TI1 AMC1306E25DWVR Small, high-precision, reinforced isolated delta-sigma modulators with high cmti Datasheet

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AMC1306E05, AMC1306E25, AMC1306M05, AMC1306M25
SBAS734 – MARCH 2017
AMC1306x Small, High-Precision,
Reinforced Isolated Delta-Sigma Modulators with High CMTI
1 Features
3 Description
•
The AMC1306 device is a precision, delta-sigma (ΔΣ)
modulator with the output separated from the input
circuitry by a capacitive double isolation barrier that is
highly resistant to magnetic interference. This barrier
is certified to provide reinforced isolation of up to
8000 VPEAK according to the DIN V VDE V 0884-10
and UL1577 standards. Used in conjunction with
isolated power supplies, this isolated modulator
separates parts of the system that operate on
different common-mode voltage levels and protects
lower-voltage parts from damage.
1
•
•
•
•
•
Pin-Compatible Family Optimized for ShuntResistor-Based Current Measurements:
– ±50-mV or ±250-mV Input Voltage Ranges
– Manchester Coded or Uncoded Bitstream
Options
Excellent DC Performance:
– Offset Error: ±100 µV (max)
– Offset Drift: 1 µV/°C (max)
– Gain Error: ±0.2% (max)
– Gain Drift: ±40 ppm/°C (max)
Transient Immunity: 100 kV/µs (typ)
System-Level Diagnostic Features
Safety-Related Certifications:
– 7000-VPEAK Reinforced Isolation per DIN V
VDE V 0884-10 (VDE V 0884-10): 2006-12
– 5000-VRMS Isolation for 1 Minute per UL1577
– CAN/CSA No. 5A-Component Acceptance
Service Notice, IEC 60950-1, and IEC 60065
End Equipment Standards
Fully Specified Over the Extended Industrial
Temperature Range: –40°C to +125°C
The input of the AMC1306 is optimized for direct
connection to shunt resistors or other low voltagelevel signal sources. The unique low input voltage
range of the ±50-mV device allows significant
reduction of the power dissipation through the shunt
and supports excellent ac and dc performance. The
output bitstream of the AMC1306 is Manchester
coded (AMC1306Ex) or uncoded (AMC1306Mx),
depending on the derivate. By using an integrated
digital filter (such as those in the TMS320F2807x or
TMS320F2837x microcontroller families) to decimate
the bitstream, the device can achieve 16 bits of
resolution with a dynamic range of 85 dB at a data
rate of 78 kSPS.
The bitstream output of the Manchester coded
AMC1306Ex versions support single-wire data and
clock transfer without having to consider the setup
and hold time requirements of the receiving device.
2 Applications
•
Shunt-Resistor-Based Current Sensing and
Isolated Voltage Measurements in:
– Industrial Motor Drives
– Photovoltaic Inverters
– Uninterruptible Power Supplies
Device Information(1)
PART NUMBER
AMC1306x
PACKAGE
SOIC (8)
BODY SIZE (NOM)
5.85 mm × 7.50 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
Floating
Power Supply
HV+
AMC1306Mx
AGND
RSHUNT
Optional
To Load
AINN
Optional
DVDD
AVDD
Optional
AINP
Reinforced Isolation
3.3 V or 5.0 V
DGND
3.0 V, 3.3 V, or 5.0 V
TMS320F28x7x
DOUT
SD-Dx
CLKIN
SD-Cx
PWMx
HV-
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AMC1306E05, AMC1306E25, AMC1306M05, AMC1306M25
SBAS734 – MARCH 2017
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
8
8.2 Functional Block Diagram ....................................... 17
8.3 Feature Description................................................. 18
8.4 Device Functional Modes........................................ 22
1
1
1
2
3
3
4
9
Application and Implementation ........................ 23
9.1 Application Information............................................ 23
9.2 Typical Applications ................................................ 24
10 Power Supply Recommendations ..................... 29
11 Layout................................................................... 30
Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 4
Power Ratings........................................................... 4
Insulation Specifications............................................ 5
Safety-Related Certifications..................................... 6
Safety Limiting Values .............................................. 6
Electrical Characteristics: AMC1306x25 ................... 7
Switching Characteristics ........................................ 9
Insulation Characteristics Curves ......................... 10
Typical Characteristics .......................................... 11
11.1 Layout Guidelines ................................................. 30
11.2 Layout Example .................................................... 30
12 Device and Documentation Support ................. 31
12.1
12.2
12.3
12.4
12.5
12.6
12.7
12.8
Device Support......................................................
Documentation Support ........................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
31
31
31
31
31
31
32
32
13 Mechanical, Packaging, and Orderable
Information ........................................................... 32
Detailed Description ............................................ 17
8.1 Overview ................................................................. 17
4 Revision History
2
DATE
REVISION
NOTES
March 2017
*
Initial release.
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SBAS734 – MARCH 2017
5 Device Comparison Table
PART NUMBER
STATUS
INPUT VOLTAGE
RANGE
DIFFERENTIAL INPUT
RESISTANCE
DIGITAL OUTPUT INTERFACE
AMC1306E05
Preview
±50 mV
4.9 kΩ
Manchester coded CMOS
AMC1306E25
Active
±250 mV
22 kΩ
Manchester coded CMOS
AMC1306M05
Preview
±50 mV
4.9 kΩ
Uncoded CMOS
AMC1306M25
Active
±250 mV
22 kΩ
Uncoded CMOS
6 Pin Configuration and Functions
DWV Package
8-Pin SOIC
Top View
AVDD
1
8
DVDD
AINP
2
7
CLKIN
AINN
3
6
DOUT
AGND
4
5
DGND
Not to scale
Pin Functions
PIN
NO.
1
NAME
I/O
DESCRIPTION
Analog (high-side) power supply, 3.0 V to 5.5 V.
See the Power Supply Recommendations section for decoupling recommendations.
AVDD
—
2
AINP
I
Noninverting analog input
3
AINN
I
Inverting analog input
4
AGND
—
Analog (high-side) ground reference
5
DGND
—
Digital (controller-side) ground reference
6
DOUT
O
Modulator data output. This pin is a Manchester coded output for AMC1306Ex derivates.
7
CLKIN
I
Modulator clock input: 5 MHz to 21 MHz (5-V operation) with internal pulldown resistor (typical value: 1.5 MΩ)
8
DVDD
—
Digital (controller-side) power supply, 2.7 V to 5.5 V.
See the Power Supply Recommendations section for decoupling recommendations.
