LITEON LTST-5630VDWT Smd led Datasheet

SMD LED
Product Data Sheet
LTST-5630VDWT
Spec No. :DS22-2012-0206
Effective Date: 04/20/2017
Revision: F
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
SMD LED
LTST-5630VDWT
1. Description
SMD LEDs from Lite-On are available in miniature sizes and special configurations for automated PC board assembly and
space-sensitive applications. These SMD LEDs are suitable for use in a wide variety of electronic equipment, including cordless
and cellular phones, notebook computers, network systems, home appliances, and indoor signboard applications.
1.1 Features
1.2 Applications
Meet ROHS
Package in 12mm tape on 7" diameter reels
EIA STD package
I.C. compatible
Compatible with automatic placement equipment
Compatible with infrared reflow solder process
Preconditioning: accelerate to JEDEC level 3
Telecommunication, Office automation, home appliances
industrial equipment
Status indicator
Signal and Symbol Luminary
Front panel backlighting
Special lighting
2. Package Dimensions
Part No.
Lens Color
Source Color
LTST-5630VDWT
Diffused Lens
AlInGaP Deep Red
Notes:
1.
2.
All dimensions are in millimeters.
Tolerance is ±0.2 mm (.008") unless otherwise noted.
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SMD LED
LTST-5630VDWT
3. Rating and Characteristics
3.1 Absolute Maximum Ratings at Ta=25°C
LTST-5630VDWT
Unit
420
mW
180
mA
150
mA
Reverse Voltage
5
V
Operating Temperature Range
-40°C to + 85°C
Storage Temperature Range
-40°C to + 100°C
Parameter
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
DC Forward Current
3.2 Suggest IR Reflow Condition for Pb Free Process:
IR-Reflow Soldering Profile for lead free soldering (Acc. to J-STD-020B)
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3.3 Electrical / Optical Characteristics at Ta=25°C
Part No.
Parameter
Symbol
Min.
Typ.
Max.
Unit.
Test Condition
3.55
-
14.00
lm
IF = 150mA
Note 1
deg
Note 2 (Fig.5)
LTSTLuminous Flux
ΦV
5630VDWT
Viewing Angle
2θ1/2
5630VDWT
λP
5630VDWT
-
660
-
nm
Measurement
@Peak (Fig.1)
Spectral Line Half-Width
∆λ
5630VDWT
-
20
-
nm
-
Forward Voltage
VF
5630VDWT
-
2.8
V
IF = 150mA
Note 3
Reverse Current
IR
5630VDWT
-
10
μA
VR = 5V
Note 4
Peak Emission
120
Wavelength
-
Notes:
1.
Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve
2.
θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3.
Forward voltage tolerance is +/- 0.1 volt.
4.
Reverse Voltage (VR) condition is applied to IR test only. The device is not designed for reverse
operation.
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SMD LED
LTST-5630VDWT
4. Bin Rank
IV Rank
Luminous Flux
Unit : lm @150mA
Bin Code
Min.
Max.
H2
3.55
4.50
J1
4.50
5.60
J2
5.60
7.10
K1
7.10
9.00
K2
9.00
11.20
L1
11.20
14.00
Tolerance on each Intensity bin is +/-11%
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SMD LED
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5. Typical Electrical / Optical Characteristics Curves.
(25°C Ambient Temperature Unless Otherwise Noted)
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LTST-5630VDWT
6. User Guide
6.1 Cleaning
Do not use unspecified chemical liquid to clean LED they could harm the package. If cleaning is necessary, immerse the
LED in ethyl alcohol or isopropyl alcohol at normal temperature for less one minute.
6.2 Recommend Printed Circuit Board Attachment Pad
Infrared / vapor phase
Reflow Soldering
6.3 Package Dimensions of Tape and Reel
Note:
1. All dimensions are in millimeters (inches).
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LTST-5630VDWT
6.4 Package Dimensions of Reel
Notes:
1. Empty component pockets sealed with top cover tape.
2. 7 inch reel 2000 pieces per reel.
