TI1 LM57FPW Resistor-programmable temperature switch and analog temperature sensor Datasheet

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LM57
SNIS152E – MAY 2009 – REVISED JULY 2015
LM57 Resistor-Programmable Temperature Switch and Analog Temperature Sensor
1 Features
3 Description
•
The LM57 device is a precision, dual-output,
temperature switch with analog temperature sensor
output for wide temperature industrial applications.
The trip temperature (TTRIP) is selected from 256
possible values in the range of –40°C to 150°C. The
VTEMP is a class AB analog voltage output that is
proportional to temperature with a programmable
negative temperature coefficient (NTC). Two external
1% resistors set the TTRIP and VTEMP slope. The
digital and analog outputs enable protection and
monitoring of system thermal events.
1
•
•
•
•
•
•
•
•
•
See LM57-Q1 Data Sheet for AEC-Q100 Grade
1/Grade 0/Grade 0 Extended (Qualified and
Manufactured on an Automotive Grade Flow)
Trip Temperature Set by External Resistors with
Accuracy of ±1.7°C or ±2.3°C from −40°C to
+150°C
Resistor Tolerance Contributes Zero Error
Push-Pull and Open-Drain Switch Outputs
Wide Operating Temperature Range of −50°C to
150°C
Very Linear Analog VTEMP Temp Sensor Output
with ±0.8°C or ±1.3°C Accuracy from −50°C to
+150°C
Short-Circuit Protected Analog and Digital Outputs
Latching Function for Digital Outputs
TRIP-TEST Pin Allows In-System Testing
Low Power Minimizes Self-Heating to Under
0.02°C
2 Applications
•
•
•
•
•
•
Factory Automation
Industrial
Automotive
Down Hole
Avionics
Telecom Infrastructure
Built-in thermal hysteresis (THYST) prevents the digital
outputs from oscillating. The TOVER and TOVER digital
outputs will assert when the die temperature exceeds
TTRIP and will de-assert when the temperature falls
below a temperature equal to TTRIP minus THYST.
TOVER is active-high with a push-pull structure. TOVER
is active-low with an open-drain structure. Tying
TOVER to TRIP-TEST will latch the output after it trips.
The output can be cleared by forcing TRIP-TEST low.
Driving the TRIP-TEST high will assert the digital
outputs. A processor can check the state of TOVER or
TOVER , confirming they changed to an active state.
This allows for in situ verification that the comparator
and output circuitry are functional after system
assembly. When TRIP-TEST is high, the trip-level
reference voltage appears at the VTEMP pin. The
system could then use this voltage to calculate the
threshold of the LM57.
Device Information
PART NUMBER
PACKAGE
(1) (2)
BODY SIZE (NOM)
LM57BISD
WSON (8)
2.50 mm × 2.50 mm
LM57FPW
TSSOP (8)
3.00 mm × 6.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) For device comparison see Device Comparison Table .
LM57 Overtemperature Alarm
Temperature Transfer Function
VDD Supply
(+2.4V to +5.5V)
3,500
J2 (-5.166mV/°C)
J3 (-7.752mV/°C)
J4 (-10.339mV/°C)
J5 (-12.924mV/°C)
VDD
VTEMP
Analog
ADC Input
LM57
Microcontroller
RSENSE1
RSENSE2
SENSE1
TOVER
SENSE2
TOVER
TRIP TEST
Digital In
Digital Out
VTEMP VOLTAGE (mV)
3,000
2,500
2,000
1,500
1,000
GND
500
0
-50
-25
0
25
50
75
100
125
150
TEMPERTURE (ƒC)
C101
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM57
SNIS152E – MAY 2009 – REVISED JULY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
8
1
1
1
2
3
4
5
Absolute Maximum Ratings ...................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 5
Thermal Information .................................................. 6
Electrical Characteristics - Accuracy Characteristics –
Trip Point Accuracy.................................................... 7
Electrical Characteristics - Accuracy Characteristics –
VTEMP Analog Temperature Sensor Output
Accuracy .................................................................... 7
Electrical Characteristics........................................... 8
Switching Characteristics .......................................... 9
Typical Characteristics ........................................... 10
Detailed Description ............................................ 12
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
12
12
13
23
Application and Implementation ........................ 26
9.1 Application Information............................................ 26
9.2 Typical Application .................................................. 26
10 Power Supply Recommendations ..................... 28
11 Layout................................................................... 28
11.1 Layout Guidelines ................................................. 28
11.2 Layout Example .................................................... 29
11.3 Temperature Considerations................................. 30
12 Device and Documentation Support ................. 31
12.1
12.2
12.3
12.4
12.5
Documentation Support .......................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
31
31
31
31
31
13 Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (February 2013) to Revision E
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Added TSSOP Package option throughout data sheet .......................................................................................................... 1
Changes from Revision C (February 2010) to Revision D
•
2
Page
Changed layout of National Data Sheet to TI format ............................................................................................................. 1
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5 Device Comparison Table
ORDER NUMBER
PACKAGE
GRADE (TEMP RANGE)
VTEMP
ACCURACY
TRIP POINT
ACCURACY
HYSTERESIS
LM57BISD-5, LM57BISDX-5
WSON/SD/NGR
/DFN (8)
Commercial (-50°C to
150°C)
±0.8°C
±1.5°C
5°C
LM57BISD-10, LM57BISDX-10
WSON/SD/NGR
/DFN (8)
Commercial (-50°C to
150°C)
±0.8°C
±1.5°C
10°C
LM57CISD-5, LM57CISD-5
WSON/SD/NGR
/DFN (8)
Commercial (-50°C to
150°C)
±1.3°C
±2.3°C
5°C
LM57CISD-10, LM57CISDX-10
WSON/SD/NGR
/DFN (8)
Commercial (-50°C to
150°C)
±1.3°C
±2.3°C
10°C
LM57FPW, LM57FPWR
PW/TSSOP (8)
Commercial (-50°C to
150°C)
±1.3°C
±2.3°C
5°C
LM57TPW, LM57TPWR
PW/TSSOP (8)
Commercial (-50°C to
150°C)
±1.3°C
±2.3°C
10°C
LM57FSPWQ1, LM57FSPWRQ1
(1)
PW/TSSOP (8)
Automotive Grade 0
Extended (-50°C to
160°C)
±1.3°C
±2.3°C
5°C
LM57TSPWQ1, LM57TSPWRQ1
(1)
PW/TSSOP (8)
Automotive Grade 0
Extended (-50°C to
160°C)
±1.3°C
±2.3°C
10°C
LM57FEPWQ1, LM57FEPWRQ1
(1)
PW/TSSOP (8)
Automotive Grade 0
±1.3°C
Standard (-50°C to 150°C)
±2.3°C
5°C
LM57TEPWQ1, LM57TEPWRQ1
(1)
PW/TSSOP (8)
Automotive Grade 0
±1.3°C
Standard (-50°C to 150°C)
±2.3°C
10°C
LM57FQPWQ1, LM57FQPWRQ1
(1)
PW/TSSOP (8)
Automotive Grade 1
±1.3°C
Standard (-50°C to 125°C)
±2.3°C
5°C
LM57TQPWQ1, LM57TQPWRQ1
(1)
PW/TSSOP (8)
Automotive Grade 1
±1.3°C
Standard (-50°C to 125°C)
±2.3°C
10°C
(1)
For Automotive grade device complete datasheet see LM57-Q1.
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6 Pin Configuration and Functions
TSSOP/PW and WSON/SD/NGR/DFN Packages
8-Pin
Top View
GND
1
8
VTEMP
SENSE1
2
7
TOVER
SENSE2
3
6
TOVER
VDD
4
5
TRIP TEST
LM57
Pin Functions
PIN
NAME
GND
NO.
