Material Content Data Sheet Sales Product Name IPG20N06S4L-11 MA# MA001038274 Package PG-TDSON-8-4 Issued 12. December 2014 Weight* 98.23 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus tin silver lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-31-5 7440-22-4 7439-92-1 3.729 3.80 0.045 0.05 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.80 37967 37967 455 0.013 0.01 44.654 45.45 45.51 454590 137 455182 0.758 0.77 0.77 7719 7719 0.087 0.09 885 6.170 6.28 37.193 37.86 44.23 378634 442330 1.308 1.33 1.33 13312 13312 0.048 0.05 0.000 0.00 0.084 0.09 0.106 0.11 4.034 4.11 62811 489 0.05 1 1075 4.31 41065 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 490 860 43000 1000000