Diodes DMN3012LFG-13 30v synchronous n-channel enhancement mode mosfet Datasheet

DMN3012LFG
Green
30V SYNCHRONOUS N-CHANNEL ENHANCEMENT MODE MOSFET
PowerDI3333-8 (Type D)
Product Summary
Features and Benefits
Device
BVDSS
RDS(ON) max
Q1
30V
12mΩ @ VGS = 5V, ID = 15A
Q2
30V
6mΩ @ VGS = 5V, ID = 15A






Description and Applications
100% Unclamped Inductive Switch (UIS) Test in Production
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
This new generation MOSFET is designed to minimize the on-state
resistance (RDS(ON)) and yet maintain superior switching performance,
Mechanical Data
making it ideal for high efficiency power management applications.

Case: PowerDI 3333-8 (Type D)

Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.044 grams (Approximate)


DC-DC Converters
Power Management Functions




®
PowerDI3333-8 (Type D)
Pin1
D1
S1/D2
D1
S1/D2
S2
G1
S1/D2
S1/D2
Top View
G2
Top View
Pin Configuration
Bottom View
Ordering Information (Note 4)
Part Number
DMN3012LFG-7
DMN3012LFG-13
Notes:
Case
PowerDI3333-8 (Type D)
PowerDI3333-8 (Type D)
Packaging
1000 / Tape & Reel
3000 / Tape & Reel
1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.
YYWW
Marking Information
N04 = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Two Digits of Year (ex: 17 = 2017)
WW = Week Code (01 to 53)
N04
G72
PowerDI is a registered trademark of Diodes Incorporated.
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
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© Diodes Incorporated
DMN3012LFG
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current @ VGS = 5V
TC = +25C
TC = +70C
TA = +25C
TA = +70C
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)
Continuous Source-Drain Diode Current (Note 5)
Avalanche Current (Note 6) L = 0.1mH
Avalanche Energy (Note 6) L = 0.1mH
Q1
Q2
ID
30
±10
20
16
ID
10
8
70
2.7
34
58
IDM
IS
IAS
EAS
Unit
V
V
A
A
100
3.2
50
125
A
A
A
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation
Thermal Resistance, Junction to Ambient (Note 5)
Symbol
TC = +25°C
TC = +70°C
Steady State
t<10s
Value
2.2
1.4
58
36
9.5
-55 to +150
PD
RJA
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
RJC
TJ, TSTG
Unit
W
°C/W
°C
Electrical Characteristics Q1 (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge at VTH
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
Symbol
Min
Typ
Max
Unit
BVDSS
IDSS
IGSS
30
—
—
—
—
—
—
1
±100
V
μA
nA
VGS = 0V, ID = 250μA
VDS = 20V, VGS = 0V
VGS = ±10V, VDS = 0V
VGS(TH)
RDS(ON)
|Yfs|
VSD
1
—
—
—
—
10.5
27
—
2.1
12
—
1.0
V
mΩ
S
V
VDS = VGS, ID = 250μA
VGS = 5V, ID = 15A
VDS = 5V, ID = 15A
VGS = 0V, IS = 15A
Ciss
Coss
Crss
—
—
—
650
314
12
850
410
16
pF
VDS = 15V, VGS = 0V,
f = 1.0MHz
Rg
—
1.63
3.3
Ω
VDS = 0V, VGS = 0V, f =
1.0MHz
Qg
Qg(TH)
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
4.7
0.91
1.6
0.9
5.1
2.7
6.4
2.3
24.5
8.3
6.1
—
—
—
7.7
—
9.6
—
—
—
nC
VDS = 15V, ID = 15A
ns
VDD = 15V, VGS = 4.5V,
ID = 15A, RG = 2Ω
ns
nC
IF = 15A, di/dt = 300A/μs
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Test Condition
October 2017
© Diodes Incorporated
DMN3012LFG
Electrical Characteristics Q2 (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = +25°C
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge at VTH
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes:
Symbol
Min
Typ
Max
Unit
Test Condition
BVDSS
IDSS
IGSS
30
—
—
—
—
—
—
1.0
±100
V
μA
nA
VGS = 0V, ID = 250μA
VDS = 20V, VGS = 0V
VGS = ±10V, VDS = 0V
VGS(TH)
RDS(ON)
|Yfs|
VSD
0.75
—
—
—
—
5.2
46
—
1.15
6
—
1.0
V
mΩ
S
V
VDS = VGS, ID = 250μA
VGS = 5V, ID = 15A
VDS = 5V, ID = 15A
VGS = 0V, IS = 15A
Ciss
Coss
Crss
Rg
Qg
Qg(TH)
Qgs
Qgd
tD(ON)
tR
tD(OFF)
tF
tRR
QRR
—
—
—
—
—
—
—
—
—
—
—
—
—
—
1137
620
24
0.54
9.7
0.96
1.7
1.2
4.4
3.5
12.4
2.9
30.5
10.8
1480
810
32
1.1
12.6
—
—
—
6.6
—
18.6
—
—
—
pF
pF
pF
Ω
nC
nC
nC
nC
ns
ns
ns
ns
ns
nC
VDS = 15V, VGS = 0V,
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1MHz
