AD AD9234-500EBZ 12-bit, 1 gsps/500 msps jesd204b, dual analog-to-digital converter Datasheet

12-Bit, 1 GSPS/500 MSPS JESD204B,
Dual Analog-to-Digital Converter
AD9234
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
APPLICATIONS
BUFFER
VIN+A
VIN–A
FD_A
ADC
CORE
FD_B
12
DECIMATE
BY 2
SIGNAL
MONITOR
12
VIN+B
VIN–B
DECIMATE
BY 2
ADC
CORE
JESD204B
HIGH SPEED SERIALIZER +
Tx OUTPUTS
SPIVDD
AVDD1 AVDD2 AVDD3 AVDD1_SR DVDD DRVDD
(1.25V) (2.5V) (3.3V)
(1.25V)
(1.25V) (1.25V) (1.8V TO 3.3V)
FAST
DETECT
4
SERDOUT0±
SERDOUT1±
SERDOUT2±
SERDOUT3±
BUFFER
FAST
DETECT
V_1P0
CLK+
CLK–
÷2
÷4
÷8
AGND
SYNCINB±
JESD204B
SUBCLASS 1
CONTROL
CLOCK
GENERATION
AND ADJUST
SPI CONTROL
SYSREF±
SIGNAL
MONITOR
AD9234
DRGND DGND SDIO SCLK CSB
PDWN/
STBY
12244-001
JESD204B (Subclass 1) coded serial digital outputs
1.5 W total power per channel at 1 GSPS (default settings)
SFDR
79 dBFS at 340 MHz (1 GSPS)
86 dBFS at 340 MHz (500 MSPS)
SNR
63.4 dBFS at 340 MHz (AIN = −1.0 dBFS, 1 GSPS)
65.6 dBFS at 340 MHz (AIN = −1.0 dBFS, 500 MSPS)
ENOB = 10.4 bits at 10 MHz
DNL = ±0.16 LSB; INL = ±0.35 LSB
Noise density
−151 dBFS/Hz (1 GSPS)
−150 dBFS/Hz (500 MSPS)
1.25 V, 2.5 V, and 3.3 V dc supply operation
Low swing full scale input
1.34 V p-p nominal (1 GSPS)
1.63 V p-p nominal (500 MSPS)
No missing codes
Internal ADC voltage reference
Flexible termination impedance
400 Ω, 200 Ω, 100 Ω, and 50 Ω differential
2 GHz usable analog input full power bandwidth
95 dB channel isolation/crosstalk
Amplitude detect bits for efficient AGC implementation
Differential clock input
Optional decimate-by-2 DDC per channel
Differential clock input
Integer clock divide by 1, 2, 4, or 8
Flexible JESD204B lane configurations
Small signal dither
Figure 1.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
5.
6.
7.
Low power consumption analog core, 12-bit, 1.0 GSPS dual
analog-to-digital converter (ADC) with 1.5 W per channel.
Wide full power bandwidth supports IF sampling of signals
up to 2 GHz.
Buffered inputs with programmable input termination
eases filter design and implementation.
Flexible serial port interface (SPI) controls various product
features and functions to meet specific system requirements.
Programmable fast overrange detection.
9 mm × 9 mm 64-lead LFCSP.
Pin compatible with the AD9680 14-bit, 1 GSPS/500 MSPS
dual ADC.
Communications
Diversity multiband, multimode digital receivers
3G/4G, TD-SCDMA, W-CDMA, GSM, LTE
Point-to-point radio systems
Digital predistortion observation path
General-purpose software radios
Ultrawideband satellite receiver
Instrumentation (spectrum analyzers, network analyzers,
integrated RF test solutions)
Digital oscilloscopes
High speed data acquisition systems
DOCSIS 3.0 CMTS upstream receive paths
HFC digital reverse path receivers
Rev. A
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Technical Support
www.analog.com
AD9234
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Digital Downconverter (DDC) ..................................................... 34
Applications ....................................................................................... 1
DDC General Description ........................................................ 34
Functional Block Diagram .............................................................. 1
Half-Band Filter .......................................................................... 35
Product Highlights ........................................................................... 1
DDC Gain Stage ......................................................................... 36
Revision History ............................................................................... 3
DDC Complex to Real Conversion ......................................... 36
General Description ......................................................................... 4
Digital Outputs ............................................................................... 37
Specifications..................................................................................... 5
Introduction to the JESD204B Interface ................................. 37
DC Specifications ......................................................................... 5
JESD204B Overview .................................................................. 37
AC Specifications.......................................................................... 6
Functional Overview ................................................................. 38
Digital Specifications ................................................................... 8
JESD204B Link Establishment ................................................. 39
Switching Specifications .............................................................. 9
Physical Layer (Driver) Outputs .............................................. 41
Timing Specifications .................................................................. 9
Configuring the JESD204B Link .............................................. 43
Absolute Maximum Ratings .......................................................... 11
Multichip Synchronization............................................................ 46
Thermal Characteristics ............................................................ 11
SYSREF± Setup/Hold Window Monitor ................................. 48
ESD Caution ................................................................................ 11
Test Modes ....................................................................................... 50
Pin Configuration and Function Descriptions ........................... 12
ADC Test Modes ........................................................................ 50
Typical Performance Characteristics ........................................... 14
JESD204B Block Test Modes .................................................... 51
AD9234-1000 .............................................................................. 14
Serial Port Interface ........................................................................ 53
AD9234-500 ................................................................................ 18
Configuration Using the SPI ..................................................... 53
Equivalent Circuits ......................................................................... 22
Hardware Interface ..................................................................... 53
Theory of Operation ...................................................................... 24
SPI Accessible Features .............................................................. 53
ADC Architecture ...................................................................... 24
Memory Map .................................................................................. 54
Analog Input Considerations.................................................... 24
Reading the Memory Map Register Table............................... 54
Voltage Reference ....................................................................... 27
Memory Map Register Table ..................................................... 55
Clock Input Considerations ...................................................... 28
Applications Information .............................................................. 65
Power-Down/Standby Mode .................................................... 29
Power Supply Recommendations............................................. 65
Temperature Diode .................................................................... 29
Exposed Pad Thermal Heat Slug Recommendations ............ 65
ADC Overrange and Fast Detect .................................................. 30
AVDD1_SR (Pin 57) and AGND (Pin 56 and Pin 60) .............. 65
ADC Overrange .......................................................................... 30
Outline Dimensions ....................................................................... 66
Fast Threshold Detection (FD_A and FD_B) ........................ 30
Ordering Guide .......................................................................... 66
Signal Monitor ................................................................................ 31
Rev. A | Page 2 of 66
Data Sheet
AD9234
REVISION HISTORY
3/15—Rev. 0 to Rev. A
Added AD9234-500 ........................................................... Universal
Changes to Features Section ............................................................ 1
Changes to Table 1 ............................................................................ 5
Changes to Table 2 ............................................................................ 6
Changes to Table 4 ............................................................................ 9
Changes to Table 6, Thermal Characteristics Section, and
Table 7 ...............................................................................................11
Added AD9234-500 Section and Figure 29 to Figure 51 ...........18
Changes to Figure 63 and Figure 64 Captions, Analog Input
Controls and SFDR Optimization Section, and Figure 66 ........25
Changes to Figure 70 and Figure 71 ...............................................26
Changes to Voltage Referece Section ..............................................27
Changes to Figure 79 ...................................................................... 28
Changes to Figure 80 ...................................................................... 29
Changes to Figure 91 ...................................................................... 38
Changes to DDC General Description Section .......................... 34
Added Example 2: Full Bandwidth Mode at 500 MSPS Section... 44
Added Test Modes Section and Table 15 to Table 19 ................. 50
Changes to Table 22 ........................................................................ 55
Changes to Power Supply Recommendations Section and
Figure 106 ......................................................................................... 65
Changes to Ordering Guide ........................................................... 66
8/14—Revision 0: Initial Version
Rev. A | Page 3 of 66
AD9234
Data Sheet
GENERAL DESCRIPTION
The AD9234 is a dual, 12-bit, 1 GSPS/500 MSPS ADC. The
device has an on-chip buffer and sample-and-hold circuit
designed for low power, small size, and ease of use. This
product is designed for sampling wide bandwidth analog
signals. The AD9234 is optimized for wide input bandwidth,
high sampling rate, excellent linearity, and low power in a small
package.
The dual ADC cores feature a multistage, differential pipelined
architecture with integrated output error correction logic. Each
ADC features wide bandwidth buffered inputs supporting a
variety of user-selectable input ranges. An integrated voltage
reference eases design considerations. Each ADC data output is
internally connected to an optional decimate-by-2 block.
The AD9234 has several functions that simplify the automatic
gain control (AGC) function in a communications receiver.
The programmable threshold detector allows monitoring of the
incoming signal power using the fast detect output bits of the
ADC. If the input signal level exceeds the programmable
threshold, the fast detect indicator goes high. Because this
threshold indicator has low latency, the user can quickly turn
down the system gain to avoid an overrange condition at the
ADC input. In addition to the fast detect outputs, the AD9234
also offers signal monitoring capability. The signal monitoring
block provides additional information about the signal being
digitized by the ADC.
Users can configure the Subclass 1 JESD204B-based high speed
serialized output in a variety of one-, two-, or four-lane
configurations, depending on the acceptable lane rate of the
receiving logic device and the sampling rate of the ADC.
Multiple device synchronization is supported through the
SYSREF± and SYNCINB± input pins.
The AD9234 has flexible power-down options that allow
significant power savings when desired. All of these features
can be programmed using a 1.8 V to 3.3 V capable 3-wire SPI.
The AD9234 is available in a Pb-free, 64-lead LFCSP and is
specified over the −40°C to +85°C industrial temperature range.
This product is protected by a U.S. patent.
Rev. A | Page 4 of 66
Data Sheet
AD9234
SPECIFICATIONS
DC SPECIFICATIONS
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR = 1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, specified
maximum sampling rate, AIN = −1.0 dBFS, clock divider = 2, default SPI settings, TA = 25°C, unless otherwise noted.
Table 1.
Parameter
RESOLUTION
ACCURACY
No Missing Codes
Offset Error
Offset Matching
Gain Error
Gain Matching
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
TEMPERATURE DRIFT
Offset Error
Gain Error
INTERNAL VOLTAGE REFERENCE
Voltage
INPUT-REFERRED NOISE
VREF = 1.0 V
ANALOG INPUTS
Differential Input Voltage Range
Common-Mode Voltage (VCM)
Differential Input Capacitance1
Analog Input Full Power Bandwidth
POWER SUPPLY
AVDD1
AVDD2
AVDD3
AVDD1_SR
DVDD
DRVDD
SPIVDD
IAVDD1
IAVDD2
IAVDD3
IAVDD1_SR
IDVDD2
IDRVDD1
IDRVDD (L = 2 mode)
ISPIVDD
AD9234-500
Typ
Max
Min
12
Full
Full
Full
Full
Full
Full
Full
Guaranteed
−0.22 0
+0.20
0
+0.19
−13.8 −5.1
+3.6
−3.9
+1
+5.9
−0.3
+0.3
−0.8
+1.1
25°C
25°C
±2.6
±36
±6
±36
ppm/°C
ppm/°C
Full
1.0
1.0
V
25°C
0.74
1.02
LSB rms
Full
25°C
25°C
25°C
1.63
2.05
1.5
2
1.34
2.05
1.5
2
V p-p
V
pF
GHz
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
25°C
Full
1.22
2.44
3.2
1.22
1.22
1.22
1.7
Rev. A | Page 5 of 66
1.25
2.50
3.3
1.25
1.25
1.25
1.8
430
380
65
15
140
190
140
5
1.28
2.56
3.4
1.28
1.28
1.28
3.4
480
430
75
18
152
246
6
Min
12
AD9234-1000
Typ
Max
Temp
Full
−0.22
−0.3
−1.2
1.22
2.44
3.2
1.22
1.22
1.22
1.7
Guaranteed
0
+0.20
0
+0.19
0
1
+4.8
±0.16
+0.3
±35
+1.4
1.25
2.50
3.3
1.25
1.25
1.25
1.8
675
525
75
16
230
205
N/A3
5
1.28
2.56
3.4
1.28
1.28
1.28
3.4
740
590
91
18
236
225
6
Unit
Bits
% FSR
% FSR
% FSR
% FSR
LSB
LSB
V
V
V
V
V
V
V
mA
mA
mA
mA
mA
mA
mA
mA
AD9234
Parameter
POWER CONSUMPTION
Total Power Dissipation (Including Output Drivers)2
Total Power Dissipation (L = 2 Mode)
Power-Down Dissipation
Standby4
Data Sheet
Temp
Min
Full
25°C
Full
Full
AD9234-500
Typ
Max
2.15
2.08
670
1.1
Min
AD9234-1000
Typ
Max
2.5
3.0
N/A3
750
1.25
3.3
Unit
W
W
mW
W
All lanes running. Power dissipation on DRVDD changes with lane rate and number of lanes used.
Default mode. No DDCs used. L = 4, M = 2, F = 1.
N/A = not applicable. At the maximum sample rate, it is not applicable to use L = 2 mode on the JESD204B output interface because this exceeds the maximum lane
rate of 12.5 Gbps. L = 2 mode is supported when the equation ((M × N΄ × (10/8) × fOUT)/L) results in a line rate that is ≤12.5 Gbps. fOUT is the output sample rate and is
denoted by fS/DCM, where DCM = decimation ratio.
4
Can be controlled by the SPI.
1
2
3
AC SPECIFICATIONS
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR = 1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, specified
maximum sampling rate, AIN = −1.0 dBFS, clock divider = 2, default SPI settings, TA = 25°C, unless otherwise noted.
Table 2.
Parameter1
ANALOG INPUT FULL SCALE
NOISE DENSITY2
SIGNAL-TO-NOISE RATIO (SNR)3
fIN = 10 MHz
fIN = 170 MHz
fIN = 340 MHz
fIN = 450 MHz
fIN = 737 MHz
fIN = 985 MHz
fIN = 1410 MHz
SNR AND DISTORTION RATIO (SINAD)3
fIN = 10 MHz
fIN = 170 MHz
fIN = 340 MHz
fIN = 450 MHz
fIN = 737 MHz
fIN = 985 MHz
fIN = 1410 MHz
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 10 MHz
fIN = 170 MHz
fIN = 340 MHz
fIN = 450 MHz
fIN = 737 MHz
fIN = 985 MHz
fIN = 1410 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR)3
fIN = 10 MHz
fIN = 170 MHz
fIN = 340 MHz
fIN = 450 MHz
fIN = 737 MHz
fIN = 985 MHz
fIN = 1410 MHz
Temp
Full
Full
25°C
Full
25°C
25°C
25°C
25°C
25°C
25°C
Full
25°C
25°C
25°C
25°C
25°C
25°C
Full
25°C
25°C
25°C
25°C
25°C
25°C
Full
25°C
25°C
25°C
25°C
25°C
Rev. A | Page 6 of 66
AD9234-500
Min
Typ
Max
1.63
−150
65.1
65.0
10.5
77
65.9
65.8
65.6
65.3
64.2
63.6
62.2
65.8
65.7
65.5
65.2
63.7
63.1
61.2
10.7
10.6
10.6
10.5
10.3
10.2
9.9
84
85
85
87
75
75
71
AD9234-1000
Min
Typ
Max
1.34
−151
61.6
61.2
9.9
70
Unit
V p-p
dBFS/Hz
64.2
63.9
63.4
63.1
61.6
60.7
58.8
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
64.1
63.8
63.3
63.0
61.5
60.6
58.7
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
10.4
10.3
10.2
10.2
9.9
9.8
9.5
Bits
Bits
Bits
Bits
Bits
Bits
Bits
89
80
79
80
81
79
78
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
Data Sheet
AD9234
Parameter1
WORST HARMONIC, SECOND OR THIRD3
fIN = 10 MHz
fIN = 170 MHz
fIN = 340 MHz
fIN = 450 MHz
fIN = 737 MHz
fIN = 985 MHz
fIN = 1410 MHz
WORST OTHER, EXCLUDING SECOND OR THIRD HARMONIC3
fIN = 10 MHz
fIN = 170 MHz
fIN = 340 MHz
fIN = 450 MHz
fIN = 737 MHz
fIN = 985 MHz
fIN = 1410 MHz
TWO-TONE INTERMODULATION DISTORTION (IMD), AIN1 AND AIN2 =
−7 dBFS
fIN1 = 187 MHz, fIN2 = 190 MHz
fIN1 = 338 MHz, fIN2 = 341 MHz
CROSSTALK4
FULL POWER BANDWIDTH5
Temp
AD9234-500
Min
Typ
Max
AD9234-1000
Min
Typ
Max
Unit
25°C
Full
25°C
25°C
25°C
25°C
25°C
−84
−85
−85
−87
−75
−75
−71
−89
−80
−79
−80
−82
−79
−78
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
25°C
Full
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
−82
−77
−96
−95
−94
−93
−88
−89
−86
−89
−85
−83
−82
−81
−85
−80
−90
−86
95
2
−81
−78
95
2
−70
−76
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
Noise density is measured at a low analog input frequency (30 MHz).
3
See Table 9 for recommended settings for the buffer current setting optimized for SFDR.
4
Crosstalk is measured at 170 MHz with a −1.0 dBFS analog input on one channel and no input on the adjacent channel.
5
Measured with circuit shown in Figure 64.
1
2
Rev. A | Page 7 of 66
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
dB
GHz
AD9234
Data Sheet
DIGITAL SPECIFICATIONS
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR = 1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, specified
maximum sampling rate, AIN = −1.0 dBFS, default SPI settings, TA = 25°C, unless otherwise noted.
Table 3.
Parameter
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
Differential Input Voltage
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance
SYSTEM REFERENCE INPUTS (SYSREF+, SYSREF−)
Logic Compliance
Differential Input Voltage
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance (Differential)
LOGIC INPUTS (SDIO, SCLK, CSB, PDWN/STBY)
Logic Compliance
Logic 1 Voltage
Logic 0 Voltage
Input Resistance
LOGIC OUTPUT (SDIO)
Logic Compliance
Logic 1 Voltage (IOH = 800 µA)
Logic 0 Voltage (IOL = 50 µA)
SYNC INPUTS (SYNCINB+, SYNCINB−)
Logic Compliance
Differential Input Voltage
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance
LOGIC OUTPUTS (FD_A, FD_B)
Logic Compliance
Logic 1 Voltage
Logic 0 Voltage
Input Resistance
DIGITAL OUTPUTS (SERDOUTx±, x = 0 TO 3)
Logic Compliance
Differential Output Voltage
Output Common-Mode Voltage (VCM)
AC-Coupled
Short-Circuit Current (IDshort)
Differential Return Loss (RLDIFF)1
Common-Mode Return Loss (RLCM)1
Differential Termination Impedance
1
Temperature
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Min
Typ
LVDS/LVPECL
1200
0.85
35
600
Max
Unit
1800
mV p-p
V
kΩ
pF
2.5
LVDS/LVPECL
1200
0.85
35
400
0.6
1800
2.0
2.5
mV p-p
V
kΩ
pF
CMOS
0.8 × SPIVDD
0
0.5
30
V
V
kΩ
CMOS
0.8 × SPIVDD
0
400
0.6
0.5
LVDS/LVPECL/CMOS
1200
1800
0.85
2.0
35
2.5
V
V
mV p-p
V
kΩ
pF
CMOS
0.8 × SPIVDD
0
0.5
V
V
kΩ
30
Full
Full
360
770
mV p-p
25°C
25°C
25°C
25°C
Full
0
−100
8
6
80
1.8
+100
V
mA
dB
dB
Ω
Differential and common-mode return loss is measured from 100 MHz to 0.75 MHz × baud rate.
Rev. A | Page 8 of 66
CML
100
120
Data Sheet
AD9234
SWITCHING SPECIFICATIONS
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR = 1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, specified
maximum sampling rate, AIN = −1.0 dBFS, default SPI settings, TA = 25°C, unless otherwise noted.
Table 4.
Parameter
CLOCK
Clock Rate (at CLK+/CLK− Pins)
Maximum Sample Rate1
Minimum Sample Rate2
Clock Pulse Width High
Clock Pulse Width Low
OUTPUT PARAMETERS
Unit Interval (UI)3
Rise Time (tR) (20% to 80% into 100 Ω Load)
Fall Time (tF) (20% to 80% into 100 Ω Load)
PLL Lock Time
Data Rate per Channel (NRZ)4
LATENCY5
Pipeline Latency
Fast Detect Latency
Wake-Up Time6
Standby
Power-Down
APERTURE
Aperture Delay (tA)
Aperture Uncertainty (Jitter, tj)
Out-of-Range Recovery Time
AD9234-500
Typ
Max
Temperature
Min
Full
Full
Full
Full
Full
0.3
500
300
1000
1000
Full
25°C
25°C
25°C
25°C
80
24
24
3.125
4
200
32
32
2
5
Full
Full
55
25°C
25°C
1
Full
Full
Full
530
55
1
AD9234-1000
Min
Typ
Max
Unit
0.3
1000
300
500
500
GHz
MSPS
MSPS
ps
ps
80
24
24
12.5
3.125
4
100
32
32
2
10
12.5
ps
ps
ps
ms
Gbps
28
Clock cycles
Clock cycles
4
ms
ms
55
28
1
4
530
55
1
ps
fs rms
Clock Cycles
The maximum sample rate is the clock rate after the divider.
The minimum sample rate operates at 300 MSPS with L = 2 or L = 1.
3
Baud rate = 1/UI. A subset of this range can be supported.
4
Default L = 4. This number can be changed based on the sample rate and decimation ratio.
5
No DDCs used. L = 4, M = 2, F = 1.
6
Wake-up time is defined as the time required to return to normal operation from power-down mode.
