IXYS IXXN110N65B4H1 Xpttm 650v genx4tm Datasheet

XPTTM 650V GenX4TM
w/ Sonic Diode
IXXN110N65B4H1
Extreme Light Punch Through
IGBT for 10-30kHz Switching
VCES =
IC110 =
VCE(sat) 
tfi(typ) =
650V
110A
2.1V
85ns
E
SOT-227B, miniBLOC
E153432
Symbol
Test Conditions
Maximum Ratings
VCES
VCGR
TJ = 25°C to 175°C
TJ = 25°C to 175°C, RGE = 1M
650
650
V
V
VGES
VGEM
Continuous
Transient
±20
±30
V
V
IC25
IC25
IC110
IF110
ICM
TC = 25°C (Chip Capability)
Terminal Current Limit
TC = 110°C
TC = 110°C
TC = 25°C, 1ms
215
200
110
70
730
A
A
A
A
A
SSOA
(RBSOA)
VGE = 15V, TVJ = 150°C, RG = 2
Clamped Inductive Load
ICM = 220
@VCE  VCES
A
tsc
(SCSOA)
VGE = 15V, VCE = 360V, TJ = 150°C
RG = 82, Non Repetitive
10
μs
PC
TC = 25°C
50/60Hz
IISOL 1mA
Md
Mounting Torque
Terminal Connection Torque
E
C
G = Gate, C = Collector, E = Emitter
 either emitter terminal can be used as
Main or Kelvin Emitter
Features


TJ
TJM
Tstg
VISOL
E
G
t = 1min
t = 1s
Weight
750
W
-55 ... +175
175
-55 ... +175
°C
°C
°C
2500
3000
V~
V~
1.5/13
1.3/11.5
Nm/lb.in.
Nm/lb.in.
30
g






International Standard Package
miniBLOC, with Aluminium Nitride
Isolation
2500V~ Isolation Voltage
Anti-Parallel Sonic Diode
Optimized for 10-30kHz Switching
Square RBSOA
Short Circuit Capability
High Current Handling Capability
Advantages


High Power Density
Low Gate Drive Requirement
Applications
Symbol
Test Conditions
(TJ = 25C, Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
BVCES
IC
= 250A, VGE = 0V
650
VGE(th)
IC
= 250A, VCE = VGE
4.0
ICES
VCE = VCES, VGE = 0V
VCE = 0V, VGE = 20V
VCE(sat)
IC
= 110A, VGE = 15V, Note 1
TJ = 150C
© 2013 IXYS CORPORATION, All Rights Reserved

