Diodes BSS84DW-7 Dual p-channel enhancement mode mosfet Datasheet

BSS84DW
DUAL P-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
Features and Benefits
V(BR)DSS
RDS(on) max
-50V
10 @ VGS = -5V
ID
TA = +25°C
-130mA

Low On-Resistance

Low Gate Threshold Voltage

Low Input Capacitance

Fast Switching Speed
Description

Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
This MOSFET has been designed to minimize the on-state resistance
(RDS(on)) and yet maintain superior switching performance, making it

Halogen and Antimony Free. “Green” Device (Note 3)

Qualified to AEC-Q101 Standards for High Reliability
ideal for high efficiency power management applications.
Mechanical Data
Applications


General Purpose Interfacing Switch

Power Management Functions

Analog Switch

Case: SOT363
Case Material: Molded Plastic. “Green” Molding Compound. UL
Flammability Classification Rating 94V-0


Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208

Terminal Connections: See Diagram

Weight: 0.006 grams (approximate)
SOT363
Top View
D2
G1
S1
S2
G2
D1
e3
Top View
Internal Schematic
Ordering Information (Note 4)
Part Number
BSS84DW-7-F
BSS84DWQ-13
BSS84DWQ-7
Notes:
Compliance
Standard
Automotive
Automotive
Case
SOT363
SOT363
SOT363
Packaging
3,000/Tape & Reel
10,000/Tape & Reel
3,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html
Marking Information
YM
Date Code Key
Year
1998
Code
J
Month
Code
Jan
1
1999
K
2000
L
Feb
2
BSS84DW
Document number: DS30204 Rev. 17 - 2
2001
M
Mar
3
2002
N
Apr
4
YM
K84
K84
2003
P
May
5
K84 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
2004
R
2005
S
Jun
6
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2006
T
Jul
7
2007
U
Aug
8
2008
V
Sep
9
2009
W
Oct
O
2010
X
2011
Y
Nov
N
2012
Z
Dec
D
February 2013
© Diodes Incorporated
BSS84DW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Drain-Gate Voltage (Note 5)
Gate-Source Voltage
Drain Current (Note 6)
Continuous
Continuous
Symbol
VDSS
VDGR
VGSS
ID
Value
-50
-50
20
-130
Units
V
V
V
mA
Value
300
417
-55 to +150
Units
mW
C/W
C
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
-50
-75
Zero Gate Voltage Drain Current
IDSS
µA
µA
nA
IGSS





-1
-2
-100
Gate-Body Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS
Turn-On Delay Time
Turn-Off Delay Time




10
nA
VGS = 0V, ID = -250µA
VDS = -50V, VGS = 0V, TJ = +25°C
VDS = -50V, VGS = 0V, TJ = +125°C
VDS = -25V, VGS = 0V, TJ = +25°C
VGS = 20V, VDS = 0V
VGS(th)
RDS (ON)
gFS
-0.8

0.05
-1.6
6

-2.0
10

V

S
VDS = VGS, ID = -1mA
VGS = -5V, ID = -0.100A
VDS = -25V, ID = -0.1A
Ciss
Coss
Crss






45
25
12
pF
pF
pF
VDS = -25V, VGS = 0V, f = 1.0MHz
tD(ON)
tD(OFF)


10
18


ns
ns
VDD = -30V, ID = -0.27A,
RGEN = 50, VGS = -10V
Notes:
V
Test Condition
5. RGS  20K.
6. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com.
7. Short duration pulse test used to minimize self-heating effect.
BSS84DW
Document number: DS30204 Rev. 17 - 2
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BSS84DW
-600
400
TA = 25°C
ID, DRAIN-SOURCE CURRENT (mA)
PD , POWER DISSIPATION (mW)
350
300
250
200
150
100
50
0
0
-500
-400
-300
-200
-100
0
50
75 100 125 150 175 200
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Max Power Dissipation vs. Ambient Temperature
25
-1.0
RDS(ON), NORMALIZED DRAIN-SOURCE
ON-RESISTANCE ()
10
ID, DRAIN-CURRENT (A)
-0.8
-0.6
-0.4
-0.2
-0.0
0
15
9
8
7
6
5
4
3
2
T A = 125°C
1
0
-5
-2
-3
-4
-6
-7
-8
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 3 Drain-Current vs. Gate-Source Voltage
-1
TA = 25°C
0
-1
-5
-2
-3
-4
VGS, GATE-SOURCE VOLTAGE (V)
Fig. 4 On-Resistance vs. Gate-Source Voltage
25.0
VGS = -10V
ID = -0.13A
RDS(ON), ON-RESISTANCE ()
12
RDS(ON), ON-RESISTANCE ()
-1
-3
-4
-2
-5
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 2 Drain-Source Current vs. Drain-Source Voltage
0
9
6
3
20.0
VGS = -3.5V
VGS = -3V
VGS = -4.5V
15.0
VGS = -5V
VGS = -4V
10.0
5.0
VGS = -6V
VGS = -8V
VGS = -10V
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Fig. 5 On-Resistance vs. Junction Temperature
BSS84DW
Document number: DS30204 Rev. 17 - 2
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0.0
-0.0
-0.4
-0.6
-0.8
ID, DRAIN-CURRENT (A)
Fig. 6 On-Resistance vs. Drain-Current
-0.2
-1.0
February 2013
© Diodes Incorporated
BSS84DW
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
SOT363
Dim Min Max Typ
A 0.10 0.30 0.25
B 1.15 1.35 1.30
C 2.00 2.20 2.10
D
0.65 Typ
F 0.40 0.45 0.425
H 1.80 2.20 2.15
J
0
0.10 0.05
K 0.90 1.00 1.00
L 0.25 0.40 0.30
M 0.10 0.22 0.11
0°
8°

All Dimensions in mm
B C
H
K
M
J
D
L
F
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C2
Z
C2
C1
G
Y
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
X
BSS84DW
Document number: DS30204 Rev. 17 - 2
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BSS84DW
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Copyright © 2013, Diodes Incorporated
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Document number: DS30204 Rev. 17 - 2
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