1
2
TIMING SPECIFICATIONS
Table 5.
Parameter
CLK+ to SYSREF+ TIMING REQUIREMENTS
tSU_SR
tH_SR
SPI TIMING REQUIREMENTS
tDS
tDH
tCLK
tS
tH
tHIGH
tLOW
tEN_SDIO
tDIS_SDIO
Test Conditions/Comments
See Figure 2
Device clock to SYSREF+ setup time
Device clock to SYSREF+ hold time
See Figure 3
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the SCLK
Setup time between CSB and SCLK
Hold time between CSB and SCLK
Minimum period that SCLK must be in a logic high state
Minimum period that SCLK must be in a logic low state
Time required for the SDIO pin to switch from an input to an
output relative to the SCLK falling edge (not shown in Figure 3)
Time required for the SDIO pin to switch from an output to an
input relative to the SCLK rising edge (not shown in Figure 3)
Rev. A | Page 9 of 66
Min
Typ
117
−96
Max
Unit
ps
ps
2
2
40
2
2
10
10
10
ns
ns
ns
ns
ns
ns
ns
ns
10
ns
AD9234
Data Sheet
Timing Diagrams
CLK–
CLK+
tSU_SR
tH_SR
12244-003
SYSREF–
SYSREF+
Figure 2. SYSREF± Setup and Hold Timing
tHIGH
tDS
tS
tCLK
tDH
tACCESS
tH
tLOW
CSB
SDIO DON’T CARE
DON’T CARE
R/W
A14
A13
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
DON’T CARE
12244-004
SCLK DON’T CARE
Figure 3. Serial Port Interface Timing Diagram
APERTURE
DELAY
ANALOG
INPUT
SIGNAL
SAMPLE N
N – 54
N+1
N – 55
N – 53
N – 52
N–1
N – 51
CLK–
CLK+
CLK–
CLK+
SERDOUT0–
A
B
C
D
E
F
G
H
I
J
A
B
C
D
E
F
G
H
I
J
A
B
C
D
E
F
G
H
I
J
CONVERTER0 MSB
A
B
C
D
E
F
G
H
I
J
A
B
C
D
E
F
G
H
I
J
A
B
C
D
E
F
G
H
I
J
CONVERTER0 LSB
A
B
C
D
E
F
G
H
I
J
A
B
C
D
E
F
G
H
I
J
A
B
C
D
E
F
G
H
I
J
CONVERTER1 MSB
A
B
C
D
E
F
G
H
I
J
A
B
C
D
E
F
G
H
I
J
A
B
C
D
E
F
G
H
I
J
CONVERTER1 LSB
SERDOUT0+
SERDOUT1–
SERDOUT1+
SERDOUT2–
SERDOUT2+
SERDOUT3–
SAMPLE N – 55
ENCODED INTO 1
8-BIT/10-BIT SYMBOL
SAMPLE N – 54
ENCODED INTO 1
8-BIT/10-BIT SYMBOL
SAMPLE N – 53
ENCODED INTO 1
8-BIT/10-BIT SYMBOL
Figure 4. Data Output Timing (Full Bandwidth Mode; L = 4; M = 2; F = 1)
Rev. A | Page 10 of 66
12244-002
SERDOUT3+
Data Sheet
AD9234
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
Parameter
Electrical
AVDD1 to AGND
AVDD1_SR to AGND
AVDD2 to AGND
AVDD3 to AGND
DVDD to DGND
DRVDD to DRGND
SPIVDD to AGND
AGND to DRGND
VIN±x to AGND
SCLK, SDIO, CSB to AGND
PDWN/STBY to AGND
Operating Temperature Range
Junction Temperature Range
Storage Temperature Range (Ambient)
Rating
1.32 V
1.32 V
2.75 V
3.63 V
1.32 V
1.32 V
3.63 V
−0.3 V to +0.3 V
3.2 V
−0.3 V to SPIVDD + 0.3 V
−0.3 V to SPIVDD + 0.3 V
−40°C to +85°C
−40°C to +115°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Typical θJA, θJB, and θJC are specified vs. the number of printed
circuit board (PCB) layers in different airflow velocities (in
m/sec). Airflow increases heat dissipation effectively reducing
θJA and θJB. In addition, metal in direct contact with the package
leads and exposed pad from metal traces, through holes, ground,
and power planes, reduces the θJA. Thermal performance for
actual applications requires careful inspection of the conditions
in an application. The use of appropriate thermal management
techniques is recommended to ensure that the maximum
junction temperature does not exceed the limits shown in Table 6.
Table 7. Thermal Resistance Values
PCB
Type
JEDEC
2s2p
Board
Airflow
Velocity
(m/sec)
0.0
1.0
2.5
1
θJA
17.81, 2
15.61, 2
15.01, 2
ΨJB
6.31, 3
5.91, 3
5.71, 3
θJC_TOP
4.71, 5
N/A4
N/A4
Per JEDEC 51-7, plus JEDEC 51-5 2s2p test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per JEDEC JESD51-8 (still air).
4
N/A = not applicable.
5
Per MIL-STD 883, Method 1012.1.
2
3
ESD CAUTION
Rev. A | Page 11 of 66
θJC_BOT
1.21, 5
Unit
°C/W
°C/W
°C/W
AD9234
Data Sheet
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AVDD1
AVDD2
AVDD2
AVDD1
AGND
SYSREF–
SYSREF+
AVDD1_SR
AGND
AVDD1
CLK–
CLK+
AVDD1
AVDD2
AVDD2
AVDD1
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
AD9234
TOP VIEW
(Not to Scale)
AVDD1
AVDD1
AVDD2
AVDD3
VIN–B
VIN+B
AVDD3
AVDD2
AVDD2
AVDD2
SPIVDD
CSB
SCLK
SDIO
DVDD
DGND
NOTES
1. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE
PROVIDES THE GROUND REFENCE FOR AVDDx. THIS EXPOSED
PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION.
12244-005
FD_A
DRGND
DRVDD
SYNCINB–
SYNCINB+
SERDOUT0–
SERDOUT0+
SERDOUT1–
SERDOUT1+
SERDOUT2–
SERDOUT2+
SERDOUT3–
SERDOUT3+
DRVDD
DRGND
FD_B
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
AVDD1
AVDD1
AVDD2
AVDD3
VIN–A
VIN+A
AVDD3
AVDD2
AVDD2
AVDD2
AVDD2
V_1P0
SPIVDD
PDWN/STBY
DVDD
DGND
Figure 5. Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
Power Supplies
0
Mnemonic
Type
Description
EPAD
Ground
1, 2, 47, 48, 49, 52, 55, 61, 64
3, 8, 9, 10, 11, 39, 40, 41,
46, 50, 51, 62, 63
4, 7, 42, 45
13, 38
15, 34
16, 33
18, 31
19, 30
56, 60
57
Analog
5, 6
12
AVDD1
AVDD2
Supply
Supply
Exposed Pad. The exposed thermal pad on the bottom of the
package provides the ground reference for AVDDx. This
exposed pad must be connected to ground for proper
operation.
Analog Power Supply (1.25 V Nominal).
Analog Power Supply (2.5 V Nominal).
AVDD3
SPIVDD
DVDD
DGND
DRGND
DRVDD
AGND1
AVDD1_SR1
Supply
Supply
Supply
Ground
Ground
Supply
Ground
Supply
Analog Power Supply (3.3 V Nominal).
Digital Power Supply for SPI (1.8 V to 3.3 V).
Digital Power Supply (1.25 V Nominal).
Ground Reference for DVDD.
Ground Reference for DRVDD.
Digital Driver Power Supply (1.25 V Nominal).
Ground Reference for SYSREF±.
Analog Power Supply for SYSREF± (1.25 V Nominal).
VIN−A, VIN+A
V_1P0
Input
Input/DNC
43, 44
53, 54
CMOS Outputs
17, 32
VIN+B, VIN−B
CLK+, CLK−
Input
Input
ADC A Analog Input Complement/True.
1.0 V Reference Voltage Input/Do Not Connect. This pin is
configurable through the SPI as a no connect or an input. Do
not connect this pin if using the internal reference. This pin
requires a 1.0 V reference voltage input if using an external
voltage reference source.
ADC B Analog Input True/Complement.
Clock Input True/Complement.
FD_A, FD_B
Output
Fast Detect Outputs for Channel A and Channel B.
Rev. A | Page 12 of 66
Data Sheet
Pin No.
Digital Inputs
20, 21
58, 59
Data Outputs
22, 23
24, 25
26, 27
28, 29
Device Under Test (DUT)
Controls
14
35
36
37
1
AD9234
Mnemonic
Type
Description
SYNCINB−, SYNCINB+
SYSREF+, SYSREF−
Input
Input
Active Low JESD204B LVDS Sync Input Complement/True.
Active High JESD204B LVDS System Reference Input
True/Complement.
SERDOUT0−, SERDOUT0+
SERDOUT1−, SERDOUT1+
SERDOUT2−, SERDOUT2+
SERDOUT3−, SERDOUT3+
Output
Output
Output
Output
Lane 0 Output Data Complement/True.
Lane 1 Output Data Complement/True.
Lane 2 Output Data Complement/True.
Lane 3 Output Data Complement/True.
PDWN/STBY
Input
SDIO
SCLK
CSB
Input/output
Input
Input
Power-Down Input (Active High). The operation of this pin
depends on the SPI mode and can be configured as powerdown or standby.
SPI Serial Data Input/Output.
SPI Serial Clock.
SPI Chip Select (Active Low).
To ensure proper ADC operation, connect AVDD1_SR and AGND separately from the AVDD1 and EPAD connection. For more information, refer to the Applications
Information section.
Rev. A | Page 13 of 66
AD9234
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
AD9234-1000
AVDD1 = 1.25 V, AVDD1_SR = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, 1.34 V p-p
full-scale differential input, AIN = −1.0 dBFS, default SPI settings, clock divider = 2, TA = 25°C, 128k FFT sample, unless otherwise noted.
0
0
AIN = –1dBFS
SNR = 64.2dBFS
ENOB = 10.4BITS
SFDR = 88dBFS
BUFFER CURRENT = 2.5×
AIN = –1dBFS
SNR = 63.1dBFS
ENOB = 10.2 BITS
SFDR = 80dBFS
BUFFER CURRENT = 4.5×
–20
AMPLITUDE (dBFS)
–40
–60
–80
–100
–40
–60
–80
0
100
200
300
400
500
FREQUENCY (MHz)
–120
12244-100
–120
0
300
400
500
Figure 9. Single-Tone FFT with fIN = 450.3 MHz
0
0
AIN = –1dBFS
SNR = 63.9dBFS
ENOB = 10.3 BITS
SFDR = 80dBFS
BUFFER CURRENT = 2.5×
AIN = –1dBFS
SNR = 61.6dBFS
ENOB = 9.9 BITS
SFDR = 81dBFS
BUFFER CURRENT = 6.5×
–20
AMPLITUDE (dBFS)
–20
–40
–60
–80
–40
–60
–80
–100
–100
0
100
200
300
400
500
FREQUENCY (MHz)
–120
12244-101
–120
0
100
200
300
400
500
FREQUENCY (MHz)
Figure 7. Single-Tone FFT with fIN = 170.3 MHz
12244-300
AMPLITUDE (dBFS)
200
FREQUENCY (MHz)
Figure 6. Single-Tone FFT with fIN = 10.3 MHz
Figure 10. Single-Tone FFT with fIN = 737.3 MHz
0
0
AIN = –1dBFS
SNR = 63.4dBFS
ENOB = 10.2 BITS
SFDR = 79dBFS
BUFFER CURRENT = 3.0×
AIN = –1dBFS
SNR = 60.7dBFS
ENOB = 9.8 BITS
SFDR = 79dBFS
BUFFER CURRENT = 6.5×
–20
AMPLITUDE (dBFS)
–20
–40
–60
–80
–100
–40
–60
–80
–100
–120
0
100
200
300
400
FREQUENCY (MHz)
500
12244-102
AMPLITUDE (dBFS)
100
12244-103
–100
Figure 8. Single-Tone FFT with fIN = 340.3 MHz
–120
0
100
200
300
400
FREQUENCY (MHz)
Figure 11. Single-Tone FFT with fIN = 985.3 MHz
Rev. A | Page 14 of 66
500
12244-301
AMPLITUDE (dBFS)
–20
Data Sheet
AD9234
0
90
AIN = –1dBFS
SNR = 59.7dBFS
ENOB = 9.6 BITS
SFDR = 80dBFS
BUFFER CURRENT = 7.0×
SFDR (dBFS)
–40
SNR/SFDR (dBFS)
–60
–80
80
70
SNR (dBFS)
–100
0
100
200
300
400
500
FREQUENCY (MHz)
60
10.3
12244-302
–120
128.3
180.3
242.3
309.3
361.3
420.3
480.3
INPUT FREQUENCY (MHz)
Figure 12. Single-Tone FFT with fIN = 1213.3 MHz
Figure 15. SNR/SFDR vs. Input Frequency (fIN); fIN < 500 MHz ;
Buffer Current = 3.5× (Uses Circuit Shown in Figure 63)
0
90
AIN = –1dBFS
SNR = 58.8dBFS
ENOB = 9.5 BITS
SFDR = 78dBFS
BUFFER CURRENT = 7.5×
–20
80
–40
SNR/SFDR (dBFS)
AMPLITUDE (dBFS)
85.3
12244-306
AMPLITUDE (dBFS)
–20
–60
–80
SFDR (dBFS)
70
SNR (dBFS)
60
0
100
200
300
400
500
FREQUENCY (MHz)
50
453.3 629.3 737.3 837.3 937.3 1077.3 1177.3 1277.3 1377.3 1477.3
12244-303
–120
INPUT FREQUENCY (MHz)
Figure 16. SNR/SFDR vs. Input Frequency (fIN); 450 MHz < fIN < 1500 MHz;
Buffer Current = 7.5× (Uses Circuit Shown in Figure 64)
Figure 13. Single-Tone FFT with fIN = 1413.3 MHz
80
90
SFDR (dBFS)
SFDR (dBFS)
SNR/SFDR (dBFS)
80
70
70
60
SNR (dBFS)
60
700
750
800
850
900
950
1000
1050
SAMPLE RATE (MHz)
Figure 14. SNR/SFDR vs. Sample Rate (fS),
fIN = 170.3 MHz ; Buffer Current = 3.0×
1100
50
1523.3 1587.3 1623.3 1687.3 1723.3 1787.3 1823.3 1887.3 1923.3 1987.3
INPUT FREQUENCY (MHz)
12244-308
SNR (dBFS)
12244-304
SNR/SFDR (dBFS)
12244-307
–100
Figure 17. SNR/SFDR vs. Input Frequency (fIN); 1500 MHz < fIN < 2000 MHz;
Buffer Current = 8.5× (Uses Circuit Shown in Figure 64)
Rev. A | Page 15 of 66
AD9234
Data Sheet
0
0
AIN1 AND AIN2 = –7dBFS
SFDR = 81dBFS
IMD2 = 81dBFS
IMD3 = 83dBFS
BUFFER CURRENT = 4.5×
SFDR (dBc)
–20
SFDR/IMD3 (dBc AND dBFS)
–40
–60
–80
–100
–40
IMD3 (dBc)
–60
–80
SFDR (dBFS)
–100
0
100
200
300
400
500
FREQUENCY (MHz)
IMD3 (dBFS)
–120
–90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12 –6
12244-205
–120
INPUT AMPLITUDE (dBFS)
12244-208
AMPLITUDE (dBFS)
–20
Figure 21. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with
fIN1 = 338 MHz and fIN2 = 341 MHz
Figure 18. Two-Tone FFT; fIN1 = 184 MHz, fIN2 = 187 MHz
120
AIN1 AND AIN2 = –7dBFS
SFDR = 78dBFS
IMD2 = 78dBFS
IMD3 = 85dBFS
BUFFER CURRENT = 4.5×
–15
AMPLITUDE (dBFS)
–30
SFDR (dBFS)
100
SNR/SFDR (dBc AND dBFS)
0
–45
–60
–75
–90
–105
80
SNR (dBFS)
60
40
SFDR (dBc)
20
SNR (dBc)
0
–120
–20
0
100
200
300
400
500
FREQUENCY (MHz)
–40
–97
12244-206
–150
–84
–74
–64
–54
–44
–34
–24
–14
–4
INPUT AMPLITUDE (dBFS)
Figure 19. Two-Tone FFT; fIN1 = 338 MHz, fIN2 = 341 MHz
12244-209
–135
Figure 22. SNR/SFDR vs. Analog Input Level, fIN = 10.3 MHz;
Buffer Current = 2.0×
0
90
SFDR (dBc)
SFDR
SNR/SFDR (dBFS)
–40
IMD3 (dBc)
–60
–80
80
70
SFDR (dBFS)
IMD3 (dBFS)
–120
–90 –84 –78 –72 –66 –60 –54 –48 –42 –36 –30 –24 –18 –12 –6
INPUT AMPLITUDE (dBFS)
Figure 20. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with
fIN1 = 184 MHz and fIN2 = 187 MHz
60
–45 –35 –25 –15 –5
5
15
25
35
45
55
65
75
TEMPERATURE (°C)
Figure 23. SNR/SFDR vs. Temperature, fIN = 170.3 MHz
Rev. A | Page 16 of 66
85
12244-400
SNR
–100
12244-207
SFDR/IMD3 (dBc AND dBFS)
–20
Data Sheet
AD9234
3.10
0.4
3.05
POWER DISSIPATION (W)
0.6
0
–0.2
–0.4
3.00
2.95
2.90
2.85
2.80
–0.6
0
500
1000
1500
2000
2500
3000
3500
2.75
–45 –35 –25 –15 –5
12244-401
–0.8
4000
OUTPUT CODE
5
15
25
35
45
55
65
75
85
TEMPERATURE (°C)
12244-404
INL (LSB)
0.2
Figure 27. Power Dissipation vs. Temperature
Figure 24. INL, fIN = 10.3 MHz
0.3
3.5
3.4
0.2
POWER DISSIPATION (W)
3.3
DNL (LSB)
0.1
0
–0.1
3.2
3.1
3.0
2.9
2.8
2.7
–0.2
500
1000
1500
2000
2500
3000
3500
2.5
700
12244-402
0
4000
OUTPUT CODE
1.02 LSB rms
3000000
2000000
1500000
1000000
500000
N
N+1
N+2
OUTPUT CODE
N+3
12244-403
NUMBER OF HITS
2500000
N–1
820
860
900
940
980
1020 1060 1110
Figure 28. Power Dissipation vs. Sample Rate (fS)
3500000
N–2
780
SAMPLE RATE (MHz)
Figure 25. DNL, fIN = 10 MHz
0
N–3
740
Figure 26. Input-Referred Noise Histogram
Rev. A | Page 17 of 66
12244-405
2.6
–0.3
AD9234
Data Sheet
AD9234-500
AVDD1 = 1.25 V, AVDD1_SR = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, DVDD = 1.25 V, DRVDD = 1.25 V, SPIVDD = 1.8 V, 1.63 V p-p
full-scale differential input, AIN = −1.0 dBFS, default SPI settings, clock divider = 2, TA = 25°C, 128k FFT sample, unless otherwise noted.