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7 Specifications
7.1 Absolute Maximum Ratings (1)
Supply voltage
MIN
MAX
UNIT
–0.3
6.5
V
AGND – 6
AVDD + 0.5
V
DGND – 0.5
DVDD + 0.5
V
AVDD to AGND or DVDD to DGND
Analog input voltage at AINP, AINN
Digital input or output voltage at CLKIN or DOUT
Input current to any pin except supply pins
–10
Junction temperature, TJ
Storage temperature, Tstg
(1)
–65
10
mA
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
NOM
MAX
AVDD
Analog (high-side) supply voltage (AVDD to AGND)
3.0
5.0
5.5
UNIT
V
DVDD
Digital (controller-side) supply voltage (DVDD to DGND)
2.7
3.3
5.5
V
TA
Operating ambient temperature
–40
125
°C
7.4 Thermal Information
AMC1306x
THERMAL METRIC
(1)
DWV (SOIC)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
112.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
47.6
°C/W
RθJB
Junction-to-board thermal resistance
60.0
°C/W
ψJT
Junction-to-top characterization parameter
23.1
°C/W
ψJB
Junction-to-board characterization parameter
60.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Power Ratings
PARAMETER
PD
Maximum power dissipation (both sides)
PD1
Maximum power dissipation
(high-side supply)
PD2
Maximum power dissipation
(low-side supply)
4
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TEST CONDITIONS
MIN
TYP
MAX
AMC1306Ex, AVDD = DVDD = 5.5 V
91.85
AMC1306Mx, AVDD = DVDD = 5.5 V
86.90
AVDD = 5.5 V
53.90
AMC1306Ex, DVDD = 5.5 V
37.95
AMC1306Mx, DVDD = 5.5 V
33.00
UNIT
mW
mW
mW
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SBAS734 – MARCH 2017
7.6 Insulation Specifications
over operating ambient temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VALUE
UNIT
Shortest pin-to-pin distance through air
≥9
mm
Shortest pin-to-pin distance across the package
surface
≥9
mm
≥ 0.021
mm
≥ 600
V
GENERAL
CLR
External clearance (1)
CPG
External creepage
(1)
DTI
Distance through insulation
Minimum internal gap (internal clearance) of the
double insulation (2 × 0.0105 mm)
CTI
Comparative tracking index
DIN EN 60112 (VDE 0303-11); IEC 60112
Material group
According to IEC 60664-1
Overvoltage category per IEC 60664-1
DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12
VIORM
Maximum repetitive peak isolation
voltage
VIOWM
Maximum-rated isolation working
voltage
VIOTM
Maximum transient isolation voltage
VIOSM
Maximum surge isolation voltage (3)
Barrier capacitance, input to output (5)
CIO
Insulation resistance, input to output (5)
RIO
I-IV
Rated mains voltage ≤ 600 VRMS
I-IV
Rated mains voltage ≤ 1000 VRMS
I-III
(2)
Apparent charge (4)
qpd
I
Rated mains voltage ≤ 300 VRMS
At ac voltage (bipolar)
2121
VPK
At ac voltage (sine wave)
1500
VRMS
At dc voltage
2121
VDC
VTEST = VIOTM, t = 60 s (qualification test)
7000
VTEST = 1.2 × VIOTM, t = 1 s (100% production test)
8400
Test method per IEC 60065, 1.2/50-μs waveform,
VTEST = 1.6 × VIOSM = 12800 VPK (qualification)
8000
Method a, after input/output safety test subgroup 2/3,
Vini = VIOTM, tini = 60 s,
Vpd(m) = 1.2 × VIORM = 2545 VPK, tm = 10 s
≤5
Method a, after environmental tests subgroup 1,
Vini = VIOTM, tini = 60 s,
Vpd(m) = 1.6 × VIORM = 3394 VPK, tm = 10 s
≤5
Method b1, at routine test (100% production) and
preconditioning (type test), Vini = VIOTM, tini = 1 s,
Vpd(m) = 1.875 × VIORM = 3977 VPK, tm = 1 s
≤5
VIO = 0.5 VPP at 1 MHz
~1
VPK
VPK
pC
pF
12
VIO = 500 V at TA = 25°C
> 10
VIO = 500 V at 100°C ≤ TA ≤ 125°C
> 1011
VIO = 500 V at TS = 150°C
> 109
Pollution degree
2
Climatic category
40/125/21
Ω
UL1577
VISO
(1)
(2)
(3)
(4)
(5)
Withstand isolation voltage
VTEST = VISO = 5000 VRMS or 7000 VDC, t = 60 s
(qualification), VTEST = 1.2 × VISO = 6000 VRMS,
t = 1 s (100% production test)
5000
VRMS
Apply creepage and clearance requirements according to the specific equipment isolation standards of an application. Care must be
taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed
circuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal in certain cases. Techniques such as
inserting grooves and ribs on the PCB are used to help increase these specifications.
This coupler is suitable for safe electrical insulation only within the safety ratings. Compliance with the safety ratings shall be ensured by
means of suitable protective circuits.
Testing is carried out in air or oil to determine the intrinsic surge immunity of the isolation barrier.
Apparent charge is electrical discharge caused by a partial discharge (pd).
All pins on each side of the barrier are tied together, creating a two-pin device.
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7.7 Safety-Related Certifications
VDE
UL
Certified according to DIN V VDE V 0884-10 (VDE V 0884-10): 2006-12,
DIN EN 60950-1 (VDE 0805 Teil 1): 2014-08,
and DIN EN 60065 (VDE 0860): 2005-11
Recognized under 1577 component recognition and
CSA component acceptance NO 5 programs
Reinforced insulation
Single protection
File number: DIN 40040142
File number: E181974
7.8 Safety Limiting Values
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output (I/O) circuitry.
A failure of the I/O may allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to
overheat the die and damage the isolation barrier, potentially leading to secondary system failures.
PARAMETER
IS
Safety input, output, or supply current
PS
Safety input, output, or total power
TS
Maximum safety temperature
(1)
TEST CONDITIONS
MIN
TYP
MAX
θJA = 112.2°C/W, AVDD = DVDD = 5.5 V,
TJ = 150°C, TA = 25°C
202.5
θJA = 112.2°C/W, AVDD = DVDD = 3.6 V,
TJ = 150°C, TA = 25°C
309.4
UNIT
mA
1114 (1)
θJA = 112.2°C/W, TJ = 150°C, TA = 25°C
150
mW
°C
Input, output, or the sum of input and output power must not exceed this value.
The maximum safety temperature is the maximum junction temperature specified for the device. The power
dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines
the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information table is that
of a device installed on a high-K test board for leaded surface-mount packages. The power is the recommended
maximum input voltage times the current. The junction temperature is then the ambient temperature plus the
power times the junction-to-air thermal resistance.
6
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7.9 Electrical Characteristics: AMC1306x25
minimum and maximum specifications apply from TA = –40°C to +125°C, AVDD = 3.0 V to 5.5 V, DVDD = 2.7 V to 5.5 V,
AINP = –250 mV to 250 mV, AINN = AGND, and sinc3 filter with OSR = 256 (unless otherwise noted); typical specifications
are at TA = 25°C, CLKIN = 20 MHz, AVDD = 5 V, and DVDD = 3.3 V
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG INPUTS
VClipping
Differential input voltage before clipping
output
AINP – AINN
FSR
Specified linear differential full-scale
voltage
AINP – AINN
Absolute common-mode input voltage
(1)
±320
–250
mV
250
mV
(AINP – AINN) / 2 to AGND
–2
AVDD
V
VCM
Operating common-mode input voltage
(AINP – AINN) / 2 to AGND
–0.16
AVDD – 2.1
V
VCMov
Common-mode overvoltage detection
level (2)
(AINP – AINN) / 2 to AGND
AVDD – 2
CIN
Single-ended input capacitance
2
CIND
Differential input capacitance
1
IIB
Input bias current
Inputs shorted to AGND
RIN
Single-ended input resistance
AINN = AGND
19
kΩ
RIND
Differential input resistance
22
kΩ
IIO
Input offset current
±5
nA
CMTI
Common-mode transient immunity
100
kV/µs
CMRR
Common-mode rejection ratio
–82
50
–60
AINP = AINN, fIN = 0 Hz,
VCM min ≤ VIN ≤ VCM max
–95
AINP = AINN, fIN from 0.1 Hz to 50 kHz,
VCM min ≤ VIN ≤ VCM max
–95
pF
pF
–48
µA
dB
Input bandwidth (3)
BW
V
900
kHz
DC ACCURACY
DNL
Differential nonlinearity
Resolution: 16 bits
–0.99
0.99
LSB
INL
Integral nonlinearity (4)
Resolution: 16 bits
–4
±1
4
LSB
EO
Offset error
Initial, at 25°C
–100
±4.5
100
Initial, at 25°C
–0.2%
–0.005%
0.2%
–40
±20
40
(5)
TCEO
Offset error thermal drift
EG
Gain error
TCEG
Gain error thermal drift (6)
–1
AINP = AINN = AGND,
3.0 V ≤ AVDD ≤ 5.5 V, at dc
PSRR
Power-supply rejection ratio
1
µV
µV/°C
ppm/°C
–103
dB
AINP = AINN = AGND,
3.0 V ≤ AVDD ≤ 5.5 V,
10 kHz, 100-mV ripple
–92
AC ACCURACY
SNR
Signal-to-noise ratio
fIN = 1 kHz
82
86
dB
SINAD
Signal-to-noise + distortion
fIN = 1 kHz
81.9
85.7
dB
THD
Total harmonic distortion
SFDR
(1)
(2)
(3)
(4)
(5)
(6)
Spurious-free dynamic range
4.5 V ≤ AVDD ≤ 5.5 V,
5 MHz ≤ fCLKIN ≤ 21 MHz, fIN = 1 kHz
–98
–86
3.0 V ≤ AVDD ≤ 3.6 V,
5 MHz ≤ fCLKIN ≤ 20 MHz, fIN = 1 kHz
–93
–85
fIN = 1 kHz
dB
83
100
dB
Steady-state voltage supported by the device in case of a system failure; see the specified common-mode input voltage VCM for normal
operation. Adhere to the analog input voltage range as specified in the Absolute Maximum Ratings table.
