Product Folder Order Now Support & Community Tools & Software Technical Documents LMK04832 SNAS752 – AUGUST 2017 LMK04832 Ultra Low-Noise JESD204B Compliant Clock Jitter Cleaner With Dual Loop PLLs 1 Features 3 Description • • The LMK04832 is the industry's highest performance clock conditioner with JEDEC JESD204B support and is also pin compatible with the LMK0482x family of devices. • • • • • • • • • • • • Maximum Clock Output Frequency: 3250 MHz Multi-Mode: Dual PLL, Single PLL, and Clock Distribution Ultra-Low Noise, at 3200 MHz: – 47 fs RMS Jitter (12 kHz to 20 MHz) – 50 fs RMS Jitter (100 Hz to 100 MHz) – –158 dBc/Hz Noise Floor PLL2 – PLL FOM of –230 dBc/Hz – PLL 1/f of –126 dBc/Hz – Phase Detector Rate up to 320 MHz – Two Integrated VCOs: 2495 to 2705 MHz and 2945 to 3205 MHz Up to 14 Differential Device Clocks – CML, LVPECL, LCPECL, HSDS, LVDS, and 2xLVCMOS Programmable Outputs Up to 1 Buffered VCXO/XO Output – LVPECL, LVDS, 2xLVCMOS Programmable Capable of 3.13-MHz Device Clock from 3.2 GHz Capable of 391-kHz SYSREF from 3.2 GHz 25-ps Step Analog Delay for SYSREF Clocks Digital Delay and Dynamic Digital Delay for Device Clock and SYSREF Holdover Mode with PLL1 0-Delay with PLL1 or PLL2 +125°C Junction Temperature Supports 105°C PCB Temperature (Measured at Thermal Pad) The 14 clock outputs from PLL2 can be configured to drive seven JESD204B converters or other logic devices using device and SYSREF clocks. SYSREF can be provided using both DC and AC coupling. Not limited to JESD204B applications, each of the 14 outputs can be individually configured as high performance outputs for traditional clocking systems. The LMK04832 can be configured for operation in dual PLL, single PLL, or clock distribution modes with or without SYSREF generation or reclocking. PLL2 may operate with either internal or external VCO. The high performance combined with features like the ability to trade off between power and performance, dual VCOs, dynamic digital delay, and holdover make the LMK04832 ideal for providing flexible high performance clocking trees. Device Information(1) PART NUMBER LMK04832NKDT LMK04832NKDR Test and Measurement RADAR Microwave Backhaul Data Converter Clocking WQFN (64) BODY SIZE (NOM) 9 mm x 9 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) T = Tape; R = Reel Simplified Schematic Recovered ³GLUW\´ FORFN RU clean clock VCXO or XO CLKout10 LMX2594 CLKout11 PLL+VCO CLKin0 Backup Reference Clock CLKin1 2 Applications • • • • DESCRIPTION CLKout0 & CLKout2 ADC CLKout1 & CLKout3 0XOWLSOH ³FOHDQ´ clocks at different frequencies OSCout CLKout8 CLKout9 LMK04832 FPGA CLKout4 & CLKout6 CLKout5 & CLKout7 CLKout12, CLKout13 DAC DAC Serializer/ Deserializer Copyright © 2017, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. ADVANCE INFORMATION for pre-production products; subject to change without notice. ADVANCE INFORMATION 1 LMK04832 SNAS752 – AUGUST 2017 www.ti.com Table of Contents 1 2 3 4 5 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Device and Documentation Support.................... 5.2 5.3 5.4 5.5 1 1 1 2 3 6 5.1 Device Support ........................................................ 3 Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 3 3 3 3 Mechanical, Packaging, and Orderable Information ............................................................. 3 4 Revision History DATE REVISION NOTES August 2017 * Initial release. ADVANCE INFORMATION 2 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LMK04832 LMK04832 www.ti.com SNAS752 – AUGUST 2017 5 Device and Documentation Support 5.1 Device Support 5.1.1 Development Support 5.1.1.1 Clock Architect Part selection, loop filter design, simulation. To run the online Clock Architect tool, go to www.ti.com/clockarchitect. 5.1.1.2 PLLatinum Sim Supports loop filter design and simulation. All simulation is for a single loop, to perform dual loop simulations, the result of the first PLL sim must be loaded as a reference to the second PLL sim. To download PLLatinum Sim tool, go to www.ti.com/tool/PLLATINUMSIM-SW EVM programming software. Can also be used to generate register map for programming and calculate current consumption estimate. For TICS Pro, go to www.ti.com/tool/TICSPRO-SW 5.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 5.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 5.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 5.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 6 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This data is subject to change without notice and revision of this document. Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Product Folder Links: LMK04832 3 ADVANCE INFORMATION 5.1.1.3 TICS Pro PACKAGE OPTION ADDENDUM www.ti.com 19-Sep-2017 PACKAGING INFORMATION Orderable Device Status (1) PLMK04832NKDT ACTIVE Package Type Package Pins Package Drawing Qty WQFN NKD 64 250 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) TBD Call TI Call TI Op Temp (°C) Device Marking (4/5) -40 to 85 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 Samples PACKAGE OUTLINE NKD0064A WQFN - 0.8 mm max height SCALE 1.600 WQFN 9.1 8.9 B A PIN 1 INDEX AREA 0.5 0.3 9.1 8.9 0.3 0.2 DETAIL OPTIONAL TERMINAL TYPICAL 0.8 MAX C SEATING PLANE (0.1) TYP 7.2 0.1 SEE TERMINAL DETAIL 32 17 60X 0.5 33 16 4X 7.5 1 PIN 1 ID (OPTIONAL) 48 64 49 64X 0.5 0.3 64X 0.3 0.2 0.1 0.05 C A C B 4214996/A 08/2013 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT NKD0064A WQFN - 0.8 mm max height WQFN ( 7.2) SYMM 64X (0.6) 64X (0.25) 64 SEE DETAILS 49 1 48 60X (0.5) SYMM (8.8) (1.36) TYP ( 0.2) VIA TYP 8X (1.31) 16 33 32 17 (1.36) TYP 8X (1.31) (8.8) LAND PATTERN EXAMPLE SCALE:8X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND METAL SOLDER MASK OPENING SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) METAL SOLDER MASK DEFINED SOLDER MASK DETAILS 4214996/A 08/2013 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note in literature No. SLUA271 (www.ti.com/lit/slua271). www.ti.com EXAMPLE STENCIL DESIGN NKD0064A WQFN - 0.8 mm max height WQFN SYMM 64X (0.6) 64X (0.25) (1.36) TYP 64 49 1 48 (1.36) TYP 60X (0.5) SYMM (8.8) METAL TYP 33 16 32 17 25X (1.16) (8.8) SOLDERPASTE EXAMPLE BASED ON 0.125mm THICK STENCIL EXPOSED PAD 65% PRINTED SOLDER COVERAGE BY AREA SCALE:10X 4214996/A 08/2013 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated