TI1 DAC38RF83IAAV Dual- or single-channel, single-ended or differential-output, 14-bit, 9-gsps, rf-sampling dac with jesd204b interface and on-chip pll Datasheet

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DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
DAC38RFxx: Dual- or Single-Channel, Single-Ended or Differential-Output,
14-bit, 9-GSPS, RF-Sampling DAC with JESD204B Interface and On-Chip PLL
1 Features
3 Description
•
•
•
The DAC38RFxx is a family of high-performance,
dual/single-channel, 14-bit, 9-GSPS, RF-sampling
digital-to-analog converters (DACs) that are capable
of synthesizing wideband signals from 0 to 4.5 GHz.
A high dynamic range allows the DAC38RFxx family
to generate 3G/4G signals for wireless basestations
with an output frequency up to 4 GHz.
1
•
•
•
•
•
•
•
14-Bit Resolution
Maximum DAC Sample Rate: 9 GSPS
Key Specifications:
– RF Full Scale Output Power at 2.1 GHz:
– DAC38RF80/90/84: 0 dBm
– DAC38RF83/93/85: 3 dBm (with 2:1 balun)
– Spectral Performance (on-chip PLL, DIFF):
– fDAC = 5898.24 MSPS, fOUT = 2.14 GHz
– WCDMA ACLR: 75 dBc
– WCDMA alt-ACLR: 77 dBc
– fDAC = 8847.36 MSPS, fOUT = 3.7 GHz
– 20 MHz LTE ACLR: 63 dBc
– fDAC = 9 GSPS, fOUT = 1.8 GHz
– IMD3 = 70 dBc (–6 dBFS, 10 MHz tone
spacing)
– NSD = –157 dBc/Hz
Dual-Band Digital Upconverter per DAC
– Max Input Rate: 1 Band: 1250 MSPS
Complex, 2 bands: 625 MSPS Complex Each
– 6, 8, 10, 12, 16, 18, 20 or 24x Interpolation
– 4 Independent NCOs with 48-Bit Resolution
JESD204B Interface
– Subclass 1 Support for Multi-chip
Synchronization
– Maximum Lane Rate: 12.5 Gbps
Single-Ended Output with Integrated Balun
(DAC38RF80/90/84) Covering 700–3800 MHz
Internal PLL and VCO with Bypass
– fC(VCO) = 5.9 or 8.9 GHz
Power Dissipation: 1.4 – 2.2 W/ch
Power Supplies: –1.8 V, 1.0 V, 1.8 V
Package: 10 x 10 mm BGA, 0.8 mm Pitch,
144-Balls
The devices feature a low-power JESD204B Interface
with up to 8 lanes, and provides a maximum bit rate
of 12.5 Gbps and input sample rate of 1.25 GSPS
complex per channel. The DAC38RFxx provides two
digital upconverters per DAC, with multiple
interpolation rates and a digital quadrature modulator
with independent, frequency flexible NCOs. An
optional low-jitter PLL/VCO simplifies the DAC clock
generation by allowing use of a lower frequency
reference clock.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DAC38RF83
DAC38RF93
DAC38RF85
DAC38RF80
FCBGA (144)
10.0 mm x 10.0 mm
DAC38RF90
DAC38RF84
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 x 20 MHz LTE at 1.84 GHz and 2.14 GHz,
800 MHz Span
2 Applications
•
•
•
•
•
•
Wireless Communications
Radar
Communications Test Equipment
Arbitrary Waveform Generators
Military Software Defined Radio
Satellite Communications (SATCOM)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 4
Pin Configuration and Functions ......................... 5
Specifications....................................................... 11
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
8
Absolute Maximum Ratings ....................................
ESD Ratings............................................................
Recommended Operating Conditions.....................
Thermal Information ................................................
Electrical Characteristics - DC Specifications .........
Electrical Characteristics - Digital Specifications ....
Electrical Characteristics - AC Specifications .........
Timing Requirements ..............................................
Typical Characteristics ............................................
11
11
11
12
12
15
18
21
22
Detailed Description ............................................ 30
8.1 Overview ................................................................. 30
8.2 Functional Block Diagrams ..................................... 30
8.3 Feature Description................................................. 36
8.4 Device Functional Modes........................................ 70
8.5 Register Maps ........................................................ 74
9
Application and Implementation ...................... 136
9.1 Application Information.......................................... 136
9.2 Typical Application: Multi-band Radio Frequency
Transmitter ............................................................ 137
10 Power Supply Recommendations ................... 141
10.1 Power Supply Sequencing .................................. 142
11 Layout................................................................. 143
11.1 Layout Guidelines ............................................... 143
11.2 Layout Example .................................................. 146
12 Device and Documentation Support ............... 147
12.1 Related Links ......................................................
12.2 Receiving Notification of Documentation
Updates..................................................................
12.3 Community Resources........................................
12.4 Trademarks .........................................................
12.5 Electrostatic Discharge Caution ..........................
12.6 Glossary ..............................................................
147
147
147
147
147
147
13 Mechanical, Packaging, and Orderable
Information ......................................................... 147
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (December 2016) to Revision A
Page
•
Changed Feature: Spectral Performance (on-chip PLL, DIFF) .............................................................................................. 1
•
Changed 1 V to 1.0 V in Features ......................................................................................................................................... 1
•
Changed text From: 1.25 GSPS complex per channel To: 1.23 GSPS complex per channel in the Description ................. 1
•
Changed the Pin Configuration image .................................................................................................................................. 5
•
Changed the Pin Functions table ........................................................................................................................................... 6
•
Changed the Pin Configuration image .................................................................................................................................. 8
•
Changed the Pin Functions table ........................................................................................................................................... 9
•
Added "Transformer (TCM2-452X-2+) loss not de-embedded 2.1 GHz output frequency" to the Full scale output
power Test Conditions in Electrical Characteristics - DC Specifications.............................................................................. 12
•
Changed Reference output current From: 100 mA To: 100 nA in the Electrical Characteristics - DC Specifications ......... 12
•
Changed the POWER SUPPLY CURRENT AND CONSUMPTION section of the Electrical Characteristics - DC
specifications table ............................................................................................................................................................... 12
•
Updated the typical values for power consumption for all modes in Electrical Characteristics - DC Specifications table... 15
•
Specified the test conditions for Electrical Characteristics - DC Specifications table .......................................................... 15
•
Added max current and power consumption for operating Mode 1 and Mode 11 Electrical Characteristics - DC
Specifications table............................................................................................................................................................... 15
•
Changed VI(DPP) From: MIN = 100 V TYP = 800 V To: TYP = 800 mV MAX = 2000 mVin Electrical Characteristics Digital Specifications table.................................................................................................................................................... 15
•
Changed the typical values throughout the Electrical Characteristics - AC Specifications table ......................................... 18
•
Changed the NSD Test Conditions in the Electrical Characteristics - AC Specifications table ........................................... 19
•
Changed the AC PERFORMANCE – Modulated Signals section Test Conditions in the Electrical Characteristics AC Specifications table......................................................................................................................................................... 20
•
Changed From: LMFSHd = 841 To: LMFSHd = 84111 in the Typical Characteristics conditions statement ...................... 22
•
Updated graphs in the Typical Characteristics section ........................................................................................................ 22
2
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DAC38RF83 DAC38RF93
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
www.ti.com
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Revision History (continued)
•
Specified transformer loss is not de-embedded in Figure 37 under Typical Characteristics ............................................... 28
•
Specified the VCO center frequency and carrier frequency in Figure 39 through Figure 42 .............................................. 29
•
Replaced the Functional Block Diagrams, Figure 43 through Figure 48.............................................................................. 30
•
Updated the max input rate in Table 9 ................................................................................................................................ 41
•
Updated value of pull up and pull down resistors in Figure 68 under CMOS Digital Inputs ................................................ 68
•
Changed From: 2 x (DACFS -11) To: 2 mA x (DACFS - 11) in Equation 10 ...................................................................... 68
•
Updated the startup sequence in Figure 165 .................................................................................................................... 136
•
Replaced Figure 170 ......................................................................................................................................................... 141
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DAC38RF83 DAC38RF93
3
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
5 Device Comparison Table
Device
DAC38RF83
DAC38RF93
DAC38RF85
DAC38RF80
DAC38RF90
DAC38RF84
4
No. of
Channels
Output
Interpolation
VCO Center
Frequency
6-24
VCO0 = 5.9 GHz,
VCO1 = 8.85 GHz
12-24
VCO0 = 5.9 GHz,
VCO1 = 8.85 GHz
6-24
VCO0 = 5.9 GHz,
VCO1 = 8.85 GHz
6-24
VCO0 = 5.9 GHz,
VCO1 = 8.85 GHz
12-24
VCO0 = 5.9 GHz,
VCO1 = 8.85 GHz
6-24
VCO0 = 5.9 GHz,
VCO1 = 8.85 GHz
2
2
Differential
1
2
2
Single ended
1
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DAC38RF83 DAC38RF93
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
www.ti.com
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
6 Pin Configuration and Functions
DAC38RF83, DAC38RF93, DAC38RF85 AAV Package 144-Pin (FCBGA)
144-Pin FCBGA
Top View
A
B
C
D
E
F
G
H
J
K
L
M
VSSCLK
AGND
VOUT2+
VOUT2-
AGND
VDDOUT18
VDDOUT18
AGND
VOUT1-
VOUT1+
AGND
12
VSSCLK
AGND
AGND
AGND
VDDA1
VDDA18
VDDA18
VDDA1
AGND
AGND
AGND
11
10 DACCLK+
VDDAPLL18
EXTIO
VEE18N
VEE18N
VSSCLK
VDDL2_1
VDDL2_1
VSSCLK
VEE18N
VEE18N
SDIO
10
9
DACCLK-
VDDAPLL18
RBIAS
VSSCLK
VDDCLK1
VDDCLK1
VSSCLK
RESET\
SCLK
SDO
9
8
VSSCLK
VSSCLK
ATEST
VDDPLL1
VDDPLL1
VSSCLK
VDDL1_1
VDDL1_1
VSSCLK
ALARM
SLEEP
SDEN\
8
7
CLKTX+
VDDTX18
SYNC1\+
VDDDIG1
DGND
VDDE1
DGND
VDDE1
DGND
GPI0
GPO0
GPI1
7
6
CLKTX-
VDDTX1
SYNC1\-
DGND
VDDDIG1
DGND
VDDE1
DGND
VDDE1
TXENABLE
GPO1
DGND
6
5
VDDDIG1
VDDDIG1
VDDDIG1
VDDDIG1
VDDDIG1
VDDDIG1
VDDDIG1
VDDIO18
TRST\
TMS
DGND
RX3+
5
4
SYSREF-
VDDS18
SYNC0\+
VSENSE
VDDDIG1
VDDDIG1
VDDDIG1
TDI
TDO
TCLK
DGND
RX3-
4
3
SYSREF+
VDDS18
SYNC0\-
IFORCE
VDDDIG1
AMUX1
AMUX0
VDDT1
VDDT1
TESTMODE
DGND
RX2-
3
2
DGND
DGND
DGND
DGND
DGND
DGND
DGND
VDDR18
VDDR18
DGND
DGND
RX2+
2
1
RX7+
RX7-
RX6-
RX6+
RX5+
RX5-
RX4-
RX4+
RX0+
RX0-
RX1-
RX1+
1
A
B
C
D
E
F
G
H
J
K
L
M
12 DACCLKSE
11
VSSCLK
VDDAVCO18 VDDAVCO18
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DAC38RF83 DAC38RF93
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DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
Pin Functions - DAC38RF83, DAC38RF93, DAC38RF85
PIN
I/O
DESCRIPTION
NAME
NO.
AGND
C11, C12, D11, E11,
F12, J12, K11, L11,
M11, M12
–
Analog ground.
ALARM
K8
O
CMOS output for ALARM condition. The ALARM output functionality is defined through the config7
register. Default polarity is active low, but can be changed to active high via config0 alarm_out_pol
control bit.
AMUX0
G3
O
Analog test pin for SerDes, Lane 0 to Lane 3. Can be left floating.
AMUX1
F3
O
Analog test pin for SerDes, Lane 4 to Lane 7. Can be left floating.
ATEST
C8
O
Analog test pin for DAC, references and PLL. Can be left floating.
CLKTX+
A7
O
Divided output clock, self-biased, positive terminal.
CLKTX-
A6
O
Divided output clock, internally biased, negative terminal.
DACCLK+
A10
I
Device clock, self-biased, positive terminal.
DACCLK-
A9
I
Device clock, self-biased, negative terminal.
DACCLKSE
A12
I
Single ended device clock optional input. Can be left floating if not used.
DGND
A2, B2, C2, D2, D6, E2,
E7, F2, F6, G2, G7, H6,
J7, K2, L2, L3, L4, L5,
M6
-
Digital ground.
EXTIO
C10
I/O
GPI0
K7
-
Requires a 0.1 μF decoupling capacitor to AGND.
Factory use only. User should GND.
GPI1
M7
-
Factory use only. User should GND.
GPO0
L7
O
Used for CMOS SYNC0\ signal.
GPO1
L6
O
Used for CMOS SYNC1\ signal.
IFORCE
D3
O
Test pin for on chip parametrics. Can be left floating.
RBIAS
C9
O
Full-scale output current bias. Change the full-scale output current through DACFS in register DACFS
(8.5.72). Expected to be 3.6 kΩ to GND for 40 mA full scale output.
RESET
K9
I
Active low input for chip RESET, which resets all the programming registers to their default state. Internal
pull-up.
RX0+
J1
I
CML SerDes interface lane 0 input, positive
RX0-
K1
I
CML SerDes interface lane 0 input, negative
RX1+
M1
I
CML SerDes interface lane 1 input, positive
RX1-
L1
I
CML SerDes interface lane 1 input, negative
RX2+
M2
I
CML SerDes interface lane 2 input, positive
RX2-
M3
I
CML SerDes interface lane 2 input, negative
RX3+
M5
I
CML SerDes interface lane 3 input, positive
RX3-
M4
I
CML SerDes interface lane 3 input, negative
RX4+
H1
I
CML SerDes interface lane 4 input, positive
RX4-
G1
I
CML SerDes interface lane 4 input, negative
RX5+
E1
I
CML SerDes interface lane 5 input, positive
RX5-
F1
I
CML SerDes interface lane 5 input, negative
RX6+
D1
I
CML SerDes interface lane 6 input, positive
RX6-
C1
I
CML SerDes interface lane 6 input, negative
RX7+
A1
I
CML SerDes interface lane 7 input, positive
RX7-
B1
I
CML SerDes interface lane 7 input, negative
SCLK
L9
I
Serial interface clock. Internal pull-down.
SDEN
M8
I
Active low serial data enable, always an input to the DAC38RFxx. Internal pull-up.
SDIO
M10
I/O
Serial interface data. Bi-directional in 3-pin mode (default) and uni-directional input 4-pin mode. Internal
pull-down.
SDO
M9
O
Uni-directional serial interface data output in 4-pin mode. The SDO pin is tri-stated in 3-pin interface
mode (default).
SLEEP
L8
I
Active high asynchronous hardware power-down input. Internal pull-down.
SYNC0+
C4
O
Synchronization request to transmitter for JESD204B link 0, LVDS positive output.
SYNC0-
C3
O
Synchronization request to transmitter for JESD204B link 0, LVDS negative output.
SYNC1+
C7
O
Synchronization request to transmitter for JESD204B link 1, LVDS positive output.
6
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DAC38RF85, DAC38RF90, DAC38RF93
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Pin Functions - DAC38RF83, DAC38RF93, DAC38RF85 (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
SYNC1-
C6
O
Synchronization request to transmitter for JESD204B link 1, LVDS negative output.
SYSREF+
A3
I
LVPECL SYSREF positive input. This positive/negative pair is captured with the rising edge of
DACCLKP/N. It is used for multiple DAC synchronization.
SYSREF-
A4
I
LVPECL SYSREF negative input. (See the SYSREF description)
TCLK
K4
I
JTAG test clock. Internal pull-down
TDI
H4
I
JTAG test data in. Internal pull-up
TDO
J4
O
JTAG test data out. Internal pull-up
TESTMODE
K3
-
This pin is used for factory testing.
Recommended to connect to ground for normal operation.
TMS
K5
I
JTAG test mode select. Internal pull-up
TRST
J5
I
JTAG test reset. Internal pull-up. Must be connected to ground if not used
K6
I
Transmit enable active high input. Internal pull-down.
To enable analog output data transmission, set sif_txenable in register config3 to “1” or pull CMOS
TXENABLE pin to high.
To disable analog output, set sif_txenable to “0” and pull CMOS TXENABLE pin to low. The DAC output
is forced to midscale.
VDDA1
F11, J11
I
Analog 1 V supply voltage.
VDDA18
G11, H11
I
Analog 1.8 V supply voltage. (1.8 V)
VDDPLL1
D8, E8
I
Analog 1 V supply for PLL.
VDDAPLL18
B9, B10
I
PLL analog supply voltage. (1.8 V)
VDDAVCO18
D9, E9
I
Analog supply voltage for VCO (1.8 V)
VDDCLK1
G9, H9
I
Internal clock buffer supply voltage (1 V).
It is recommended to isolate this supply from VDDDIG1 and VDDA1.
VDDL1_1
G8, H8
I
DAC core supply voltage. (1 V)
VDDL2_1
G10, H10
I
DAC core supply voltage. (1 V)
VDDDIG1
A5, B5, C5, D5, D7, E3,
E4, E5, E6, F4, F5, G4,
G5
I
Digital supply voltage. (1 V).
It is recommended to isolate this supply from VDDCLK1 and VDDA1.
F7, H7, G6, J6
I
Digital Encoder supply voltage (1 V).
Must be separated from VDDDIG1 supply
TXENABLE
VDDE1
VDDIO18
H5
I
Supply voltage for all digital I/O and CMOS I/O.
G12, H12
I
DAC output supply. (1.8 V)
VDDR18
H2, J2
I
Supply voltage for SerDes. (1.8 V)
VDDS18
B3, B4
I
Supply voltage for LVDS SYNC0+/- and SYNC1+/- (1.8 V)
VDDT1
H3, J3
I
Supply voltage for SerDes termination. (1 V)
VDDTX1
B6
I
Supply voltage for divided clock output. (1 V)
VDDTX18
B7
I
Supply voltage for divided clock output . (1.8 V)
VEE18N
D10, E10, K10, L10
I
Analog supply voltage. (-1.8 V)
VOUT1+
L12
O
DAC channel 1 output.
VOUT1-
K12
O
DAC channel 1 complementary output.
VOUT2+
D12
O
DAC channel 2 output. Leave pin floating in DAC38RF85
VOUT2-
E12
O
DAC channel 2 complementary output. Leave pin floating in DAC38RF85
VSENSE
D4
O
Test pin for on chip parametrics. Can be left floating.
VSSCLK
A8, A11, B8, B11, B12,
F8, F9, F10, J8, J9, J10
-
Clock ground.
VDDOUT18
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DAC38RF83 DAC38RF93
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DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
DAC38RF80, DAC38RF84, DAC38RF90 AAV Package 144-Pin (FCBGA)
144-Pin FCBGA
Top View
A
B
C
D
E
F
G
H
J
K
L
M
VSSCLK
AGND
AGND
VOUT2
AGND
VDDOUT18
VDDOUT18
AGND
VOUT1
AGND
AGND
12
VSSCLK
AGND
AGND
AGND
VDDA1
VDDA18
VDDA18
VDDA1
AGND
AGND
AGND
11
10 DACCLK+
VDDAPLL18
EXTIO
VEE18N
VEE18N
VSSCLK
VDDL2_1
VDDL2_1
VSSCLK
VEE18N
VEE18N
SDIO
10
9
DACCLK-
VDDAPLL18
RBIAS
VSSCLK
VDDCLK1
VDDCLK1
VSSCLK
RESET\
SCLK
SDO
9
8
VSSCLK
VSSCLK
ATEST
VDDPLL1
VDDPLL1
VSSCLK
VDDL1_1
VDDL1_1
VSSCLK
ALARM
SLEEP
SDEN\
8
7
CLKTX+
VDDTX18
SYNC1\+
VDDDIG1
DGND
VDDE1
DGND
VDDE1
DGND
GPI0
GPO0
GPI1
7
6
CLKTX-
VDDTX1
SYNC1\-
DGND
VDDDIG1
DGND
VDDE1
DGND
VDDE1
TXENABLE
GPO1
DGND
6
5
VDDDIG1
VDDDIG1
VDDDIG1
VDDDIG1
VDDDIG1
VDDDIG1
VDDDIG1
VDDIO18
TRST\
TMS
DGND
RX3+
5
4
SYSREF-
VDDS18
SYNC0\+
VSENSE
VDDDIG1
VDDDIG1
VDDDIG1
TDI
TDO
TCLK
DGND
RX3-
4
3
SYSREF+
VDDS18
SYNC0\-
IFORCE
VDDDIG1
AMUX1
AMUX0
VDDT1
VDDT1
TESTMODE
DGND
RX2-
3
2
DGND
DGND
DGND
DGND
DGND
DGND
DGND
VDDR18
VDDR18
DGND
DGND
RX2+
2
1
RX7+
RX7-
RX6-
RX6+
RX5+
RX5-
RX4-
RX4+
RX0+
RX0-
RX1-
RX1+
1
A
B
C
D
E
F
G
H
J
K
L
M
12 DACCLKSE
11
8
VSSCLK
VDDAVCO18 VDDAVCO18
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DAC38RF83 DAC38RF93
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
www.ti.com
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Pin Functions - DAC38RF80,DAC38RF90,DAC38RF84
PIN
I/O
DESCRIPTION
NAME
NO.
AGND
C11, C12, D11, E11,
F12, J12, K11, L11,
M11, M12, D12, L12
-
Analog ground.
ALARM
K8
O
CMOS output for ALARM condition. The ALARM output functionality is defined through the config7
register. Default polarity is active low, but can be changed to active high via config0 alarm_out_pol
control bit.
AMUX0
G3
O
Analog test pin for SerDes, Lane 0 to Lane 3. Can be left floating.
AMUX1
F3
O
Analog test pin for SerDes, Lane 4 to Lane 7. Can be left floating.
ATEST
C8
O
Analog test pin for DAC, references and PLL. Can be left floating.
CLKTX+
A7
O
Divided output clock, self-biased, positive terminal.
CLKTX-
A6
O
Divided output clock, self-biased, negative terminal.
DACCLK+
A10
I
Device clock, self-biased, positive terminal.
DACCLK-
A9
I
Device clock, self-biased, negative terminal.
DACCLKSE
A12
I
Single ended device clock optional input. Can be left floating if not used.
DGND
A2, B2, C2, D2, D6, E2,
E7, F2, F6, G2, G7, H6,
J7, K2, L2, L3, L4, L5,
M6
-
Digital ground.
EXTIO
C10
Requires a 0.1 μF decoupling capacitor to AGND.
GPI0
L6
Factory use only. User should GND.
GPI1
M7
Factory use only. User should GND.
GPO0
L7
Used for CMOS SYNC0\ signal.
GPIO1
K7
Used for CMOS SYNC1\ signal.
IFORCE
D3
Test pin for on chip parametrics. Can be left floating.
RBIAS
C9
I/O
RESET
K9
I
Active low input for chip RESET, which resets all the programming registers to their default state. Internal
pull-up.