1
TYPE
EQUIVALENT CIRCUIT
Ground
—
DESCRIPTION
Power supply ground
VDD
SENSE1
2
Trip-point resistor sense. One of two sense pins which selects the
temperature at which TOVER and TOVER will assert.
—
GND
GND
VDD
SENSE2
3
Trip-point resistor sense. One of two sense pins which selects the
temperature at which TOVER and TOVER will assert.
—
GND
GND
VDD
4
Power
Supply voltage
VDD
TRIP
TEST
5
Digital
Input
1 PA
TRIP TEST pin. Active High input.
If TRIP TEST = 0 (default), then the VTEMP output has the analog
temperature sensor output voltage.
If TRIP TEST = 1, then TOVER and TOVER outputs are asserted and VTEMP =
VTRIP, the temperature trip voltage.
Tie this pin to ground if not used.
GND
TOVER
6
Digital
Output
GND
Overtemperature switch output
Active low, open-drain (see LM57 VTEMP Voltage-to-Temperature Equations
regarding required pullup resistor.)
Asserted when the measured temperature exceeds the Trip Point
Temperature or if TRIP TEST = 1
This pin may be left open if not used.
VDD
TOVER
7
Overtemperature switch output
Active high, push-pull
Asserted when the measured temperature exceeds the trip point
temperature or if TRIP TEST = 1
This pin may be left open if not used.
Digital
Output
GND
4
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Pin Functions (continued)
PIN
NAME
NO.
TYPE
EQUIVALENT CIRCUIT
DESCRIPTION
VDD
VSENSE
VTEMP
8
VTEMP analog voltage output
If TRIP TEST = 0, then VTEMP = VTS, temperature sensor output voltage
If TRIP TEST = 1, then VTEMP = VTRIP, temperature trip voltage
This pin may be left open if not used.
Analog
Output
GND
Thermal
Pad
(WSON
package
only)
—
—
—
Connected to GND
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Supply voltage
−0.3
6
V
Voltage at TOVER
−0.3
6
V
Voltage at TOVER , VTEMP, TRIP-TEST, SENSE1, and SENSE2
−0.3
(VDD + 0.3 V)
V
5
mA
150
°C
Current at any pin
−65
Storage temperature
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.
7.2 ESD Ratings
VALUE
UNIT
LM57BISD and LM57CISD in WSON package
V(ESD)
Electrostatic discharge
(1)
Human body model (HBM)
±5500
Charged-device model (CDM)
±1250
Machine Model (MM)
±450
V
LM57FPW and LM57TPW in TSSOP package
V(ESD)
(1)
(2)
(3)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(2)
Charged-device model (CDM), per JEDEC specification JESD22-C101
±2000
(3)
V
±750
The Human Body Model (HBM) is a 100-pF capacitor charged to the specified voltage then discharged through a 1.5-kΩ resistor into
each pin. The Machine Model (MM) is a 200 pF capacitor charged to the specified voltage then discharged directly into each pin. The
Charged Device Model (CDM) is a specified circuit characterizing an ESD event that occurs when a device acquires charge through
some triboelectric (frictional) or electrostatic induction processes and then abruptly touches a grounded object or surface.
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
NOM MAX
UNIT
Supply voltage
2.4
5.5
V
Free air temperature range (TMIN ≤ TA ≤ TMAX)
−50
150
°C
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7.4 Thermal Information
LM57
THERMAL METRIC
(1)
NGR
(WSON/SD)
PW (TSSOP)
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
71.3
183
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
82.8
66
°C/W
RθJB
Junction-to-board thermal resistance
43.4
111
°C/W
ψJT
Junction-to-top characterization parameter
2.2
8
°C/W
ψJB
Junction-to-board characterization parameter
43.7
110
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
11.9
—
°C/W
(1)
6
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 Electrical Characteristics - Accuracy Characteristics – Trip Point Accuracy
PARAMETER
Trip Point
Accuracy
(Includes 1% setresistor tolerance)
MIN
TYP
LM57C, LM57F or LM57T
MAX
MIN
TYP
MAX
UNIT
J2
TA = −41°C to
52°C
VDD = 2.4 V to 5.5 V
±1.5
±2.3
°C
J3
TA = 52°C to
97°C
VDD = 2.4 V to 5.5 V
±1.5
±2.3
°C
J4
TA = 97°C to
119°C
VDD = 2.4 V to 5.5 V
±1.5
±2.3
°C
J5
TA = 119°C to
free air
temperature
max
VDD = 2.4 V to 5.5 V
±1.5
±2.3
°C
(1)
(1)
LM57B
TEST CONDITIONS
Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Conversion Table at the
specified conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the
specified conditions. Accuracy limits do not include load regulation; they assume no DC load.
7.6 Electrical Characteristics - Accuracy Characteristics – VTEMP Analog Temperature Sensor
Output Accuracy
These limits do not include DC load regulation. These stated accuracy limits are with reference to the values in Table 1.
PARAMETER
VTEMP Accuracy
(These stated
accuracy limits are
with reference to
the values in
Table 1, LM57
VTEMP
Temperature-toVoltage.) (1)
MIN
TYP
LM57C, LM57F or LM57T
MAX
MIN
TYP
MAX
UNIT
J2
TA = −50°C
to free air
temperature
max
VDD = 2.4 V to 5.5 V
±0.95
±1.3
°C
J3
TA = −50°C
to free air
temperature
max
VDD = 2.4 V to 5.5 V
±0.8
±1.3
°C
TA = 20°C
to 50°C
VDD = 2.4 V to 5.5 V
±0.7
±1.3
TA = 0°C to
free air
temperature
max
VDD = 2.7 V to 5.5 V
±0.7
±1.3
TA = −50°C
to 0°C
VDD = 3.1 V to 5.5 V
±0.8
±1.3
TA = 60°C
to free air
temperature
max
VDD = 2.4 V to 5.5 V
±0.7
±1.3
TA = 20°C
to 50°C
VDD = 2.9 V to 5.5 V
±0.7
±1.3
TA = 0°C to
free air
temperature
max
VDD = 3.2 V to 5.5 V
±0.7
±1.3
TA = −50°C
to 0°C
VDD = 4 V to 5.5 V
±0.8
±1.3
J4
J5
(1)
LM57B
TEST CONDITIONS
°C
°C
Accuracy is defined as the error between the measured and reference output voltages, tabulated in the Conversion Table at the
specified conditions of supply gain setting, voltage, and temperature (expressed in °C). Accuracy limits include line regulation within the
specified conditions. Accuracy limits do not include load regulation; they assume no DC load.
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7.7 Electrical Characteristics
Unless otherwise noted, these specifications apply for VDD = 2.4 to 5.5 V. Limits apply over free air temperature range.
