Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
General Description
Features
The AP2822 is an integrated high-side power switch
that consists of N-Channel MOSFET, charge pump,
over current & temperature and other related protection
circuits. The switch’s low RDS(ON), 85mΩ, is designed
to meet USB voltage drop requirements. The IC
includes soft-start to limit inrush current, over-current
protection, load short protection with fold-back, and
thermal shutdown to avoid switch failure during hot
plug-in. Under voltage lockout (UVLO) function is
used to ensure the device remain off unless there is a
valid input voltage present. A FLAG output is
available to indicate fault conditions to the local USB
controller.
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The AP2822 is available in the standard package of
SOT-23-5.
AP2822
Low MOSFET On Resistance: 85mΩ
Compliant to USB Specifications
Available 4 Versions of Continuous Load:
0.5A/1.0A/1.5A/2.0A
Logic Level Enable Pin: Available with
Active-high or Active-low Version
Operating Voltage Range: 2.7V to 5.5V
Low Supply Current: 68µA (Typ.)
Low Shutdown Current: 1.0µA (Max)
Under-voltage Lockout
Soft Start-up
Over-current Protection
Over Temperature Protection
Load Short Protection with Fold-back
No Reverse Current When Power Off
Deglitched FLAG Output with Open Drain
With Output Shutdown Pull-low Resistor
Applications
•
•
•
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•
USB Power Management
USB Bus/Self Powered Hubs
Hot-plug Power Supplies
Battery-charger Circuits
Notebooks, Motherboard PCs
SOT-23-5
Figure 1. Package Type of AP2822
Dec. 2012
Rev 1. 1
BCD Semiconductor Manufacturing Limited
1
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Pin Configuration
K/KA/KB/KE Package
（SOT-23-5）
K
FLAG
1
GND
2
EN
3
KA
5
4
VOUT
VIN
EN
1
GND
2
FLAG
3
KB
VOUT
1
GND
2
VIN
3
5
VOUT
4
VIN
5
VIN
4
EN
KE
5
4
VOUT
EN
VOUT
1
GND
2
FLAG
3
Figure 2. Pin Configuration of AP2822 (Top View)
Dec. 2012
Rev 1. 1
BCD Semiconductor Manufacturing Limited
2
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Pin Descriptions
Pin Number
1(K)
3(KA/KE)
2
Pin Name
Function
FLAG
Fault flag pin, output with open drain, need a pull-up resistor
in application, active low to indicate OCP or OTP
GND
Ground
3(K)
1(KA)
EN
Chip enable control input, active low or high
VIN
Supply input pin
4(KB/KE)
4(K/KA)
3(KB)
5(KE)
5(K/KA)
1,5(KB)
VOUT
Switch output voltage
1(KE)
Dec. 2012
Rev 1. 1
BCD Semiconductor Manufacturing Limited
3
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Functional Block Diagram
VIN
3(1){4}[4]
EN
4(4){3}[5]
Clock
Gate Control
Band Gap
Reference
Over Current
Limiting
CMP
Current
Sense
5(5){1,5}[1]
VOUT
Shutdown
Signal
1(3)[3]
UVLO
GND
FLAG
FLAG
Deglitch Logic
Thermal
Sense
2(2){2}[2]
A(B){C}[D]
A: SOT-23-5(K Package)
B: SOT-23-5(KA Package)
C: SOT-23-5(KB Package)
D: SOT-23-5(KE Package)
Figure 3. Functional Block Diagram of AP2822
Dec. 2012
Rev 1. 1
BCD Semiconductor Manufacturing Limited
4