0
0
AIN = –1dFBS
SNR = 65.9dBFS
ENOB = 10.7BITS
SFDR = 85dBFS
BUFFER CURRENT = 2.5×
–20
AMPLITUDE (dBFS)
–40
–60
–80
–100
–40
–60
–80
0
50
100
150
FREQUENCY (MHz)
200
250
–120
12244-030
–120
0
150
200
250
Figure 32. Single-Tone FFT with fIN = 450.3 MHz
0
0
AIN = –1dFBS
SNR = 65.9dBFS
ENOB = 10.6BITS
SFDR = 85dBFS
BUFFER CURRENT = 2.5×
AIN = –1dFBS
SNR = 64.2dBFS
ENOB = 10.3BITS
SFDR = 75dBFS
BUFFER CURRENT = 4.5x
–20
AMPLITUDE (dBFS)
–20
–40
–60
–80
–100
–40
–60
–80
–120
0
50
100
150
200
250
FREQUENCY (MHz)
12244-506
–100
250
12244-509
AMPLITUDE (dBFS)
100
FREQUENCY (MHz)
Figure 29. Single-Tone FFT with fIN = 10.3 MHz
250
–120
0
50
100
150
200
FREQUENCY (MHz)
Figure 30. Single-Tone FFT with fIN = 170.3 MHz
Figure 33. Single-Tone FFT with fIN = 737.3 MHz
0
0
AIN = –1dFBS
SNR = 65.5dBFS
ENOB = 10.5BITS
SFDR = 86dBFS
BUFFER CURRENT = 4.5×
AIN = –1dFBS
SNR = 63.6dBFS
ENOB = 10.2BITS
SFDR = 75dBFS
BUFFER CURRENT = 5.5×
–20
AMPLITUDE (dBFS)
–20
–40
–60
–80
–100
–40
–60
–80
–100
–120
0
50
100
150
200
FREQUENCY (MHz)
250
12244-507
AMPLITUDE (dBFS)
50
12244-508
–100
12244-510
AMPLITUDE (dBFS)
–20
AIN = –1dFBS
SNR = 65.3dBFS
ENOB = 10.5BITS
SFDR = 86dBFS
BUFFER CURRENT = 4.5×
–120
0
50
100
150
200
FREQUENCY (MHz)
Figure 31. Single-Tone FFT with fIN = 340.3 MHz
Figure 34. Single-Tone FFT with fIN = 985.3 MHz
Rev. A | Page 18 of 66
Data Sheet
AD9234
90
0
AIN = –1dFBS
SNR = 62.9dBFS
ENOB = 10.0BITS
SFDR = 72dBFS
BUFFER CURRENT = 8.5×
SNR/SFDR (dBFS)
AMPLITUDE (dBFS)
–20
–40
–60
–80
80
SNR (dBFS)
SFDR (dBFS)
SNR (dBFS)
SFDR (dBFS)
70
FREQUENCY (MHz)
Figure 35. Single-Tone FFT with fIN = 1213.3 MHz
Figure 38. SNR/SFDR vs. Input Frequency (fIN); fIN < 500 MHz;
Buffer Current = 2.5× and 4.5× (Uses Circuit Shown in Figure 63)
0
90
AIN = –1dFBS
SNR = 62.2dBFS
ENOB = 9.9BITS
SFDR = 71dBFS
BUFFER CURRENT = 8.5×
–20
AMPLITUDE (dBFS)
12244-515
480.3
450.3
420.3
390.3
360.3
340.7
330.3
301.3
270.3
240.3
210.3
FREQUENCY (MHz)
60
180.3
250
170.3
200
150.3
150
95.3
100
125.3
50
65.3
0
10.3
–120
12244-511
–100
SNR (dBFS)
SFDR (dBFS)
SNR (dBFS)
SFDR (dBFS)
SNF/SFDR (dBFS)
–40
–60
–80
80
70
FREQUENCY (MHz)
Figure 36. Single-Tone FFT with fIN = 1413.3 MHz
12244-516
1510.3
1410.3
1310.3
1205.3
1110.3
1010.3
985.3
FREQUENCY (MHz)
60
810.3
250
765.3
200
610.3
150
515.3
100
510.3
50
480.3
0
450.3
–120
12244-512
–100
Figure 39. SNR/SFDR vs. Input Frequency (fIN); 450 MHz < fIN < 1500 MHz;
Buffer Current = 6.5× and 8.5× (Uses Circuit Shown in Figure 64)
90
72
70
SFDR (dBFS)
SFDR (dBFS)
SNR/SFDR (dBFS)
80
70
SNRFS (dBFS)
66
64
62
SNR (dBFS)
60
58
60
300 320 340 360 380 400 420 440 460 480 500 520 540
FREQUENCY (MHz)
Figure 37. SNR/SFDR vs. Sample Rate (fS),
fIN = 170.3 MHz ; Buffer Current = 3.0×
54
1510.3
1600.3
1710.3
1810.3
FREQUENCY (MHz)
1910.3
1950.3
12244-517
56
12244-513
SNRFS/SFDR (dBFS)
68
Figure 40. SNR/SFDR vs. Input Frequency (fIN); 1500 MHz < fIN < 2000 MHz;
Buffer Current = 8.5× (Uses Circuit Shown in Figure 64)
Rev. A | Page 19 of 66
AD9234
Data Sheet
0
0
AIN1 AND A IN2 = –7dBFS
SFDR = 90dBFS
IMD2 = 99dBFS
IMD3 = 90dBFS
BUFFER CURRENT = 2.0×
–40
–60
–80
–40
IMD3 (dBc)
–60
–80
SFDR (dBFS)
0
50
100
150
200
250
FREQUENCY (MHz)
–120
–90
12244-518
–120
–80
–70
–60
–50
–40
AMPLITUDE
–30
–20
–10
Figure 44. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with
fIN1 = 338 MHz and fIN2 = 341 MHz
Figure 41. Two-Tone FFT; fIN1 = 184 MHz, fIN2 = 187 MHz
120
0
SFDR (dBFS)
AIN1 AND A IN2 = –7dBFS
SFDR = 86dBFS
IMD2 = 86dBFS
IMD3 = 76dBFS
BUFFER CURRENT = 4.5×
100
–40
–60
–80
–100
80
SNR (dBFS)
60
SFDR (dBc)
40
20
0
–20
0
50
100
150
200
250
FREQUENCY (MHz)
–40
–90
12244-519
–120
SNR (dBc)
–80
–70
–60
–50
–40
–30
–20
–10
0
AMPLITUDE (dBFS)
12244-522
SNR/SFDR (dBc AND dBFS)
–20
Figure 45. SNR/SFDR vs. Analog Input Level, fIN = 10.3 MHz;
Buffer Current = 2.0×
Figure 42. Two-Tone FFT; fIN1 = 338 MHz, fIN2 = 341 MHz
0
100
SFDR (dBc)
–20
SFDR (dBFS)
90
SNR/SFDR (dBFS)
–40
IMD3 (dBc)
–60
–80
80
SFDR (dBFS)
70
–100
IMD3 (dBFS)
–80
–70
–60
–50
–40
AMPLITUDE (dBFS)
–30
–20
–10
12244-520
–120
–90
SNRFS (dBFS)
60
–45
–25
–15
–5
15
25
45
65
TEMPERATURE (°C)
Figure 46. SNR/SFDR vs. Temperature, fIN = 170.3 MHz
Figure 43. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with
fIN1 = 184 MHz and fIN2 = 187 MHz
Rev. A | Page 20 of 66
85
12244-523
AMPLITUDE (dBFS)
IMD3 (dBFS)
12244-521
–100
–100
SFDR/IMD3 (dBc AND dBFS)
SFDR (dBc)
–20
SFDR/IMD3 (dBc AND dBFS)
AMPLITUDE (dBFS)
–20
Data Sheet
AD9234
0.4
2.14
0.3
2.13
2.12
0.2
2.11
DUT POWER
0
–0.1
–0.2
2.10
2.09
2.08
2.07
–0.3
2.06
–0.4
500
1000
1500
2000
2500
3000
3500
4000
OUTPUT CODE
2.04
–45
–25
–15
–5
15
25
TEMPERATURE (°C)
45
65
85
12244-527
0
12244-524
2.05
–0.5
550
12244-528
INL (LSB)
0.1
Figure 50. Power Dissipation vs. Temperature
Figure 47. INL, fIN = 10.3 MHz
2.20
0.15
2.15
0.10
POWER DISSIPATION (W)
2.10
DNL (LSB)
0.05
0
–0.05
L.M.F = 4.2.1
2.05
2.00
1.95
L.M.F = 2.2.2
1.90
1.85
1.80
–0.10
1.75
0
500
1000
1500
2000
2500
3000
3500
4000
OUTPUT CODE
1.70
300
12244-525
–0.15
1,800,000
1,600,000
1,400,000
1,200,000
1,000,000
800,000
600,000
400,000
12244-526
200,000
N – 10
N–9
N–8
N–7
N–6
N–5
N–4
N–3
N–2
N–1
N
N+1
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
N + 10
450
500
Figure 51. Power Dissipation vs. Sample Rate (fS)
2,000,000
NUMBER OF HITS
400
SAMPLE RATE (MHz)
Figure 48. DNL, fIN = 10 MHz
0
350
OUTPUT CODE
Figure 49. Input-Referred Noise Histogram
Rev. A | Page 21 of 66
AD9234
Data Sheet
EQUIVALENT CIRCUITS
AVDD3
AVDD3
VIN+x
AVDD3
200Ω
EMPHASIS/SWING
CONTROL (SPI)
VCM
BUFFER
200Ω
DRVDD
DATA+
AVDD3
AVDD3
SERDOUTx+
x = 0, 1, 2, 3
3pF
SERDOUTx–
x = 0, 1, 2, 3
DRGND
Figure 52. Analog Inputs
Figure 55. Digital Outputs
AVDD1
DVDD
25Ω
SYNCINB+
1kΩ
DGND
AVDD1
20kΩ
LEVEL
TRANSLATOR
25Ω
CLK–
DRVDD
DATA–
12244-011
AIN
CONTROL
(SPI)
CLK+
DRGND
OUTPUT
DRIVER
VIN–x
20kΩ
20kΩ
VCM = 0.85V
12244-012
DVDD
20kΩ
SYNCINB–
VCM = 0.85V
VCM
1kΩ
12244-015
67Ω
28Ω
10pF
200Ω
400Ω
SYNCINB± PIN
CONTROL (SPI)
DGND
Figure 53. Clock Inputs
Figure 56. SYNCINB± Inputs
AVDD1_SR
SYSREF+
1kΩ
SPIVDD
20kΩ
LEVEL
TRANSLATOR
AVDD1_SR
ESD
PROTECTED
VCM = 0.85V
20kΩ
SCLK
SPIVDD
1kΩ
30kΩ
1kΩ
ESD
PROTECTED
12244-016
12244-013
SYSREF–
12244-014
67Ω
200Ω
28Ω
3pF
Figure 57. SCLK Input
Figure 54. SYSREF± Inputs
Rev. A | Page 22 of 66
Data Sheet
AD9234
SPIVDD
SPIVDD
ESD
PROTECTED
30kΩ
1kΩ
CSB
30kΩ
1kΩ
PDWN/
STBY
ESD
PROTECTED
12244-017
ESD
PROTECTED
Figure 58. CSB Input
PDWN
CONTROL (SPI)
Figure 61. PDWN/STBY Input
AVDD2
SPIVDD
ESD
PROTECTED
SDO
ESD
PROTECTED
SPIVDD
1kΩ
SDIO
12244-020
ESD
PROTECTED
SDI
V_1P0
ESD
PROTECTED
12244-018
ESD
PROTECTED
V_1P0 PIN
CONTROL (SPI)
Figure 59. SDIO Input
Figure 62. V_1P0 Input
SPIVDD
ESD
PROTECTED
FD_A/FD_B
FD
JESD LMFC
JESD SYNC~
TEMPERATURE DIODE
(FD_A ONLY)
FD_x PIN CONTROL (SPI)
12244-019
ESD
PROTECTED
Figure 60. FD_A/FD_B Outputs
Rev. A | Page 23 of 66
12244-021
30kΩ
AD9234
Data Sheet
THEORY OF OPERATION
The AD9234 has two analog input channels and four JESD204B
output lane pairs. The ADC is designed to sample wide bandwidth analog signals of up to 2 GHz. The AD9234 is optimized for
wide input bandwidth, high sampling rate, excellent linearity,
and low power in a small package.
The dual ADC cores feature a multistage, differential pipelined
architecture with integrated output error correction logic. Each
ADC features wide bandwidth inputs supporting a variety of
user-selectable input ranges. An integrated voltage reference
eases design considerations.
The AD9234 has several functions that simplify the AGC
function in a communications receiver. The programmable
threshold detector allows monitoring of the incoming signal
power using the fast detect output bits of the ADC. If the input
signal level exceeds the programmable threshold, the fast detect
indicator goes high. Because this threshold indicator has low
latency, the user can quickly turn down the system gain to avoid
an overrange condition at the ADC input.
The Subclass 1 JESD204B-based high speed serialized output
data rate can be configured in one-lane (L = 1), two-lane
(L = 2), and four-lane (L = 4) configurations, depending on
the sample rate and the decimation ratio. Multiple device
synchronization is supported through the SYSREF± and
SYNCINB± input pins.
ADC ARCHITECTURE
The architecture of the AD9234 consists of an input buffered
pipelined ADC. The input buffer is designed to provide a
termination impedance to the analog input signal. This termination impedance can be changed using the SPI to meet
the termination needs of the driver/amplifier. The default
termination value is set to 400 Ω. The equivalent circuit
diagram of the analog input termination is shown in Figure 52.
The input buffer is optimized for high linearity, low noise, and
low power.
The input buffer provides a linear high input impedance (for
ease of drive) and reduces kickback from the ADC. The buffer
is optimized for high linearity, low noise, and low power. The
quantized outputs from each stage are combined into a final
12-bit result in the digital correction logic. The pipelined
architecture permits the first stage to operate with a new input
sample; at the same time, the remaining stages operate with the
preceding samples. Sampling occurs on the rising edge of the
clock.
ANALOG INPUT CONSIDERATIONS
The analog input to the AD9234 is a differential buffer. The
internal common-mode voltage of the buffer is 2.05 V. The
clock signal alternately switches the input circuit between
sample mode and hold mode. When the input circuit is switched
into sample mode, the signal source must be capable of charging
the sample capacitors and settling within one-half of a clock cycle.
A small resistor, in series with each input, helps reduce the peak
transient current injected from the output stage of the driving
source. In addition, low Q inductors or ferrite beads can be placed
on each leg of the input to reduce high differential capacitance
at the analog inputs and, thus, achieve the maximum bandwidth
of the ADC. Such use of low Q inductors or ferrite beads is
required when driving the converter front end at high IF
frequencies. Either a differential capacitor or two single-ended
capacitors can be placed on the inputs to provide a matching
passive network. This ultimately creates a low-pass filter at the
input, which limits unwanted broadband noise. For more
information, refer to the AN-742 Application Note, the AN-827
Application Note, and the Analog Dialogue article “TransformerCoupled Front-End for Wideband A/D Converters” (Volume 39,
April 2005). In general, the precise values depend on the
application.
For best dynamic performance, the source impedances driving
VIN+x and VIN−x must be matched such that common-mode
settling errors are symmetrical. These errors are reduced by the
common-mode rejection of the ADC. An internal reference
buffer creates a differential reference that defines the span of the
ADC core.
Maximum SNR performance is achieved by setting the ADC to
the largest span in a differential configuration. In the case of the
AD9234, the available span is 1.34 V p-p differential for
AD9234-1000 and 1.63 V p-p differential for AD9234-500.
Differential Input Configurations
There are several ways to drive the AD9234, either actively or
passively. However, optimum performance is achieved by
driving the analog input differentially.
For applications where SNR and SFDR are key parameters,
differential transformer coupling is the recommended input
configuration (see Figure 63 and Figure 64) because the noise
performance of most amplifiers is not adequate to achieve the
true performance of the AD9234.
For low to midrange frequencies, a double balun or double
transformer network (see Figure 63) is recommended for
optimum performance of the AD9234. For higher frequencies
in the second and third Nyquist zones, it is better to remove
some of the front-end passive components to ensure wideband
operation (see Figure 64).
Rev. A | Page 24 of 66
Data Sheet
AD9234
10Ω
10Ω
0.1µF
25Ω
4pF
ADC
2pF
0.1µF
25Ω
10Ω
10Ω
0.1µF
12244-022
ETC1-11-13/
MABA007159
1:1Z
4pF
Figure 63. Differential Transformer-Coupled Configuration for Frequencies Up to 500 MHz
25Ω
25Ω
MARKI
BAL-0006
OR
BAL-0006SMG
25Ω
0.1µF
ADC
0.1µF
12244-023
25Ω
0.1µF
Figure 64. Differential Transformer-Coupled Configuration for Frequencies > 500 MHz
Input Common Mode
The analog inputs of the AD9234 are internally biased to the
common mode as shown in Figure 65. The common-mode
buffer has a limited range in that the performance suffers greatly
if the common-mode voltage drops by more than 100 mV.
Therefore, in dc-coupled applications, set the common-mode
voltage to 2.05 V, ±100 mV to ensure proper ADC operation.
Using Register 0x018, the buffer currents on each channel can
be scaled to optimize the SFDR over various input frequencies
and bandwidths of interest. As the input buffer currents are set,
the amount of current required by the AVDD3 supply changes.
This relationship is shown in Figure 66. For a complete list of
buffer current settings, see Table 22.
300
AD9234-1000
AD9234-500
Analog Input Controls and SFDR Optimization
250
IAVDD3 (mA)
The AD9234 offers flexible controls for the analog inputs, such
as input termination and buffer current. All of the available
controls are shown in Figure 65.
AVDD3
AVDD3
200
150
VIN+x
3pF
50
VCM
BUFFER
1.5×
2.5×
3.5×
4.5×
5.5×
6.5×
7.5×
BUFFER CONTROL 1 SETTING
200Ω
67Ω
28Ω
10pF
200Ω
400Ω
Figure 66. AVDD3 Power (IAVDD3) vs. Buffer Current Setting
AVDD3
AVDD3
VIN–x
AIN CONTROL
(SPI) REGISTERS
(0x008, 0x015, 0x016,
0x018)
12244-027
3pF
Figure 65. Analog Input Controls
Rev. A | Page 25 of 66
8.5×
12244-341
200Ω
67Ω
200Ω
28Ω
100
AVDD3
AD9234
Data Sheet
80
75
8.5×
70
7.5×
65
SFDR (dBFS)
Figure 67, Figure 68, and Figure 69 show how the SFDR for
AD9234-1000 can be optimized using the buffer current setting
in Register 0x018 for different Nyquist zones. Figure 70, Figure 71,
and Figure 72 show how the SFDR for AD9234-500 can be
optimized using the buffer current setting in Register 0x018 for
different Nyquist zones. At frequencies greater than 1 GHz, it is
better to run the ADC at input amplitudes less than −1 dBFS
(−3 dBFS, for example). This greatly improves the linearity of
the converted signal without sacrificing SNR performance.
6.5×
60
5.5×
55
50
45
40
90
30
1523.3 1587.3 1623.3 1687.3 1723.3 1787.3 1823.3 1887.3 1923.3 1987.3
4.5×
SFDR (dBFS)
80
INPUT FREQUENCY (MHz)
Figure 69. Buffer Current Sweeps, AD9234-1000;
SFDR vs. Input Frequency (IBUFF);1500 MHz < fIN < 2000 MHz
75
3.5×
1.5×
12244-344
35
85
70
95
2.5×
65
90
60
85
80
128.3
180.3
242.3
309.3
361.3
420.3
480.3
INPUT FREQUENCY (MHz)
12244-342
85.3
SFDR (dBFS)
55
50
10.3
4.5×
3.5×
75
2.5×
2.0×
70
65
Figure 67. Buffer Current Sweeps, AD9234-1000;
SFDR vs. Input Frequency (IBUFF); fIN < 500 MHz
60
1.5×
90
12244-529
480.3
450.3
420.3
390.3
360.3
340.7
330.3
301.3
270.3
240.3
210.3
180.3
170.3
7.5×
150.3
95.3
80
125.3
50
8.5×
65.3
85
10.3
55
Figure 70. Buffer Current Sweeps, AD9234-500;
SFDR vs. Input Frequency (IBUFF); fIN < 500 MHz
70
6.5×
65
90
5.5×
85
60
4.5×
80
FREQUENCY (MHz)
Figure 71. Buffer Current Sweeps, AD9234-500;
SFDR vs. Input Frequency (IBUFF); 500 MHz < fIN < 1500 MHz
Rev. A | Page 26 of 66
12244-530
1410.3
1310.3
1205.3
1110.3
50
1010.3
4.5×
985.3
55
810.3
5.5×
765.3
60
610.3
6.5×
515.3
65
1510.3
7.5×
510.3
Figure 68. Buffer Current Sweeps, AD9234-1000;
SFDR vs. Input Frequency (IBUFF); 500 MHz < fIN < 1500 MHz
8.5×
70
480.3
INPUT FREQUENCY (MHz)
75
450.3
50
453.3 629.3 737.3 837.3 937.3 1077.3 1177.3 1277.3 1377.3 1477.3
SFDR (dBFS)
55
12244-343
SFDR (dBFS)
FREQUENCY (MHz)
75
Data Sheet
AD9234
72
VIN+A/
VIN+B
70
VIN–A/
VIN–B
8.5×
68
7.5×
SFDR (dBFS)
66
INTERNAL
V_1P0
GENERATOR
64
62
60
ADC
CORE
FULL-SCALE
VOLTAGE
ADJUST
V_1P0 ADJUST
SPI REGISTER
(0x024)
6.5×
V_1P0
58
12244-531
54
1710.3
1810.3
FREQUENCY (MHz)
1910.3
Figure 72. Buffer Current Sweeps, AD9234-500;
SFDR vs. Input Frequency (IBUFF);1500 MHz < fIN < 2000 MHz
Table 9 shows the recommended buffer current and full-scale
voltage settings for the different analog input frequency ranges.
Table 9. SFDR Optimization for Input Frequencies
Input
Frequency
<400 MHz
400 MHz to 1 GHz
>1 GHz
Figure 73. Internal Reference Configuration and Controls
1950.3
Input Buffer Current Control Setting,
Register 0x018
2.5× or 3.0×
4.5× or 6.5×
6.5× or higher
The SPI Register 0x024 enables the user to either use this
internal 1.0 V reference, or to provide an external 1.0 V
reference. When using an external voltage reference, provide a
1.0 V reference.
The use of an external reference may be necessary, in some
applications, to enhance the gain accuracy of the ADC or
improve thermal drift characteristics. Figure 74 shows the
typical drift characteristics of the internal 1.0 V reference.
1.0010
1.0009
1.0008
1.0007
V_1P0 VOLTAGE (V)
Absolute Maximum Input Swing
The absolute maximum input swing allowed at the inputs of the
AD9234 is 4.3 V p-p differential. Signals operating near or at
this level can cause permanent damage to the ADC.
VOLTAGE REFERENCE
1.0006
1.0005
1.0004
1.0003
1.0002
1.0001
A stable and accurate 1.0 V voltage reference is built into the
AD9234. This internal 1.0 V reference is used to set the fullscale input range of the ADC. For more information on adjusting
the input swing, see Table 22. Figure 73 shows the block diagram
of the internal 1.0 V reference controls.
1.0000
0.9999
0.9998
0
–50
25
TEMPERATURE (°C)
90
12244-106
1600.3
Figure 74. Typical V_1P0 Drift
The external reference must be a stable 1.0 V reference. The
ADR130 is a good option for providing the 1.0 V reference.
Figure 75 shows how the ADR130 can be used to provide the
external 1.0 V reference to the AD9234. The grayed out areas
show unused blocks within the AD9234 while using the
ADR130 to provide the external reference.
INTERNAL
V_1P0
GENERATOR
ADR130
INPUT
1
NC
2
GND SET 5
3
VIN
0.1µF
V_1P0
ADJUST
NC 6
VOUT 4
V_1P0
0.1µF
V_1P0
ADJUST
Figure 75. External Reference Using ADR130
Rev. A | Page 27 of 66
12244-032
52
1510.3
12244-031
V_1P0 PIN
CONTROL SPI
REGISTER
(0x024)
56
AD9234
Data Sheet
CLOCK INPUT CONSIDERATIONS
Input Clock Divider
For optimum performance, drive the AD9234 sample clock
inputs (CLK+ and CLK−) with a differential signal. This signal
is typically ac-coupled to the CLK+ and CLK− pins via a
transformer or clock drivers. These pins are biased internally
and require no additional biasing.
