Material Content Data Sheet Sales Product Name IFX27001TF V15 MA# MA000724054 Package PG-TO252-3-11 Issued 29. August 2013 Weight* 379.50 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 2.924 0.77 0.234 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.77 7705 7705 618 0.070 0.02 234.187 61.71 61.79 617101 185 617904 0.158 0.04 0.04 417 417 0.267 0.07 704 12.284 3.24 120.970 31.88 35.19 318765 351838 3.740 0.99 0.99 9855 9855 0.091 0.02 0.000 0.00 0.114 0.03 0.091 0.02 4.364 1.15 32369 239 0.02 1 241 1.20 11499 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 240 301 12041 1000000