
0.300
0.400
0.500
A/B
W
0.200
0.250
0.300
Tp
0.152
Tt
5.500
5.600
5.700
r
0.125
Wt
5.400
5.500
5.600
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IQ Switch®
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11.2 IQS550 Landing Pad Layout
H
48 47 46 45 44 43 42 41 40 39 38 37
36
1
35
2
3
W
34
4
33
5
32
6
31
7
30
8
29
9
g
X
Y2
28
Y
49 (*Note1)
Y1
10
27
11
26
12
25
13 14 15 16 17 18 19 20 21 22 23 24
P
X3
X1
X2
Figure 11.2 QFN(7x7)-48 Footprint
Table 11.2
Dimensions from Figure 11.2
Label
Dimension (mm)
Label
Dimension (mm)
X
5.60
Y2
7.30
X1
6.20
H
0.55
X2
7.30
W
0.30
X3
5.80
g
0.20
Y
5.60
P
0.50
Y1
6.20
*Note1: It is recommended to connect and solder this back-side pad to PCB ground.
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IQ Switch®
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11.3 IQS572/IQS525 QFN(4x4)-28 Mechanical Dimensions
Figure 11.3 QFN(4x4)-28 Package
Table 11.3
Dimensions from Figure 11.3
Dimension (mm)
Dimension (mm)
Label
Label
Min
Typical
Max
Min
Typical
Max
A
0.5
0.55
0.6
L
0.3
0.4
0.5
A1
-0.05
0
0.05
L1
0.25
0.35
0.45
D
3.9
4.0
4.1
T
D1
2.9
3.0
3.1
b
E
3.9
4.0
4.1
e
E1
2.9
3.0
3.1
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0.152
0.2
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0.3
0.5
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IQ Switch®
ProxSense® Series
11.4 IQS572/IQS525 Landing Pad Layout
Figure 11.4 QFN(4x4)-48 Footprint (dimensions in millimetres)
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IQ Switch®
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12 Packaging Information
12.1 Tape Specification
The IQS5xx products come packaged in a carrier tape on a reel. The carrier tape has a leader
and trailer section where no products are populated. A 400mm (min) section at the start of the
carrier tape is empty (leader part). The cover tape starts in this leader part and covers a
100mm (min) of carrier tape that has no products. From there the products are consecutively
populated in the carrier tape. The trailer of 160mm (min) has no products.
Figure 12.1 Representation of Leader and Trailer for the Carrier Tape
Table 12.1
Tape Dimensions
Measurement (mm)
Description
IQS550
IQS572
IQS525
Tape width
16
12
12
Part pitch
12
8
8
Sprocket hole diameter
1.5
2
2
Sprocket hole pitch
4
4
4
Cavity length
7.2
5.3
5.3
Cavity width
7.2
5.3
5.3
Cavity depth
1.2
1.1
1.1
Cover tape width
13
9.5
9.5
Please note: Cover tape does not cover the sprocket holes.
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IQ Switch®
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12.1.1 IQS550 Tape Description
Azoteq logo
and name
IQS550 chip name
Pin 1 corner
indicator
Sprocket holes
Figure 12.2 IQS550 QFN48-7x7 Package in Carrier Tape Example
The IQS550 is packed in a carrier tape as shown above and placed on the reel. It fits in a long
carrier tape that is moulded specifically for this product and a removable see-through cover
tape is placed over. This cover can be peeled off and the product taken out of the tape with a
pick-and-place machine. The Pin 1 corner indicator is closest to a side facing the sprocket
holes in the carrier tape as illustrated.
12.1.2 IQS572 and IQS525 Tape Description
The IQS525 & IQS572 share the same tape and reel details, with an example of the IQS525
tape provided here.
Pin 1 corner
indicator
IQS525
chip name
Sprocket
holes
Figure 12.3 IQS525 QFN28-4x4 Package in Carrier Tape Example
Again the Pin 1 corner indicator is closest the side facing the sprocket holes in the carrier tape
as illustrated.
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IQ Switch®
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12.2 Reel Specification
The reel is made from a high impact PS material. The physical dimensions are illustrated in
the table and figure below.
Figure 12.4 Reel Dimensions: Front and Side View
Table 12.2
Reel Dimensions
Value (in mm)
Dimension
IQS550
IQS572
IQS525
A
330 (max)
330 (max)
330 (max)
B
1.5 (min)
1.5 (min)
1.5 (min)
C
13 ±0.2
13 ±0.2
13 ±0.2
D
20.2 (min)
20.2 (min)
20.2 (min)
N
60
60
60
G
16.4 + 2/-0
12.4 + 2/-0mm
12.4 + 2/-0mm
T
22.4 (max)
18.4mm (max)
18.4mm (max)
Note: The reel could also have additional cut-outs not illustrated in the figure
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IQ Switch®
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12.2.1 Dry Packing
The IQS5xx is specifically dry packed to protect them from moisture absorption while
shipping/storing which has a large effect on the quality and reliability of the IQS5xx after
soldering. To improve the quality and reliability of soldering joints, it is advised to bake the
IQS5xx before reflow soldering.