The AD9234 contains an input clock divider with the ability to
divide the Nyquist input clock by 1, 2, 4, and 8. The divider
ratios can be selected using Register 0x10B. This is shown in
Figure 79.
Figure 76 shows a preferred method for clocking the AD9234. The
low jitter clock source is converted from a single-ended signal to
a differential signal using an RF transformer.
0.1µF
1:1Z
CLK+
100Ω
CLK+
ADC
CLK–
0.1µF
CLK–
÷2
÷4
Figure 76. Transformer-Coupled Differential Clock
÷8
Another option is to ac couple a differential CML or LVDS
signal to the sample clock input pins, as shown in Figure 77
and Figure 78.
REG 0x10B
Figure 79. Clock Divider Circuit
3.3V
71Ω
10pF
33Ω
33Ω
Z0 = 50Ω
The AD9234 clock divider can be synchronized using the external
SYSREF± input. A valid SYSREF± causes the clock divider to
reset to a programmable state. This feature is enabled by setting
Bit 7 of Register 0x10D. This synchronization feature allows
multiple devices to have their clock dividers aligned to guarantee
simultaneous input sampling. See the Multichip Synchronization
section for more information
0.1µF
ADC
Z0 = 50Ω
0.1µF
12244-036
CLK+
CLK–
Figure 77. Differential CML Sample Clock
CLK+
50Ω1
150Ω
LVDS
DRIVER
100Ω
CLK–
CLOCK INPUT
The input clock divider inside the AD9234 provides phase delay
in increments of ½ the input clock cycle. Register 0x10C can
be programmed to enable this delay independently for each
channel. Changing this register does not affect the stability of
the JESD204B link.
CLK+
50Ω1
ADC
CLK–
0.1µF
RESISTORS ARE OPTIONAL.
12244-037
0.1µF
Input Clock Divider ½ Period Delay Adjust
0.1µF
0.1µF
CLOCK INPUT
12244-038
50Ω
12244-035
CLOCK
INPUT
The maximum frequency at the CLK± inputs is 4 GHz. This is
the limit of the divider. In applications where the clock input is
a multiple of the sample clock, care must be taken to program
the appropriate divider ratio into the clock divider before
applying the clock signal. This ensures that the current
transients during device startup are controlled.
Figure 78. Differential LVDS Sample Clock
Clock Duty Cycle Considerations
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals. As a result, these ADCs may
be sensitive to clock duty cycle. Commonly, a 5% tolerance is
required on the clock duty cycle to maintain dynamic performance
characteristics. In applications where the clock duty cycle cannot
be guaranteed to be 50%, a higher multiple frequency clock can be
supplied to the device. The AD9234 can be clocked at 2 GHz with
the internal clock divider set to 2. The output of the divider offers
a 50% duty cycle, high slew rate (fast edge) clock signal to the
internal ADC. See the Memory Map section for more details on
using this feature.
Clock Fine Delay Adjust
The AD9234 sampling edge instant can be adjusted by
writing to Register 0x117 and Register 0x118. Setting Bit 0 of
Register 0x117 enables the feature, and Register 0x118, Bits[7:0]
set the value of the delay. This value can be programmed individually for each channel. The clock delay can be adjusted from
−151.7 ps to +150 ps in ~1.7 ps increments. The clock delay
adjust takes effect immediately when it is enabled via SPI writes.
Enabling the clock fine delay adjust in Register 0x117 causes a
datapath reset. However, the contents of Register 0x118 can be
changed without affecting the stability of the JESD204B link.
Rev. A | Page 28 of 66
Data Sheet
AD9234
Clock Jitter Considerations
POWER-DOWN/STANDBY MODE
High speed, high resolution ADCs are sensitive to the quality
of the clock input. The degradation in SNR at a given input
frequency (fA) due only to aperture jitter (tJ) can be calculated by
The AD9234 has a PDWN/STBY pin that can be used to
configure the device in power-down or standby mode. The
default operation is the PDWN function. The PDWN/STBY pin
is a logic high pin. When in power-down mode, the JESD204B
link is disrupted. The power-down option can also be set via
Register 0x03F and Register 0x040.
SNR = 20 × log 10 (2 × π × fA × tJ)
In this equation, the rms aperture jitter represents the root
mean square of all jitter sources, including the clock input,
analog input signal, and ADC aperture jitter specifications.
IF undersampling applications are particularly sensitive to
jitter (see Figure 80).
In standby mode, the JESD204B link is not disrupted and
transmits zeroes for all converter samples. This can be changed
using Register 0x571, Bit 7 to select /K/ characters.
TEMPERATURE DIODE
130
12.5fS
25fS
50fS
100fS
200fS
400fS
800fS
SNR (dB)
100
90
The AD9234 contains a diode-based temperature sensor for
measuring the temperature of the die. This diode can output a
voltage and serve as a coarse temperature sensor to monitor the
internal die temperature.
80
70
60
50
30
10
100
1000
10000
ANALOG INPUT FREQUENCY (MHz)
12244-039
40
Figure 80. Ideal SNR vs. Analog Input Frequency and Jitter
Treat the clock input as an analog signal in cases where aperture
jitter may affect the dynamic range of the AD9234. Separate
power supplies for clock drivers from the ADC output driver
supplies to avoid modulating the clock signal with digital noise.
If the clock is generated from another type of source (by gating,
dividing, or other methods), retime the clock by the original clock
at the last step. Refer to the AN-501 Application Note and the
AN-756 Application Note for more in-depth information about
jitter performance as it relates to ADCs.
The temperature diode voltage can be output to the FD_A pin
using the SPI. Use Register 0x028, Bit 0 to enable or disable the
diode. Register 0x028 is a local register. Channel A must be
selected in the device index register (Register 0x008) to enable
the temperature diode readout. Configure the FD_A pin to
output the diode voltage by programming Register 0x040[2:0].
See Table 22 for more information.
The voltage response of the temperature diode (SPIVDD =
1.8 V) is shown in Figure 81.
0.90
0.85
0.80
0.75
0.70
0.65
0.60
–55 –45 –35 –25 –15 –5
5
15 25 35 45 55 65 75 85 95 105 115 125
TEMPERATURE (°C)
Figure 81. Diode Voltage vs. Temperature
Rev. A | Page 29 of 66
12244-353
110
DIODE VOLTAGE (V)
120
AD9234
Data Sheet
ADC OVERRANGE AND FAST DETECT
The operation of the upper threshold and lower threshold
registers, along with the dwell time registers, is shown in
Figure 82.
In receiver applications, it is desirable to have a mechanism to
reliably determine when the converter is about to be clipped.
The standard overrange bit in the JESD204B outputs provides
information on the state of the analog input that is of limited
usefulness. Therefore, it is helpful to have a programmable
threshold below full scale that allows time to reduce the gain
before the clip actually occurs. In addition, because input
signals can have significant slew rates, the latency of this
function is of major concern. Highly pipelined converters
can have significant latency. The AD9234 contains fast detect
circuitry for individual channels to monitor the threshold and
assert the FD_A and FD_B pins.
The FD indicator is asserted if the input magnitude exceeds the
value programmed in the fast detect upper threshold registers,
located at Register 0x247 and Register 0x248. The selected
threshold register is compared with the signal magnitude at the
output of the ADC. The fast upper threshold detection has a
latency of 28 clock cycles (maximum). The approximate upper
threshold magnitude is defined by
Upper Threshold Magnitude (dBFS) = 20 log (Threshold
Magnitude/213)
ADC OVERRANGE
The FD indicators are not cleared until the signal drops below
the lower threshold for the programmed dwell time. The lower
threshold is programmed in the fast detect lower threshold
registers, located at Register 0x249 and Register 0x24A. The fast
detect lower threshold register is a 13-bit register that is compared
with the signal magnitude at the output of the ADC. This
comparison is subject to the ADC pipeline latency, but is
accurate in terms of converter resolution. The lower threshold
magnitude is defined by
The ADC overrange indicator is asserted when an overrange is
detected on the input of the ADC. The overrange indicator can
be embedded within the JESD204B link as a control bit (when
CSB > 0). The latency of this overrange indicator matches the
sample latency.
The AD9234 also records any overrange condition in any of
the four virtual converters. For more information on the virtual
converters, refer to Figure 87. The overrange status of each
virtual converter is registered as a sticky bit in Register 0x563.
The contents of Register 0x563 can be cleared using
Register 0x562, by toggling the bits corresponding to the
virtual converter to set and reset position.
Lower Threshold Magnitude (dBFS) = 20 log (Threshold
Magnitude/213)
For example, to set an upper threshold of −6 dBFS, write 0xFFF
to Register 0x247 and Register 0x248. To set a lower threshold
of −10 dBFS, write 0xA1D to Register 0x249 and Register 0x24A.
FAST THRESHOLD DETECTION (FD_A AND FD_B)
The FD bit (enabled via the control bits in Register 0x559 and
Register 0x55A) is immediately set whenever the absolute value
of the input signal exceeds the programmable upper threshold
level. The FD bit is only cleared when the absolute value of the
input signal drops below the lower threshold level for greater
than the programmable dwell time. This feature provides
hysteresis and prevents the FD bit from excessively toggling.
The dwell time can be programmed from 1 to 65,535 sample
clock cycles by placing the desired value in the fast detect dwell
time registers, located at Register 0x24B and Register 0x24C.
See the Memory Map section (Register 0x040, and Register 0x245
to Register 0x24C in Table 22) for more details.
UPPER THRESHOLD
DWELL TIME
TIMER RESET BY
RISE ABOVE
LOWER
THRESHOLD
DWELL TIME
FD_A OR FD_B
Figure 82. Threshold Settings for FD_A and FD_B Signals
Rev. A | Page 30 of 66
TIMER COMPLETES BEFORE
SIGNAL RISES ABOVE
LOWER THRESHOLD
12244-040
MIDSCALE
LOWER THRESHOLD
Data Sheet
AD9234
SIGNAL MONITOR
The signal monitor block provides additional information about
the signal being digitized by the ADC. The signal monitor
computes the peak magnitude of the digitized signal. This
information can be used to drive an AGC loop to optimize
the range of the ADC in the presence of real-world signals.
The results of the signal monitor block can be obtained either
by reading back the internal values from the SPI port or by
embedding the signal monitoring information into the
JESD204B interface as special control bits. A global, 24-bit
programmable period controls the duration of the measurement. Figure 83 shows the simplified block diagram of the
signal monitor block.
FROM
MEMORY
MAP
SIGNAL MONITOR
PERIOD REGISTER
(SMPR)
0x271, 0x272, 0x273
DOWN
COUNTER
When the monitor period timer reaches a count of 1, the 13-bit
peak level value is transferred to the signal monitor holding
register, which can be read through the memory map or output
through the SPORT over the JESD204B interface. The monitor
period timer is reloaded with the value in the SMPR, and the
countdown is restarted. In addition, the magnitude of the first
input sample is updated in the magnitude storage register, and
the comparison and update procedure, as explained previously,
continues.
IS
COUNT = 1?
LOAD
MAGNITUDE
STORAGE
REGISTER
LOAD
LOAD
SIGNAL
MONITOR
HOLDING
REGISTER
TO SPORT OVER
JESD204B AND
MEMORY MAP
SPORT Over JESD204B
12244-406
CLEAR
FROM
INPUT
COMPARE
A>B
After enabling this mode, the value in the SMPR is loaded into a
monitor period timer, which decrements at the decimated clock
rate. The magnitude of the input signal is compared with the
value in the internal magnitude storage register (not accessible
to the user), and the greater of the two is updated as the current
peak level. The initial value of the magnitude storage register
is set to the current ADC input signal magnitude. This comparison continues until the monitor period timer reaches a
count of 1.
Figure 83. Signal Monitor Block
The peak detector captures the largest signal within the
observation period. The detector only observes the magnitude
of the signal. The resolution of the peak detector is a 13-bit
value and the observation period is 24 bits and represents
converter output samples. The peak magnitude can be derived
by using the following equation:
Peak Magnitude (dBFS) = 20 log (Peak Detector Value/213)
The magnitude of the input port signal is monitored over a
programmable time period, which is determined by the signal
monitor period register (SMPR). The peak detector function is
enabled by setting Bit 1 of Register 0x270 in the signal monitor
control register. The 24-bit SMPR must be programmed before
activating this mode.
The signal monitor data can also be serialized and sent over the
JESD204B interface as control bits. These control bits must be
deserialized from the samples to reconstruct the statistical data.
This function is enabled by setting Bit 1 and Bit 0 of Register
0x279 and Bit 1 of Register 0x27A. Figure 84 shows two different example configurations for the signal monitor control bit
locations inside the JESD204B samples. There are a maximum
of three control bits that can be inserted into the JESD204B
samples; however, only one control bit is required for the signal
monitor. Control bits are inserted from MSB to LSB. If only
one control bit is to be inserted (CS = 1), then only the most
significant control bit is used (see Example Configuration 1 and
Example Configuration 2 in Figure 84). To select the SPORT
over JESD204B option, program Register 0x559, Register 0x55A,
and Register 0x58F. See Table 22 for more information on
setting these bits.
Figure 85 shows the 25-bit frame data that encapsulates the
peak detector value. The frame data is transmitted MSB first
with five 5-bit subframes. Each subframe contains a start bit
that can be used by a receiver to validate the deserialized data.
Figure 86 shows the SPORT over JESD204B signal monitor data
with a monitor period timer set to 80 samples.
Rev. A | Page 31 of 66
AD9234
Data Sheet
16-BIT JESD204B SAMPLE SIZE (N' = 16)
EXAMPLE
CONFIGURATION 1
(N' = 16, N = 15, CS = 1)
1-BIT
CONTROL
BIT
(CS = 1)
15-BIT CONVERTER RESOLUTION (N = 15)
15
S[14]
X
14
S[13]
X
13
S[12]
X
12
S[11]
X
11
10
S[10]
X
9
S[9]
X
8
S[8]
X
7
S[7]
X
6
S[6]
X
5
S[5]
X
S[4]
X
4
S[3]
X
3
S[2]
X
2
S[1]
X
1
0
S[0]
X
CTRL
[BIT 2]
X
SERIALIZED SIGNAL MONITOR
FRAME DATA
16-BIT JESD204B SAMPLE SIZE (N' = 16)
14-BIT CONVERTER RESOLUTION (N = 14)
15
S[13]
X
14
S[12]
X
13
S[11]
X
12
S[10]
X
11
10
S[9]
X
9
S[8]
X
8
S[7]
X
7
S[6]
X
6
S[5]
X
5
S[4]
X
S[3]
X
4
S[2]
X
3
S[1]
X
2
1
0
S[0]
X
CTRL
[BIT 2]
X
TAIL
X
SERIALIZED SIGNAL MONITOR
FRAME DATA
Figure 84. Signal Monitor Control Bit Locations
5-BIT SUB-FRAMES
5-BIT IDLE
SUB-FRAME
(OPTIONAL)
25-BIT
FRAME
IDLE
1
IDLE
1
IDLE
1
IDLE
1
IDLE
1
5-BIT IDENTIFIER START
0
SUB-FRAME
ID[3]
0
ID[2]
0
ID[1]
0
ID[0]
1
5-BIT DATA
MSB
SUB-FRAME
START
0
P[12]
P[11]
P[10]
P[9]
5-BIT DATA
SUB-FRAME
START
0
P[8]
P[7]
P[6]
P5]
5-BIT DATA
SUB-FRAME
START
0
P[4]
P[3]
P[2]
P1]
5-BIT DATA
LSB
SUB-FRAME
START
0
P[0]
0
0
0
P[] = PEAK MAGNITUDE VALUE
12244-408
EXAMPLE
CONFIGURATION 2
(N' = 16, N = 14, CS = 1)
Figure 85. SPORT over JESD204B Signal Monitor Frame Data
Rev. A | Page 32 of 66
12244-407
1
CONTROL
BIT
1 TAIL
(CS = 1)
BIT
Data Sheet
AD9234
SMPR = 80 SAMPLES (0x271 = 0x50; 0x272 = 0x00; 0x273 = 0x00)
80 SAMPLE PERIOD
PAYLOAD #3
25-BIT FRAME (N)
IDENT.
DATA
MSB
DATA
DATA
DATA
LSB
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
IDLE
80 SAMPLE PERIOD
PAYLOAD #3
25-BIT FRAME (N + 1)
IDENT.
DATA
MSB
DATA
DATA
DATA
LSB
IDLE
IDLE
IDLE
IDLE
IDLE
80 SAMPLE PERIOD
IDENT.
DATA
MSB
DATA
DATA
DATA
LSB
IDLE
IDLE
IDLE
IDLE
IDLE
Figure 86. SPORT over JESD204B Signal Monitor Example with Period = 80 Samples
Rev. A | Page 33 of 66
12244-409
PAYLOAD #3
25-BIT FRAME (N + 2)
AD9234
Data Sheet
DIGITAL DOWNCONVERTER (DDC)
Each DDC block contains a decimate-by-2 digital processing
block, as shown in Figure 87.
The AD9234 includes two digital downconverters (DDC 0 and
DDC 1) that provide filtering and reduce the output data rate.
This digital processing section includes a half-band decimating
filter, a gain stage, and a complex to real conversion stage. Each
of these processing blocks has control lines that allow it to be
independently enabled and disabled to provide the desired
processing function. The digital downconverter can be
configured to output either real data or complex output data.
When DDCs have different decimation ratios, the chip decimation ratio (Register 0x201) must be set to the lowest decimation
ratio of all the DDC blocks. In this scenario, samples of higher
decimation ratio DDCs are repeated to match the chip decimation ratio sample rate. Whenever the NCO frequency is set or
changed, the DDC soft reset must be issued. If the DDC soft
reset is not issued, the output may potentially show amplitude
variations. The DDCs output a 16-bit stream. To enable this
operation, the converter number of bits N is set to a default
value of 16, even though the analog core only outputs 12 bits.
DDC GENERAL DESCRIPTION
The two DDC blocks are used to extract a portion of the full
digital spectrum captured by the ADC(s). They are intended for
IF sampling or oversampled baseband radios requiring wide
bandwidth input signals.
DDC 0
REAL/I
ADC A
SAMPLING
AT fS
REAL/I
I
HB1 FIR
DCM = 2
REAL/Q
Q
REAL/I
CONVERTER 0
Q
CONVERTER 1
I/Q
CROSSBAR
MUX
OUTPUT
INTERFACE
REAL/Q
ADC B
SAMPLING
AT fS
I
HB1 FIR
DCM = 2
REAL/Q
Q
REAL/I
CONVERTER 2
Q
CONVERTER 3
Figure 87. DDC Detailed Block Diagram
Rev. A | Page 34 of 66
12244-161
DDC 1
REAL/I
Data Sheet
AD9234
HALF-BAND FILTER
Table 10. Half-Band Filter Coefficients
The AD9234 offers one half-band filter per DDC to enable
digital signal processing of the ADC converted data.
HB1 Coefficient
Number
C1, C55
C2, C54
C3, C53
C4, C52
C5, C51
C6, C50
C7, C49
C8, C48
C9, C47
C10, C46
C11, C45
C12, C44
C13, C43
C14, C42
C15, C41
C16, C40
C17, C39
C18, C38
C19, C37
C20, C36
C21, C35
C22, C34
C23, C33
C24, C32
C25, C31
C26, C30
C27, C29
C28
The decimate-by-2, half-band (HB), low-pass FIR filter uses a
55-tap, symmetrical, fixed coefficient filter implementation,
optimized for low power consumption. The HB filter is enabled
when the DDC is selected. Table 10 and Figure 88 show the
coefficients and response of the HB1 filter.
0
–40
–60
–80
–100
–120
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
NORMALIZED FREQUENCY (× π RAD/SAMPLE)
Figure 88. HB1 Filter Response
12244-048
MAGNITUDE (dB)
–20
Rev. A | Page 35 of 66
Normalized
Coefficient
−0.000023
0
0.000097
0
−0.000288
0
0.000696
0
−0.0014725
0
0.002827
0
−0.005039
0
0.008491
0
−0.013717
0
0.021591
0
−0.033833
0
0.054806
0
−0.100557
0
0.316421
0.500000
Decimal
Coefficient (21-Bit)
−24
0
102
0
−302
0
730
0
−1544
0
2964
0
−5284
0
8903
0
−14,383
0
22640
0
−35476
0
57468
0
−105442
0
331,792
524,288
AD9234
Data Sheet
DDC GAIN STAGE
DDC COMPLEX TO REAL CONVERSION
Each DDC contains an independently controlled gain stage.
The gain is selectable as either 0 dB or 6 dB. When mixing a real
input signal down to baseband, it is recommended that the user
enable the 6 dB of gain to recenter the dynamic range of the
signal within the full scale of the output bits.
Each DDC contains an independently controlled complex to
real conversion block. The complex to real conversion block
reuses the last filter (HB1 FIR) in the filtering stage, along with
an fS/4 complex mixer, to upconvert the signal.
After upconverting the signal, the Q portion of the complex
mixer is no longer needed and is dropped.
When mixing a complex input signal down to baseband, the
mixer has already recentered the dynamic range of the signal
within the full scale of the output bits and no additional gain
is necessary. However, the optional 6 dB gain can be used to
compensate for low signal strengths. The downsample by 2
portion of the HB1 FIR filter is bypassed when using the
complex to real conversion stage (see Figure 89).
HB1 FIR
Figure 89 shows a simplified block diagram of the complex to
real conversion.
