TI1 LP8860AQVFPRQ1 Low-emi automotive led driver with four 150-ma channel Datasheet

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LP8860-Q1
SNVSAM5 – AUGUST 2016
LP8860-Q1 Low-EMI Automotive LED Driver With Four 150-mA Channels
1 Features
2 Applications
•
•
•
1
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Input Voltage Operating Range 3 V to 48 V
Four High-Precision Current Sinks
– Current Matching 0.5% (typical)
– LED String Current up to 150 mA per Channel
– Dimming Ratio >13 000:1 With External PWM
Brightness Control
– 16-bit Dimming Control with SPI or I2C
– Supports Display Mode (Global Dimming) and
Cluster Mode (Independent Dimming)
Hybrid PWM and Current Dimming for Higher LED
Drive Optical Efficiency
Synchronization for LED PWM Frequency
Boost Controller With Programmable Switching
Frequency 100 kHz to 2.2 MHz and SpreadSpectrum Option for Lower EMI
Boost Synchronization Input
Power-Line FET Control for Inrush Current
Protection and Standby Energy Saving
Automatic LED Current Reduction With External
Temperature Sensor
Extensive Fault Diagnostics
Backlight for:
– Automotive Infotainment
– Automotive Instrument Clusters
– Smart Mirrors
– Heads-Up Displays (HUD)
– Central Information Displays (CID)
– Audio-Video Navigation (AVN)
3 Description
The LP8860-Q1 is an automotive high-efficiency LED
driver with boost controller. It has 4 high-precision
current sinks that can be controlled by a PWM input
signal, an SPI or I2C master, or both.
The boost converter has adaptive output voltage
control based on the headroom voltages of the LED
current sinks. This feature minimizes the power
consumption by adjusting the voltage to the lowest
sufficient level in all conditions. A wide-range
adjustable frequency allows the LP8860-Q1 to avoid
disturbance for AM radio band.
The LP8860-Q1 supports built-in hybrid PWM and
current dimming, which reduces EMI, extends the
LED lifetime, and increases the total optical
efficiency. Phase-shift PWM reduces audible noise
and output ripple.
To request a full data sheet or other design
resources: request LP8860-Q1.
Simplified Schematic
VIN
RISENSE
3...40 V
Device Information(1)
D
L
Q2
Up to 48V
CIN
COUT
C1P
SD
VSENSE_N
System Efficiency
ISENSE
VDD 3.3V
RSENSE
VDD
95
ISENSE_GND
CPUMP
BODY SIZE (NOM)
7.00 mm × 7.00 mm
GD
VSENSE_P
CCPUMP
PACKAGE
HLQFP (32)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Q1
C1N
PART NUMBER
LP8860-Q1
C2x
FB
CVDD
90
SQW
FILTER
LP8860-Q1
SYNC
V/H SYNC
Efficiency (%)
BOOST SYNC
Up to 150 mA/string
OUT1
VSYNC
BRIGHTNESS
PWM
OUT2
SCLK/SCL
OUT3
MOSI/SDA
OUT4
MISO
FAULT RESET
85
VIN = 5 V
80
VIN = 6 V
75
VIN = 8 V
NSS
EN
TSENSE
VDDIO/EN
FAULT
SGND
NTC
65
VIN = 12 V
ISET
IF
FAULT
RT°
70
PGND LGND
VIN = 15 V
PAD
RISET
VDDIO
0
10
20
30
40
50
60
Brightness (%)
70
80
90
100
C001
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LP8860-Q1
SNVSAM5 – AUGUST 2016
www.ti.com
4 Device Comparison Table
VIN range
Number of LED channels
LED current / channel
LP8860-Q1
LP8862-Q1
LP8861-Q1
TPS61193-Q1
TPS61194-Q1
TPS61196-Q1
3 V to 48 V
4.5 V to 45 V
4.5 V to 45 V
4.5 V to 45 V
4.5 V to 45 V
8 V to 30 V
4
2
4
3
4
6
150 mA
160 mA
100 mA
100 mA
100 mA
200 mA
I2C/SPI support
Yes
No
No
No
No
No
SEPIC support
No
Yes
Yes
Yes
Yes
No
2
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: LP8860-Q1
LP8860-Q1
www.ti.com
SNVSAM5 – AUGUST 2016
5 Device and Documentation Support
5.1 Device Support
5.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
5.2 Documentation Support
5.2.1 Related Documentation
For related documentation see the following:
• PowerPAD™ Thermally Enhanced Package Application Note
• Understanding Boost Power Stages in Switch Mode Power Supplies
• Power Stage Designer™ Tools
5.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: LP8860-Q1
3
PACKAGE OPTION ADDENDUM
www.ti.com
5-Nov-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LP8860AQVFPRQ1
ACTIVE
HLQFP
VFP
32
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
LP8860AQ1
LP8860BQVFPRQ1
PREVIEW
HLQFP
VFP
32
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
LP8860BQ1
LP8860CQVFPRQ1
ACTIVE
HLQFP
VFP
32
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
LP8860CQ1
LP8860DQVFPRQ1
ACTIVE
HLQFP
VFP
32
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
LP8860DQ1
LP8860HQVFPRQ1
PREVIEW
HLQFP
VFP
32
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
LP8860HQ1
LP8860JQVFPRQ1
PREVIEW
HLQFP
VFP
32
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
LP8860JQ1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
5-Nov-2016
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP8860AQVFPRQ1
HLQFP
VFP
32
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
LP8860BQVFPRQ1
HLQFP
VFP
32
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
LP8860CQVFPRQ1
HLQFP
VFP
32
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
LP8860DQVFPRQ1
HLQFP
VFP
32
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
LP8860HQVFPRQ1
HLQFP
VFP
32
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
LP8860JQVFPRQ1
HLQFP
VFP
32
1000
330.0
16.4
9.6
9.6
1.9
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP8860AQVFPRQ1
HLQFP
VFP
32
1000
367.0
367.0
38.0
LP8860BQVFPRQ1
HLQFP
VFP
32
1000
367.0
367.0
38.0
LP8860CQVFPRQ1
HLQFP
VFP
32
1000
367.0
367.0
38.0
LP8860DQVFPRQ1
HLQFP
VFP
32
1000
367.0
367.0
38.0
LP8860HQVFPRQ1
HLQFP
VFP
32
1000
367.0
367.0
38.0
LP8860JQVFPRQ1
HLQFP
VFP
32
1000
367.0
367.0
38.0
Pack Materials-Page 2
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