Below is a flow diagram which shows how Azoteq aims to minimise moisture absorption during
shipping and storage. On the right side is a flow diagram specific for the customer to consult
whether baking is needed.
Figure 12.5 Moisture Absorption Control Method / Guide
The flow diagram above informs the customer whether the baking process is needed. When
opening the dry pack consult the humidity indicator (gel) inside the pack. If it turned pink, the
product must be baked. If the gel is not pink, within the specified period there is no need for
baking, as long as the humidity and temperature conditions are met.
12.2.2 Baking
The IQS5xx is packed in a tape and reel and can thus not be baked. It must first be transferred
to a non-metal tube or tray, for example a glass tray. This is placed in an oven and baked
according to the IPC/JEDEC J-STD-033C MSL specification. A picture of this baking method
is shown below.
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IQ Switch®
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Figure 12.6 IQS550 Baking Example
Take the IQS5xx out of the carrier tape and place on for example a glass sheet. Ensure all the
IQS5xx‟s are turned top side up and not lying on top of each other. Bake the product for 24
hours at 125 0C. Remove from oven and let cool for about 1 hour before handling.
12.3 Handling of the IQS5xx
When handling the IQS5xx product, ESD (Electrostatic discharge) must be avoided as far as
possible. Make sure all equipment and personnel are grounded to avoid static build-up.
Machines should be grounded and personnel should wear grounding straps.
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IQ Switch®
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12.4 Reflow for IQS5xx
When soldering the IQS5xx to a board, the correct temperature curve must be followed to
ensure good soldering joints and to avoid damaging the chip due to high temperatures.
Figure 12.7 Reflow Temperature Curve for the IQS5xx
The figure above shows the temperature profile to be used when soldering the IQS5xx onto a
board. This is according to the JEDEC (J-STD-020D.1) standard lead-free reflow profile.
Table 12.3
JEDEC Standard Lead-Free Reflow Profile
Symbol
Description
Value
TSmax to TP
Average ramp-up rate
3 0C/second max
TSmin
Temperature min
150 0C
TSmax
Temperature max
200 0C
ts
Preheat time
60 – 120 seconds
TL
Temperature
217 0C
tL
Time maintained above
temperature TL
60 – 150 seconds
TP
Peak/classification temperature
260 0C
tP
Time within 5 0C of actual peak
temperature (TP)
30 seconds
Ramp-down rate
6 0C/second max
Time: 25 0C to peak temperature
8 minutes max
t25C to tP
All temperatures refer to topside of the package, measured on the body surface.
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IQ Switch®
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13 Device Marking
13.1 IQS550 Marking
Copyright © Azoteq (Pty) Ltd
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A
=
IC Name
B
=
Assembly Plant
C
=
Internal use
D
=
Internal use
E
=
Country of Origin
F
=
Assembly Year
G
=
Assembly Week
H
=
Dot – Pin1 reference
I
=
Internal use
J
=
Design Revision
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IQ Switch®
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13.2 IQS572/IQS525 Marking
A
B
C
D
E
F
G
H
A
=
IC Name
B
=
Assembly Plant
C
=
Internal use
D
=
Internal use
E
=
Country of Origin
F
=
Assembly Date
G
=
Additional Information including Design Revision Code
H
=
Dot – Pin1 reference
14 Ordering Information
Order quantities will be subject to multiples of full reels. For large orders, Azoteq can provide
custom configured devices.
14.1 IQS550 Ordering
IQS550 zz
QN R
IC NAME
BULK PACKAGING
CONFIGURATION CODE
PACKAGE TYPE
IC NAME
IQS550
=
IQS550
CONFIGURATION CODE
BL
=
Bootloader (ready for application firmware
programming, B000 firmware NOT pre-loaded)
PACKAGE TYPE
QN
=
QFN(7x7)-48
BULK PACKAGING
R
=
Reel (2500pcs/reel)
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IQ Switch®
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14.2 IQS572 Ordering
IQS572 zz
QN R
IC NAME
BULK PACKAGING
CONFIGURATION CODE
PACKAGE TYPE
IC NAME
IQS572
=
IQS572
CONFIGURATION CODE
BL
=
Bootloader (ready for application firmware
programming, B000 firmware NOT pre-loaded)
PACKAGE TYPE
QN
=
QFN(4x4)-28
BULK PACKAGING
R
=
Reel (3000pcs/reel)
14.3 IQS525 Ordering
IQS525 zz
QN R
IC NAME
BULK PACKAGING
CONFIGURATION CODE
PACKAGE TYPE
IC NAME
IQS525
=
IQS525
CONFIGURATION CODE
BL
=
Bootloader (ready for application firmware
programming, B000 firmware NOT pre-loaded)
PACKAGE TYPE
QN
=
QFN(4x4)-28
BULK PACKAGING
R
=
Reel (3000pcs/reel)
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IQ Switch®
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Changes:
Release v1.00
 IQS5xx-B000 datasheet released
Release v1.01
 Added ‘Minimum count Re-ATI delta„ to memory map, and updated Section 3.7.2.

Updated links (Sections 4.3 and 8.8.2)
Release v2.00











Updated wake pin functionality and changed terminology from wake to switch input:
Updated section 7.3.2 and 8.8.1, added SWITCH_STATE bit, added SW_INPUT_EVENT
bit, Added section 7.11
Added export file version: Updated Section 7.1 and memory map
Updated Note 2 in Table 10.8 (525 setup added and ATI target fixed)
Fixed heading of Table 2.3
Updated Figure 11.4
Updated RxToTx register to include IQS572 (memory map also updated), and updated
Section 5.1.4
Added Section 7.9 and 7.10
Updated Section 8.8.1 with updated trackpad event definition
Added tap location details to Section 6.1
Removed manual device setup description and startup flow diagram from Section 7.2
Updated overview diagrams and circuit diagrams (removed program interface on PGM and
NRST, and updated SW_IN pin)
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IQ Switch®
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15 Contact Information
USA
Asia
South Africa
Physical 6507 Jester Blvd
Address Bldg 5, suite 510G
Austin
TX 78750
USA
Rm2125, Glittery City
Shennan Rd
Futian District
Shenzhen, 518033
China
109 Main Street
Paarl
7646
South Africa
Postal
Address
6507 Jester Blvd
Bldg 5, suite 510G
Austin
TX 78750
USA
Rm2125, Glittery City
Shennan Rd
Futian District
Shenzhen, 518033
China
PO Box 3534
Paarl
7620
South Africa
Tel
+1 512 538 1995
+86 755 8303 5294
ext 808
+27 21 863 0033
Fax
+1 512 672 8442
Email
[email protected]
+27 21 863 1512
[email protected]
[email protected]
Please visit www.azoteq.com for a list of distributors and worldwide representation.
The following patents relate to the device or usage of the device: US 6,249,089; US 6,952,084; US 6,984,900; US
7,084,526; US 7,084,531; US 8,395,395; US 8,531,120; US 8,659,306; US 8,823,273; US 9,209,803; US 9,360,510; EP
2,351,220; EP 2,559,164; EP 2,656,189; HK 1,156,120; HK 1,157,080; SA 2001/2151; SA 2006/05363; SA 2014/01541; SA
2015/023634
®
®
TM
IQ Switch , SwipeSwitch™, ProxSense , LightSense™, AirButton , ProxFusion™, Crystal Driver™ and the
logo are trademarks of Azoteq.
The information in this Datasheet is believed to be accurate at the time of publication. Azoteq uses reasonable effort to maintain the i nformation up-to-date and accurate, but does not warrant
the accuracy, completeness or reliability of the information contained herein. All content and information are provided on an “as is” basis only, without any representations or warranties, express
or implied, of any kind, including representations about the suitability of these products or information for any purpose. Values in the datasheet is subject to change without notice, please ensure
to always use the latest version of this document. Application specific operating conditions should be taken into account during design and verified before mass production. Azoteq disclaims all
warranties and conditions with regard to these products and information, including but not limited to all implied warranties and conditions of merchantability, fitness for a particular purpose, title
and non-infringement of any third party intellectual property rights. Azoteq assumes no liability for any damages or injury arising from any use of the information or the product or caused by,
without limitation, failure of performance, error, omission, interruption, defect, delay in operation or transmission, even if Azoteq has been advised of the possibility of such damages. The
applications mentioned herein are used solely for the purpose of illustration and Azoteq makes no warranty or representation that such applications will be suitable without further modification,
nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Azoteq products are not authorized for use as critical components in
life support devices or systems. No licenses to patents are granted, implicitly, express or implied, by estoppel or otherwise, under any intellectual property rights. In the event that any of the
abovementioned limitations or exclusions does not apply, it is agreed that Azoteq‟s total liability for all losses, damages and causes of action (in contract, tort (including without limitation,
negligence) or otherwise) will not exceed the amount already paid by the customer for the products. Azoteq reserves the right to alter its products, to make corrections, deletions, modifications,
enhancements, improvements and other changes to the content and information, its products, programs and services at any time o r to move or discontinue any contents, products, programs or
services without prior notification. For the most up-to-date information and binding Terms and Conditions please refer to www.azoteq.com
www.azoteq.com/ip
[email protected]
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