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Ordering Information
AP2822
-
Circuit Type
G1: Green
TR: Tape & Reel
Condition
A: Active High (Continuous 0.5A)
B: Active Low (Continuous 0.5A)
C: Active High (Continuous 1.0A)
D: Active Low (Continuous 1.0A)
E: Active High (Continuous 1.5A)
F: Active Low (Continuous 1.5A)
G: Active High (Continuous 2.0A)
H: Active Low (Continuous 2.0A)
Package
SOT-23-5
Dec. 2012
Temperature
Range
Condition
-40 to 85°C
Active High
(Continuous 0.5A)
Active Low
(Continuous 0.5A)
Active High
(Continuous 1.0A)
Active Low
(Continuous 1.0A)
Active High
(Continuous 1.5A)
Active Low
(Continuous 1.5A)
Active High
(Continuous 2.0A)
Active Low
(Continuous 2.0A)
Package
K/KA/KB/KE: SOT-23-5
Part Number
Marking ID
Packing
Type
AP2822AKTR-G1
GCQ
Tape & Reel
AP2822BKTR-G1
GCR
Tape & Reel
AP2822CKTR-G1
GCS
Tape & Reel
AP2822DKTR-G1
GCT
Tape & Reel
AP2822EKTR-G1
GCU
Tape & Reel
AP2822FKTR-G1
GCV
Tape & Reel
AP2822GKTR-G1
GCW
Tape & Reel
AP2822HKTR-G1
GCZ
Tape & Reel
Rev 1. 1
BCD Semiconductor Manufacturing Limited
5
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Ordering Information (Continued)
Package
SOT-23-5
SOT-23-5
Dec. 2012
Temperature
Range
-40 to 85°C
-40 to 85°C
Condition
Active High
(Continuous 0.5A)
Active Low
(Continuous 0.5A)
Active High
(Continuous 1.0A)
Active Low
(Continuous 1.0A)
Active High
(Continuous 1.5A)
Active Low
(Continuous 1.5A)
Active High
(Continuous 2.0A)
Active Low
(Continuous 2.0A)
Active High
(Continuous 0.5A)
Active Low
(Continuous 0.5A)
Active High
(Continuous 1.0A)
Active Low
(Continuous 1.0A)
Active High
(Continuous 1.5A)
Active Low
(Continuous 1.5A)
Active High
(Continuous 2.0A)
Active Low
(Continuous 2.0A)
Part Number
Marking ID
Packing
Type
AP2822AKATR-G1
GDQ
Tape & Reel
AP2822BKATR-G1
GDR
Tape & Reel
AP2822CKATR-G1
GDS
Tape & Reel
AP2822DKATR-G1
GDT
Tape & Reel
AP2822EKATR-G1
GDU
Tape & Reel
AP2822FKATR-G1
GDV
Tape & Reel
AP2822GKATR-G1
GDW
Tape & Reel
AP2822HKATR-G1
GDZ
Tape & Reel
AP2822AKBTR-G1 GLA
Tape & Reel
AP2822BKBTR-G1 GLB
Tape & Reel
AP2822CKBTR-G1 GLC
Tape & Reel
AP2822DKBTR-G1 GLD
Tape & Reel
AP2822EKBTR-G1 GLE
Tape & Reel
AP2822FKBTR-G1 GLF
Tape & Reel
AP2822GKBTR-G1 GLG
Tape & Reel
AP2822HKBTR-G1 GLH
Tape & Reel
Rev 1. 1
BCD Semiconductor Manufacturing Limited
6
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Ordering Information (Continued)
Package
SOT-23-5
Temperature
Range
Condition
-40 to 85°C
Active High
(Continuous 0.5A)
Active Low
(Continuous 0.5A)
Active High
(Continuous 1.0A)
Active Low
(Continuous 1.0A)
Active High
(Continuous 1.5A)
Active Low
(Continuous 1.5A)
Active High
(Continuous 2.0A)
Active Low
(Continuous 2.0A)
Part Number
Marking ID
Packing
Type
AP2822AKETR-G1
GLI
Tape & Reel
AP2822BKETR-G1
GLJ
Tape & Reel
AP2822CKETR-G1
GLK
Tape & Reel
AP2822DKETR-G1
GLL
Tape & Reel
AP2822EKETR-G1
GLM
Tape & Reel
AP2822FKETR-G1
GLN
Tape & Reel
AP2822GKETR-G1
GLO
Tape & Reel
AP2822HKETR-G1
GLP
Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant
and green.
Dec. 2012
Rev 1. 1
BCD Semiconductor Manufacturing Limited
7
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Value
Unit
VIN
6.0
V
TJ
150
ºC
Storage Temperature Range
TSTG
-65 to 150
ºC
Lead Temperature (Soldering, 10sec)
TLEAD
260
ºC
θJA
TBD
Power Supply Voltage
Operating
Range
Junction
Temperature
Thermal Resistance
(Junction to Ambient)
o
C/W
ESD (Machine Model)
200
V
ESD (Human Body Model)
2000
V
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Supply Voltage
Operating Ambient
Range
Dec. 2012
Temperature
Symbol
Min
Max
Unit
VIN
2.7
5.5
V
TA
-40
85
°C
Rev 1. 1
BCD Semiconductor Manufacturing Limited
8
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Electrical Characteristics
(VIN=5.0V, CIN=2.2µF, COUT=1.0µF, Typical TA=25°C, unless otherwise specified)
Parameter
Symbol
Supply Voltage
VIN
Switch On Resistance
RDS(ON)
Current Limit
ILIMIT
Supply Current
ISUPPLY
Fold-back Short Current
ISHORT
Shutdown Supply Current
ISHUTDOWN
Condition
Min Typ Max Unit
2.7
VIN=5.0V, IOUT=2.0A
5.5
V
85
110
mΩ
AP2822A/B(0.5A) , VOUT=4.0V
0.7
1.0
1.4
AP2822C/D(1.0A), VOUT=4.0V
1.1
1.5
2.1
AP2822E/F(1.5A), VOUT=4.0V
1.65
2.2
2.8
AP2822G/H(2.0A), VOUT=4.0V
2.2
2.7
3.2
VIN=5.0V, No Load
68
95
AP2822 A/B/C/D, VOUT=0V
0.7
AP2822 E/F/G/H, VOUT=0V
1.1
Chip Disable, Shutdown Mode
0.1
A
µA
A
1.0
µA
Enable High Input Threshold
VENH
1.6
5.5
V
Enable Low Input Threshold
VENL
0
1.0
V
Force 0V to 5.0V at EN Pin
-1.0
1.0
µA
VIN Increasing from 0V
2.2
3.0
V
Enable Pin Input Current
Under
Voltage
Threshold Voltage
Lockout
IEN
VUVLO
Under Voltage Hysteresis
VUVLOHY
Reverse Current
IREVERSE
Output Pull Low Resistance
after Shutdown
tON
FLAG Pin Delay Time
tDFLG
FLAG Pin Low Voltage
VFLG
FLAG Pin Leakage Current
Thermal
Temperature
Shutdown
Thermal Shutdown Hysteresis
Dec. 2012
0.2
Chip Disable, VOUT>VIN
RDISCHARGE
Output Turn-on Time
ILEAKAGE
2.5
From Enable Active to 90% of
Output
From Over Current Fault Condition
to Flag Active
ISINK=5.0mA
0.1
1.0
µA
100
200
Ω
500
5
µs
10
15
ms
35
70
mV
1.0
µA
FLAG Disable, Force 5.0V
TOTSD
150
THYOTSD
30
Rev 1. 1
V
o
C
BCD Semiconductor Manufacturing Limited
9
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Typical Performance Characteristics
100
100
VIN=5V
Enable Active
No Load
90
80
Supply Current (μA)
Supply Current (μA)
80
Enable Active
90
70
60
50
40
30
70
60
O
TA=-40 C
50
O
TA=25 C
40
O
TA=85 C
30
20
20
10
10
0
0
-40.0
-10
-20.0
0.0
20.0
40.0
60.0
80.0
1.0
1.5
2.0
2.5
O
Ambient Temperature ( C)
Figure 4. Supply Current vs. Ambient Temperature
3.5
4.0
4.5
5.0
5.5
Figure 5. Supply Current vs. Supply Voltage
200
180
IOUT=1.0A
170
IOUT=1.0A
180
160
150
160
140
140
130
120
RDS(ON) (mΩ)
RDS(ON) (mΩ)
3.0
Supply Voltage (V)
VIN=5.0V
VIN=3.3V
100
80
O
TA=-40 C
120
O
TA=25 C
110
O
TA=85 C
100
90
80
60
70
60
40
50
20
40
0
-40
-20
0
20
40
60
30
