Intersil ISL33334E Operates from a single 3.3v supply Datasheet

DATASHEET
3.3V, ±15kV ESD Protected, Two Port, Dual Protocol
(RS-232/RS-485) Transceivers
ISL33334E, ISL33337E
Features
The ISL33334E, ISL33337E are two port interface ICs where
port 1 is configured as a dual (2 Tx, 2 Rx) RS-232 transceiver
and port 2 is a single RS-485/RS-422 transceiver.
• ±15kV (HBM) ESD protected bus pins (RS-232 or RS-485)
The on-board charge pump generates RS-232 compliant ±5V
Tx output levels from a single VCC supply as low as 3.15V. The
transceivers are RS-232 compliant, with the Rx inputs
handling up to ±25V.
The port 2 transceiver supports both the RS-485 and RS-422
differential communication standards. The receiver features
"full fail-safe" operation, so the Rx output remains in a high
state if the inputs are open or shorted together. The
transmitter supports two data rates, one of which is slew rate
limited for problem free communication at low data rates. The
active low Rx enable pin (RE485) allows Tx/Rx direction
control, via a single signal, simply by connecting the
corresponding DE485 and RE485 pins together.
The ISL33334E and ISL33337E also include a shutdown
function, which disables the Tx and Rx outputs, disables the
charge pumps and places the IC in a low current (40µA) mode.
The ISL33337E is a QFN packaged device for space
constrained applications.
• Operates from a single 3.3V supply
• Two independent ports, port 1 set for RS-232 (2 Transceivers)
and port 2 for RS-485/RS-422 (1 transceiver)
• True flow-through pinouts (Rx inputs and Tx outputs all on
the same side) simplify board layouts
• Pb-free (RoHS compliant)
• Full fail-safe (open/short) RS-485/422 Port 2 Rx
• User selectable RS-485 data rates
- Fast speed. . . . . . . . . . . . . . . . . . . . . . . . . . . . up to 20Mbps
- Slew rate limited . . . . . . . . . . . . . . . . . . . . . . up to 115kbps
• Fast RS-232 data rate . . . . . . . . . . . . . . . . . . . . up to 400kbps
• Small charge pump capacitors . . . . . . . . . . . . . . . . 4 x 0.1µF
• Low current shutdown mode . . . . . . . . . . . . . . . . . . . . . . 40µA
• QFN package saves board space (ISL33337E only)
Applications
• Gaming applications (e.g., slot machines)
• Single board computers
Related Literature
• Factory automation
• For a full list of related documents, visit our website
- ISL33334E, ISL33337E product pages
• Security networks
• Industrial/process control networks
• Level translators (e.g., RS-232 to RS-422)
• Point-of-sale equipment
TABLE 1. SUMMARY OF FEATURES
PART NUMBER
PACKAGE OPTION
PORT 2
RS-485 DATA RATE (bps)
PORT 1
RS-232 DATA RATE (bps)
LOW POWER
SHUTDOWN?
PORT 2
RS-485 Rx AND Tx ENABLE?
ISL33334E
28 Ld SSOP
20M, 115k
400k
YES
YES
ISL33337E
40 Ld QFN (6x6mm)
20M, 115k
400k
YES
YES
October 21, 2016
FN8776.1
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2015, 2016. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ISL33334E, ISL33337E
Ordering Information
PART NUMBER
(Notes 2, 3)
PART MARKING
TEMP. RANGE
(°C)
TAPE AND REEL
(UNITS)
PACKAGE
(RoHS COMPLIANT)
PKG.
DWG. #
ISL33334EIAZ
33334E IAZ
-40 to +85
-
28 Ld SSOP
M28.209
ISL33334EIAZ-T (Notes 1)
33334E IAZ
-40 to +85
1k
28 Ld SSOP
M28.209
ISL33337EIRZ
33337E IRZ
-40 to +85
-
40 Ld QFN
L40.6x6
ISL33337EIRZ-T (Notes 1)
33337E IRZ
-40 to +85
1k
40 Ld QFN
L40.6x6
ISL33337EIRZ-T7A (Notes 1) 33337E IRZ
-40 to +85
250
40 Ld QFN
L40.6x6
NOTES:
1. Refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), see product information page for ISL33334E, ISL33337E. For more information on MSL, see tech brief TB363.
TABLE 2. KEY DIFFERENCES BETWEEN FAMILY OF PARTS
PART NUMBER
VCC
(V)
PKG
RS485 (bps)
DATA RATE
RS232 (bps)
DATA RATE
ISL33354E
5
28Ld SSOP
20M, 115k
650k
ISL33357E
5
40Ld QFN
20M, 115k
650k
ISL33334E
3.3
28Ld SSOP
20M, 115k
400k
ISL33337E
3.3
40Ld QFN
20M, 115k
400k
NOTE: For a full list of dual protocol transceivers, please visit our website.
Pin Configurations
36
V+
1
R1IN
2
23 T2IN
R2IN
3
22 T1IN
T1OUT
4
SLOW485 14
*GND
6
D
18 RO
*VCC
7
17 V-
R
16 RE485
PORT 2 15 GND
Y
8
Z
9
A
* NOT A SUPPLY PIN, BUT MUST BE CONNECTED TO THE
NOTED SUPPLY.
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2
27 T1IN
D
26 *VCC
25 SHDN
PORT 2
24 DI
D
23 DE485
22 RO
R
EP
10
11
12
13
14
15
21 DNC
16
17
18
19
20
*VCC
B 13
19 DE485
28 T2IN
D
V-
Z 11
5
29 R1OUT
RE485
Y 10
A 12
T2OUT
20 DI
*VCC 9
30 R2OUT
*GND
21 SHDN
D
31
GND
*GND 8
32
R
GND
D
T2OUT 7
33
R
*VCC
24 R1OUT
R
34
PORT 1
SLOW485
25 R2OUT
35
VCC
C2+
37
NC
C1+
38
NC
C1-
39
VCC
NC
40
26 VCC
R
R2IN 5
T1OUT 6
27 C2-
*VCC
V+ 3
R1IN 4
28 C2+
NC
PORT 1
C1- 2
B
C1+ 1
C2-
ISL33337E
(40 LD QFN)
TOP VIEW
ISL33334E
(28 LD SSOP)
TOP VIEW
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Pin Descriptions
PIN NAME
PIN # for
SSOP
PIN # for
QFN
PORT/
MODE
NC
-
DNC
-
21
BOTH
Do not make any external connections to this pin.
SHDN
21
25
BOTH
A low on SHDN disables the charge pumps, disables all the outputs and places the device in low power
shutdown. Internally pulled-high. SHDN = 1 for normal operation.
VCC
26
31, 34
BOTH
System power supply input (3.15V to 3.45V). Both pins 31 and 34 must connect to the VCC supply.
GND
15
15, 16
BOTH
Ground connection. QFN pins 15 and 16 must both connect to GND. This is also the potential of the QFN’s
exposed metal pad (EP).
*VCC
9
12, 20, 7, BOTH
14, 26
For proper operation, connect this lead to the VCC supply. This is not a power supply lead, so no decoupling
is required.
*GND
8
6, 17
BOTH
RxIN
4, 5
2, 3
1 / RS-232 RS-232 receiver input with ±15kV ESD protection. A low on RxIN forces RxOUT high; a high on RXIN forces
RxOUT low.
RxOUT
24, 25
29, 30
1 / RS-232 RS-232 receiver output.
TxIN
22, 23
27, 28
1 / RS-232 RS-232 transmitter input. A low on TxIN drives the corresponding TxOUT high, while a high on TxIN drives
the corresponding TxOUT low.
