Diodes DMN2029USD 20v dual n-channel enhancement mode mosfet Datasheet

DMN2029USD
20V DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
ADVANCE INFORMATION
NEW PRODUCT
Product Summary
V(BR)DSS
RDS(on) max
20V
25m @ VGS = 4.5V
35m @ VGS = 2.5V
Features
Package
SO-8
ID
TA = +25°C
5.8A
4.8A

Low Input Capacitance

Low On-Resistance

Fast Switching Speed

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

Halogen and Antimony Free. “Green” Device (Note 3)
Description

Qualified to AEC-Q101 Standards for High Reliability
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(ON)) and yet maintain superior switching
Mechanical Data
performance, making it ideal for high efficiency power management

applications.

Case: SO-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Applications

DC-DC Converters

Power Management Functions

Backlighting
SO-8

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Connections: See Diagram

Terminals: Finish – Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208

S1
D1
G1
D1
S2
D2
G2
D2
Top View
Weight: 0.074 grams (approximate)
D1
D2
G2
G1
S2
S1
Top View
Pin Configuration
Equivalent Circuit
Ordering Information (Note 4)
Part Number
DMN2029USD-13
Notes:
Case
SO-8
Packaging
2,500/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html.
Marking Information
Top View
8
5
Logo
N2029SD
Part no
.
YY WW
Xth week: 01 ~ 53
Year: “12” = 2012
1
DMN2029USD
Document number: DS36127 Rev. 3 - 2
4
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DMN2029USD
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
ADVANCE INFORMATION
NEW PRODUCT
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 4.5V
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Steady
State
t < 10s
Value
20
±8
5.8
4.7
ID
A
6.9
5.7
2.1
30
15
11.2
ID
Maximum Body Diode Forward Current (Note 6)
Pulsed Drain Current (10s pulse, duty cycle = 1%)
Avalanche Current (Note 7) L = 0.1mH
Avalanche Energy (Note 7) L = 0.1mH
Units
V
V
IS
IDM
IAS
EAS
A
A
A
A
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
TA = +25°C
TA = +70°C
Steady state
t < 10s
TA = +25°C
TA = +70°C
Steady state
t < 10s
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
PD
RθJA
PD
RθJA
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
RθJC
TJ, TSTG
Value
1.2
0.7
115
70
1.4
0.9
95
60
14.5
-55 to +150
Units
W
°C/W
W
°C/W
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
20
—
—
—
—
—
—
1
±100
V
µA
nA
VGS = 0V, ID = 250µA
VDS = 16V, VGS = 0V
VGS = ±8V, VDS = 0V
VGS(th)
RDS(ON)
|Yfs|
VSD
—
14
19
10
0.7
1.5
25
35
—
1.2
V
Static Drain-Source On-Resistance
0.6
—
—
—
—
VDS = VGS, ID = 250µA
VGS = 4.5V, ID = 6.5A
VGS = 2.5V, ID = 5.4A
VDS = 5V, ID = 6.5A
VGS = 0V, IS = 1.3A
Ciss
Coss
Crss
RG
Qg
Qg
Qgs
Qgd
tD(on)
tr
tD(off)
tf
trr
Qrr
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1171
133
110
1.2
10.4
18.6
1.9
2.3
16.5
33.3
119.3
53.5
7.5
2.0
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 8V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes:
mΩ
S
V
Test Condition
pF
VDS = 10V, VGS = 0V
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = 10V, ID = 3A
nS
VGS = 4.5V, VDD = 10V, RGEN = 6Ω,
ID = 1A
nS
nC
IS = 6.5A, dI/dt = 100A/μs
IS = 6.5A, dI/dt = 100A/μs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. IAR and EAR rating are based on low frequency and duty cycles to keep TJ = +25°C
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
DMN2029USD
Document number: DS36127 Rev. 3 - 2
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30.0
VGS = 4.5V
18
VGS = 4.0V
16
VGS = 3.5V
20.0
VGS = 3.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
25.0
VGS = 2.0V
VGS = 2.5V
15.0
10.0
VGS = 1.8V
VDS = 5.0V
14
12
10
8
TA = 85°C
6
TA = 125°C
4
5.0
0.0
0
TA = -55°C
0
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.025
VGS = 2.5V
0.02
VGS = 4.5V
0.015
VGS = 10V
0.01
0.005
0
0
5
10
15
20
25
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
1.8
1.6
VGS = 2.5 V
ID = 5A
1.4
VGS = 4.5V
ID = 10A
1.2
1
0.8
0.6
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 5 On-Resistance Variation with Temperature
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2.5
0.5
1
1.5
2
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
3
0.03
VGS = 4.5V
T A = 150°C
0.025
TA = 125°C
0.02
T A = 85°C
TA = 25°C
0.015
T A = -55°C
0.01
0.005
0
0
30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
0.03
TA = 25°C
TA = 150°C
2
VGS = 1.5V
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
ADVANCE INFORMATION
NEW PRODUCT
20
VGS = 8.0V
2
4
6
8 10 12 14 16 18
ID, DRAIN CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
20
0.04
0.03
VGS = 2.5V
ID = 5A
0.02
VGS = 4.5V
ID = 10A
0.01
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (C)
Figure 6 On-Resistance Variation with Temperature
May 2013
© Diodes Incorporated
20
1.8
18
1.6
16
IS, SOURCE CURRENT (A)
VGS(th), GATE THRESHOLD VOLTAGE (V)
2
1.4
1.2
ID = 1mA
1
0.8
0.6
ID = 250µA
0.4
14
12
0
T A = 25°C
10
8
6
4
0.2
2
0
0
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
-50
VGS GATE THRESHOLD VOLTAGE (V)
f = 1MHz
Ciss
1000
C oss
100
Crss
10
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
8
10000
CT, JUNCTION CAPACITANCE (pF)
0
2
4
6
8 10 12 14 16 18
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
1
r(t), TRANSIENT THERMAL RESISTANCE
ADVANCE INFORMATION
NEW PRODUCT
DMN2029USD
7
6
5
3
2
1
0
20
VDS = 10V
ID = 3A
4
0
2
4
6
8 10 12 14 16 18
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate Charge
20
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
RJA(t) = r(t) * RJA
RJA = 113°C/W
Duty Cycle, D = t1/ t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 11 Transient Thermal Resistance
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Package Outline Dimensions
0.254
ADVANCE INFORMATION
NEW PRODUCT
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
E1 E
A1
L
Gauge Plane
Seating Plane
Detail ‘A’
h
7°~9°
45°
Detail ‘A’
A2 A A3
b
e
D
SO-8
Dim
Min
Max
A
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
0.35
L
0.62
0.82
0
8

All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X
C1
Dimensions
X
Y
C1
C2
Value (in mm)
0.60
1.55
5.4
1.27
C2
Y
DMN2029USD
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ADVANCE INFORMATION
NEW PRODUCT
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
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