The common-mode overvoltage detection level has a typical hysteresis of 90 mV.
This parameter is the –3-dB, second-order, roll-off frequency of the integrated differential input amplifier to consider for antialiasing filter
designs.
Integral nonlinearity is defined as the maximum deviation from a straight line passing through the end-points of the ideal ADC transfer
function expressed as number of LSBs or as a percent of the specified linear full-scale range FSR.
value MAX value MIN
TempRange
.
§ value MAX value MIN
TCE G ( ppm ) ¨¨
© value u TempRange
Gain error drift is calculated using the box method, as described by the following equation:
Offset error drift is calculated using the box method, as described by the following equation:
Copyright © 2017, Texas Instruments Incorporated
TCE O
·
¸¸ u 10 6
¹
.
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Electrical Characteristics: AMC1306x25 (continued)
minimum and maximum specifications apply from TA = –40°C to +125°C, AVDD = 3.0 V to 5.5 V, DVDD = 2.7 V to 5.5 V,
AINP = –250 mV to 250 mV, AINN = AGND, and sinc3 filter with OSR = 256 (unless otherwise noted); typical specifications
are at TA = 25°C, CLKIN = 20 MHz, AVDD = 5 V, and DVDD = 3.3 V
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUTS/OUTPUTS
CMOS Logic with Schmitt-trigger
DGND ≤ VIN ≤ DVDD
IIN
Input current
CIN
Input capacitance
0
7
VIH
High-level input voltage
0.7 × DVDD
DVDD + 0.3
VIL
Low-level input voltage
–0.3
0.3 × DVDD
CLOAD
Output load capacitance
VOH
High-level output voltage
VOL
Low-level output voltage
4
fCLKIN = 20 MHz
pF
30
IOH = –20 µA
DVDD – 0.1
IOH = –4 mA
DVDD – 0.4
μA
V
V
pF
V
IOL = 20 µA
0.1
IOL = 4 mA
0.4
V
POWER SUPPLY
AVDD
High-side supply voltage
IAVDD
High-side supply current
DVDD
Controller-side supply voltage
IDVDD
8
Controller-side supply current
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5.0
5.5
3.0 V ≤ AVDD ≤ 3.6 V
3.0
6.3
8.5
4.5 V ≤ AVDD ≤ 5.5 V
7.2
9.8
3.3
5.5
AMC1306Ex, 2.7 V ≤ DVDD ≤ 3.6 V,
CLOAD = 15 pF
2.7
4.1
5.5
AMC1306Mx, 2.7 V ≤ DVDD ≤ 3.6 V,
CLOAD = 15 pF
3.3
4.8
AMC1306Ex, 4.5 V ≤ DVDD ≤ 5.5 V,
CLOAD = 15 pF
5.0
6.9
AMC1306Mx, 4.5 V ≤ DVDD ≤ 5.5 V,
CLOAD = 15 pF
3.9
6.0
V
mA
V
mA
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7.10 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
4.5 V ≤ AVDD ≤ 5.5 V
5
21
3.0 V ≤ AVDD ≤ 5.5 V
5
20
4.5 V ≤ AVDD ≤ 5.5 V
47.6
200
3.0 V ≤ AVDD ≤ 5.5 V
50
200
UNIT
fCLKIN
CLKIN clock frequency
tCLKIN
CLKIN clock period
tHIGH
CLKIN clock high time
20
25
120
ns
tLOW
CLKIN clock low time
20
25
120
ns
tH
DOUT hold time after rising edge of
CLKIN
AMC1306Mx (1), CLOAD = 15 pF
tD
Rising edge of CLKIN to DOUT valid
delay
AMC1306Mx (1), CLOAD = 15 pF
tr
DOUT rise time
tf
DOUT fall time
ns
3.5
ns
15
10% to 90%, 2.7 V ≤ DVDD ≤ 3.6 V,
CLOAD = 15 pF
0.8
3.5
10% to 90%, 4.5 V ≤ DVDD ≤ 5.5 V,
CLOAD = 15 pF
1.8
3.9
10% to 90%, 2.7 V ≤ DVDD ≤ 3.6 V,
CLOAD = 15 pF
0.8
3.5
10% to 90%, 4.5 V ≤ DVDD ≤ 5.5 V,
CLOAD = 15 pF
1.8
3.9
tISTART
Interface startup time
DVDD at 2.7 V (min) to DOUT valid
with AVDD ≥ 3.0 V
tASTART
Analog startup time
AVDD step to 3.0 V with DVDD ≥ 2.7 V,
0.1% settling
(1)
MHz
ns
ns
ns
32
32
CLKIN
cycles
0.5
ms
The output of the Manchester encoded versions of the AMC1306Ex can change with every edge of CLKIN with a typical delay of 6 ns;
see the Manchester Coding Feature section for additional details.
tCLKIN
tHIGH
CLKIN
tLOW
tH
tr / tf
tD
DOUT
Figure 1. Digital Interface Timing
AVDD
DVDD
tASTART
CLKIN
...