80
3.0
O
3.5
4.0
4.5
5.0
Ambient Temperature ( C)
Supply Voltage (V)
Figure 6. RDS(ON) vs. Ambient Temperature
Figure 7. RDS(ON) vs. Supply Voltage
Dec. 2012
Rev 1. 1
5.5
BCD Semiconductor Manufacturing Limited
10
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Typical Performance Characteristics (Continued)
1.4
For AP2822A/B
1.2
1.2
1.0
1.0
Current Limit (A)
Current Limit (A)
1.4
0.8
O
TA= -40 C
0.6
O
TA= 25 C
0.4
O
TA= 85 C
0.2
For AP2822A/B
0.8
VIN=5.0V
VIN=3.3V
0.6
0.4
0.2
0.0
3.0
3.5
4.0
4.5
5.0
0.0
-40
5.5
-20
Supply Voltage (V)
0
20
40
60
80
O
Ambient Temperature ( C)
Figure 8. Current Limit vs. Supply Voltage
Figure 9. Current Limit vs. Ambient Temperature
2.0
2.0
For AP2822C/D
1.9
For AP2822C/D
1.9
1.8
1.8
Current Limit (A)
Current Limit (A)
1.7
1.6
1.5
1.4
TA=-40 C
1.3
TA=25 C
1.2
TA=85 C
o
0
VIN=5.0V
VIN=3.3V
1.7
1.6
1.5
1.4
0
1.3
1.1
1.0
3.0
3.5
4.0
4.5
5.0
1.2
-40
5.5
Supply Voltage (V)
0
20
40
60
80
O
Ambient Temperature ( C)
Figure 10. Current Limit vs. Supply Voltage
Dec. 2012
-20
Figure 11. Current Limit vs. Ambient Temperature
Rev 1. 1
BCD Semiconductor Manufacturing Limited
11
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Typical Performance Characteristics (Continued)
3.0
3.0
For AP2822E/F
2.6
2.6
2.4
2.4
2.2
2.0
O
TA=-40 C
1.8
O
TA=25 C
O
TA=85 C
1.6
For AP2822E/F
2.8
Current Limit (A)
Current Limit (A)
2.8
2.2
2.0
VIN=5.0V
VIN=3.3V
1.8
1.6
1.4
1.4
1.2
3.0
3.5
4.0
4.5
5.0
1.2
-40
5.5
-20
Supply Voltage (V)
20
40
60
80
O
Figure 12. Current Limit vs. Supply Voltage
Figure 13. Current Limit vs. Ambient Temperature
3.6
3.6
For AP2822G/H
3.4
3.2
3.0
3.0
2.8
2.6
2.4
o
TA=-40 C
o
2.2
TA=25 C
2.0
TA=85 C
For AP2822G/H
3.4
3.2
Current Limit (A)
Current Limit (A)
0
Ambient Temperature ( C)
2.8
2.6
VIN=5.0V
VIN=3.3V
2.4
2.2
o
2.0
1.8
1.8
1.6
-40
1.6
3.0
3.5
4.0
4.5
5.0
5.5
Supply Voltage (V)
0
20
40
60
80
O
Ambient Temperature ( C)
Figure 14. Current Limit vs. Supply Voltage
Dec. 2012
-20
Figure 15. Current Limit vs. Ambient Temperature
Rev 1. 1
BCD Semiconductor Manufacturing Limited
12
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
15
2.70
Enable Active
2.65
Flag Delay Time during Over Current (ms)
Under Voltage Lockout Threshold Voltage (V)
Typical Performance Characteristics (Continued)
2.60
2.55
VIN Rising
VIN Falling
2.50
2.45
2.40
2.35
2.30
2.25
2.20
-40.0
-20.0
0.0
20.0
40.0
60.0
80.0
VIN=5V
Enable Active
14
13
12
11
10
9
8
7
6
5
-40.0
-20.0
0.0
40.0
60.0
80.0
Ambient Temperature ( C)
Ambient Temperature ( C)
Figure 16. UVLO Voltage vs. Ambient Temperature
Figure 17. Flag Delay Time during Over Current
vs. Ambient Temperature
1.30
TA=25 C
VIN=5V
Enable Active
12
10
8
6
1.26
1.24
1.22
1.20
1.18
1.16
1.14
1.12
1.10
1.08
1.06
1.04
For AP2822 E/F/G/H
1.02
1.00
3.0
3.5
4.0
4.5
5.0
5.5
Supply Voltage (V)
3.0
3.5
4.0
4.5
5.0
