Murata NFM21HC471R1H3 This product specification is applied to chip emifil Datasheet

Chip EMIFIL®Chip 3-terminal Capacitor for Automotive
NFM21HC471R1H3_ (0805, 470pF, DC50V)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Chip EMIFIL®Chip 3-terminal Capacitor used for Automotive Electronic equipment.
2.MURATA Part NO. System
(Ex.)
NFM
21
(1)L/W
Dimensions
HC
(2)Features
471
R
(3)Nominal
Capacitance
1H
(4)Temperature (5)DC Rated
Characteristics
Voltage
3
(6)Electrode
D
(7)Packaging
Code
3. Type & Dimensions
a)Equivalent Circuit
(1)-1 L
(1)-2 W
i
j
2.0±0.2
1.25±0.1
0.6±0.2
0.2+0.2/-0.1
T
e
0.85±0.1
0.3±0.2
(Unit:mm)
g
0.2 min.
4.Rated value
(3) Nominal Capacitance
Capacitance Tolerance
470 pF
±20 %
(5)
DC Rated
Voltage
Rated
Current
(mA)
DC 50 V
1A(DC)
DC
Resistance
Insulation
Resistance
300mΩmax.1000MΩmin.
Specifications and Test Methods
(Operating /Storage Temp. Range)
-55 to 125 °C / -55 to 125 °C
5.Package
mark
(7) Packaging
Packaging Unit
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
Product specifications in this catalog are as of Mar.3,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
NFM21HC471R1H3-01
1
■AEC-Q200 Murata Standard Specification and Test Methods
Electrical Performance
No
Item
1 Capacitance
(Cap.)
Specification
Shown in Rated value.
Test Method
Frequency
22 to 100pF : 1±0.1MHz
220pF to 1uF : 1±0.1kHz
Voltage : 1±0.2V(rms)
2 Insulation
Resistance(I.R.)
Voltage : Rated Voltage
Time : 2 minutes max.
3 DC Resistance
(Rdc1,2)
Measured with 100mA max.
Rdc1 : between signal terminals
Rdc2 : between ground terminals
Rdc2
Rdc1
Rdc1
Rdc2
4 Withstanding Voltage
Products shall not be damaged.
Test Voltage : Rated Voltage X 300%
Time : 1 to 5 s
Charge Current : 50 mA max.
5 Operating Temperature
6 Storage Temperature
Shown in Rated value.
Includes self-heating
Standard Testing Condition
< Unless otherwise specified >
Temperature : Ordinary Temp. / 15 °C to 35 °C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
JEMCPS-03093
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< In case of doubt >
Temperature: 20 °C ± 2 °C
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
■AEC-Q200 Murata Standard Specification and Test Methods
Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors)
AEC-Q200 Rev.C issued June 17. 2005
AEC-Q200
No. Stress
Test Method
3 High Temperature
Unpowered
Exposure
1000 hours @ T=150C (Ceramics)
Measurement at 24+/-2 hours after test
4 Temperature Cycling
1000cycles (-55C to +125C)
Measurement at 24+/-2 hours after test
6 Moisture Resistance
t=24 hours/cycle. Note: Steps 7a & 7b not
required.
Unpowered.
7 Biased Humidity
1000hours 85C/85%RH.
Note: Ceramics only Specified conditions:
Rated Voltage and 1.3 to 1.5 volts.
Add 100Kohm resister.
Tantalums-Rated Voltage only.
Measurement at 24+/-2 hours after test
8 Operational Life
Condition D Steady State TA=125C
Full rated ceramic caps
Measurement at 24+/-2 hours
after test conclusion.
9 External Visual
Visual inspection
10 Physical Dimension
Within the specified dimensions.
12 Resistance to Solvents
Per MIL-STD-202 Method 215
13 Mechanical Shock
Figure 1 of Method 213.
SMD:Condition F
Leaded:Condition C
14 Vibration
5g's for 20 minutes, 12cycles each of 3
oritentations
Use 8"X5" PCB, .031"thick. 7 secure points on
one long side and 2 secure points at corners of
opposite sides.
Parts mounted within 2" from any secure point.
Test from 10-2000Hz.
15 Resistance to
Note: Condition B No pre-heat of samples.
Soldering Heat
Note:Single Wave Solder-Procedure 2 for SMD.
Procedure 1 for Leaded with solder within
1.5mm of device body.