PARAMETER
TEST CONDITIONS
MIN
(1)
TYP
(2)
MAX
(1)
UNIT
TEMPERATURE SENSOR
J2: −50°C to 52°C
VTEMP sensor gain
−5.166
J3: 52°C to 97°C
−7.752
J4: 97°C to 119°C
−10.339
J5: 119°C to 150°C
−12.924
mV/°C
0.18
Line regulation DC: supply-toVTEMP (3)
Load regulation: VTEMP output
(4)
VDD = 2.4 V to 5.5 V
Temp = 90°C
IS
Supply current: quiescent
μV/V
−84
dB
Source ≤ 240 µA, (VDD – VTEMP) ≥ 200 mV; TA =
−50°C to 150°C
−1
Sink ≤ 300 µA, VTEMP ≥ 360 mV; TA = −50°C to
150°C
1
mV
Source or sink = 100 µA; TA = −50°C to 150°C
Maximum Load capacitance:
VTEMP output
mV
58
Ω
1
No output series resistor required; (See VTEMP
Capacitive Loads )
(5)
24
1100
pF
28
µA
TRIP-TEST INPUT
VIH
Logic 1 threshold voltage
VIL
Logic 0 threshold voltage
IIH
Logic 1 input current
IIL
Logic 0 input leakage current
(6)
VDD – 0.5
TA = −50°C to 150°C
V
0.5
V
1.4
3
µA
0.001
1
µA
TOVER (PUSH-PULL, ACTIVE-HIGH) OUTPUT
VOH
Logic 1 push-pull output
voltage
VOL
Logic 0 output voltage
Source ≤ 600 µA
VDD – 0.2
Source ≤ 1.2 mA
VDD – 0.45
V
Sink ≤ 600 µA
0.2
Sink ≤ 1.2 mA
0.45
V
TOVER (OPEN-DRAIN, ACTIVE-LOW) OUTPUT
VOL
IOH
(1)
(2)
(3)
(4)
(5)
(6)
8
Logic 0 output voltage
Logic 1 output leakage current
(6)
Sink ≤ 600 µA
0.2
Sink ≤1.2 mA
0.45
Temperature = 30°C;
0.001
1
V
µA
Limits are specified to TI's average outgoing quality level (AOQL).
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Line regulation (DC) is calculated by subtracting the output voltage at the highest supply voltage from the output voltage at the lowest
supply voltage. The typical DC line regulation specification does not include the output voltage shift discussed in VTEMP Voltage Shift .
Source currents are flowing out of the LM57. Sink currents are flowing into the LM57. Load Regulation is calculated by measuring VTEMP
at 0 μA and subtracting the value with the conditions specified.
Supply current refers to the quiescent current of the LM57 only and does not include any load current
This current is leakage current only and is therefore highest at high temperatures. Prototype test indicate that the leakage is well below
1 μA over the full temperature range. This 1 μA specification reflects the limitations of measuring leakage at room temperature. For this
reason only, the leakage current is not specified at a lower value.
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Electrical Characteristics (continued)
Unless otherwise noted, these specifications apply for VDD = 2.4 to 5.5 V. Limits apply over free air temperature range.
PARAMETER
TEST CONDITIONS
MIN
(1)
TYP
(2)
MAX
(1)
UNIT
HYSTERESIS
THYST
Hysteresis temperature
5°C hysteresis option (for all LM57F or LM57-5)
4.7
5
5.4
°C
10°C hysteresis option (for all LM57T or LM57-10)
9.6
10
10.6
°C
UNIT
7.8 Switching Characteristics
Unless otherwise noted, these specifications apply for VDD = 2.4 to 5.5 V over the free air temperature range.
TYP
MAX
tEN
Maximum time from power on
to digital output enabled
PARAMETER
TEST CONDITIONS
MIN
1.5
2.9
ms
tVTEMP
Maximum time from power on
to analog temperature
(VTEMP) valid
1.5
2.9
ms
VDD
1.3V
tEN
TOVER
Enabled
TOVER
Enabled
Figure 1. Definition of tEN
VDD
tVTEMP
Valid
VTEMP
Figure 2. Definition of tVTEMP
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30
30
29
29
28
28
27
27
26
IDD (PA)
IDD (PA)
7.9 Typical Characteristics
T = 150°C
T = 30°C
25
24
26
VDD = 5.5V
25
24
23
23
T = -40°C
22
VDD = 2.4V
22
21
21
20
2.4
2.8
3.2
3.6
4.0
4.4
4.8
5.2
20
-50 -30 -10 10 30 50 70 90 110 130 150
5.6
TEMPERATURE (°C)
VDD (V)
Figure 4. Supply Current vs Temperature
Overhead =
400 mV
Overhead =
100 mV
DELTA_VOUT (mV)
DELTA VOUT (mV)
Figure 3. Supply Current vs Supply Voltage
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
-1.4
-1.6
-1.8
-2.0
-2.2
-2.4
-2.6
-2.8
-3.0
Overhead =
200 mV
0
100
200
300
400
500
600
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
VDD = 2.4V
VDD = 2.7V
VDD = 3.3V
VDD = 5.0V
200 400 600 800 1000 1200 1400 1600
0
700
LOAD (PA)
Figure 5. Load Regulation: Change In VTEMP vs Source
Current Overhead Is Vdd-Vtemp
Figure 6. Load Regulation: Change In VTEMP vs Sink Current
VTEMP (mV)
949
948
947
946
945
2.4
2.8
3.2
3.6
4
4.4
4.8
5.2
5.6
5oC HYSTERESIS (oC) 10oC HYSTERESIS (oC
LOAD (PA)
950
10.2
HYST J5
10.1
10.0
HYST J2
HYST J3
HYST J4
9.9
|
|
5.2
HYST J3
5.1
5.0
HYST J2
4.9
2.4
2.8
3.2
HYST J5
3.6
4.0
4.4
HYST J4
4.8
5.2
5.6
VDD
VDD (V)
Figure 7. Line Regulation: VTEMP vs Supply Voltage
10
VDD = 3.5V
Figure 8. Line Regulation: Hysteresis vs Supply Voltage
30°C
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5oC HYSTERESIS (oC) 10oC HYSTERESIS (oC)
Typical Characteristics (continued)
VDD (V)
3
2
1
Tover
VOUTPUT (V)
0
3
|
|
2
Vtemp
1
0
-1
0
1
2
3
4
5
6
7
8
9
10.2
HYST J5
10.1
HYST J3
10.0
HYST J4
HYST J2
9.9
|
|
5.2
HYST J3
HYST J5
5.1
5.0
HYST J4
HYST J2
4.9
-50 -30 -10 10 30 50 70 90 110 130 150
TEMPERATURE (oC)
TIME (ms)
Figure 9. Start-Up Response
Figure 10. Hysteresis vs Temperature
2.0
MAX LImit
VTEMP Accuracy (ƒC)
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
MIN Limit
-2.0
±50
±25
0
25
50
75
100
125
DUT Temperature (ƒC)
150
C102
Conditions: J2, VDD=5V
Figure 11. J2 Accuracy Specification Over Temperature
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8 Detailed Description
8.1 Overview
The LM57 is a precision, dual-output, temperature switch with analog temperature sensor output. The trip
temperature (TTRIP) is selected from 256 possible values by using two external 1% resistors. The VTEMP class AB
analog output provides a voltage that is proportional to temperature. The LM57 includes an internal reference
DAC, analog temperature sensor and analog comparator. The reference DAC is connected to one of the
comparator inputs. The reference DAC output voltage (VTRIP) is controlled by the value of resistance applied to
the SENSE pins. The resistance value sets one of 16 "logic" levels at the SENSE pins. These "logic" levels are
then decoded and applied to the DAC input, thus the actual resistance tolerance does not directly affect the
threshold level accuracy. The result of the reference DAC voltage and the temperature sensor output comparison
is provided on two output pins TOVER and TOVER.
The VTEMP output has a programmable gain. The output gain has 4 possible settings as described in Figure 12.
The gain setting is dependent on the trip point selected by resistance applied to the SENSE pins.
Built-in temperature hysteresis (THYST) prevents the digital outputs from oscillating. The TOVER and TOVER will
activate when the die temperature exceeds TTRIP and will release when the temperature falls below a
temperature equal to TTRIP minus THYST. TOVER is active-high with a push-pull structure. TOVER , is active-low with
an open-drain structure. There are two different hysteresis options available that are factory preset. The preset
hysteresis can be selected by purchasing the proper order number as described in Device Comparison Table .
Driving the TRIP-TEST high will activate the digital outputs. A processor can check the logic level of the TOVER or
TOVER , confirming that they changed to their active state. This allows for system production testing verification
that the comparator and output circuitry are functional after system assembly. When the TRIP-TEST pin is high,
the trip-level reference voltage appears at the VTEMP pin. Tying TOVER to TRIP-TEST will latch the output after it
trips. It can be cleared by forcing TRIP-TEST low or powering off the LM57.
8.2 Functional Block Diagram
VDD = 2.4V to 5.5V
TRIP TEST
SENSE1
LM57
SENSE2
VTRIP
DAC
TOVER
GAIN
TEMP SENSOR
(negative temp
coefficient)
TRIP
TEST = 1
+
-
TRIP
TEST = 0
VDD
TOVER
VTEMP
GND
12
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8.3 Feature Description
8.3.1
LM57 VTEMP Temperature-to-Voltage Transfer Function
The value of the RSENSE resistors select a trip point and a corresponding VTEMP gain (J2, J3, J4, or J5).The trip
point range associated with a given gain is shown in bold green in Table 1. The VTEMP gain is selected by the
RSENSE resistors. VTEMP is valid over the entire temperature range. The VTEMP gain is selected by the RSENSE
resistors. VTEMP is valid over the entire temperature range.
3,500
J2 (-5.166mV/°C)
J3 (-7.752mV/°C)
J4 (-10.339mV/°C)
J5 (-12.924mV/°C)
VTEMP VOLTAGE (mV)
3,000
2,500
2,000
1,500
1,000
500
0
-50
-25
0
25
50
75
100
125
150
TEMPERTURE (ƒC)
C101
Figure 12. Temperature Transfer Characteristics
Table 1. LM57 VTEMP Temperature to Voltage
Temperature (°C)
(1)
(1)
VTEMP VOLTAGE (mV)
J2 (-5.166 mV/°C)
J3 (–7.752 mV/°C)
J4 (–10.339 mV/°C)
J5 (–12.924 mV/°C)
–50
1352.56
2028.80
2705.20
3381.40
–49
1347.60
2021.35
2695.26
3368.98
–48
1342.64
2013.90
2685.32
3356.55
–47
1337.67
2006.44
2675.38
3344.12
–46
1332.70
1998.98
2665.43
3331.68
–45
1327.73
1991.52
2655.47
3319.23
–44
1322.76
1984.05
2645.51
3306.78
–43
1317.78
1976.58
2635.54
3294.32
–42
1312.81
1969.11
2625.57
3281.85
–41
1307.82
1961.63
2615.60
3269.38
–40
1302.84
1954.15
2605.62
3256.90
–39
1297.86
1946.66
2595.63
3244.41
–38
1292.87
1939.17
2585.64
3231.92
–37
1287.88
1931.68
2575.64
3219.42
–36
1282.88
1924.18
2565.64
3206.92
–35
1277.89
1916.68
2555.63
3194.41
–34
1272.89
1909.17
2545.62
3181.89
The RSENSE resistors select a trip point and a corresponding VTEMP gain (J2, J3, J4, or J5). The trip point range associated with a given
gain is shown in bold green on this table. VTEMP is valid over the entire temperature range.
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Feature Description (continued)
Table 1. LM57 VTEMP Temperature to Voltage
Temperature (°C)
14
(1)
(continued)
VTEMP VOLTAGE (mV)
J2 (-5.166 mV/°C)
J3 (–7.752 mV/°C)
J4 (–10.339 mV/°C)
J5 (–12.924 mV/°C)
–33
1267.88
1901.66
2535.60
3169.37
–32
1262.88
1894.15
2525.58
3156.84
–31
1257.87
1886.63
2515.56
3144.30
–30
1252.86
1879.11
2505.52
3131.76
–29
1247.85
1871.59
2495.49
3119.21
–28
1242.84
1864.06
2485.44
3106.66
–27
1237.82
1856.53
2475.40
3094.10
–26
1232.80
1848.99
2465.34
3081.53
–25
1227.78
1841.45
2455.29
3068.96
–24
1222.75
1833.91
2445.23
3056.38
–23
1217.73
1826.36
2435.16
3043.79
–22
1212.70
1818.81
2425.09
3031.20
–21
1207.67
1811.26
2415.01
3018.60
–20
1202.63
1803.70
2404.93
3006.00
–19
1197.59
1796.13
2394.84
2993.38
–18
1192.55
1788.57
2384.74
2980.77
–17
1187.51
1781.00
2374.65
2968.14
–16
1182.46
1773.42
2364.54
2955.51
–15
1177.42
1765.85
2354.44
2942.87
–14
1172.37
1758.26
2344.32
2930.23
–13
1167.31
1750.68
2334.20
2917.58
–12
1162.26
1743.09
2324.08
2904.93
–11
1157.20
1735.50
2313.95
2892.26
–10
1152.14
1727.90
2303.82
2879.60
–9
1147.07
1720.30
2293.68
2866.92
–8
1142.01
1712.69
2283.54
2854.24
–7
1136.94
1705.09
2273.39
2841.55
–6
1131.87
1697.47
2263.24
2828.86
–5
1126.79
1689.86
2253.08
2816.16
–4
1121.72
1682.24
2242.91
2803.45
–3
1116.64
1674.61
2232.74
2790.74
–2
1111.56
1666.99
2222.57
2778.02
–1
1106.47
1659.35
2212.39
2765.30
0
1101.39
1651.72
2202.21
2752.57
1
1096.30
1644.08
2192.02
2739.83
2
1091.20
1636.44
2181.82
2727.08
3
1086.11
1628.79
2171.62
2714.33
4
1081.01
1621.14
2161.42
2701.58
5
1075.91
1613.48
2151.21
2688.82
6
1070.81
1605.83
2141.00
2676.05
7
1065.71
1598.16
2130.78
2663.27
8
1060.60
1590.50
2120.55
2650.49
9
1055.49
1582.83
2110.32
2637.70
10
1050.38
1575.15
2100.09
2624.91
11
1045.26
1567.48
2089.85
2612.10
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Feature Description (continued)
Table 1. LM57 VTEMP Temperature to Voltage
Temperature (°C)
(1)
(continued)
VTEMP VOLTAGE (mV)
J2 (-5.166 mV/°C)
J3 (–7.752 mV/°C)
J4 (–10.339 mV/°C)
J5 (–12.924 mV/°C)
12
1040.14
1559.80
2079.60
2599.30
13
1035.02
1552.11
2069.35
2586.48
14
1029.90
1544.42
2059.10
2573.66
15
1024.77
1536.73
2048.84
2560.84
16
1019.65
1529.03
2038.57
2548.01
17
1014.51
1521.33
2028.30
2535.17
18
1009.38
1513.63
2018.03
2522.32
19
1004.25
1505.92
2007.75
2509.47
20
999.11
1498.21
1997.46
2496.61
21
993.97
1490.49
1987.17
2483.75
22
988.82
1482.77
1976.88
2470.88
23
983.68
1475.05
1966.58
2458.00
24
978.53
1467.32
1956.27
2445.12
25
973.38
1459.59
1945.96
2432.23
26
968.22
1451.86
1935.64
2419.34
27
963.07
1444.12
1925.32
2406.43
28
957.91
1436.38
1915.00
2393.53
29
952.74
1428.63
1904.67
2380.61
30
947.58
1420.88
1894.33
2367.69
31
942.41
1413.13
1883.99
2354.76
32
937.24
1405.37
1873.64
2341.83
33
932.07
1397.61
1863.29
2328.89
34
926.90
1389.84
1852.94
2315.94
35
921.72
1382.07
1842.57
2302.99
36
916.54
1374.30
1832.21
2290.03
37
911.36
1366.52
1821.84
2277.07
38
906.17
1358.74
1811.46
2264.10
39
900.98
1350.96
1801.08
2251.12
40
895.79