GAIN STAGE
COMPLEX TO
REAL ENABLE
LOW-PASS
FILTER
I
2
0dB
OR
6dB
I
0 I/REAL
1
COMPLEX TO REAL CONVERSION
0dB
OR
6dB
I
cos(wt)
+
REAL
90°
fS/4
0°
–
sin(wt)
LOW-PASS
FILTER
2
Q
0dB
OR
6dB
Q
Q
12244-049
Q
0dB
OR
6dB
HB1 FIR
Figure 89. Complex to Real Conversion Block
Rev. A | Page 36 of 66
Data Sheet
AD9234
DIGITAL OUTPUTS
INTRODUCTION TO THE JESD204B INTERFACE
•
The AD9234 digital outputs are designed to the JEDEC
standard JESD204B, serial interface for data converters.
JESD204B is a protocol to link the AD9234 to a digital
processing device over a serial interface with lane rates of up
to 10 Gbps. The benefits of the JESD204B interface over LVDS
include a reduction in required board area for data interface
routing, and an ability to enable smaller packages for converter
and logic devices.
JESD204B OVERVIEW
•
•
•
K = number of frames per multiframe (AD9234 value = 4,
8, 12, 16, 20, 24, 28, or 32 )
S = samples transmitted/single converter/frame cycle
(AD9234 value = set automatically based on L, M, F,
and N΄)
HD = high density mode (AD9234 = set automatically based
on L, M, F, and N΄)
CF = number of control words/frame clock cycle/converter
device (AD9234 value = 0)
The JESD204B data transmit block assembles the parallel data
from the ADC into frames and uses 8B/10B encoding as well as
optional scrambling to form serial output data. Lane synchronization is supported through the use of special control characters
during the initial establishment of the link. Additional control
characters are embedded in the data stream to maintain synchronization thereafter. A JESD204B receiver is required to complete
the serial link. For additional details on the JESD204B interface,
users are encouraged to refer to the JESD204B standard.
Figure 90 shows a simplified block diagram of the AD9234
JESD204B link. By default, the AD9234 is configured to use
two converters and four lanes. Converter A data is output to
SERDOUT0± and/or SERDOUT1± , and Converter B is output
to SERDOUT2± and/or SERDOUT3±. The AD9234 allows
other configurations such as combining the outputs of both
converters onto a single lane, or changing the mapping of the A
and B digital output paths. These modes are set up via a quick
configuration register in the SPI register map, along with
additional customizable options.
The AD9234 JESD204B data transmit block maps up to two
physical ADCs or up to eight virtual converters (when DDCs
are enabled) over a link. A link can be configured to use one,
two, or four JESD204B lanes. The JESD204B specification
refers to a number of parameters to define the link, and these
parameters must match between the JESD204B transmitter (the
AD9234 output) and the JESD204B receiver (the logic device
input).
By default in the AD9234, the 12-bit converter word from each
converter is broken into two octets (eight bits of data). Bit 13
(MSB) through Bit 6 are in the first octet. The second octet
contains Bit 5 through Bit 0 (LSB) and two tail bits. The tail
bits can be configured as zeros or a pseudorandom number
sequence. The tail bits can also be replaced with control bits
indicating overrange, SYSREF±, signal monitor, or fast detect
output.
The JESD204B link is described according to the following
parameters:
The two resulting octets can be scrambled. Scrambling is
optional; however, it is recommended to avoid spectral peaks
when transmitting similar digital data patterns. The scrambler
uses a self-synchronizing, polynomial-based algorithm defined
by the equation 1 + x14 + x15. The descrambler in the receiver is
a self-synchronizing version of the scrambler polynomial.
•
•
•
•
•
•
L = number of lanes/converter device (lanes/link) (AD9234
value = 1, 2, or 4)
M = number of converters/converter device (virtual
converters/link) (AD9234 value = 1, 2, 4, or 8)
F = octets/frame (AD9234 value = 1, 2, 4, 8, or 16)
N΄ = number of bits per sample (JESD204B word size)
(AD9234 value = 8 or 16)
N = converter resolution (AD9234 value = 7 to 16)
CS = number of control bits/sample (AD9234 value = 0, 1,
2, or 3)
The two octets are then encoded with an 8B/10B encoder. The
8B/10B encoder works by taking eight bits of data (an octet)
and encoding them into a 10-bit symbol. Figure 91 shows how
the 12-bit data is taken from the ADC, the tail bits are added,
the two octets are scrambled, and how the octets are encoded
into two 10-bit symbols. Figure 91 illustrates the default data
format.
Rev. A | Page 37 of 66
AD9234
Data Sheet
CONVERTER 0
CONVERTER A
INPUT
ADC
A
JESD204B LINK
CONTROL
(L.M.F)
(SPI REG 0x570)
MUX/
FORMAT
(SPI
REG 0x561,
REG 0x564)
CONVERTER B
INPUT
LANE MUX
AND MAPPING
(SPI
REG 0x5B0,
REG 0x5B2,
REG 0x5B3,
REG 0x5B5,
REG 0x5B6)
ADC
B
SERDOUT0–,
SERDOUT0+
SERDOUT1–,
SERDOUT1+
SERDOUT2–,
SERDOUT2+
SERDOUT3–,
SERDOUT3+
12244-050
CONVERTER 1
SYSREF±
SYNCINB±
Figure 90. Transmit Link Simplified Block Diagram Showing Full Bandwidth Mode (Register 0x200 = 0x00)
JESD204B
INTERFACE
TEST PATTERN
(REG 0x573,
REG 0x551 TO
REG 0x558)
JESD204B
LONG TRANSPORT
TEST PATTERN
REG 0x571[5]
SERIALIZER
SCRAMBLER
1 + x14 + x15
MSB A13
A12
A11
A10
A9
A8
A6
LSB A7
A5
A4
A3
A2
A1
A0
C2
T
MSB S7
S6
S5
S4
S3
S2
S1
LSB S0
S7
S6
S5
S4
S3
S2
S1
S0
8-BIT/10-BIT
ENCODER
a b
a b c d e f g h i j
SERDOUT0±
SERDOUT1±
i j a b
SYMBOL0
i j
SYMBOL1
a b c d e f g h i j
12244-151
TAIL BITS
0x571[6]
(OPTIONAL)
OCTET 1
JESD204B SAMPLE
CONSTRUCTION
MSB A13
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
LSB A0
OCTET 1
OCTET 0
FRAME
CONSTRUCTION
OCTET 0
ADC TEST PATTERNS
(RE0x550,
REG 0x551 TO
REG 0x558)
ADC
JESD204B DATA
LINK LAYER TEST
PATTERNS
REG 0x574[2:0]
C2
CONTROL BITS C1
C0
Figure 91. ADC Output Datapath Showing Data Framing
TRANSPORT
LAYER
SAMPLE
CONSTRUCTION
FRAME
CONSTRUCTION
SCRAMBLER
ALIGNMENT
CHARACTER
GENERATION
PHYSICAL
LAYER
8-BIT/10-BIT
ENCODER
CROSSBAR
MUX
SERIALIZER
Tx
OUTPUT
12244-052
PROCESSED
SAMPLES
FROM ADC
DATA LINK
LAYER
SYSREF±
SYNCINB±
Figure 92. Data Flow
number of tail bits within a sample (JESD204B word):
FUNCTIONAL OVERVIEW
The block diagram in Figure 92 shows the flow of data through
the JESD204B hardware from the sample input to the physical
output. The processing can be divided into layers that are
derived from the open-source initiative (OSI) model widely
used to describe the abstraction layers of communications
systems. These layers are the transport layer, data link layer,
and physical layer (serializer and output driver).
Transport Layer
The transport layer handles packing the data (consisting of
samples and optional control bits) into JESD204B frames that
are mapped to 8-bit octets. These octets are sent to the data link
layer. The transport layer mapping is controlled by rules derived
from the link parameters. Tail bits are added to fill gaps where
required. The following equation can be used to determine the
T = N΄ – N – CS
Data Link Layer
The data link layer is responsible for the low level functions
of passing data across the link. These include optionally
scrambling the data, inserting control characters for multichip
synchronization/lane alignment/monitoring, and encoding
8-bit octets into 10-bit symbols. The data link layer is also
responsible for sending the initial lane alignment sequence
(ILAS), which contains the link configuration data used by
the receiver to verify the settings in the transport layer.
Physical Layer
The physical layer consists of the high speed circuitry clocked at
the serial clock rate. In this layer, parallel data is converted into
one, two, or four lanes of high speed differential serial data.
Rev. A | Page 38 of 66
Data Sheet
AD9234
JESD204B LINK ESTABLISHMENT
Initial Lane Alignment Sequence (ILAS)
The AD9234 JESD204B transmitter (Tx) interface operates in
Subclass 1 as defined in the JEDEC Standard JESD204B (July
2011 specification). The link establishment process is divided
into the following steps: code group synchronization and
SYNCINB±, initial lane alignment sequence, and user data
and error correction.
The ILAS phase follows the CGS phase and begins on the next
LMFC boundary. The ILAS consists of four multiframes, with
an /R/ character marking the beginning and an /A/ character
marking the end. The ILAS begins by sending an /R/ character
followed by 0 to 255 ramp data for one multiframe. On the
second multiframe, the link configuration data is sent, starting
with the third character. The second character is a /Q/ character
to confirm that the link configuration data follows. All
undefined data slots are filled with ramp data. The ILAS
sequence is never scrambled.
Code Group Synchronization (CGS) and SYNCINB±
The CGS is the process by which the JESD204B receiver finds
the boundaries between the 10-bit symbols in the stream of
data. During the CGS phase, the JESD204B transmit block
transmits /K28.5/ characters. The receiver must locate /K28.5/
characters in its input data stream using clock and data recovery
(CDR) techniques.
The receiver issues a synchronization request by asserting
the SYNCINB± pin of the AD9234 low. The JESD204B Tx
then begins sending /K/ characters. After the receiver has
synchronized, it waits for the correct reception of at least
four consecutive /K/ symbols. It then deasserts SYNCINB±.
The AD9234 then transmits an ILAS on the following local
multiframe clock (LMFC) boundary.
The ILAS sequence construction is shown in Figure 93. The
four multiframes include the following:
•
•
•
For more information on the code group synchronization
phase, refer to the JEDEC Standard JESD204B, July 2011,
Section 5.3.3.1.
•
Multiframe 1. Begins with an /R/ character (/K28.0/) and
ends with an /A/ character (/K28.3/).
Multiframe 2. Begins with an /R/ character followed by a
/Q/ (/K28.4/) character, followed by link configuration
parameters over 14 configuration octets (see Table 11) and
ends with an /A/ character. Many of the parameter values
are of the value – 1 notation.
Multiframe 3. Begins with an /R/ character (/K28.0/) and
ends with an /A/ character (/K28.3/).
Multiframe 4. Begins with an /R/ character (/K28.0/) and
ends with an /A/ character (/K28.3/).
The SYNCINB± pin operation can also be controlled by the
SPI. The SYNCINB± signal is a differential dc-coupled LVDS
mode signal by default, but it can also be driven single-ended.
For more information on configuring the SYNCINB± pin
operation, refer to Register 0x572.
K K R D
D A R Q C
C D
D A R D
D A R D
D A D
START OF
ILAS
START OF LINK
CONFIGURATION DATA
START OF
USER DATA
Figure 93. Initial Lane Alignment Sequence
Rev. A | Page 39 of 66
12244-053
END OF
MULTIFRAME
AD9234
Data Sheet
User Data and Error Detection
8B/10B Encoder
After the initial lane alignment sequence is complete, the
user data is sent. Normally, within a frame, all characters are
considered user data. However, to monitor the frame clock and
multiframe clock synchronization, there is a mechanism for
replacing characters with /F/ or /A/ alignment characters
when the data meets certain conditions. These conditions are
different for unscrambled and scrambled data. The scrambling
operation is enabled by default, but it can be disabled using the SPI.
The 8B/10B encoder converts 8-bit octets into 10-bit symbols
and inserts control characters into the stream when needed.
The control characters used in JESD204B are shown in Table 11.
The 8B/10B encoding ensures that the signal is dc balanced by
using the same number of ones and zeros across multiple
symbols.
For scrambled data, any 0xFC character at the end of a frame
is replaced by an /F/, and any 0x7C character at the end of a
multiframe is replaced with an /A/. The JESD204B receiver (Rx)
checks for /F/ and /A/ characters in the received data stream
and verifies that they only occur in the expected locations. If an
unexpected /F/ or /A/ character is found, the receiver handles
the situation by using dynamic realignment or asserting the
SYNCINB± signal for more than four frames to initiate a
resynchronization. For unscrambled data, if the final character
of two subsequent frames is equal, the second character is
replaced with an /F/ if it is at the end of a frame, and an /A/
if it is at the end of a multiframe.
The 8B/10B interface has options that can be controlled via the
SPI. These operations include bypass and invert. These options
are intended to be troubleshooting tools for the verification of
the digital front end (DFE). Refer to the Memory Map section,
Register 0x572[2:1] for information on configuring the 8B/10B
encoder.
Insertion of alignment characters can be modified using SPI.
The frame alignment character insertion (FACI) is enabled by
default. More information on the link controls is available in the
Memory Map section, Register 0x571.
Table 11. AD9234 Control Characters Used in JESD204B
Abbreviation
/R/
/A/
/Q/
/K/
/F/
1
Control Symbol
/K28.0/
/K28.3/
/K28.4/
/K28.5/
/K28.7/
8-Bit Value
000 11100
011 11100
100 11100
101 11100
111 11100
10-Bit Value, RD1 = −1
001111 0100
001111 0011
001111 0010
001111 1010
001111 1000
RD means running disparity.
Rev. A | Page 40 of 66
10-Bit Value, RD1 = +1
110000 1011
110000 1100
110000 1101
110000 0101
110000 0111
Description
Start of multiframe
Lane alignment
Start of link configuration data
Group synchronization
Frame alignment
Data Sheet
AD9234
PHYSICAL LAYER (DRIVER) OUTPUTS
Digital Outputs, Timing, and Controls
The AD9234 physical layer consists of drivers that are defined
in the JEDEC Standard JESD204B, July 2011. The differential
digital outputs are powered up by default. The drivers use a
dynamic 100 Ω internal termination to reduce unwanted
reflections.
Place a 100 Ω differential termination resistor at each receiver,
which results in a nominal 300 mV p-p swing at the receiver
(see Figure 94). It is recommended to use ac coupling to
connect the AD9234 SERDES outputs to the receiver.
DRVDD
100Ω
DIFFERENTIAL
TRACE
PAIR
0.1µF
SERDOUTx+
100Ω
RECEIVER
SERDOUTx–
12244-054
0.1µF
OUTPUT SWING = 300mV p-p
Figure 95 to Figure 100 show examples of the digital output data
eye, time interval error (TIE) jitter histogram, and bathtub
curve for one AD9234 lane running at 10 Gbps and 6 Gbps,
respectively. The format of the output data is twos complement
by default. To change the output data format, see the Memory Map
section (Register 0x561 in Table 22).
De-Emphasis
De-emphasis enables the receiver eye diagram mask to be met
in conditions where the interconnect insertion loss does not
meet the JESD204B specification. Use the de-emphasis feature
only when the receiver is unable to recover the clock due to
excessive insertion loss. Under normal conditions, it is disabled
to conserve power. Additionally, enabling and setting too high a
de-emphasis value on a short link may cause the receiver eye
diagram to fail. Use the de-emphasis setting with caution
because it may increase electromagnetic interference (EMI). See
the Memory Map section (Register 0x5C1 to Register 0x5C5 in
Table 22) for more details.
Phase-Locked Loop
Figure 94. AC-Coupled Digital Output Termination Example
If there is no far-end receiver termination, or if there is poor
differential trace routing, timing errors may result. To avoid
such timing errors, it is recommended that the trace length be
less than six inches, and that the differential output traces be
close together and at equal lengths.
The PLL is used to generate the serializer clock, which will
operate at the JESD204B lane rate. The JESD204B lane rate
Register 0x056E[4:3] must be set to correspond with
the lane rate.
400
400
300
300
200
0
VOLTAGE (mV)
VOLTAGE (mV)
200
100
Tx EYE
MASK
–100
100
0
–100
Tx EYE
MASK
–200
–200
–300
–300
–80
–60
–40
–20
0
TIME (ps)
20
40
60
80
12244-500
–100
Figure 95. Digital Outputs Data Eye, External 100 Ω Terminations at 10 Gbps
–150
–100
–50
0
TIME (ps)
50
100
150
12244-503
–400
–400
Figure 96. Digital Outputs Data Eye, External 100 Ω Terminations at 6 Gbps
Rev. A | Page 41 of 66
AD9234
Data Sheet
8000
12000
7000
10000
6000
4000
HITS
HITS
8000
6000
4000
3000
4000
2000
2000
–2
0
2
4
6
TIME (ps)
Figure 97. Digital Outputs Histogram, External 100 Ω Terminations at 10 Gbps
1–2
1–2
1–4
1–4
1–6
1–6
BER
1
1–10
1–12
1–12
1–14
1–14
1–16
–0.5
1–16
–0.5
–0.3
–0.2
–0.1
0
UI
0.1
0.2
0.3
0.4
0.5
Figure 98. Digital Outputs Bathtub Curve, External 100 Ω Terminations at 10 Gbps
–1
1
0
2
3
4
1–8
1–10
–0.4
–2
Figure 99. Digital Outputs Histogram, External 100 Ω Terminations at 6 Gbps
1
1–8
–3
TIME (ps)
12244-502
BER
0
–4
–0.4
–0.3
–0.2
–0.1
0
UI
0.1
0.2
0.3
0.4
0.5
12244-505
–4
12244-501
0
12244-504
1000
Figure 100. Digital Outputs Bathtub Curve, External 100 Ω Terminations at 6 Gbps
Rev. A | Page 42 of 66
Data Sheet
AD9234
CONFIGURING THE JESD204B LINK
The following steps can be used to configure the output:
The AD9234 has one JESD204B link. The device offers an easy
way to set up the JESD204B link through the quick configuration
register (Register 0x570). The serial outputs (SERDOUT0± to
SERDOUT3±) are considered to be part of one JESD204B link.
The basic parameters that determine the link setup are
1.
2.
3.
4.
5.
6.
•
•
•
Number of lanes per link (L)
Number of converters per link (M)
Number of octets per frame (F)
Power down the link.
Select quick configuration options.
Configure detailed options.
Set output lane mapping (optional).
Set additional driver configuration options (optional).
Power up the link.
If the lane line rate calculated is less than 6.25 Gbps, select the
low line rate option. This is done by programming a value of
0x10 to Register 0x56E.
The maximum lane rate allowed by the JESD204B specification
is 12.5 Gbps. The lane line rate is related to the JESD204B
parameters using the following equation:
Table 12 and Table 13 show the JESD204B output configurations supported for both N΄ = 16 and N΄ = 8 for a given number
of virtual converters. Care must be taken to ensure that the
serial line rate for a given configuration is within the supported
range of 3.125 Gbps to 12.5 Gbps.
 10 
M × N '×   × f OUT
8
Lane Line Rate =
L
where fOUT = fADC_CLOCK/decimation ratio.
Table 12. JESD204B Output Configurations for N΄ = 16
Number of Virtual
Converters
Supported (Same
Value as M)
1
2
4
JESD204B Transport Layer Settings2
JESD204B Quick
Configuration
(0x570)
0x01
0x40
0x41
0x80
0x81
0x0A
0x49
0x88
0x89
0x13
0x52
0x91
JESD204B Serial
Line Rate1
20 × fOUT
10 × fOUT
10 × fOUT
5 × fOUT
5 × fOUT
40 × fOUT
20 × fOUT
10 × fOUT
10 × fOUT
80 × fOUT
40 × fOUT
20 × fOUT
L
1
2
2
4
4
1
2
4
4
1
2
4
M
1
1
1
1
1
2
2
2
2
4
4
4
F
2
1
2
1
2
4
2
1
2
8
4
2
S
1
1
2
2
4
1
1
1
2
1
1
1
HD
0
1
0
1
0
0
0
1
0
0
0
0
N
8 to 16
8 to 16
8 to 16
8 to 16
8 to 16
8 to 16
8 to 16
8 to 16
8 to 16
8 to 16
8 to 16
8 to 16
N΄
16
16
16
16
16
16
16
16
16
16
16
16
CS
0 to 3
0 to 3
0 to 3
0 to 3
0 to 3
0 to 3
0 to 3
0 to 3
0 to 3
0 to 3
0 to 3
0 to 3
K3
Only valid K
values that
are divisible
by 4 are
supported
fOUT = output sample rate = ADC sample rate/chip decimation ratio. The JESD204B serial line rate must be ≥3.125 Gbps and ≤12.5 Gbps; when the serial line rate is
≤12.5 Gbps and ≥6.25 Gbps, the low line rate mode must be disabled (set Bit 4 to 0x0 in 0x56E). When the serial line rate is <6.25 Gbps and ≥3.125 Gbps, the low line
rate mode must be enabled (set Bit 4 to 0x1 in 0x56E).
2
JESD204B transport layer descriptions are as described in the JESD204B Overview section.
3
For F = 1, K = 20, 24, 28, and 32. For F = 2, K = 12, 16, 20, 24, 28, and 32. For F = 4, K = 8, 12, 16, 20, 24, 28, and 32. For F = 8 and F = 16, K = 4, 8, 12, 16, 20, 24, 28, and 32.
