Material Content Data Sheet Sales Product Name BBY 58-06W H6327 MA# MA000857392 Package PG-SOT323-3-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% arsenic gold silicon silicon titanium chromium copper copper carbon black epoxy resin silicondioxide tin silver 7440-38-2 7440-57-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 5.97 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.000 0.00 10 0.006 0.10 1003 0.051 0.86 0.001 0.01 0.003 0.04 440 0.008 0.13 1321 2.617 43.85 44.03 438480 440329 0.012 0.21 0.21 2093 2093 0.031 0.52 0.672 11.27 2.424 40.62 52.41 406164 524083 0.133 2.22 2.22 22234 22234 0.010 0.17 0.17 1678 0.96 8570 2. 3. 5241 112678 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 9583 88 Important Remarks: 1. Sum [ppm] 1678 1000000