DOUT
Test Pattern
Bitream not valid
(analog settling)
Valid bitstream
tISTART
Figure 2. Device Startup Timing
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7.11 Insulation Characteristics Curves
1200
500
AVDD = DVDD = 3.6 V
AVDD = DVDD = 5.5 V
1100
1000
400
900
PS (mW)
IS (mA)
800
300
200
700
600
500
400
300
100
200
100
0
0
0
50
100
TA (°C)
150
0
200
Figure 3. Thermal Derating Curve for Safety-Limiting
Current per VDE
100
TA (°C)
200
D002
Safety Margin Zone: 1800 VRMS , 254 Years
Operating Zone: 1500 VRMS , 135 Years
TDDB Line (<1 PPM Fail Rate)
1E+10
1E+9
150
Figure 4. Thermal Derating Curve for Safety-Limiting
Power per VDE
1E+11
Time to Fail (sec)
50
D001
87.5%
1E+8
1E+7
1E+6
1E+5
1E+4
1E+3
20%
1E+2
9000
9500
8500
8000
7500
7000
6500
6000
5500
5000
4500
4000
3500
3000
2500
2000
1500
500
1000
1E+1
Stress Voltage (V RMS)
TA up to 150°C, stress-voltage frequency = 60 Hz,
isolation working voltage = 1500 VRMS, operating lifetime = 135 years
Figure 5. Reinforced Isolation Capacitor Lifetime Projection
10
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7.12 Typical Characteristics
at AVDD = 5 V, DVDD = 3.3 V, AINP = –50 mV to 50 mV (AMC1306x05) or –250 mV to 250 mV (AMC1306x25),
AINN = AGND, fCLKIN = 20 MHz, and sinc3 filter with OSR = 256 (unless otherwise noted)
4
3.3
3.5
3.25
3.2
VCMov (V)
VCM (V)
3
2.5
2
1.5
3.1
3.05
3
1
2.95
0.5
3
3.5
4
4.5
AVDD (V)
5
2.9
-40
5.5
-10
0
40
-20
20
CMRR (dB)
-20
80
95
110 125
D004
-60
-80
-40
-100
-60
0
0.5
1
1.5
VCM (V)
2
2.5
3
-120
0.1
3.5
1
10
fIN (kHz)
D005
AMC1306x25
100
1000
D006
AMC1306x25
Figure 8. Input Bias Current vs
Common-Mode Input Voltage
Figure 9. Common-Mode Rejection Ratio vs
Input Signal Frequency
4
100
3.5
75
3
50
2.5
25
EO (µV)
INL (|LSB|)
20 35 50 65
Temperature (qC)
-40
0
2
0
1.5
-25
1
-50
0.5
-75
0
-40
5
Figure 7. Common-Mode Overvoltage Detection Level vs
Temperature
60
-80
-0.5
-25
D003
Figure 6. Maximum Operating Common-Mode Input Voltage
vs High-Side Supply Voltage
IIB (PA)
3.15
-100
-25
-10
5
20 35 50 65
Temperature (°C)
80
95
110 125
D008
3
3.5
4
4.5
AVDD (V)
5
5.5
D009
AMC1306x25
Figure 10. Integral Nonlinearity vs Temperature
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Figure 11. Offset Error vs High-Side Supply Voltage
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Typical Characteristics (continued)
100
100
80
80
60
60
40
40
20
20
EO (µV)
EO (PV)
at AVDD = 5 V, DVDD = 3.3 V, AINP = –50 mV to 50 mV (AMC1306x05) or –250 mV to 250 mV (AMC1306x25),
AINN = AGND, fCLKIN = 20 MHz, and sinc3 filter with OSR = 256 (unless otherwise noted)
0
-20
-40
0
-20
-40
-60
-60
Device 1
Device 2
Device 3
-80
-100
-40
-80
-100
-25
-10
5
20 35 50 65
Temperature (°C)
80
95
110 125
5
9
13
fCLKIN (MHz)
D010
AMC1306x25
17
21
D011
AMC1306x25
Figure 12. Offset Error vs Temperature
Figure 13. Offset Error vs Clock Frequency
0.3
0.25
0.2
0.2
0.15
0.1
0.05
EG (%)
EG (%)
0.1
0
0
-0.05
-0.1
-0.1
-0.15
-0.2
-0.2
-0.3
-40
-0.25
3
3.5
4
4.5
AVDD (V)
5
5.5
-25
-10
5
D012
AMC1306x25
0.2
-20
0.1
-40
0
-80
-0.2
-100
-0.3
17
AMC1306x25
Figure 16. Gain Error vs Clock Frequency
12
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110 125
D013
-60
-0.1
13
fCLKIN (MHz)
95
Figure 15. Gain Error vs Temperature
0
PSRR (dB)
EG (%)
Figure 14. Gain Error vs High-Side Supply Voltage
9
80
AMC1306x25
0.3
5
20 35 50 65
Temperature (qC)
21
D014
-120
0.1
1
10
100
Ripple Frequency (kHz)
1000
D015
AMC1306x25
Figure 17. Power-Supply Rejection Ratio vs
Ripple Frequency
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Typical Characteristics (continued)
at AVDD = 5 V, DVDD = 3.3 V, AINP = –50 mV to 50 mV (AMC1306x05) or –250 mV to 250 mV (AMC1306x25),
AINN = AGND, fCLKIN = 20 MHz, and sinc3 filter with OSR = 256 (unless otherwise noted)
90
90
AMC1306x25, SNR
AMC1306x25, SINAD
88
87
86
85
84
83
3
3.5
4
4.5
AVDD (V)
5
87
86
85
84
82
-40
5.5
-25
-10
5
D016
Figure 18. Signal-to-Noise Ratio and Signal-to-Noise +
Distortion vs High-Side Supply Voltage
20 35 50 65
Temperature (qC)
80
95
110 125
D017
Figure 19. Signal-to-Noise Ratio and Signal-to-Noise +
Distortion vs Temperature
90
88
AMC1306x25, SNR
AMC1306x25, SINAD
89
86
88
SNR and SINAD (dB)
SNR and SINAD (dB)
88
83
82
87
86
85
84
83
84
82
80
78
76
74
82
5
9
13
fCLKIN (MHz)
17
AMC1306x25, SNR
AMC1306x25, SINAD
72
0.1
21
1
10
100
fIN (kHz)
D018
Figure 20. Signal-to-Noise Ratio and Signal-to-Noise +
Distortion vs Clock Frequency
D019
Figure 21. Signal-to-Noise Ratio and Signal-to-Noise +
Distortion vs Input Signal Frequency
100
-86
AMC1306x25, SNR
AMC1306x25, SINAD
95
-88
-90
90
-92
85
-94
80
THD (dB)
SNR and SINAD (dB)
AMC1306x25, SNR
AMC1306x25, SINAD
89
SNR and SINAD (dB)
SNR and SINAD (dB)
89
75
70
-96
-98
-100
-102
65
-104
60
-106
55
-108
50
-110
4.5
0
50
100
150
200 250 300
VIN (mVpp)
350
400
450
500
D020
4.75
5
AVDD (V)
5.25
5.5
D021
AMC1306x25, fCLKIN = 21 MHz
Figure 22. Signal-to-Noise Ratio and Signal-to-Noise +
Distortion vs Input Signal Amplitude
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Figure 23. Total Harmonic Distortion vs
High-Side Supply Voltage (5 V, nom)
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Typical Characteristics (continued)
-86
-86
-88
-88
-90
-90
-92
-92
-94
-94
THD (dB)
THD (dB)
at AVDD = 5 V, DVDD = 3.3 V, AINP = –50 mV to 50 mV (AMC1306x05) or –250 mV to 250 mV (AMC1306x25),
AINN = AGND, fCLKIN = 20 MHz, and sinc3 filter with OSR = 256 (unless otherwise noted)
-96
-98
-100
-96
-98
-100
-102
-102
-104
-104
-106
-106
-108
-108
-110
3
3.5
4
4.5
AVDD (V)
5
-110
-40
5.5
-25
-10
D039
AMC1306x25, fCLKIN = 20 MHz
5
20 35 50 65
Temperature (°C)
80
95
110 125
D022
AMC1306x25
Figure 24. Total Harmonic Distortion vs
High-Side Supply Voltage (3.3 V, nom)
Figure 25. Total Harmonic Distortion vs Temperature
-85
-86
-88
-90
-90
-92
-95
THD (dB)
THD (dB)
-94
-96
-98
-100
-102
-100
-105
-110
-104
-106
-115
-108
-110
5
9
13
fCLKIN (MHz)
17
-120
0.1
21
1
fIN (kHz)
D023
AMC1306x25
Figure 27. Total Harmonic Distortion vs
Input Signal Frequency
-70
118
-75
114
-80
110
-85
106
SFDR (dB)
THD (dB)
D024
AMC1306x25
Figure 26. Total Harmonic Distortion vs Clock Frequency
-90
-95
-100
102
98
94
-105
90
-110
-115
86
-120
82
0
50
100
150
200 250 300
VIN (mVpp)
350
400
450
AMC1306x25
Figure 28. Total Harmonic Distortion vs
Input Signal Amplitude
14
10
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500
D025
3
3.5
4
4.5
AVDD (V)
5
5.5
D026
AMC1306x25
Figure 29. Spurious-Free Dynamic Range vs
High-Side Supply Voltage
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Typical Characteristics (continued)
118
118
114
114
110
110
106
106
SFDR (dB)
SFDR (dB)
at AVDD = 5 V, DVDD = 3.3 V, AINP = –50 mV to 50 mV (AMC1306x05) or –250 mV to 250 mV (AMC1306x25),
AINN = AGND, fCLKIN = 20 MHz, and sinc3 filter with OSR = 256 (unless otherwise noted)
102
98
102
98
94
94
90
90
86
86
82
-40
82
-25
-10
5
20 35 50 65
Temperature (qC)
80
95
5
110 125
9
13
fCLKIN (MHz)
D027
AMC1306x25
D028
Figure 31. Spurious-Free Dynamic Range vs
Clock Frequency
118
125
114
120
110
115
110
SFDR (dB)
106
SFDR (dB)
21
AMC1306x25
Figure 30. Spurious-Free Dynamic Range vs Temperature
102
98
94
105
100
95
90
90
85
86
80
82
0.1
75
1
fIN (kHz)
0
10
50
100
150
D029
AMC1306x25
200 250 300
VIN (mVpp)
350
400
450
500
D030
AMC1306x25
Figure 32. Spurious-Free Dynamic Range vs
Input Signal Frequency
Figure 33. Spurious-Free Dynamic Range vs
Input Signal Amplitude
0
0
-20
-20
-40
-40
Magnitude (dB)
Magnitude (dB)
17
-60
-80
-100
-60
-80
-100
-120
-120
-140
-140
-160
-160
0
5
10
15
20
25
Frequency (kHz)
30
35
40
D031
AMC1306x25, 4096-point FFT, VIN = 500 mVPP
Figure 34. Frequency Spectrum with 1-kHz Input Signal
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0
5
10
15
20
25
Frequency (kHz)
30
35
40
D032
AMC1306x25, 4096-point FFT, VIN = 500 mVPP
Figure 35. Frequency Spectrum with 10-kHz Input Signal
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Typical Characteristics (continued)
at AVDD = 5 V, DVDD = 3.3 V, AINP = –50 mV to 50 mV (AMC1306x05) or –250 mV to 250 mV (AMC1306x25),
AINN = AGND, fCLKIN = 20 MHz, and sinc3 filter with OSR = 256 (unless otherwise noted)
10
10
9.5
9.5
9
9
8.5
8.5
8
IAVDD (mA)
IAVDD (mA)
8
7.5
7
6.5
7
6.5
6
6
5.5
5.5
5
5
4.5
4.5
4
3
3.5
4
4.5
AVDD (V)
5
4
-40
5.5
10
8
9.5
7.5
9
7
8.5
6.5
5
20 35 50 65
Temperature (°C)
80
95
110 125
D034
AMC1306Mx
AMC1306Ex
6
IDVDD (mA)
7.5
7
6.5
5.5
5
4.5
6
4
5.5
3.5
5
3
4.5
2.5
2
2.7
4
5
9
13
Clock Frequency (MHz)
17
21
3.5
3.9
4.3
DVDD (V)
4.7
5.1
5.5
D036
Figure 39. Controller-Side Supply Current vs
Controller-Side Supply Voltage
8
8
AMC1306Mx, DVDD = 3.3 V
AMC1306Mx, DVDD = 5 V
AMC1306Ex, DVDD = 3.3 V
AMC1306Ex, DVDD = 5 V
7.5
7
6.5
AMC1306Mx, DVDD = 3.3 V
AMC1306Mx, DVDD = 5 V
AMC1306Ex, DVDD = 3.3 V
AMC1306Ex, DVDD = 5 V
7.5
7
6.5
6
IDVDD (mA)
6
5.5
5
4.5
5.5
5
4.5
4
4
3.5
3.5
3
3
2.5
2.5
2
-40
3.1
D035
Figure 38. High-Side Supply Current vs Clock Frequency
IDVDD (mA)
-10
Figure 37. High-Side Supply Current vs Temperature
8
2
-25
-10
5
20 35 50 65
Temperature (qC)
80
95
110 125
D037
Figure 40. Controller-Side Supply Current vs Temperature
16
-25
D033
Figure 36. High-Side Supply Current vs
High-Side Supply Voltage
IAVDD (mA)
7.5
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5
9
13
fCLKIN (MHz)
17
21
D038
Figure 41. Controller-Side Supply Current vs
Clock Frequency
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8 Detailed Description
8.1 Overview
The differential analog input (comprised of input signals AINP and AINN) of the AMC1306 is a fully-differential
amplifier feeding the switched-capacitor input of a second-order, delta-sigma (ΔΣ) modulator stage that digitizes
the input signal into a 1-bit output stream. The isolated data output DOUT of the converter provides a stream of
digital ones and zeros that is synchronous to the externally-provided clock source at the CLKIN pin with a
frequency in the range of 5 MHz to 21 MHz. The time average of this serial bitstream output is proportional to the
analog input voltage.
The Functional Block Diagram section shows a detailed block diagram of the AMC1306. The analog input range
is tailored to directly accommodate a voltage drop across a shunt resistor used for current sensing. The silicondioxide (SiO2) based capacitive isolation barrier supports a high level of magnetic field immunity as described in
the ISO72x Digital Isolator Magnetic-Field Immunity application report, available for download at www.ti.com. The
external clock input simplifies the synchronization of multiple current-sensing channels on the system level. The
extended frequency range of up to 21 MHz supports higher performance levels compared to the other solutions
available on the market.
8.2 Functional Block Diagram
DVDD
AVDD
Receiver
AINP
û Modulator
VCM, AVDD
Diagnostic
AGND
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Interface
Band-Gap
Reference
Receiver
AINN
Manchester Coding
(AMC1306Ex Only)
Reinforced
Isolation
Barrier
AMC1306x
DOUT
CLKIN
DGND
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8.3 Feature Description
8.3.1 Analog Input
The AMC1306 incorporates front-end circuitry that contains a differential amplifier and a sampling stage, followed
by a ΔΣ modulator. The gain of the differential amplifier is set by internal precision resistors to a factor of 4 for
devices with a specified input voltage range of ±250 mV (this value is for the AMC1306x25), or to a factor of 20
in devices with a ±50-mV input voltage range (for the AMC1306x05), resulting in a differential input impedance of
4.9 kΩ (for the AMC1306x05) or 22 kΩ (for the AMC1306x25). For reduced offset and offset drift, the differential
amplifier is chopper-stabilized with the switching frequency set at fCLKIN / 32. The switching frequency generates
a spur as shown in Figure 42.
0
-20
Magnitude (dB)
-40
-60
-80
-100
-120
-140
-160
0.1
1
10
100
Frequency (kHz)
1000
10000
D007
sinc3 filter, OSR = 2, fCLKIN = 20 MHz, fIN = 1 kHz
Figure 42. Quantization Noise Shaping
Consider the input impedance of the AMC1306 in designs with high-impedance signal sources that can cause
degradation of gain and offset specifications. The importance of this effect, however, depends on the desired
system performance. Additionally, the input bias current caused by the internal common-mode voltage at the
output of the differential amplifier is dependent on the actual amplitude of the input signal; see the Isolated
Voltage Sensing section for more details on reducing these effects.
There are two restrictions on the analog input signals (AINP and AINN). First, if the input voltage exceeds the
range AGND – 6 V to AVDD + 0.5 V, the input current must be limited to 10 mA because the device input
electrostatic discharge (ESD) diodes turn on. In addition, the linearity and noise performance of the device are
ensured only when the differential analog input voltage remains within the specified linear full-scale range (FSR),
that is ±250 mV (for the AMC1306x25) or ±50 mV (for the AMC1306x05), and within the specified input commonmode range.