RX0+
J1
I
CML SerDes interface lane 0 input, positive
RX0-
K1
I
CML SerDes interface lane 0 input, negative
RX1+
M1
I
CML SerDes interface lane 1 input, positive
RX1-
L1
I
CML SerDes interface lane 1 input, negative
RX2+
M2
I
CML SerDes interface lane 2 input, positive
RX2-
M3
I
CML SerDes interface lane 2 input, negative
RX3+
M5
I
CML SerDes interface lane 3 input, positive
RX3-
M4
I
CML SerDes interface lane 3 input, negative
RX4+
H1
I
CML SerDes interface lane 4 input, positive
RX4-
G1
I
CML SerDes interface lane 4 input, negative
RX5+
E1
I
CML SerDes interface lane 5 input, positive
RX5-
F1
I
CML SerDes interface lane 5 input, negative
RX6+
D1
I
CML SerDes interface lane 6 input, positive
RX6-
C1
I
CML SerDes interface lane 6 input, negative
RX7+
A1
I
CML SerDes interface lane 7 input, positive
RX7-
B1
I
CML SerDes interface lane 7 input, negative
SCLK
L9
I
Serial interface clock. Internal pull-down.
SDEN
M8
I
Active low serial data enable, always an input to the DAC38RFxx. Internal pull-up.
SDIO
M10
I/O
Serial interface data. Bi-directional in 3-pin mode (default) and uni-directional input 4-pin mode. Internal
pull-down.
SDO
M9
O
Uni-directional serial interface data output in 4-pin mode. The SDO pin is tri-stated in 3-pin interface
mode (default).
Full-scale output current bias. Change the full-scale output current through DACFS in register DACFS
(8.5.72). Expected to be 3.6 kΩ to GND for 40 mA full scale output.
SLEEP
L8
I
Active high asynchronous hardware power-down input. Internal pull-down.
SYNC0+
C4
O
Synchronization request to transmitter for JESD204B link 0, LVDS positive output.
SYNC0-
C3
O
Synchronization request to transmitter for JESD204B link 0, LVDS negative output.
SYNC1+
C7
O
Synchronization request to transmitter for JESD204B link 1, LVDS positive output.
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Pin Functions - DAC38RF80,DAC38RF90,DAC38RF84 (continued)
PIN
I/O
DESCRIPTION
NAME
NO.
SYNC1-
C6
O
Synchronization request to transmitter for JESD204B link 1, LVDS negative output.
SYSREF+
A3
I
LVPECL SYSREF positive input. This positive/negative pair is captured with the rising edge of
DACCLKP/N. It is used for multiple DAC synchronization.
SYSREF-
A4
I
LVPECL SYSREF negative input. (See the SYSREF description)
TCLK
K4
I
JTAG test clock. Internal pull-down
TDI
H4
I
JTAG test data in. Internal pull-up
TDO
J4
O
JTAG test data out. Internal pull-up
TESTMODE
K3
I
This pin is used for factory testing.
Recommended to connect to ground.
TMS
K5
I
JTAG test mode select. Internal pull-up
TRST
J5
I
JTAG test reset. Must be connected to ground if not used. Internal pull-up
TXENABLE
K6
I
Transmit enable active high input. Internal pull-down.
To enable analog output data transmission, pull the CMOS TXENABLE pin to high.
To disable analog output, pull CMOS TXENABLE pin to low. The DAC output is forced to midscale.
VDDA1
F11, J11
I
Analog 1V supply voltage.
VDDA18
G11, H11
I
Analog 1.8V supply voltage. (1.8 V)
VDDPLL1
D8, E8
I
Analog 1V supply for PLL.
VDDAPLL18
B9, B10
I
PLL analog supply voltage. (1.8 V)
VDDAVCO18
D9, E9
I
Analog supply voltage for VCO (1.8 V)
VDDCLK1
G9, H9
I
Internal clock buffer supply voltage (1 V)
It is recommended to isolate this supply from VDDDIG1 and VDDA1.
VDDL1_1
G8, H8
I
DAC core supply voltage. (1 V)
VDDL2_1
G10, H10
I
DAC core supply voltage. (1 V)
VDDDIG1
A5, B5, C5, D5, D7, E3,
E4, E5, E6, F4, F5, G4,
G5
I
Digital supply voltage. (1 V)
It is recommended to isolate this supply from VDDCLK1 and VDDA1.
F7, H7, G6, J6
I
Digital Encoder supply voltage (1 V).
Must be separated from VDDDIG1 on new substrate device
VDDE1
VDDIO18
H5
I
Supply voltage for all digital I/O and CMOS I/O.
G12, H12
I
DAC supply voltage (1.8 V)
VDDR18
H2, J2
I
Supply voltage for SerDes. (1.8 V)
VDDS18
B3, B4
I
Supply voltage for LVDS SYNC0+/- and SYNC1+/- (1.8V)
VDDT1
H3, J3
I
Supply voltage for SerDes termination. (1 V)
VDDTX1
B6
I
Supply voltage for divided clock output. (1 V)
VDDTX18
B7
I
Supply voltage for divided clock output. (1.8 V)
VEE18N
D10, E10, K10, L10
I
Analog supply voltage. (-1.8 V)
VOUT1
K12
O
DAC channel 1 single ended output.
VOUT2
E12
O
DAC channel 2 single ended output. Leave pin floating in DAC38RF84
VSENSE
D4
I
Test pin for on chip parametrics. Can be left floating.
VSSCLK
A8, A11, B8, B11, B12,
F8, F9, F10, J8, J9, J10
-
Clock ground.
VDDOUT18
10
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply Voltage Range
(2)
MIN
MAX
UNIT
VDDDAC1, VDDDIG1, VDDL1_1, VDDL2_1,
VDDCLK1, VDDT1, VDDCLK1, VDDTX1
–0.3
1.3
V
VDDR18, VDDIO18, VDDS18, VDDAPLL18,
VDDOUT18, VDDA18, VDDAVCO18, VDDTX18
–0.3
2.45
V
VEE18N
–2
–0.5
V
–0.3
0.3
V
RX[0..7]+/-
–0.5
VDDDIG1 + 0.5 V
V
SDEN, SCLK, SDIO, SDO, TXENABLE, ALARM,
RESET, SLEEP, TMS, TCLK, TDI, TDO, TRST,
TESTMODE, GPI0, GPI1, GPO0, GPO1
–0.5
VDDIO + 0.5 V
V
CLKOUT+/-
–0.5
VDDTX18 + 0.5 V
V
DACCLK+/-, SYSREF+/-, DACCLKSE
–0.5
VDDCLK1 + 0.5 V
V
SYNC0+/-, SYNC1+/-
–0.5
VDDS18 + 0.5 V
V
VOUT1+/-, VOUT2+/-
–0.5
VDDAOUT18 + 0.5 V
V
RBIAS, EXTIO, ATEST
–0.5
VDDAOUT18 + 0.5 V
V
IFORCE, VSENSE
–0.5
VDDDIG1 + 0.5 V
V
AMUX1, AMUX0
–0.5
VDDT1 + 0.5 V
V
20
mA
Voltage between AGND and DGND
Pin Voltage Range (2)
Peak input current (any input)
Peak total input current (all inputs)
–30
mA
Junction temperature TJ
150
°C
Operating free-air temperature, TA
–40
85
°C
Storage temperature, Tstg
–65
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Measured with respect to AGND or DGND.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±1000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±250
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
TJ
TA
(1)
Recommended operating temperature
Maximum rated operating junction temperature (1)
125
Recommended free-air temperature
–40
NOM
MAX
UNIT
105
°C
°C
85
°C
Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate
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7.4 Thermal Information
AAV (FCBGA)
THERMAL METRIC (1)
UNIT
144 PINS
RθJA
Junction-to-ambient thermal resistance
25
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
1.0
°C/W
RθJB
Junction-to-board thermal resistance
7.7
°C/W
ψJT
Junction-to-top characterization parameter
0.1
°C/W
ψJB
Junction-to-board characterization parameter
7.7
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Electrical Characteristics - DC Specifications
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DC ACCURACY
Resolution
14
bits
DNL Differential nonlinearity
(DAC38RF83/93/85) only
±0.5
LSB
INL Integral nonlinearity
(DAC38RF83/93/85) only
±1
LSB
ANALOG OUTPUT
Gain Error
(DAC38RF83/93/85) only
±2
Full scale output signal current
10
P(OUTFS)
Full scale output power
2:1 transformer coupled into 50 Ω- load. Transformer
(TCM2-452X-2+) loss not de-embedded
2.1 GHz output frequency
(DAC38RF83/93/85) only)
P(OUTFS)
Full scale output power
50-Ω load
2.1 GHz output frequency
(DAC38RF80/90/84) only
Output Compliance Range
30
%FSR
40
mA
3
dBm
0
dBm
1.3
2.3
V
Output capacitance
Single ended to ground.
(DAC38RF83/93/85) only
1.5
pF
Output resistance
Measured differentially
(DAC38RF83/93/85) only
100
Ohms
REFERENCE OUTPUT
VREF
Reference output voltage
0.9
V
Reference output current
100
nA
±8
ppm/°C
TEMPERATURE COEFFICIENTS
Reference voltage drift
REFERENCE VOLTAGE DRIFT
VDDA18, VDDAPLL18, VDDS18,
VDDIO18, VDDR18, VDDAPLL18,
VDDOUT18, VDDAVCO18
1.71
1.8
1.89
V
VDDDIG1 VDDA1, VDDT1,
VDDAPLL1, VDDCLK1, VDDL1_1,
VDDL2_1, VDDTX1, VDDE1
0.95
1
1.05
V
–1.89
–1.8
–1.71
V
1478
2290
mA
1510
1758
mA
281
290
mA
VEE18N
POWER SUPPLY CURRENT AND CONSUMPTION
1 V Digital supplies: VDDDIG1
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 1: 2 TX, 1IQ/slice, LMFS = 8411, PLL on, 12x
Interpolation, fINPUT = 737.28 MSPS, fDAC = 8847.36
MSPS, NCO’s = 2.14 GHz, CLKTX Disabled
-1.8 V Supply: VEE18N
PDIS
12
Power Dissipation
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159
180
mA
3779
4894
mW
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DAC38RF85, DAC38RF90, DAC38RF93
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Electrical Characteristics - DC Specifications (continued)
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted.
PARAMETER
TEST CONDITIONS
1 V Digital supplies: VDDDIG1
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 2: 1 TX, 1IQ/slice, LMFS = 4211, PLL on, 12x
Interpolation, fINPUT = 737.28 MSPS, fDAC = 8847.36
MSPS, NCO = 2.14 GHz, CLKTX Disabled
-1.8 V Supply: VEE18N
PDIS
1303
mA
257
mA
mA
1V Digital supplies: VDDDIG1
2253
mA
1522
mA
280
mA
MODE 3: 2 TX, 2 IQ/slice, LMFS = 8821, PLL on, 24x
Interpolation, fINPUT = 368.64 MSPS, fDAC = 8847.36
MSPS, NCO1 = 1.84 GHz, NCO2 = 2.15 GHz, CLKTX
Disabled
159
mA
Power Dissipation
4565
mW
1 V Digital supplies: VDDDIG1
1701
mA
1314
mA
256
mA
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 4: 1 TX, 2 IQ/slice, LMFS = 4421, PLL on, 24x
Interpolation, fINPUT = 368.64 MSPS, fDAC = 8847.36
MSPS, NCO1 = 1.84 GHz, NCO2 = 2.15 GHz, CLKTX
Disabled
-1.8 V Supply: VEE18N
159
mA
Power Dissipation
3763
mW
1 V Digital supplies: VDDDIG1
1328
mA
1312
mA
249
mA
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 5: 2 TX, 1 IQ/slice, LMFS = 4421, PLL on, 18x
Interpolation, fINPUT = 491.52 MSPS, fDAC = 8847.36
MSPS, NCO1 = 2.14 GHz, CLKTX Disabled
-1.8 V Supply: VEE18N
159
mA
Power Dissipation
3374
mW
1 V Digital supplies: VDDDIG1
1027
mA
1206
mA
248
mA
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 6: 1 TX, 1 IQ/slice, LMFS = 2221, PLL on, 18x
Interpolation, fINPUT = 491.52 MSPS, fDAC = 8847.36
MSPS, NCO1 = 2.14 GHz, CLKTX Disabled
-1.8 V Supply: VEE18N
159
mA
Power Dissipation
2964
mW
1 V Digital supplies: VDDDIG1
1157
mA
1125
mA
246
mA
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 7: 2 TX, 1 IQ/slice, LMFS = 8411, PLL on, 6x
Interpolation, fINPUT = 983.04 MSPS, fDAC = 5898.24
MSPS, NCO1 = 2.14 GHz, CLKTX Disabled
-1.8 V Supply: VEE18N
PDIS
mA
mW
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
PDIS
UNIT
159
-1.8 V Supply: VEE18N
PDIS
MAX
3162
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
PDIS
TYP
1110
Power Dissipation
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
PDIS
MIN
Power Dissipation
159
mA
3011
mW
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Electrical Characteristics - DC Specifications (continued)
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, nominal supplies, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
1 V Digital supplies: VDDDIG1
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 8: 1 TX, 1 IQ/slice, LMFS = 4211, PLL on, 6x
Interpolation, fINPUT = 983.04 MSPS, fDAC = 5898.24
MSPS, NCO1 = 2.14 GHz, CLKTX Disabled
-1.8 V Supply: VEE18N
PDIS
647
mA
230
mA
mA
mW
1 V Digital supplies: VDDDIG1
2131
mA
1324
mA
251
mA
MODE 9: 2 TX, 2 IQ/slice, LMFS = 4831, PLL on, 24x
Interpolation, fINPUT = 368.64 MSPS, fDAC = 8847.36
MSPS, NCO1 = 2.14 GHz, CLKTX Disabled
159
mA
Power Dissipation
4192
mW
1 V Digital supplies: VDDDIG1
1635
mA
1212
mA
250
mA
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 10: 1 TX, 2 IQ/slice, LMFS = 2431, PLL on, 24x
Interpolation, fINPUT = 368.64 MSPS, fDAC = 8847.36
MSPS, NCO1 = 2.14 GHz, CLKTX Disabled
-1.8 V Supply: VEE18N
Power Dissipation
159
mA
3583
mW
1 V Digital supplies: VDDDIG1
63
568
mA
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
18
105
mA
47
51
mA
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
MODE 11: Power down mode, no clock, DACs in
sleep, Serdes in sleep
-1.8 V Supply: VEE18N
Power Dissipation
VDDTX1
VDDTX18
14
mA
159
-1.8 V Supply: VEE18N
PDIS
UNIT
2195
1.8 V Supplies: VDDA18 VDDOUT18
VDDAVCO18 VDDAPLL18 VDDR18
VDDIO18 VDDS18 VDDTX18
PDIS
MAX
848
Power Dissipation
1 V Analog supplies: VDDA1
VDDACLK1 VDDTX1 VDDAPLL1
VDDT1 VDDE1
PDIS
TYP
23
28
mA
208
815
mW
fDAC = 8847 MSPS, Clock Out Divider Enabled
25
mA
fDAC = 5898 MSPS, Clock Out Divider Enabled
19
mA
Clock Out Enabled
16
mA
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7.6 Electrical Characteristics - Digital Specifications
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9
GSPS, 12x Interpolation, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
1200
mV
CML SERDES INPUTS: RX[7:0]+/VDIFF
Receiver input amplitude
VCOM
Input common mode voltage
ZDDIFF
Internal differential termination
fSERDES
Serdes bit rate
50
TERM = 111
600
TERM = 001
700
TERM = 100
0
TERM = 101
mV
250
85
100
0.78125
115
Ω
12.5
Gbps
9
GHz
2000
mV
DIFFERENTIAL CLOCK INPUTS: SYSREF+/-, DACCLK+/fDACCLK
DACCLK input frequency
VCOM
Differential input common mode voltage
0.1
0.5
VI(DPP)
Differential input peak-to-peak voltage
800
ZT
Internal termination
100
Ω
CL
Input capacitance
2
pF
Duty cycle (DACCLK only)
40%
V
60%
LVDS OUTPUT: SYNC1+/-, SYNC2+/VCOM
Output common mode voltage
1.2
V
ZT
Internal termination
100
Ω
VOD
Differential output voltage swing
500
mV
1300
mV
CML OUTPUT: CLKTX+/VOD
CML OUTPUT: CLKTX+/-
CMOS INTERFACE: SDEN, SCLK, SDIO, SDO, TXENABLE, ALARM, RESET, SLEEP, TMS, TCLK, TDI, TDO, TRST, TESTMODE, SYNCSE1,
SYNCSE2
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
High-level input current
–40
IOL
Low-level input current
–40
CI
CMOS input capacitance
VOH
High-level output voltage
VOL
Low-level output voltage
0.7 x VDDIO
V
0.3 x VDDIO
V
40
µA
40
µA
2
ILOAD = –100 µA
VDDIO – 0.2
ILOAD = –2 mA
0.8 x VDDIO
pF
V
ILOAD = –100 µA
0.2
ILOAD = –2 mA
0.5
V
LATENCY
full rate, RATE = “00”
RX SerDes Digital Delay
half rate, RATE = “01”
34
29
quarter rate, RATE = “10”
26.5
eighth rate, RATE = “11”
26.25
SerDes output to JED204B elastic buffer
input latency
21 -39
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UI
JESD
clock
cycles
15
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
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Electrical Characteristics - Digital Specifications (continued)
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9
GSPS, 12x Interpolation, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted.
PARAMETER
16
TEST CONDITIONS
MIN
TYP
LMFSHD = 82121, 6x Interpolation
856
LMFSHD = 82121, 8x Interpolation
1120
LMFSHD = 82121, 12x Interpolation
1602
LMFSHD = 82121, 16x Interpolation
2091
LMFSHD = 42111 or 84111, 6x
Interpolation
817
LMFSHD = 42111 or 84111, 8x
Interpolation
1057
LMFSHD = 42111 or 84111, 10x
Interpolation
1184
LMFSHD = 42111 or 84111, 12x
Interpolation
1532
LMFSHD = 42111 or 84111, 16x
Interpolation
1997
LMFSHD = 42111 or 84111, 18x
Interpolation
2142
LMFSHD = 42111 or 84111, 24x
Interpolation
2941
LMFSHD = 22210 or 44210, 8x
Interpolation
1020
LMFSHD = 22210 or 44210, 12x
Interpolation
1473
Digital Latency: JESD Buffer to DAC Output LMFSHD = 22210 or 44210, 16x
Interpolation
1917
LMFSHD = 22210 or 44210, 18x
Interpolation
2050
LMFSHD = 22210 or 44210, 20x
Interpolation
2275
LMFSHD = 22210 or 44210, 24x
Interpolation
2821
LMFSHD = 12410 or 24410, 16x
Interpolation
1912
LMFSHD = 12410 or 24410, 24x
Interpolation
2786
LMFSHD = 44210 or 88210, 8x
Interpolation
916
LMFSHD = 44210 or 88210, 12x
Interpolation
1317
LMFSHD = 44210 or 88210, 16x
Interpolation
1709
LMFSHD = 44210 or 88210, 24x
Interpolation
2509
LMFSHD = 24410 or 48410, 16x
Interpolation
1672
LMFSHD = 24410 or 48410, 24x
Interpolation
1593
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MAX
UNIT
DAC
clock
cycles
Copyright © 2016–2017, Texas Instruments Incorporated
DAC38RF83 DAC38RF93
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Electrical Characteristics - Digital Specifications (continued)
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9
GSPS, 12x Interpolation, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted.
PARAMETER
SYSREF TO JESD LMFC RESET
TEST CONDITIONS
MIN
TYP
LMFSHD = 82121, 6x Interpolation
5
LMFSHD = 82121, 8x Interpolation
5
LMFSHD = 82121, 12x Interpolation
5
LMFSHD = 82121, 16x Interpolation
5
LMFSHD = 42111 or 84111, 6x
Interpolation
16
LMFSHD = 42111 or 84111, 8x
Interpolation
16
LMFSHD = 42111 or 84111, 10x
Interpolation
15
LMFSHD = 42111 or 84111, 12x
Interpolation
15
LMFSHD = 42111 or 84111, 16x
Interpolation
13
LMFSHD = 42111 or 84111, 18x
Interpolation
15
LMFSHD = 42111 or 84111, 24x
Interpolation
15
LMFSHD = 22210 or 44210, 8x
Interpolation
8
LMFSHD = 22210 or 44210, 12x
Interpolation
7
LMFSHD = 22210 or 44210, 16x
Interpolation
6
LMFSHD = 22210 or 44210, 18x
Interpolation
7
LMFSHD = 22210 or 44210, 20x
Interpolation
5
LMFSHD = 22210 or 44210, 24x
Interpolation
4
LMFSHD = 12410 or 24410, 16x
Interpolation
9
LMFSHD = 12410 or 24410, 24x
Interpolation
7
LMFSHD = 44210 or 88210, 8x
Interpolation
29
LMFSHD = 44210 or 88210, 12x
Interpolation
27
LMFSHD = 44210 or 88210, 16x
Interpolation
26
LMFSHD = 44210 or 88210, 24x
Interpolation
25
LMFSHD = 24410 or 48410, 16x
Interpolation
8
LMFSHD = 24410 or 48410, 24x
Interpolation
6
MAX
UNIT
JESD
clock
cycles
PLL/VCO
fVCO
VCO operating frequency
VCO 1
7.96
9
GHz
VCO 2
5.24
6.72
GHz
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DAC38RF83 DAC38RF93
17
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
7.7 Electrical Characteristics - AC Specifications
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9
GSPS, 12x Interpolation, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted.
PARAMETER
TEST CONDITIONS
DAC38RF83/93/85
MIN
TYP
MAX
DAC38RF80/90/84
MIN
TYP
MAX
UNIT
ANALOG OUTPUT
fDAC
Maximum DAC sample rate
9
9
GSPS
AC PERFORMANCE - CW
SFDR
SFDR
SFDR
HD2
HD3
18
Spurious Free Dynamic
Range 0 – fDAC/2
Spurious Free Dynamic
Range within 500 MHz fOUT ±
250 MHz
Spurious Free Dynamic
Range excluding HD2, HD3
and CMP2 0 – fDAC/2
2nd Order Harmonic
3rd Order Harmonic
fCLK = 6 GHz , fOUT = 501 MHz
63
70
fCLK = 6 GHz , fOUT = 951 MHz
62
67
fCLK = 6 GHz , fOUT = 1851 MHz
58
59
fCLK = 6 GHz , fOUT = 2651 MHz
57
57
fCLK = 9 GHz , fOUT = 501 MHz
62
64
fCLK = 9 GHz , fOUT = 951 MHz
61
65
fCLK = 9 GHz , fOUT = 1851 MHz
61
62
fCLK = 9 GHz , fOUT = 2651 MHz
54
50
fCLK = 9 GHz , fOUT = 3651 MHz
51
51
fCLK = 6 GHz , fOUT = 501 MHz
97
94
fCLK = 6 GHz , fOUT = 951 MHz
93
88
fCLK = 6 GHz , fOUT = 1851 MHz
88
87
fCLK = 6 GHz , fOUT = 2651 MHz
77
78
fCLK = 9 GHz , fOUT = 501 MHz
94
92
fCLK = 9 GHz , fOUT = 951 MHz
90
88
fCLK = 9 GHz , fOUT = 1851 MHz
85
85
fCLK = 9 GHz , fOUT = 2651 MHz
82
82
fCLK = 9 GHz , fOUT = 3651 MHz
79
78
fCLK = 6 GHz , fOUT = 501 MHz
72
72
fCLK = 6 GHz , fOUT = 951 MHz
71
75
fCLK = 6 GHz , fOUT = 1851 MHz
74
75
fCLK = 6 GHz , fOUT = 2651 MHz
71
71
fCLK = 9 GHz , fOUT = 501 MHz
69
63
fCLK = 9 GHz , fOUT = 951 MHz
69
66
fCLK = 9 GHz , fOUT = 1851 MHz
72
65
fCLK = 9 GHz , fOUT = 2651 MHz
71
64
fCLK = 9 GHz , fOUT = 3651 MHz
67
62
fCLK = 6 GHz , fOUT = 501 MHz
72
71
fCLK = 6 GHz , fOUT = 951 MHz
65
68
fCLK = 6 GHz , fOUT = 1851 MHz
57
59
fCLK = 6 GHz , fOUT = 2651 MHz
57
57
fCLK = 9 GHz , fOUT = 501 MHz
71
71
fCLK = 9 GHz , fOUT = 951 MHz
65
67
fCLK = 9 GHz , fOUT = 1851 MHz
62
62
fCLK = 9 GHz , fOUT = 2651 MHz
54
49
fCLK = 9 GHz , fOUT = 3651 MHz
51
51
fCLK = 6 GHz , fOUT = 501 MHz
63
75
fCLK = 6 GHz , fOUT = 951 MHz
62
72
fCLK = 6 GHz , fOUT = 1851 MHz
71
72
fCLK = 6 GHz , fOUT = 2651 MHz
69
70
fCLK = 9 GHz , fOUT = 501 MHz
62
74
fCLK = 9 GHz , fOUT = 951 MHz
61
73
fCLK = 9 GHz , fOUT = 1851 MHz
66
72
fCLK = 9 GHz , fOUT = 2651 MHz
65
69
fCLK = 9 GHz , fOUT = 3651 MHz
67
69
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dBc
dBc
dBc
dBc
dBc
Copyright © 2016–2017, Texas Instruments Incorporated
DAC38RF83 DAC38RF93
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Electrical Characteristics - AC Specifications (continued)
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9
GSPS, 12x Interpolation, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted.
PARAMETER
CMP2
CMP4+
IMD3
NSD
Fs/2 clock mixing product
(Fs/2 – fOUT)
Fs/N (N = 4, 8, 16) clock
mixing product (fOUT ± Fs/N)
Third-order two-tone
intermodulation distortion
Noise Spectral Density > 50
MHz offset
TEST CONDITIONS
DAC38RF83/93/85
MIN
TYP
MAX
DAC38RF80/90/84
MIN
TYP
fCLK = 6 GHz , fOUT = 501 MHz
85
79
fCLK = 6 GHz , fOUT = 951 MHz
85
80
fCLK = 6 GHz , fOUT = 1851 MHz
82
76
fCLK = 6 GHz , fOUT = 2651 MHz
79
76
fCLK = 9 GHz , fOUT = 501 MHz
78
70
fCLK = 9 GHz , fOUT = 951 MHz
76
67
fCLK = 9 GHz , fOUT = 1851 MHz
73
67
fCLK = 9 GHz , fOUT = 2651 MHz
74
63
fCLK = 9 GHz , fOUT = 3651 MHz
68
59
fCLK = 6 GHz , fOUT = 501 MHz
92
90
fCLK = 6 GHz , fOUT = 951 MHz
87
87
fCLK = 6 GHz , fOUT = 1851 MHz
81
83
fCLK = 6 GHz , fOUT = 2651 MHz
78
76
fCLK = 9 GHz , fOUT = 501 MHz
95
91
fCLK = 9 GHz , fOUT = 951 MHz
89
88
fCLK = 9 GHz , fOUT = 1851 MHz
84
85
fCLK = 9 GHz , fOUT = 2651 MHz
79
81
fCLK = 9 GHz , fOUT = 3651 MHz
74
74
fCLK = 6 GHz , fOUT = 501 ± 5 MHz, –6
dBFS each tone
80
83
fCLK = 6 GHz , fOUT = 951 ± 5 MHz, –6
dBFS each tone
76
79
fCLK = 6 GHz , fOUT = 1851 ± 5 MHz, –6
dBFS each tone
73
76
fCLK = 6 GHz , fOUT = 2651 ± 5 MHz, –6
dBFS each tone
72
75
fCLK = 9 GHz , fOUT = 501 ± 5 MHz, –6
dBFS each tone
80
84
fCLK = 9 GHz , fOUT = 951 ± 5 MHz, –6
dBFS each tone
75
80
fCLK = 9 GHz , fOUT = 1851 ± 5 MHz, –6
dBFS each tone
70
74
fCLK = 9 GHz , fOUT = 2651 ± 5 MHz, –6
dBFS each tone
70
73
fCLK = 9 GHz , fOUT = 3651 ± 5 MHz, –6
dBFS each tone
68
71
fCLK = 6 GHz , fOUT = 501 MHz
–170
–169
fCLK = 6 GHz , fOUT = 951 MHz
–163
–163
fCLK = 6 GHz , fOUT = 1851 MHz
–157
–155
fCLK = 6 GHz , fOUT = 2651 MHz
–155
–154
fCLK = 9 GHz , fOUT = 501 MHz
–172
–171
fCLK = 9 GHz , fOUT = 951 MHz
–166
–167
fCLK = 9 GHz , fOUT = 1851 MHz
–157
–156
fCLK = 9 GHz , fOUT = 2651 MHz
–156
–155
fCLK = 9 GHz , fOUT = 3651 MHz
–153
–153
fCLK = 6 GHz , fOUT = 501 MHz, –9 dBFS
–163
–160
fCLK = 6 GHz , fOUT = 951 MHz, –9 dBFS
–155
–154
fCLK = 6 GHz , fOUT = 1851 MHz, –9 dBFS
–149
–150
fCLK = 9 GHz , fOUT = 2651 MHz, –9 dBFS
–153
–153
fCLK = 9 GHz , fOUT = 3651 MHz, –9 dBFS
–150
–150
MAX
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DAC38RF83 DAC38RF93
UNIT
dBc
dBc
dBc
dBFS/
Hz
19
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
Electrical Characteristics - AC Specifications (continued)
Typical values at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 85°C, external differential clock mode at 9
GSPS, 12x Interpolation, fOUT = 2.14 GHz, I(OUTFS) = 40 mA, nominal supplies, LMFSHd = 84111, unless otherwise noted.
PARAMETER
Isolation
Isolation between DAC A and
DAC B analog output
TEST CONDITIONS
DAC38RF83/93/85
MIN
TYP
MAX
DAC38RF80/90/84
MIN
TYP
< 2 GHz
74
55
>2 GHz to 4 GHz
56
54
fCLK = 5898.24 MHz , fOUT = 950 MHz
76
78
fCLK = 5898.24 MHz, fOUT = 2140 MHz
75
73
fCLK = 8847.36 MHz , fOUT = 950 MHz
76
77
fCLK = 8847.36 MHz, fOUT = 2140 MHz
73
73
fCLK = 5898.24 MHz , fOUT = 950 MHz
82
83
fCLK = 5898.24 MHz, fOUT = 2140 MHz
77
77
fCLK = 8847.36 MHz , fOUT = 950 MHz
82
82
fCLK = 8847.36 MHz, fOUT = 2140 MHz
77
78
fCLK = 5898.24 MHz , fOUT = 800 MHz
73
74
fCLK = 5898.24 MHz, fOUT = 2650 MHz
70
68
fCLK = 8847.36 MHz , fOUT = 800 MHz
73
74
fCLK = 8847.36 MHz, fOUT = 2650 MHz
69
68
fCLK = 8847.36 MHz, fOUT = 3700 MHz
63
66
MAX
UNIT
dBc
AC PERFORMANCE – Modulated Signals
ACPR
AltACLR
LTE20
20
WCDMA 1 carrier adjacent
channel power ratio
WCDMA 1 carrier alternate
channel ACPR
20 MHz LTE adjacent
channel power ratio
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dBc
dBc
dBc
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DAC38RF83 DAC38RF93
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
7.8 Timing Requirements
MIN
NOM
MAX
UNIT
DIGITAL INPUT TIMING SPECIFICATIONS
TIMING: SYSREF+/ts(SYSREF)
Setup time, SYSREF+/- valid to rising
edge of DACCLK+/-
SYSREF Capture assist disabled
50
ps
th(SYSREF)
Hold time, SYSREF+/- valid after rising
edge of DACCLK+/-
SYSREF Capture assist disabled
50
ps
TIMING: SERIAL PORT
ts(/SDEN)
Setup time, SDEN to rising edge of SCLK
20
ns
ts(SDIO)
Setup time, SDIO valid to rising edge of SCLK
10
ns
th(SDIO)
Hold time, SDIO valid after rising edge of SCLK
5
ns
t(SCLK)
Period of SCLK
td(Data)
tRESET
temperature sensor read
1
µs
100
ns
Data output delay after falling edge of SCLK
25
ns
Minimum RESET pulse width
25
ns
All other registers
ANALOG OUTPUT
ts(DAC)
Output settling time to 0.1%
1
ns
tr
Output rise time 10% to 90%
50
ns
tf
Output fall time 90% to 10%
50
ns
250
ps
LATENCY
RX SerDes AnalogDelay
DAC wake-up time
IOUT current settling to 1% of IOUTFS
from deep sleep
90
µs
DAC sleep time
IOUT current settling to less than 1% of
IOUTFS in deep sleep
90
µs
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21
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
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7.9 Typical Characteristics
Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 8847.36MSPS, 12x interpolation, 0dBFS
digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is
disabled.
170
170
-12dBFS
-9dBFS
-6dBFS
0dBFS
165
160
165
160
155
NSD (dBc/Hz)
NSD (dBc/Hz)
155
150
145
140
150
145
140
135
135
130
130
125
125
120
500
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
Measured 50 MHz from carrier
4000
120
500
4500
-12dBFS
-9dBFS
-6dBFS
0dBFS
1000
1500
D005
DAC38RF83/93/85
measured 50 MHz
from carrier
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D020
DAC38RF80/90/84
Figure 1. NSD vs Output Frequency Over Input Scale
170
165
165
160
160
155
155
NSD (dBc/Hz)
NSD (dBc/Hz)
Figure 2. NSD vs Output Frequency Over Input Scale
170
150
145
140
Iout=40mA
Iout=30mA
Iout=20mA
Iout=10mA
135
130
125
120
500
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
Measured 50 MHz from carrier
4000
145
140
Iout=40mA
Iout=30mA
Iout=20mA
Iout=10mA
135
130
125
4500
120
500
1000
D011
DAC38RF83/93/85
Figure 3. NSD vs Output Frequency Over Output Current
IoutFS
22
150
measured 50 MHz
from carrier
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D025
DAC38RF80/90/84
Figure 4. NSD vs Output Frequency Over Output Current
IoutFS
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DAC38RF83 DAC38RF93
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Typical Characteristics (continued)
Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 8847.36MSPS, 12x interpolation, 0dBFS
digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is
disabled.
170
170
On-chip PLL
External clock
160
160
155
155
150
145
140
150
145
140
135
135
130
130
125
125
120
500
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
Measured 50 MHz from carrier
4000
On-chip PLL
External clock
165
NSD (dBc/Hz)
NSD (dBc/Hz)
165
120
500
4500
1000
1500
D015
DAC38RF83/93/85
measured 50 MHz
from carrier
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D029
DAC38RF80/90/84
Figure 5. NSD vs Output Frequency Over Clocking Option
Figure 6. NSD vs Output Frequency Over Clocking Option
80
80
-12dBFS
-6dBFS
0dBFS
75
70
70
65
HD2 (dBc)
HD2 (dBc)
65
60
55
60
55
50
50
45
45
40
40
35
500
-12dBFS
-6dBFS
0dBFS
75
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
35
500
4500
1000
1500
D002
DAC38RF83/93/85
Figure 7. HD2 vs Output Frequency Over Input Scale
4500
D018
Figure 8. HD2 vs Output Frequency Over Input Scale
80
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
75
70
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
75
70
65
HD2 (dBc)
65
HD2 (dBc)
4000
DAC38RF80/90/84
80
60
55
60
55
50
50
45
45
40
40
35
500
2000 2500 3000 3500
Output Frequency (MHz)
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
35
500
D010
DAC38RF83/93/85
Figure 9. HD2 vs Output Frequency Over Output Current
IoutFS
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D023
D008
DAC38RF80/90/84
Figure 10. HD2 vs Output Frequency Over Output Current
IoutFS
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DAC38RF83 DAC38RF93
23
DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
Typical Characteristics (continued)
Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 8847.36MSPS, 12x interpolation, 0dBFS
digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is
disabled.
80
80
On-chip PLL
External clock
70
70
65
65
60
55
55
50
45
45
40
40
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
35
500
4500
1000
1500
D013
4500
D027
Figure 11. HD2 vs Output Frequency Over Clocking Option
Figure 12. HD2 vs Output Frequency Over Clocking Option
70
HD3 (dBc)
65
60
55
50
-12dBFS
-6dBFS
0dBFS
45
40
35
500
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
-12dBFS
-6dBFS
0dBFS
1000
1500
D004
DAC38RF83/93/85
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
4000
4500
D013
Figure 14. HD3 vs Output Frequency Over Input Scale
HD3 (dBc)
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
2000 2500 3000 3500
Output Frequency (MHz)
DAC38RF80/90/84
Figure 13. HD3 vs Output Frequency Over Input Scale
HD3 (dBc)
4000
DAC38RF80/90/84
75
24
2000 2500 3000 3500
Output Frequency (MHz)
DAC38RF83/93/85
80
HD3 (dBc)
60
50
35
500
On-chip PLL
External clock
75
HD2 (dBc)
HD2 (dBc)
75
105
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
D024
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D014
DAC38RF83/93/85
DAC38RF80/90/84
Figure 15. HD3 vs Output Frequency Over Output Current
IoutFS
Figure 16. HD3 vs Output Frequency Over Output Current
IoutFS
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DAC38RF80, DAC38RF83, DAC38RF84
DAC38RF85, DAC38RF90, DAC38RF93
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Typical Characteristics (continued)
80
80
75
75
70
70
65
65
HD3 (dBc)
HD3 (dBc)
Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 8847.36MSPS, 12x interpolation, 0dBFS
digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is
disabled.
60
55
45
45
On-chip PLL
External clock
40
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
On-chip PLL
External clock
40
35
500
4500
1000
1500
D014
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D015
DAC38RF83/93/85
DAC38RF80/90/84
Figure 17. HD3 vs Output Frequency Over Clocking Option
Figure 18. HD3 vs Output Frequency Over Clocking Option
80
80
75
75
70
70
65
65
SFDR (dBc)
SFDR (dBc)
55
50
50
35
500
60
60
55
50
60
55
50
-12dBFS
-6dBFS
0dBFS
45
40
35
500
-12dBFS
-6dBFS
0dBFS
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
Excludes HD2, HD3 and CMP2
45
40
4000
35
500
4500
1000
1500
D032
D001
DAC38RF83/93/85
Excludes HD2, HD3
and CMP2
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D032
D001
DAC38RF80/90/84
Figure 19. SFDR vs Output Frequency Over Input Scale
80
75
75
70
70
65
65
SFDR (dBc)
SFDR (dBc)
Figure 20. SFDR vs Output Frequency Over Input Scale
80
60
55
50
40
35
500
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
Excludes HD2, HD3 and CMP2
4000
60
55
50
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
45
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
45
40
4500
35
500
1000
D022
DAC38RF83/93/85
Figure 21. SFDR vs Output Frequency Over Output Current
IoutFS
Excludes HD2, HD3
and CMP2
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D022
DAC38RF80/90/84
Figure 22. SFDR vs Output Frequency Over Output Current
IoutFS
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Typical Characteristics (continued)
80
80
75
75
70
70
65
65
SFDR (dBc)
SFDR (dBc)
Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 8847.36MSPS, 12x interpolation, 0dBFS
digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is
disabled.
60
55
60
55
50
50
On-chip PLL
External clock
45
45
40
35
500
On-chip PLL
External clock
40
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
Excludes HD2, HD3 and CMP2
4000
35
500
4500
1000
1500
D026
DAC38RF83/93/85
2000 2500 3000 3500
Output Frequency (MHz)
Excludes HD2, HD3
and CMP2
4000
4500
D026
DAC38RF80/90/84
Figure 23. SFDR vs Output Frequency Over Clocking Option
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
SFDR (dBc)
SFDR (dBc)
Figure 24. SFDR vs Output Frequency Over Clocking Option
-12dBFS
-6dBFS
0dBFS
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
±250 MHz Span
4000
4500
DAC38RF83/93/85
1500
2000 2500 3000 3500
Output Frequency (MHz)
SFDR (dBc)
± 250 MHz Span
4000
4500
1500
DAC38RF83/93/85
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D032
DAC38RF80/90/84
Figure 26. SFDR vs Output Frequency Over Input Scale
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
1000
1500
D008
Figure 27. SFDR vs Output Frequency Over Output Current
IoutFS
26
1000
+/- 250MHz Span
SFDR (dBc)
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
1000
-12dBFS
-6dBFS
0dBFS
D032
Figure 25. SFDR vs Output Frequency Over Input Scale
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
± 250 MHz Span
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D008
DAC38RF80/90/84
Figure 28. SFDR vs Output Frequency Over Output Current
IoutFS
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Typical Characteristics (continued)
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
100
95
90
85
80
75
70
65
60
55
50
45
40
35
500
On-chip PLL
External clock
SFDR (dBc)
SFDR (dBc)
Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 8847.36MSPS, 12x interpolation, 0dBFS
digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is
disabled.
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
± 250 MHz Span
4000
4500
On-chip PLL
External clock
1000
1500
D026
DAC38RF83/93/85
2000 2500 3000 3500
Output Frequency (MHz)
+/- 250MHz Span
Figure 29. SFDR vs Output Frequency Over Clocking Option
4000
4500
D026
DAC38RF80/90/84
Figure 30. SFDR vs Output Frequency Over Clocking Option
80
90
75
85
80
70
75
IMD3 (dBc)
IMD3 (dBc)
65
60
55
50
45
40
35
500
-18dBFS
-12dBFS
-6dBFS
0dBFS
65
60
55
-18dBFS
-12dBFS
-6dBFS
0dBFS
50
45
40
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
±250 MHz Span
4000
35
500
4500
1000
D006
1500
2000 2500 3000 3500
Output Frequency (MHz)
DAC38RF83/93/85
4000
4500
D006
DAC38RF80/90/84
Figure 31. IMD3 vs Output Frequency Over Input Scale
Figure 32. IMD3 vs Output Frequency Over Input Scale
85
80
80
75
75
70
70
65
HD3 (dBc)
IMD3 (dBc)
70
65
60
55
45
40
500
1000
1500
55
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
50
Iout=10mA
Iout=20mA
Iout=30mA
Iout=40mA
50
60
45
40
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
35
500
D009
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
4500
D007
DAC38RF83/93/85
DAC38RF80/90/84
Figure 33. IMD3 vs Output Frequency Over Output Current
IoutFS
Figure 34. IMD3 vs Output Frequency Over Output Current
IoutFS
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Typical Characteristics (continued)
Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 8847.36MSPS, 12x interpolation, 0dBFS
digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is
disabled.
80
80
On-chip PLL
External clock
70
70
65
65
60
55
60
55
50
50
45
45
40
40
35
500
1000
1500
2000 2500 3000 3500
Output Frequency (MHz)
4000
On-chip PLL
External clock
75
IMD3 (dBc)
IMD3 (dBc)
75
35
500
4500
1000
D016
DAC38RF83/93/85
500
1000 1500 2000 2500 3000 3500 4000 4500
Output Frequency (MHz)
D000
Transformer loss not de-embedded
4000
4500
D030
Figure 36. IMD3 vs Output Frequency Over Clocking Option
Output Power (dBm)
Output Power (dBm)
0
2000 2500 3000 3500
Output Frequency (MHz)
DAC38RF80/90/84
Figure 35. IMD3 vs Output Frequency Over Clocking Option
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
1500
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
0
DAC38RF83/93/85
500
1000 1500 2000 2500 3000 3500 4000 4500
Output Frequency (MHz)
D017
DAC38RF80/90/84
Figure 37. Power vs Output Frequency
Figure 38. Power vs Output Frequency
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Typical Characteristics (continued)
Unless otherwise noted, all plots are at TA = 25°C, nominal supply voltages, fDAC = 8847.36MSPS, 12x interpolation, 0dBFS
digital input, 40 mA full scale output current (with 2:1 transformer in DAC38RF83/93/85 only), LMFSHd = 84111 and PLL is
disabled.
-60
-90
CP=2
CP=3
CP=4
CP=5
CP=6
CP=7
CP=8
CP=9
CP=10
CP=11
CP=12
CP=13
CP=14
CP=15
-100
-120
-100
-110
Phase Noise (dBc)
Phase Noise (dBc)
-80
div4
div3
div2
-120
-130
-140
-140
-150
-160
1000
10000
100000
1000000
Freq offset (Hz)
VCO frequency = 8847.36MHz
1E+7
-160
1000
5E+7
Measured at 1 GHz
100000
1000000
Freq offset (Hz)
1E+7
5E+7
D028
VCO frequency = 8847.36MHz
Figure 39. VCO1 Phase Noise vs Offset Frequency Over
Charge pump current
Figure 40. VCO1 Output Clock Phase Noise vs Offset
frequency Over Divider Ratio
-100
-80
CP=1
CP=2
CP=3
CP=4
CP=5
CP=6
CP=7
CP=8
CP=9
CP=10
CP=11
CP=12
CP=13
CP=14
CP=15
-120
div4
div3
div2
-110
Phase Noise (dBc)
-100
Phase Noise (dBc)
10000
D027
-120
-130
-140
-140
-150
-160
1000
10000
100000
1000000
Freq offset (Hz)
VCO frequency = 5898.24 MHz
1E+7
5E+7
-160
1000
D029
measured at 1GHz
Figure 41. VCO0 Phase Noise vs Offset Frequency Over
Charge Pump Current
10000
100000
1000000
Freq offset (Hz)
1E+7
5E+7
D030
VCO frequency = 5898.24 MHz
Figure 42. VCO0 Output clock Phase Noise vs Offset
Frequency Over Divider Ratio
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8 Detailed Description
8.1 Overview
The DAC38RFxx are a family of high performance 14-bit, 9 GSPS interpolating digital-to-analog converter
(DACs), capable of synthesizing wideband signals from 0 to 4 GHz in 1st Nyquist zone and up to 6 GHz in 2nd
Nyquist zone. A high dynamic range allows the DAC38RFxx to generate 2G/3G/4G signals for wireless
basestations for all 3GPP bands, including simultaneous generation of multiple bands.