V
6.5
V
50 A
3 mA
TJ = 150C
IGES

100
1.75
2.15
2.10






Power Inverters
UPS
Motor Drives
SMPS
PFC Circuits
Battery Chargers
Welding Machines
Lamp Ballasts
nA
V
V
DS100505B(6/13)
IXXN110N65B4H1
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
Characteristic Values
Min.
Typ.
Max.
gfs
24
IC = 60A, VCE = 10V, Note 1
Cies
Coes
Cres
VCE = 25V, VGE = 0V, f = 1MHz
Qg
Qge
Qgc
IC = 110A, VGE = 15V, VCE = 0.5 • VCES
td(on)
tri
Eon
td(off)
tfi
Eoff
td(on)
tri
Eon
td(off)
tfi
Eoff
Inductive load, TJ = 25°C
IC = 55A, VGE = 15V
VCE = 400V, RG = 2
Note 2
Inductive load, TJ = 150°C
IC = 55A, VGE = 15V
VCE = 400V, RG = 2
Note 2
RthJC
RthCS
SOT-227B miniBLOC (IXXN)
40
S
3650
440
143
pF
pF
pF
183
nC
32
nC
83
nC
38
46
2.20
156
85
1.05
ns
ns
mJ
ns
ns
mJ
1.70
34
46
3.15
160
105
1.40
ns
ns
mJ
ns
ns
mJ
0.05
0.20 °C/W
°C/W
Reverse Sonic Diode (FRD)
Symbol Test Conditions
(TJ = 25°C Unless Otherwise Specified)
VF
IF = 100A, VGE = 0V, Note 1
IRM
IF = 100A, VGE = 0V,
-diF/dt = 1500A/sVR = 300V
trr
Characteristic Values
Min.
Typ.
Max.
TJ = 150C
1.7
1.8
TJ = 150C
95
A
100
ns
V
V
0.42 C/W
RthJC
Notes:
2.3
1. Pulse test, t  300μs, duty cycle, d  2%.
2. Switching times & energy losses may increase for higher VCE(clamp), TJ or RG.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
by one or more of the following U.S. patents: 4,860,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,727,585
7,005,734 B2
6,710,405 B2 6,759,692
7,063,975 B2
6,710,463
6,771,478 B2 7,071,537
7,157,338B2
IXXN110N65B4H1
Fig. 1. Output Characteristics @ T J = 25ºC
Fig. 2. Extended Output Characteristics @ T J = 25ºC
VGE = 15V
14V
13V
200
300
11V
250
VGE = 15V
14V
13V
12V
IC - Amperes
IC - Amperes
160
12V
10V
120
80
9V
200
11V
150
10V
100
9V
40
8V
50
8V
0
7V
0
0.5
1
1.5
2
2.5
3
0
3.5
7V
0
2
4
6
8
10
12
14
16
18
150
175
VCE - Volts
VCE - Volts
Fig. 4. Dependence of VCE(sat) on
Junction Temperature
Fig. 3. Output Characteristics @ T J = 150ºC
2.4
VGE = 15V
14V
200
VGE = 15V
2.2
13V
2.0
IC - Amperes
VCE(sat) - Normalized
12V
160
11V
120
10V
80
I
1.8
C
= 220A
1.6
1.4
I
1.2
C
= 110A
1.0
9V
0.8
40
8V
7V
0
0
0.5
1
1.5
2
2.5
3
3.5
4
I
0.6
= 55A
0.4
-50
4.5
-25
0
VCE - Volts
25
50
75
100
125
TJ - Degrees Centigrade
Fig. 5. Collector-to-Emitter Voltage vs.
Gate-to-Emitter Voltage
5.0
C
Fig. 6. Input Admittance
100
TJ = 25ºC
4.5
90
80
4.0
I
3.0
C
IC - Amperes
VCE - Volts
70
3.5
= 220A
2.5
TJ = - 40ºC
25ºC
60
50
TJ = 150ºC
40
30
110A
2.0
20
1.5
10
55A
1.0
8
9
10
11
12
VGE - Volts
© 2013 IXYS CORPORATION, All Rights Reserved
13
0
14
15
4
5
6
7
VGE - Volts
8
9
10
IXXN110N65B4H1
Fig. 7. Transconductance
Fig. 8. Gate Charge
16
TJ = - 40ºC
50
VCE = 325V
14
I G = 10mA
12
40
25ºC
30
VGE - Volts
g f s - Siemens
I C = 110A
150ºC
20
10
8
6
4
10
2
0
0
0
10
20
30
40
50
60
70
80
90
0
100
20
40
60
80
100
120
140
160
180
200
QG - NanoCoulombs
IC - Amperes
Fig. 10. Reverse-Bias Safe Operating Area
Fig. 9. Capacitance
10,000
240
f = 1 MHz
Cies
IC - Amperes
Capacitance - PicoFarads
200
1,000
Coes
160
120
80
TJ = 150ºC
40
Cres
0
100
100
0
5
10
15
20
25
30
35
40
RG = 2Ω
dv / dt < 10V / ns
200
300
400
500
600
700
VCE - Volts
VCE - Volts
Fig. 11. Maximum Transient Thermal Impedance
Z(th)JC - ºC / W
1
0.1
0.01
0.001
0.00001
0.0001
0.001
0.01
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
0.1
1
10
IXXN110N65B4H1
Fig. 12. Inductive Switching Energy Loss vs.
Gate Resistance
Eon -
Eoff
4.5
---
TJ = 150ºC , VGE = 15V
4.0
VCE = 400V
16
3.8
Eoff
14
3.4
RG = 2Ω , VGE = 15V
12
I C = 110A
3.0
10
2.5
8
2.0
6
1.5
4
I
1.0
C
= 55A
0.5
2
3
4
5
6
7
8
9
10