TxOUT
6, 7
4, 5
1 / RS-232 RS-232 transmitter output with ±15kV ESD protection.
C1+
1
37
1 / RS-232 External charge pump capacitor is connected to this lead.
C1-
2
38
1 / RS-232 External charge pump capacitor is connected to this lead.
C2+
28
36
1 / RS-232 External charge pump capacitor is connected to this lead.
C2-
27
35
1 / RS-232 External charge pump capacitor is connected to this lead.
V+
3
1
1 / RS-232 Internally generated positive RS-232 transmitter supply (+5.5V).
V-
17
19
1 / RS-232 Internally generated negative RS-232 transmitter supply (-5.5V).
A
12
10
2 / RS-485 RS-485 noninverting receiver input with ±15kV ESD protection.
B
13
11
2 / RS-485 RS-485 inverting receiver input with ±15kV ESD protection.
Y
10
8
2/ RS-485 RS-485 noninverting driver output with ±15kV ESD protection.
Z
11
9
2/ RS-485 RS-485 inverting driver output with ±15kV ESD protection.
DI
20
24
2 / RS-485 RS-485 driver input. A low on DI forces output Y low and output Z high.
RO
18
22
2 / RS-485 RS-485 receiver output: If A > B by at least -40mV, RO is high; If A < B by -200mV or more, RO is low;
RO = High if A and B are unconnected (floating) or shorted together (i.e., full fail-safe).
SLOW485
14
13
2 / RS-485 RS-485 data rate control. A low on SLOW485 selects the 115kbps RS-485 data rate (slew rate limited
output transitions); a high selects the 20Mbps data rate (full speed transitions). Internally pulled-high.
RE485
16
18
2/ RS-485 RS-485 active low receiver output enable. RO is enabled when RE485 is low; RO is high impedance when
RE485 is high. Internally pulled low.
DE485
19
23
2/ RS-485 RS-485 driver output enable (DE). The driver outputs, Y and Z, are enabled by driving DE485 high. They
are high impedance when DE485 is low. Internally pulled high.
EP
-
EP
BOTH
32, 33, 39, BOTH
40
FUNCTION
No Internal Connection.
For proper operation, connect this lead to GND. This is not a power supply lead.
QFN exposed thermal pad (EPAD). Connect to GND.
TABLE 3. ISL33334E AND ISL33337E FUNCTION TABLE
INPUTS
RECEIVER OUTPUTS
Y AND Z
N.A.
PORT
SHDN
RE485
DE485
SLOW485
RO
R1OUT
AND
R2OUT
1
1
N.A.
N.A.
N.A.
N.A.
ON
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3
DRIVER OUTPUTS
T1OUT AND
T2OUT
CHARGE
PUMPS
(Note 4)
DRIVER
DATA
RATE
(bps)
ON
ON
400k
MODE
RS-232
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
TABLE 3. ISL33334E AND ISL33337E FUNCTION TABLE
INPUTS
RECEIVER OUTPUTS
DRIVER OUTPUTS
Y AND Z
T1OUT AND
T2OUT
CHARGE
PUMPS
(Note 4)
DRIVER
DATA
RATE
(bps)
MODE
PORT
SHDN
RE485
DE485
SLOW485
RO
R1OUT
AND
R2OUT
2
1
0
0
0
ON
N.A.
High-Z
N.A.
ON
115k
RS-485 Rx
2
1
0
1
0
ON
N.A.
ON
N.A.
ON
115k
RS-485 Tx
and Rx
2
1
1
1
0
High-Z
N.A.
ON
N.A.
ON
115k
RS-485 Tx
2
1
0
0
1
ON
N.A.
High-Z
N.A.
ON
20M
RS-485 Rx
2
1
0
1
1
ON
N.A.
ON
N.A.
ON
20M
RS-485 Tx
and Rx
2
1
1
1
1
High-Z
N.A.
ON
N.A.
ON
20M
RS-485 Tx
1 AND 2
0
X
X
X
High-Z
High-Z
High-Z
High-Z
OFF
N.A.
Shutdown
NOTE:
4. Charge pumps are off if SHDN = 0. If SHDN = 1, the charge pumps are on.
Truth Tables
RS-485 TRANSMITTING (PORT 2)
RS-232 TRANSMITTING (PORT 1)
INPUTS
INPUTS
OUTPUTS
OUTPUTS
SHDN
T1IN
T2IN
T1OUT
T2OUT
SHDN
DE485
DI
SLOW485
Y
Z
DATA RATE
(bps)
1
0
0
1
1
1
1
0
0
0
1
115k
1
0
1
1
0
1
1
1
0
1
0
115k
1
1
0
0
1
1
1
0
1
0
1
20M
1
1
1
0
0
1
1
1
1
1
0
20M
0
X
X
High-Z
High-Z
1
0
X
X
High-Z High-Z
N.A.
0
X
X
X
High-Z High-Z
N.A.
RS-232 RECEIVING (PORT 1)
INPUTS
OUTPUTS
SHDN
R1IN
R2IN
R1OUT
R2OUT
1
0
0
1
1
1
0
1
1
0
1
1
0
0
1
1
1
1
0
0
1
Open
Open
1
1
0
X
X
High-Z
High-Z
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4
RS-485 RECEIVING (PORT 2)
INPUTS
OUTPUT
SHDN
RE485
A-B
RO
1
0
≥-40mV
1
1
0
≤-200mV
0
1
0
Open or Shorted together
1
1
1
X
High-Z
0
X
X
High-Z
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Typical Operating Circuits
+3.3V
+
0.1µF
1
C1
0.1µF
+
C2
0.1µF
28
+
27
R1IN
R2IN
T2OUT
T1OUT
B
A
2
9, 26
C1+
VCC
V+
C1C2+
3
+ C3
0.1µF
V- 17
C2-
4
5kΩ
5
5kΩ
24
R
25
R
7
D
6
D
23
22
C4
0.1µF
+
R1OUT
R2OUT
T2IN
T1IN
13
12
R
18
RO
16
RE485
Z
Y
11
10
D
20
DI
19
DE485
21
14
SHDN
VCC
VCC
SLOW485
GND
8, 15
NOTE: PINOUT FOR SSOP
FIGURE 1. PORT RS-232 MODE AND 1 PORT RS-485 MODE
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FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
All Except A,B, RxIN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Input/Output Voltages
A, B, RxIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V to +25V
Y, Z, TxOUT (Note 5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . -12.5V to +12.5V
RO, RxOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC + 0.5V)
Output Short-circuit Duration
Y, Z, TxOUT, RxOUT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . See Specification Table on page 7
Latch-up (per JESD78D, Level 2, Class A) . . . . . . . . . . . . . . . . . . . . . +85°C
JA (°C/W) JC (°C/W)
Thermal Resistance (Typical)
28 Ld SSOP Package (Notes 7, 9) . . . . . . . .
60
36
40 Ld QFN Package (Notes 6, 8) . . . . . . . . .
32
2.5
Maximum Junction Temperature (Plastic Package) . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . . . . . . -65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .see TB493
Recommended Operating Conditions
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3V
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
RS-485 Tx Load . . . . . . . . . . . . . . . . . . . . . . One or two 120Ω Terminations
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. One output at a time, IOUT ≤100mA for ≤10 mins.
6. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
7. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
8. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
9. For JC, the “case temp” location is taken at the package top center.
Electrical Specifications Test Conditions: VCC = 3.15V to 3.45V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at VCC = 3.3V,
TA = +25°C (Note 10). Boldface limits apply across the operating temperature range, -40°C to +85°C.
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 14)
TYP
MAX
(Note 14)
UNIT
Full
-
-
VCC
V
Full
2
2.3
-
V
DC CHARACTERISTICS - RS-485 DRIVER (PORT 2)
Driver Differential VOUT (no load)
VOD1
Driver Differential VOUT (with load)
VOD2
R = 50Ω (RS-422) (Figure 2)
R = 27Ω (RS-485) (Figure 2)
Full
1.5
2
5
V
VOD3
RD = 60Ω, R = 375Ω, VCM = -7V to 12V (Figure 2)
Full
1.5
-
5
V
VOD
R = 27Ω or 50Ω (Figure 2)
Full
-
0.01
0.2
V
Driver Common-Mode VOUT
VOC
R = 27Ω or 50Ω (Figure 2)
Full
-
-
3
V
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
VOC
R = 27Ω or 50Ω (Figure 2)
Full
-
0.01
0.2
V
Full
35
-
250
mA
VOUT = 12V
Full
-
-
200
µA
VOUT = -7V
Full
-200
-
-
µA
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Short-Circuit Current,
VOUT = High or Low
IOS
-7V ≤ (VY or VZ) ≤ 12V (Note 12)
Driver Three-State Output Leakage
Current (Y, Z)
IOZ
Outputs disabled,
VCC = 0V or 3.6V
DC CHARACTERISTICS - RS-232 DRIVER (PORT 1)
Driver Output Voltage Swing
VO
All TOUTS loaded with 3kΩ to ground
Full
±5
-
-
V
Driver Output Short-Circuit Current
IOS
VOUT = 0V
Full
-60
-
60
mA
DC CHARACTERISTICS - LOGIC PINS (i.e., DRIVER AND CONTROL INPUT PINS)
Input High Voltage
VIH
Full
2.2
-
-
V
Input Low Voltage
VIL
Full
-
-
0.8
V
Input Current
IIN1
Pins Without Pull ups or Pull downs
Full
-2
-
2
µA
IIN2
SLOW485, DE485, RE485, SHDN
Full
-25
-
25
µA
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FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Electrical Specifications Test Conditions: VCC = 3.15V to 3.45V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at VCC = 3.3V,
TA = +25°C (Note 10). (Continued)Boldface limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
TEMP
(°C)
MIN
(Note 14)
TYP
MAX
(Note 14)
UNIT
-7V ≤ VCM ≤ 12V, full fail-safe
Full
-0.2
-
-0.04
V
VCM = 0V
25
-
35
-
mV
VIN = 12V
Full
-
-
0.8
mA
VIN = -7V
Full
-0.64
-
-
mA
Full
15
-
-
kΩ
VIN
Full
-25
-
25
V
SYMBOL
TEST CONDITIONS
DC CHARACTERISTICS - RS-485 RECEIVER INPUTS (PORT 2)
Receiver Differential Threshold
Voltage
V TH
V TH
Receiver Input Hysteresis
Receiver Input Current (A, B)
IIN
Receiver Input Resistance
RIN
VCC = 0V or 3.0 to 3.6V
-7V ≤ VCM ≤ 12V, VCC = 0 (Note 13) or
3V ≤ VCC ≤ 3.6V
DC CHARACTERISTICS - RS-232 RECEIVER INPUTS (PORT 1)
Receiver Input Voltage Range
Receiver Input Threshold
VIL
Full
-
1.1
0.8
V
VIH
Full
2.4
1.6
-
V
Receiver Input Hysteresis
V TH
25
-
0.5
-
V
Receiver Input Resistance
RIN
Full
3
5
7
kΩ
VCC-0.4
-
-
V
VIN = ±15V, VCC powered up (Note 13)
DC CHARACTERISTICS - RECEIVER OUTPUTS (PORT 1 and 2)
Receiver Output High Voltage
VOH
IO = -1.5mA
Full
Receiver Output Low Voltage
VOL
IO = 5mA
Full
-
0.2
0.4
V
Receiver Short-Circuit Current
IOSR
0V ≤ VO ≤ VCC
Full
7
-
85
mA
Receiver Three-State Output Current
IOZR
Output Disabled, 0V ≤ VO ≤ VCC
Full
-
-
±10
µA
ICC
SHDN = VCC
Full
-
3.7
7
mA
SHDN = SLOW485 = GND, RE485 = VCC,
DE485 = GND
Full
-
40
160
µA
Bus Pins (A, B, Y, Z, RxIN, TxOUT) Any
Port
Human body model
25
-
±15
-
kV
All Other Pins
Human body model
25
-
±2.5
-
kV
Machine model
25
-
±200
-
V
POWER SUPPLY CHARACTERISTICS
No-Load Supply Current, (Note 11)
Shutdown Supply Current
ISHDN
ESD CHARACTERISTICS
RS-232 DRIVER AND RECEIVER SWITCHING CHARACTERISTICS (PORT 1, ALL VERSIONS AND SPEEDS)
Driver Output Transition Region
Slew Rate
SR
Driver Output Transition Time
tr, tf
Driver Propagation Delay
tDPHL
RL = 3kΩ, Measured From
3V to -3V or -3V to 3V
CL ≥15pF
Full
-
20
30
V/µs
CL 2500pF
Full
4
9
-
V/µs
RL = 3kΩ, CL = 2500pF, 10% - 90%
Full
0.22
1.2
3.1
µs
RL = 3kΩ CL = 1000pF (Figure 7)
Full
-
1
2
µs
Full
-
1.2
2
µs
tDPLH
Driver Propagation Delay Skew
tDSKEW
tDPHL - tDPLH (Figure 7)
Full
-
300
450
ns
Driver Enable Time from Shutdown
tDENSD
VOUT = ±3.0V, CL = 1000pF
25
-
25
-
µs
Driver Maximum Data Rate
DRD
RL = 3kΩ, CL = 500pF, One Transmitter
Switching
Full
250
400
-
kbps
Receiver Propagation Delay
tRPHL
CL = 15pF (Figure 8)
Full
-
40
120
ns
Full
-
58
120
ns
tRPLH
Submit Document Feedback
7
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Electrical Specifications Test Conditions: VCC = 3.15V to 3.45V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at VCC = 3.3V,
TA = +25°C (Note 10). (Continued)Boldface limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
SYMBOL
Receiver Propagation Delay Skew
tRSKEW
Receiver Maximum Data Rate
DRR
TEST CONDITIONS
TEMP
(°C)
MIN
(Note 14)
TYP
MAX
(Note 14)
UNIT
tRPHL - tRPLH (Figure 8)
Full
-
18
40
ns
CL = 15pF
Full
0.46
2
-
Mbps
Full
10
20
35
ns
RS-485 DRIVER SWITCHING CHARACTERISTICS (FAST DATA RATE (20Mbps), PORT 2, (SLOW485 = VCC))
Driver Differential Input to Output
Delay
tDLH, tDHL RDIFF = 54Ω, CL = 100pF (Figure 3)
Driver Output Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 3)
Full
-
2
10
ns
Driver Differential Rise or Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF, (Figure 3)
Full
3
20
30
ns
Driver Enable to Output Low
tZL
CL = 100pF, SW = VCC (Figure 4)
Full
-
28
60
ns
Driver Enable to Output High
tZH
CL = 100pF, SW = GND (Figure 4)
Full
-
35
60
ns
Driver Disable from Output Low
tLZ
CL = 15pF, SW = VCC (Figure 4)
Full
-
30
60
ns
Driver Disable from Output High
tHZ
CL = 15pF, SW = GND Figure 4)
Full
-
30
60
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 500Ω, CL = 100pF, SW = VCC (Figure 4)
Full
-
100
250
ns
Driver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 500Ω, CL = 100pF, SW = GND (Figure 4)