16 Thermal Shock
17 ESD
18 Solderability
-55C/+125C
Note: Number of cycles required-300,
Maximum transfer time-20 s,
Dwell time-15 minuites. Air-Air.
Per AEC-Q200-002
Per J-STD-002
Summary to show Min, Max, Mean and
19 Electrical Characterization Standard deviation at room as well as Min and
Max operating temperatures.
JEMCPS-03093
3
Pressure jig
R340
F
Deflection
45
Murata Specification / Deviation
Meet Table D after testing.
Meet Table A after testing.
Meet Table D after testing.
Meet Table D after testing.
Meet Table D after testing.
No abnormalities
No defects
Not Applicable
Meet Table C after testing.
Meet Table C after testing.
Meet Table A after testing.
Deviation for AEC-Q200;
Testing condition
Flux: Ethanol solution of rosin, 25(wt)%
Pre-heating: 150C+/-10C, 60 to 90s
Solder: Sn-3.0Ag-0.5Cu
Solder Temperature: 270C+/-5C
Immesion Time: 10s+/-1s
Immesion and emersion rates: 25mm/s
Then measured after exposure in the room
Meet Table A after testing.
Component Classification:Meet Table E
95% of the terminations is to be soldered.
Method B : Not Applicable
Deviation for AEC-Q200;
Shown in Rated value.
45
Product
■AEC-Q200 Murata Standard Specification and Test Methods
Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors)
AEC-Q200 Rev.C issued June 17. 2005
AEC-Q200
No. Stress
Test Method
21 Board Flex
Appendix 2. Note:2mm(min) for all except 3mm
for class 1.
Murata Specification / Deviation
Meet Table B after testing.
Deviation for AEC-Q200;
It shall be soldered on the Glass-epoxy substrate (t =
1mm).
• Deflection : 2mm
• Keeping Time : 30s
Pressure jig
R230
F
Deflection
45
22 Terminal Strength
Per AEC-Q200-006
A force of 1.8 kg
for 60 s
45
Product
The electrode should show no failure after testing.
Deviation for AEC-Q200;
It shall be soldered on the substrate.
• Applying Force : 17.6N
• Applying Time : 60s
1.0
0.8
0.6
23 Beam Load Test
Per AEC-Q200-003
1.6
The chip endure 20N.
Deviation for AEC-Q200
Place the capacitor in the beam load fixture
as below figure.
Pressure Jig: R0.5
Iron Board
Speed supplied the Stress Load: 0.5mm/s.
JEMCPS-03093
4
■AEC-Q200 Murata Standard Specification and Test Methods
Mechanical Performance (based on Table 2 for Tantalum & Ceramic Capacitors)
AEC-Q200 Rev.C issued June 17. 2005
Table A
Appearance
Capacitance Change
I.R.
DC Resistance(Rdc1,2)
Tabe B
Appearance
Capacitance Change
DC Resistance(Rdc1,2)
Table C
Appearance
Capacitance
DC Resistance(Rdc1,2)
Table D
Appearance
Capacitance Change
I.R.
DC Resistance(Rdc1,2)
No damage
Within +/-7.5% at 20C
1000MΩ min. (22pF-470000pF)
500MΩ min. (1000000pF)
0.5Ω max (22pF-2200pF)
0.05Ω max (22000pF-1000000pF)
No damage
Within +/-12.5% at 20C
0.5Ωmax (22pF-2200pF)
0.05Ω max (22000pF-1000000pF)
No damage
Meet initial value (Shown in Rated value.)
0.5Ωmax (22pF-2200pF)
0.05Ω max (22000pF-1000000pF)
No damage
Within +/-12.5% at 20C
1000MΩ min. (22pF-470000pF)
500M Ω min. (1000000pF)
0.5Ωmax (22pF-2200pF)
0.05Ω max (22000pF-1000000pF)
Table E
Murata PN
NFM21HC220U1H3D
NFM21HC470U1H3D
NFM21HC101U1H3D
NFM21HC221R1H3D
NFM21HC471R1H3D
NFM21HC102R1H3D
NFM21HC222R1H3D
NFM21HC223R1H3D
NFM21HC104R1A3D
NFM21HC224R1A3D
NFM21HC474R1A3D
NFM21HC105R1C3D
JEMCPS-03093
DC Resistance
(Rdc 1,2)
Value After Testing
(ohm) max.