3. Minimum packing quantity is 500 pieces for remainders.
4. The maximum number of consecutive missing lamps is two.
5. In accordance with ANSI/EIA 481 specifications.
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7. Cautions
7.1 Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon’s Sales in advance for information on applications
in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize
life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety
devices).
7.2 Storage
The package is sealed:
The LEDs should be stored at 30°C or less and 70%RH or less. And the LEDs are limited to use within one year, while
the LEDs is packed in moisture-proof package with the desiccants inside.
The package is opened:
The storage ambient for the LEDs should not exceed 30°C temperature and 60% relative humidity.
It is recommended that LEDs out of their original packaging are IR-reflowed within 168hrs.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container
with appropriate desiccant, or in a desiccators with nitrogen ambient.
LEDs stored out of their original packaging for more than 168hrs should be baked at about 60 °C for at least 48 hours
before solder assembly.
7.3 Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary.
7.4 Soldering
Recommended soldering conditions:
Reflow soldering
Pre-heat
Pre-heat time
Peak temperature
Soldering time
150~200°C
120 sec. Max.
260°C Max.
10 sec. Max.(Max. two times)
Soldering iron
Temperature
Soldering time
300°C Max.
3 sec. Max.
(one time only)
Notes:
Because different board designs use different number and types of devices, solder pastes, reflow ovens, and circuit
boards, no single temperature profile works for all possible combinations.
However, you can successfully mount your packages to the PCB by following the proper guidelines and PCB-specific
characterization.
LITE-ON Runs both component-level verification using in-house KYRAMX98 reflow chambers and board-level assembly.
The results of this testing are verified through post-reflow reliability testing .Profiles used at LITE-ON are based on
JEDEC standards to ensure that all packages can be successfully and reliably surface mounted.
Figure on page3 shows a sample temperature profile compliant to JEDEC standards. You can use this example as a
generic target to set up your reflow process. You should adhere to the JEDEC profile limits as well as specifications and
recommendations from the solder paste manufacturer to avoid damaging the device and create a reliable solder joint.
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7.5 Drive Method
A LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED
as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit.
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs.
7.6 ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use of a conductive wrist band or anti-electrostatic glove when handling these LEDs.
All devices, equipment, and machinery must be properly grounded.
Work tables, storage racks, etc. should be properly grounded.
Use ion blower to neutralize the static charge which might have built up on surface of the LED’s plastic lens as a
result of friction between LEDs during storage and handling.
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or
“ no lightup ” at low currents.
To verify for ESD damage, check for “ lightup ” and Vf of the suspect LEDs at low currents.
The Vf of “ good ” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product.
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8. Reliability Test
No.
Test item
1
Resistance to soldering heat
2
Solderability
Test condition
Reference standard
Tsld = 260°C, 10sec.
3 times
JEITA ED-4701 300 301
Tsld=245± 5°C
(Lead Free Solder, Coverage ≧ 95% of the
JEITA ED-4701 300 303
dipped surface)
3
Thermal Shock
85 ± 5°C ~ -30°C ± 5°C
30min
30min
100cycles
JEITA ED-4701 300 307
4
Temperature Cycle
-55°C ~ 25°C ~ 100°C ~ 25°C
30min
5min
30min
5min
100cycles
JEITA ED-4701 100 105
5
High Temperature Storage
100°C
1000hrs
JEITA ED- 4701 200 201
6
Low Temperature Storage
-55°C
1000hrs
JEITA ED-4 701 200 202
7
Temperature Humidity Storage
60°C/90%RH 300hrs
8
Room temp life test
25°C, IF: Typ current , 1000hrs
JEIT A ED-4701 100 103
--
9. Others
The appearance and specifications of the product may be modified for improvement without prior notice.
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SMD LED
LTST-5630VDWT
10. Suggested Checking List
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wears wrist strap, heel strap or conductive shoes with
conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for InGaN LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycles?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
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