The devices have a low power 8 lane JESD204B Interface, with a maximum bit rate of 12.5 Gbps. The full output
rate is achieved by use of the interpolation filters, after which the signal can be upconverted to RF using a digital
NCO and digital quadrature modulator. Two signals can be tuned to different frequencies and digitally combined,
allowing wide output spectrums. An optional low jitter PLL/VCO simplifies the DAC clock generation by allowing
use of a lower frequency reference clock.
DACCLK+
Low Jitter
PLL
DACCLKDACCLKSE
VDDL2_1
VDDL1_1
VDDA1
VDDDIG1
VDDAVCO18
VDDAPLL1
VDDAPLL18
VDDCLK1
8.2 Functional Block Diagrams
CLKTX+
Divider
/2, /3, /4
Clock
Distribution
CLKTXVDDTX1
Multi-band DUC Channel 2 (multi-DUC2)
SYSREF+
SYSREF-
I
RX[4..7]+
Q
JESD Interface
SYNC2\+
SYNC2\VDDT1
VDDR18
RX[0..3]+
VOUT2
14-b
DAC
x
sin(x)
I
RX[4..7]-
VDDTX18
DACB
Gain
NCO 4
VDDOUT18
Q
NCO 3
0.9 V
Ref
NCO 1
EXTIO
RBIAS
TESTMODE
I
Q
RX[0..3]-
I
SYNC1\+
Q
VEE18N
DACA
Gain
NCO 2
SYNC1\-
VOUT1
14-b
DAC
x
sin(x)
VDDA18
Multi-band DUC Channel 1 (multi-DUC1)
VDDS18
ATEST
AMUX0/1
Temp
Sensor
TRST\
TMS
TCLK
GPI1
GPI0
GPO1
GPO0
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
VDDIO18
GND
JTAG
TDI
Control Interface
VSENSE
TDO
IFORCE
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Figure 43. DAC38RF80 Block Diagram
30
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DACCLK+
Low Jitter
PLL
DACCLKDACCLKSE
VDDL2_1
VDDL1_1
VDDA1
VDDDIG1
VDDAVCO18
VDDAPLL1
VDDAPLL18
VDDCLK1
Functional Block Diagrams (continued)
CLKTX+
Divider
/2, /3, /4
Clock
Distribution
CLKTXVDDTX1
Multi-band DUC Channel 2 (multi-DUC2)
SYSREF+
SYSREF-
I
RX[4..7]+
Q
JESD Interface
SYNC2\+
SYNC2\VDDT1
VDDR18
RX[0..3]+
14-b
DAC
x
sin(x)
I
RX[4..7]-
VDDTX18
DACB
Gain
NCO 3
100:
VOUT2+
VOUT2-
Q
NCO 4
0.9 V
Ref
NCO 1
EXTIO
RBIAS
TESTMODE
I
Q
RX[0..3]-
I
SYNC1\+
Q
14-b
DAC
x
sin(x)
VDDA18
Multi-band DUC Channel 1 (multi-DUC1)
VDDS18
VOUT1+
VOUT1VEE18N
DACA
Gain
NCO 2
SYNC1\-
100:
ATEST
AMUX0/1
Temp
Sensor
TRST\
TMS
JTAG
TDI
GPI1
GPI0
GPO1
GPO0
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
VDDIO18
GND
VSENSE
TCLK
Control Interface
TDO
IFORCE
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Figure 44. DAC38RF83 Block Diagram
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DACCLK+
Low Jitter
PLL
DACCLKDACCLKSE
VDDL2_1
VDDL1_1
VDDA1
VDDDIG1
VDDAVCO18
VDDAPLL1
VDDAPLL18
VDDCLK1
Functional Block Diagrams (continued)
CLKTX+
Divider
/2, /3, /4
Clock
Distribution
CLKTXVDDTX1
Single-band DUC Channel
VDDTX18
SYSREF+
SYSREFI
RX[4..7]+
Q
SYNC2\+
SYNC2\VDDT1
VDDR18
VDDOUT18
NCO 2
JESD Interface
RX[4..7]-
0.9 V
Ref
EXTIO
RBIAS
TESTMODE
RX[0..3]+
I
RX[0..3]-
Q
VOUT1
14-b
DAC
x
sin(x)
NCO 1
SYNC1\+
VEE18N
DACA
Gain
SYNC1\-
VDDA18
VDDS18
ATEST
AMUX0/1
Temp
Sensor
TRST\
TMS
TCLK
GPI1
GPI0
GPO1
GPO0
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
VDDIO18
GND
JTAG
TDI
Control Interface
VSENSE
TDO
IFORCE
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Figure 45. DAC38RF84 Block Diagram
32
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DACCLK+
Low Jitter
PLL
DACCLKDACCLKSE
VDDL2_1
VDDL1_1
VDDA1
VDDDIG1
VDDAVCO18
VDDAPLL1
VDDAPLL18
VDDCLK1
Functional Block Diagrams (continued)
CLKTX+
Divider
/2, /3, /4
Clock
Distribution
CLKTXVDDTX1
Single-band DUC Channel
VDDTX18
SYSREF+
SYSREFI
RX[4..7]+
Q
SYNC2\+
SYNC2\VDDT1
VDDR18
VDDOUT18
NCO 2
JESD Interface
RX[4..7]-
0.9 V
Ref
RX[0..3]+
I
RX[0..3]-
Q
14-b
DAC
x
sin(x)
100:
EXTIO
RBIAS
TESTMODE
VOUT1+
VOUT1-
NCO 1
SYNC1\+
VEE18N
DACA
Gain
SYNC1\-
VDDA18
VDDS18
ATEST
AMUX0/1
Temp
Sensor
TRST\
TMS
TDI
GPI1
GPI0
GPO1
GPO0
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
VDDIO18
GND
JTAG
TCLK
Control Interface
VSENSE
TDO
IFORCE
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Figure 46. DAC38RF85 Block Diagram
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DACCLK+
Low Jitter
PLL
DACCLKDACCLKSE
VDDL2_1
VDDL1_1
VDDA1
VDDDIG1
VDDAVCO18
VDDAPLL1
VDDAPLL18
VDDCLK1
Functional Block Diagrams (continued)
CLKTX+
Divider
/2, /3, /4
Clock
Distribution
CLKTXVDDTX1
Single-band DUC Channel 2
VDDTX18
DACB
Gain
SYSREF+
SYSREFI
RX[4..7]+
VOUT2
14-b
DAC
x
sin(x)
Q
SYNC2\+
SYNC2\VDDT1
VDDR18
VDDOUT18
NCO 2
JESD Interface
RX[4..7]-
0.9 V
Ref
Single-band DUC Channel 1
RX[0..3]+
I
RX[0..3]-
Q
VOUT1
14-b
DAC
x
sin(x)
EXTIO
RBIAS
TESTMODE
NCO 1
SYNC1\+
VEE18N
DACA
Gain
SYNC1\-
VDDA18
VDDS18
ATEST
AMUX0/1
Temp
Sensor
TRST\
TMS
TCLK
GPI1
GPI0
GPO1
GPO0
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
VDDIO18
GND
JTAG
TDI
Control Interface
VSENSE
TDO
IFORCE
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Figure 47. DAC38RF90 Block Diagram
34
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DACCLK+
Low Jitter
PLL
DACCLKDACCLKSE
VDDL2_1
VDDL1_1
VDDA1
VDDDIG1
VDDAVCO18
VDDAPLL1
VDDAPLL18
VDDCLK1
Functional Block Diagrams (continued)
CLKTX+
Divider
/2, /3, /4
Clock
Distribution
CLKTXVDDTX1
Single-band DUC Channel 2
VDDTX18
DACB
Gain
SYSREF+
SYSREFI
RX[4..7]+
14-b
DAC
x
sin(x)
100:
Q
SYNC2\+
SYNC2\VDDT1
VDDR18
0.9 V
Ref
RX[0..3]+
I
RX[0..3]-
Q
VOUT2VDDOUT18
NCO 2
JESD Interface
RX[4..7]-
VOUT2+
14-b
DAC
x
sin(x)
100:
EXTIO
RBIAS
TESTMODE
VOUT1+
VOUT1-
NCO 1
SYNC1\+
VEE18N
DACA
Gain
SYNC1\-
VDDA18
Single-band DUC Channel 1
VDDS18
ATEST
AMUX0/1
Temp
Sensor
TRST\
TMS
TDI
GPI1
GPI0
GPO1
GPO0
TESTMODE
ALARM
SLEEP
RESETB
TXENABLE
SCLK
SDENB
SDIO
SDO
VDDIO18
GND
JTAG
TCLK
Control Interface
VSENSE
TDO
IFORCE
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Figure 48. DAC38RF93 Block Diagram
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8.3 Feature Description
8.3.1 Serdes Inputs
The DAC38RFxx RX [0..7]+/- differential inputs are each internally terminated to a common point via 50 Ω, as
shown in Figure 49.
Figure 49. Serial Lane Input Termination
Common mode termination is via a 50 pF capacitor to GND. The common mode voltage and termination of the
differential signal can be controlled in a number of ways to suit a variety of applications via field TERM in register
SRDS_CFG2 (8.5.87), as described in Table 1.
NOTE
AC coupling is recommended for JESD204B compliance.
Table 1. Receiver Termination Selection
TERM
EFFECT
000
Reserved
001
Common point set to 0.7 V. This configuration is for AC coupled systems. The transmitter has no effect on the
receiver common mode, which is set to optimize the input sensitivity of the receiver. Note: this mode is not
compatible with JESD204B.
01x
Reserved
100
Common point set to GND. This configuration is for applications that require a 0 V common mode.
101
Common point set to 0.25 V. This configuration is for applications that require a low common mode.
110
Reserved
111
Common point floating. This configuration is for DC coupled systems in which the common mode voltage is set by
the attached transmit link partner to 0 and 0.6 V. Note: this mode is not compatible with JESD204B
Input data is sampled by the differential sensing amplifier using clocks derived from the clock recovery algorithm.
The polarity of RX+ and RX- can be inverted by setting the bit of the corresponding lane in field INVPAIR in
register SRDS_POL (8.5.88) to “1”. This can potentially simplify PCB layout and improve signal integrity by
avoiding the need to swap over the differential signal traces.
Due to processing effects, the devices in the RX+ and RX- differential sense amplifiers will not be perfectly
matched and there will be some offset in switching threshold. The DAC38RFxx contains circuitry to detect and
correct for this offset. This feature can be enabled by setting ENOC in register SRDS_CFG1 (8.5.86) to “1”. It is
anticipated the most users will enable this feature. During the compensation process, LOOPBACK in register
SRDS_CFG1 (8.5.86) must be set to “00”.
36
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8.3.2 Serdes Rate
The DAC38RFxx has eight configurable JESD204B serial lanes. The highest speed of each SerDes lane is 12.5
Gbps. Because the primary operating frequency of the SerDes is determined by its reference clock and PLL
multiplication factor, there is a limit on the lowest SerDes rate supported. To support lower speed application,
each receiver should be configured to operate at half, quarter or eighth of the full rate via field RATE in register
SRDS_CFG2 (8.5.87). Refer to Table 2 for details.
Table 2. Lane Rate Selection
RATE
EFFECT
00
Full rate. Four data samples taken per SerDes PLL output clock cycle.
01
Half rate. Two data samples taken per SerDes PLL output clock cycle.
10
Quarter rate. One data samples taken per SerDes PLL output clock cycle.
11
Eighth rate. One data samples taken every two SerDes PLL output clock cycles.
8.3.3 Serdes PLL
The DAC38RFxx has two integrated PLLs, one PLL is to provide the clocking of DAC; the other PLL is to provide
the clocking for the high speed SerDes. The reference frequency of the SerDes PLL can be in the range of 100800 MHz nominal, and 300-800 MHz optimal. The reference frequency is derived from DACCLK divided down by
the value in field SERDES_REFCLK_DIV in register SRDS_CLK_CFG (8.5.84), as shown in Figure 50. Field
SERDES_CLK_SEL in register SRDS_CLK_CFG (8.5.84) determines if the DACCLK input or DAC PLL output is
used as the source of the Serdes PLL reference. If the DACCLK input is used, a pre-divider set by field
SERDES_REFCLK_PREDIV in register SRDS_CLK_CFG (8.5.84) should be used to reduce the frequency of
the DACCLK.
SERDES_REFCLK_PREDIV
0
Predivider
DACCLK+
divider
0
SERDES
PLL
REFCLK
DACCLKDAC PLL
DACCLKSE
1
1
SERDES_REFCLK_DIV
SERDES_REFCLK_SEL
SEL_EXTCLK_DIFFSE
Figure 50. Reference Clock of SerDes PLL
During normal operation, the clock generated by PLL is 4-25 times the reference frequency, according to the
multiply factor selected via the field MPY] in register SRDS_PLL_CFG (8.5.85). In order to select the appropriate
multiply factor and reference clock frequency, it is first necessary to determine the required PLL output clock
frequency. The relationship between the PLL output clock frequency and the lane rate is determined by field
RATE in register SRDS_CFG2 (8.5.87) is shown in Table 3. Having computed the PLL output frequency, the
reference frequency can be obtained by dividing this by the multiply factor specified via MPY.
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Table 3.
RATE
LINE RATE
PLL OUTPUT FREQUENCY
00
x Gbps
0.25x GHz
01
x Gbps
0.5x GHz
10
x Gbps
1x GHz
11
x Gbps
2x GHz
Table 4. SerDes PLL Modes Selection
MPY
EFFECT
00010000
4x
00010100
5x
00011000
6x
00100000
8x
00100001
8.25x
00101000
10x
00110000
12x
00110010
12.5x
01000000
15x
01000010
16x
01010000
20x
01011000
22x
01100100
25x
Other codes
Reserved
The wide range of multiply factors combined with the different rate modes means it is often possible to achieve a
given line rate from multiple different reference frequencies. The configuration which utilizes the highest
reference frequency achievable is always preferable.
The SerDes PLL VCO must be in the nominal range of 1.5625 - 3.125 GHz. It is necessary to adjust the loop
filter depending on the operating frequency of the VCO. If the PLL output frequency is below 2.17 GHz, VRANGE
in register SRDS_PLL_CFG (8.5.84) should be set high.
Performance of the integrated PLL can be optimized according to the jitter characteristics of the reference clock
by setting the appropriate loop bandwidth via field LB in register SRDS_PLL_CFG (8.5.84). The loop bandwidth
is obtained by dividing the reference frequency by BWSCALE, where the BWSCALE is a function of both LB and
PLL output frequency as shown in Table 5.
Table 5. SerDes PLL Loop Bandwidth Selection
LB
EFFECT
BWSCALE vs PLL OUTPUT FREQUENCY
3.125 GHz
2.17 GHz
1.5625 GHz
13
14
16
00
Medium loop bandwidth
01
Ultra high loop bandwidth
7
8
8
10
Low loop bandwidth
21
23
30
11
High loop bandwidth
10
11
14
An approximate loop bandwidth of 8 – 30 MHz is suitable and recommended for most systems where the
reference clock is via low jitter clock input buffer. For systems where the reference clock is via a low jitter input
cell, but of low quality, an approximate loop bandwidth of less than 8 MHz may offer better performance. For
systems where the reference clock is cleaned via an ultra-low jitter LC-based cleaner PLL, a high loop bandwidth
up to 60 MHz is more appropriate. Note that the use of ultra-high loop bandwidth setting is not recommended for
PLL multiply factor of less than 8.
A free running clock output is available when field ENDIVCLK in register SRDS_PLL_CFG (8.5.85) is set high. It
runs at a fixed divided-by-80 of the PLL output frequency and can be output on the ALARM pin by setting field
DTEST to “0001” (lanes 0 – 3) or “0010” (lanes 4 – 7) in register DTEST (8.5.76).
38
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8.3.4 Serdes Equalizer
All channels of the DAC38RFxx incorporate an adaptive equalizer, which can compensate for channel insertion
loss by attenuating the low frequency components with respect to the high frequency components of the signal,
thereby reducing inter-symbol interference. Figure 51 shows the response of the equalizer, which can be
expressed in terms of the amount of low frequency gain and the frequency up to which this gain is applied (i.e.,
the frequency of the ’zero’). Above the zero frequency, the gain increases at 6 dB/octave until it reaches the high
frequency gain.
Figure 51. Equalizer Frequency Response
The equalizer can be configured via fields EQ and EQHLD in register SRDS_CFG1 (8.5.86). Table 6 and Table 7
summarize the options. When enabled, the receiver equalization logic analyzes data patterns and transition times
to determine whether the low frequency gain should be increased or decreased. The decision logic is
implemented as a voting algorithm with a relatively long analysis interval. The slow time constant that results
reduces the probability of incorrect decisions but allows the equalizer to compensate for the relatively stable
response of the channel. The lock time for the adaptive equalizer is data dependent, and so it is not possible to
specify a generally applicable absolute limit. However, assuming random data, the maximum lock time will be
6x106 divided by the CDR activity level. For field CDR in register SRDS_CFG1 (8.5.86) = 110, the activity level
is 1.5 x 106 UI.
When EQ = 0, finer control of gain boost is available using the EQBOOST IEEE1500 tuning chain field, as shown
in Table 8.
Table 6. Receiver Equalization Configuration
EQ
EFFECT
00
No equalization. The equalizer provides a flat response at the maximum gain. This setting may be
appropriate if jitter at the receiver occurs predominantly as a result of crosstalk rather than
frequency dependent loss.
01
Fully adaptive equalization. The zero position is determined by the selected operating rate, and the
low frequency gain of the equalizer is determined algorithmically by analyzing the data patterns and
transition positions in the received data. This setting should be used for most applications.
10
Precursor equalization analysis. The data patterns and transition positions in the received data are
analyzed to determine whether the transmit link partner is applying more or less precursor
equalization than necessary.
11
Postcursor equalization analysis. The data patterns and transition positions in the received data are
analyzed to determine whether the transmit link partner is applying more or less post-cursor
equalization than necessary.
[1-0]
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Table 6. Receiver Equalization Configuration (continued)
EQ
[2]
EFFECT
0
Default
1
Boost. Equalizer gain boosted by 6 dB, with a 20% reduction in bandwidth, and an increase of
5mW power consumption. May improve performance over long links.
Table 7. Receiver Equalizer Hold
EQHOLD
EFFECT
0
Equalizer adaption enabled. The equalizer adaption and analysis algorithm is enabled. This should be the default
state.
1
Equalizer adaption held. The equalizer is held in its current state. Additionally, the adaption and analysis algorithm
is reset.
Table 8. Relationship Between Lane Rate and SerDes PLL Output Frequency
EQBOOST
GAIN BOOST (dB)
BANDWIDTH CHANGE (%)
POWER INCREASE (mW)
00
0
0
0
01
2
-30
0
01
4
10
5
11
6
-20
5
When EQ is set to 010 or 011, the equalizer is reconfigured to provide analytical data about the amount of pre
and post cursor equalization respectively present in the received signal. This can in turn be used to adjust the
equalization settings of the transmitting link partner, where a suitable mechanism for communicating this data
back to the transmitter exists. Status information is provided by setting field DTEST in register DTEST (8.5.76) to
“0111” for EQOVER and “0110” for EQUNDER. The procedure is as follows:
1. Enable the equalizer by setting fields EQHLD low and EQ to “001” (register SRDS_CFG1 8.5.86). Allow
sufficient time for the equalizer to adapt;
2. Set EQHLD to 1 to lock the equalizer and reset the adaption algorithm. This also causes both EQOVER and
EQUNDER to become low;
3. Wait at least 48 UI, and proportionately longer if the CDR activity is less than 100%, to ensure the 1 on
EQHLD is sampled and acted upon;
4. Set EQ to “010” or “011”, and EQHLD to 0. The equalization characteristics of the received signal are
analysed (the equalizer response will continue to be locked);
5. Wait at least 150 × 103 UI to allow time for the analysis to occur, proportionately longer if the CDR activity is
less than 100%;
6. Examine EQOVER and EQUNDER for results of analysis
– If EQOVER is high, it indicates the signal is over equalized;
– If EQUNDER is high, it indicates the signal is under equalized;
7. Set EQHLD to 1;
8. Repeat items 3–7 if required;
9. Set EQ to “001”, and EQHLD to 0 to exit analysis mode and return to normal adaptive equalization.
NOTE
When changing EQ from one non-zero value to another, EQHLD must already be 1. If this
is not the case, there is a chance the equalizer could be reset by a transitory input state
(i.e., if EQ is momentarily 000). EQHLD can be set to 0 at the same time as EQ is
changed.
As the equalizer adaption algorithm is designed to equalize the post cursor, EQOVER or
EQUNDER will only be set during post cursor analysis if the amount of post cursor
equalization required is more or less than the adaptive equalizer can provide.
40
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8.3.5 JESD204B Descrambler
The descrambler is a 16-bit parallel self-synchronous descrambler based on the polynomial 1 + x14 + x15. From
the JESD204B specification, the scrambling/descrambling process only occurs on the user data, not on the code
group synchronization or the ILA sequence. Each multi-DUC has a separate descrambler that can be enabled
independently. The descrambler is enabled by field SCR in the multi-DUC paged register JESD_N_HD_SCR
(8.5.49).
8.3.6 JESD204B Frame Assembly
The DAC38RFxx may be programmed as a single or dual DAC device, with one JESD RX block designated for
each DAC. The two JESD RX blocks can be programmed to operate as two separate links or as a single link.
The JESD204B defines the following parameters:
• L is the number of lanes
• M is the number of I or Q streams per device (2 = 1 IQ pair, 4 = 2 IQ pairs, 8 = 4 IQ pairs)
• F is the number of octets per frame clock period
• S is the number of samples per frame
• HD is the High-Density bit which controls whether a sample may be divided over more lanes
• N = NPRIME is the number of bits per sample (12 or 16 - bits)
Fields K and L are found in multi-DUC paged register JESD_K_L (8.5.46), M and S in multi-DUC paged register
JESD_M_S (8.5.48), and N, NPRIME and HD in multi-DUC paged register JESD_N_HD_SCR (8.5.49).
Table 9 lists the available JESD204B formats, interpolation rates and sample rate limits for the DAC38RFxx. The
ranges are limited by the Serdes PLL VCO frequency range, the Serdes PLL reference clock range, the
maximum Serdes line rate, and the maximum DAC sample frequency. Table 10 through Table 22 lists the frame
formats for each mode. In the frame format tables, i CH (N) [x:y] and q CH (N) [x:y] are bits x through y of the I
and Q samples at time N of DUC channel CH. If [x..y] is not listed, the full sample is assumed. For example,
i0(0)[15:8] are bits 15 – 8 of the I sample at time 0 of DUC #0, and q1(1) is the full Q sample at time 1 of DUC
#1.
