SCLS083D − DECEMBER 1982 − REVISED AUGUST 2003 D Wide Operating Voltage Range of 2 V to 6 V D Outputs Can Drive Up To 10 LSTTL Loads D Low Power Consumption, 20-µA Max ICC SN54HC10 . . . J OR W PACKAGE SN74HC10 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 1B 1A NC VCC 1C SN54HC10 . . . FK PACKAGE (TOP VIEW) VCC 1C 1Y 3C 3B 3A 3Y 2A NC 2B NC 2C 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 1Y NC 3C NC 3B 2Y GND NC 3Y 3A 1A 1B 2A 2B 2C 2Y GND D Typical tpd = 9 ns D ±4-mA Output Drive at 5 V D Low Input Current of 1 µA Max NC − No internal connection description/ordering information The ’HC10 devices contain three independent 3-input NAND gates. They perform the Boolean function Y = A • B • C or Y = A + B + C in positive logic. ORDERING INFORMATION PACKAGE† TA PDIP − N SN74HC10N Tube of 50 SN74HC10D Reel of 2500 SN74HC10DR Reel of 250 SN74HC10DT SOP − NS Reel of 2000 SN74HC10NSR HC10 SSOP − DB Reel of 2000 SN74HC10DBR HC10 Tube of 90 SN74HC10PW Reel of 2000 SN74HC10PWR Reel of 250 SN74HC10PWT CDIP − J Tube of 25 SNJ54HC10J SNJ54HC10J CFP − W Tube of 150 SNJ54HC10W SNJ54HC10W LCCC − FK Tube of 55 SNJ54HC10FK TSSOP − PW −55°C −55 C to 125 125°C C TOP-SIDE MARKING Tube of 25 SOIC − D −40°C −40 C to 85 85°C C ORDERABLE PART NUMBER SN74HC10N HC10 HC10 SNJ54HC10FK † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! " #$%! " &$'(#! )!%* )$#!" # ! "&%##!" &% !+% !%" %," "!$%!" "!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* &)$#!" #&(! ! 0 12 (( &%!%" % !%"!%) $(%"" !+%-"% !%)* (( !+% &)$#!" &)$#! &#%""/ )%" ! %#%""(. #($)% !%"!/ (( &%!%"* POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS083D − DECEMBER 1982 − REVISED AUGUST 2003 FUNCTION TABLE (each gate) INPUTS A B C OUTPUT Y H H H L L X X H X L X H X X L H logic diagram (positive logic) A B C Y absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS083D − DECEMBER 1982 − REVISED AUGUST 2003 recommended operating conditions (see Note 3) SN54HC10 VCC Supply voltage VIH VCC = 2 V VCC = 4.5 V High-level input voltage VCC = 6 V VCC = 2 V VIL VI VO Input voltage NOM MAX 2 5 6 NOM MAX 2 5 6 1.5 3.15 3.15 4.2 4.2 0 VCC = 6 V UNIT V V 0.5 0.5 1.35 1.35 1.8 1.8 VCC VCC VCC = 2 V VCC = 4.5 V Input transition rise/fall time MIN 1.5 0 Output voltage ∆t/∆v MIN VCC = 4.5 V VCC = 6 V Low-level input voltage SN74HC10 0 VCC VCC 0 1000 1000 500 500 400 400 V V V ns TA Operating free-air temperature −55 125 −40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL TEST CONDITIONS Ci SN54HC10 SN74HC10 MIN MIN MAX MAX UNIT 2V 1.9 1.998 1.9 1.9 IOH = −20 µA 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 IOH = −4 mA IOH = −5.2 mA 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 5.34 2V 0.002 0.1 0.1 0.1 IOL = 20 µA 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V ±0.1 ±100 ±1000 ±1000 nA 2 40 20 µA 10 10 10 pF VI = VIH or VIL VI = VIH or VIL VI = VCC or 0 VI = VCC or 0, TA = 25°C MIN TYP MAX 4.5 V IOL = 4 mA IOL = 5.2 mA II ICC VCC IO = 0 6V 2 V to 6 V POST OFFICE BOX 655303 3 • DALLAS, TEXAS 75265 V V 3 SCLS083D − DECEMBER 1982 − REVISED AUGUST 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) TA = 25°C TYP MAX SN54HC10 SN74HC10 MIN MIN PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 35 95 145 120 tpd A, B, or C Y 4.5 V 10 19 29 24 6V 9 16 25 20 tt Y MIN MAX MAX 2V 23 75 110 95 4.5 V 6 15 22 19 6V 5 13 19 16 UNIT ns ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per gate No load TYP UNIT 25 pF PARAMETER MEASUREMENT INFORMATION From Output Under Test Test Point Input VCC 50% 50% 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 50% 10% tPHL 90% 90% tr Input 50% 10% 90% 90% tr tPHL VCC 50% 10% 0 V Out-of-Phase Output 90% tf VOH 50% 10% VOL tf tPLH 50% 10% tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-8403801VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type 84038012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84038012A SNJ54HC 10FK 8403801CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8403801CA SNJ54HC10J 8403801DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8403801DA SNJ54HC10W JM38510/65002B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65002B2A JM38510/65002BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65002BCA M38510/65002B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 65002B2A M38510/65002BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 65002BCA SN54HC10J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54HC10J SN74HC10D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 Addendum-Page 1 5962-8403801VC A SNV54HC10J Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty SN74HC10N ACTIVE PDIP N 14 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 Device Marking (4/5) SN74HC10N SN74HC10N3 OBSOLETE PDIP N 14 TBD Call TI Call TI -40 to 85 SN74HC10NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 85 SN74HC10N SN74HC10NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SN74HC10PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 HC10 SNJ54HC10FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 84038012A SNJ54HC 10FK SNJ54HC10J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 8403801CA SNJ54HC10J SNJ54HC10W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 8403801DA SNJ54HC10W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC10, SN54HC10-SP, SN74HC10 : • Catalog: SN74HC10, SN54HC10 • Automotive: SN74HC10-Q1, SN74HC10-Q1 • Enhanced Product: SN74HC10-EP, SN74HC10-EP • Military: SN54HC10 • Space: SN54HC10-SP Addendum-Page 3 PACKAGE OPTION ADDENDUM www.ti.com 17-Dec-2015 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Enhanced Product - Supports Defense, Aerospace and Medical Applications • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 4 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74HC10DR SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 6.5 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 9.0 2.1 8.0 16.0 Q1 SN74HC10DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC10NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC10PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC10PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 18-Aug-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC10DR SOIC D 14 2500 367.0 367.0 38.0 SN74HC10DT SOIC D 14 250 367.0 367.0 38.0 SN74HC10NSR SO NS 14 2000 367.0 367.0 38.0 SN74HC10PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC10PWT TSSOP PW 14 250 367.0 367.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated