Material Content Data Sheet Sales Product Name BSC084P03NS3 G MA# MA001384732 Package PG-TDSON-8-5 Issued 4. September 2015 Weight* 119.41 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal non noble metal inorganic material non noble metal non noble metal inorganic material non noble metal < 10% silicon iron phosphorus copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead iron phosphorus copper iron phosphorus copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 7439-89-6 7723-14-0 7440-50-8 7439-89-6 7723-14-0 7440-50-8 1.835 1.54 0.038 0.03 wire encapsulation leadfinish plating solder heatspreader heat sink CLIP *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.54 15366 15366 317 0.011 0.01 37.762 31.62 31.66 316223 95 316635 0.057 0.05 0.05 478 478 0.085 0.07 713 6.046 5.06 36.449 30.52 35.65 305232 356579 1.470 1.23 1.23 12308 12308 0.166 0.14 0.14 1386 1386 0.046 0.04 0.037 0.03 1.758 1.47 0.011 0.01 0.003 0.00 11.320 9.48 0.022 0.02 0.007 0.01 22.292 18.67 50634 385 308 1.54 14719 28 9.49 94796 2. 3. 56 18.70 186674 Sum in total: 100.00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption 7a, Lead in high melting temperature type solders. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 94919 187 Important Remarks: 1. 15412 95 186917 1000000