1
Table 13. JESD204B Output Configurations for N΄ = 8
Number of Virtual
Converters Supported
(Same Value as M)
1
JESD204B Quick
Configuration
(0x570)
0x00
0x01
0x40
0x41
0x42
0x80
0x81
JESD204B Transport Layer Settings2
Serial Line Rate1
10 × fOUT
10 × fOUT
5 × fOUT
5 × fOUT
5 × fOUT
2.5 × fOUT
2.5 × fOUT
L
1
1
2
2
2
4
4
M
1
1
1
1
1
1
1
Rev. A | Page 43 of 66
F
1
2
1
2
4
1
2
S
1
2
2
4
8
4
8
HD
0
0
0
0
0
0
0
N
7 to 8
7 to 8
7 to 8
7 to 8
7 to 8
7 to 8
7 to 8
N΄
8
8
8
8
8
8
8
CS
0 to 1
0 to 1
0 to 1
0 to 1
0 to 1
0 to 1
0 to 1
K3
Only valid K
values which
are divisible
by 4 are
supported
AD9234
Data Sheet
Number of Virtual
Converters Supported
(Same Value as M)
2
JESD204B Quick
Configuration
(0x570)
0x09
0x48
0x49
0x88
0x89
0x8A
JESD204B Transport Layer Settings2
Serial Line Rate1
20 × fOUT
10 × fOUT
10 × fOUT
5 × fOUT
5 × fOUT
5 × fOUT
L
1
2
2
4
4
4
M
2
2
2
2
2
2
F
2
1
2
1
2
4
S
1
1
2
2
4
8
HD
0
0
0
0
0
0
N
7 to 8
7 to 8
7 to 8
7 to 8
7 to 8
7 to 8
N΄
8
8
8
8
8
8
CS
0 to 1
0 to 1
0 to 1
0 to 1
0 to 1
0 to 1
K3
1
fOUT = output sample rate = ADC sample rate/chip decimation ratio. The JESD204B serial line rate must be ≥3125 Mbps and ≤12,500 Mbps; when the serial line rate is
≤12.5 Gbps and ≥6.25 Gbps, the low line rate mode must be disabled (set Bit 4 to 0x0 in Register 0x56E). When the serial line rate is <6.25 Gbps and ≥3.125 Gbps, the
low line rate mode must be enabled (set Bit 4 to 0x1 in Register 0x56E).
2
JESD204B transport layer descriptions are as described in the JESD204B Overview section.
3
For F = 1, K = 20, 24, 28, and 32. For F = 2, K = 12, 16, 20, 24, 28, and 32. For F = 4, K = 8, 12, 16, 20, 24, 28, and 32. For F = 8 and F = 16, K = 4, 8, 12, 16, 20, 24, 28, and 32.
See the Example 1: Full Bandwidth Mode section, the
Example 2: Full Bandwidth Mode at 500 MSPS section, and the
Example 3: ADC with DDC Option (Two ADCs Plus Two
DDCs) section for examples describing which JESD204B
transport layer settings are valid for a given chip mode.
Example 1: Full Bandwidth Mode at 1 GSPS
Example 2: Full Bandwidth Mode at 500 MSPS
Chip application mode is full bandwidth mode (see Figure 101).



Two 12-bit converters at 500 MSPS
Full bandwidth application layer mode
No decimation
Chip application mode is full bandwidth mode (see Figure 101).
JESD204B output configuration includes the following:





Two 12-bit converters at 1000 MSPS
Full bandwidth application layer mode
No decimation
JESD204B supported output configurations (see Table 12)
include
JESD204B output configuration includes the following:





Two virtual converters required (see Table 12)
Output sample rate (fOUT) = 1000/1 = 1000 MSPS
JESD204B supported output configurations (see Table 12)
include



N΄ = 16 bits
N = 12 bits
L = 4, M = 2, and F = 1, or L = 4, M = 2, and F = 2 (quick
configuration = 0x88 or 0x89)
CS = 0 to 2
K = 32
Output serial line rate = 10 Gbps per lane, low line rate
mode disabled



CMOS
FAST
DETECTION
REAL/I
14-BIT
AT
1Gbps
CONVERTER 0
JESD204B
TRANSMIT
INTERFACE
REAL/Q
14-BIT
AT
1Gbps
L
JESD204B
LANES
AT UP TO
12.5Gbps
CONVERTER 1
FAST
DETECTION
CMOS
12244-060



Two virtual converters required (see Table 12)
Output sample rate (fOUT) = 500/1 = 500 MSPS
Figure 101. Full Bandwidth Mode
Rev. A | Page 44 of 66
N΄ = 16 bits
N = 12 bits
L = 4, M = 2, and F = 1, or L = 2, M = 2, and F = 2 (quick
configuration = 0x88 or 0x49)
CS = 0 to 2
K = 32
Output serial line rate
 5 Gbps per lane for L.M.F = 4.2.1, low line rate mode
enabled (0x56E = 0x00)
 10 Gbps per lane for L.M.F = 2.2.2, low line rate mode
disabled (0x56E = 0x00)
Data Sheet
AD9234
Example 3: ADC with DDC Option (Two ADCs Plus Two
DDCs)
JESD204B supported output configurations include (see
Table 12)
Chip application mode is two-DDC mode. (see Figure 102).
•
•
•
•
•
•
•
•
•
•
•
Two 12-bit converters at 1 MSPS
Two DDC application layer mode with complex outputs
(I/Q)
Chip decimation ratio = 2
DDC decimation ratio = 2 (see Table 22)
JESD204B output configuration includes the following:
Example 2 shows the flexibility in the digital and lane
configurations for the AD9234. The sample rate is 1 GSPS,
but the outputs are all combined in either one or two lanes,
depending on the I/O speed capability of the receiving device.
Virtual converters required = 4 (see Table 12)
Output sample rate (fOUT) = 1000/2 = 500 MSPS
REAL
REAL
SYSREF
ADC A
SAMPLING
AT fS
ADC B
SAMPLING
AT fS
REAL/I
DDC 0
I
CONVERTER 0
Q
CONVERTER 1
DDC 1
I
CONVERTER 2
Q
CONVERTER 3
I/Q
CROSSBAR
MUX
REAL/Q
L JESD204B
LANES UP TO
12.5Gbps
L
JESD204B
LANES
AT UP TO
12.5Gbps
12244-061
•
•
N΄ = 16 bits
N = 12 bits
L = 4, M = 4, and F = 2 (quick configuration = 0x91)
CS = 0 to 1
K = 32
Output serial line rate = 10 Gbps per lane (L = 4)
Low line rate mode is disabled (0x56E = 0x00).
SYNCHRONIZATION
CONTROL CIRCUITS
Figure 102. Two-ADC Plus Two-DDC Mode
Rev. A | Page 45 of 66
AD9234
Data Sheet
MULTICHIP SYNCHRONIZATION
The AD9234 has a SYSREF± input that allows the user flexible
options for synchronizing the internal blocks. The SYSREF±
input is a source synchronous system reference signal that
enables multichip synchronization. The input clock divider,
DDCs, signal monitor block, and JESD204B link can be
synchronized using the SYSREF± input. For the highest level
of timing accuracy, SYSREF± must meet setup and hold
requirements relative to the CLK± input.
The flowchart in Figure 103 describes the internal mechanism
by which multichip synchronization can be achieved in the
AD9234. The AD9234 supports several features which aid users
in meeting the requirements set out for capturing a SYSREF±
signal. The SYSREF sample event can be defined as either a
synchronous low to high transition, or synchronous high to
low transition. Additionally, the AD9234 allows the SYSREF
signal to be sampled using either the rising edge or falling edge
of the CLK± input. The AD9234 also has the ability to ignore
a programmable number (up to 16) of SYSREF± events. The
SYSREF± control options can be selected using Register 0x120
and Register 0x121.
Rev. A | Page 46 of 66
Data Sheet
AD9234
START
INCREMENT
SYSREF± IGNORE
COUNTER
NO
NO
RESET
SYSREF± IGNORE
COUNTER
SYSREF±
ENABLED?
(0x120)
NO
NO
SYSREF±
ASSERTED?
YES
UPDATE
SETUP/HOLD
DETECTOR STATUS
(0x128)
YES
SYSREF±
IGNORE
COUNTER
EXPIRED?
(0x121)
YES
ALIGN CLOCK
DIVIDER
PHASE TO
SYSREF
INPUT
CLOCK
DIVIDER
ALIGNMENT
REQUIRED?
YES
YES
NO
SYNCHRONIZATION
MODE?
(0x1FF)
CLOCK
DIVIDER
AUTO ADJUST
ENABLED?
(0x10D)
NO
TIMESTAMP
MODE
SYSREF±
TIMESTAMP
DELAY
(0x123)
INCREMENT
SYSREF±
COUNTER
(0x12A)
CLOCK
DIVIDER
> 1?
(0x10B)
YES
NO
SYSREF±
CONTROL BITS?
(0x559, 0x55A,
0x58F)
YES
SYSREF±
INSERTED
IN JESD204B
CONTROL BITS
NO
RAMP
TEST
MODE
ENABLED?
(0x550)
NORMAL
MODE
YES
SYSREF± RESETS
RAMP TEST
MODE
GENERATOR
BACK TO START
NO
YES
ALIGN PHASE
OF ALL
INTERNAL CLOCKS
(INCLUDING LMFC)
TO SYSREF±
SEND INVALID
8B/10B
CHARACTERS
(ALL 0's)
SYNC~
ASSERTED
NO
SEND K28.5
CHARACTERS
NORMAL
JESD204B
INITIALIZATION
NO
NO
SIGNAL
MONITOR
ALIGNMENT
ENABLED?
(0x26F)
YES
YES
ALIGN SIGNAL
MONITOR
COUNTERS
DDC NCO
ALIGNMENT
ENABLED?
(0x300)
YES
NO
Figure 103. Multichip Synchronization
Rev. A | Page 47 of 66
ALIGN DDC
NCO PHASE
ACCUMULATOR
BACK TO START
12244-410
JESD204B
LMFC
ALIGNMENT
REQUIRED?
AD9234
Data Sheet
SYSREF± SETUP/HOLD WINDOW MONITOR
To assist in ensuring a valid SYSREF signal capture, the AD9234
has a SYSREF± setup/hold window monitor. This feature allows
the system designer to determine the location of the SYSREF±
signals relative to the CLK± signals by reading back the amount
of setup/hold margin on the interface through the memory
map. Figure 104 and Figure 105 show the setup and hold status
REG 0x128[3:0]
values for different phases of SYSREF±. The setup detector
returns the status of the SYSREF±signal before the CLK± edge
and the hold detector returns the status of the SYSREF signal
after the CLK± edge. Register 0x128 stores the status of
SYSREF± and lets the user know if the SYSREF± signal is
successfully captured by the ADC.
–1
–2
–3
–4
–5
–6
–7
–8
7
6
5
4
3
2
1
0
CLK±
INPUT
SYSREF±
INPUT
VALID
FLIP-FLOP
HOLD (MIN)
FLIP-FLOP
HOLD (MIN)
12244-411
FLIP-FLOP
SETUP (MIN)
Figure 104. SYSREF± Setup Detector
REG 0x128[7:4]
–1
–2
–3
–4
–5
–6
–7
–8
7
6
5
4
3
2
1
0
CLK±
INPUT
SYSREF±
INPUT
FLIP-FLOP
SETUP (MIN)
FLIP-FLOP
HOLD (MIN)
FLIP-FLOP
HOLD (MIN)
Figure 105. SYSREF± Hold Detector
Rev. A | Page 48 of 66
12244-412
VALID
Data Sheet
AD9234
Table 14 shows the description of the contents of Register 0x128 and how to interpret them.
Table 14. SYSREF± Setup/Hold Monitor, Register 0x128
Register 0x128[7:4]
Hold Status
0x0
0x0 to 0x8
0x8
0x8
0x9 to 0xF
0x0
Register 0x128[3:0]
Setup Status
0x0 to 0x7
0x8
0x9 to 0xF
0x0
0x0
0x0
Description
Possible setup error. The smaller this number, the smaller the setup margin.
No setup or hold error (best hold margin).
No setup or hold error (best setup and hold margin).
No setup or hold error (best setup margin).
Possible hold error. The larger this number, the smaller the hold margin.
Possible setup or hold error.
Rev. A | Page 49 of 66
AD9234
Data Sheet
TEST MODES
ADC TEST MODES
The AD9234 has various test options that aid in the system level
implementation. The AD9234 has ADC test modes that are
available in Register 0x550. These test modes are described in
Table 15. When an output test mode is enabled, the analog section
of the ADC is disconnected from the digital back-end blocks,
and the test pattern is run through the output formatting block.
Some of the test patterns are subject to output formatting, and
some are not. The PN generators from the PN sequence tests
can be reset by setting Bit 4 or Bit 5 of Register 0x550. These
tests can be performed with or without an analog signal (if
present, the analog signal is ignored); however, they do require
an encode clock. For more information, see the AN-877
Application Note, Interfacing to High Speed ADCs via SPI.
Table 15. ADC Test Modes1
Output Test Mode
Bit Sequence
0000
0001
0010
0011
0100
0101
0110
0111
1000
Pattern Name
Off (default)
Midscale short
+Full-scale short
−Full-scale short
Checkerboard
PN sequence long
PN sequence short
One-/zero-word toggle
User input
Expression
N/A
0000 0000 0000
0111 1111 1111
1000 0000 0000
1010 1010 1010
X23 + X18 + 1
X9 + X5 + 1
1111 1111 1111
Register 0x551 to
Register 0x558
1111
Ramp output
(X) % 212
1
Default/
Seed Value
N/A
N/A
N/A
N/A
N/A
0x3AFF
0x0092
N/A
N/A
N/A
N/A means not applicable.
Rev. A | Page 50 of 66
Sample (N, N + 1, N + 2,….)
N/A
N/A
N/A
N/A
0x0AAA, 0x0555, 0x0AAA, 0x0555, 0x0AAA
0x3FD7, 0x0002, 0x26E0, 0x0A3D, 0x1CA6
0x125B, 0x3C9A, 0x2660, 0x0c65, 0x0697
0x0FFF, 0x0000, 0x0FFF, 0x0000, 0x0FFF
User Pat 1[15:2], User Pat 2[15:2], User Pat 3[15:2],
User Pat 4[15:2], User Pat 1[15:2] … for repeat mode
User Pat 1[15:2], User Pat 2[15:2], User Pat 3[15:2],
User Pat 4[15:2], 0x0000 … for single mode
(X) % 212, (X +1) % 212, (X +2) % 212, (X +3) % 212
Data Sheet
AD9234
JESD204B BLOCK TEST MODES
Transport Layer Sample Test Mode
In addition to the ADC pipeline test modes, the AD9234 also
has flexible test modes in the JESD204B block. These test modes
are listed in Register 0x573 and Register 0x574. These test
patterns can be injected at various points along the output
data path. These test injection points are shown in Figure 91.
Table 16 describes the various test modes available in the
JESD204B block. For the AD9234, a transition from test modes
(Register 0x573 ≠ 0x00) to normal mode (Register 0x573 =
0x00) requires an SPI soft reset. This is done by writing 0x81 to
Register 0x00 (self cleared).
The transport layer samples are implemented in the AD9234 as
defined by section 5.1.6.3 in the JEDEC JESD204B Specification.
These tests are shown in Register 0x571[5]. The test pattern is
equivalent to the raw samples from the ADC.
Interface Test Modes
The interface test modes are described in Register 0x573
Bits[3:0]. These test modes are also explained in Table 16. The
interface tests can be injected at various points along the data.
See Figure 91 for more information on the test injection points.
Register 0x573 Bits[5:4] show where these tests are injected.
Table 17, Table 18, and Table 19 show examples of some of the
test modes when injected at the JESD Sample Input, PHY 10-bit
Input, and Scrambler 8-bit Input. UP in the tables represent the
user pattern control bits from the customer register map.
Table 16. JESD204B Interface Test Modes
Output Test Mode
Bit Sequence
0000
0001
0010
0011
0100
0101
0110
0111
1000
1110
1111
Pattern Name
Off (default)
Alternating checker board
1/0 word toggle
31-bit PN sequence
23-bit PN sequence
15-bit PN sequence
9-bit PN sequence
7-bit PN sequence
Ramp output
Continuous/repeat user test
Single user test
Expression
Not applicable
0x5555, 0xAAAA, 0x5555…
0x0000, 0xFFFF, 0x0000…
X31 + X28 + 1
X23 + X18 + 1
X15 + X14 + 1
X9 + X5 + 1
X7 + X6 + 1
(X) % 216
Register 0x551 to Register 0x558
Register 0x551 to Register 0x558
Default
Not applicable
Not applicable
Not applicable
0x0003AFFF
0x003AFF
0x03AF
0x092
0x07
Ramp size depends on test injection point
User Pat 1 to User Pat 4, then repeat
User Pat 1 to User Pat 4, then zeroes
Table 17. JESD204B Sample Input for M = 2, S = 2, N' = 16 (Register 0x573[5:4] = 'b00)
Frame
Number
0
0
0
0
1
1
1
1
2
2
2
2
3
3
3
3
4
4
4
4
Converter
Number
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
Sample
Number
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Alternating
Checkerboard
0x5555
0x5555
0x5555
0x5555
0xAAAA
0xAAAA
0xAAAA
0xAAAA
0x5555
0x5555
0x5555
0x5555
0xAAAA
0xAAAA
0xAAAA
0xAAAA
0x5555
0x5555
0x5555
0x5555
1/0 Word
Toggle
0x0000
0x0000
0x0000
0x0000
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0x0000
0x0000
0x0000
0x0000
0xFFFF
0xFFFF
0xFFFF
0xFFFF
0x0000
0x0000
0x0000
0x0000
Ramp
(X) % 216
(X) % 216
(X) % 216
(X) % 216
(X +1) % 216
(X +1) % 216
(X +1) % 216
(X +1) % 216
(X +2) % 216
(X +2) % 216
(X +2) % 216
(X +2) % 216
(X +3) % 216
(X +3) % 216
(X +3) % 216
(X +3) % 216
(X +4) % 216
(X +4) % 216
(X +4) % 216
(X +4) % 216
Rev. A | Page 51 of 66
PN9
0x496F
0x496F
0x496F
0x496F
0xC9A9
0xC9A9
0xC9A9
0xC9A9
0x980C
0x980C
0x980C
0x980C
0x651A
0x651A
0x651A
0x651A
0x5FD1
0x5FD1
0x5FD1
0x5FD1
PN23
0xFF5C
0xFF5C
0xFF5C
0xFF5C
0x0029
0x0029
0x0029
0x0029
0xB80A
0xB80A
0xB80A
0xB80A
0x3D72
0x3D72
0x3D72
0x3D72
0x9B26
0x9B26
0x9B26
0x9B26
User Repeat
UP1[15:0]
UP1[15:0]
UP1[15:0]
UP1[15:0]
UP2[15:0]
UP2[15:0]
UP2[15:0]
UP2[15:0]
UP3[15:0]
UP3[15:0]
UP3[15:0]
UP3[15:0]
UP4[15:0]
UP4[15:0]
UP4[15:0]
UP4[15:0]
UP1[15:0]
UP1[15:0]
UP1[15:0]
UP1[15:0]
User Single
UP1[15:0]
UP1[15:0]
UP1[15:0]
UP1[15:0]
UP2[15:0]
UP2[15:0]
UP2[15:0]
UP2[15:0]
UP3[15:0]
UP3[15:0]
UP3[15:0]
UP3[15:0]
UP4[15:0]
UP4[15:0]
UP4[15:0]
UP4[15:0]
0x0000
0x0000
0x0000
0x0000
AD9234
Data Sheet
Table 18. Physical Layer 10-Bit Input (Register 0x573[5:4] = 'b01)
10-Bit Symbol
Number
0
1
2
3
4
5
6
7
8
9
10
11
Alternating
Checkerboard
0x155
0x2AA
0x155
0x2AA
0x155
0x2AA
0x155
0x2AA
0x155
0x2AA
0x155
0x2AA
1/0 Word
Toggle
0x000
0x3FF
0x000
0x3FF
0x000
0x3FF
0x000
0x3FF
0x000
0x3FF
0x000
0x3FF
Ramp
(X) % 210
(X + 1)% 210
(X + 2)% 210
(X + 3)% 210
(X + 4)% 210
(X + 5)% 210
(X + 6)% 210
(X + 7)% 210
(X + 8)% 210
(X + 9)% 210
(X + 10)% 210
(X + 11)% 210
PN9
0x125
0x2FC
0x26A
0x198
0x031
0x251
0x297
0x3D1
0x18E
0x2CB
0x0F1
0x3DD
PN23
0x3FD
0x1C0
0x00A
0x1B8
0x028
0x3D7
0x0A6
0x326
0x10F
0x3FD
0x31E
0x008
PN9
0x49
0x6F
0xC9
0xA9
0x98
0x0C
0x65
0x1A
0x5F
0xD1
0x63
0xAC
PN23
0xFF
0x5C
0x00
0x29
0xB8
0x0A
0x3D
0x72
0x9B
0x26
0x43
0xFF
User Repeat
UP1[15:6]
UP2[15:6]
UP3[15:6]
UP4[15:6]
UP1[15:6]
UP2[15:6]
UP3[15:6]
UP4[15:6]
UP1[15:6]
UP2[15:6]
UP3[15:6]
UP4[15:6]
User Single
UP1[15:6]
UP2[15:6]
UP3[15:6]
UP4[15:6]
0x000
0x000
0x000
0x000
0x000
0x000
0x000
0x000
Table 19. Scrambler 8-Bit Input (Register 0x573[5:4] = 'b10)
8-Bit Octet
Number
0
1
2
3
4
5
6
7
8
9
10
11
Alternating
Checkerboard
0x55
0xAA
0x55
0xAA
0x55
0xAA
0x55
0xAA
0x55
0xAA
0x55
0xAA
1/0 Word
Toggle
0x00
0xFF
0x00
0xFF
0x00
0xFF
0x00
0xFF
0x00
0xFF
0x00
0xFF
Ramp
(X) % 28
(X + 1)% 28
(X + 2)% 28
(X + 3)% 28
(X + 4)% 28
(X + 5)% 28
(X + 6)% 28
(X + 7)% 28
(X + 8)% 28
(X + 9)% 28
(X + 10)% 28
(X + 11)% 28
Data Link Layer Test Modes
The data link layer test modes are implemented in the AD9234
as defined by Section 5.3.3.8.2 in the JEDEC JESD204B
Specification. These tests are shown in Register 0x574 Bits[2:0].