18
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Feature Description (continued)
8.3.2 Modulator
The modulator implemented in the AMC1306 is a second-order, switched-capacitor, feed-forward ΔΣ modulator,
such as the one conceptualized in Figure 43. The analog input voltage VIN and the output V5 of the 1-bit digitalto-analog converter (DAC) are differentiated, providing an analog voltage V1 at the input of the first integrator
stage. The output of the first integrator feeds the input of the second integrator stage, resulting in output voltage
V3 that is differentiated with the input signal VIN and the output of the first integrator V2. Depending on the polarity
of the resulting voltage V4, the output of the comparator is changed. In this case, the 1-bit DAC responds on the
next clock pulse by changing the associated analog output voltage V5, causing the integrators to progress in the
opposite direction and forcing the value of the integrator output to track the average value of the input.
fCLKIN
V1
V2
Integrator 1
VIN
V3
V4
Integrator 2
CMP
0V
V5
DAC
Figure 43. Block Diagram of a Second-Order Modulator
The modulator shifts the quantization noise to high frequencies, as shown in Figure 43. Therefore, use a lowpass digital filter at the output of the device to increase the overall performance. This filter is also used to convert
from the 1-bit data stream at a high sampling rate into a higher-bit data word at a lower rate (decimation). TI's
microcontroller families TMS320F2807x and TMS320F2837x offer a suitable programmable, hardwired filter
structure termed a sigma-delta filter module (SDFM) optimized for usage with the AMC1306 family. Also,
SD24_B converters on the MSP430F677x microcontrollers offer a path to directly access the integrated sincfilters for a simple system-level solution for multichannel, isolated current sensing. An additional option is to use a
suitable application-specific device, such as the AMC1210 (a four-channel digital sinc-filter). Alternatively, a fieldprogrammable gate array (FPGA) can be used to implement the filter.
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Feature Description (continued)
8.3.3 Isolation Channel Signal Transmission
The AMC1306 device uses an on-off keying (OOK) modulation scheme to transmit the modulator output
bitstream across the capacitive SiO2-based isolation barrier. The transmitter modulates the bitstream at TX IN in
Figure 44 with an internally-generated, 480-MHz carrier across the isolation barrier to represent a digital one and
sends a no signal to represent the digital zero. The receiver demodulates the signal after advanced signal
conditioning and produces the output. The symmetrical design of each isolation channel improves the CMTI
performance and reduces the radiated emissions caused by the high-frequency carrier. The block diagram of an
isolation channel integrated in the AMC1306 is shown in Figure 44.
Transmitter
Receiver
OOK
Modulation
TX IN
TX Signal
Conditioning
SiO2-Based
Capacitive
Reinforced
Isolation
Barrier
RX Signal
Conditioning
Envelope
Detection
RX OUT
Oscillator
Figure 44. Block Diagram of an Isolation Channel
Figure 45 shows the concept of the on-off keying scheme.
TX IN
Carrier Signal Across
the Isolation Barrier
RX OUT
Figure 45. OOK-Based Modulation Scheme
20
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Feature Description (continued)
8.3.4 Digital Output
A differential input signal of 0 V ideally produces a stream of ones and zeros that are high 50% of the time. A
differential input of 250 mV (for the AMC1306x25) or 50 mV (for the AMC1306x05) produces a stream of ones
and zeros that are high 89.06% of the time. With 16 bits of resolution, that percentage ideally corresponds to the
code 58368. A differential input of –250 mV (–50 mV for the AMC1306x05) produces a stream of ones and zeros
that are high 10.94% of the time and ideally results in code 7168 with 16-bit resolution. These input voltages are
also the specified linear ranges of the different AMC1306 versions with performance as specified in this
document. If the input voltage value exceeds these ranges, the output of the modulator shows nonlinear behavior
when the quantization noise increases. The output of the modulator clips with a stream of only zeros with an
input less than or equal to –320 mV (–65 mV for the AMC1306x05) or with a stream of only ones with an input
greater than or equal to 320 mV (65 mV for the AMC1306x05). In this case, however, the AMC1306 generates a
single 1 (if the input is at negative full-scale) or 0 every 128 clock cycles to indicate proper device function (see
the Fail-Safe Output section for more details). The input voltage versus the output modulator signal is shown in
Figure 46.
Modulator Output
+FS (Analog Input)
-FS (Analog Input)
Analog Input
Figure 46. Analog Input versus the AMC1306 Modulator Output
The density of ones in the output bitstream for any input voltage value (with the exception of a full-scale input
signal, as described in the Output Behavior in Case of a Full-Scale Input section) can be calculated using
Equation 1:
VIN
VClipping
2 u VClipping
(1)
The AMC1306 system clock is provided externally at the CLKIN pin. For more details, see the Switching
Characteristics table and the Manchester Coding Feature section.
8.3.5 Manchester Coding Feature
The AMC1306Ex offers the IEEE 802.3-compliant Manchester coding feature that generates at least one
transition per bit to support clock signal recovery from the bitstream. A Manchester coded bitstream is free of dc
components. The Manchester coding combines the clock and data information using exclusive or (XOR) logical
operation and results in a bitstream as shown in Figure 47. The duty cycle of the Manchester encoded bitstream
depends on the duty cycle of the input clock CLKIN.
Clock
Uncoded
Bitstream
1
0
1
0
1
1
1
0
0
1
1
0
0
0
1
Machester
Coded
Bitstream
Figure 47. Manchester Coded Output of the AMC1306Ex
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8.4 Device Functional Modes
8.4.1 Fail-Safe Output
In the case of a missing high-side supply voltage AVDD, the output of a ΔΣ modulator is not defined and can
cause a system malfunction. In systems with high safety requirements, this behavior is not acceptable.
Therefore, the AMC1306 implements a fail-safe output function that ensures that the output DOUT of the device
offers a steady-state bitstream of logic 0's in case of a missing AVDD, as shown in Figure 48.
Additionally, if the common-mode voltage of the input reaches or exceeds the specified common-mode
overvoltage detection level VCMov as defined in the Electrical Characteristics table, the AMC1306 offers a steadystate bitstream of logic 1's at the output DOUT, as also shown in Figure 48.
tASTART
tISTART
CLKIN
...
AVDD
VCM
DOUT
AVDD GOOD
Missing AVDD
VCM • 9CMov
VCM < VCMov
Valid Bit Stream
AVDD GOOD
0
1
Test Pattern
VCM < VCMov
1
Bit Stream Not Valid
Valid Bit Stream
Figure 48. Fail-Safe Output of the AMC1306
8.4.2 Output Behavior in Case of a Full-Scale Input
If a full-scale input signal is applied to the AMC1306 (that is, VIN ≥ VClipping), the device generates a single one or
zero every 128 bits at DOUT, depending on the actual polarity of the signal being sensed, as shown in Figure 49.
In this way, differentiating between a missing AVDD and a full-scale input signal is possible on the system level.
CLKIN
...
DOUT
...
VIN ” ±320 mV (AMC1306x05: ±64 mV)
DOUT
...
...
...
...
VIN • 320 mV (AMC1306x05: 64 mV)
127 CLKIN Cycles
127 CLKIN Cycles
Figure 49. Overrange Output of the AMC1306
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Digital Filter Usage
The modulator generates a bitstream that is processed by a digital filter to obtain a digital word similar to a
conversion result of a conventional analog-to-digital converter (ADC). A very simple filter, built with minimal effort
and hardware, is a sinc3-type filter, as shown in Equation 2:
H z
§ 1 z OSR
¨¨
1
© 1 z
·
¸¸
¹
3
(2)
This filter provides the best output performance at the lowest hardware size (count of digital gates) for a secondorder modulator. All the characterization in this document is also done with a sinc3 filter with an oversampling
ratio (OSR) of 256 and an output word duration of 16 bits.
