TDK C2012C0G2A562J125AA Multilayer ceramic chip capacitor Datasheet

1 of 3
Creation Date : February 20, 2017
(GMT)
Multilayer Ceramic Chip Capacitors
C2012C0G2A562J125AA
TDK item description C2012C0G2A562JT****
Applications
Commercial Grade
Feature
Mid Mid Voltage (100 to 630V)
Series
C2012 [EIA 0805]
Status
Production
Size
Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
1.25mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
1.00mm to 1.30mm(Flow Soldering)
Recommended Land Pattern (PA)
0.90mm to 1.20mm(Reflow Soldering)
1.00mm to 1.20mm(Flow Soldering)
Recommended Land Pattern (PB)
0.70mm to 0.90mm(Reflow Soldering)
0.80mm to 1.10mm(Flow Soldering)
Recommended Land Pattern (PC)
0.90mm to 1.20mm(Reflow Soldering)
Electrical Characteristics
Capacitance
5.6nF ±5%
Rated Voltage
100VDC
Temperature Characteristic
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ
Other
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : February 20, 2017
(GMT)
Multilayer Ceramic Chip Capacitors
C2012C0G2A562J125AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
C2012C0G2A562J125AA
ESR
C2012C0G2A562J125AA
Capacitance
C2012C0G2A562J125AA
C2012C0G2A562J125AA
Temperature Characteristic
C2012C0G2A562J125AA(No Bias)
DC Bias Characteristic
C2012C0G2A562J125AA(DC Bias =
50V )
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
C2012C0G2A562J125AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : February 20, 2017
(GMT)
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