SUTEX HV633PG-G 32-channel, 128-level amplitude gray-shade display column driver Datasheet

Supertex inc.
HV633
32-Channel, 128-Level Amplitude
Gray-Shade Display
Column Driver
Features
►► HVCMOS® technology
►► 5.0V CMOS inputs
►► Capable of 128 levels of gray shading
►► Modulation voltage up to +80V
►► 24MHz data throughput rate
►► 32 outputs per device (can be cascaded)
►► Pin-programmable shift direction (DIR)
►► D/A conversion cycle time is 20µs
►► Diodes in output structure allow usage in energy
recovery systems
►► Available in 3-sided 64-lead gull wing package
Applications
►► Electroluminescent Displays
►► Polycholesteric Displays
General Description
The HV633 is a 32-channel driver IC for gray shade display
use. It is designed to produce varying output voltages between
3.0 - 80V. This amplitude modulation at the output is facilitated
by an external ramp voltage VR. See Theory of Operation for
detailed explanation.
This device consists of dual 16-bit shift registers, 32 data
latches and comparators, and control logic to preform 128
levels of gray shading. There are 7 bits of data inputs. Data is
shifted through the shift registers at both edges of the clock,
resulting in a data transfer rate of twice that of the shift clock
frequency. When the DIR pin is high, CSI/CSO is the input/
output for the chip select pulse. When DIR is low, CSI/CSO is
the output/input for the chip select pulse. When the DIR pin is
high, it allows the HV633 to shift data in the counter-clockwise
direction when viewed from the top of the package. When the
DIR pin is low, data is shifted in the clockwise direction. The
output circuitry allows the energy which is stored in the output
capacitance to be returned to VPP through the body diode of
the output transistor.
Functional Block Diagram
VDD
CSI
LC
Shift Register
Latches
Comparator
Counter
CC
CSO
DIR
7
32
Source Follower
Output Buffer
HVOUT1
~
~
HVOUT32
IBIAS Control
VCTL
Doc.# DSFP-HV633
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VPP
High Voltage
Low Voltage
SC
D1 - D7
VR
RCTL
Supertex inc.
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HV633
Pin Configuration
Ordering Information
Part Number
Package Option
Packing
HV633PG-G
64-Lead PQFP
66/Tray
64
-G denotes a lead (Pb)-free / RoHS compliant package
Absolute Maximum Ratings
Parameter
Value
Supply voltage, VDD
-0.5V to +7.5V
Supply voltage, VPP
-0.5V to +90V
Logic input levels
1
64-Lead PQFP
-0.5V to VDD +0.5V
Ground current1
(top view)
1.5A
Operating temperature range
Storage temperature range
0°C to +125°C
-65°C to +150°C
Continuous total power dissipation2
Product Marking
2.0W
Absolute Maximum Ratings are those values beyond which damage to the
device may occur. Functional operation under these conditions is not implied.
Continuous operation of the device at the absolute rating level may affect device
reliability. All voltages are referenced to device ground.
Notes:
1. Duty cycle is limited by the total power dissipated in the package.
2. For operation above 25°C ambient derate linearly to 125°C at
20mW/°C.