11
12
13
14
10
Eon
3.0
7
2.6
6
2.2
5
TJ = 150ºC
1.8
4
1.4
3
1.0
2
0.6
0
0.2
2
TJ = 25ºC
1
55
15
60
65
70
75
4.0
----
RG = 2Ω , VGE = 15V
Eoff - MilliJoules
2.4
6
2.0
5
1.6
4
I C = 55A
I
150
I
C
= 110A
100
50
0
2
3
4
5
6
7
tfi
td(off) - - - -
180
160
170
140
RG = 2Ω , VGE = 15V
VCE = 400V
140
130
TJ = 25ºC
100
110
20
10
95
IC - Amperes
© 2013 IXYS CORPORATION, All Rights Reserved
100
105
tfi
td(off) - - - -
240
RG = 2Ω , VGE = 15V
VCE = 400V
200
I C = 55A
I C = 110A
60
40
90
15
120
110
85
14
80
30
80
13
160
120
75
12
100
50
70
11
280
120
t f i - Nanoseconds
TJ = 150ºC
90
65
10
80
40
25
50
75
100
TJ - Degrees Centigrade
125
0
150
t d(off) - Nanoseconds
150
t d(off) - Nanoseconds
t f i - Nanoseconds
160
110
60
9
Fig. 17. Inductive Turn-off Switching Times vs.
Junction Temperature
Fig. 16. Inductive Turn-off Switching Times vs.
Collector Current
55
8
RG - Ohms
TJ - Degrees Centigrade
70
350
= 55A
60
0
130
C
200
1
150
125
400
VCE = 400V
250
20
100
450
80
40
0.4
500
100
2
150
0
110
300
0.8
170
105
120
3
75
100
td(off) - - - -
140
1.2
50
95
t d(off) - Nanoseconds
7
I C = 110A
Eon - MilliJoules
2.8
25
90
TJ = 150ºC, VGE = 15V
160
8
VCE = 400V
tfi
180
9
t f i - Nanoseconds
3.2
85
Fig. 15. Inductive Turn-off Switching Times vs.
Gate Resistance
200
10
Eon
80
IC - Amperes
Fig. 14. Inductive Switching Energy Loss vs.
Junction Temperature
Eoff
8
VCE = 400V
RG - Ohms
3.6
9
----
Eon - MilliJoules
Eoff - MilliJoules
4.2
Eon - MilliJoules
3.5
18
Eoff - MilliJoules
5.0
Fig. 13. Inductive Switching Energy Loss vs.
Collector Current
IXXN110N65B4H1
Fig. 19. Inductive Turn-on Switching Times vs.
Collector Current
Fig. 18. Inductive Turn-on Switching Times vs.
Gate Resistance
200
160
I
VCE = 400V
C = 110A
90
140
70
120
60
100
50
C
= 55A
80
40
60
30
40
20
20
3
4
5
6
7
8
9
10
11
12
13
14
180
70
65
60
VCE = 400V
120
55
I
100
C
= 110A
50
80
45
60
40
40
t d(on) - Nanoseconds
t r i - Nanoseconds
td(on) - - - -
RG = 2Ω , VGE = 15V
140
35
I C = 55A
20
30
0
25
50
75
100
100
50
45
TJ = 25ºC
TJ = 150ºC
80
125
40
60
35
40
30
60
65
70
75
80
85
90
IC - Amperes
Fig. 20. Inductive Turn-on Switching Times vs.
Junction Temperature
tri
55
VCE = 400V
120
55
15
RG - Ohms
160
td(on) - - - -
20
10
2
tri
RG = 2Ω , VGE = 15V
25
150
TJ - Degrees Centigrade
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
95
100
105
25
110
t d(on) - Nanoseconds
140
I
60
80
t d(on) - Nanoseconds
t r i - Nanoseconds
td(on) - - - -
TJ = 150ºC, VGE = 15V
160
t r i - Nanoseconds
tri
180
100
IXXN110N65B4H1
Fig. 22. Typ. Reverse Recovery Charge Qrr vs. -diF/dt
Fig. 21. Typ. Forward characteristics
20
200
TVJ = 150ºC
175
16
150
VR = 300V
IF = 200A
TVJ = 25ºC
TVJ = 150ºC
125
QRM
IF
12
100A
100
[µC]
[A]
75
8
50A
50
4
25
0
0
0.5
1
1.5
2
2.5
0
1000
3
1200
VF - [V]
1800
2000
Fig. 24. Typ. Recovery Time trr vs. -diF/dt
350
140
IF = 200A
TVJ = 150ºC
TVJ = 150ºC
300
VR = 300V
VR = 300V
250
100A
100
trr
IRM
[A]
1600
-diF/ dt [A/µs]
Fig. 23. Typ. Peak Reverse Current IRM vs. -diF/dt
120
1400
200
IF = 200A
[ns]
50A
80
150
100A
60
100
40
1000
1200
1400
1600
1800
50
1000
2000
50A
1200
diF/dt [A/µs]
1400
1600
1800
2000
-diF/dt [A/µs]
Fig. 26. Maximum Transient Thermal Impedance
Fig. 25. Typ. Recovery Energy Erec vs. -diF/dt
1
5
TVJ = 150ºC
IF = 200A
VR = 300V
Erec
3
Z(th)JC - ºC / W
4
100A
[mJ]
2
0.1
0.01
50A
1
0
1000
1200
1400
1600
-diF/dt [A/µs]
© 2013 IXYS CORPORATION, All Rights Reserved
1800
2000
0.001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS REF: IXX_110N65B4H1(E8) 02-04-13-B
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