Full
-
290
375
ns
RDIFF = 54Ω, CL = 100pF (Figure 3)
Full
20
35
-
Mbps
800
1600
2500
ns
Driver Maximum Data Rate
fMAX
RS-485 DRIVER SWITCHING CHARACTERISTICS (SLOW DATA RATE (115kbps), PORT 2, (SLOW485 = GND))
Driver Differential Input to Output
Delay
tDLH, tDHL RDIFF = 54Ω, CL = 100pF (Figure 3)
Full
Driver Output Skew
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 3)
Full
-
250
500
ns
Driver Differential Rise or Fall Time
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 3)
Full
1000
1700
3100
ns
Full
-
45
100
ns
Driver Enable to Output Low
tZL
CL = 100pF, SW = VCC (Figure 4)
Driver Enable to Output High
tZH
CL = 100pF, SW = GND (Figure 4)
Full
-
900
1200
ns
Driver Disable from Output Low
tLZ
CL = 15pF, SW = VCC (Figure 4)
Full
-
35
60
ns
Driver Disable from Output High
tHZ
CL = 15pF, SW = GND (Figure 4)
Full
-
25
60
ns
Driver Enable from Shutdown to
Output Low
tZL(SHDN)
RL = 500Ω, CL = 100pF, SW = VCC (Figure 4)
Full
-
-
800
ns
Driver Enable from Shutdown to
Output High
tZH(SHDN)
RL = 500Ω, CL = 100pF, SW = GND (Figure 4)
Full
-
-
1500
ns
RDIFF = 54Ω, CL = 100pF (Figure 3)
Full
115
800
-
kbps
Driver Maximum Data Rate
fMAX
RS-485 RECEIVER SWITCHING CHARACTERISTICS (PORT 2, ALL SPEEDS)
Receiver Input to Output Delay
tPLH, tPHL
(Figure 5)
Full
20
45
70
ns
Receiver Skew | tPLH - tPHL |
tSKEW
(Figure 5)
Full
-
3
10
ns
Receiver Maximum Data Rate
fMAX
Full
20
40
-
Mbps
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC (Figure 6)
Full
-
20
60
ns
Receiver Enable to Output High
tZH
CL = 15pF, SW = GND (Figure 6)
Full
-
20
60
ns
Receiver Disable from Output Low
tLZ
CL = 15pF, SW = VCC (Figure 6)
Full
-
20
60
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND (Figure 6)
Full
-
20
60
ns
Receiver Enable from Shutdown to
Output Low
tZLSHDN
CL = 15pF, SW = VCC (Figure 6)
Full
-
500
900
ns
Receiver Enable from Shutdown to
Output High
tZHSHDN
CL = 15pF, SW = GND (Figure 6)
Full
-
500
900
ns
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8
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Electrical Specifications Test Conditions: VCC = 3.15V to 3.45V, C1 - C4 = 0.1µF; unless otherwise specified. Typicals are at VCC = 3.3V,
TA = +25°C (Note 10). (Continued)Boldface limits apply across the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
SYMBOL
TEMP
(°C)
TEST CONDITIONS
MIN
(Note 14)
TYP
MAX
(Note 14)
UNIT
NOTES:
10. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless otherwise
specified.
11. Supply current specification is valid for loaded RS-485 (port 2) drivers when DE485 = 0V.
12. Applies to peak current. See “Typical Performance Curves on page 12” for more information.
13. A, B, RxIN defaults to RS-485 mode (>15kΩ) when the device is unpowered (VCC = 0V), or in SHDN.
14. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
Test Circuits and Waveforms
R
DE485
VCC
Z
DI
RD
D
VOD
Y
VOC
R
FIGURE 2. RS-485 DRIVER VOD AND VOC TEST CIRCUIT
3V
DI
50%
50%
0V
tPLH
tPHL
VOH
50%
OUT (Y)
50%
VOL
VCC
DE485
tPLH
tPHL
CL = 100pF
VOH
OUT (Z)
50%
50%
Z
DI
VOL
RDIFF
D
Y
tDLH
CL = 100pF
90%
DIFF OUT (Y - Z)
SIGNAL
GENERATOR
10%
tDHL
0V
0V
+VOD
90%
10%
tR
-VOD
tF
SKEW = |tPLH (Y or Z) - tPHL (Z or Y)|
FIGURE 3A. TEST CIRCUIT
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. RS-485 DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
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FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Test Circuits and Waveforms (Continued)
DE485
Z
DI
500Ω
VCC
D
SIGNAL
GENERATOR
GND
SW
Y
ENABLED
DE485
(SHDN FOR SHDN)
3V
50%
50%
0V
CL
tZH
tZH(SHDN)
FOR SHDN TESTS, SWITCH SHDN RATHER THAN DE485
PARAMETER SHDN/DE485 OUTPUT
OUTPUT HIGH
OUT (Y, Z)
DI
SW
CL (pF)
tHZ
1/-
Y/Z
1/0
GND
15
tLZ
1/-
Y/Z
0/1
VCC
15
tZH
1/-
Y/Z
1/0
GND
100
tZL
1/-
Y/Z
0/1
VCC
100
tZH(SHDN)
-/1
Y/Z
1/0
GND
100
tZL(SHDN)
-/1
Y/Z
0/1
VCC
100
tHZ
VOH - 0.5V VOH
2.3V
0V
tZL
tZL(SHDN)
tLZ
VCC
OUT (Y, Z)
2.3V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4A. TEST CIRCUIT
FIGURE 4. RS-485 DRIVER ENABLE AND DISABLE TIMES
RE485
0V
+1.5V
15pF
B
R
A
A
RO
0V
0V
-1.5V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
RO
1.5V
1.5V
0V
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5A. TEST CIRCUIT
FIGURE 5. RS-485 RECEIVER PROPAGATION DELAY
RE485
B
R
SIGNAL
GENERATOR
1kΩ
RO
VCC
SW
A
GND
SHDN
(FOR SHDN TESTS)
3V
1.5V
15pF
0V
ENABLED
3V
RE485
1.5V
FOR SHDN TESTS, SWITCH SHDN RATHER THAN RE485
1.5V
0V
PARAMETER
SHDN/RE485
A
SW
tHZ
1/-
+1.5V
GND
tLZ
1/-
-1.5V
VCC
tZH
1/-
+1.5V
GND
tZH
tZH(SHDN)
RO
OUTPUT HIGH
tHZ
VOH - 0.5V VOH
1.5V
0V
tZL
1/-
-1.5V
VCC
tZH(SHDN)
-/0
+1.5V
GND
tZL
tZL(SHDN)
tZL(SHDN)
-/0
-1.5V
VCC
RO
tLZ
VCC
1.5V
OUTPUT LOW
FIGURE 6A. TEST CIRCUIT
VOL + 0.5V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RS-485 RECEIVER ENABLE AND DISABLE TIMES
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10
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Test Circuits and Waveforms (Continued)
3V
SHDN
VCC
TxIN
TxIN
D
1.5V
1.5V
CL
TxOUT
0V
tDPHL
RL
SIGNAL
GENERATOR
tDPLH
VO+
TxOUT
0V
0V
VO-
SKEW = |tDPHL - tDPLH|
FIGURE 7B. MEASUREMENT POINTS
FIGURE 7A. TEST CIRCUIT
FIGURE 7. RS-232 DRIVER PROPAGATION DELAY AND TRANSITION TIMES
3V
SHDN
VCC
RxIN
RxIN
RxOUT
R
50%
50%
CL = 15pF
0V
tRPLH
tRPHL
SIGNAL
GENERATOR
VOH
RxOUT
50%
50%
SKEW = |tRPHL - tRPLH|
FIGURE 8A. TEST CIRCUIT
VOL
FIGURE 8B. MEASUREMENT POINTS
FIGURE 8. RS-232 RECEIVER PROPAGATION DELAY AND TRANSITION TIMES
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FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Typical Performance Curves
VCC = 3.3V, TA = +25°C, unless otherwise specified
90
VOL, +25 °C
DRIVER OUTPUT CURRENT (mA)
RECEIVER OUTPUT CURRENT (mA)
30
VOH, +25 °C
25
VOL, +85 °C
20
VOH, +85 °C
15
10
5.0
0
0
1
2
RECEIVER OUTPUT VOLTAGE (V)
3
70
60
50
40
30
20
10
0
3.3
0
0.5
1
1.5
2
2.5
3
3.5
DIFFERENTIAL OUTPUT VOLTAGE (V)
FIGURE 10. RS-485, DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 9. RECEIVER OUTPUT CURRENT vs RECEIVER OUTPUT
VOLTAGE
2.30
250
2.25
RDIFF = 100Ω
2.20
2.15
2.10
2.05
RDIFF = 54Ω
2.00
150
50
Y OR Z = LOW
0
Y OR Z = HIGH
-50
-100
1.90
-40
-150
0
25
50
TEMPERATURE (°C)
75
85
FIGURE 11. RS-485, DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
-40 °C
100
1.95
-25
+25 °C
+85 °C
200
OUTPUT CURRENT (mA)
DIFFERENTIAL OUTPUT VOLTAGE (V)
80
+25 °C
+85 °C
-40 °C
-7 -6
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
12
FIGURE 12. RS-485, DRIVER OUTPUT CURRENT vs
SHORT-CIRCUIT VOLTAGE
4.5
4.0
DE485 = VCC
ICC (mA)
3.5
DE485 = GND
3.0
2.5
2.0
1.5
1.0
-40
-25
0
25
50
75
85
TEMPERATURE (°C)
FIGURE 13. SUPPLY CURRENT vs TEMPERATURE
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FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Typical Performance Curves
1640
VCC = 3.3V, TA = +25°C, unless otherwise specified (Continued)
300
RDIFF = 54Ω, CL = 100pF
RDIFF = 54Ω, CL = 100pF
|tPLHZ - tPHLY|
1630
250
|tPHLZ - tPLHY|
200
1610
SKEW (ns)
tDHL
1600
1590
tDLH
100
1580
1570
150
tDHL
50
1560
|tDLH - tDHL|
1550
-40
-25
25
0
75
50
0
-40
85
-25
TEMPERATURE (°C)
25
3.0
|tDLH - tDHL|
2.0
tDLH
SKEW (ns)
PROPAGATION DELAY (ns)
2.5
22
20
19
tDHL
18
1.5
|tPHLZ - tPLHY|
1.0
17
0.5
|tPLHZ - tPHLY|
16
-40
-25
25
0
50
75
0
-40
85
-25
TEMPERATURE (°C)
0
5
RO
0
4
Z
2
1
RECEIVER OUTPUT (V)
DI
5
DRIVER INPUT (V)
RDIFF = 54Ω, CL = 100pF
Y
0
TIME (400ns/DIV)
FIGURE 18. RS-485, DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (SLOW DATA RATE)
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13
0
50
25
TEMPERATURE (°C)
85
75
FIGURE 17. RS-485, DRIVER SKEW vs TEMPERATURE
(FAST DATA RATE)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
FIGURE 16. RS-485, DRIVER PROPAGATION DELAY vs
TEMPERATURE (FAST DATA RATE)
3
85
RDIFF = 54Ω, CL = 100pF
23
15
75
FIGURE 15. RS-485, DRIVER SKEW vs TEMPERATURE
(SLOW DATA RATE)
RDIFF = 54Ω, CL = 100pF
21
50
TEMPERATURE (°C)
FIGURE 14. RS-485, DRIVER PROPAGATION DELAY vs
TEMPERATURE (SLOW DATA RATE)
24
0
RDIFF = 54Ω, CL = 100pF
DI
5
0
5
RO
0
DRIVER INPUT (V)
PROPAGATION DELAY (ns)
1620
4
3
Y
2
1
Z
0
TIME (400ns/DIV)
FIGURE 19. RS-485, DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (SLOW DATA RATE)
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
DI
0
5
RO
0
4
Z
3
2
Y
1
RDIFF = 54Ω, CL = 100pF
DI
0
0
5
RO
0
4
3
Y
2
1
Z
0
TIME (10ns/DIV)
TIME (10ns/DIV)
FIGURE 20. RS-485, DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (FAST DATA RATE)
FIGURE 21. RS-485, DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (FAST DATA RATE)
5.0
2.5
VOUT+
250kbps
BOTH TOUTS LOADED WITH 3kΩ TO GND
2 TRANSMITTERS AT 250kbps OR 400kbps
400kbps
0
-2.5
400kbps
-5
250kbps
VOUT 0
1000
2000
3000
4000
TRANSMITTER OUTPUT VOLTAGE (V)
7.5
RS-232 REGION OF NONCOMPLIANCE
TRANSMITTER OUTPUT VOLTAGE (V)
7.5
-7.5
5
DRIVER INPUT (V)
5
RECEIVER OUTPUT (V)
RDIFF = 54Ω, CL = 100pF
DRIVER INPUT (V)
VCC = 3.3V, TA = +25°C, unless otherwise specified (Continued)
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
5.0
2.5
0
VOUT+
OUTPUTS STATIC
BOTH TOUTS LOADED WITH 3kΩ TO GND
AND AT V+ OR V-
-2.5
-5
VOUT -7.5
-40
5000
-25
LOAD CAPACITANCE (pF)
FIGURE 22. RS-232, TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
0
25
TEMPERATURE (°C)
50
75
85
FIGURE 23. RS-232, TRANSMITTER OUTPUT VOLTAGE vs
TEMPERATURE
TRANSMITTER OUTPUT CURRENT (mA)
50
40
5V
TxOUT = LOW
30
0
20
CL = 2000pF, 2 CHANNELS SWITCHING
TxIN
5V
VOUT SHORTED TO GND
10
0
0
-5V
5V
-10
RxOUT
TxOUT = HIGH
0
-20
-30
-40
TxOUT/
RxIN
-25
0
25
50
75
85
2µs/DIV
TEMPERATURE (°C)
FIGURE 24. RS-232, TRANSMITTER SHORT-CIRCUIT CURRENT vs
TEMPERATURE
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14
FIGURE 25. RS-232, TRANSMITTER AND RECEIVER WAVEFORMS
AT 250kbps
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Typical Performance Curves
VCC = 3.3V, TA = +25°C, unless otherwise specified (Continued)
58
CL = 1000pF, 2 CHANNELS SWITCHING
TxIN
TxOUT/
RxIN
5V
0
-5V
5V
0
56
55
53
52
51
49
2µs/DIV
DATA RATE (kbps)
450
2 TRANSMITTERS AT +25°C
1 TRANSMITTER AT +25°C
350
300
1 TRANSMITTER AT +85°C
200
2 TRANSMITTERS AT +85°C
150
1000
500
1000
1500
2000
2000
3000
4000
LOAD CAPACITANCE (pF)
5000
FIGURE 28. RS-232, TRANSMITTER MAXIMUM DATA RATE vs
LOAD CAPACITANCE
7.5
TRANSMITTER OUTPUT VOLTAGE (V)
VOUT ≥ ±4V AND DUTY CYCLE BETWEEN 40% AND 60%
500
BOTH TOUTS LOADED WITH 5kΩ TO GND
400
0
FIGURE 27. RS-232, RECEIVER OUTPUT +DUTY CYCLE vs DATA
RATE
550
0
SR IN = 100V/µs
DATA RATE (kbps)
FIGURE 26. RS-232, TRANSMITTER AND RECEIVER WAVEFORMS
AT 400kbps
100
SR IN = 15V/µs
54
50
RxOUT
250
FULL TEMP RANGE
+25°C
VOUT+
5
+85°C
2.5
2 TRANSMITTERS SWITCHING
0
BOTH TOUTS LOADED WITH 5kΩ TO GND, CL = 1000pF
-2.5
+85°C
-5
+25°C
VOUT -7.5
0
100
