Material Content Data Sheet Sales Product Name TDA5210 Issued MA# MA000223760 Package PG-TSSOP-28-1 Weight* Construction Element Material Group Substances CAS# if applicable chip leadframe inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon nickel iron gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7440-02-0 7439-89-6 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 wire encapsulation leadfinish plating glue *deviation 7. September 2015 Weight [mg] 107.00 mg Average Mass [%] Sum [%] 2.30 Average Mass [ppm] Sum [ppm] 22966 22966 2.457 2.30 14.398 13.46 19.882 18.58 32.04 185822 320383 0.938 0.88 0.88 8768 8768 0.196 0.18 134561 1833 8.301 7.76 56.867 53.15 61.09 531486 610904 1.559 1.46 1.46 14568 14568 1.416 1.32 1.32 13231 13231 0.196 0.18 0.786 0.73 77585 1836 0.91 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7344 9180 1000000