LUXEON Flip Chip Chip Scale Package LED Introduction Philips Lumileds LUXEON® Flip Chip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level and customize the phosphor and packaging to best suit their lighting applications. LUXEON Flip Chip is a real Chip Scale Package LED that can be attached by reflow without additional packaging. Traditional wire bonding limits the packing and power density of LEDs. LUXEON Flip Chip LEDs can be packaged closer and can be driven at a higher current density, therefore requiring fewer emitters to achieve a higher lumen output at higher lumen densities. This document contains the performance data needed to design and engineer Philips Lumileds LUXEON Flip Chip based application. Features Benefits Key Applications • High drive current up to 1A/mm2 • High current density for high lumen and lm/$ at high lm/W • High-power LED emitters • 440-460 nm wave length • High-packaging density • Remote phosphor applications • Low typical forward voltage of 2.9V • 5-sided emitter for dispense and remote phosphor applications • 1.0 mm x 1.0 mm 5-sided emitter • Low thermal resistance • Symmetric, large bond pads bumped with AuSn solder • Surface mount capable • No wire bonds • Robust design with proven Lumileds reliability LUXEON Flip Chip DS116 ©2013 Philips Lumileds Lighting Company. • Chip on board applications Table of Contents Product Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Environmental Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Mechanical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Characteristic Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Relative Spectral Power Distribution vs. Wavelength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Forward Current vs. Forward Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Typical Relative Radiometric Power vs. Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Peak Wavelength Shift vs. Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Relative Radiometric Power vs. Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Peak Wavelength Shift vs. Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Typical Translation from Peak Wavelength to Dominant Wavelength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Radiation Patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Bin Structure for LUXEON Flip Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. i Product Nomenclature The part number designation for LUXEON Flip Chip follows: LHDF-RB10abcdefghi Where: RB – designates color (RB for Royal Blue) 10 – designates die dimension (10 for 1.0mm2) a – designates peak wave length bin (Values 3, 4, 5, 6 per description of bin codes) b – designates bond pad finish (A for pad bumped with AuSn solder) cd – open slot to accommodate additional product requirements efgh – minimum radiometric power performance (mW) i – additional product designator (default value = 1) Environmental Compliance Philips Lumileds is committed to providing environmentally friendly products to the solid-state lighting market. LUXEON Flip Chip is compliant to the European Union directives on the restriction of hazardous substances in electronic equipment, namely the RoHS and REACH directives. Philips Lumileds will not intentionally add the following restricted material to the LUXEON Flip Chip: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 2 Product Performance and Characterization Guide Table 1. Optical Characteristics at Tj = 25°C, If = 350 mA Peak Wavelength (nm) [1,2] Part Number Min. Max. LHDF-RB10300000000 440 445 LHDF-RB10400000000 445 450 LHDF-RB10500000000 450 455 LHDF-RB10600000000 455 460 Typical Spectra Half-width (nm) Typical Temperature Coefficient of Peak Wavelength [3] (nm/°C) 24 0.05 Notes for Table 1: 1. Philips Lumileds maintains a tolerance of ±2nm for peak wavelength measurements. 2. Please see Figure 8 for typical translation from peak wavelength to dominant wavelength. 3. Measured between 25°C and 85°C at If= 350 mA. Table 2. Performance Characteristics at Tj = 25°C, If = 350 mA Part Number Min. Radiometric Power (mW) [1,2] LHDF-RB10300005000 500 LHDF-RB10400005000 500 LHDF-RB10500005000 500 LHDF-RB10600004500 450 Typical H/C factor [3] 0.95 Notes for Table 2: 1. Radiometric power values are based on a die packaged on ceramic tile with high reflective surface and dome encapsulation. 2. Philips Lumileds maintains a tolerance of ± 6.5% on radiometric power measurements. 3. H/C factor is the radiometric power ratio between 25°C and 85°C at If= 350 mA. Table 3. Electrical Characteristics at Tj = 25°C, If = 350 mA Part Number LHDF-RB10400000000 Forward Voltage (V)[1] Min. Typ. Max. Typical Temperature Coefficient of Forward Voltage[2] (mV/°C) DVf/DTJ 2.7 2.9 3.1 -2 to -3 Notes for Table 3: 1. Philips Lumileds maintains a tolerance of ±0.06V on forward voltage measurements. 2. Measured between 25°C and 85°C at If= 350 mA. LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 3 Absolute Maximum Ratings Table 4. Operating Condition and Ratings Parameter Maximum Performance DC Forward Current [1] [2] Peak Pulsed Forward Current 1050 mA 1300 mA [3] Storage Temperature -40°C - 135°C LED Junction Temperature [1] 135°C ESD Sensitivity[4] ≤ 200V (HBM, CLASS 0B per JS-001-2012) Reverse Voltage LUXEON Flip Chip is not designed to be driven in reverse bias Notes for Table 4: 1. Proper current de-rating must be observed to maintain the junction temperature below the specified maximum junction temperature. 