L = Lot Number
YY = Year Sealed
WW = Week Sealed
C = Country of Origin
A = Assembler ID
= “Green” Packaging
Top Marking
HV 6 3 3 P G
LLLLLLLLLL
Y Y WW
CCCCCCCC AAA
Package may or may not include the following marks: Si or
64-Lead PQFP
Typical Thermal Resistance
Package
θja
64-Lead PQFP
41OC/W
Recommended Operating Conditions
Sym
VDD
Parameter
Low-voltage digital supply voltage
Low-voltage analog supply voltage
Min
Typ
Max
Units
4.5
5.0
5.5
V
VIH
High-level input voltage (analog & digital)
VDD -1
-
VDD
V
VIL
Low-level input voltage (analog & digital)
0
-
1.0
V
-2.0
0
-
V
-
0
2.0
V
-0.3
-
80
V
VBIAS
IPP control circuit bias voltage
VCTL
IPP control circuit control voltage
VPP
High voltage supply
VR
Ramp voltage
0
-
VPP -2
V
fSC
Shift clock operating frequency (at VDD = 5.5V)
-
-
12
MHz
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HV633
Electrical Characteristics (over recommended operating conditions at T = 25°C unless otherwise noted)
A
Low Voltage DC Characteristics (Digital)
Sym
Parameter
Min
Typ 1
Max
Units
Conditions
IDD
VDD supply current
-
12
20
mA
fSC = 12MHz, fCC = 12MHz
IDDQ
Quiescent VDD supply current
-
-
200
µA
All VIN = 0V, VDD = 5.5V
High-level input current
-
1.0
50
µA
VIH = VDD
Low-level input current
-
-1.0
-50
µA
VIL = 0V
CIN
Input capacitance (D1 ~ D7, LC, SC, CC)
-
-
15
pF
VIN = 0V, f = 1.0MHz
IOH
High-level output current
-2.0
-
-
mA
VDD = 4.5V, VOH = 0.9VDD
IOL
Low-level output current
2.0
-
-
mA
VDD = 4.5V, VOL = 0.1VDD
IIH
IIL
2
Notes:
1. All typical values are at VDD = 5.0V.
2. Guaranteed by design.
Low Voltage DC Characteristics (Analog)
IDD
VDD supply current
-
-
500
µA
fSC = 12MHz, fCC = 12MHz
IDDQ
Quiescent VDD supply current
-
-
200
µA
All VIN = 0V, VDD = 5.5V
2.0
-
mA
Depending on external
bias circuit, see Table 1.
mA
VPP = 80V. See Test Circuit
mA
VPP = 80V, VDD = 4.5V,
VAO = 2.0V
High Voltage Bias Circuit for Output Variation Control
IPP
VPP supply current for bias circuit
-
High Voltage DC Characteristics
IAOH
High-voltage analog output source current
IAOL
High-voltage analog output sink current
ΔVO
Maximum delta voltage between high voltage
outputs of the same level
AC Characteristics (V
Logic Timing
DD
See performance
curves
See performance
curves
-
-
±0.2
V
At all gray levels
= 5.5V, TA = 25°C)
fSC
Shift clock operating frequency
-
-
12
MHz
---
fDIN
Data-in frequency
-
-
24
MHz
---
tSS
CSI/CSO pulse to shift clock setup time
-
40
-
ns
---
tHS
CSI/CSO pulse to shift clock hold time
-
0
-
ns
---
tWA
CSI pulse width
-
49
-
ns
---
tDS
Data to shift clock setup time
-
20
-
ns
---
tDH
Data to shift clock hold time
-
0
-
ns
---
tWD
Data-in pulse width
-
24
-
ns
---
tWLC
Load count pulse width
-
98
-
ns
---
tDLCR
Load count to ramp delay
1.0
-
-
µs
---
tDRCC3
Ramp to count clock delay
0.47
-
-
µs
---
-
98
-
ns
---
tDSL
Shift clock to load count delay time
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HV633
Logic Timing (cont.)
Sym
Parameter
Min
Typ
Max
Units
Conditions
tCSC
Shift clock cycle time
98
-
-
ns
---
tWSC
Shift clock pulse width
49
-
-
ns
---
tCCC
Count clock cycle time
98
-
-
ns
---
tWCC
Count clock pulse width
49
-
-
ns
---
15
-
-
µs
---
VR Timing
tCR
Cycle time of ramp signal
tRR
Ramp rise time
10.6
-
-
µs
---
tHR4
Ramp hold time
2.0
-
15
µs
---
tFR
Ramp fall time
3.0
-
-
µs
CLOAD = 1nF
Notes:
3. Count clock starts counting after 0.47µs min. This is equivalent to a time duration for a linear ramp VR to ramp from 0 to 3.0V, assuming the
minimum value of tRR, ramp size time of 12µs for VR = 80V.
4. The maximum ramp hold time may be longer than 15 µs, but the output voltage HVOUT will droop due to leakage.
Table 1: Schemes to control IPP bias current, typical IPP
Option 1
Option 2
VBIAS
VCTL
RCTL
(kΩ)
(mA)
IPP
VBIAS
VCTL
RCTL
(kΩ)
(mA)
0
0.1
56
2.0
-1.0
0
56
4.0
0
1.0
56
7.0
-2.0
0
56
5.5
(V)
(V)
(V)
(V)
IPP
VCTL
+ VCTL
HV633
RCTL
RCTL
+ VBIAS
Function Table
Function
In
DIR Data
(D1 - D7)
Shift data from
HVOUT1 to HVOUT32
H
Data
Shift data from
HVOUT32 to HVOUT1
L
Data
Load shift register
X
X
Load counter
X
X
Counting/voltage
conversion
X
X
Notes:
CSI
CSO
SC
Output
Output
Pre-defined
by 1 or 2
LC
CC
VR
HVOUT
L
L
L
Data → HVOUT1 → ...→ HVOUT32
L
L
L
Data → HVOUT32 → ...→ HVOUT1
L
L
L
-
L
L
-
Initiates
VR
-
L
L
L
L = Low logic level
H = High logic level
= Low to high transition
= Transition of both edges
X = Don’t care
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HV633
Functional Block Diagram
See Output Stage Detail
1
2
VCTL
Dual
16-bit
Shift Registers
RCTL
●
L/E
Data
Latches
L/E
Data
Latches
7
Latches and
Comparators
Latches and
Comparators
7
7
RS
F/F
Output
Stage
HVOUT1
RS
F/F
Output
Stage
HVOUT2
●
●
●
●
●
31
32
●
●
●
●
●
●
●
●
●
●
●
●
L/E
Data
Latches
L/E
Data
Latches
SC
SC
DIR
7
GND
VR VPP
7
7
7
RS
F/F
Output
Stage
HVOUT31
Latches and 7
Comparators
RS
F/F
Output
Stage
HVOUT32
Latches and
Comparators
CC
7
Count
Data In
Buffers
I/O
Buffers
I/O
Buffers
Shift
Clock
Buffer
CSI
CSO
SC
Counter
Reset
Counter
Load
Clear
Pulse
Generator
D7
●●●●●●●
D1
Load
Count
Buffer
Count
Clock
Buffer
LC
CC
Note:
SC = Shift Clock, LC = Load Count, CC = Count Clock, CSI = Chip Select Input, CSO = Chip Select Output
*Data rate = 2x the SC frequency
Input and Output Equivalent Circuits
VDD
VDD
DATA
OUT
DATA
IN
LVGND
LVGND
Logic Data Output
Logic Inputs
Output Stage Detail
VR
VPP
CH
VCTL
RCTL
Doc.# DSFP-HV633
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Internal
Logic
&
Bias
Circuit
5
Q1
HVOUT
Q2
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HV633
Test Circuit
High-voltage Analog Output Source Current (IAOH). For gray shade #1 (000 0000).
VR
70V
+
–
HV633
Output
Stage
Logic
0V
VPP = 80V
HVOUT
+
1.0kΩ VTST
-
LVGND
1.
2.
3.
4.
5.