200
300
400
DATA RATE (kbps)
500
RS-232 REGION OF NONCOMPLIANCE
0
VIN = ±5V
57
RECEIVER + DUTY CYCLE (%)
5V
600
FIGURE 29. RS-232, TRANSMITTER OUTPUT VOLTAGE vs DATA
RATE
Die Characteristics
650
2 TRANSMITTERS SWITCHING
600 BOTH T
OUTS LOADED WITH 3kΩ TO GND, CL = 1000pF
SKEW (ns)
550
+85°C
500
SUBSTRATE AND QFN PAD POTENTIAL
(POWERED UP):
GND
PROCESS:
BiCMOS
450
400
+25°C
350
-40 °C
300
250
0
50
200
400
600 650
DATA RATE (kbps)
FIGURE 30. RS-232, TRANSMITTER SKEW vs DATA RATE
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FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Typical Application
Detailed Description
RS-232 to RS-485 Converter
Each of the ISL3333XE parts supports dual protocols:
RS-485/RS-422 (port 2) and RS-232 (port 1). RS-485 and
RS-422 are differential (balanced) data transmission standards
for use in high speed (up to 20Mbps) networks, or long haul and
noisy environments. The differential signaling, coupled with
RS-485’s requirement for an extended Common-mode Range
(CMR) of +12V to -7V make these transceivers extremely
tolerant of ground potential differences, as well as voltages
induced in the cable by external fields. Both of these effects are
real concerns when communicating over the RS-485/RS-422
maximum distance of 4000’ (1220m).
The ISL33334E, ISL33337E are ideal for implementing a single
IC 2-wire (Tx Data, Rx Data) protocol converter, because each
port is programmed for a different protocol. Figure 31 illustrates
the simple connections to create a single transceiver RS-232 to
RS-485 converter. Depending on the RS-232 data rate, using an
RS-422 bus as an RS-232 “extension cord” can extend the
transmission distance up to 4000’ (1220m). A similar circuit on
the other end of the cable completes the conversion to/from
RS-232.
+3.3V
+ 0.1µF
C1
0.1µF
C2
0.1µF
NC
TxD
RS-232 IN
1
C1+
2
C128
C2+
+
27
C2+
4 R1IN
9, 26
VCC
V+
3
V- 17
R
R1OUT 24
+ C3
0.1µF
C4
0.1µF
+
NC
5kΩ
5 R2IN
R
Conversely, RS-485 is a true multipoint standard, which allows
up to 32 devices (any combination of drivers - must be
tri-statable - and receivers) on each bus. Now, bidirectional
communication takes place on a single bus, so the Rx inputs
and Tx outputs of a port connect to the same bus lines, as
shown in Figure 32. Port 2 is set to RS-485 /RS-422 mode and
includes one Rx and one Tx.
R2OUT 25
5kΩ
NC
RxD
RS-232 OUT
RS-485 IN
RS-485 OUT
6 T1OUT
7 T2OUT
13
B
12
A
11
Z
10
Y
T1IN 22
D
T2IN 23
D
RO
R
RS-422 is typically a point-to-point (one driver talking to one
receiver on a bus), or a point-to-multireceiver (multidrop)
standard that allows only one driver and up to 10 receivers on
each bus. Because of the one driver per bus limitation, RS-422
networks use a two bus, full duplex structure for bidirectional
communication and the Rx inputs and Tx outputs (no tri-state
required) connect to different busses, as shown in Figure 33.
RS-232 is a point-to-point, single ended (signal voltages
referenced to GND) communication protocol targeting fairly
short (<150’, 46m) and low data rate (<1Mbps) applications.
Port 1 contains two RS-232 transceivers (2 Tx and 2 Rx).
18
RE485 16
DI
D
20
DE485 19
VCC
GND
8, 15
NOTE: PINOUT FOR SSOP
FIGURE 31. SINGLE IC RS-232 TO RS-485 CONVERTER
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October 21, 2016
ISL33334E, ISL33337E
+
GENERIC 1/2 DUPLEX 485 XCVR
RO
RE
DE
DI
GENERIC 1/2 DUPLEX 485 XCVR
+3.3V OR +5V
+3.3V
ISL3333XE
+
VCC
RO
A
R
0.1µF
D
R
0.1µF
+3.3V OR +5V
0.1µF
RO
R
B/Z
RE
Tx/Rx
A/Y
DE
DI
VCC
GND
VCC
B
RE
+
D
DE
B/Z
Z
RT
RT
DI
D
A/Y
Y
GND
GND
FIGURE 32. TYPICAL HALF DUPLEX RS-485 NETWORK
+
GENERIC 422 Rx (SLAVE)
DI
+3.3V OR +5V
R
0.1µF
+3.3V OR +5V
VCC
GND
B
D
VCC
RT
Y
A
Z
B
RO
R
Z
RT
B
R
0.1µF
+
A
VCC
DE
RO
GENERIC FULL DUPLEX 422 XCVR (SLAVE)
+
ISL3333XE (MASTER)
RE
0.1µF
+3.3V
1kΩ
RO
A
D
Y
DI
GND
GND
RE485
FIGURE 33. TYPICAL RS-422 NETWORK
.
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ISL33334E, ISL33337E
ISL3333XE Advantages
These dual protocol ICs offer many parametric improvements
vs those offered on competing dual protocol devices. Some of
the major improvements are:
• 3.3V Supply Voltage - Eliminates the 5V supply that powers
just the interface IC
• 15kV Bus Pin ESD - Eases board level requirements
• Full Fail-safe RS-485 Rx - Eliminates bus biasing
• Selectable RS-485 Data Rate - Up to 20Mbps, or slew rate
limited for low EMI and fewer termination issues
• High RS-232 Data Rate - >250kbps
• Lower Tx and Rx Skews - Wider, consistent bit widths
• Lower ICC - Max ICC is 2x to 4x lower than competition
• Flow-Through Pinouts - Tx, Rx bus pins on one side, logic pins
on the other, for easy routing to connector/UART
• Packaging - Smaller (QFN) and Pb-free
RS-232 Mode (Port 1)
Rx Features
RS-232 receivers invert and convert RS-232 input levels (±3V
to ±25V) to the standard TTL/CMOS levels required by a UART,
ASIC, or µcontroller serial port. Receivers are designed to
operate at faster data rates than the drivers and they feature
very low skews (18ns) so the receivers contribute negligibly to
bit width distortion. Inputs include the standards required 3kΩ
to 7kΩ pull-down resistor, so unused inputs may be left
unconnected. Rx inputs also have built-in hysteresis to
increase noise immunity and to decrease erroneous triggering
due to slowly transitioning input signals.
Rx outputs are short-circuit protected and are only tri-statable
when the entire IC is shutdown via the SHDN pin (see Table
Table 3 on page 3 and the “Low Power Shutdown (SHDN)
Mode” on page 20 for more details).
Tx Features
RS-232 drivers invert and convert the standard TTL/CMOS
levels from a UART, or µcontroller serial port to RS-232
compliant levels (±5V minimum). The Tx delivers these
compliant output levels even at data rates of 400kbps, with
loads of 500pF. The drivers are designed for low skew (typically
12% of the 400kbps bit width) and are compliant to the
RS-232 slew rate spec (4 to 30V/µs) for a wide range of load
capacitances. Tx inputs float if left unconnected and may
cause ICC increases. For the best results, connect unused
inputs to GND.
Tx outputs are short-circuit protected and incorporate a
thermal shutdown feature to protect the IC in situations of
severe power dissipation - see the RS-485 “Tx Features” on
page 19 for more details. Both Tx outputs disable when the IC
enters thermal shutdown.
Drivers also tri-state in SHDN mode (SHDN = 0), or when the
3.3V power supply is off (see Table 3 and the “Low Power
Shutdown (SHDN) Mode” on page 20 section for more details).
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18
SHDN is a global function - affecting both ports - so it is useful
for disabling the RS-232 outputs only if both ports will always
be disabled together and if it is acceptable for the Rx to be
disabled as well.
Charge Pumps
The on-chip charge pumps create the RS-232 transmitter
power supplies (typically +5.7/-5.3V) from a single supply as
low as 3.15V and are enabled all the time unless in SHDN via
the SHDN pin. The efficient design requires only four small
0.1µF capacitors for the voltage doubler and inverter
functions. By operating discontinuously (i.e., turning off as
soon as V+ and V- pump up to the nominal values), the charge
pump contribution to ICC reduces significantly.
Data Rates and Cabling
Drivers operate at data rates up to 400kbps and are
guaranteed for data rates up to 250kbps. The charge pumps
and drivers are designed such that both drivers in port 1 can
be operated at the rated load and at 250kbps (see Figure 22
on page 14). Figure 22 also shows that drivers can easily two
thousand picofarads at data rates up to 250kbps, while still
delivering compliant ±5V output levels.
Receivers operate at data rates up to 2Mbps. They are
designed for a higher data rate to facilitate faster factory
downloading of software into the final product, thereby
improving the user’s manufacturing throughput.
Figures 25 and 26 illustrate driver and receiver waveforms at
250kbps and 400kbps, respectively. For these graphs, both
drivers of port 1 drive the specified capacitive load and a
receiver in the port.
RS-232 doesn’t require anything special for cabling; just a
single bus wire per transmitter and receiver and another wire
for GND. So an ISL3333XE RS-232 port uses a five conductor
cable for interconnection. Bus terminations are not required,
nor allowed, by the RS-232 standard.
RS-485 Mode (Port 2)
Rx Features
RS-485 receivers convert differential input signals as small as
200mV, as required by the RS-485 and RS-422 standards, to
TTL/CMOS output levels. The differential Rx provides
maximum sensitivity, noise immunity and common-mode
rejection. Per the RS-485 standard, receiver inputs function
with common-mode voltages from +12V to -7V, regardless of
supply voltage, making them ideal for long networks where
induced voltages are a realistic concern. The RS-485/RS-422
port includes a single receiver (RO).
Worst case receiver input currents are 20% lower than the 1
“unit load” (1mA) RS-485 limit, which translates to a 15kΩ
minimum input resistance.
This receiver includes a “full fail-safe” function that guarantees
a high level receiver output if the receiver inputs are
unconnected (floating), shorted together, or if the bus is
terminated but undriven (i.e., differential voltage collapses to
near zero due to termination). Fail-safe with shorted, or
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
terminated and undriven inputs is accomplished by setting the
Rx upper switching point at -40mV, thereby ensuring that the
Rx recognizes a 0V differential as a high level.
The Rx output is short-circuit protected and is tri-stated when
the RE485 input is driven low or when the IC is forced into
SHDN via a logic low on the SHDN pin.
Tx Features
The RS-485/RS-422 driver is a differential output device that
delivers at least 1.5V across a 54Ω load (RS-485) and at least
2V across a 100Ω load (RS-422). The drivers feature low
propagation delay skew to maximize bit widths and to
minimize EMI.
To allow multiple drivers on a bus, the RS-485 spec requires
that drivers survive worst case bus contentions undamaged.
The ISL3333XE drivers meet this requirement via driver output
short-circuit current limits and on-chip thermal shutdown
circuitry. The output stages incorporate current limiting
circuitry that ensures that the output current never exceeds the
RS-485 spec, even at the common-mode voltage range
extremes of 12V and -7V. In the event of a major short-circuit
condition, devices also include a thermal shutdown feature that
disables the drivers whenever the die temperature becomes
excessive. This eliminates the power dissipation, allowing the
die to cool. The drivers automatically re-enable after the die
temperature drops about 15 degrees. If the contention persists,
the thermal shutdown/re-enable cycle repeats until the fault is
cleared. Receivers stay operational during thermal shutdown.
RS-485 multidriver operation also requires drivers to include
tri-state functionality, so port 2 has a DE485 pin to control this
function. If the driver is used in an RS-422 network, such that
driver tri-state isn’t required, then the DE485 pin should be
connected to VCC, through a 1kΩ resistor, to keep the Tx in the
enabled state. Drivers are also tri-stated when the IC is in
SHDN, or when the 3.3V power supply is off.
Speed Options
The ISL3333XE offer two RS-485 speed options selectable via
the SLOW485 pin; “Fast” mode (SLOW485 = 1) selects high
slew rate driver outputs optimized for 20Mbps data rates while
“Slow” mode uses slew rate limiting designed for 115kbps
operation. See the “RS-485 Slew Rate Limited Data Rates”
and “Data Rate, Cables and Terminations” sections for more
information.
Receiver performance is the same for both speed options.
RS-485 Slew Rate Limited Data Rates
These ICs allow the user to select fast Tx output transitions
optimized for a 20Mbps data rate, or slew rate limited
transitions optimized for a data rate of 115kbps. The 20Mbps
fast edges may increase EMI and reflection issues, even
though fast transitions aren’t required at the lower data rates
used by many applications. Choosing the slew limited edges
for lower data rates permits longer unterminated networks, or
longer stubs off terminated busses and helps minimize EMI
and reflections.
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Nevertheless, for the best jitter performance when driving long
cables, the faster speed option may be preferable, even at
lower data rates. The faster output transitions deliver less
variability (jitter) when loaded with the large capacitance
associated with long cables. Of course, faster transitions
require more attention to ensuring short stub lengths and
quality terminations, so there are trade-offs to be made.
Assuming a jitter budget of 10%, it is likely better to go with
the slow speed option for data rates of 115kbps or less, to
minimize fast edge effects. For higher data rates, or when the
absolute best jitter is required, use the high speed option. The
data rate selection pertains to only port 2.
Data Rate, Cables and Terminations
RS-485/RS-422 are intended for network lengths up to 4000’
(1220m), but the maximum system data rate decreases as the
transmission length increases. Devices operating at the
maximum data rate of 20Mbps are limited to maximum
lengths of 20-100’ (6-31m), while devices operating at or
below 115kbps can operate at the maximum length of 4000’
(1220m).
