CYStech Electronics Corp. Spec. No. : C302SH Issued Date : 2012.08.16 Revised Date : Page No. : 1/6 Small Signal Schottky diode BAT54SH Description Planar silicon Schottky barrier diode encapsulated in a SOD-123 very small plastic SMD package. Features •Guard ring protected •Low forward voltage drop •Very small plastic SMD package •Pb-free lead plating and halogen-free package Mechanical Data • Case: Molded plastic, JEDEC SOD-123. • Terminals: Pure tin plated, solderable per MIL-STD-202 method 208 • Polarity: Indicated by cathode band. • Weight: 0.01 gram approximately Symbol Outline BAT54SH SOD-123 Ordering Information Device BAT54SH BAT54SH Package SOD-123 (Pb-free lead plating and halogen-free package) Shipping Marking 3000 pcs / Tape & Reel JV CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302SH Issued Date : 2012.08.16 Revised Date : Page No. : 2/6 Absolute Maximum Ratings Symbol VR IF IFRM IFSM Ptot Tstg Tj Tamb Parameter continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current total power dissipation storage temperature operating junction temperature range operating ambient temperature range Conditions tp≤1s, δ≤0.5 tp<10ms Tamb≤25℃ Min -65 -65 -65 Max 30 200 300 600 400 +150 +125 +125 Unit V mA mA mA mW ℃ ℃ ℃ Characteristics (Ta=25°C, unless otherwise specified) Parameter Reverse Breakdown Voltage Forward Voltage (Note ) Symbol Condition Min. Max. Unit VBR IR=100μA 30 - V VF(1) IF=0.1mA - 240 mV VF(2) IF=1mA - 320 mV VF(3) IF=10mA - 400 mV VF(4) IF=30mA - 500 mV VF(5) IF=100mA - 800 mV Reverse Leakage Current (Note ) IR VR=25V - 2 μA Diode Capacitance CD - 10 pF Reverse Recovery Time trr VR=1V, f=1MHz when switched from IF= 10mA to IR=10mA; RL=100Ω; measured at IR=1mA - 5 ns Notes: pulse test, tp=300μs, duty cycle<2%. Thermal Characteristics Symbol Parameter Rth j-a thermal resistance from junction to ambient Conditions Value Unit note 1 250 K/W Note 1 : Device mounted on a FR-4 PCB BAT54SH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302SH Issued Date : 2012.08.16 Revised Date : Page No. : 3/6 Typical Characteristics Forward Current & Forward Voltage Diode Capacitance & Reverse-Biased Voltage 100 250 Diode Capacitance-Cd (pF) Forward Current-IF (mA) 200 150 100 10 50 0 1 0 200 400 600 Forward Voltage-VF (mV) BAT54SH 800 1000 0.1 1 10 100 Reverse Biased Voltage-VR (V) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302SH Issued Date : 2012.08.16 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension BAT54SH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302SH Issued Date : 2012.08.16 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BAT54SH CYStek Product Specification CYStech Electronics Corp. Spec. No. : C302SH Issued Date : 2012.08.16 Revised Date : Page No. : 6/6 SOD-123 Dimension Marking: JV 2-Lead SOD-123 Plastic Surface Mounted Package CYStek Package Code: SH Inches Min. Max. 0.102 0.110 0.059 0.067 0.041 0.049 DIM A B C Millimeters Min. Max. 2.600 2.800 1.500 1.700 1.050 1.250 Style: Pin 1.Cathode 2.Anode DIM D E Inches Min. Max. 0.018 0.026 0.140 0.152 Millimeters Min. Max. 0.450 0.650 3.550 3.850 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BAT54SH CYStek Product Specification