10kΩ
HVGND
Set HVOUT = Low
Apply VPP = 80V
Apply a step voltage of 70V at VR (slew rate = 4.1V/µs)
Measure voltage across the 1.0KΩ resistor
Output source current can be calculated by using VTST /1.0KΩ
Typical Panel Connections
D1 ~ D7
DIR = LOW
VR, VPP
LVGND, HVGND,
SC, LC, CC, CSO
32
1
32
1
32
1
1
32
Display Panel
(Example)
VR, VPP
LVGND, HVGND,
SC, LC, CC, CSI
1
32
1
32
DIR = HIGH
D1 ~ D7
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HV633
Timing Diagrams
(a) Basic System Timing
tCR
tHR
tRR
VR
Load
First
Device
Chip Select
Input (CSI)
Load
Second
Device
tFR
Load
Last
Device
Chip Select
Output (CSO)
Shift Clock
(SC)
↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓
DATA IN
(D1 - D7)
↑ ↓ ↑ ↓ ↑ ↓ ↑ ↓
↑ ↓
Data from Data Bus (See Detailed Timing)
tDLCR
Load Count*
(LC)
Count Clock
(CC)
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
↑
1
2
3
4
5
128
1
2
3
4
5
128
HVOUT
*HVOUT will clear to zero with load count.
(b) Detailed Device Timing
LOADING LAST DEVICE
tWA
NEXT LOADING CYCLE
Chip Select
Input (CSI)
tHS
tSS
Shift Clock
(SC)
Data
(D1-D7)
DATA
SET 1
tDH
Load Count
(LC)
tCSC
SC1
DATA
SET 2
tWSC
SC2
DATA
SET 3
SC 16
DATA
SET 31
tWD
SC 1
SC 16
DATA
SET 1
DATA
SET 32
tDSL
DATA
SET 31
tWLC
tDS
tWCC
tCCC
Count Clock
(CC)
Count
Clock 1
tDRCC
tDLCR
VR
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0V
7
Count
Clock 128
3V
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HV633
Gray Shade Decoding Scheme
Shade
Number
D7
D6
D5
D4
Gray Scale Voltage
D3
D2
D1
1
1
1
1
1
1
1
127
1
1
1
1
1
1
0
126
1
1
1
1
1
0
1
125
1
1
1
1
1
0
0
124
1
1
1
1
0
1
1
123
1
1
1
1
0
1
0
122
1
1
1
1
0
0
1
121
1
1
1
1
0
0
0
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
7
0
0
0
0
1
1
0
6
0
0
0
0
1
0
1
5
0
0
0
0
1
0
0
4
0
0
0
0
0
1
1
3
0
0
0
0
0
1
0
2
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
VR
HVOUT
HVOUT
HVOUT
HVOUT
(111 1111)
01 2
● ● ●
127
Gray Scale Voltage
128
(000 0000)
HVOUT
Clock Cycle
Typical Performance Curves
Source Output Characteristics
15
12
IO (milliamperes)
IO (milliamperes)
12
9
6
3
1
Sink Output Characteristics
15
9
6
3
0
1
2
3
4
5
6
7
0
8
VGS Volts
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1
2
3
4
5
6
7
8
VGS Volts
8
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HV633
Theory of Operation
When data has been loaded into all 32 outputs of all chips
(top and bottom of the display panel), the load count pin is
pulsed. On its rising transition, all output levels are reset to
zero and all the data in the input latches is transferred to a
like number of comparator latches, (thus leaving the data
latches ready to receive new data during the following operations). After the transfer, the load count pin is brought low.
This transition begins the events that convert the binary data
into a gray-shade level.
The HV633 has two primary functions:
1) Loading data from the data bus and,
2) Gray-shade conversion(converting latched data to output voltages).
Since the device was developed initially for flat panel displays, the operation will be described in terms that pertain
to that technology. As shown by the Typical Panel Connections, several HV633 packages are mounted at the top and
bottom of a display panel. Data exists on a 7-bit bus (adjacent PC board traces) at top and bottom. The D1 through
D7 inputs of each chip take data from the bus when either a
CSI or CSO pulse is present at the chip. These pulses therefore act as a combination CHIP SELECT and LOCATION
STROBE. Because of the way the chip HVOUT pins are sequenced, data on the bus at the bottom of the display panel
will be entered into the left-most chip as HVOUT1, HVOUT2,
etc. up to HVOUT32. The CSI pulse will accomplish this with
DIR = High.