Table 9. JESD204B Formats for DAC38RFxx
L-M-F-S-Hd
1 TX
82121
42111
22210
L-M-F-SHd
2 TX
NA
84111
44210
Frame
Format
1 TX:
Table 10
1 TX:
Table 11
2 TX:
Table 12
1 TX:
Table 13
2 TX:
Table 14
Input
IQ pairs
Resoluti
per DAC
on
Interp
Input
rate max
(MSPS)
fDAC
Max
(MSPS)
DAC38RF
DAC38RF
DAC38RF
83,
85
93,DAC38
DAC38RF
(1 TX
RF90
80
only)
DAC38RF
84
(1 TX
only)
16
1
6
1250
7500
x
16
1
8
1125
9000
x
x
16
1
12
750
9000
x
x
x
x
16
1
16
562.5
9000
x
x
x
x
16
1
6
1250
7500
x
x
16
1
8
1125
9000
x
x
16
1
10
900
9000
x
16
1
12
750
9000
x
x
x
x
16
1
16
562.5
9000
x
x
x
x
16
1
18
500
9000
x
x
x
x
16
1
24
375
9000
x
x
x
x
16
1
8
625
5000
x
16
1
12
625
7500
x
x
x
x
16
1
16
562.5
9000
x
x
x
x
16
1
18
500
9000
x
x
x
x
16
1
20
450
9000
x
x
x
x
16
1
24
375
9000
x
x
x
x
x
x
x
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Table 9. JESD204B Formats for DAC38RFxx (continued)
L-M-F-S-Hd
1 TX
12410
44210
L-M-F-SHd
2 TX
Frame
Format
24410
1 TX:
Table 15
2 TX:
Table 16
88210
1 TX:
Table 17
2 TX:
Table 18
24410
48410
1 TX:
Table 19
2 TX:
Table 20
24310
48310
1 TX:
Table 21
2 TX:
Table 22
Input
IQ pairs
Resoluti
per DAC
on
Interp
Input
rate max
(MSPS)
fDAC
Max
(MSPS)
DAC38RF
DAC38RF
DAC38RF
83,
85
93,DAC38
DAC38RF
(1 TX
RF90
80
only)
DAC38RF
84
(1 TX
only)
16
1
16
312.5
5000
x
x
x
x
16
1
24
312.5
7500
x
x
x
x
16
2
8
625
5000
x
x
16
2
12
625
7500
x
x
x
16
2
16
562.5
9000
x
x
x
16
2
24
375
9000
x
x
x
16
2
16
312.5
5000
x
x
x
16
2
24
312.5
7500
x
x
x
12
2
24
375
9000
x
x
x
Table 10. JESD204B Frame Format for LMFSHd = 82121
# un bits
4
8
# en bits
5
10
Nibble
1
2
lane RX0
i0[15:8]
lane RX1
i0[7:0]
lane RX2
i1[15:8]
lane RX3
i1[7:0]
lane RX4
q0[15:8]
lane RX5
q0[7:0]
lane RX6
q1[15:8]
lane RX7
q1[7:0]
Table 11. JESD204B Frame Format for LMFSHd = 42111
# un bits
4
8
# en bits
5
10
Nibble
1
2
lane RX0
i0[15:8]
lane RX1
i0[7:0]
lane RX2
q0[15:8]
lane RX3
q0[7:0]
Table 12. JESD204B Frame Format for LMFSHd = 84111
# un bits
4
8
# en bits
5
10
Nibble
1
2
lane RX0
42
i0[15:8]
lane RX1
i0[7:0]
lane RX2
q0[15:8]
lane RX3
q0[7:0]
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Table 12. JESD204B Frame Format for LMFSHd = 84111 (continued)
lane RX4
i1[15:8]
lane RX5
i1[7:0]
lane RX6
q1[15:8]
lane RX7
q1[7:0]
Table 13. JESD204B Frame Format for LMFSHd = 22210
# un bits
4
8
12
16
# en bits
5
10
15
20
Nibble
1
2
3
4
lane RX0
i0
lane RX1
q0
Table 14. JESD204B Frame Format for LMFSHd = 44210
# un bits
4
8
12
16
# en bits
5
10
15
20
Nibble
1
2
3
4
lane RX0
i0
lane RX1
q0
lane RX2
i1
lane RX3
q1
Table 15. JESD204B Frame Format for LMFSHd = 12410
# un bits
4
8
12
16
20
24
28
32
# en bits
5
10
15
20
25
30
35
40
Nibble
1
2
3
4
5
6
7
8
lane RX0
i0
q0
Table 16. JESD204B Frame Format for LMFSHd = 24410
# un bits
4
8
12
16
20
24
28
32
# en bits
5
10
15
20
25
30
35
40
Nibble
1
2
3
4
5
6
7
8
lane RX0
i0
q0
lane RX1
i1
q1
Table 17. JESD204B Frame Format for LMFSHd = 44210
# un bits
4
8
12
16
# en bits
5
10
15
20
Nibble
1
2
3
4
lane RX0
i0
lane RX1
q0
lane RX2
i1
lane RX3
q1
Table 18. JESD204B Frame Format for LMFSHd = 88210
# un bits
4
8
12
16
# en bits
5
10
15
20
Nibble
1
2
3
4
lane RX0
i0
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Table 18. JESD204B Frame Format for LMFSHd = 88210 (continued)
lane RX1
q0
lane RX2
i1
lane RX3
q1
lane RX4
i2
lane RX5
q2
lane RX6
i3
lane RX7
q3
Table 19. JESD204B Frame Format for LMFSHd = 24410
# un bits
4
8
12
16
20
24
28
32
# en bits
5
10
15
20
25
30
35
40
Nibble
1
2
3
4
5
6
7
8
lane RX0
i0
q0
lane RX1
i1
q1
Table 20. JESD204B Frame Format for LMFSHd = 48410
# un bits
4
8
12
16
20
24
28
32
# en bits
5
10
15
20
25
30
35
40
Nibble
1
2
3
4
5
6
7
8
lane RX0
i0
q0
lane RX1
i1
q1
lane RX2
i2
q2
lane RX3
i3
q3
Table 21. JESD204B Frame Format for LMFSHd = 24310
# un bits
4
8
12
16
20
24
# en bits
5
10
15
20
25
30
Nibble
1
2
3
4
5
6
lane RX0
i0
q0
lane RX1
i1
q1
Table 22. JESD204B Frame Format for LMFSHd = 48310
44
# un bits
4
8
12
16
20
24
# en bits
5
10
15
20
25
30
Nibble
1
2
3
4
5
6
lane RX0
i0
q0
lane RX1
i1
q1
lane RX2
i2
q2
lane RX3
i3
q3
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8.3.7 SYNC Interface
The DAC38RFxx JESD204B interface has two differential SYNC outputs called SYNC0 and SYNC1 to support
one or two links. Alternatively, GPO0 and GPO1 can be used to output SYNC as a single-ended CMOS level.
Each of the differential or CMOS outputs is enabled by a 2-bit register (fields GPO0_SEL, GPO1_SEL,
SYNC0B_SEL, SYNC1B_SEL in register IO_CONFIG 8.5.2), with bit 0 enabling multi-DUC1 SYNC and bit 1
enabling multi-DUC2 SYNC. If both are enabled, the SYNC\ signals are OR’ed.
The SYNC signal can be asserted low by the receiver either to make a synchronization request to
initialize/reinitialize the link or to report an error to the transmitter. Synchronization requests must have a
minimum duration of five frames plus nine octets rounded up to the nearest whole number of frames. To report
an error, the SYNC signal is asserted for exactly two frames. The transmitter interprets any negative edge of its
SYNC input as an error and any SYNC assertion lasting four frames or longer as a synchronization request. See
the following sections in the standard for more details.
• 7.6.3 Errors requiring re-initialization
• 7.6.4 Error reporting via SYNC interface
• 8.4 SYNC signal decoding
8.3.8 Single or Dual Link Configuration
The DAC38RFxx JESD204B interface can be configures with one or two links. The advantage of using two links,
one for each DAC, is that one link can be re-established without affecting the other link and DAC.
The configuration for each mode of operation are:
1. Dual DAC, dual link
(a) Program fields OCTETPATH0_SEL to OCTETPATH7_SEL in multi-DUC paged registers
JESD_CROSSBAR1 (8.5.57) and JESD_CROSSBAR2 (8.5.58) so that each multi-DUC will pick data off
of the appropriate SERDES lane.
(b) Appropriate bits in field LANE_ENA in multi-DUC paged register JESD_LN_EN (8.5.45) must be set for
each multi-DUC enable the lanes used.
(c) Field ONE_DAC_ONLY in register RESET_CONFIG (8.5.1) should be ‘0’ (default).
2. Dual DAC, single link
(a) Program OCTETPATH0_SEL to OCTETPATH7_SEL in multi-DUC paged registers JESD_CROSSBAR1
(8.5.57) and JESD_CROSSBAR2 (8.5.58) so that each multi-DUC will pick data off the appropriate
SERDES lane.
(b) Appropriate bits in field LANE_ENA in multi-DUC paged register JESD_LN_EN (8.5.45) must be set for
each multi-DUC enable the lanes used.
(c) Set field ONE_LINK_ONLY to ‘1’ to configure TXENABLE output.
3. Single DAC, single link
(a) Set Field ONE_DAC_ONLY in register RESET_CONFIG (8.5.1) to ‘1’ to gate clocks to unused multiDUC2 for power savings.
(b) ONE_LINK_ONLY bit does not matter in this case.
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8.3.9 Multi-Device Synchronization
In many applications, such as multi antenna systems where the various transmit channels information is
correlated, it is required that the latency across the link is deterministic and multiple DAC devices are completely
synchronized such that their outputs are phase aligned. The DAC38RFxx achieves the deterministic latency
using SYSREF (JESD204B Subclass 1).
SYSREF is generated from the same clock domain as DACCLK. After having resynchronized its local multiframe
clock (LMFC) to SYSREF, the DAC will request a link re-initialization via SYNC interface. Processing of the
signal on the SYSREF input can be enabled and disabled via the SPI interface.
The SYSREF capture circuit and the timing requirements relative to device clock are described in SYSREF
Capture Circuit.
8.3.10 SYSREF Capture Circuit
The JESD204B standard for Device Subclass 1 introduces a SYSREF signal that can be used as a global timing
reference to align the phase of the internal local multiframe clock (LMFC) and frame clock across multiple
devices. This allows the system to achieve deterministic latency and align data samples across several data
converters. The SYSREF signal accomplishes this goal by identifying a device clock edge for each chip that can
be used as an alignment reference. In particular, the LMFC and frame clock align to the device clock edge upon
which the SYSREF transition from “0” to “1” is sampled. SYSREF may be periodic, one-shot, or “gapped”
periodic and its period must be a multiple of the LMFC period.
Figure 52. SYSREF Signal Timing
With high-speed device clocks, the phase of the SYSREF signals relative to the device clock must meet the
setup/hold time requirements of each individual device clock. Historically, this has been done by controlling the
board-level routing delay and/or employing commercial clock distribution capable of generating device clocks and
SYSREF signals with programmable delays and with the option of splitting SYSREF into multiple SYSREFS,
each with its own fine-tuned delay. Since the DAC38RFxx family supports device clock frequencies up to 9 GHz,
a SYSREF capture circuit is includes in the DAC38RFxx that allows a relaxation in meeting the device clock
setup and hold.
The SYSREF capture circuit provides:
• tolerance to manufacturing and environmental variations in SYSREF phase
• immunity to sampling errors due to setup/hold/meta-stability
• information about phase of SYSREF relative to DAC clock inside the data converter
• software compensation for phase misalignment due to PCB design errors
The concepts behind the SYSREF capture scheme are illustrated in Figure 53.
46
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Figure 53. SYSREF Capture Strategy and Phase Tolerance Windows
To understand Figure 53, to begin with we’ll ignore the SYSREF phase tolerance windows in the lower portion of
the figure and focus on the blue clock waveform at the top of the figure. This waveform represents the device
clock input to a particular DAC chip. The green arrows, labeled “R” and “F”, correspond to the rising and falling
edges of this clock (ignoring for the moment the additional arrows labeled “ER” and "EF”). Lower frequency
devices captured SYSREF only on the rising edge of the device clock, the new scheme samples SYSREF on the
falling edge as well, which provides more flexibility when optimizing the setup and hold time of the SYSREF
capture path. Moreover, each time a rising SYSREF edge is captured, the chip remembers the clock phase
during which the event occurred, and the system designer can later read back the phase information to observe
the SYSREF timing relative to the device clock at the internal capture point. If SYSREF transitions close to the
rising or falling clock edge sampling points the capture flop setup and hold time may not be met and the
observed phase may be unreliable and subject to meta-stability phenomenon.
To reduce the sensitivity to setup/hold/meta-stability concerns an “early” version of the device clock is generated
within the DAC and additional SYSREF samples are taken at the “early falling” and “early rising” edges of the
clock (labeled “EF” and “ER”, respectively, in Figure 53). The resulting set of four samples is used to narrow
down the timing of the rising SYSREF edge to one of four possible clock phases. If the rising SYSREF transition
takes place between the “EF” and “F” samples, then SYSREF is said to occur in phase θ1. Similarly, if it takes
place between the “F” and “ER” samples, then it is said to occur in phase θ2. If SYSREF transitions between the
“ER” and “R” samples, then it is said to occur in phase θ3. And, finally, if the SYSREF rising edge event happens
between the “R” and “EF” samples, then it is said to occur in phase θ4. As mentioned before, the chip
remembers all observed SYSREF phases and the user can later read them back. Since the delay between
“early” and “on time” versions of the clock is intentionally chosen to be larger than the setup/hold/meta-stability
window, at most one of the four samples can be affected even when the SYSREF transitions right at one of the
four sampling points. Thus, the uncertainty in the observed SYSREF timing is limited to adjacent phases, and
with twice as many sampling phases the resolution of the timing information is improved by a factor of two.
Referring to the lower portion of Figure 53, the user can now see how this information regarding the observed
SYSREF phases is used to devise a reliable SYSREF capture methodology with a high degree of tolerance to
manufacturing and environmental variations in SYSREF phase. Based on the SYSREF phases observed for a
particular DAC chip during system characterization, the system designer can select one of four so-called “phase
tolerance window” options (denoted “’00”, “01”, “10”, and “11”) to maximize immunity to manufacturing and
environmental variations. For example, consider the default phase tolerance window labeled “window=00” in the
figure. If, during characterization, the system designer observes (by reading back the recorded phase
observations) that the rising SYSREF edge nominally occurs in either θ1 or θ2 or both (i.e. θ12) then he would
program that particular DAC chip to use phase tolerance window “00”. This mapping is indicated in the figure
with the label “θ1|θ12|θ2: window=00”. Having programmed the device to use window “00”, all future SYSREF
events that occur in θ1 or θ2 would trigger the LMFC and frame clock to be aligned using the following rising
clock edge as the alignment reference (as indicated by the red arrow pointing to rising clock edge “R” and
labeled “Window=00/01 alignment edge”).
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The full extent of each phase tolerance window is indicated in the figure using “box and whisker” plots. For the
“window=00” example, the “box” portion of the plot indicates that the phase tolerance window is centered on θ12
(to be precise on the boundary between θ1 and θ2) and the “whisker” portion indicates that even if the rising
edge of SYSREF occurs as early as the preceding θ4 or as late as the following θ3 it still results in LMFC and
frame clock alignment to the same rising clock edge indicated by the red arrow labeled “Window=00/01
alignment edge”. When programmed for phase tolerance window “00”, the DAC chip is tolerant to variations in
the SYSREF timing ranging from a rising SYSREF edge that occurs just after one rising edge of clock to just
before the next rising edge of the clock. The qualifying phrases “just after” and “just before” are used here to
indicate that the SYSREF transition must occur far enough away from the rising edges of the clock to avoid
setup/hold violations and prevent the device from concluding that the SYSREF transition has crossed out off the
phase tolerance window when in fact it has not. The tolerance range for window “00” is from rising clock edge to
rising clock edge and is indicated in the figure by the green text labeled “tolerance = R↔R”.
Following the above example, if characterization reveals SYSREF timing centered on θ23 then phase tolerance
window “01” (with tolerance for SYSREF rising edge events from EF to EF) should be chosen. Notice that this
option is tolerant even to rising SYSREF edges that occur after the rising device clock edge (i.e. in θ4) and will
treat them just as if they had occurred in one of the earlier three phases, aligning to the same rising device clock
edge indicated by the red arrow labeled “Window=00/01 Alignment Edge”. This allows the system designer to
tolerate PCB design errors and/or environmental and manufacturing variations – achieving his intended
alignment without having to make physical changes to the board to adjust the SYSREF timing.
Similarly, if characterization indicates that SYSREF timing is centered on θ34 or θ41 then phase tolerance
window “10” or “11” can be selected, resulting in tolerance for “F↔F” or “ER↔ER” SYSREF timing, respectively.
Note, however, that in these two cases the alignment reference edge is by default taken to be the subsequent
rising edge of the device clock. Since this may not be the desired behavior, the DAC38RFxx allows the user to
program in an optional alignment offset of θ1 if the default offset of 0 does not achieve the desired alignment.
This feature is illustrated in Figure 54 where the user can see that by setting the alignment offset to -1, phase
tolerance windows “10” and “11” can be made to trigger alignment to the earlier rising device clock edge used by
windows “00” and “01”. Alternatively, the window “00” and “01” alignment edge can be pushed one cycle later by
setting their alignment offset to +1.
Figure 54. Optional SYSREF Alignment Offset
Several important controls related to SYSREF alignment and capture timing are contained in register
SYSR_CAPTURE (8.5.78). For example, as mentioned before, the device is capable of monitoring the observed
phases of the rising SYSREF edge events; however, in order to avoid unwanted noise coupling from the
SYSREF circuits into the DAC output, the SYSREF monitoring circuits are disabled by default. Field
SYSR_STATUS_ENA enables SYSREF status monitoring. Field SYSR_PHASE_WDW contains the the phase
tolerance window selected for normal operation, which is optimized during characterization. Field
SYSR_ALIGN_DLY contains the control that allows the system designer to optionally offset the SYSREF
alignment event by ±1 device clock cycles. Field SYSR_STATUS_ENA enables the SYSREF capture alignment
accumulation and will generate alarms when enabled. Writing a “1” to field SYSR_ALIGN_SYNC clears the
accumulated SYSREF alignment statistics. The SYSREF alignment block can be bypassed completely by field
SYSREF_BYPASS_ALIGN, in which case SYSREF is latched by the rising edge of DACCLK.
48
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When field SYSR_STATUS_ENA is high the device records the phase associated with each SYSREF event for
use in characterizing the SYSREF capture timing and selecting an appropriate phase tolerance window. The
phase data is available in two forms. First, each of the four phases has a corresponding “sticky” alarm flag
indicating which phases have been observed since the last time the register was cleared. In addition, the device
also accumulates statistics on the relative number of occurrences of each phase spanning multiple SYSREF
events using saturating 8-bit counters. These accumulated real-time SYSREF statistics allow us to account for
time-varying effects during characterization such as potential timing differences between the 1st and Nth edges
in a “gapped” SYSREF pulse train. The counters are fields PHASE1_CNT and PHASE2_CNT in register
SYSREF12_CNT (8.5.10), PHASE3_CNT and PHASE4_CNT in register SYSREF34_CNT (8.5.11), and
ALIGN_TO_R1_CNT and ALIGN_TO_R3_CNT in register SYSREF_ALIGN_R (8.5.9).
The accumulated SYSREF statistics can be cleared by writing ‘1’ to SYSR_ALIGN_SYNC. This sync signal
affects only the SYSREF statistics monitors and does not cause a sync of any other portions of the design.
Before collecting phase statistics, the user must first enable the SYSREF status monitoring logic by setting the
SYSR_STATUS_ENA bit. The user must then generate a repeating SYSREF input before using
SYSR_ALIGN_SYNC to clear the statistic counters. This is necessary to flush invalid data out of the status
pipeline.
The “sticky” alarm flags indicating which of the four phases have been observed since the last
SYSR_ALIGN_SYNC write of ‘1’ are fields ALM_SYSRPHASE1 to ALM_SYSRPHASE4 and are contained in the
ALM_SYSREF_DET register (8.5.6).
8.3.11 JESD204B Subclass 0 support
Some functionality has been implemented to support Subclass 0 operation. Note that programming the
SUBCLASSV configuration parameter has no functional impact on the logic. The value programmed for
SUBCLASSV is only used in the initial lane alignment (ILA) sequence. The following configuration parameters
are used to support Subclass 0 operation:
• Field SYSREF_MODE in register JESD_SYSR_MODE (8.5.56) = 0
• Field DISABLE_ERR_RPT in register JESD_ERR_OUT (8.5.53) = 1
• Field MIN_LATENCY_ENA in register JESD_MATCH (8.5.50) = 1
8.3.12 SerDes Test Modes through Serial Programming
The DAC38RFxx supports a number of basic pattern generation and verification of SerDes via the serial
interface. Three pseudo random bit stream (PRBS) sequences are available, along with an alternating 0/1
pattern and a 20-bit user-defined sequence. The 27 - 1, 231 - 1 or 223 – 1 sequences implemented can often be
found programmed into standard test equipment, such as a Bit Error Rate Tester (BERT). Pattern generation and
verification selection is via field TESTPATT in register SRDS_CFG1 (8.5.86), as shown in Table 23.
Table 23. SerDes Test Pattern Selection
TESTPATT
EFFECT
000
Test mode disabled.
001
Alternating 0/1 Pattern. An alternating 0/1 pattern with a period of 2 UI.
010
Verify 27 - 1 PRBS. Uses a 7-bit LFSR with feedback polynomial x7 + x6 + 1.
011
Verify 223 - 1 PRBS. Uses an ITU O.150 conformant 23-bit LFSR with feedback polynomial x23 + x18 + 1.
100
Verify 231 - 1 PRBS. Uses an ITU O.150 conformant 31-bit LFSR with feedback polynomial x31 + x28 + 1.
101
User-defined 20-bit pattern. Uses the USR PATT IEEE1500 Tuning instruction field to specify the pattern. The default
value is 0x66666.
11x
Reserved.
Pattern verification compares the output of the serial to parallel converter with an expected pattern. When there
is a mismatch, the TESTFAIL bit is driven high, which can be programmed to come out the ALARM terminal by
setting field DTEST in register DTEST (8.5.76) to “0011”.
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8.3.13 SerDes Test Modes through IEEE 1500 Programming
DAC38RFxx also provide a number of advanced diagnostic capabilities controlled by the IEEE 1500 interface.
These are:
• Accumulation of pattern verification errors;
• The ability to map out the width and height of the receive eye, known as Eye Scan;
• Rreal-time monitoring of internal voltages and currents;
The SerDes blocks support the following IEEE1500 instructions:
Table 24. IEEE1500 Instruction for SerDes Receivers
INSTRUCTION
OPCODE
DESCRIPTION
ws_bypass
0x00
Bypass. Selects a 1-bit bypass data register. Use when accessing other macros on the same
IEEE1500 scan chain.
ws_cfg
0x35
Configuration. Write protection options for other instructions.
ws_core
0x30
Core. Fields also accessible via dedicated core-side ports.
ws_tuning
0x31
Tuning. Fields for fine tuning macro performance.
ws_debug
0x32
Debug. Fields for advanced control, manufacturing test, silicon characterization and debug.
ws_unshadowed
0x34
Unshadowed. Fields for silicon characterization.
ws_char
0x33
Char. Fields used for eye scan.