1343.17
1790.69
2238.14
41
890.60
1335.38
1780.30
2225.15
42
885.41
1327.58
1769.90
2212.15
43
880.21
1319.78
1759.50
2199.15
44
875.01
1311.98
1749.09
2186.14
45
869.81
1304.17
1738.68
2173.12
46
864.60
1296.36
1728.26
2160.10
47
859.39
1288.54
1717.84
2147.07
48
854.18
1280.72
1707.41
2134.04
49
848.97
1272.90
1696.98
2121.00
50
843.75
1265.07
1686.54
2107.95
51
838.53
1257.24
1676.10
2094.90
52
833.31
1249.41
1665.65
2081.84
53
828.09
1241.57
1655.20
2068.77
54
822.86
1233.73
1644.74
2055.70
55
817.63
1225.88
1634.28
2042.62
56
812.40
1218.03
1623.81
2029.54
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Feature Description (continued)
Table 1. LM57 VTEMP Temperature to Voltage
Temperature (°C)
16
(1)
(continued)
VTEMP VOLTAGE (mV)
J2 (-5.166 mV/°C)
J3 (–7.752 mV/°C)
J4 (–10.339 mV/°C)
J5 (–12.924 mV/°C)
57
807.17
1210.18
1613.34
2016.44
58
801.93
1202.32
1602.86
2003.35
59
796.69
1194.46
1592.38
1990.24
60
791.45
1186.60
1581.89
1977.13
61
786.20
1178.73
1571.40
1964.02
62
780.96
1170.86
1560.90
1950.89
63
775.71
1162.98
1550.40
1937.76
64
770.46
1155.10
1539.89
1924.63
65
765.20
1147.22
1529.37
1911.49
66
759.94
1139.33
1518.86
1898.34
67
754.68
1131.44
1508.33
1885.19
68
749.42
1123.54
1497.80
1872.02
69
744.16
1115.64
1487.27
1858.86
70
738.89
1107.74
1476.73
1845.68
71
733.62
1099.83
1466.19
1832.50
72
728.35
1091.92
1455.64
1819.32
73
723.07
1084.01
1445.08
1806.13
74
717.79
1076.09
1434.53
1792.93
75
712.51
1068.17
1423.96
1779.72
76
707.23
1060.24
1413.39
1766.51
77
701.94
1052.31
1402.82
1753.30
78
696.65
1044.38
1392.24
1740.07
79
691.36
1036.44
1381.65
1726.84
80
686.07
1028.50
1371.07
1713.61
81
680.77
1020.55
1360.47
1700.36
82
675.48
1012.60
1349.87
1687.11
83
670.17
1004.65
1339.27
1673.86
84
664.87
996.69
1328.66
1660.60
85
659.56
988.73
1318.04
1647.33
86
654.25
980.77
1307.42
1634.05
87
648.94
972.80
1296.80
1620.77
88
643.63
964.83
1286.17
1607.49
89
638.31
956.85
1275.53
1594.19
90
632.99
948.87
1264.89
1580.89
91
627.67
940.89
1254.25
1567.59
92
622.35
932.90
1243.60
1554.28
93
617.02
924.91
1232.94
1540.96
94
611.69
916.92
1222.28
1527.63
95
606.36
908.92
1211.61
1514.30
96
601.02
900.91
1200.94
1500.97
97
595.69
892.91
1190.27
1487.62
98
590.34
884.90
1179.59
1474.27
99
585.00
876.88
1168.90
1460.92
100
579.66
868.87
1158.21
1447.55
101
574.31
860.84
1147.52
1434.18
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Feature Description (continued)
Table 1. LM57 VTEMP Temperature to Voltage
Temperature (°C)
(1)
(continued)
VTEMP VOLTAGE (mV)
J2 (-5.166 mV/°C)
J3 (–7.752 mV/°C)
J4 (–10.339 mV/°C)
J5 (–12.924 mV/°C)
102
568.96
852.82
1136.81
1420.81
103
563.61
844.79
1126.11
1407.43
104
558.25
836.76
1115.40
1394.04
105
552.89
828.72
1104.68
1380.65
106
547.53
820.68
1093.96
1367.24
107
542.17
812.63
1083.23
1353.84
108
536.80
804.59
1072.50
1340.42
109
531.43
796.53
1061.77
1327.01
110
526.06
788.48
1051.02
1313.58
111
520.69
780.42
1040.28
1300.15
112
515.31
772.35
1029.53
1286.71
113
509.93
764.29
1018.77
1273.26
114
504.55
756.21
1008.01
1259.81
115
499.17
748.14
997.24
1246.36
116
493.78
740.06
986.47
1232.89
117
488.39
731.98
975.69
1219.42
118
483.00
723.89
964.91
1205.95
119
477.61
715.80
954.12
1192.46
120
472.21
707.70
943.33
1178.98
121
466.81
699.61
932.53
1165.48
122
461.41
691.50
921.73
1151.98
123
456.00
683.40
910.92
1138.47
124
450.60
675.29
900.11
1124.96
125
445.19
667.18
889.29
1111.44
126
439.78
659.06
878.47
1097.91
127
434.36
650.94
867.64
1084.38
128
428.94
642.81
856.81
1070.84
129
423.52
634.68
845.97
1057.29
130
418.10
626.55
835.13
1043.74
131
412.67
618.41
824.28
1030.18
132
407.25
610.27
813.43
1016.62
133
401.82
602.13
802.57
1003.05
134
396.38
593.98
791.71
989.47
135
390.95
585.83
780.84
975.89
136
385.51
577.67
769.97
962.30
137
380.07
569.51
759.09
948.70
138
374.63
561.35
748.20
935.10
139
369.18
553.18
737.32
921.49
140
363.73
545.01
726.42
907.87
141
358.28
536.84
715.52
894.25
142
352.83
528.66
704.62
880.62
143
347.37
520.48
693.71
866.99
144
341.91
512.29
682.80
853.35
145
336.45
504.10
671.88
839.70
146
330.99
495.91
660.95
826.05
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Feature Description (continued)
Table 1. LM57 VTEMP Temperature to Voltage
Temperature (°C)
18
(1)
(continued)
VTEMP VOLTAGE (mV)
J2 (-5.166 mV/°C)
J3 (–7.752 mV/°C)
J4 (–10.339 mV/°C)
J5 (–12.924 mV/°C)
147
325.52
487.71
650.03
812.39
148
320.05
479.51
639.09
798.73
149
314.58
471.30
628.15
785.05
150
309.10
463.09
617.21
771.38
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8.3.1.1
SNIS152E – MAY 2009 – REVISED JULY 2015
LM57 VTEMP Voltage-to-Temperature Equations
VTEMP= a (T-30)2+ b (T-30) + c
where
•
VTEMP is in mV and T is in °C
(1)
2
T
b b 4 a( c VTEMP )
2a
30 qC
where
•
T is in °C and VTEMP is in mV
(2)
Table 2. LM57 VTEMP Voltage-to-Temperature Equations Coefficients
Trip-Point
Region
LM57 Trip Point Range
a
b
J2
−41°C to 52°C
– 0.00129
− 5.166
947.6
J3
52°C to 97°C
– 0.00191
− 7.752
1420.9
J4
97°C to 119°C
– 0.00253
− 10.339
1894.3
J5
119°C to 150°C
– 0.00316
− 12.924
2367.7
c
8.3.2 RSENSE
The LM57 uses the voltage at the two SENSE pins to set the trip point for the temperature switch. It is possible
to drive the two SENSE pins with a voltage equal to the value generated by the resistor and the internal currentsource and have the same switch point. Thus one can use an external DAC to drive each SENSE pin, allowing
for the temperature trip point to be set dynamically by the system processor. Table 3 shows the RSENSE value
and its corresponding generated SENSE pin voltage (the center value).
