ESDAXLC5-1U2 Low clamping, single-line unidirectional ESD protection for high speed interface Datasheet production data Features Unidirectional device Low clamping voltage: – 10.4 V IEC 61000-4-2, 8 kV contact measured at 30 ns – 13.7 V TLP 16 A IPP Very high bandwidth: 11.4 GHz 0201 package Ultra low PCB area: 0.18 mm2 67SDFNDJH 3LQDYDLODEOHLQGLIIHUHQWIRUPV ECOPACK®2 and RoHS compliant component Figure 1. Functional diagram (top view) Complies with the following standards: IEC 61000-4-2 level 4 (exceed level4) – ±30 kV (air discharge) – ±16 kV (contact discharge) Applications Where transient overvoltage protection in ESD sensitive equipment is required, such as: Smartphones, mobile phone and accessories Tablet PCs, netbooks and notebooks Portable multimedia devices and accessories Digital cameras and camcorders Communication and highly integrated systems Description The ESDAXLC5-1U2 is a unidirectional single line TVS diode designed to protect data lines or other I/O ports against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. January 2016 This is information on a product in full production. DocID028771 Rev 1 1/12 www.st.com Characteristics 1 ESDAXLC5-1U2 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter VPP Peak pulse voltage: IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge PPP Peak pulse power (8/20 µs)(1) (1) Value Unit ±16 ±30 kV 20 W 2.2 A IPP Peak pulse current (8/20 µs) Tj Operating junction temperature range - 55 to +150 °C Tstg Storage temperature range - 65 to +150 °C TL Maximum lead temperature for soldering during 10 s 260 °C 1. According to IEC61000-4-5, for a surge greater than the maximum values, the diode will fail in short-circuit. Figure 2. Electrical characteristics (definitions) , 6\PERO 9%5 9&/ ,50 950 ,) ,33 ,5 9) 5G Į7 2/12 3DUDPHWHU %UHDNGRZQYROWDJH &ODPSLQJYROWDJH /HDNDJHFXUUHQW# 950 6WDQGRIIYROWDJH )RUZDUGFXUUHQW 3HDNSXOVHFXUUHQW %UHDNGRZQFXUUHQW )RUZDUGYROWDJHGURS '\QDPLFLPSHGDQFH 9ROWDJHWHPSHUDWXUH ,) 9) 9&/ 9%5 950 DocID028771 Rev 1 ,50 ,5 6ORSH 5 G ,33 9 ESDAXLC5-1U2 Characteristics Table 2. Electrical characteristics (values, Tamb = 25 °C) Symbol Parameter Test Condition VBR Breakdown voltage VRM Reverse working voltage IRM Leakage current VRM = 3.6 V Cline Line capacitance F = (200 MHz- 3000 MHz), VLINE = 0 V VCL Rd VFCL FC Reverse clamping voltage Dynamic resistance(1) Forward clamping voltage Cut-off frequency IR = 1 mA Min. Typ. 5 6.6 Unit V 3.6 V 4 100 nA 0.55 0.7 pF IPP = 1 A, 8/20 µs 7 IPP = 2.2 A, 8/20 µs 8 IEC 61000-4-2, 8 kV contact measured at 30 ns 10.4 TLP measurement (pulse duration 100 ns), IPP = 16 A(1) 13.7 Pulse duration 100 ns(1) Max. Direct 0.39 Forward 0.52 IPP = 1 A, 8/20 µs 2.5 IPP = 2.2 A, 8/20 µs 4.0 TLP measurement (pulse duration 100 ns), IPP = 16 A(1) 10.4 -3 dB 11.4 V Ω V GHz 1. More information is available in ST application note: AN4022 DocID028771 Rev 1 3/12 12 Characteristics ESDAXLC5-1U2 Figure 3. Leakage current versus junction temperature (typical values) Figure 4. Junction capacitance versus frequency (typical values) ,5 Q$ 95 950 9 ,2,2 & S) 7 M & 9 RVF P 9 ) 0+] 7M & Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 9GLY Figure 6. ESD response to IEC 61000-4-2 (-8 kV contact discharge) 9GLY 9 933 (6'SHDNYROWDJH 9&/ FODPSLQJYROWDJHDWQV 9 FODPSLQJYROWDJHDWQV &/ 9&/ FODPSLQJYROWDJHDWQV 9 9 9 9 9 QVGLY Figure 7. S21 attenuation