Material Content Data Sheet Sales Product Name BTS4130QGA Issued MA# MA001114808 Package PG-DSO-20-32 29. August 2013 Weight* 478.31 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-22-4 7.009 1.47 0.036 0.01 0.143 0.03 299 2.862 0.60 5983 116.197 24.29 24.93 242932 249289 0.464 0.10 0.10 970 970 0.692 0.14 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.47 14654 14654 75 1446 31.822 6.65 313.373 65.53 72.32 655168 723143 2.746 0.57 0.57 5741 5741 0.341 0.07 0.001 0.00 0.588 0.12 0.356 0.07 1.680 0.35 66529 713 2 0.19 2. 3. 0.42 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1945 745 Important Remarks: 1. 1230 3513 4258 1000000