Supply Voltage (V)
Figure 18. Flag Delay Time during Over Current
vs. Supply Voltage
Dec. 2012
VIN=5V
Enable Active
1.28
O
14
Output Short to GND Current (A)
Flag Delay Time during Over Current (ms)
20.0
O
O
Figure 19. Output Short to GND Current
vs. Supply Voltage
Rev 1. 1
BCD Semiconductor Manufacturing Limited
13
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Typical Performance Characteristics (Continued)
1.6
VIN=5V
VIN=5V
Enable Active
1.5
1.4
Enable Threshold Voltage (V)
Output Short to GND Current (A)
1.5
1.3
1.2
1.1
1.4
VENH
VENL
1.3
1.2
1.1
For AP2822 E/F/G/H
1.0
-40.0
-20.0
0.0
20.0
40.0
60.0
1.0
-40.0
80.0
-20.0
0.0
20.0
40.0
60.0
80.0
O
O
Ambient Temperature ( C)
Ambient Temperature ( C)
Figure 20. Output Short to GND Current
vs. Ambient Temperature
Figure 21. Enable Threshold Voltage
vs. Ambient Temperature
1.7
O
TA=25 C
Enable Threshold Voltage (V)
1.6
VEN
5V/div
1.5
1.4
VENH
VENL
1.3
1.2
IINRUSH
20mA/div
1.1
1.0
VOUT
1V/div
0.9
0.8
0.7
3.0
3.5
4.0
4.5
5.0
Time 500μs/div
5.5
Supply Voltage (V)
Figure 22. Enable Threshold Voltage
vs. Supply Voltage
Dec. 2012
Figure 23. Output Turn On and Rise Time
(CIN=1.0μF, COUT=1.0μF, No Load)
Rev 1. 1
BCD Semiconductor Manufacturing Limited
14
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Typical Performance Characteristics (Continued)
VEN
5V/div
VEN
5V/div
IINRUSH
1A/div
IINRUSH
1A/div
VOUT
1V/div
VOUT
1V/div
Time 500μs/div
Time 500μs/div
Figure 24. Output Turn On and Rise Time
(CIN=1.0μF, COUT=1.0μF, RL=3.3Ω)
Figure 25. Output Turn On and Rise Time
(CIN=1.0μF, COUT=100μF, No Load)
VEN
5V/div
VEN
5V/div
COUT=100μF
COUT=22μF
VOUT
1V/div
COUT=470μF
COUT=220μF
VOUT
1V/div
IOUT
1A/div
COUT=1μF
Time 500μs/div
Time 5ms/div
Figure 26. Output Turn Off and Fall Time
(VIN=5V, CIN=1.0μF, No Load)
Dec. 2012
Figure 27. Output Turn Off and Fall Time
(VIN=5V, CIN=1.0μF, COUT=470μF, RL=3.3Ω)
Rev 1. 1
BCD Semiconductor Manufacturing Limited
15
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Typical Performance Characteristics (Continued)
VFLAG
1V/div
VEN
5V/div
IOUT
1A/div
IOUT
1A/div
VOUT
1V/div
VOUT
1V/div
Time 5ms/div
Time 20ms/div
Figure 28. Output Short to GND Current
(VIN=5V, CIN=1.0μF)
Figure 29. FLAG Response during Over Current
VFLAG
1V/div
IOUT
1A/div
VOUT
1V/div
Time 5ms/div
Figure 30. FLAG Response during
Over Temperature (TA=125 ºC)
Dec. 2012
Rev 1. 1
BCD Semiconductor Manufacturing Limited
16
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Typical Application
R
10kΩ
VIN =5V
4(4){3}[5]
VIN
C IN
(Note2)
2.2µF
1(3)[3]
USB Controller
AP2822
3(1){4}[4]
Enable
FLAG
EN
VOUT
GND
5(5){1,5}[1]
COUT
1µF
2(2){2}[2]
VBUS
D+
DGND
A(B){C}[D]
A: SOT-23-5(K Package)
B: SOT-23-5(KA Package)
C: SOT-23-5(KB Package)
D: SOT-23-5(KE Package)
Note 2: 2.2µF input capacitor is enough in most application cases.
If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend
22µF.
Figure 31. Typical Application of AP2822
Dec. 2012
Rev 1. 1
BCD Semiconductor Manufacturing Limited
17
Preliminary Datasheet
0.5A to 2.0A High-side Power Distribution Switches
AP2822
Mechanical Dimensions
SOT-23-5
Unit: mm(inch)
2.820(0.111)
3.020(0.119)
0.100(0.004)
0.200(0.008)
0.200(0.008)
0.700(0.028)
REF
0.950(0.037)
TYP
0.300(0.012)
0.400(0.016)
0°
8°
1.800(0.071)
2.000(0.079)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
Dec. 2012
Rev 1. 1
BCD Semiconductor Manufacturing Limited
18
BCD Semiconductor Manufacturing Limited
http://www.bcdsemi.com
IMPORTANT NOTICE
IMPORTANT
NOTICE
BCD Semiconductor
BCD
Semiconductor Manufacturing
Manufacturing Limited
Limited reserves
reserves the
the right
right to
to make
make changes
changes without
without further
further notice
notice to
to any
any products
products or
or specifispecifications herein.
cations
herein. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not assume
assume any
any responsibility
responsibility for
for use
use of
of any
any its
its products
products for
for any
any
particular purpose,
particular
purpose, nor
nor does
does BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited assume
assume any
any liability
liability arising
arising out
out of
of the
the application
application or
or use
use
of any
of
any its
its products
products or
or circuits.
circuits. BCD
BCD Semiconductor
Semiconductor Manufacturing
Manufacturing Limited
Limited does
does not
not convey
convey any
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or
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others.
MAIN SITE
SITE
MAIN
- Headquarters
BCD
Semiconductor Manufacturing Limited
BCD
Semiconductor
Manufacturing Limited
- Wafer
Fab
No.
1600, Zi
Xing Road,
Shanghai ZiZhu
Science-basedLimited
Industrial Park, 200241, China
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Tel:
Fax: +86-21-24162277
800,+86-21-24162266,
Yi Shan Road, Shanghai
200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
REGIONAL SALES OFFICE
Shenzhen OfficeSALES OFFICE
REGIONAL
- Wafer
FabSemiconductor Manufacturing Limited
BCD
Shanghai
SIM-BCD
Semiconductor Manufacturing Co., Ltd.
- IC Design
Group
800 Yi
Shan Road,
Shanghai
200233,
China Corporation
Advanced
Analog
Circuits
(Shanghai)
Tel: +86-21-6485
1491,YiFax:
0008200233, China
8F, Zone B, 900,
Shan+86-21-5450
Road, Shanghai
Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
Taiwan Office
Shanghai
Semiconductor Manufacturing Co., Ltd., Shenzhen Office
BCD Taiwan
Semiconductor
Shenzhen SIM-BCD
Office
Office (Taiwan) Company Limited
Unit
A Room
1203, Skyworth
Bldg., Gaoxin
Ave.1.S., Nanshan
Shenzhen,
4F, 298-1,
Guang Road,(Taiwan)
Nei-Hu District,
Taipei,
Shanghai
SIM-BCD
Semiconductor
Manufacturing
Co., Ltd.District,
Shenzhen
Office
BCDRui
Semiconductor
Company
Limited
China
Taiwan
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
Tel:
+86-755-8826
Tel: +886-2-2656
2808
Room
E, 5F, Noble 7951
Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China
Taiwan
Fax:
+86-755-88267951
7865
Fax: +886-2-2656
28062808
Tel: +86-755-8826
Tel: +886-2-2656
Fax: +86-755-8826 7865
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BCD Office
Semiconductor Corp.
USA
30920Semiconductor
Huntwood Ave.Corporation
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BCD
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30920
Huntwood
Tel :94544,
+1-510-324-2988
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U.S.A
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