LITEON LTL2V3WFK Through hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL2V3WFK
Spec No.: DS20-2010-0101
Effective Date: 02/22/2011
Revision: -
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
.
Features
* Lead (Pb) free product – RoHS compliant.
* High luminous intensity output.
* Low power consumption.
* High efficiency & reliability.
* Versatile mounting on P.C. board or panel.
* I.C. Compatible/low current requirements.
* Popular T-13/4 diameter.
Package Dimensions
Part No.
Lens
Source Color
LTL2V3WFK
White Diffused
AlInGaP Yellow Orange
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
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Absolute Maximum Ratings at TA=25°C
Parameter
Power Dissipation
Maximum Rating
Unit
120
mW
90
mA
50
mA
0.75
mA/°C
5
V
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
Derating Linear From 40°C
Reverse Voltage
Operating Temperature Range
-40°C to + 80°C
Storage Temperature Range
-55°C to + 100°C
Lead Soldering Temperature
[2 mm(.08") From Body]
260°C for 5 Seconds Max.
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Electrical / Optical Characteristics at TA=25°C
Parameter
Luminous Intensity
Symbol
Min.
IV
3200
Typ.
Max.
Unit
9300
mcd
2θ1/2
30
deg
Peak Emission Wavelength
λP
611
nm
Dominant Wavelength
λd
Spectral Line Half-Width
Δλ
Forward Voltage
VF
Reverse Current
IR
Viewing Angle
600
605
610
17
1.8
2.0
nm
Test Condition
IF = 20mA
Note 1
Note 2 (Fig.5)
Measurement
@Peak (Fig.1)
Note 4
nm
2.4
V
IF = 20mA
100
μA
VR = 5V
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Iv classification code is marked on each packing bag.
4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
5. The Iv guarantee should be added ±15% .
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Typical Electrical / Optical Characteristics Curves
(25°C Ambient Temperature Unless Otherwise Noted)
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Packing Spec
1000, 500 or 250 pcs per packing bag
8 packing bags per inner carton
total 8000 pcs per inner carton
8 Inner cartons per outer carton
total 64000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
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Optical/Electrical Bin Table
Iv Spec. Table Specification
Luminous Intensity
Unit : mcd @20mA
Bin Code
Min.
Max.
U
3200
4200
V
4200
5500
W
5500
7200
X
7200
9300
Luminous Intensity Measurement allowance is ±15%
Hue Spec. Table Specification.
Dominant Wavelength
Unit : nm @20mA
Bin Code
Min.
Max.
H23
600.0
603.0
H24
603.0
606.5
H25
606.5
610.0
Note Tolerance of measurement precision ±1nm
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for
information on applications in which exceptional reliability is required, particularly when the failure or
malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic
control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
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6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
 Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
 All devices, equipment, and machinery must be properly grounded
 Work tables, storage racks, etc. should be properly grounded
 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing
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Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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8. Reliability Test
Classification
Test Item
Operation Life
Test Condition
Ta = 25°C
IF = 50mA
*Test Time= 1000hrs (-24hrs,+72hrs)
Steady state
Ta = 60°C, RH= 90 %
Operation Life of
IF = 20mA
High Humidity Heat *Test Time= 500hrs±2hrs
Endurance
Test
Reference Standard
MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)
MIL-STD-202F: 103B(1980)
JIS C 7021 : B-11(1982)
Steady state
Operation Life of
Low Temperature
Ta = -30°C
IF = 20mA
*Test Time= 1000hrs (-24hrs,+72hrs)
High Temperature
Storage
Ta= 105±5°C
*Test Time= 1000hrs (-24hrs,+72hrs)
MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)
Low Temperature
Storage
Ta= -55±5°C
*Test Time= 1000hrs (-24hrs,+72hrs)
JIS C 7021:B-12 (1982)
Temperature
Cycling
105°C ~ 25°C ~ -55°C ~ 25°C
30mins 5mins
30mins 5mins
*Test time: 100 Cycles
MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021: A-4(1982)
Thermal
Shock
105 ± 5°C ~ -55°C ± 5°C
10mins
10mins
*Test time: 100 Cycles
MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)
Solder
Resistance
T.sol = 260 °C Max.
Dwell Time= 5sec. Max.
*Test time: 1 time
MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021: A-1(1982)
Solderability
T. sol = 235 ± 5°C
Dwell Time= 5 ± 1secs
*Test time: 1 time
MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
JIS C 7021: A-2(1982)
Environmental
Test
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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