Higher data rates require faster edges, so both of the
ISL3333XE versions offer an edge rate capable of 20Mbps
data rates. These ICs also offer a slew rate limited option to
minimize problems at slower data rates. Nevertheless, for the
best jitter performance when driving long cables, the faster
speed settings may be preferable, even at low data rates. See
the “RS-485 Slew Rate Limited Data Rates” section for details.
Twisted pair is the cable of choice for RS-485/RS-422
networks. Twisted pair cables tend to pick up noise and other
electromagnetically induced voltages as common-mode
signals, which are effectively rejected by the differential
receivers in these ICs.
The preferred cable connection technique is “daisy-chaining”,
where the cable runs from the connector of one device directly
to the connector of the next device, such that cable stub
lengths are negligible. A “backbone” structure, where stubs
run from the main backbone cable to each device’s connector,
is the next best choice, but care must be taken to ensure that
each stub is electrically “short”. See Table 4 for recommended
maximum stub lengths for each speed option.
TABLE 4. RECOMMENDED STUB LENGTHS
SPEED OPTION
MAXIMUM STUB LENGTH
ft (m)
SLOW
350-500 (107-152)
FAST
1-3 (0.3 - 0.9)
Proper termination is imperative to minimize reflections when
using the 20Mbps speed option. Short networks using the slow
speed option need not be terminated, but terminations are
recommended unless power dissipation is an overriding
concern. Note that the RS-485 spec allows a maximum of two
terminations on a network, otherwise the Tx output voltage
may not meet the required VOD.
In point-to-point, or point-to-multireceiver (RS-422) networks,
the main cable should be terminated in its characteristic
FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Active Low Rx Enable (RE485)
In many RS-485 applications, especially half duplex
configurations, users like to implement “echo suppression” by
disabling the corresponding receiver while its driver is
transmitting data. This function is available on the ISL3333XE
parts via an active low RE485 pin for port 2. The active low
function simplifies direction control, by allowing a single GPIO
line to provide a Tx/Rx direction control signal. Figure 34
details the advantage of using the RE485 pin.
+3.3V
ISL3333XE
+
VCC
RO
R
0.1µF
Even the ISL3333XE pinouts are features, in that the true
flow-through design simplifies board layout. Having the bus
pins all on one side of the package for easy routing to a cable
connector and the Rx outputs and Tx inputs (logic pins) on the
other side for easy connection to a UART, avoids costly and
problematic crossovers. Competing “flow-through” pinouts mix
logic and bus pin inputs on one side of the package and logic
and bus pin outputs on the other side. This forces the designer
to route four traces from the right side of the IC around the IC
to the cable connector. Figure 35 illustrates the flow-through
nature of the ISL3333XE’s pinout.
ISL33334E
R2OUT
R1OUT
T2IN
T1IN
R1IN
R2IN
T1OUT
T2OUT
UART
OR
ASIC
Y
Z
A
B
D
DI
OR
RO
µCONTROLLER
R
A
B
RE
Flow-Through Pinouts
CONNECTOR
impedance (typically 120Ω) at the end farthest from the driver.
In multireceiver applications, stubs connecting receivers to the
main cable should be kept as short as possible, but definitely
shorter than the limits shown in Table 4. Multipoint (RS-485)
systems require that the main cable be terminated in its
characteristic impedance at both ends. Again, keep stubs
connecting a transceiver to the main cable as short as possible
and refer to Table 4. Avoid “star” and other configurations,
where there are many “ends” which would require more than
the two allowed terminations to prevent reflections.
FIGURE 35. ILLUSTRATION OF FLOW-THROUGH PINOUT
Tx/Rx
DE
DI
D
Z
Low Power Shutdown (SHDN) Mode
Y
The SHDN pin is driven low to place the IC (both ports) in the
SHDN mode and the already low supply current drops to as low
as 40µA. If this functionality isn’t desired, the SHDN pin should
be connected to VCC through a 1kΩ resistor. SHDN disables the
Tx and Rx outputs and disables the charge pumps, so V+
collapses to VCC and V- collapses to GND.
GND
FIGURE 34. USING ACTIVE LOW RX ENABLE
Additional Features
High ESD
All pins on the ISL3333XE include ESD protection structures
rated at ±2.5kV (HBM), which is good enough to survive ESD
events commonly seen during manufacturing. But the bus pins
(Tx outputs and Rx inputs) are particularly vulnerable to ESD
events because they connect to an exposed port on the
exterior of the finished product. Simply touching the port pins,
or connecting a cable, can destroy an unprotected port.
ISL3333XE bus pins are fitted with advanced structures that
deliver ESD protection in excess of ±15kV (HBM), without
interfering with any signal in the RS-485 or the RS-232 range.
This high level of protection may eliminate the need for board
level protection, or at the very least will increase the
robustness of any board level scheme.
All but 10µA of SHDN supply current is due to control input
(SHDN, SLOW485, DE485) pull-up resistors (~10µA/resistor
when the input = 0V), so SHDN supply current varies
depending on the ISL3333XE configuration. For example, the
RS-485 drivers are disabled in SHDN, so driving the DE485 pin
high during this time reduces the SHDN supply current. The
spec table indicates the SHDN ICC for the worst case
configuration.
When enabling from SHDN, allow at least 25µs for the charge
pumps to stabilize before transmitting RS-232 data. The
charge pumps aren’t used by the RS-485 port, so the
transceiver is ready to send or receive data in less than 2µs,
which is much faster than competing devices that require the
charge pump for all modes of operation.
Small Packages
Many competing dual protocol devices are only available in
monstrously large 24 to 28 Ld SOIC packages. The ISL33334’s
28 Ld SSOP is 50% smaller than even a 24 Ld SOIC and the
ISL33337E’s small 6x6mm QFN footprint is 80% smaller than
a 28 Ld SOIC.
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ISL33334E, ISL33337E
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please visit our website to make sure you have the latest revision.
DATE
REVISION
CHANGE
October 21, 2016
FN8776.1
Added Related Literature section on page 1.
Added Table 2 on page 2.
Added Tape and Reel column to Ordering information table.
September 29, 2015
FN8776.0
Initial Release
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For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
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FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Package Outline Drawing
For the most recent package outline drawing, see L40.6x6.
L40.6x6
40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 3, 10/06
4X 4.5
6.00
36X 0.50
A
B
31
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
40
30
1
6.00
4 . 10 ± 0 . 15
21
10
0.15
(4X)
11
20
TOP VIEW
0.10 M C A B
40X 0 . 4 ± 0 . 1
4 0 . 23 +0 . 07 / -0 . 05
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0 . 90 ± 0 . 1
( 5 . 8 TYP )
(
C
BASE PLANE
SEATING PLANE
0.08 C
SIDE VIEW
4 . 10 )
( 36X 0 . 5 )
C
0 . 2 REF
5
( 40X 0 . 23 )
0 . 00 MIN.
0 . 05 MAX.
( 40X 0 . 6 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
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FN8776.1
October 21, 2016
ISL33334E, ISL33337E
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
N
INDEX
AREA
H
0.25(0.010) M
2
3
0.25
0.010
SEATING PLANE
-A-
INCHES
GAUGE
PLANE
-B1
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
B M
E
A
D
-C-

e
A2
A1
B
0.25(0.010) M
L
C
0.10(0.004)
C A M
B S
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
H
0.292
L
0.022
N
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
MILLIMETERS

0.65 BSC
0.322
7.40
0.037
0.55
28
0°
-
0.95
6
28
8°
0°
-
8.20
7
8°
Rev. 2 6/05
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
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23
For the most recent package outline drawing, see M28.209.
FN8776.1
October 21, 2016