The data for each SerDes instruction is formed by chaining together sub-components called head, body (receiver
or transmitter) and tail. DAC38RFxx uses two SerDes receiver blocks R0 and R1, each of which contains 4
receive lanes (channels), the data for each IEEE1500 instruction is formed by chaining {head, receive lane 0,
receive lane 1, receive lane 2, receive lane 3, tail}. A description of bits in head, body and tail for each instruction
is given as follows:
NOTE
All multi-bit signals in each chain are packed with bits reversed e.g. mpy[7:0] in ws_core
head subchain is packed as {retime, enpll, mpy[0:7], vrange, lb[0:1]}. All DATA REGISTER
READS from SerDes Block R0 should read 1 bit more than the desired number of bits and
discard the first bit received on TDO e.g., to read 40-bit data from R0 block, 41 bits should
be read off from TDO and the first bit received should be discarded. Similarly, any data
written to SerDes Block R0 Data Registers should be prefixed with an extra 0.
Table 25. ws_cfg Chain
FIELD
DESCRIPTION
HEAD (STARTING FROM THE MSB OF CHAIN)
RETIME
No function.
CORE_WE
Core chain write enable.
RECEIVER (FOR EACH LANE 0, 1, 2, 3)
CORE_WE
Core chain write enable.
TUNING_WE
Tuning chain write enable.
DEBUG_WE
Reserved.
CHAR_WE
Char chain write enable.
UNSHADOWED_WE
Reserved.
TAIL (ENDING WITH THE LSB OF CHAIN)
CORE_WE
Core chain write enable.
TUNING_WE
Tuning chain write enable.
DEBUG_WE
Reserved.
RETIME
No function.
CHAIN LENGTH = 26 BITS
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Table 26. ws_core Chain
FIELD
DESCRIPTION
HEAD (STARTING FROM THE MSB OF CHAIN)
RETIME
No function.
ENPLL
PLL enable.
MPY[7:0]
PLL multiply.
VRANGE
VCO range.
ENDIVCLK
Enable DIVCLK output
LB[1:0]
Loop bandwidth
RECEIVER (FOR EACH LANE 0,1,2,3)
ENRX
Receiver enable.
SLEEPRX
Receiver sleep mode.
BUSWIDTH[2:0]
Bus width.
RATE[1:0]
Operating rate.
INVPAIR
Invert polarity.
TERM[2:0]
Termination.
ALIGN[1:0]
Symbol alignment.
LOS[2:0]
Loss of signal enable.
CDR[2:0]
Clock/data recovery.
EQ[2:0]
Equalizer.
EQHLD
Equalizer hold.
ENOC
Offset compensation.
LOOPBACK[1:0]
Loopback.
BSINRXP
Boundary scan initialization.
BSINRXN
Boundary scan initialization.
RESERVED
Reserved.
Testpatt[2:0]
Test pattern selection.
TESTFAIL
Test failure (real time).
LOSTDTCT
Loss of signal detected (real time).
BSRXP
Boundary scan data.
BSRXN
Boundary scan data.
OCIP
Offset compensation in progress.
EQOVER
Receiver signal over equalized.
EQUNDER
Receiver signal under equalized.
LOSTDTCT
Loss of signal detected (sticky).
SYNC
Re-alignment done, or aligned comma output
(sticky).
RETIME
No function.
TAIL (ENDING WITH THE LSB CHAIN)
CLKBYP[1:0]
Clock bypass.
SLEEPPLL
PLL sleep mode.
RESERVED
Reserved.
LOCK
PLL lock (real time).
BSINITCLK
Boundary scan initialization clock.
ENBSTX
Enable TX boundary scan.
ENBSRX
Enable RX boundary scan.
ENBSPT
RX pulse boundary scan.
RESERVED
Reserved.
NEARLOCK
PLL near to lock.
UNLOCK
PLL lock (sticky).
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Table 26. ws_core Chain (continued)
FIELD
DESCRIPTION
CFG OVR
Configuration over-ride.
RETIME
No function.
CHAIN LENGTH = 196 BITS
Table 27. ws_tuning Chain
FIELD
DESCRIPTION
HEAD (STARTING FROM THE MSB OF CHAIN)
RETIME
No function.
RECEIVER (FOR EACH LANE 0,1,2,3)
PATTERRTHR[2:0]
Resync error threshold.
PATT TIMER
PRBS timer.
RXDSEL[3:0]
Status select.
ENCOR
Enable clear-on-read for error counter.
EQZERO[4:0]
EQZ OVRi Equalizer zero.
EQZ OVR
Equalizer zero over-ride.
EQLEVEL[15:0]
EQ OVRi Equalizer gain observe or set.
EQ OVR
Equalizer over-ride.
EQBOOST[1:0]
Equalizer gain boost.
RXASEL[2:0]
Selects amux output.
TAIL (ENDING WITH THE LSB CHAIN)
ASEL[3:0]
Selects amux output.
USR PATT[19:0]
User-defined test pattern.
RETIME
No function.
CHAIN LENGTH = 174 BITS
Table 28. ws_char Chain
FIELD
DESCRIPTION
HEAD (STARTING FROM THE MSB OF CHAIN)
RETIME
No function.
RECEIVER (FOR EACH LANE 0,1,2,3)
TESTFAIL
Test failure (sticky).
ECOUNT[11:0]
Error counter.
ESWORD[7:0]
Eye scan word masking.
ES[3:0]
Eye scan.
ESPO[6:0]
Eye scan phase offset.
ES BIT SELECT[4:0]
Eye scan compare bit select.
ESVO[5:0]
Eye scan voltage offset.
ESVO OVR
Eye scan voltage offset override.
ESLEN[1:0]
Eye scan run length.
ESRUN
Eye scan run.
ESDONE
Eye scan done.
TAIL (ENDING WITH THE LSB CHAIN)
RETIME
No function.
CHAIN LENGTH = 194 BITS
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8.3.14 Error Counter
All receive channels include a 12-bit counter for accumulating pattern verification errors. This counter is
accessible via the ECOUNT IEEE1500 Char field. It is an essential part of the eye scan capability (see the Eye
Scan section).
The counter increments once for every cycle that the TESTFAIL bit is detected. The counter does not increment
when at its maximum value (i.e., all 1s). When an IEEE1500 capture is performed, the count value is loaded into
the ECOUNT scan elements (so that it can be scanned out), and the counter is then reset, provided NCOR is set
high.
ECOUNT can be used to get a measure of the bit error rate. However, as the error rate increases, it becomes
less accurate due to limitations of the pattern verification capabilities. Specifically, the pattern verifier checks
multiple bits in parallel (as determined by the Rx bus width), and it is not possible to distinguish between 1 or
more errors.
8.3.15 Eye Scan
All receive channels provide features which facilitate mapping the received data eye or extracting a symbol
response. A number of fields accessible via the IEEE1500 Char scan chain allow the required low level data to
be gathered. The process of transforming this data into a map of the eye or a symbol response must then be
performed externally, typically in software.
The basic principle used is as follows:
• Enable dedicated eye scan input samplers, and generate an error when the value sampled differs from the
normal data sample;
• Apply a voltage offset to the dedicated eye scan input samplers, to effectively reduce their sensitivity;
• Apply a phase offset to adjust the point in the eye that the dedicated eye scan data samples are taken;
• Reset the error counter to remove any false errors accumulated as a result of the voltage or phase offset
adjustments;
• Run in this state for a period of time, periodically checking to see if any errors have occurred;
• Change voltage and/or phase offset, and repeat.
Alternatively, the algorithm can be configured to optimize the voltage offset at a specified phase offset, over a
specified time interval.
Eye scan can be used in both synchronous and asynchronous systems, while receiving normal data traffic. The
IEEE1500 Char fields used to directly control eye scan and symbol response extraction are ES, ESWORD, ES
BIT SELECT, ESLEN, ESPO, ESVO, ESVO OVR, ESRUN and ESDONE. Eye scan errors are accumulated in
ECOUNT.
The required eyescan mode is selected via the ES field, as shown in Table 29. When enabled, only data from
the bit position within the 20-bit word specified via ES BIT SELECT is analyzed. In other words, only eye scan
errors associated with data output at this bit position will accumulate in ECOUNT. The maximum legal ES BIT
SELECT is 10011.
Table 29. Eye Scan Mode Selection
ES[3:0]
EFFECT
0000
Disabled. Eye scan is disabled.
0x01
Compare. Counts mismatches between the normal sample and the eye scan sample if ES[2] = 0, and matches
otherwise.
0x10
Compare zeros. As ES = 0x01, but only analyses zeros, and ignores ones.
0x11
Compare ones. As ES = 0x01, but only analyses ones, and ignores zeroes.
0100
Count ones. Increments ECOUNT when the eye scan sample is a 1.
1x00
Average. Adjusts ESVO to the average eye opening over the time interval specified by ESLEN. Analyses zeroes when
ES[2] = 0, and ones when ES[2]= 1.
1001
1110
Outer. Adjusts ESVO to the outer eye opening (i.e. lowest voltage zero, highest voltage 1) over the time interval
specified by ESLEN. 1001 analyses zeroes, 1110 analyses ones.
1010
1101
Inner. Adjusts ESVO to the inner eye opening (i.e. highest voltage zero, lowest voltage 1) over the time interval
specified by ESLEN. 1010 analyses zeroes, 1101 analyses ones.
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Table 29. Eye Scan Mode Selection (continued)
ES[3:0]
EFFECT
1x11
Timed Compare. As ES = 001x, but analyses over the time interval specified by ESLEN. Analyses zeroes when ES[2] =
0, and ones when ES[2] = 1.
When ES[3] = 0, the selected analysis runs continuously. However, when ES[3] = 1, only the number of qualified
samples specified by ESLed, as shown in Table 30. In this case, analysis is started by writing a 1 to ESRUN (it is
not necessary to set it back to 0). When analysis completes, ESDONE is set to 1.
Table 30. Eye Scan Run Length
ESLen
NUMBER OF SAMPLES ANALYZED
00
127
01
1023
10
8095
11
65535
When ESVO OVR = 1, the ESVO field determines the amount of offset voltage that is applied to the eye scan
data samplers associated with rxpi and rxni. The amount of offset is variable between 0 and 300 mV in
increments of ~10 mV, as shown Table 31. When ES[3] = 1, ESVO OVR must be 0 to allow the optimized
voltage offset to be read back via ESVO.
Table 31. Eye Scan Voltage Offset
ESVO
OFFSET (mV)
100000
-310
…
…
111110
-20
111111
-10
000000
0
000001
10
000010
20
…
…
011111
300
The phase position of the samplers associated with rxpi and rxni, is controlled to a precision of 1/32UI. When ES
is not 00, the phase position can be adjusted forwards or backwards by more than one UI using the ESPO field,
as shown in Table 32. In normal use, the range should be limited to ±0.5 UI (+15 to –16 phase steps).
Table 32. Eye Scan Phase Offset
54
ESPO
OFFSET (1/32 UI)
011111
+63
…
…
000001
+1
000000
0
111111
-1
…
…
100000
-64
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8.3.16 JESD204B Pattern Test
The DAC38RFxx supports the following test patterns for JESD204B:
• Link layer test pattern by setting field JESD_TEST_SEQ in register JESD_LN_EN (8.5.45) and monitoring the
lane alarms (1 = fail, 0 = pass)
– Verify repeating /D.21.5/ high frequency pattern for random jitter (RJ)
– Verify repeating /K.28.5/ mixed frequency pattern for deterministic jitter (DJ)
– Verify repeating initial lane alignment (ILA) sequence
• RPAT, JSPAT or JTSPAT pattern can be verified using errors counter of 8b/10b errors produced over an
amount of time to get an estimate of BER.
• Transport layer test pattern: implements a short transport layer pattern check based on F = 1, 2, 4 or 8. The
short test pattern has a duration of one frame period and is repeated continuously for the duration of the test.
Each sample has a unique value that can be identified with the position of the sample in the user data format.
The sample values are such that correct sample values will never be decoded at the receiver if there is a
mismatch between the mapping formats being used at the transmitter and receiver devices. This can
generally be accomplished by ensuring there are no repeating sub patterns within the stream of samples
being transmitted. Refer to the JESD204B standard section 5.1.6 for more details.
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The DAC38RFxx expects the test samples, in a frame, transmitted by an logic device as per Table 33:
Table 33. Short Test Patterns
JESD Mode
i0
q0
i1
q1
82121
7CB8, F431, 6DA9, E520
7CB8, F431, 6DA9,
E520
n/a
n/a
42111
7CB8, F431
6DA9, E520
F871, E962
DA53, CB40
22210
7CB8
6DA9
n/a
n/a
12410
7CB8
6DA9
n/a
n/a
44210
7CB8
6DA9
7CB8
6DA9
24410
7CB8
6DA9
7CB8
6DA9
41121
7CB8, F431, 6DA9, E520
81180
7C00, B800, F400, 3100, 6D00,
A900, E500, 2000, F800, 7100,
E900, 6200, DA00, 5300, CB00,
4000
n/a
n/a
n/a
24310
87C0, F4B0
D310, A960
0E50, F820
9710, 62E0
41380
87C0, F4B0, D310, A960, 0E50,
F820, 9710, 62E0
n/a
n/a
n/a
The short test pattern has duration of one frame period and is repeated continuously for the duration of the test.
Each sample has a unique value that can be identified with the position of the sample in the user data format.
The sample values are such that correct sample values will never be decoded at the receiver if there is a
mismatch between the mapping formats being used at the transmitter and receiver devices. This can generally
be accomplished by ensuring there are no repeating sub patterns within the stream of samples being transmitted.
Following are the steps required to execute the short test functionality in DAC38RFxx.
1. Configure other registers, make sure clocks are up and running.
2. Start driving short test patterns
3. Clear short test alarm by writing ‘0’ to field ALM_FROM_SHORTTEST in register ALM_SYSREF_PAP
(8.5.67). This is a paged register, one for each Multi-DUC.
4. Enable short test by writing a ‘1’ to field SHORTTEST_ENA in register MULTIDUC_CFG2 (8.5.14).
5. Read the short test alarm from field ALM_FROM_SHORTTEST in register ALM_SYSREF_PAP (8.5.67).
This is a paged register, one for each Multi-DUC
If the alarm read from the register is high, the short test has detected an error.
8.3.17 Multiband DUC (multi-DUC)
Each DAC output in the DAC38RFxx is supported by a dual band digital upconverter (DUC), which is called a
multi-DUC.Figure 55 shows the signal processing features of each of the two multi-DUCs. The two paths are
identical and independent. The SPI interface registers for the multi-DUCs are addressed through paging, with
page 0 supporting multi-DUC1 and page 1 supporting multi-DUC2. Register PAGE_SET (8.5.8) is used to set the
pages. Both pages can be selected at the same time to program both multi-DUCs simultaneously with the same
settings.
Each multi-DUC has 2 DUC channels, called path AB and path CD. The output of one multi-DUC can be added
to the signal of the other multi-DUC to allow a configuration with 4 total DUCs summed together for 1 DAC. After
quadrature modulation is a sin(x)/x compensation filter, followed by the multiband summation block. The multiband summation block had the ability to add the signals from the other multi-DUC for a combined 4 DUCs, each
with independent frequency control. The final block is an output delay block with 0 – 15 sample range.
56
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48-bit
NCO1
Input
Mux
cos
xN
16
Q
xN
16
PAP
xN
Path CD
Q
xN
16
x
sin(x)
PAP
Gain
CMIX control
(±n*Fs/4)
I
16
Multiband
summation
Complex Mixer
(FMIX or CMIX)
JESD204B Interface
Path AB
sin
Complex Mixer
(FMIX or CMIX)
I
cos
Delay
x
sin(x)
PAP
Gain
From 2nd
multi-DUC
sin
48-bit
NCO2
Figure 55. DAC38RFxx multi-DUC Signal Processing Block Diagram
8.3.17.1 Multi-DUC input
Each multi-DUC, accepts data from up to 8 Serdes lanes. A crossbar switch allows any Serdes lane to be
mapped to any other Serdes lane. The crossbar switch is controlled by fields OCTETPATHx_SEL (x = [0..7]) in
Registers JESD_CROSSBAR1 (8.5.57) and JESD_CROSSBAR2 (8.5.58).
As shown in Table 9, the multiband DUC can be configured as either a single DUC with 1 IQ input, or a dual
DUC with 2 IQ inputs, which is selected by asserting field DUAL_IQ in register MULTIDUC_CFG1 (8.5.13).
8.3.17.2 Interpolation Filters
The digital upconverter first increases the sample rate of the IQ signal from the input sample rate to the final
DAC sample rate through a series of interpolation filters. Different sets of filters are used to achieve different
rates, as shown in Table 34. The interpolation rate is selected by field INTERP in register MULTIDUC_CFG1
(8.5.13).
Table 34. FIR filters Used for Different Interpolation Rates
FILTERS USED
Interpolation
Rate
FIR0 (2x)
6
x
FIR1 (2x)
LPFIR0_5X
FIR2 (2x)
LPFIR0_3X
FIR3 (2x)
LPFIR1_3X
x
8
x
10
x
x
12
x
x
16
x
x
18
x
20
x
x
24
x
x
x
x
x
x
x
x
x
x
x
x
x
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The FIR filter coefficients are shown in Table 35 The FIR filters are design with a passband BW of 0.4 x fINPUT, a
stopband attenuation of 90 dBc and ripple of < 0.001 dB. The composite frequency response for each
interpolation factor are shown in Figure 56 to Figure 63.
20
0
0
-20
-20
-40
-40
Magnitude (dB)
Magnitude (dB)
20
-60
-80
-100
-60
-80
-100
-120
-120
-140
-140
-160
-160
0
0.075
0.15
0.225
0.3
f/Fdac
0.375
0.45
0
0.15
20
20
0
0
-20
-20
-40
-40
-60
-80
-100
0.375
0.45
D002_8x
-60
-80
-100
-120
-120
-140
-140
-160
0.225
0.3
f/Fdac
Figure 57. Composite Magnitude Response for 8x
Interpolation
Magnitude (dB)
Magnitude (dB)
Figure 56. Composite Magnitude Response for 6x
Interpolation
-160
0
0.075
0.15
0.225
0.3
f/Fdac
0.375
0.45
0
D003
Figure 58. Composite Magnitude Response for 10x
Interpolation
58
0.075
D001
0.075
0.15
0.225
0.3
f/Fdac
0.375
0.45
D004
Figure 59. Composite Magnitude Response for 12x
Interpolation
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20
20
0
0
-20
-20
-40
-40
Magnitude (dB)
Magnitude (dB)
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-60
-80
-100
-60
-80
-100
-120
-120
-140
-140
-160
-160
0
0.075
0.15
0.225
0.3
f/Fdac
0.375
0.45
0
Figure 60. Composite Magnitude Response for 16x
Interpolation
0.15
0.225
0.3
f/Fdac
0.375
0.45
D006
Figure 61. Composite Magnitude Response for 18x
Interpolation
20
20
0
0
-20
-20
-40
-40
Magnitude (dB)
Magnitude (dB)
0.075
D005
-60
-80
-100
-60
-80
-100
-120
-120
-140
-140
-160
-160
0
0.075
0.15
0.225
0.3
f/Fdac
0.375
0.45
0
0.075
0.15
0.225
0.3
f/Fdac
D007
Figure 62. Composite Magnitude Response for 20x
Interpolation
0.375
0.45
D001
Figure 63. Composite Magnitude Response for 24x
Interpolation
Table 35. FIR Filter Coefficients
tap
FIR0
FIR1
LPFIR0_5X
FIR2
LPFIR0_3X
FIR3
LPFIR1_3X
1
6
-12
-6
29
-14
3
25
1
2
0
0
-22
0
-61
0
88
-4
3
-19
84
-51
-214
-125
-25
22
13
4
0
0
-89
0
-95
0
-576
-50
5
47
-336
-117
1209
181
150
-1764
592
6
0
0
-106
2048
681
256
-2263
-50
7
-100
1006
-18
1209
972
150
491
13
8
0
0
171
0
347
0
8139
-4
9
192
-2691
449
-214
-1475
-25
18625
1
10
0
0
745
0
-3519
0
26365
11
-342
10141
930
29
-3528
3
26365
12
0
16384
841
707
18625
13
572
10141
338
9337
8139
14
0
0
-618
19445
491
15
-914
-2691
-1892
26299
-2263
16
0
0
-3147
26299
-1764
17
1409
1006
-3872
19445
-576
INVSINC
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Table 35. FIR Filter Coefficients (continued)
60
tap
FIR0
FIR1
LPFIR0_5X
18
0
0
-3500
19
-2119
-336
20
0
0
21
3152
FIR2
LPFIR0_3X
-1564
707
88
2121
-3528
25
84
7336
-3519
0
0
13430
-1475
23
-4729
-12
19426
347
24
0
24231
972
25
7420
26904
681
26
0
26904
181
27
-13334
24231
-95
28
0
19426
-125
29
41527
13430
-61
30
65536
7336
-14
31
41527
2121
32
0
-1564
33
-13334
-3500
34
0
-3872
35
7420
-3147
36
0
-1892
37
-4729
-618
38
0
338
39
3152
841
40
0
930
41
-2119
745
42
0
449
43
1409
171
44
0
-18
45
-914
-106
46
0
-117
47
572
-89
48
0
-51
49
-342
-22
50
0
-6
51
192
0
53
-100
54
0
55
47
56
0
57
-19
58
0
59
6
LPFIR1_3X
22
22
52
FIR3
9337
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8.3.17.3 JESD and Interpolation Programming
Table 36 lists the register field values required for each JESD and interpolation mode. The register field
addresses are listed in Table 37.
Table 36. Register Programming for JESD and Interpolation Mode
Mode
L-M-F-S-Hd
1 TX/2TX
Register Field Programming
Interp
82121/NA
42111/84111
22210/44210
12410/24410
44210/88210
24410/48410
24310/48310
CLKJESD_DIV
INTERP
(4-0)
CLKJESD
_DIV
(3-0)
CLKJESD
_OUT_DI
V
(3-0)
6
div24
00011
0110
0011
8
div32
00100
0111
0100
12
div48
00110
1010
0110
16
div64
01000
1011
0111
6
div12
00011
0010
0011
8
div16
00100
0011
0100
10
div20
00101
0101
0101
12
div24
00110
0110
0110
16
div32
01000
0111
0111
18
div36
01001
1001
1000
24
div48
01100
1010
1010
8
div8
00100
0001
0100
12
div12
00110
0010
0110
16
div16
01000
0011
0111
18
div18
01001
0100
1000
20
div20
01010
0101
1001
24
div24
01100
0110
1010
16
div8
01000
0001
0111
24
div24
01100
0110
1010
8
div8
00100
0001
0100
12
div12
00110
0010
0110
16
div16
01000
0011
0111
24
div24
01100
0110
1010
16
div8
01000
0001
0111
24
div12
01100
0010
1010
24
div16
01100
0011
1010
L_M1
(4-0)
F_M1
(7-0)
M_M1
(7-0)
S_M1
(4-0)
HD
N_M1/N’_
M1
(4-0)
00111
0x00
0x01
00001
1
01111
00011
0x00
0x01
00000
1
01111
00001
0x01
0x01
00000
0
01111
00000
0x03
0x01
00000
0
01111
00011
0x01
0x03
00000
0
01111
00011
0x03
0x03
00000
0
01111
00011
0x02
0x03
00000
0
01011
Table 37. Register Field Addresses for JESD and Interpolation Programming
Register Field Name
Register
Register Address
Bit(s)
Hyperlink
INTERP
MULTIDUC_CFG1
0x0A
12-8
8.5.13
SERDES_CLK
0x25
L_M1
JESD_K_L
0x4C
F_M1
JESD_RBD_F
0x4B
CLKJESD_DIV
CLKJESD_OUT_DIV
M_M1
S_M1
JESD_M_S
0x4D
HD
N_M1
15-12
11-8
8.5.28
4-0
8.5.47
7-0
8.5.46
15-8
4-0
8.5.48
6
JESD_N_HD_SCR
0x4E
N_M1’ (NPRIME_M1)
12-8
8.5.49
4-0
All registers are paged!