Gray-shade Conversion
1) The COUNT CLOCK is started. An external signal is applied to the COUNT CLOCK pin, causing the counter on
each chip to increment from binary 000 0000 to 111 1111 (0
to 127).
2) At the same time, the VR voltage is applied to all chips, via
charging transistors, causing the HOLD CAPACITOR (CH)
on each output to experience a rise in voltage.
3) The logic control compares the count in the comparator
latch to the count clock. The gate voltage of Q1 and the output voltage HVOUT will ramp up at the same rate as VR.
Loading Data from Data Bus
Here is the full data-entry sequence:
4) Once VR has reached the maximum voltage, then all the
pixels will be at the final value. (See Gray Scale Voltage.)
1) The micro controller puts data on the bus (7 bits)
Output Voltage Variation
2) To enter the data into the 32 sets of 7 latches on the first
chip, the shift clock rises. This positive transition is combined
with the CSI pulse and is generated only once to strobe the
data into the first set of latches. (These latches eventually
send data to the HVOUT1). The data on the bus then changes,
the shift clock falls, and this negative transition is combined
with the CSI pulse, which is now propagated internally, to
strobe the new data into the next set of 7 latches (which will
end up as HVOUT2). This internal CSI pulse therefore runs at
twice the shift clock rate.
The output voltage of the HV633 is determined by the logic
and the ramp voltage VR. It is possible that the output voltage may be coupled to an unacceptable level due to its
adjacent outputs through the panel. In order to solve this
problem, internal logic (refer to Output Stage Detail) is integrated in the IC to minimize the effect. Two external pins
VCTL and RCTL allow the feasibility to control the current
flowing through Q2. The VCTL pin is connected to a voltage
source and the RCTL pin is connected to ground through a
resistor (2.0V and 56KΩ are used for a particular panel). The
internal bias circuit will drive the resistor to a voltage level
that is equal to the VCTL voltage at steady state through an
operational amplifier. The current flowing through Q1 and Q2
will be limited to VCTL/RCTL. This combination of VCTL and
RCTL will reduce the output voltage variation to less than
±0.2V of delta voltage for each gray shade, independent of
its adjacent output voltages.
3) When the last set of 7 latches in the first chip has been
loaded (HVOUT32), the CSI pulse leaves chip 1 and enters
chip 2. The exit pin is called CSO and the chip 2 entry pin is
CSI. For chips at the top of the panel things are reversed:
DIR is low, entry pins are CSO and exit pins are CSI, because the data-into-latches sequence is in descending order, HVOUT32 down to HVOUT1.
4) The buses may of course be separate, and data can be
strobed in on an interleaved basis, etc., but those complications will be left to systems designers.
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HV633
Pin Descriptions
Pin #
Function
1
HVOUT1
2
HVOUT2
3
HVOUT3
4
HVOUT4
5
HVOUT5
6
HVOUT6
7
HVOUT7
8
HVOUT8
9
HVOUT9
10
HVOUT10
11
HVOUT11
12
HVOUT12
13
HVOUT13
14
HVOUT14
15
HVOUT15
16
HVOUT16
17
HVGND
This is ground for the high-voltage (output) section. HVGND and LVGND should be
connected together externally.
18
VR
High voltage ramp input for charging the output stage hold capacitors (CH). This input can
be linear or non-linear as desired.
19
VPP
This input biases the output source followers.
20
NC
No connect.
21
VDD (analog)*
22
CSI
Input pin for the chip select pulse (when DIR is high). Output pin for the chip select pulse
(when DIR is low).
23
NC
No connect.
24
VCTL
25
RCTL
26
SC
(shift clock)
27
LVGND
28
DIR
29
VDD
(digital)*
Description
High-voltage outputs
Low-voltage analog supply voltage.
Voltage supply pin to prevent output voltage from being affected by its adjacent outputs
(VCTL = 2.0V for a particular panel). The combination of VCTL and RCTL will reduce the output
voltage variation to less than ±0.2V of delta voltage between high voltage outputs of the
same level at all gray levels.
Current sense resistor to ground to prevent output voltage from being affected by its
adjacent outputs (RCTL = 56KΩ for a particular panel). See VCTL function above.
Triggers data on both rising and falling edges. This implies that the data rate is always twice
the clock rate (data rate = 20MHz if clock rate = 10MHz).
This is ground for the logic section. HVGND and LVGND should be connected together
externally.
When this pin is connected to VDD, input data is shifted in ascending order, i.e.,
corresponding to HVOUT1 to HVOUT32. When connected to LVGND, input data is shifted in
descending order, i.e., corresponding to HVOUT32 to HVOUT1.
Low-voltage digital supply voltage.
* Analog VDD and digital VDD may be connected seperately for better noise immunity.
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HV633
Pin Descriptions (cont.)
Pin #
Function
30
D7
31
D6
32
D5
33
D4
34
D3
35
D2
36
D1
37
NC
38
LVGND
39
NC
40
LC
(Load Count)
Description
Inputs for binary-format parallel data.
No connect.
This is ground for the logic section. HVGND and LVGND should be connected together
externally.
No connect.
Input for a pulse whose rising edge causes data from the input latches to enter the
comparator latches, and whose falling edge initiates the conversion of this binary data to
an output level (D-to-A). Also, the HVOUT will clear to zero after the load count is initiated.
41
NC
42
CC
(Count Clock)
43
CSO
44
NC
No connect.
45
VPP
This input biases the output source followers.
46
NC
No connect.
47
VR
48
HVGND
49
HVOUT17
50
HVOUT18
51
HVOUT19
52
HVOUT20
53
HVOUT21
54
HVOUT22
55
HVOUT23
56
HVOUT24
57
HVOUT25
58
HVOUT26
59
HVOUT27
60
HVOUT28
61
HVOUT29
62
HVOUT30
63
HVOUT31
64
HVOUT32
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No connect.
Input to the count clock generator whose increments are compared to the data in the
comparator latches.
Input pin for the chip select pulse (when DIR is low). Output pin for the chip select pulse
(when DIR is high).
High-voltage ramp input for charging the output stage hold capacitors (CH).This input can
be linear or non-linear as desired.
This is ground for the high-voltage (output) section. HVGND and LVGND should be
connected together externally.
High-voltage outputs
11
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HV633
64-Lead PQFP (3-Sided) Package Outline (PG)
20.00x14.00mm body, 3.40mm height (max), 0.80mm pitch, 3.90mm footprint
D
L3
D1
64
E1 E
Note 1
(Index Area
D1/4 x E1/4)
1
Note 2
e
b
θ1
Top View
View B
A A2
Seating
Plane
A1
L
L1
L2
Gauge
Plane
θ
Seating
Plane
View B
Side View
Note:
1. A Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier can be: a molded mark/identifier; an embedded metal marker; or
a printed indicator.
2. The leads on this side are trimmed.
Symbol
Dimension
(mm)
A
A1
A2
b
D
D1
E
E1
MIN
2.80
0.25
2.55
0.30
22.25 19.80 17.65 13.80
NOM
-
-
2.80
-
22.50 20.00 17.90 14.00
MAX
3.40
0.50
3.05
0.45
e
L
L1
0.73
L2
L3
θ
θ1
0
5O
O
0.80
1.95 0.25 0.55
0.88
3.5O
BSC
REF BSC REF
22.75 20.20 18.15 14.20
1.03
7O
16O
Drawings not to scale.
Supertex Doc. #: DSPD-64PQFPPG, Version NR090608.
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)
Supertex inc.
©2014 Supertex inc. All rights reserved. Unauthorized use or reproduction is prohibited.
Doc.# DSFP-HV633
C031414
12
1235 Bordeaux Drive, Sunnyvale, CA 94089
Tel: 408-222-8888
www.supertex.com
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