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.05
0.05
0.05
0.05
0.05
5
ESD Component
Classification
1C: 1kV(DC) to<2kV(DC)
1C
1C
1C
1C
1C
1C
1C
1C
1C
1C
1C
1C
PACKAGING
NFM21 Type
1. Appearance and Dimensions (8mm-wide paper tape)
(in mm)
2. Specification of Taping
(1) Packing quantity (standard quantity)
4000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Base tape and Top tape
The base tape and top tape have no spliced point.
(5) Cavity
There shall not be burr in the cavity.
(6) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous.
The specified quantity per reel is kept.
3. Pull Strength of Top Tape and Bottom Tape
5N min.
4. Peeling off force of top tape
0.1N to 0.6N (minimum value is typical)
Speed of Peeling off : 300 mm / min
Top tape
165 to 180 degree
F
Bottom tape
Base tape
5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
2.0±0.5
160 min.
Label
190 min.
210 min.
Empty tape
Top tape
f 13.0±0.2
1
f 60± 0
f 21.0±0.8
9± 10
Direction of feed
13±1.4
(in mm)
0
f 180± 3
JEMCPP-02232A
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!
Caution
1.Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where dust rises.
2. Caution (Rating)
Do not use products beyond the Operating Temperature Range, Rated Voltage and Rated Current.
3. Attention regarding product's lay out
< Attention regarding the heat generated by other products >
Please provide special attention when mounting products in close proximity to other products that radiate heat.
4. Attention regarding chip mounting
An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting,
causing cracked chips.
Please set the suction nozzle's bottom dead point on the upper surface of the board, after the board is adjusted flat.
The chip received force (static loading) from the suction nozzle's should be 1N to 3N.
5. Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
JEMCPC-02249A
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!
Caution
6. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
a
Products shall be located in the sideways
direction (Length:a<b) to the mechanical stress.
b
〈Poor example〉 〈Good example〉
(2) Products location on P.C.B. near seam for separation.
Seam
b
Products (A,B,C,D) shall be located carefully so that products are
not subject to the mechanical stress due to warping the board.
Because they may be subjected the mechanical stress in order
of A >C >B≒D.
C
B
D
A
Slit
Length:a b
a
7. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
1.9
0.8
0.6
8. Reflow Soldering
• Standard printing pattern of solder paste.
1) Soldering paste printing for reflow
• Standard thickness of solder paste: 100µm to 150µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard land dimensions.
0.6
(in mm)
1.4
2) Soldering Conditions
2.6
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Temp.
260°C
(°C)
245°C±3°C
220°C
230°C
Limit Profile
180
150
30s~60s
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
Limit Profile
Pre-heating
150°C ~ 180°C , 90s ± 30s
Heating
above 220°C , 30s ~ 60s
above 230°C , 60s max.
Peak temperature
245°C ± 3°C
260°C , 10s
Cycle of reflow
2 times
2 times
9. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
• Pre-heating : 150°C, 1 min
• Soldering iron output : 30W max.
• Tip temperature : 350°C max.
• Tip diameter : φ3mm max.
• Soldering time : 3(+1,-0) s
• Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
ceramic material due to the thermal shock.
JEMCPC-02249A
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!
Caution
10. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
1/3T  t T(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
11.Resin coating
The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please
make the reliability evaluation with the product mounted in your application set.
12. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
Twisting
Failure to follow the above cautions may result, worst case, in a short circuit and cause fuming or partial dispersion
when the product is used.
13.Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be caused
by the abnormal function or the failure of our product.
14.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
JEMCPC-02249A
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Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
1. Flux and Solder
Flux
Solder
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Other flux (except above) Please contact us for details, then use.
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
2. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power
: 20W / l max.
Frequency
: 28kHz to 40kHz
Time
: 5 minutes max.
(3) Cleaner
1. Cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
3. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be
arranged according to the figure to reinforce the ground-pattern.
2.3
1.9
0.6
diameter thru hole f 0.4
0.8
< Standard land dimensions for reflow >
・Side on which chips are mounted
Small
0.6
Resist
1.4
Copper foil pattern
2.6
No pattern
4.Storage and Delivery condition
(in mm)
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
・Products should be stored in the warehouse on the following conditions.
Temperature: -10 to +40°C
Humidity: 15 to 85% relative humidity
No rapid change on temperature and humidity
・Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
JEMCPC-02249A
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!
NOTE
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) We consider it not appropriate to include any terms and conditions with regard to the business transaction in the
product specifications, drawings or other technical documents. Therefore, if your technical documents as above
include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement
liability clause, they will be deemed to be invalid.
JEMCPC-02249A
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