Foshan LV2045BCT Schottky barrier diode in a to-263 plastic package Datasheet

LV2045BCT
Rev.F May.-2016
描述
/
DATA SHEET
Descriptions
TO-263 塑封封装肖特基二极管。
Schottky Barrier Diode in a TO-263 Plastic Package.

特征
/ Features
低正向压降,低功耗,效率高。
Low forward voltage drop,low power losses,High efficiency operation.
用途
/
Applications
用于高频率逆变器,开关电源,续流二极管,OR-ing 二极管,DC-DC 转换器和电池反向保护。
For use in high frequency inverters, switching power supplies, freewheeling diodes, OR-ing diode,
dc-to-dc converters and reverse battery protection.
内部等效电路
引脚排列
1
/ Equivalent Circuit
/ Pinning
2
4
3
PIN1:Anode
放大及印章代码
PIN 2、4:Cathode
PIN 3:Anode
/ hFE Classifications & Marking
见印章说明。See Marking Instructions.
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LV2045BCT
Rev.F May.-2016
极限参数
/
DATA SHEET
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Reverse Voltage
符号
Symbol
VRRM
VRWM
VDC
数值
Rating
单位
Unit
45
V
VRMS
31.5
V
IF
2 X 10
A
Non Repetitive Peak Surge Current
IFSM
160
A
Thermal Resistance Junction to Case
RθJc
2.8
℃/W
Tj Tstg
-40~+150
℃
RMS Reverse Voltage
Average forward rectified Current
Junction and Storage Temperature Range
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Reverse Voltage
Forward Voltage
Instantaneous Reverse Current
符号
Symbol
V(BR)R
VFM
IR
(Note 1)
测试条件
Test Conditions
IR =1mA
Ta=25℃
最小值 典型值 最大值
Min
Typ
Max
45
单位
Unit
V
IF =5.0A
Ta=25℃
0.38
IF =10A
Ta=25℃
0.43
IF =5.0A
Ta=125℃
0.28
IF =10A
Ta=125℃
0.37
0.45
V
VR=45V Ta=25℃
80
200
uA
VR=45V Ta=125℃
30
100
mA
V
0.48
V
V
注/Notes:
1. 使用极短的测试时间,以尽量减少自热效应。/Short duration pulse test used to minimize self-heating
effect.
2. 除非特别注明,数值为一个芯片的参数。/ Unless otherwise noted, values for the parameters of a
single chip
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LV2045BCT
Rev.F May.-2016
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
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LV2045BCT
Rev.F May.-2016
外形尺寸图
DATA SHEET
/ Package Dimensions
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LV2045BCT
Rev.F May.-2016
印章说明
/
DATA SHEET
Marking Instructions
BR
CT
****
LV2045
说明:
BR: 


为公司代码
LV2045:

为产品型号
CT:  


为内部结构
****:


为生产批号代码,随生产批号变化。
Note:
BR:  

LV2045:
Company Code
Product Type.
CT:

Internal Structure
****:

Lot No. Code, code change with Lot No.
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LV2045BCT
Rev.F May.-2016
DATA SHEET
回流焊温度曲线图(无铅)
/
Temperature Profile for IR Reflow Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 245±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:245±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:260±5℃
包装规格
Package Type
封装形式
TO-263
套管包装
Package Type
封装形式
使用说明
Temp.:260±5℃
Time:10±1 sec
/ Packaging SPEC.
卷盘包装
TO-263
时间:10±1 sec.
/ REEL
Units 包装数量
Dimension
Units/Reel
只/卷盘
Reels/Inner Box
卷盘/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
800
1
800
5
4,000
包装尺寸
3
(unit:mm )
Reel
Inner Box 盒
Outer Box 箱
13〞×24
360×360×50
385×257×392
/ TUBE
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
Units/Tube
只/套管
Tubes/Inner Box
套管/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Tube 套管
Inner Box 盒
Outer Box 箱
50
20
1,000
5
5,000
532×33×7.0
555×164×50
575×290×180
/ Notices
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