VDS = 15V, ID = 15A
VDD = 15V, VGS = 4.5V,
ID = 15A, RG = 2Ω
IF = 15A, di/dt = 300A/μs
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
Typical Circuit
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
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DMN3012LFG
50.0
50.0
VGS = 3.5V
45.0
VGS = 4.0V
VGS = 4.5V
35.0
VGS = 3.0V
30.0
25.0
VGS = 3.0V
40.0
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
40.0
VGS = 2.5V
45.0
VGS = 5.0V
20.0
VGS = 2.5V
15.0
10.0
VGS = 3.5V
35.0
VGS = 2.0V
30.0
VGS = 4.0V
25.0
VGS = 4.5V
20.0
VGS = 5.0V
15.0
10.0
5.0
5.0
VGS = 2.0V
0.0
0.0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0
0.5
1
1.5
2
2.5
3.5
4
4.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Q1 Typical Output Characteristic
Figure 2. Q2 Typical Output Characteristic
5
30
VDS = 5V
VDS = 5V
25
ID, DRAIN CURRENT (A)
25
20
15
TJ = 150oC
TJ = 125oC
10
TJ = 85oC
TJ = 25oC
5
20
15
TJ = 150oC
10
TJ = 125oC
TJ = 85oC
5
TJ = 25oC
TJ = -55oC
TJ = -55oC
0
0
0
0.5
1
1.5
2
2.5
0
3
VGS, GATE-SOURCE VOLTAGE (V)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
0.015
0.013
0.011
VGS = 5V
0.009
0.007
0.005
0
5
10
15
20
25
0.5
1
1.5
2
2.5
3
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Q2 Typical Transfer Characteristic
Figure 3. Q1 Typical Transfer Characteristic
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
3
VDS, DRAIN-SOURCE VOLTAGE (V)
30
ID, DRAIN CURRENT (A)
VGS = 1.5V
VGS = 1.3V
0.01
0.008
0.006
VGS = 5V
0.004
0.002
30
0
0
5
10
15
20
25
30
ID, DRAIN-SOURCE CURRENT (A)
ID, DRAIN-SOURCE CURRENT (A)
Figure 5. Q1 Typical On-Resistance vs. Drain Current
and Gate Voltage
Figure 6. Q2 Typical On-Resistance vs. Drain Current
and Gate Voltage
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
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October 2017
© Diodes Incorporated
0.02
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
()
DMN3012LFG
VGS = 5.0V
0.018
0.016
TJ = 150oC
TJ = 125oC
0.014
0.012
0.01
0.008
TJ = 25oC
TJ = 85oC
0.006
TJ = -55oC
0.004
0.002
0.01
VGS = 5.0V
0.008
0.006
0.004
TJ = -55oC
0
0
5
10
15
20
25
30
0
ID, DRAIN CURRENT (A)
Figure 7. Q1 Typical On-Resistance vs. Drain Current
and Temperature
VGS = 5V, ID = 15A
1.2
0.9
5
10
15
20
25
30
ID, DRAIN CURRENT (A)
Figure 8. Q2 Typical On-Resistance vs. Drain Current
and Temperature
1.5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
1.5
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
TJ = 25oC
TJ = 85oC
0.002
0
1.2
VGS = 5V, ID = 15A
0.9
0.6
0.6
-50
-25
0
25
50
75
100
125
-50
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 9. Q1 On-Resistance Variation with
Temperature
0.02
0.015
VGS = 5V, ID = 15A
0.01
0.005
0
-50
-25
0
25
50
75
100
125
Document number: DS38967 Rev. 5 - 2
0
25
50
75
100
125
150
0.01
0.008
VGS = 5V, ID = 15A
0.006
0.004
0.002
150
0
-50
-25
0
25
50
75
100
125
150
TJ, JUNCTION TEMPERATURE (℃)
Figure 12. Q2 On-Resistance Variation with
Temperature
TJ, JUNCTION TEMPERATURE (℃)
Figure 11. Q1 On-Resistance Variation with
Temperature
DMN3012LFG
-25
TJ, JUNCTION TEMPERATURE (℃)
Figure 10. Q2 On-Resistance Variation with
Temperature
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
RDS(ON), DRAIN-SOURCE ON-RESISTANCE ()
TJ = 150oC
TJ = 125oC
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DMN3012LFG
2
VGS(TH), GATE THRESHOLD VOLTAGE (V)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
2
1.8
1.6
ID = 1mA
1.4
1.2
1
ID = 250µA
0.8
0.6
0.4
0.2
1.8
1.6
1.4
1.2
ID = 1mA
1
0.8
0.6
ID = 250µA
0.4
0.2
0
0
-50
-25
0
25
50
75
100
125
150
-50
30
25
50
75
100
125
150
30
VGS = 0V
VGS = 0V
25
IS, SOURCE CURRENT (A)
25
IS, SOURCE CURRENT (A)
0
TJ, JUNCTION TEMPERATURE (℃)
Figure 14. Q2 Gate Threshold Variation vs. Junciton
Temperature
TJ, JUNCTION TEMPERATURE (℃)
Figure 13. Q1 Gate Threshold Variation vs. Junciton
Temperature
20
15
TJ = 150oC
TJ = 125oC
10
TJ = 85oC
TJ = 25oC
5
20