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8.3.17.4 Digital Quadrature Modulator
Each DUC in the DAC38RFxx has digital quadrature modulator (DQM) blocks with independent Numerically
Controlled Oscillators (NCO) that converts the complex input signal to a real signal with flexible frequency
placement between 0 and fDAC/2. The NCOs are enabled by fields NCOAB_ENA and NCOCD_ENA in register
MULTIDUC_CFG2 (8.5.14). The NCOs have 48-bit frequency registers (FREQ_NCOAB (8.5.25) and
FREQ_NCOCD (8.5.26)) and 16-bit phase registers (PHASE_NCOAB (8.5.23) and PHASE_NCOCD (8.5.24))
that generate the sine and cosine terms for the complex mixing. The NCO block diagram is shown in Figure 64.
48
16
48
48
Accumulator
48
16
16
Frequency
Register
sin
Look Up
Table
16
CLK RESET
cos
16
FDAC
NCO SYNC
via
syncsel_NCO(3:0)
Phase
Register
Figure 64. NCO Block Diagram
Synchronization of the NCOs occurs by resetting the NCO accumulators to zero. The synchronization source is
selected by fields SYNCSEL_NCOAB and SYNCSEL_NCOCD in register SYNCSEL1 (8.5.29). The frequency
word in the FREQ_NCOAB and FREQ_NCOCD registers are added to the accumulators every clock cycle, fDAC.
The frequency and phase offset of the NCOs are:
fNCOAB or CD
/ AB or CD
FREQ _ NCOAB or CD u fDAC
2Πu
248
(1)
PHASE _ NCOAB or CD
216
(2)
Treating the complex channels as complex vectors of the form I + j Q, the output of the DQM is:
Output AB
OutputCD
^IINPUTAB u cos
^IINPUTCD u cos
2ŒINCOABW
2ŒINCOCDW
/AB
/CD
4INPUTAB u VLQ 2ŒINCOABW
4INPUTCD u VLQ 2ŒINCOCDW
/AB
` u 2 MIXERAB _ GAIN
/CD ` u 2
1
(3)
MIXERCD _ GAIN 1
(4)
Where t is the time since the last resetting of the NCO accumulator and the fields MIXERAB_GAIN and
MIXERCD_GAIN in register MULTIDUC_CFG2 (8.5.13) are either 0 or 1.
The maximum output amplitude of the DQM occurs if IIN(t) and QIN(t) are simultaneously full scale amplitude and
the sine and cosine arguments are equal to an integer multiple of π/4.
With MIXERAB_GAIN or MIXERCD_GAIN = 0, the gain through the DQM is sqrt(2)/2 or -3 dB. This loss in signal
power is in most cases undesirable, and it is recommended that the gain function be used to increase the signal
by 3 dB to compensate. With MIXERAB_GAIN or MIXERCD_GAIN = 1, the gain through the DQM is sqrt(2) or
+3 dB, which can cause clipping of the signal if IIN(t) and QIN(t) are simultaneously near full scale amplitude and
should therefore be used with caution.
8.3.17.5 Low Power Coarse Resolution Mixing Modes
In addition to the NCO the DAC38RFxx also has a coarse mixer block capable of shifting the input signal
spectrum by the fixed mixing frequencies ±N x fDAC/8. Using the coarse mixer instead of the full mixers will result
in lower power consumption.
Treating the two complex channels as complex vectors of the form I(t) + j Q(t), the outputs of the coarse mixer is
equivalent to:
62
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Output AB
IINPUTAB u cos 2ŒICMIX _ ABW
4INPUTAB u VLQ 2ŒICMIX _ ABW
(5)
OutputCD
IINPUTCD u cos 2ŒICMIX _ CDW
4INPUTCD u VLQ 2ŒICMIX _ CDW
(6)
Where fCMIX_AB and fCMIX_CD and the fixed mixing frequency selected by fields CMIX_AB or CMIX_CD in register
CMIX (8.5.21). The coarse mixer blocks are disabled by setting CMIX_AB and CMIX_CD to 0x0.
The NCO and coarse mixers can be enabled simultaneously, although this is not useful in most cases as the full
frequency range can be covered by the NCO.
8.3.17.6 Inverse Sinc Filter
The DAC38RFxx have a 9-tap inverse Sinc filter (INVSINC) that runs at the DAC update rate (fDAC) that can be
used to flatten the frequency response of the sample-and-hold output. The DAC sample-and-hold output sets the
output current and holds it constant for one DAC clock cycle until the next sample, resulting in the well known
sin(x)/x or Sinc(x) frequency response (Figure 65, red line). The inverse sinc filter response (Figure 65, blue line)
has the opposite frequency response from 0 to 0.4 x fDAC, resulting in the combined response (Figure 65, green
line). Between 0 to 0.4 x fDAC, the inverse sinc filter compensates the sample-and-hold roll-off with less than 0.03
dB error.
The inverse sinc filter has a gain > 1 at all frequencies. Therefore, the signal input to INVSINC must be reduced
from full scale to prevent saturation in the filter. The amount of back-off required depends on the signal
frequency, andis set such that at the signal frequencies the combination of the input signal and filter response is
less than 1 (0 dB). For example, if the signal input to INVSINC is at 0.25 x fDAC, the response of INVSINC is 0.9
dB, and the signal must be backed off from full scale by 0.9 dB to avoid saturation. The advantage of INVSINC
having a positive gain at all frequencies is that the user is then able to optimize the back-off of the signal based
on its frequency.
The inverse Sinc filters are enabled by fields ISFIRAB_ENA and ISFIRCD_ENA in register MULTIDUC_CFG1
(9.5.9).
4
3
FIR4
Magnitude (dB)
2
1
Corrected
0
–1
–2
sin(x)/x
–3
–4
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
0.5
f/fDAC
G056
Figure 65. Composite Magnitude Spectrum for INVSINC
8.3.17.7 Summation Block for Dual DUC Modes
When using the dual DUC modes, the outputs of the two AQM blocks are summed together to form a composite
signal for the DAC output, configured by field OUTSUM_SEL in register OUTSUM (8.5.22). The input signals to
the DUCs much be scaled such that the signal does not exceed fullscale during summation. This field can also
be configures to add the signals from the adjacent multi-DUC to enable a four DUC signal.
8.3.18 PA Protection Block
The DAC38RFxx incorporates an optional power amplifier protection (PAP) block to monitor when the input
signal is two large, for example when an interface error occurs, and reduces the output signal power of the DAC.
The PAP block achieves the functionality of reducing the input signal that crosses the threshold through three
main sub-blocks. These are PAP trigger generation block, PAP gain state machine and GAIN block.
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The PAP block keeps track of the input signal power by maintaining a sliding window accumulation of last N
samples. N is selectable to be 32, 64 or 128 based on the setting (Table 38) of fields PAPAB_SEL_DLY in
register PAP_CFG_AB (8.5.35) and PAPCD_SEL_DLY in register PAP_CFG_CD (8.5.36). The average
amplitude of input signal is computed by dividing accumulated value by the number of samples in the delay-line
(N). The result is then compared against the threshold in fields PAPAB_THRESH in register PAP_CFG_AB
(8.5.35) and PAPCD_THRESH in register PAP_CFG_CD (8.5.36). If the threshold is violated, gain state machine
is triggered which generated gain value to ramp down the DAC output signal amplitude. After the input signal
returns to normal value, the state machine ramps up the DAC output signal amplitude.
Table 38. PAP Delay Line Selection
pap_sel_dly[1:0]
# of samples averaged
00
32
01
64
10
128
11
Reserved
The generation of the PAP trigger as explained as follows:
• The I and Q samples are treated separately – either can trigger attenuation
• In dual DUC modes, each IQ pair is treated separately and has a separate gain block
• 8 samples at the input are put through an absolute value circuit (all 2’s complement)
• Next these values are vector summed to get a 12 bit result
• Then 12 bit result is placed into the delay line and summed into the accumulator
• The accumulator is also subtracting out the delayed 12 bit word corresponding to N = 32, N = 64 or N = 128
• Finally the accumulator output is divided down by N and rounded to 13 bits. These 13 bits are compared to
the threshold in the SPI registers. A pap_trig occurs if the threshold is exceeded.
The PAP gain state machine generates the pap gain value to be applied on the output stream to reduce the
output signal amplitude. The state machine below is used to control the attenuation of the DAC output and the
gaining up of the signal again once the trigger is released.
Figure 66. PAP Gain State Machine
The normal operating condition for the PAP block is the NORMAL state in Figure 66. However, when the PAP
block detects an error condition it sets the pap_trig signal to ‘1’ causing a state transition from NORMAL
operation to the ATTENUATE state.
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In the ATTENUTATE state the data path gain is scaled from 1.0 down to 0.0 by a programmable step amount set
by fields PAPAB_GAIN_STEP in register PAP_GAIN_AB (8.5.35) and PAPCD_GAIN_STEP in register
PAP_GAIN_CD (8.5.33). This value is always positive with the decimal place located between the MSB and
MSB-1. Unity is equal to “1000000000”. Each clock cycle (16 samples) the PAP_GAIN is stepped down by
PAPAB_GAIN_STEP and PAPCD_GAIN_STEP until the gain is 0.
After PAP_GAIN is 0, the state machine moves on to the WAIT state. Here a programmable counter counts clock
cycles to allow the condition for the pap_trig to be fixed. Fields PAPAB_WAIT in register PAP_WAIT_AB (8.5.32)
and PAPCD_WAIT in register PAP_WAIT_CD (8.5.34) are used to select the number of clock cycles (samples =
16 x PAPAB_WAIT or 16 x PAPCD_WAIT) to wait before moving to the next state. Once the WAIT counter
equals zero and pap_trig=’0’, the state machine moves on to the GAIN state. If the WAIT equals 0 but pap_trig
still equals ‘1’ then the state machine stays in the WAIT state until pap_trig =’0’.
8.3.19 Gain Block
The GAIN block also has additional output gain control through fields GAINAB in register GAINAB (8.5.35) and
GAINCD in register GAINCD (8.5.40). Similar to PAP_GAIN value, the output gain is always positive with unity
when GAINAB or GAINCD = ”010000000000”.
To reduce the power the gain block clock has been gated whenever the pap is disabled and GAINAB or GAINCD
is set to unity.
8.3.20 Output Summation
The OUTSUM block allows addition of samples from each DUC in the multi-DUC. It is also possible to add the
output samples from the adjacent multi-DUC. Field OUTSUM_SEL in register OUTSUM (8.5.22) controls the
summation for each multi-DUC. The functionality of the block can be represented by the following equation:
OUTSUMoutput
SAME AB
SAMECD
ADJ AB
ADJCD
(7)
In order to avoid overflow, rounding operation is performed after the addition to reduce the word size back to 16bits. Exact number of bits rounded depends on the number of channels added. Table 39 shows the description of
round after the summation.
Table 39. OUTSUM Scaling and Rounding
# OF CHANNELS ADDED
# OF BITS ROUNDED
0
0, Use bits[15:0] from the result
1
Use bits[16:1] from the result and bit[0] used for rounding
2
Use bits[17:2] from the result and bits[1:0] used for rounding
3
Use bits[18:3] from the result and bit[2:0 used for rounding
4
Use bits[19:4] from the result and bit[3:0] used for rounding
8.3.21 Output Delay
The signal following output summation can be programmably delayed by 0-15 DACCLK cycles through field
OUTPUT_DELAY in register OUTSUM (8.5.20). The block takes 16 sample words (vec16) from both the A and B
paths and shifts the them to 32 sample long delay line.
8.3.22 Polarity Inversion
The signal following the output delay can be inverted by a 2’s complement conversion allowing the + and - DAC
outputs to be swapped by asserting field DAC_COMPLEMENT in register MULTIDUC_CFG1 (8.5.13).
8.3.23 Temperature Sensor
The DAC38RFxx incorporates a temperature sensor block which monitors the die temperature by measuring the
voltage across 2 transistors. The voltage is converted to an 8-bit digital word using a successive approximation
(SAR) analog to digital conversion process. The result is scaled, limited and formatted as a twos complement
value representing the temperature in degrees Celsius.
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The sampling is controlled by the serial interface signals SDEN and SCLK. If the temperature sensor is enabled
by writing a 0 to field TSENSE_SLEEP in register SLEEP_CONFIG (8.5.70), a conversion takes place each time
the serial port is written or read. The data is only read and sent out by the digital block when the temperature
sensor is read in field TEMPDATA in register TEMP_PLLVOLT (8.5.7). The conversion uses the first eight clocks
of the serial clock as the capture and conversion clock, the data is valid on the falling eighth SCLK. The data is
then clocked out of the chip on the rising edge of the ninth SCLK. No other clocks to the chip are necessary for
the temperature sensor operation. As a result the temperature sensor is enabled even when the device is in
sleep mode.
In order for the process described above to operate properly, the serial port read from register TEMP_PLLVOLT
must be done with an SCLK period of at least 1 μs. If this is not satisfied the temperature sensor accuracy is
greatly reduced.
8.3.24 Alarm Monitoring
The DAC38RFxx includes a flexible set of alarm monitoring that can be used to alert of a possible malfunction
scenario. All the alarm events can be accessed either through the SIP registers and/or through the ALARM
output. Once an alarm is set, the corresponding alarm bit must be reset through the serial interface to allow
further testing. The set of alarms includes the following conditions:
• JESD alarms
– Fields ALM_LANEx_ERR in registers JESD_ALM_Lx (x = 0-7, 8.5.59 to 8.5.66):
– multiframe alignment_error. Occurs when multiframe alignment fails
– frame alignment error. Occurs when multiframe alignment fails
– link configuration error. Occurs when there is wrong link configuration
– elastic buffer overflow. Occurs when bad RBD value is used
– elastic buffer match error. Occurs when the first non-/K/ doesn’t match the programmed data
– code synchronization error
– 8b/10b not-in-table decode error
– 8b/10b disparity error
– Field ALM_FROM_SHORTTEST in register ALM_SYSREF_PAP (8.5.67): Occurs when the short pattern
test fails.
• SerDes alarms
– Field ALM_SD_LOTDET in register ALM_SD_DET 8.5.5): Occurs when there are loss of signal detect
from Serdes lanes.
– Fields ALM_FIFOx_FLAGS in registers JESD_ALM_Lx (x = 0-7, 8.5.59 to 8.5.66):
– FIFO write error. Occurs if write request and FIFO is full.
– FIFO write full: Occurs if FIFO is full.
– FIFO read error. Occurs if read request and FIFO is empty.
– FIFO read empty: Occurs if FIFO is empty.
– Field ALM_SD0_PLL in register ALM_SYSREF_DET (8.5.6): Occurs if the PLL in the Serdes block 0 goes
out of lock.
– Field ALM_SD1_PLL in register ALM_SYSREF_DET (8.5.6): Occurs if the PLL in the Serdes block 1 goes
out of lock.
• SYSREF alarm
– Field ALM_SYSREF_ERR in register ALM_SYSREF_PAP (8.5.67): Occurs when the SYSREF is received
at an unexpected time. If too many of these occur it will cause the JESD to go into synchronization mode
again.
• DAC PLL alarm
– Field PLL_LOCK in register ALM_SYSREF_DET (8.5.6). This register field is asserted when the PLL is
locked. When used as an alarm output, this is inverted so a high signal indicated that the PLL is unlocked.
• PAP alarm
– Field ALM_PAP in register ALM_SYSREF_PAP (8.5.67): Occurs when the average power is above the
threshold. While any alarm_pap is asserted the attenuation for the appropriate data path is applied.
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8.3.25 Differential Clock Inputs
Figure 67 shows the preferred configuration for driving the DACCLK+/- and SYSREF+/- with a differential
ECL/PECL source.
LVPCL Driver
0.01 mF
CAC
100 W
0.01 mF
240 W
240 W
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Figure 67. Preferred Clock Input Configuration With a Differential ECL/PECL Clock Source
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8.3.26 CMOS Digital Inputs
Figure 68 shows a schematic of the equivalent CMOS digital inputs of the DAC38RFxx. SDIO, SCLK, TCLK,
SLEEP, TESTMODE and TXENABLE have internal pull-down resistors while SDEN, RESET, TMS, TDI and
TRST have internal pull-up resistors. See the Specifications table for logic thresholds. The pull-up and pull-down
circuitry is approximately equivalent to 10 kΩ.
VDDIO18
VDDIO18
10 k
SDIO
SCLK
TCLK
SLEEP
TXENABLE
TESTMODE
400
internal
digital in
SDENB
RESETB
TMS
TDI
TRSTB
400
internal
digital in
10 k
GND
GND
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Figure 68. CMOS Digital Equivalent Input
8.3.27 DAC Fullscale Output Current
The DAC38RFxx uses a bandgap reference and control amplifier for biasing the full-scale output current. The
DAC full scale output current is set by a combination of the fixed current through the external resistor RBIAS
(connected to pin BIASJ) and current from course trim current sources:
IOUTFS
IRBIAS
Icoarsetrim
(8)
The bias current IBIAS through resistor RBIAS is defined by the on-chip bandgap reference voltage VBG (nominally
0.9 V) and control amplifier. For normal operation, it is recommended that RBIAS is set to 3.6 kΩ for a fixed
current through RBIAS of 250 µA. This current is scaled 128x internally, giving:
IRBIAS
128 u
VBG
RBIAS
128 u
0.9V
3.6 k
32 mA
(9)
The course trim current sources are configured through SPI register field DACFS in register DACFS (9.5.69),as
follows:
I coarsetrim = 2mA × DACFS - 11
(10)
From the discussion above, the DAC full scale output current can be configured from 40 mA (DACFS[3:0] =
1111) down to 10 mA (DACFS[3:0] = 0000).
An external decoupling capacitor CEXT of 0.1 μF should be connected externally to terminal EXTIO for
compensation. RBIAS of 3.6 kΩ is recommended for setting the full-scale output current.
8.3.28 Current Steering DAC Architecture
The DACs in the DAC38RFxx consist of a segmented array of NMOS current sources, capable of sinking a fullscale output current up to 40 mA (see Figure 69). Differential current switches direct the current to either one of
the complimentary output nodes VOUT1/2+ or VOUT1/2-. On the DAC38RF80/90/84 with integrated balun, these
nodes are internal to the device. Complimentary output currents enable differential operation, thus canceling out
common mode noise sources (digital feed-through, on-chip and PCB noise), dc offsets, even order distortion
components, and increasing signal output power by a factor of four.
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VDDOUT18
Zext+
Zext-
VOUT1/2+
VOUT1/2-
100 :
IOUT+
IOUT-
VDEE18N
(-1.8V)
Figure 69. Current Steering DAC Architecture for DAC38RF83/93/85
Referring to Figure 69, the total output current IOUTFS is fixed, and is switched to either the + or – output by
switches S(N):
IOUTFS
IOUT +
IOUT-
(11)
Since the output stage is a current sinking architecture, we will denote current into the DAC as + current, and the
current flows IOUT+ and IOUT- into terminals VOUT1/2+ and VOUT1/2- respectively. IOUT+ and IOUT- can be
expressed as:
IOUT+
IOUT-
IOUTFS u CODE
16384
(12)
IOUTFS u 16383 CODE
16384
(13)
where CODE is the decimal representation of the 14-bit DAC core data input word. Note the signal path up to the
DAC is 16-bits and the 2 LSBs are truncated for the DAC core data input word.
8.3.29 DAC Transfer Function for DAC38RF83, 93, 85
The DAC38RF83/93/85 has a differential output and is terminated internally with a differential 100-Ω load. The
DAC38RF83/93/85 output compliance range is 1.3 to 2.3 V. Note that care should be taken not to exceed the
compliance voltages at node VOUT1/2+ and VOUT1/2-, which would lead to increased signal distortion.
Referring again toFigure 69, denote the external impedance as seen by VOUT1/2+ as Zext+ and by VOUT1/2as Zext-. Note that Zext+ and Zext- should terminate to VDDOUT18 to supply the output current for the DAC.
Also, Zext+ and Zext- are ideally identical to maintain the differential balance of the output. The voltage at nodes
VOUT1/2+ and VOUT1/2- generated by the current flow through the impedance is
VOUT 1/ 2
IOUT + u 100
Zext +
u Zext +
Zext + Zext 100
VOUT 1/ 2
IOUT - u 100
Zext u Zext +
100
Zext + Zext -
IOUT - uZext u Zext +
Zext + Zext -
(14)
IOUT + uZext +
u Zext Zext + Zext -
(15)
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The DAC38RF83/93/85 can be easily configured to drive a doubly terminated 50-Ω cable using a properly
selected 2:1 RF transformer (Figure 70). Note that the center tap of the primary input of the transformer has to
be connected to the VDDOUT18 supply (nominally 1.8 V) to enable a DC current flow into the DAC. The AC load
impedance as seen through 2:1 transformer is 100 Ω, which is split equally into Zext+ = Zext- = 50 Ω. The DC
impedance for the transformer is a short to the center tap of the transformer, which drives the common mode of
VOUT1/2+ and VOUT1/2- to 1.8V. To calculate the peak to peak output swing VOUT1/2PP at each node, the
equations above simplify to:
VOUT 1/ 2PP
VOUT 1/ 2
VOUT 1/ 2PP
IOUTFS u 50 u
200
IOUT+ IOUTFS,IOUT
IOUTFS u
0
VOUT 1/ 2
u
IOUT- IOUTFS ,IOUT+ 0
(16)
IOUTFS u 25
(17)
With IOUTFS = 40 mA, the swing becomes 1 VPP at each node. With the common mode at 1.8 V due to the
center tap, the voltage at VOUT1/2+ and VOUT1/2- varies between 1.3 and 2.3 V, which is the compliance range
of the DAC.
The differential output swing is 2x VOUT1/2PP, or 2 VPPDIFF. On the load side of the transformer, this reduces to
1.414 VPP, for a transferred load power of 7 dBm (assuming no loss).
VOUT1/2+
2:1
RLOAD
100 :
50 :
VOUT1/2VDDADAC18
(1.8V)
Figure 70. Driving a 50-Ω Load Using a 2:1 Impedance Ratio Transformer (DAC38RF83/93/85)
The DAC38RF83/93/85 can also be DC coupled. In this case, the termination voltage can be raised above 1.8 V
(for example 2.3 V) so that the common mode for the output pin is nominally 1.8 V.
8.3.30 DAC Transfer Function for DAC38RF80/90/84
The DAC38RF80/90/84 has an wide bandwidth integrated balun (nominally 700 MHz to 3.8 GHz passband) to
convert the DAC core differential signal to a single ended signal. The single ended output is expected to drive a
50-Ω load (see Figure 71). With a fullscale current of 40 mA, after the loss in the balun, the expected output
power of a fullscale tone into 50 Ω is approximately 2 dBm.