Table 3. RSENSE Values (kΩ) vs SENSE Pin Voltage (mV)
RSENSE (kΩ)
SENSE Pin Voltage (mV)
Center Value
976
1875
825
1585
698
1341
590
1134
499
959
412
792
340
653
280
538
226
434
178
342
140
269
105
202
75
146
46.4
87
22.6
43
0.01
0
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8.3.3 Resistor Selection
Table 4. Trip Point (°C) vs Sense Resistor (RSENSE) Values (Ω)
RSENSE2
J2
RSENSE1
(1)
20
(1)
J3
(1)
J4
(1)
J5
(1)
976 kΩ
825 kΩ
698 kΩ
590 kΩ
499 kΩ
412 kΩ
340 kΩ
280 kΩ
226 kΩ
178 kΩ
140 kΩ
105 kΩ
75 kΩ
976 kΩ
–40.68
–16.26
7.33
30.38
52.73
67.77
82.74
97.47
108.61
119.62
128.46
137.28
146.08
825 kΩ
–39.13
–14.76
8.79
31.81
53.68
68.71
83.67
98.17
109.30
120.18
129.01
137.83
146.62
698 kΩ
–37.57
–13.27
10.24
33.24
54.62
69.65
84.60
98.86
110.00
120.73
129.56
138.38
147.16
590 kΩ
–36.03
–11.78
11.70
34.67
55.56
70.59
85.53
99.56
110.70
121.28
130.12
138.93
147.71
499 kΩ
–34.49
–10.29
13.15
36.10
56.50
71.52
86.46
100.25
111.39
121.84
130.67
139.49
148.25
412 kΩ
–32.95
–8.81
14.60
37.53
57.44
72.46
87.40
100.95
112.09
122.39
131.22
140.04
148.80
340 kΩ
–31.41
–7.32
16.05
38.95
58.39
73.40
88.33
101.64
112.79
122.94
131.77
140.59
149.34
280 kΩ
–29.88
–5.83
17.49
40.38
59.33
74.33
89.26
102.34
113.48
123.50
132.32
141.14
149.88
226 kΩ
–28.34
–4.35
18.93
41.81
60.27
75.27
90.19
103.03
114.18
124.05
132.87
141.69
150.43
178 kΩ
–26.83
–2.88
20.36
43.23
61.21
76.20
91.12
103.73
114.87
124.60
133.43
142.24
140 kΩ
–25.32
–1.42
21.79
44.65
62.15
77.14
92.05
104.42
115.57
125.15
133.98
142.79
105 kΩ
–23.80
0.04
23.22
46.07
63.08
78.07
92.99
105.11
116.26
125.71
134.53
143.34
75 kΩ
–22.29
1.50
24.65
47.50
64.02
79.01
93.92
105.81
116.95
126.26
135.08
143.89
46.4 kΩ
–20.77
2.96
26.08
48.92
64.96
79.94
94.84
106.50
117.65
126.81
135.63
144.44
22.6 kΩ
–19.26
4.42
27.51
50.33
65.90
80.87
95.77
107.19
118.34
127.36
136.18
144.99
0.01 kΩ
–17.75
5.88
28.94
51.75
66.84
81.81
96.70
107.89
119.04
127.91
136.73
145.54
There are four gains corresponding to each of the four Temperature Trip Point Ranges:
J2 (-5.166 mV/°C) is the temperature sensor output gain used for Temperature Trip Points −40.68°C to 51.8°C.
J3 (-7.752 mV/°C) is for Trip Points 52°C to 97°C.
J4 (-10.339 mV/°C) for 97°C to 119°C.
J5 (-12.924 mV/°C) for 119°C to 150°C.
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Table 5. VTEMP (mV) at the Trip Point vs Sense Resistor (RSENSE) Value (Ω)
RSENSE2
J2
RSENSE1
(1)
(1)
J3
(1)
J4
(1)
J5
(1)
976 kΩ
825 kΩ
698 kΩ
590 kΩ
499 kΩ
412 kΩ
340 kΩ
280 kΩ
226 kΩ
178 kΩ
140 kΩ
105 kΩ
75 kΩ
976 kΩ
1306.23
1183.77
1064.00
945.63
1243.67
1125.34
1006.75
1185.27
1066.00
1184.05
1064.59
944.83
824.96
825 kΩ
1298.50
1176.23
1056.56
938.23
1236.27
1117.93
999.34
1177.83
1058.52
1176.57
1057.10
937.33
817.53
698 kΩ
1290.72
1168.70
1049.13
930.83
1228.88
1110.52
991.92
1170.40
1051.03
1169.10
1049.62
929.83
810.09
590 kΩ
1283.03
1161.16
1041.69
923.43
1221.48
1103.10
984.51
1162.96
1043.55
1161.63
1042.13
922.33
802.66
499 kΩ
1275.33
1153.62
1034.26
916.02
1214.09
1095.69
977.09
1155.52
1036.07
1154.16
1034.65
914.83
795.22
412 kΩ
1267.64
1146.09
1026.82
908.62
1206.69
1088.28
969.66
1148.09
1028.59
1146.68
1027.16
907.33
787.78
340 kΩ
1259.94
1138.55
1019.38
901.22
1199.30
1080.87
962.22
1140.65
1021.10
1139.21
1019.67
899.83
780.35
280 kΩ
1252.25
1131.02
1011.99
893.82
1191.90
1073.45
954.78
1133.22
1013.62
1131.74
1012.19
892.33
772.91
226 kΩ
1244.55
1123.48
1004.62
886.42
1184.50
1066.04
947.35
1125.78
1006.14
1124.27
1004.70
884.83
765.48
178 kΩ
1236.99
1116.05
997.26
879.02
1177.11
1058.63
939.91
1118.35
998.66
1116.79
997.22
877.33
140 kΩ
1229.38
1108.61
989.89
871.61
1169.71
1051.22
932.48
1110.91
991.17
1109.32
989.73
869.82
105 kΩ
1221.76
1101.18
982.53
864.21
1162.32
1043.80
925.04
1103.48
983.69
1101.85
982.25
862.32
75 kΩ
1214.15
1093.74
975.16
856.81
1154.92
1036.39
917.61
1096.04
976.21
1094.38
974.76
854.82
46.4 kΩ
1206.53
1086.30
967.80
849.41
1147.53
1028.98
910.17
1088.60
968.73
1086.90
967.28
847.32
22.6 kΩ
1198.92
1078.87
960.43
842.01
1140.13
1021.57
902.74
1081.17
961.24
1079.43
959.79
839.82
0.01 kΩ
1191.30
1071.43
953.07
834.62
1132.74
1014.15
895.30
1073.73
953.76
1072.04
952.31
832.32
There are four gains corresponding to each of the four Temperature Trip Point Ranges:
J2 (-5.166 mV/°C) is the temperature sensor output gain used for Temperature Trip Points −40.68°C to 51.8°C.
J3 (-7.752 mV/°C) is for Trip Points 52°C to 97°C.
J4 (-10.339 mV/°C) for 97°C to 119°C.
J5 (-12.924 mV/°C) for 119°C to 150°C.
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8.3.4 TOVER and TOVER Digital Outputs
The TOVER active high, push-pull output and the TOVER Active Low, Open-Drain Output both assert at the same
time whenever the Die Temperature reaches the Trip Point. They also assert simultaneously whenever the TRIP
TEST pin is set high. Both outputs de-assert when the die temperature goes below the (Temperature Trip Point)
- (Hysteresis). These two types of digital outputs enable the user the flexibility to choose the type of output that is
most suitable for his design.
Either the TOVER or the TOVER Digital Output pins can be left open if not used.