15
TJ = 150oC
10
TJ = 125oC
TJ = 85oC
5
TJ = 25oC
TJ = -55oC
TJ = -55oC
0
0
0
0.3
0.6
0.9
0
1.2
0.3
0.6
0.9
1.2
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 16. Q2 Diode Forward Voltage vs. Current
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 15. Q1 Diode Forward Voltage vs. Current
10000
100000
TJ = 150oC
TJ = 150oC
10000
1000
IDSS, LEAKAGE CURRENT (nA)
IDSS, LEAKAGE CURRENT (nA)
-25
TJ = 125oC
100
TJ = 85oC
10
TJ = 25oC
1
1000
TJ = 125oC
100
TJ = 85oC
0.1
10
TJ = 25oC
1
0.1
0
5
10
15
20
25
30
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 17. Q1 Typical Drain-Source Leakage Current
vs. Voltage
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
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0
5
10
15
20
25
30
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 18. Q2 Typical Drain-Source Leakage Current
vs. Voltage
October 2017
© Diodes Incorporated
4.5
4.5
4
4
3.5
3.5
3
3
VGS (V)
VGS (V)
DMN3012LFG
2.5
2
1.5
2.5
VDS = 15V, ID = 15A
2
1.5
VDS = 15V, ID = 15A
1
1
0.5
0.5
0
0
0
2
4
6
8
0
10
1
2
3
4
5
Qg (nC)
Qg (nC)
Figure 19. Q1 Gate Charge
Figure 20. Q2 Gate Charge
100
1000
RDS(ON)
Limited
PW = 100µs
RDS(ON)
Limited
PW = 1ms
PW = 100µs
10
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
100
DC
1
0.1
0.01
PW = 10s
TJ(Max) = 150℃
TC = 25℃
PW = 1s
Single Pulse
DUT on 1*MRP PW = 100ms
PW = 10ms
Board
VGS = 5V
P = 1ms
1
DC
1
0.1
W
0.1
10
10
TJ(Max) = 150℃
PW = 10s
TC = 25℃
Single Pulse
PW = 1s
DUT on 1*MRP
PW = 100ms
Board
VGS = 5V
P = 10ms
W
0.01
0.01
100
0.1
VDS, DRAIN-SOURCE VOLTAGE (V)
1
10
100
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 22. Q2 SOA, Safe Operation Area
Figure 21. Q1 SOA, Safe Operation Area
P(pk), PEAK TRANSIENT POWER (W)
600
Single Pulse
RθJA = 112℃/W
RθJA (t) = RθJA * r(t)
TJ - TA = P * RθJA (t)
500
400
300
200
100
0
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 23. Single Pulse Maximum Power Dissipation
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
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DMN3012LFG
r(t), TRANSIENT THERMAL RESISTANCE
1
D=0.9
D=0.7
D=0.5
D=0.3
0.1
D=0.1
D=0.05
D=0.02
0.01
D=0.01
D=0.005
RθJA (t) = r(t) * RθJA
RθJA = 112℃/W
Duty Cycle, D = t1/t2
D=Single Pulse
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t1, PULSE DURATION TIME (sec)
Figure 24. Transient Thermal Resistance
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
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DMN3012LFG
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI3333-8 (Type D)
A1
A3
A
A3a
La
D
D2
b2
1
E E2
d
k
PIN# 1 I.D.
k1
b
z
e
L
PowerDI33330-8
(Type D)
Dim
Min
Max
Typ
A
1.17
1.23 1.20
A1
0.00
0.05 0.02
A3
0.15
0.25 0.20
A3a
0.05
0.15 0.10
b
0.30
0.40 0.35
b2
0.95
1.05 1.00
D
3.20
3.40 3.30
D2
2.65
2.75 2.70
E
3.20
3.40 3.30
E2
1.75
1.85 1.80
d
0.15
0.25 0.20
e
--0.65
k
--0.30
k1
0.21
0.31 0.26
L
0.40
0.50 0.45
La
0.15
0.25 0.20
z
0.25
0.35 0.30
All Dimensions in mm
These exposed die clip may vary
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
PowerDI3333-8 (Type D)
X4
X3
X2
Dimensions
C
Y2 Y3
Y4
Y1
C
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
Y4
Value
(in mm)
0.650
0.450
1.100
2.400
2.800
3.500
0.650
0.300
1.390
1.900
3.600
Y(7x)
X1
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
X(6x)
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DMN3012LFG
IMPORTANT NOTICE
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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final and determinative format released by Diodes Incorporated.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
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2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2017, Diodes Incorporated
www.diodes.com
DMN3012LFG
Document number: DS38967 Rev. 5 - 2
10 of 10
www.diodes.com
October 2017
© Diodes Incorporated
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