measurement results 6G% Figure 8. TLP measurements ,33 $ 3RVLWLYHSRODULW\ 1HJDWLYHSRODULW\ 933 (6'SHDNYROWDJH 9&/ FODPSLQJYROWDJHDWQV 9 FODPSLQJYROWDJHDWQV &/ 9&/ FODPSLQJYROWDJHDWQV QVGLY 9 9 ) +] ( 4/12 ( ( ( ( 9&/ 9 DocID028771 Rev 1 ESDAXLC5-1U2 2 Package information Package information Epoxy meets UL94, V0 Bar indicates pin 1 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 ST0201 package information Figure 9. ST0201 package outline ( ' 7R S $ 6LGH / / E E %RWWRP 3LQ / H / E E %RWWRP H 3LQDYDLODEOHLQGLIIHUHQWIRUPV DocID028771 Rev 1 5/12 12 Package information ESDAXLC5-1U2 Table 3. 0201 package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.23 0.28 0.33 b1 0.20 0.25 0.30 0.0091 0.0110 0.0130 0.0079 0.0098 0.0118 b2 0.20 0.25 0.30 0.0079 0.0098 0.0118 D 0.25 0.30 0.35 0.0099 0.0118 0.0138 E 0.55 0.60 0.65 0.0217 0.0236 0.0256 e 0.35 0.0138 L1 0.13 0.18 0.23 0.0052 0.0071 0.0091 L2 0.14 0.19 0.24 0.0055 0.0075 0.0095 Figure 10. Footprint, dimensions in mm (inches) Figure 11. Marking 3LQ ' 3LQ Note: 6/12 Product marking may be rotated by 180° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. DocID028771 Rev 1 ESDAXLC5-1U2 Package information Figure 12. Tape and reel outline %DULQGLFDWHV3LQ ' ' ' ' ' ' ' $OOGLPHQVLRQVDUHW\SLFDOYDOXHVLQPP 8VHUGLUHFWLRQRIXQUHHOLQJ DocID028771 Rev 1 7/12 12 Recommendation on PCB assembly ESDAXLC5-1U2 3 Recommendation on PCB assembly 3.1 Stencil opening design 1. General recommendations on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 13. Stencil opening dimensions / 7 b) : General design rule Stencil thickness (T) = 75 ~ 125 µm W Aspect Ratio = ----- 1.5 T LW Aspect Area = ---------------------------- 0.66 2T L + W 2. Recommended stencil window a) Stencil opening thickness: 80 µm b) Other dimensions: see Figure 14 Figure 14. Recommended stencil window position, stencil opening thickness: 80 µm PP LQFKHV )RRWSULQW 8/12 DocID028771 Rev 1 6WHQFLOZLQGRZ ESDAXLC5-1U2 3.2 3.3 3.4 Recommendation on PCB assembly Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component displacement during PCB movement. 4. Use solder paste with fine particles: Type 4 (powder particle size is 20-45 µm). Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ±0.05 mm is recommended. 4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. PCB design preference 1. To control the solder paste amount, the closed via is recommended instead of open vias. 2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away. DocID028771 Rev 1 9/12 12 Recommendation on PCB assembly 3.5 ESDAXLC5-1U2 Reflow profile Figure 15. ST ECOPACK® recommended soldering reflow profile for PCB mounting & 7HPSHUDWXUH & &V &V VHF PD[ &V &V &V 7LPH V Note: 10/12 Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DocID028771 Rev 1 ESDAXLC5-1U2 4 Ordering information Ordering information Figure 16. Ordering information scheme (6'$;/&8 (6'$UUD\ ([WUDORZFDSDFLWDQFH %UHDGRZQYROWDJH 9 1XPEHURIOLQHV 3DFNDJH 8 67 Table 4. Ordering information Order code Marking Weight Base qty Delivery mode ESDAXLC5-1U2 D2(1) 0.124 mg 15000 Tape and reel 1. The marking can be rotated by 180° to differentiate assembly location 5 Revision history Table 5. Document revision history Date Revision 25-Jan-2016 1 Changes Initial release. DocID028771 Rev 1 11/12 12 ESDAXLC5-1U2 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 12/12 DocID028771 Rev 1