2. Residual periodic variations due to power conversion from alternating current (AC) to direct current (DC), also called “ripple”, with frequencies ≥ 100Hz and amplitude ≤ 250 mA are acceptable, assuming the average current throughout each cycle does not exceed the specified maximum DC forward current and the junction temperature is kept below the specified maximum junction temperature. 3. Pulsed operation with a peak drive current of 1300 mA is acceptable if the pulse on-time is ≤ 5ms per cycle and the duty cycle is ≤ 50%. 4. Please see the LUXEON Flip Chip application brief for additional information on ESD protection. Mechanical Dimensions Figure 1. Mechanical Dimensions, LUXEON Flip Chip LHDF-RB10 xxxx xxxx x. Notes for Figure 1: 1. Drawing is not scale. 2. All dimensions are in micrometers . 3. A notch in the bond pad center indicates the anode. 4. The bond pads are bumped with AuSn solder. 5. LUXEON Flip Chip is qualified for AuSn reflow attach on ceramic and MCPCB substrates. LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 4 Characteristic Curves Relative Spectral Power Distribution vs. Wavelength Figure 2. Relative spectral power distribution at Tj = 25°C, If = 350 mA. Forward Current vs. Forward Voltage Figure 3. Forward current vs. forward voltage at Tj = 25°C. LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 5 Typical Relative Radiometric Power vs. Forward Current Figure 4. Typical relative radiometric power vs. forward current at Tj = 25°C. Peak Wavelength Shift vs. Forward Current Figure 5. Peak wavelength shift vs. forward current at Tj = 25°C. LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 6 Relative Radiometric Power vs. Junction Temperature Figure 6. Relative radiometric power vs. junction temperature at If = 350 mA. Peak Wavelength Shift vs. Junction Temperature Figure 7. Peak wavelength shift vs. junction temperature at If = 350 mA. LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 7 Typical Translation from Peak Wavelength to Dominant Wavelength Figure 8. Typical translation from peak wavelength to dominant wavelength at Tj = 25°C, If = 350 mA. LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 8 Radiation Patterns Figure 9. Typical spatial radiation pattern at Tj = 25°C, If = 350 mA. Figure 10. Typical polar radiation pattern for LUXEON Flip Chip. Note for Figures 9 and 10: Radiation pattern is measured for the die packaged on ceramic tile with high reflective surface and dome encapsulation. LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 9 Bin Structure for LUXEON Flip Chip LUXEON Flip Chip is characterized at Tj = 25°C, If = 350 mA and sorted on bin sheets. A specific bin sheet only contains LUXEON Flip Chip within a single bin for radiometric power, peak wavelength, and forward voltage. An order for a specific part number at a given peak wavelength bin can be filled from any bin combination of radiometric flux and forward voltage. Bin sheets are labeled by a four digit alphanumeric CAT code ABCD following the format below. Table 5. A BC D Radiometric Power (mW)[1] Peak Wavelength (nm) [2] Forward Voltage (V) Bin Code Min. Max. Bin Code Min. Max. Bin Code Min. Max. E 450 500 3x 440 445 7 2.7 2.8 F 500 550 4x 445 450 8 2.8 2.9 G 550 600 5x 450 455 9 2.9 3.0 H 600 650 6x 455 460 0 3.0 3.1 Notes for Table 5: 1. Radiometric power values are based on a die packaged on ceramic tile with high reflective surface and dome encapsulation. The availability of flux bins will vary depending on peak wavelength. 2. Limited availability for bin 3x and 6x. LUXEON Flip Chip DS116 20131105 ©2013 Philips Lumileds Lighting Company. 10 Who We Are Philips Lumileds focuses on one goal: Creating the world’s highest performing LEDs. The company pioneered the use of solid-state lighting in breakthrough products such as the first LED backlit TV, the first LED flash in camera phones, and the first LED daytime running lights for cars. Today we offer the most comprehensive portfolio of high quality LEDs and uncompromising service. Philips Lumileds brings LED’s qualities of energy efficiency, digital control and long life to spotlights, downlights, high bay and low bay lighting, indoor area lighting, architectural and specialty lighting as well as retrofit lamps. Our products are engineered for optimal light quality and unprecedented efficacy at the lowest overall cost. By offering LEDs in chip, packaged and module form, we deliver supply chain flexibility to the inventors of next generation illumination. Philips Lumileds understands that solid state lighting is not just about energy efficiency. It is about elegant design. Reinventing form. Engineering new materials. Pioneering markets and simplifying the supply chain. It’s about a shared vision. Learn more about our comprehensive portfolio of LEDs at www.philipslumileds.com. No. E352519 RoHS COMPLIANT Philips Lumileds Lighting Company shall not be liable for any kind of loss of data or any other damages, direct, indirect or consequential, resulting from the use of the provided information and data. Although Philips Lumileds Lighting Company has attempted to provide the most accurate information and data, the materials and services information and data are provided “as is” and Philips Lumileds Lighting Company neither warranties, nor guarantees the contents and correctness of the provided information and data. Philips Lumileds Lighting Company reserves the right to make changes without notice. You as user agree to this disclaimer and user agreement with the download or use of the provided materials, information and data. ©2013 Philips Lumileds Lighting Company. All rights reserved. LUXEON is a registered trademark of the Philips Lumileds Lighting Company in the United States and other countries. www.philipslumileds.com www.philipslumileds.cn.com DS116 20131105