The effective number of bits (ENOB) is often used to compare the performance of ADCs and ΔΣ modulators.
Figure 50 shows the ENOB of the AMC1306 with different oversampling ratios. In this document, this number is
calculated from the SNR by using Equation 3:
SINAD 1.76 dB 6.05 dB u ENOB
(3)
16
14
ENOB (bits)
12
10
8
6
4
sinc3
sinc2
sinc1
2
0
1
10
100
OSR
1000
D040
Figure 50. Measured Effective Number of Bits versus Oversampling Ratio
An example code for implementing a sinc3 filter in an FPGA is discussed in the Combining the ADS1202 with an
FPGA Digital Filter for Current Measurement in Motor Control Applications application note, available for
download at www.ti.com.
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9.2 Typical Applications
9.2.1 Frequency Inverter Application
Isolated ΔΣ modulators are being widely used in frequency inverter designs because of their high ac and dc
performance. Frequency inverters are critical parts of industrial motor drives, photovoltaic inverters (string and
central inverters), uninterruptible power supplies (UPS), electrical and hybrid electrical vehicles, and other
industrial applications.
Figure 51 shows a simplified schematics of the AMC1306Mx in a typical frequency inverter application as used in
industrial motor drives with shunt resistors (RSHUNT) used for current sensing. Depending on the system design,
either all three or only two motor phase currents are sensed.
The Manchester coded bitstream output of the AMC1306Ex minimizes the wiring efforts of the connection
between the power board and the control board; see Figure 52. This bitstream output also allows the clock to be
generated locally on the power board without the having to adjust the propagation delay time of each DOUT
connection to fulfill the setup and hold time requirements of the microcontroller.
In both examples, an additional fourth AMC1306 is used to support isolated voltage sensing of the dc link. This
high voltage is reduced using a high-impedance resistive divider and is sensed by the device across a smaller
resistor. The value of this resistor can degrade the performance of the measurement, as described in the Isolated
Voltage Sensing section.
Motor
DC link
RSHUNT
L1
RSHUNT
L3
RSHUNT
L2
AMC1306Mx
3.3 V
AVDD DVDD
AINP
CLKIN
AINN
DOUT
3.3 V
AGND DGND
TMS320F28x7x
AMC1306Mx
3.3 V
AVDD DVDD
AINP
CLKIN
AINN
DOUT
AINP
CLKIN
AINN
DOUT
CLKIN
AINN
DOUT
3.3 V
SD-D1
SD-C1
SD-D2
SD-C2
SD-D3
SD-C3
3.3 V
SD-D4
SD-C4
AGND DGND
AMC1306Mx
3.3 V
AVDD DVDD
AINP
AGND DGND
AMC1306Mx
3.3 V
AVDD DVDD
CDCLVC1104
PWMx
3.3 V
AGND DGND
Power Board
Control Board
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Figure 51. The AMC1306Mx in a Frequency Inverter Application
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Typical Applications (continued)
Motor
DC link
RSHUNT
L1
RSHUNT
L3
RSHUNT
L2
AMC1306Ex
3.3 V
AVDD DVDD
AINP
CLKIN
AINN
DOUT
3.3 V
AGND DGND
TMS320F28x7x
AMC1306Ex
3.3 V
AINP
CLKIN
AINN
DOUT
CLKIN
AINN
DOUT
3.3 V
SD-D1
SD-D2
SD-D3
SD-D4
3.3 V
AGND DGND
AMC1306Ex
3.3 V
AVDD DVDD
AINP
AGND DGND
AMC1306Ex
3.3 V
AVDD DVDD
AVDD DVDD
AINP
CLKIN
AINN
DOUT
3.3 V
AGND DGND
Clock Source
Power Board
Control Board
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Figure 52. The AMC1306Ex in a Frequency Inverter Application
9.2.1.1 Design Requirements
Table 1 lists the parameters for the typical application in the Frequency Inverter Application section.
Table 1. Design Requirements
PARAMETER
VALUE
High-side supply voltage
3.3 V or 5 V
Low-side supply voltage
3.3 V or 5 V
Voltage drop across the shunt for a linear response
±250 mV (maximum)
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9.2.1.2 Detailed Design Procedure
The high-side power supply (AVDD) for the AMC1306 device is derived from the power supply of the upper gate
driver. Further details are provided in the Power Supply Recommendations section.
The floating ground reference (AGND) is derived from one of the ends of the shunt resistor that is connected to
the negative input of the AMC1306 (AINN). If a four-pin shunt is used, the inputs of the device are connected to
the inner leads and AGND is connected to one of the outer shunt leads.
Use Ohm's Law to calculate the voltage drop across the shunt resistor (VSHUNT) for the desired measured
current: VSHUNT = I × RSHUNT.
Consider the following two restrictions to choose the proper value of the shunt resistor RSHUNT:
• The voltage drop caused by the nominal current range must not exceed the recommended differential input
voltage range: VSHUNT ≤ ±250 mV
• The voltage drop caused by the maximum allowed overcurrent must not exceed the input voltage that causes
a clipping output: VSHUNT ≤ VClipping
The typically recommended RC filter in front of a ΔΣ modulator to improve signal-to-noise performance of the
signal path is not required for the AMC1306. By design, the input bandwidth of the analog front-end of the device
is limited as specified in the Electrical Characteristics table.
For modulator output bitstream filtering, a device from TI's TMS320F2807x family of low-cost microcontrollers
(MCUs) or TMS320F2837x family of dual-core MCUs is recommended. These families support up to eight
channels of dedicated hardwired filter structures that significantly simplify system level design by offering two
filtering paths per channel: one providing high accuracy results for the control loop and one fast response path
for overcurrent detection.
9.2.1.3 Application Curve
In motor control applications, a very fast response time for overcurrent detection is required. The time for fully
settling the filter in case of a step-signal at the input of the modulator depends on the filter order; that is, a sinc3
filter requires three data updates for full settling (with fDATA = fCLK / OSR). Therefore, for overcurrent protection,
filter types other than sinc3 can be a better choice; an alternative is the sinc2 filter. Figure 53 compares the
settling times of different filter orders.
The delay time of the sinc filter with a continuous signal is half of the settling time.
16
14
ENOB (Bits)
12
10
8
6
4
sinc1
sinc2
sinc3
2
0
0
2
4
6
8
10
12
14
Settling Time (µs)
16
18
20
D041
Figure 53. Measured Effective Number of Bits versus Settling Time
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9.2.2 Isolated Voltage Sensing
The AMC1306 is optimized for usage in current-sensing applications using low-impedance shunts. However, the
device can also be used in isolated voltage-sensing applications if the affect of the (usually higher) impedance of
the resistor used in this case is considered.
High Voltage
Potential
3.3 V
or 5 V
R1
AVDD
R2
R4
AINP
RIND
200 NŸ
IIB
R3
R5
û Modulator
AINN
R4'
R3'
R5'
AGND
VCM = 1.9 V
AGND
Figure 54. Using the AMC1306 for Isolated Voltage Sensing
9.2.2.1
Design Requirements
Figure 54 shows a simplified circuit typically used in high-voltage-sensing applications. The high impedance
resistors (R1 and R2) are used as voltage dividers and dominate the current value definition. The resistance of
the sensing resistor R3 is chosen to meet the input voltage range of the AMC1306. This resistor and the
differential input impedance of the device (the AMC1306x25 is 22 kΩ, the AMC1306x05 is 4.9 kΩ) also create a
voltage divider that results in an additional gain error. With the assumption of R1, R2, and RIN having a
considerably higher value than R3, the resulting total gain error can be estimated using Equation 4, with EG
being the gain error of the AMC1306.
EGtot = EG +
R3
RIN
(4)
This gain error can be easily minimized during the initial system-level gain calibration procedure.
9.2.2.2 Detailed Design Procedure
As indicated in Figure 54, the output of the integrated differential amplifier is internally biased to a common-mode
voltage of 1.9 V. This voltage results in a bias current IIB through the resistive network R4 and R5 (or R4' and
R5') used for setting the gain of the amplifier. The value range of this current is specified in the Electrical
Characteristics table. This bias current generates additional offset error that depends on the value of the resistor
R3. The initial system offset calibration does not minimize this effect because the value of the bias current
depends on the actual common-mode amplitude of the input signal (as illustrated in Figure 55). Therefore, in
systems with high accuracy requirements, a series resistor is recommended to be used at the negative input
(AINN) of the AMC1306 with a value equal to the shunt resistor R3 (that is, R3' = R3 in Figure 54) to eliminate
the effect of the bias current.
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This additional series resistor (R3') influences the gain error of the circuit. The effect can be calculated using
Equation 5 with R5 = R5' = 50 kΩ and R4 = R4' = 2.5 kΩ (for the AMC1306x05) or 12.5 kΩ (for the
AMC1306x25).
E G (%)
R4 ·
§
¨ 1 R4' R3' ¸ u 100%
©
¹
(5)
9.2.2.3 Application Curve
Figure 55 shows the dependency of the input bias current on the common-mode voltage at the input of the
AMC1306.
60
40
IIB (PA)
20
0
-20
-40
-60
-80
-0.5
0
0.5
1
1.5
VCM (V)
2
2.5
3
3.5
D005
Figure 55. Input Bias Current vs Common-Mode Input Voltage
9.2.3 Do's and Don'ts
Do not leave the inputs of the AMC1306 unconnected (floating) when the device is powered up. If both modulator
inputs are left floating, the input bias current drives these inputs to the output common-mode of the analog frontend of approximately 2 V. If that voltage is above the specified input common-mode range, the front gain
diminishes and the modulator outputs a bitstream resembling a zero input differential voltage.
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10 Power Supply Recommendations
In a typical frequency-inverter application, the high-side power supply (AVDD) for the device is directly derived
from the floating power supply of the upper gate driver. For lowest system-level cost, a Zener diode can be used
to limit the voltage to 5 V or 3.3 V (±10%). Alternatively a low-cost low-drop regulator (LDO), for example the
LM317-N, can be used to adjust the supply voltage level and minimize noise on the power-supply node. A lowESR decoupling capacitor of 0.1 µF is recommended for filtering this power-supply path. Place this capacitor (C2
in Figure 56) as close as possible to the AVDD pin of the AMC1306 for best performance. If better filtering is
required, an additional 10-µF capacitor can be used.
The floating ground reference (AGND) is derived from the end of the shunt resistor that is connected to the
negative input (AINN) of the device. If a four-pin shunt is used, the device inputs are connected to the inner leads
and AGND is connected to one of the outer leads of the shunt.
For decoupling of the digital power supply on the controller side, a 0.1-µF capacitor is recommended to be
placed as close to the DVDD pin of the AMC1306 as possible, followed by an additional capacitor in the range of
1 µF to 10 µF.
R1
800
Gate Driver
Z1
1N751A
C1
10 F
AMC1306Mx
5.1 V
AVDD
C2
0.1 F
AGND
RSHUNT
AINN
To Load
AINP
3.0 V,
3.3 V,
or 5.0 V
DVDD
Reinforced Isolation
HV+
Floating
Power Supply
20 V
C4
0.1 F
C5
2.2 F
DGND
DOUT
SD-Dx
CLKIN
SD-Cx
PWMx
Gate Driver
TMS320F2837x
HV-
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Figure 56. Decoupling the AMC1306
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11 Layout
11.1 Layout Guidelines
A layout recommendation showing the critical placement of the decoupling capacitors (as close as possible to the
AMC1306) and placement of the other components required by the device is shown in Figure 57. For best
performance, place the shunt resistor close to the VINP and VINN inputs of the AMC1306 and keep the layout of
both connections symmetrical.
11.2 Layout Example
Clearance area,
to be kept free of any
conductive materials.
0.1 µF
0.1 µF
2.2 µF
SMD
0603
SMD
0603
SMD
0603
SMD
0603
AVDD
Shunt Resistor
To Floating
Power
Supply
2.2 µF
1
8
DVDD
CLKIN
From Clock
Source
AINN
DOUT
To Digital
Filter
(MCU)
AGND
DGND
AINP
AMC1306x
LEGEND
Copper Pour and Traces
High-Side Area
Controller-Side Area
Via to Ground Plane
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Via to Supply Plane
Figure 57. Recommended Layout of the AMC1306x
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Device Nomenclature
12.1.1.1 Isolation Glossary
See the Isolation Glossary
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
• AMC1210 Quad Digital Filter for 2nd-Order Delta-Sigma Modulator
• MSP430F677x Polyphase Metering SoCs
• TMS320F2807x Piccolo™ Microcontrollers
• TMS320F2837xD Dual-Core Delfino™ Microcontrollers
• ISO72x Digital Isolator Magnetic-Field Immunity
• Combining the ADS1202 with an FPGA Digital Filter for Current Measurement in Motor Control Applications
• CDCLVC11xx 3.3-V and 2.5-V LVCMOS High-Performance Clock Buffer Family
12.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to order now.
Table 2. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
AMC1306E05
Click here
Click here
Click here
Click here
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AMC1306E25
Click here
Click here
Click here
Click here
Click here
AMC1306M05
Click here
Click here
Click here
Click here
Click here
AMC1306M25
Click here
Click here
Click here
Click here
Click here
12.4 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.5 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.6 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
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12.7 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AMC1306E25DWV
PREVIEW
SOIC
DWV
8
64
TBD
Call TI
Call TI
-40 to 125
AMC1306E25DWVR
PREVIEW
SOIC
DWV
8
1000
TBD
Call TI
Call TI
-40 to 125
AMC1306M25DWV
PREVIEW
SOIC
DWV
8
64
TBD
Call TI
Call TI
-40 to 125
AMC1306M25DWVR
PREVIEW
SOIC
DWV
8
1000
TBD
Call TI
Call TI
-40 to 125
1306E25
1306M25
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2017
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
AMC1306M25DWVR
Package Package Pins
Type Drawing
SOIC
DWV
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
12.05
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
6.15
3.3
16.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AMC1306M25DWVR
SOIC
DWV
8
1000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
DWV0008A
SOIC - 2.8 mm max height
SCALE 2.000
SOIC
C
SEATING PLANE
11.5 0.25
TYP
PIN 1 ID
AREA
0.1 C
6X 1.27
8
1
2X
3.81
5.95
5.75
NOTE 3
4
5
0.51
0.31
0.25
C A
8X
A
7.6
7.4
NOTE 4
B
B
2.8 MAX
0.33
TYP
0.13
SEE DETAIL A
(2.286)
0.25
GAGE PLANE
0 -8
0.46
0.36
1.0
0.5
(2)
DETAIL A
TYPICAL
4218796/A 09/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DWV0008A
SOIC - 2.8 mm max height
SOIC
8X (1.8)
SEE DETAILS
SYMM
8X (0.6)
SYMM
6X (1.27)
(10.9)
LAND PATTERN EXAMPLE
9.1 mm NOMINAL CLEARANCE/CREEPAGE
SCALE:6X
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
0.07 MAX
ALL AROUND
METAL
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4218796/A 09/2013
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DWV0008A
SOIC - 2.8 mm max height
SOIC
8X (1.8)
SYMM
8X (0.6)
SYMM
6X (1.27)
(10.9)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4218796/A 09/2013
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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