The TOVER Active Low, Open-Drain Digital Output, if used, requires a pullup resistor between this pin and VDD.
8.3.4.1 TOVER and TOVER Noise Immunity
The LM57 has some noise immunity to a premature trigger due to noise on the power supply. With the die
temperature at 1°C below the trip point, there are no premature triggers for a square wave injected into the
power supply with a magnitude of 100 mVPP over a frequency range of 100 Hz to 2 MHz. Above the frequency a
premature trigger may occur.
With the die temperature at 2°C below the trip point, and a magnitude of 200 mVPP, there are no premature
triggers from 100 Hz to 300 kHz. Above that frequency a premature trigger may occur.
Therefore if the supply line is noisy, it is recommended that a local supply decoupling capacitor be used to
reduce that noise.
8.3.5 Trip Test Digital Input
The TRIP TEST pin provides a means to test the digital outputs by causing them to assert, regardless of
temperature.
In addition, when the TRIP TEST pin is pulled high the VTEMP pin will be at the VTRIP voltage.
8.3.6 VTEMP Analog Temperature Sensor Output
The VTEMP push-pull output provides the ability to sink and source significant current. This is beneficial when, for
example, driving dynamic loads like an input stage on an analog-to-digital converter (ADC). In these applications
the source current is required to quickly charge the input capacitor of the ADC. See the Typical Application
section for more discussion of this topic. The LM57 is ideal for this and other applications which require strong
source or sink current.
8.3.6.1 VTEMP Noise Considerations
A load capacitor on VTEMP can help to filter noise.
For noisy environments, TI recommends a 100 nF supply decoupling capacitor placed closed across VDD and
GND pins of LM57.
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8.3.6.2 VTEMP Capacitive Loads
The VTEMP Output handles capacitive loading well. In an extremely noisy environment, or when driving a switched
sampling input on an ADC, it may be necessary to add some filtering to minimize noise coupling. Without any
precautions, the VTEMP can drive a capacitive load less than or equal to 1100 pF as shown in Figure 13. For
capacitive loads greater than 1100 pF, a series resistor is required on the output, as shown in Figure 14, to
maintain stable conditions.
VDD
VDD
VTEMP
VTEMP
LM57
RS
LM57
GND
GND
CLOAD d 1100 pF
Figure 13. LM57 With No Isolation Resistor
Required
CLOAD > 1100 pF
Figure 14. LM57 With Series Resistor for
Capacitive Loading Greater than 1100 pF
Table 6. CLOAD and RS Values of Figure 14
CLOAD
Minimum RS
1.1 to 99 nF
3 kΩ
100 to 999 nF
1.5 kΩ
1 μF
750 Ω
8.3.6.3 VTEMP Voltage Shift
The LM57 is very linear over temperature and supply voltage range. Due to the intrinsic behavior of an
NMOS/PMOS rail-to-rail buffer, a slight shift in the output can occur when the supply voltage is ramped over the
operating range of the device. The location of the shift is determined by the relative levels of VDD and VTEMP. The
shift typically occurs when VDD − VTEMP = 1 V.
This slight shift (a few millivolts) takes place over a wide change (approximately 200 mV) in VDD or VTEMP. Since
the shift takes place over a wide temperature change of 5°C to 20°C, VTEMP is always monotonic. The accuracy
specifications in the table already includes this possible shift.
8.4 Device Functional Modes
The LM57 has several modes of operation as detailed in the following drawings.
VDD
RSENSE2
RSENSE1
SENSE1
TOVER
SENSE2
Asserts when TDIE > TTRIP
LM57
See text
TRIP TEST
GND
Figure 15. Temperature Switch Using Push-Pull Output
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Device Functional Modes (continued)
VDD
100k
SENSE1
RSENSE2
RSENSE1
TOVER
SENSE2
Asserts when TDIE > TTRIP
LM57
See text
TRIP TEST
GND
Figure 16. Temperature Switch Using Open-Drain Output
As shown in Figure 17 the LM57 has a TRIP Test input simplifying in situ board conductivity testing. Forcing
TRIP TEST pin "HIGH" will drive the TOVER pin "LOW" and the TOVER pin "HIGH".
VDD
100k
TOVER
TRIP TEST
LM57
TOVER
GND
Figure 17. Trip Test Digital Output Test Circuit
In the circuit shown in Figure 18 when TOVER goes active high, it drives trip test high. Trip test high causes TOVER
to stay high. It is therefore latched. To release the latch, power down, then power up. The LM57 always comes
up in a released condition.
VDD
TOVER
TRIP TEST
LM57
TOVER
GND
Figure 18. Simple Latch Circuit
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Device Functional Modes (continued)
The TRIP TEST pin, normally used to check the operation of the TOVER and TOVER pins, may be used to latch the
outputs whenever the temperature exceeds the programmed limit and causes the digital outputs to assert. As
shown in Figure 19, when TOVER goes high, the TRIP TEST input is also pulled high and causes TOVER output to
latch high and the TOVER output to latch low. Momentarily switching the TRIP TEST input low will reset the LM57
to normal operation. The resistor limits the current out of the TOVER output pin.
VDD
100k
TOVER
TRIP TEST
RESET
Momentary
LM57
TOVER
GND
Figure 19. Latch Circuit Using TOVER Output
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LM57 has several outputs allowing for varying system implementations.
9.1.1 ADC Input Considerations
The LM57 has an analog temperature sensor output (VTEMP) that can be directly connected to an ADC (Analog to
Digital Converter) input. Most CMOS ADCs found in microcontrollers and ASICs have a sampled data
comparator input structure. When the ADC charges the sampling cap, it requires instantaneous charge from the
output of the analog source such as the LM57 temperature sensor and many op amps. This requirement is easily
accommodated by the addition of a capacitor (CFILTER). The size of CFILTER depends on the size of the sampling
capacitor and the sampling frequency. Because not all ADCs have identical input stages, the charge
requirements will vary. The general ADC application shown in Figure 20 is an example only.
SAR Analog-to-Digital Converter
Reset
+2.4V to +5.5V
Input
Pin
LM57
VDD
RIN
Sample
VTEMP
CBP
CSAMPLE
CPIN
CFILTER
GND
Figure 20. Suggested Connection to a Sampling Analog-to-Digital Converter Input Stage
9.2 Typical Application
VDD Supply
(+2.4V to +5.5V)
VDD
VTEMP
Analog
ADC Input
LM57
Microcontroller
RSENSE2
RSENSE1
SENSE1
TOVER
SENSE2
TOVER
TRIP TEST
Digital In
Digital Out
GND
Figure 21. Typical Application Schematic with Microcontroller TRIP TEST Control
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Typical Application (continued)
9.2.1 Design Requirements
By simply selecting the value of two resistors the trip point of the LM57 can easily be programmed as described
in the following section. If standard 1% values are used the actual trip point threshold is not degraded and stands
as described in the Electrical Characteristics section ( ).
9.2.2 Detailed Design Procedure
9.2.2.1 Selection of RSENSE Resistors
To set the trip point:
1.
2.
3.
4.
5.
Locate the desired trip temperature in Table 4.
Identify the corresponding RSENSE2 value by following the column up to the resistor value.
Identify the corresponding RSENSE1 value by following the row leftwards to the resistor value.
Use only the EIA E96 standard resistor values from the list.
Use only a resistor with 1% tolerance and a temperature coefficient of 100 ppm (or better). These restrictions
are necessary to stay at the selected setting, and not to slip into an adjacent setting.
6. This is consistent with using resistors from the thick film chip resistors CRCW0402 family. These are
available with very small dimensions of L = 1 mm, W = 0.5 mm, H = 0.35 mm.
7. Note that the resistor tolerance does not diminish the accuracy of the trip point. As can be seen in the block
diagram these inputs drive the logic inputs of a DAC thus their tolerance does affect the trip point accuracy
unless the DAC setting slips into an adjacent level. See patent number 6924758.
9.2.3 Application Curves
The typical performance of the LM57 temperature sensor output can be seen in Figure 22. Figure 23 shows the
output behavior of the LM57 TOVER output.
2.0
MAX LImit
VTEMP Accuracy (ƒC)
1.5
Trip Point
1.0
Trip Point - Hysteresis
0.5
VTEMP Output
(Temp. of Leads)
0.0
-0.5
TOVER
-1.0
-1.5
MIN Limit
-2.0
±50
±25
0
25
50
75
100
125
DUT Temperature (ƒC)
150
C102
Figure 22. J2 VTEMP Accuracy Characteristics
Figure 23. Output Transfer Characteristic
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Typical Application (continued)
9.2.4 Grounding of the TRIP TEST Pin
The circuit in Figure 24 shows the TRIP TEST pin grounded. This allows the LM57 to function autonomously
without microcontroller intervention. In all other respects this circuit functions similarly to the circuit shown in
Figure 21.
VDD Supply
(+2.4V to +5.5V)
VDD
VTEMP
LM57
RSENSE2
RSENSE1
Microcontroller
SENSE1
TOVER
SENSE2
TOVER
Digital In
TRIP TEST
GND
Figure 24. Typical Application Schematic without Microcontroller TRIP TEST Control
10 Power Supply Recommendations
Power supply bypass capacitors are optional and may be required if the supply line is noisy. TI recommends that
a local supply decoupling capacitor be used to reduce noise. For noisy environments, TI recommends a 100-nF
supply decoupling capacitor placed closed across VDD and GND pins of LM57.
11 Layout
11.1 Layout Guidelines
The LM57 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface. The temperatures of the lands and traces to the other leads of the LM57 will also
affect the temperature reading.
Alternatively, the LM57 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LM57 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. If moisture creates a short circuit from the VTEMP output to ground
or VDD, the VTEMP output from the LM57 will not be correct. Printed-circuit coatings are often used to ensure that
moisture cannot corrode the leads or circuit traces.
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11.2 Layout Example
VIA to ground plane
VIA to power plane
GND
VTEMP
SENSE1
TOVER
SENSE2
TOVER
VDD
TRIP TEST
RSENSE1
RSENSE2
0.1 µ F
Figure 25. PW (TSSOP) Package Layout Example
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Layout Example (continued)
VIA to ground plane
VIA to power plane
GND
VTEMP
SENSE1
TOVER
RSENSE1
DAP
RSENSE2
SENSE2
TOVER
VDD
TRIP TEST
0.1 µ F
The best thermal conductivity to the junction of the LM57 is through the DAP. Make sure it is connected to the surface
whose temperature that is being measured.
Figure 26. SD (WSON) Package Layout Example
11.3 Temperature Considerations
The junction temperature of the LM57 is the actual temperature being measured. The thermal resistance
junction-to-ambient (RθJA) is the parameter (from Thermal Information ) used to calculate the rise of a device
junction temperature due to its power dissipation. Equation 3 is used to calculate the rise in the die temperature
of the LM57.
7J 7A 5TJA ª¬ 9DD,Q 9DD ±9TEMP ,L º¼
where
•
•
•
•
TA is the ambient temperature.
IQ is the quiescent current.
IL is the load current on VTEMP.
RθJA can be found in Thermal Information
(3)
For example using an LM57 in the PW (TSSOP) package, in an application where TA = 30°C, VDD = 5.5 V, IDD =
28 μA, J5 gain, VTEMP = 2368 mV, and IL = 0 μA, the total temperature rise would be [183°C/W × 5.5 V × 28 μA]
= 0.028°C. To minimize self-heating, the load current on VTEMP should be minimized.
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation, see the following:
• LM57-Q1 Automotive Grade Data Sheet.
• Reflow Temperature Profile specifications, www.ti.com/packaging.
• IC Package Thermal Metrics application report, SPRA953
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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19-Jul-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM57BISD-10/NOPB
ACTIVE
WSON
NGR
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-50 to 150
57B9
LM57BISD-5/NOPB
ACTIVE
WSON
NGR
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-50 to 150
57B5
LM57BISDX-10/NOPB
ACTIVE
WSON
NGR
8
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-50 to 150
57B9
LM57BISDX-5/NOPB
ACTIVE
WSON
NGR
8
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-50 to 150
57B5
LM57CISD-10/NOPB
ACTIVE
WSON
NGR
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-50 to 150
57C9
LM57CISD-5/NOPB
ACTIVE
WSON
NGR
8
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-50 to 150
57C5
LM57CISDX-10/NOPB
ACTIVE
WSON
NGR
8
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-50 to 150
57C9
LM57CISDX-5/NOPB
ACTIVE
WSON
NGR
8
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-50 to 150
57C5
LM57FPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-50 to 150
LM57F
LM57FPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-50 to 150
LM57F
LM57TPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-50 to 150
LM57T
LM57TPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-50 to 150
LM57T
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
19-Jul-2015
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM57 :
• Automotive: LM57-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Jul-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM57BISD-10/NOPB
WSON
NGR
8
1000
178.0
12.4
2.8
2.8
1.0
8.0
12.0
Q1
LM57BISD-5/NOPB
WSON
NGR
8
1000
178.0
12.4
2.8
2.8
1.0
8.0
12.0
Q1
LM57BISDX-10/NOPB
WSON
NGR
8
4500
330.0
12.4
2.8
2.8
1.0
8.0
12.0
Q1
LM57BISDX-5/NOPB
WSON
NGR
8
4500
330.0
12.4
2.8
2.8
1.0
8.0
12.0
Q1
LM57CISD-10/NOPB
WSON
NGR
8
1000
178.0
12.4
2.8
2.8
1.0
8.0
12.0
Q1
LM57CISD-5/NOPB
WSON
NGR
8
1000
178.0
12.4
2.8
2.8
1.0
8.0
12.0
Q1
LM57CISDX-10/NOPB
WSON
NGR
8
4500
330.0
12.4
2.8
2.8
1.0
8.0
12.0
Q1
LM57CISDX-5/NOPB
WSON
NGR
8
4500
330.0
12.4
2.8
2.8
1.0
8.0
12.0
Q1
LM57FPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM57TPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Jul-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM57BISD-10/NOPB
WSON
NGR
8
1000
213.0
191.0
55.0
LM57BISD-5/NOPB
WSON
NGR
8
1000
213.0
191.0
55.0
LM57BISDX-10/NOPB
WSON
NGR
8
4500
367.0
367.0
35.0
LM57BISDX-5/NOPB
WSON
NGR
8
4500
367.0
367.0
35.0
LM57CISD-10/NOPB
WSON
NGR
8
1000
213.0
191.0
55.0
LM57CISD-5/NOPB
WSON
NGR
8
1000
213.0
191.0
55.0
LM57CISDX-10/NOPB
WSON
NGR
8
4500
367.0
367.0
35.0
LM57CISDX-5/NOPB
WSON
NGR
8
4500
367.0
367.0
35.0
LM57FPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
LM57TPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
NGR0008B
SDA08B (Rev A)
www.ti.com
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
SCALE 2.800
SMALL OUTLINE PACKAGE
C
6.6
TYP
6.2
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
1
3.1
2.9
NOTE 3
2X
1.95
4
5
B
4.5
4.3
NOTE 4
SEE DETAIL A
8X
0.30
0.19
0.1
C A
1.2 MAX
B
(0.15) TYP
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
1
8
(R0.05)
TYP
SYMM
6X (0.65)
5
4
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
(R0.05) TYP
1
8
SYMM
6X (0.65)
5
4
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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