User Repeat
UP1[15:9]
UP2[15:9]
UP3[15:9]
UP4[15:9]
UP1[15:9]
UP2[15:9]
UP3[15:9]
UP4[15:9]
UP1[15:9]
UP2[15:9]
UP3[15:9]
UP4[15:9]
User Single
UP1[15:9]
UP2[15:9]
UP3[15:9]
UP4[15:9]
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
Test patterns inserted at this point are useful for verifying the
functionality of the data link layer. When the data link layer test
modes are enabled, disable SYNCINB± by writing 0xC0 to
Register 0x572.
Rev. A | Page 52 of 66
Data Sheet
AD9234
SERIAL PORT INTERFACE
The AD9234 SPI allows the user to configure the converter for
specific functions or operations through a structured register
space provided inside the ADC. The SPI gives the user added
flexibility and customization, depending on the application.
Addresses are accessed via the serial port and can be written to
or read from via the port. Memory is organized into bytes that
can be further divided into fields. These fields are documented
in the Memory Map section. For detailed operational information,
see the Serial Control Interface Standard (Rev. 1.0).
CONFIGURATION USING THE SPI
Three pins define the SPI of this ADC: the SCLK pin, the SDIO
pin, and the CSB pin (see Table 20). The SCLK (serial clock) pin
synchronizes the read and write data presented from/to the
ADC. The SDIO (serial data input/output) pin is a dual-purpose
pin that allows data to be sent and read from the internal ADC
memory map registers. The CSB (chip select bar) pin is an active
low control that enables or disables the read and write cycles.
Table 20. Serial Port Interface Pins
Pin
SCLK
SDIO
CSB
Function
Serial clock. The serial shift clock input, which is used to
synchronize serial interface reads and writes.
Serial data input/output. A dual-purpose pin that
typically serves as an input or an output, depending on
the instruction being sent and the relative position in the
timing frame.
Chip select bar. An active low control that gates the read
and write cycles.
The falling edge of CSB, in conjunction with the rising edge of
SCLK, determines the start of the framing. An example of the
serial timing and its definitions can be found in Figure 3 and
Table 5.
Other modes involving the CSB pin are available. The CSB pin
can be held low indefinitely, which permanently enables the
device; this is called streaming. The CSB pin can stall high
between bytes to allow additional external timing. When CSB
is tied high, SPI functions are placed in a high impedance
mode. This mode turns on any SPI pin secondary functions.
In addition to word length, the instruction phase determines
whether the serial frame is a read or write operation, allowing
the serial port to be used both to program the chip and to read
the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the SDIO pin to
change direction from an input to an output at the appropriate
point in the serial frame.
Data can be sent in MSB first mode or in LSB first mode. MSB
first is the default on power-up and can be changed via the SPI
port configuration register. For more information about this
and other features, see the Serial Control Interface Standard
(Rev. 1.0).
HARDWARE INTERFACE
The pins described in Table 20 comprise the physical interface
between the user programming device and the serial port of
the AD9234. The SCLK pin and the CSB pin function as inputs
when using the SPI. The SDIO pin is bidirectional, functioning
as an input during write phases and as an output during
readback.
The SPI is flexible enough to be controlled by either FPGAs
or microcontrollers. One method for SPI configuration is
described in detail in the AN-812 Application Note,
Microcontroller-Based Serial Port Interface (SPI) Boot Circuit.
Do not activate the SPI port during periods when the full
dynamic performance of the converter is required. Because the
SCLK signal, the CSB signal, and the SDIO signal are typically
asynchronous to the ADC clock, noise from these signals can
degrade converter performance. If the on-board SPI bus is used
for other devices, it may be necessary to provide buffers between
this bus and the AD9234 to prevent these signals from transitioning at the converter inputs during critical sampling periods.
SPI ACCESSIBLE FEATURES
Table 21 provides a brief description of the general features that
are accessible via the SPI. These features are described in detail
in the Serial Control Interface Standard (Rev. 1.0). The AD9234
device specific features are described in the Memory Map section.
All data is composed of 8-bit words. The first bit of each
individual byte of serial data indicates whether a read or write
command is issued. This allows the SDIO pin to change
direction from an input to an output.
Table 21. Features Accessible Using the SPI
Feature Name
Mode
Clock
DDC
Test Input/Output
Output Mode
SERDES Output Setup
Description
Allows the user to set either power-down mode or standby mode.
Allows the user to access the clock divider via the SPI.
Allows the user to set up decimation filters for different applications.
Allows the user to set test modes to have known data on output bits.
Allows the user to set up outputs.
Allows the user to vary SERDES settings such as swing and emphasis.
Rev. A | Page 53 of 66
AD9234
Data Sheet
MEMORY MAP
READING THE MEMORY MAP REGISTER TABLE
Logic Levels
Each row in the memory map register table has eight bit
locations. The memory map is divided into four sections: the
Analog Devices SPI registers (Register 0x000 to Register 0x00D),
the ADC function registers (Register 0x015 to Register 0x27A),
The DDC function registers (Register 0x300 to Register 0x347),
and the digital outputs and test modes registers (Register 0x550
to Register 0x5C5).
An explanation of logic level terminology follows:
Table 22 (see the Memory Map section) documents the default
hexadecimal value for each hexadecimal address shown. The
column with the heading Bit 7 (MSB) is the start of the default
hexadecimal value given. For example, Address 0x561, the
output mode register, has a hexadecimal default value of 0x01.
This means that Bit 0 = 1, and the remaining bits are 0s. This
setting is the default output format value, which is twos complement. For more information on this function and others, see the
Table 22.
Open and Reserved Locations
All address and bit locations that are not included in Table 22
are not currently supported for this device. Write unused bits of
a valid address location with 0s unless the default value is set
otherwise. Writing to these locations is required only when part
of an address location is unassigned (for example, Address 0x561).
If the entire address location is open (for example, Address 0x013),
do not write to this address location.
Default Values
After the AD9234 is reset, critical registers are loaded with
default values. The default values for the registers are given in
Table 22.
•
•
•
“Bit is set” is synonymous with “bit is set to Logic 1” or
“writing Logic 1 for the bit.”
“Clear a bit” is synonymous with “bit is set to Logic 0” or
“writing Logic 0 for the bit.”
X denotes a don’t care bit.
Channel-Specific Registers
Some channel setup functions, such as the input termination
(Register 0x016), can be programmed to a different value for
each channel. In these cases, channel address locations are
internally duplicated for each channel. These registers and bits
are designated in Table 22 as local. These local registers and
bits can be accessed by setting the appropriate Channel A or
Channel B bits in Register 0x008. If both bits are set, the
subsequent write affects the registers of both channels. In a read
cycle, set only Channel A or Channel B to read one of the two
registers. If both bits are set during an SPI read cycle, the device
returns the value for Channel A. Registers and bits designated
as global in Table 22 affect the entire device and the channel
features for which independent settings are not allowed
between channels. The settings in Register 0x005 do not affect
the global registers and bits.
SPI Soft Reset
After issuing a soft reset by programming 0x81 to
Register 0x000, the AD9234 requires 5 ms to recover. When
programming the AD9234 for application setup, ensure that an
adequate delay is programmed into the firmware after asserting
the soft reset and before starting the device setup.
Rev. A | Page 54 of 66
Data Sheet
AD9234
MEMORY MAP REGISTER TABLE
All address locations that are not included in Table 22 are not currently supported for this device and must not be written.
Table 22. Memory Map Registers
Reg
Addr
Register
Bit 7
(Hex)
Name
(MSB)
Analog Devices SPI Registers
INTERFACE_
Soft reset
0x000
CONFIG_A
(self
clearing)
INTERFACE_
Single
0x001
CONFIG_B
instruction
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0 (LSB)
Default
Notes
LSB first
0 = MSB
1 = LSB
0
Address
ascension
0
0
0
0
0
0x03
0xCE
Read only
Read only
0x002
DEVICE_
CONFIG (local)
0
0
0
0
0
0x003
0x004
CHIP_TYPE
CHIP_ID (low
byte)
CHIP_ID (high
byte)
CHIP_GRADE
0
1
0
1
0
0
0
0
1
Soft reset
LSB first
(self
0 = MSB
clearing)
1 = LSB
Datapath
0
0
soft reset
(self
clearing)
00 = normal operation
0
10 = standby
11 = power-down
011 = high speed ADC
1
1
0
0
0
0
0
0
0
0
0
0x00
Read only
X
X
X
X
Read only
Read only
Read only
0x005
0x006
0x008
0x00A
0x00B
0x00C
Device index
Scratch pad
SPI revision
Vendor ID (low
byte)
0x00D Vendor ID
(high byte)
ADC Function Registers
Analog Input
0x015
(local)
0x016
Input
termination
(local)
0x018
Input buffer
current control
(local)
0x024
V_1P0 control
1010 = 1000 MSPS
0101 = 500 MSPS
Address
ascension
0x00
0x00
0x00
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
Channel B
0
0
1
Channel A
0
1
0
0xAX for
AD92341000
0x5X for
AD9234500
0x03
0x00
0x01
0x56
0
0
0
0
0
1
0
0
0x04
0
0
0
0
0
0
0
Input
disable
0 = normal
operation
1 = input
disabled
0x00
0011 = AD9234-1000
0001 = AD9234-500
Analog input differential termination
0000 = 400 Ω
0001 = 200 Ω
0010 = 100 Ω
0110 = 50 Ω
0
0000 = 1.0× buffer current
0001 = 1.5× buffer current
0010 = 2.0× buffer current
0011 = 2.5× buffer current
0100 = 3.0× buffer current
0101 = 3.5× buffer current
…
1111 = 8.5× buffer current
0
0
0
0
0
0
0
0
0
0
1.0 V reference select
0 = internal
1 = external
Rev. A | Page 55 of 66
0x03 for
AD92341000;
0x01 for
AD9234500
0x30 for
AD92341000;
0x20 for
AD9234500
0x00
AD9234
Reg
Addr
(Hex)
0x028
Data Sheet
Register
Name
Temperature
diode (local)
Bit 7
(MSB)
0
0x03F
PDWN/
STBY pin
control (local)
0x040
Chip pin
control
0x10B
Bit 5
0
Bit 4
0
Bit 3
0
Bit 2
0
Bit 1
0
0 = PDWN/ 0
STBY
enabled
1=
disabled
PDWN/STBY function
00 = power down
01 = standby
10 = disabled
0
0
0
0
0
Clock divider
0
0
0
0
0x10C
Clock divider
phase (local)
0
0
0
0
0x10D
Clock divider
and SYSREF
control
Clock
0
divider
auto phase
adjust
0=
disabled
1=
enabled
0
0
0x117
Clock delay
control
0
0
0
0x118
Clock fine
delay
(local)
0x11C
Clock status
0
Bit 6
0
0
Bit 0 (LSB)
Diode
selection
0 = no diode
selected
1=
temperature
diode
selected
0
Fast Detect B (FD_B)
000 = Fast Detect B output
001 = JESD204B LMFC output
010 = JESD204B internal SYNC~
output
111 = disabled
Fast Detect A (FD_A)
000 = Fast Detect A output
001 = JESD204B LMFC output
010 = JESD204B internal SYNC~
output
011 = temperature diode
111 = disabled
000 = divide by 1
0
001 = divide by 2
011 = divide by 4
111 = divide by 8
Independently controls Channel A and Channel B
clock divider phase offset
0000 = 0 input clock cycles delayed
0001 = ½ input clock cycles delayed
0010 = 1 input clock cycles delayed
0011 = 1½ input clock cycles delayed
0100 = 2 input clock cycles delayed
0101 = 2½ input clock cycles delayed
…
1111 = 7½ input clock cycles delayed
Clock divider negative
Clock divider positive
skew window
skew window
00 = no negative skew
00 = no positive skew
01 = 1 device clock of
01 = 1 device clock of
negative skew
positive skew
10 = 2 device clocks of
10 = 2 device clocks of
negative skew
positive skew
11 = 3 device clocks of
11 = 3 device clocks of
negative skew
positive skew
Clock fine
0
0
0
delay adjust
enable
0 = disabled
1 = enabled
Clock fine delay adjust[7:0],
twos complement coded control to adjust the fine sample clock skew in ~1.7 ps steps
≤ −88 = −151.7 ps skew
−87 = −150 ps skew
…
0 = 0 ps skew
…
≥ +87 = +150 ps skew
0 = no input
0
0
0
0
0
0
clock
detected
1 = input
clock detected
Rev. A | Page 56 of 66
Default
0x00
Notes
Used in
conjunction with
Reg. 0x040
0x00
Used in
conjunction with
Reg. 0x040
0x3F
0x00
0x00
0x00
Clock
divider
must be
>1
0x00
Enabling
the clock
fine delay
adjust
causes a
datapath
reset
Used in
conjunction
with Reg.
0x0117
0x00
Read
only
Data Sheet
Reg
Addr
(Hex)
0x120
AD9234
Register
Name
SYSREF±
Control 1
Bit 7
(MSB)
0
0x121
SYSREF±
Control 2
0
0x123
SYSREF±
timestamp
delay control
0x128
SYSREF±
Status 1
SYSREF± and
clock divider
status
0x129
0x12A
0x1FF
SYSREF±
counter
Chip sync
mode
0
0
Bit 6
SYSREF±
flag reset
0=
normal
operation
1 = flags
held in
reset
0
0
Chip
application
mode
0
0
0x201
Chip
decimation
ratio
Customer
offset
Fast detect
(FD) control
(local)
0
0
0x245
0x247
0x248
FD upper
threshold LSB
(local)
FD upper
threshold MSB
(local)
0
0
Bit 4
SYSREF±
transition
select
0 = low to
high
1 = high to
low
Bit 3
Bit 2
Bit 1
SYSREF± mode select
CLK± edge
00 = disabled
select
01 = continuous
0 = rising
10 = N shot
1 = falling
Bit 0 (LSB)
0
SYSREF± N-shot ignore counter select
0000 = next SYSREF± Only
0001 = ignore the first SYSREF± transitions
0010 = ignore the first two SYSREF± transitions
…
1111 = ignore the first 16 SYSREF± transitions
SYSREF± timestamp delay, Bits[6:0]
0
0x00 = no delay
0x01 = 1 clock delay
…
0x7F = 127 clocks delay
SYSREF± hold status, Register 0x128[7:4],
SYSREF± setup status, Register 0x128[3:0],
refer to Table 14
refer to Table 14
Clock divider phase when SYSREF± was captured
0
0
0
0000 = in-phase
0001 = SYSREF± is ½ cycle delayed from clock
0010 = SYSREF± is 1 cycle delayed from clock
0011 = 1½ input clock cycles delayed
0100 = 2 input clock cycles delayed
0101 = 2½ input clock cycles delayed
…
1111 = 7½ input clock cycles delayed
SYSREF± counter, Bits[7:0] increments when a SYSREF± signal is captured
0x200
0x228
Bit 5
0
0
0
0
0
Chip Q
ignore
0=
normal
(I/Q)
1=
ignore
(I– only)
0
0
0
0
0
0
0
0
Synchronization mode
00 = normal
01 = timestamp
Chip operating mode
00 = full bandwidth
mode
01 = DDC 0 on
10 = DDC 0 and DDC 1
Chip decimation ratio select
000 = full sample rate (decimate = 1)
001 = decimate by 2
Offset adjust in LSBs from +127 to −128 (twos complement format)
0
0
0
0
Force
0
value of
FD_A/
FD_B pins
if force
pins is
true, this
value is
output
on FD
pins
Fast detect upper threshold, Bits[7:0]
0
Force
FD_A/ FD_B
pins;
0 = normal
function;
1 = force to
value
Fast detect upper threshold, Bits[12:8]
Rev. A | Page 57 of 66
Enable fast
detect
output
Default
0x00
Notes
0x00
Mode
select,
Reg. 0x120,
Bits[2:1],
must be
N shot
Ignored
when
Reg.
0x01FF
= 0x00
0x00
Read
only
Read
only
Read
only
0x00
0x00
0x00
0x00
0x00
0x00
0x00
AD9234
Reg
Addr
(Hex)
0x249
Data Sheet
Register
Name
FD lower
threshold LSB
(local)
FD lower
threshold MSB
(local)
FD dwell time
LSB (local)
FD dwell time
MSB (local)
Signal ,onitor
synchronizatio
n control
Bit 7
(MSB)
Bit 6
Bit 5
0
0
0
0
0
0
0
0
0
0x270
Signal monitor
control (local)
0
0
0
0
0
0
0x271
Signal Monitor
Period
Register 0
(local)
Signal monitor period, Bits[7:0]
0x80
0x272
Signal Monitor
Period
Register 1
(local)
Signal monitor period, Bits[15:8]
0x00
0x273
Signal Monitor
Period
Register 2
(local)
Signal monitor period, Bits[23:16]
0x00
0x274
Signal monitor
result control
(local)
0x01
0x275
Signal Monitor
Result
Register 0
(local)
Signal Monitor
Result
Register 1
(local)
Signal Monitor
Result
Register 1
(local)
Signal monitor
period counter
result (local)
Result
Result
0
0
0
selection
update
0 = reserved
1 = update
1 = peak
results (self
detector
clear)
Signal monitor result, Bits[7:0]
When Register 0x0274[0] = 1, result bits [19:7] = peak detector absolute value [12:0]; result bits [6:0] = 0
Signal monitor result, Bits[15:8]
Read
only
0
Read
only
0x24A
0x24B
0x24C
0x26F
0x276
0x277
0x278
0x279
0x27A
Signal monitor
SPORT over
JESD204B
control (local)
SPORT over
JESD204B
input selection
(local)
0
0
0
0
Bit 4
Bit 3
Bit 2
Fast detect lower threshold, Bits[7:0]
Bit 1
Bit 0 (LSB)
Fast detect lower threshold, Bits[12:8]
Fast detect dwell time, Bits[7:0]
0x00
Fast detect dwell time, Bits[15:8]
0x00
Synchronization mode
00 = disabled
01 = continuous
11 = one shot
Peak
0
detector
0=
disabled
1=
enabled
Signal monitor result, Bits[19:16]
Period count result, Bits[7:0]
0
0
0
0
0
0
0
0
0
0
0
0
Rev. A | Page 58 of 66
0x00
00 = reserved
11 = enable
0
Refer to
the Signal
Monitor
section
0x00
Read
only
Read
only
Peak
detector
0=
disabled
1=
enabled
Notes
0x00
0
0
Default
0x00
0x00
0x00
In
decimated
output
clock
cycles
In
decimated
output
clock
cycles
In
decimated
output
clock
cycles
Updated
based on
Reg.
0x274[4]
Updated
based on
Reg.
0x274[4]
Updated
based on
Reg.
0x274[4]
Updated
based on
Reg.
0x274[4]
Data Sheet
AD9234
Reg
Addr
Register
Bit 7
(Hex)
Name
(MSB)
Bit 6
Bit 5
Bit 4
Bit 3
DDC Function Registers (See the Digital Downconverter (DDC) Section)
DDC synch
DDC NCO
0x300
0
0
0
0
control
soft reset
0 = normal
operation
1 = reset
IF (intermediate
Gain
Complex
0x310
DDC 0 control Mixer
frequency) mode
select
to real
select
00 = variable IF mode enable
0 = 0 dB
0 = real
(mixers and NCO
gain
0=
mixer
enabled)
1 = 6 dB
disabled
1=
01 = 0 Hz IF mode
gain
1=
complex
(mixer bypassed, NCO enabled
mixer
disabled)
10 = fADC/4 Hz IF mode
(fADC/4 downmixing
mode)
11 = test mode (mixer
inputs forced to +FS,
NCO enabled)
DDC 0 input
0x311
0
0
0
0
0
selection
0x314
0x315
0x320
0x321
0x327
DDC 0
frequency LSB
DDC0
frequency MSB
DDC 0 phase
LSB
DDC 0 phase
MSB
DDC 0 output
test mode
selection
X
X
X
X
0
0
0x330
DDC 1 control
Mixer
select
0 = real
mixer
1=
complex
mixer
Gain
select
0 = 0 dB
gain
1 = 6 dB
gain
0x331
DDC 1 input
selection
0
0
0x334
DDC 1
frequency LSB
DDC 1
frequency MSB
DDC 1 phase
LSB
DDC 1 phase
MSB
0x335
0x340
0x341
X
X
X
X
Bit 2
0
0
Bit 1
Bit 0 (LSB)
Synchronization mode
(triggered by SYSREF±)
00 = disabled
01 = continuous
11 = 1-shot
Decimation rate select
(complex to real
disabled)
11 = decimate by 2
(complex to real
enabled)
11 = decimate by 1
I input
Q input
0
select
select
0 = Ch A
0 = Ch A
1 = Ch B
1 = Ch B
DDC 0 NCO frequency value, Bits[7:0],
twos complement
DDC 0 NCO frequency value, Bits[11:8],
X
X
twos complement
DDC 0 NCO phase value, Bits[7:0],
twos complement
DDC 0 NCO phase value, Bits[11:8],
X
X
twos complement
Q output
I output test
0
0
0
0
test mode
mode
enable
enable
0=
0 = disabled
disabled
1 = enabled
1=
from Ch A
enabled
from Ch B
IF (intermediate
Decimation rate select
Complex
0
frequency) mode
(complex to real
to real
00 = variable IF mode enable
disabled)
(mixers and NCO
11 = decimate by 2
0=
enabled)
(complex to real
disabled
01 = 0 Hz IF mode
enabled)
1=
(mixer bypassed, NCO enabled
11 = decimate by 1
disabled)
10 = fADC/4 Hz IF mode
(fADC/4 downmixing
mode)
11 = test mode (mixer
inputs forced to +FS,
NCO enabled)
Q input
I input
0
0
0
0
select
select
0 = Ch A
0 = Ch A
1 = Ch B
1 = Ch B
DDC 1 NCO frequency value, Bits[7:0],
twos complement
DDC 1 NCO frequency value, Bits[11:8],
X
X
twos complement
DDC 1 NCO phase value, Bits[7:0],
twos complement
DDC 1 NCO phase value, Bits[11:8],
X
X
twos complement
Rev. A | Page 59 of 66
Default
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
0x00
Notes
AD9234
Reg
Addr
(Hex)
0x347
Register
Name
DDC 1 output
test mode
selection
Data Sheet
Bit 7
(MSB)
0
Digital Outputs and Test Modes
User
ADC test
0x550
pattern
modes
selection
(local)
0 = continuous
repeat
1 = single
pattern
Bit 6
0
Bit 5
0
Bit 4
0
0
Reset PN
long gen
0 = long
PN
enable
1 = long
PN reset
Reset PN
short gen
0 = short
PN enable
1 = short
PN reset
Bit 3
0
Bit 2
Q output
test mode
enable
0=
disabled
1=
enabled
from
Ch B
Bit 1
0
Bit 0 (LSB)
I output test
mode
enable
0 = disabled
1 = enabled
from Ch A
Test mode selection
0000 = off, normal operation
0001 = midscale short
0010 = positive full scale
0011 = negative full scale
0100 = alternating checker board
0101 = PN sequence, long
0110 = PN sequence, short
0111 = 1/0 word toggle
1000 = the user pattern test mode (used with
Register 0x550, Bit 7 and user pattern (1, 2, 3, 4)
registers), 1111 = ramp output
0
0
0
Default
0x00
0x00
0x551
User Pattern 1
LSB
0
0
0
0
0
0x552
User Pattern 1
MSB
0
0
0
0
0
0
0
0
0x00
0x553
User Pattern 2
LSB
0
0
0
0
0
0
0
0
0x00
0x554
User Pattern 2
MSB
0
0
0
0
0
0
0
0
0x00
0x555
User Pattern 3
LSB
0
0
0
0
0
0
0
0
0x00
0x556
User Pattern 3
MSB
0
0
0
0
0
0
0
0
0x00
0x557
User Pattern 4
LSB
0
0
0
0
0
0
0
0
0x00
0x558
User Pattern 4
MSB
0
0
0
0
0
0
0
0
0x00
0x559
Output Mode
Control 1
0
Converter control Bit 1 selection
000 = tie low (1’b0)
001 = overrange bit
010 = signal monitor bit
011 = fast detect (FD) bit
101 = SYSREF±
Only used when CS
(Register 0x58F) = 2 or 3
0
Rev. A | Page 60 of 66
Converter control Bit 0 selection
000 = tie low (1’b0)
001 = overrange bit
010 = signal monitor bit
011 = fast detect (FD) bit
101 = SYSREF±
Only used when CS
(Register 0x58F) = 3
Notes
0x00
0x00
Used with
Reg. 0x550
and
Reg. 0x573
Used with
Reg. 0x550
and
Reg. 0x573
Used with
Reg. 0x550
and
Reg. 0x573
Used with
Reg. 0x550
and
Reg. 0x573
Used with
Reg. 0x550
and
Reg. 0x573
Used with
Reg. 0x550
and
Reg. 0x573
Used with
Reg. 0x550
and
Reg. 0x573
Used with
Reg. 0x550
and
Reg. 0x573
Data Sheet
Reg
Addr
(Hex)
0x55A
AD9234
Register
Name
Output Mode
Control 2
Bit 7
(MSB)
0
Bit 6
0
Bit 5
0
Bit 4
0
Bit 3
0
0x561
Output mode
0
0
0
0
0
0x562
Output
Virtual
overrange (OR) Converter 7
clear
OR
0 = OR bit
enabled
1 = OR bit
cleared
Virtual
Converter
6 OR
0 = OR bit
enabled
1 = OR bit
cleared
Virtual Converter 4 OR
0 = OR bit
enabled
1 = OR bit
cleared
Virtual
Con-verter
3 OR
0 = OR bit
enabled
1 = OR bit
cleared
0x563
Output OR
status
Virtual Converter 7 OR
0 = no OR
1 = OR
occured
Virtual
Converter 4
OR
0 = no OR
1 = OR
occured
0x564
Output
channel select
0
Virtual
Converter 6
OR
0 = no
OR
1 = OR
occured
0
Virtual
Converter 5
OR
0 = OR
bit
enabled
1 = OR
bit
cleared
Virtual
Converter 5
OR
0 = no OR
1 = OR
occured
0
0
0x56E
JESD204B lane
rate control
0
0
0
0x570
JESD204B
quick configuration
0x571
JESD204B
Link Mode
Control 1
Standby
mode
0 = all
converter
outputs 0
1 = CGS
(/K28.5/)
Tail bit (t)
PN
0=
disable
1=
enable
T = N΄ −
N − CS
Bit 2
Bit 1
Bit 0 (LSB)
Converter control Bit 2 selection
000 = tie low (1’b0)
001 = overrange bit
010 = signal monitor bit
011 = fast detect (FD) bit
101 = SYSREF
Used when CS (Register 0x58F) = 1, 2,
or 3
Data format select
Sample
00 = offset binary
invert
01 = twos complement
0 = normal
1 = sample
invert
Virtual Con- Virtual
Virtual Converter 2 OR Converter 0 OR
0 = OR bit
verter 1 OR 0 = OR bit
enabled
0 = OR bit
enabled
1 = OR bit
enabled
1 = OR bit
cleared
1 = OR bit
cleared
cleared
Default
0x01
Virtual
Converter 3
OR
0 = no OR
1 = OR
occured
Virtual Converter 2 OR
0 = no OR
1 = OR
occured
Virtual
Converter 1 OR
0 = no OR
1 = OR
occured
Virtual Converter 0 OR
0 = no OR
1 = OR
occured
0x00
0
0
0
Converter
channel
swap
0 = normal
channel
ordering
1 = channel
swap
enabled
0
0x00
0 = serial
0
0
lane rate ≥
6.25 Gbps
and
≤12.5 Gbps
1 = serial
lane rate
must be ≥
3.125 Gbps
and ≤
6.25 Gbps
JESD204B quick configuration
L = number of lanes = 2Register 0x570, Bits[7:6]
M = number of converters = 2Register 0x570, Bits[5:3]
F = number of octets/frame = 2 Register 0x570, Bits[2:0]
ILAS sequence mode
Lane
Long
transport synchron- 00 = ILAS disabled
01 = ILAS enabled
layer test ization
0 = disable 11 = ILAS always on test
0=
mode
FACI uses
disable
/K28.7/
1=
1 = enable
enable
FACI uses
/K28.3/
and
/K28.7/
Rev. A | Page 61 of 66
0
0x01
0x00
Link control
0 = active
1 = power
down
Read only
0x00 for
AD92341000;
0x10 for
AD9234500
0x88
FACI
0=
enabled
1=
disabled
Notes
0x14
Refer to
Table 12
and
Table 13
AD9234
Reg
Addr
(Hex)
0x572
Register
Name
JESD204B
Link Mode
Control 2
0x573
JESD204B
Link Mode
Control 3
0x574
JESD204B
Link Mode
Control 4
0x578
JESD204B
LMFC offset
JESD204B DID
config
JESD204B BID
config
JESD204B LID
Config 1
JESD204B LID
Config 2
JESD204B LID
Config 3
JESD204B LID
Config 4
JESD204B
parameters
SCR/L
0x580
0x581
0x583
0x584
0x585
0x586
0x58B
0x58C
JESD204B F
config
0x58D
JESD204B K
config
JESD204B M
config
0x58E
Data Sheet
Bit 7
(MSB)
Bit 6
SYNCINB± pin control
00 = normal
10 = ignore SYNCINB±
(force CGS)
11 = ignore SYNCINB±
(force ILAS/user data)
Bit 5
Bit 4
SYNCINB±
SYNCINB± pin pin type
0=
invert
0 = active differential
1 = cmos
low
1 = active
high
Test injection point
CHKSUM mode
00 = N΄ sample input
00 = sum of all 8-bit
01 = 10-bit data at
link config registers
8B/10B output (for
01 = sum of individual
PHY testing)
link config fields
10 = 8-bit data at
10 = checksum set to
scrambler input
zero
ILAS delay
0000 = transmit ILAS on first LMFC after
SYNCINB± deasserted
0001 = transmit ILAS on second LMFC after
SYNCINB± deasserted
…
1111 = transmit ILAS on 16th LMFC after
SYNCINB± deasserted
0
0
0
Bit 3
0
0
Bit 2
8B/10B
bypass
0 = normal
1 = bypass
Bit 1
8B/10B bit
invert
0 = normal
1 = invert
the a…j
symbols
Bit 0 (LSB)
0
JESD204B test mode patterns
0000 = normal operation (test mode disabled)
0001 = alternating checker board
0010 = 1/0 word toggle
0011 = 31-bit PN sequence—X31 + X28 + 1
0100 = 23-bit PN sequence—X23 + X18 + 1
0101 = 15-bit PN sequence—X15 + X14 + 1
0110 = 9-bit PN sequence—X9 + X5 + 1
0111 = 7-bit PN sequence—X7 + X6 + 1
1000 = ramp output
1110 = continuous/repeat user test
1111 = single user test
Link layer test mode
000 = normal operation (link layer test
mode disabled)
001 = continuous sequence of /D21.5/
characters
100 = modified RPAT test sequence
101 = JSPAT test sequence
110 = JTSPAT test sequence
LMFC phase offset value, Bits[4:0]
JESD204B Tx DID value, Bits[7:0]
0
Default
0x00
0x00
0x00
0x00
0x00
0
0
0
0
0
0
Lane 0 LID value, Bits[4:0]
0x00
0
0
0
Lane 1 LID value, Bits[4:0]
0x01
0
0
0
Lane 2 LID value, Bits[4:0]
0x01
0
0
0
Lane 3 LID value, Bits[4:0]
0x03
JESD204B
scrambling
(SCR)
0=
disabled
1=
enabled
0
0
0
JESD204B Tx BID value, Bits[7:0]
0
0
JESD204B lanes (L)
00 = 1 lane
01 = 2 lanes
11 = 4 lanes
Read only, see
Register 0x570
Number of octets per frame, F = Register 0x58C, Bits[7:0] + 1
0
0
Number of frames per multiframe, K = Register 0x58D, Bits[4:0] + 1
Only values where (F × K) mod 4 = 0 are supported
Number of converters per link, Bits[7:0]
0x00 = link connected to one virtual converter (M = 1)
0x01 = link connected to two virtual converters (M = 2)
0x03 = link connected to four virtual converters (M = 4)
0x07 = link connected to eight virtual converters (M = 8)
0
Rev. A | Page 62 of 66
Notes
0x00
0x8X
0x88
0x1F
Read only,
see
Reg. 0x570
See
Reg. 0x570
Read only
Data Sheet
Reg
Addr
(Hex)
0x58F
Register
Name
JESD204B
CS/N config
0x0590
JESD204B N’
config
0x591
JESD204B S
config
JESD204B
HD and CF
configuration
0x592
0x5A0
0x5A1
0x5A2
0x5A3
JESD204B
CHKSUM 0
JESD204B
CHKSUM 1
JESD204B
CHKSUM 2
JESD204B
CHKSUM 3
JESD204B lane
power-down
AD9234
Bit 7
(MSB)
Bit 6
Bit 5
Number of control
0
bits (CS) per sample
00 = no control bits
(CS = 0)
01 = 1 control bit (CS
= 1); Control Bit 2 only
10 = 2 control bits (CS
= 2); Control Bit 2 and
Control Bit 1 only
11 = 3 control bits (CS
= 3); all control bits (2,
1, 0)
Subclass support (Subclass
version)
000 = Subclass 0 (no deterministic
latency)
001 = Subclass 1
0
0
1
HD value
0=
disabled
1=
enabled
0
Bit 4
Bit 3
Samples per converter frame cycle (S)
S value = Register 0x591[4:0] +1
Control words per frame clock cycle per link (CF)
CF value = Register 0x592, Bits[4:0]
0
Notes
0x2F
Read only
Read only
CHKSUM value for SERDOUT0±, Bits[7:0]
0x81
Read only
CHKSUM value for SERDOUT1±, Bits[7:0]
0x82
Read only
CHKSUM value for SERDOUT2±, Bits[7:0]
0x82
Read only
CHKSUM value for SERDOUT3±, Bits[7:0]
0x84
Read only
1
X
SERDOUT2±
0 = on
1 = off
X
JESD204B lane
SERDOUT0±
assign
X
0x5B3
JESD204B lane
SERDOUT1±
assign
X
X
X
X
0
0x5B5
JESD204B lane
SERDOUT2±
assign
X
X
X
X
0
0x5B6
JESD204B lane
SERDOUT3±
assign
X
X
X
X
0
1
Default
0x0F
0x80
0x5B2
1
Bit 0 (LSB)
ADC number of bits per sample (N’)
0x7 = 8 bits
0xF = 16 bits
SERDOUT3±
0 = on
1 = off
X
0x5B0
Bit 2
Bit 1
ADC converter resolution (N)
0x06 = 7-bit resolution
0x07 = 8-bit resolution
0x08 = 9-bit resolution
0x09 = 10-bit resolution
0x0A = 11-bit resolution
0x0B = 12-bit resolution
0x0C = 13-bit resolution
0x0D = 14-bit resolution
0x0E = 15-bit resolution
0x0F = 16-bit resolution
0
Rev. A | Page 63 of 66
SERDSERDOUT0±
1
OUT1±
0 = on
0 = on
1 = off
1 = off
SERDOUT0± lane assignment
000 = Logical Lane 0
001 = Logical Lane 1
010 = Logical Lane 2
011 = Logical Lane 3
SERDOUT1± lane assignment
000 = Logical Lane 0
001 = Logical Lane 1
010 = Logical Lane 2
011 = Logical Lane 3
SERDOUT2± lane assignment
000 = Logical Lane 0
001 = Logical Lane 1
010 = Logical Lane 2
011 = Logical Lane 3
SERDOUT3± lane assignment
000 = Logical Lane 0
001 = Logical Lane 1
010 = Logical Lane 2
011 = Logical Lane 3
0xAA
0x00
0x11
0x22
0x33
AD9234
Reg
Addr
(Hex)
0x5BF
Data Sheet
Register
Name
JESD serializer
drive adjust
Bit 7
(MSB)
0
0x5C1
De-emphasis
select
0
0x5C2
De-emphasis
setting for
SERDOUT0±
0x5C3
Bit 6
0
Bit 5
0
Bit 4
0
Bit 3
0
SERDOUT2±
0 = disable
1 = enable
0
0
SERDOUT3±
0=
disable
1=
enable
0
0
0
De-emphasis
setting for
SERDOUT1±
0
0
0
0
0x5C4
De-emphasis
setting for
SERDOUT2±
0
0
0
0
0x5C5
De-emphasis
setting for
SERDOUT3±
0
0
0
0
Bit 2
Bit 1
Swing voltage
0000 = 237.5 mV
0001 = 250 mV
0010 = 262.5 mV
0011 = 275 mV
0100 = 287.5 mV
0101 = 300 mV (default)
0110 = 312.5 mV
0111 = 325 mV
1000 = 337.5 mV
1001 = 350 mV
1010 = 362.5 mV
1011 = 375 mV
1100 = 387.5 mV
1101 = 400 mV
1110 = 412.5 mV
1111 = 425 mV
SERD0
OUT1±
0 = disable
1 = enable
Bit 0 (LSB)
Default
0x05
SERDOUT0±
0 = disable
1 = enable
0x00
SERDOUT0± de-emphasis settings:
0000 = 0 dB
0001 = 0.3 dB
0010 = 0.8 dB
0011 = 1.4 dB
0100 = 2.2 dB
0101 = 3.0 dB
0110 = 4.0 dB
0111 = 5.0 dB
SERDOUT1± de-emphasis settings:
0000 = 0 dB
0001 = 0.3 dB
0010 = 0.8 dB
0011 = 1.4 dB
0100 = 2.2 dB
0101 = 3.0 dB
0110 = 4.0 dB
0111 = 5.0 dB
SERDOUT2± de-emphasis settings:
0000 = 0 dB
0001 = 0.3 dB
0010 = 0.8 dB
0011 = 1.4 dB
0100 = 2.2 dB
0101 = 3.0 dB
0110 = 4.0 dB
0111 = 5.0 dB
SERDOUT3± de-emphasis settings:
0000 = 0 dB
0001 = 0.3 dB
0010 = 0.8 dB
0011 = 1.4 dB
0100 = 2.2 dB
0101 = 3.0 dB
0110 = 4.0 dB
0111 = 5.0 dB
Rev. A | Page 64 of 66
0x00
0x00
0x00
0x00
Notes
Data Sheet
AD9234
APPLICATIONS INFORMATION
POWER SUPPLY RECOMMENDATIONS
The AD9234 must be powered by the following seven supplies:
AVDD1 = 1.25 V, AVDD2 = 2.5 V, AVDD3 = 3.3 V, AVDD1_SR =
1.25 V, DVDD = 1.25 V, DRVDD = 1.25 V, and SPIVDD = 1.8 V.
For applications requiring an optimal high power efficiency and
low noise performance, it is recommended that the ADP2164
and ADP2370 switching regulators be used to convert the 3.3 V,
5.0 V, or 12 V input rails to an intermediate rail (1.8 V and
3.8 V). These intermediate rails are then postregulated by very
low noise, low dropout (LDO) regulators (ADP1741, ADM7172,
and ADP125). Figure 106 shows the recommended power
supply scheme for AD9234.
ADP1741
1.8V
To maximize the coverage and adhesion between the ADC and
PCB, partition the continuous copper plane by overlaying a
silkscreen on the PCB into several uniform sections. This
provides several tie points between the ADC and PCB during
the reflow process, whereas using one continuous plane with no
partitions only guarantees one tie point. See Figure 107 for a
PCB layout example. For detailed information on packaging
and the PCB layout of chip scale packages, see the AN-772
Application Note, A Design and Manufacturing Guide for the
Lead Frame Chip Scale Package (LFCSP).
AVDD1
1.25V
AVDD1_SR
1.25V
ADP1741
DVDD
1.25V
DRVDD
1.25V
ADP125
AVDD3
3.3V
3.3V
ADM7172
OR
ADP1741
AVDD2
2.5V
12244-064
3.6V
12244-063
SPIVDD
(1.8V OR 3.3V)
Figure 106. High Efficiency, Low Noise Power Solution for the AD9234
It is not necessary to split all of these power domains in all
cases. The recommended solution shown in Figure 106 provides
the lowest noise, highest efficiency power delivery system for
the AD9234. If only one 1.25 V supply is available, route to
AVDD1 first and then tap it off and isolate it with a ferrite
bead or a filter choke, preceded by decoupling capacitors for
AVDD1_SR, SPIVDD, DVDD, and DRVDD, in that order. The
user can employ several different decoupling capacitors to cover
both high and low frequencies. These must be located close to
the point of entry at the PCB level and close to the devices, with
minimal trace lengths.
Figure 107. Recommended PCB Layout of Exposed Pad for the AD9234
AVDD1_SR (PIN 57) AND AGND (PIN 56 AND PIN 60)
AVDD1_SR (Pin 57) and AGND (Pin 56 and Pin 60) can be
used to provide a separate power supply node to the SYSREF±
circuits of AD9234. If running in Subclass 1, the AD9234 can
support periodic one-shot or gapped signals. To minimize the
coupling of this supply into the AVDD1 supply node, adequate
supply bypassing is needed.
EXPOSED PAD THERMAL HEAT SLUG
RECOMMENDATIONS
It is required that the exposed pad on the underside of the
ADC be connected to ground to achieve the best electrical
and thermal performance of the AD9234. Connect an exposed
continuous copper plane on the PCB to the AD9234 exposed
pad, Pin 0. The copper plane must have several vias to achieve
the lowest possible resistive thermal path for heat dissipation to
flow through the bottom of the PCB. These vias must be solder
filled or plugged. The number of vias and the fill determine the
resultant θJA measured on the board. This is shown in Table 7.
Rev. A | Page 65 of 66
AD9234
Data Sheet
OUTLINE DIMENSIONS
9.10
9.00 SQ
8.90
0.30
0.25
0.18
PIN 1
INDICATOR
49
1
0.50
BSC
EXPOSED
PAD
7.70
7.60 SQ
7.50
33
0.80
0.75
0.70
0.45
0.40
0.35
16
32
17
BOTTOM VIEW
7.50 REF
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
PKG-004396
SEATING
PLANE
0.20 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WMMD
02-12-2014-A
TOP VIEW
PIN 1
INDICATOR
64
48
Figure 108. 64-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-15)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD9234BCPZ-500
AD9234BCPZRL7-500
AD9234BCPZ-1000
AD9234BCPZRL7-1000
AD9234-500EBZ
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
AD9234-1000EBZ
1
Package Description
64-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Evaluation Board for AD9234-500 (Optimized for Full
Analog Input Frequency Range)
Evaluation Board for AD9234-1000 (Optimized for Full
Analog Input Frequency Range)
Z = RoHS Compliant Part.
©2014–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D12244-0-3/15(A)
Rev. A | Page 66 of 66
Package Option
CP-64-15
CP-64-15
CP-64-15
CP-64-15
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