VOUT1/2
RLOAD
50 :
Figure 71. Driving a 50-Ω Load (DAC38RF80/90/84)
8.4 Device Functional Modes
8.4.1 Clocking Modes
The DAC38RFxx has both a single ended clock input DACCLKSE and a differential clock input DACCLK+/- to
clock the device. The clock input is selected by field SEL_EXTCLK_DIFFSE in register CLK_PLL_CFG (8.5.79).
The DAC38RFxx can be clocked directly with a high frequency input clock at the DAC sample rate (PLL Bypass
Mode), or an optional on-chip low-jitter phase-locked loop (PLL) can be used to generate the high frequency
DAC sample clock internally from a lower frequency reference clock input (PLL Mode).
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Device Functional Modes (continued)
8.4.2 PLL Bypass Mode Programming
In PLL bypass mode a high quality clock is sourced to the DACCLK inputs. This clock is used to directly clock
the DAC38RFxx DAC cores. This mode gives the device best performance and is recommended for extremely
demanding applications.
The bypass mode is selected by setting the following:
1. Set field PLL_ENA in register CLK_PLL_CFG (8.5.79) to “0” to bypass the PLL circuitry.
2. Set field PLL_SLEEP in register SLEEP_CONFIG (8.5.70) to “1” to put the PLL and VCO into sleep mode.
8.4.3 Internal PLL/VCO
The DAC38RFxx has an internal clock generation circuit consisting of a PLL and two selectable VCOs, as shown
in Figure 72.
High VCO
yN
PFD
and
charge pump
Output
buffer
DAC
CLK
PLL_N(4-0)
Feedback
Low VCO
yM
y4
PLL_M(7-0)
Figure 72. Internal PLL/VCO Block Diagram
The low VCO is tuned to a target center frequency of 5.9 GHz, and the high VCO is tuned to a target center
frequency of 8.85 GHz. The VCO is selected through field PLL_VCOSEL in register PLL_CONFIG2 (8.5.81), with
‘0’ selecting the low VCO and a ‘1’ the high VCO. The 7 bit VCO tuning code in field PLL_VCO in register
PLL_CONFIG2 (8.5.81) is used to tune the VCO frequency in the range of 5.24 GHz to 6.72 GHz for low VCO
and 7.96 GHz to 9.0 GHz for the high VCO. For the low VCO the center VCO frequency is achieved with
PLL_VCO = 63decimal and for the high VCO the target VCO center frequency is achieved with PLL_VCO =
63decimal.
The supply current, and therefore; the analog signal amplitude in the VCO is controlled using the field
PLL_VCO_RDAC in register PLL_CONFIG1 (8.5.80). This control signal should be set 15decimal initially for 18 mA
supply current in the VCO and ~1.4 VPP single ended oscillation amplitude.
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Device Functional Modes (continued)
The PLL has no prescaler, so the DAC sample rate is the VCO frequency. In the PLL feedback path a fixed ÷ 4
frequency divider block receives the VCO output clock and divides its frequency by 4. The maximum operating
frequency of the phase-frequency detector (PFD) is approximately 550 MHz. The M (feedback) clock divider
takes the output clock signal from the fixed ÷4 block and divides it by a programmable ratio set by the 8-bit field
in field PLL_M_M1 in register PLL_CONFIG1 (8.5.80). The programmable division ratio range is ÷1 to ÷256, and
is the value of the 8 bit unsigned binary code + 1. Although it is possible to program the M divider to ÷1, ÷2 and
÷3, these values should not be used. As stated previously the PFD and CP have a finite maximum operating
frequency, which is the VCO frequency divided by the fixed divider ratio multiplied by the minimum allowable M
divider ratio.
PFD _ CPFmax
Fvco / Fixed _ div x Mdiv min
(18)
The N (reference) divider determines the ratio between the input reference clock frequency and the PFD
operating frequency, and is set by the 5-bit field PLL_N_M1 in register CLK_PLL_CFG (8.5.79). The division ratio
range is ÷1 to ÷32, and is the value of the 5-bit unsigned binary code + 1.
The charge pump output current amplitude is set using the 4-bit field PLL_CP_ADJ in in register PLL_CONFIG2
(8.5.81). The current amplitude is simply the digital code multiplied by the unit current amplitude of 100 µA. In a
nominal condition, with the LF VCO running at 5.898 GHz, and with the M divider set to ÷4, the PFD will run at
368.625 MHz, and the change pump current should set to 6decimal, which gives 600 µA charge pump output
current for a good phase margin of 69 degrees. If a higher M ratio (for lower PFD frequencies) are required the
charge pump output current must be increased to maintain good loop stability and prevent excessive peaking in
the phase noise response. The charge pump output current setting PLL_CP_ADJ should be adjusted in relation
to the feedback (M) divider ratio PLL_M_M1 according to the following table to maintain a constant phase margin
of 69 degrees.
Table 40. M vs Kp for Maintaining Good Stability
M
CP_ADJ
4
6
6
9
8
12
10
15
Similarly for the HF VCO running at 8.847 GHz, and with the M divider set to ÷4, the PFD will run at 552.9375
MHz as shown above. Here the change pump current should set to 6decimal, which gives 600 µA charge pump
output current for a good phase margin of 69 degrees.
8.4.4 CLKOUT
The DAC38RFxx has a programmable output clock on CLKTX+/- balls that is a divided version of the internal
DAC sample clock, either with or without PLL. Two frequency dividers, either DACCLK/3 or DACCLK/4, are
available by programming field CLK_TX_DIV4 in register CLK_OUT (8.5.71). The output swing voltage is
programmable from approximately 125 to 1460 mVPP-DIFF through field CLK_TX_SWING in register CLK_OUT
(8.5.71).
Field CLK_TX_IDLE in register CLK_OUT (8.5.71) enables an idle state, in which the pins are driven to the
proper common-mode levels in order to charge the external AC coupling caps but the clock output is disabled.
The output clock circuit can be put to sleep by field CLK_TX_SLEEP in register SLEEP_CONFIG (8.5.70).
8.4.5 Serial Peripheral Interface (SPI)
The serial port of the DAC38RFxx is a flexible serial interface which communicates with industry standard
microprocessors and microcontrollers. The interface provides read/write access to all registers used to define the
operating modes of DAC38RFxx. It is compatible with most synchronous transfer formats and can be configured
as a 3 or 4 terminal interface by SIF4_ENA in register IO_CONFIG (8.5.2). In both configurations, SCLK is the
serial interface input clock and SDEN is serial interface enable. For 3 terminal configuration, SDIO is a
bidirectional terminal for both data in and data out. For 4 terminal configuration, SDIO is bidirectional and SDO is
data out only. Data is input into the device with the rising edge of SCLK. Data is output from the device on the
falling edge of SCLK.
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The SPI registers are reset by writing a 1 to SPI_RESET in register RESET_CONFIG (8.5.1).
Each read/write operation is framed by signal SDEN (Serial Data Enable Bar) asserted low. The first frame byte
is the instruction cycle which identifies the following data transfer cycle as read or write as well as the 7-bit
address to be accessed. Figure 73 indicates the function of each bit in the instruction cycle and is followed by a
detailed description of each bit. The data transfer cycle consists of two bytes.
Figure 73. Instruction Byte of the Serial Interface
Bit
Description
7 (MSB)
R/W
6
A6
5
A5
4
A4
3
A3
2
A2
1
A1
0
A0
R/W - Identifies the following data transfer cycle as a read or write operation. A high indicates a read operation from DAC38RFxx and a low
indicates a write operation to DAC38RFxx
A6:A0 - Identifies the address of the register to be accessed during the read or write operation.
Figure 74 shows the serial interface timing diagram for a DAC38RFxx write operation. SCLK is the serial
interface clock input to DAC38RFxx. Serial data enable SDEN is an active low input to DAC38RFxx. SDIO is
serial data input. Input data to DAC38RFxx is clocked on the rising edges of SCLK.
Instruction Cycle
Data Transfer Cycle
SDEN\
SCLK
SDIO
rwb
A6
A5
A4
A3
A2
tS(SDEN\)
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
tSCLK
SDEN\
SCLK
SDIO
tS(SDIO) tH(SDIO)
Figure 74. Serial Interface Write Timing Diagram
Figure 75 shows the serial interface timing diagram for a DAC38RFxx read operation. SCLK is the serial
interface clock input to DAC38RFxx. Serial data enable SDEN\ is an active low input to DAC38RFxx. SDIO is
serial data input during the instruction cycle. In 3 pin configuration, SDIO is data out from the DAC38RFxx during
the data transfer cycle, while SDO is in a high-impedance state. In 4 pin configuration, both SDIO and SDO are
data out from the DAC38RFxx during the data transfer cycle. At the end of the data transfer, SDIO and SDO will
output low on the final falling edge of SCLK until the rising edge of SDEN when they will 3-state.
Instruction Cycle
Data Transfer Cycle
SDEN\
SCLK
SDIO
rwb
A6
A5
A4
A3
A2
A1
A0
SDO
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
SDEN\
SCLK
SDIO
SDO
Data n
Data n-1
td(Data)
Figure 75. Serial Interface Read Timing Diagram
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n the SIF interface there are four types of registers:
8.4.5.1 NORMAL (RW)
The NORMAL register type allows data to be written and read from. All 16-bits of the data are registered at the
same time. There is no synchronizing with an internal clock thus all register writes are asynchronous with respect
to internal clocks. There are three subtypes of NORMAL:
1. AUTOSYNC: A NORMAL register that causes a sync to be generated after the write is finished. These are
used when it is desirable to synchronize the block after writing the register or for a single field that spans
across multiple registers. For instance, the NCO requires three 16-bit register writes to set the frequency.
Upon writing the last of these registers an autosync is generated to deliver the entire field to the NCO block
at once, rather than in pieces after each individual register write. For a field that spans multiple registers, all
non-AUTOSYNC registers for the field must be written first before the actual AUTOSYNC register.
2. No RESET Value: These are NORMAL registers, but the reset value cannot be specified. This could be
because the register has some read_only bits or some internal logic partially controls the bit values.
3. READ_ONLY (R): Registers that can only be read.
8.4.5.2 WRITE_TO_CLEAR (W0C)
These registers are just like NORMAL registers with one exception. They can be written and read, however,
when the internal logic asynchronously sets a bit high in one of these registers, that bit stays high until it is
written to ‘0’. This way interrupts will be captured and stay constant until cleared by the user.
8.5 Register Maps
Table 41. Register Summary
Address
Reset
Acronym
Register Name
Section
General Configuration Registers (PAGE_SET[2:0] = 000)
0x00
0x5803
RESET_CONFIG
Chip Reset and Configuration
8.5.1
0x01
0x1800
IO_CONFIG
IO Configuration
8.5.2
0x02
0xFFFF
ALM_SD_MASK
Lane Signal Detect Alarm Mask
8.5.3
0x03
0xFFFF
ALM_CLK_MASK
Clock Alarms Mask
8.5.4
0x04
0x0000
ALM_SD_DET
SERDES Loss of Signal Detection Alarms
8.5.5
0x05
0x0000
ALM_SYSREF_DET
SYSREF Alignment Circuit Alarms
8.5.6
0x06
variable
TEMP_PLLVOLT
Temperature Sensor and PLL Loop Voltage
8.5.7
0x07-0x08
0x0000
Reserved
Reserved
0x09
0x0000
PAGE_SET
Page Set
0x0A-0x77
0x0000
Reserved
Reserved
0x78
0x0000
SYSREF_ALIGN_R
SYSERF Align to r1 and r3 Count
8.5.9
0x79
0x0000
SYSREF12_CNT
SYSREF Phase Count 1 and 2
8.5.10
8.5.11
0x7A
0x0000
SYSREF34_CNT
SYSREF Phase Count 3 and 4
0x7B-0x7E
0x0000
Reserved
Reserved
0x7F
0x0008
VENDOR_VER
Vendor ID and Chip Version
8.5.8
8.5.12
Multi-DUC Configuration Registers (PAGE_SET[0] = 1 for multi-DUC1, PAGE_SET[1] = 1 for multi-DUC2)
74
0x0A
0x02B0
MULTIDUC_CFG1
Multi-DUC Configuration (PAP, Interpolation)
0x0B
0x0000
Reserved
Reserved
0x0C
0x2402
MULTIDUC_CFG2
Multi-DUC Configuration (Mixers)
8.5.14
0x0D
0x8300
JESD_FIFO
JESD FIFO Control
8.5.15
0x0E
0x00FF
ALM_MASK1
Alarm Mask 1
8.5.16
0x0F
0x1F83
ALM_MASK2
Alarm Mask 2
8.5.17
0x10
0xFFFF
ALM_MASK3
Alarm Mask 3
8.5.18
0x11
0xFFFF
ALM_MASK4
Alarm Mask 4
8.5.19
0x12
0x0000
JESD_LN_SKEW
JESD Lane Skew
8.5.20
0x13-0x16
0x0000
Reserved
Reserved
0x17
0x0000
CMIX
CMIX Configuration
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8.5.21
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Register Maps (continued)
Table 41. Register Summary (continued)
Address
Reset
Acronym
Register Name
0x18
0x0000
Reserved
Reserved
Section
0x19
0x0000
OUTSUM
Output Summation and Delay
0x1A-0x1B
0x0000
Reserved
Reserved
8.5.22
0x1C
0x0000
PHASE_NCOAB
Phase offset for AB path NCO
8.5.23
0x1D
0x0000
PHASE_NCOCD
Phase offset for CD path NCO
8.5.24
0x1E-0x20
0x0000
FREQ_NCOAB
Frequency for AB path NCO
8.5.25
0x21-0x23
0x0000
FREQ_NCOCD
Frequency for CD path NCO
8.5.26
0x24
0x0010
SYSREF_CLKDIV
SYSREF Use for Clock Divider
8.5.27
0x25
0x7700
SERDES_CLK
Serdes Clock Control
8.5.28
0x26
0x0000
Reserved
Reserved
0x27
0x1144
SYNCSEL1
Sync Source Selection
8.5.29
0x28
0x0000
SYNCSEL2
Sync Source Selection
8.5.30
0x29
0x0000
PAP_GAIN_AB
PAP path AB Gain Attenuation Step
8.5.31
0x2A
0x0000
PAP_WAIT_AB
PAP path AB Wait Time at Gain = 0
8.5.32
0x2B
0x0000
PAP_GAIN_CD
PAP path CD Gain Attenuation Step
8.5.33
0x2C
0x0000
PAP_WAIT_CD
PAP path CD Wait Time at Gain = 0
8.5.34
0x2D
0x1FFF
PAP_CFG_AB
PAP path AB Configuration
8.5.35
0x2E
0x1FFF
PAP_CFG_CD
PAP path CD Configuration
8.5.36
0x2F
0x0000
SPIDAC_TEST1
Configuration for DAC SPI Constant
8.5.37
0x30
0x0000
SPIDAC_TEST2
DAC SPI Constant
8.5.38
0x31
0x0000
Reserved
Reserved
0x32
0x0800
GAINAB
Gain for path AB
8.5.39
0x33
0x0800
GAINCD
Gain for path CD
8.5.40
0x34-0x40
0x0000
Reserved
Reserved
0x41
0x0000
JESD_ERR_CNT
JESD Error Counter
0x42-0x45
0x0000
Reserved
Reserved
0x46
0x0044
JESD_ID1
JESD ID 1
8.5.42
0x47
0x190A
JESD_ID2
JESD ID 2
8.5.43
0x48
0x31C3
JESD_ID3
JESD ID 3 and Subclass
8.5.44
0x49
0x0000
Reserved
Reserved
0x4A
0x0003
JESD_LN_EN
JESD Lane Enable
8.5.45
0x4B
0x1300
JESD_RBD_F
JESD RBD Buffer and Frame Octets
8.5.46
0x4C
0x1303
JESD_K_L
JESD K and L Parameters
8.5.47
0x4D
0x0100
JESD_M_S
JESD M and S Parameters
8.5.48
0x4E
0x0F4F
JESD_N_HD_SCR
JESD N, HD and SCR Parameters
8.5.49
0x4F
0x1CC1
JESD_MATCH
JESD Character Match and Other
8.5.50
8.5.41
0x50
0x0000
JESD_LINK_CFG
JESD Link Configuration Data
8.5.51
0x51
0x00FF
JESD_SYNC_REQ
JESD Sync Request
8.5.52
0x52
0x00FF
JESD_ERR_OUT
JESD Error Output
8.5.53
8.5.54
8.5.55
0x53
0x0100
JESD_ILA_CFG1
JESD Configuration Value used for ILA
Check
0x54
0x8E60
JESD_ILA_CFG2
JESD Configuration Value used for ILA
Check
0x55-0x5B
0x0000
Reserved
Reserved
0x5C
0x0001
JESD_SYSR_MODE
JESD SYSREF Mode
0x5D-0x5E
0x0000
Reserved
Reserved
0x5F
0x0123
JESD_CROSSBAR1
JESD Crossbar Configuration 1
8.5.57
0x60
0x4567
JESD_CROSSBAR2
JESD Crossbar Configuration 2
8.5.58
0x61-0x63
0x0000
Reserved
Reserved
0x64
0x0000
JESD_ALM_L0
JESD Alarms for Lane 0
8.5.56
8.5.59
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Register Maps (continued)
Table 41. Register Summary (continued)
Address
Reset
Acronym
Register Name
Section
0x65
0x0000
JESD_ ALM_L1
JESD Alarms for Lane 1
8.5.60
0x66
0x0000
JESD_ ALM_L2
JESD Alarms for Lane 2
8.5.61
0x67
0x0000
JESD_ALM_L3
JESD Alarms for Lane 3
8.5.62
0x68
0x0000
JESD_ALM_L4
JESD Alarms for Lane 4
8.5.63
0x69
0x0000
JESD_ALM_L5
JESD Alarms for Lane 5
8.5.64
0x6A
0x0000
JESD_ALM_L6
JESD Alarms for Lane 6
8.5.65
0x6B
0x0000
JESD_ALM_L7
JESD Alarms for Lane 7
8.5.66
0x6C
0x0000
ALM_SYSREF_PAP
SYSREF and PAP Alarms
8.5.67
0x6D
0x0000
ALM_CLKDIV1
Clock Divider Alarms 1
8.5.68
0x6E-0x77
0x0000
Reserved
Reserved
Miscellaneous Configuration Registers (PAGE_SET[1:0] = 00, PAGE_SET[2] = 1)
76
0x0A
0xFC03
CLK_CONFIG
Clock Configuration
8.5.69
0x0B
0x0022
SLEEP_CONFIG
Sleep Configuration
8.5.70
0x0C
0xA002
CLK_OUT
Divided Output Clock Configuration
8.5.71
0x0D
0xF000
DACFS
DAC Fullscale Current
8.5.72
0x0E-0x0F
0x0000
Reserved
Reserved
0x10
0x0000
LCMGEN
Internal sysref generator
8.5.73
0x11
0x0000
LCMGEN_DIV
Counter for internal sysref generator
8.5.74
0x12
0x0000
LCMGEN_SPISYSREF
SPI SYSREF for internal sysref generator
8.5.75
0x13-0x1A
0x0000
Reserved
Reserved
0x1B
0x0000
DTEST
Digital Test Signals
0x1C-0x22
0x0000
Reserved
Reserved
8.5.76
0x23
0x03F3
SLEEP_CNTL
Sleep Pin Control
8.5.77
0x24
0x1000
SYSR_CAPTURE
SYSREF Capture Circuit Control
8.5.78
0x25-0x30
0x0000
Reserved
Reserved
0x31
0x0200
CLK_PLL_CFG
Clock Input and PLL Configuration
8.5.79
0x32
0x0308
PLL_CONFIG1
PLL Configuration 1
8.5.80
0x33
0x4018
PLL_CONFIG2
PLL Configuration 2
8.5.81
0x34
0x0000
LVDS_CONFIG
LVDS Output Configuration
8.5.82
0x35
0x0018
PLL_FDIV
Fuse farm clock divider
8.5.83
0x36-0x3A
0x0000
Reserved
Reserved
0x3B
0x0002
SRDS_CLK_CFG
Serdes Clock Configuration
8.5.84
0x3C
0x8228
SRDS_PLL_CFG
Serdes PLL Configuration
8.5.85
0x3D
0x0088
SRDS_CFG1
Serdes Configuration 1
8.5.86
0x3E
0x0909
SRDS_CFG2
Serdes Configuration 2
8.5.87
0x3F
0x0000
SRDS_POL
Serdes Polarity Control
8.5.88
0x40-0x75
0x0000
Reserved
Reserved
0x76
0x0000
SYNCBOUT
JESD204B SYNCB Output
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8.5.1 Chip Reset and Configuration Register (address = 0x00) [reset = 0x5803]
Figure 76. Chip Reset and Configuration Register (RESET_CONFIG)
15
0
RW
14
0
RW
13
0
RW
12
0
RW
11
0
RW
10
0
RW
9
0
RW
8
x
RW
7
0
RW
6
0
RW
5
0
RW
4
0
RW
3
0
RW
2
0
RW
1
0
RW
0
0
RW
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 42. RESET_CONFIG Field Descriptions
Bit
Field
Type
Reset
Description
15
SPI_RESET
RW
0
This will reset all the SPI registers once programmed.
14
ALM_OUT_POL
RW
1
Changes the polarity of the alarm output.
0= active low
1= active high
13
ALM_OUT_ENA
RW
0
Turn on the alarm pin
12
SYSCLK_ENA
RW
1
Turns on the dividers for the SYSCLK to the Fusefarm
11
AUTOLOAD_TRIG
RW
1
Causes a Fuse AUTOLOAD to be executed.
10:7
Reserved
RW
0000
Reserved
6
ONE_DAC_ONLY
RW
0
When set high only the SLICE0 is available.
5
ONE_LINK_ONLY
RW
0
This needs to be set high when a single link setup is being
programmed to get the correct TXENABLE signal generation
4:2
Reserved
RW
000
Reserved
1
INIT_SLICE1
RW
1
Puts the multi-DAC2 JESD into initialization state
0
INIT_SLICE0
RW
1
Puts the multi-DAC1 JESD into initialization state
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8.5.2 IO Configuration Register (address = 0x01) [reset = 0x1800]
Figure 77. IO Configuration Register (IO_CONFIG)
15
0
R/W
14
0
R/W
13
0
R/W
12
1
R/W
11
1
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 43. IO_CONFIG Field Descriptions
Bit
Field
Type
Reset
Description
15:14
GPO0_SEL
RW
00
Selects the JESD SYNC_N signal coming out the GPO0 pin.
Both bits can be asserted which does an oring of the SYNC_N
signals from each multi-DUC.
bit 0 = 1 then multi-DUC1 SYNC_N used
bit 1 = 1 then multi-DUC2 SYNC_N is used
13:12
SYNC0B_SEL
RW
01
Selects the JESD SYNC_N signal coming out the SYNC0B pin.
Both bits can be asserted which does an oring of the SYNC_N
signals from each multi-DUC.
bit 0 = 1 then multi-DUC1 SYNC_N used
bit 1 = 1 then multi-DUC2 SYNC_N is used
11:10
SYNC1B_SEL
RW
10
Selects the JESD SYNC_N signal coming out the SYNC1B pin.
Both bits can be asserted which does an oring of the SYNC_N
signals from each multi-DUC.
bit 0 = 1 then multi-DUC1 SYNC_N used
bit 1 = 1 then multi-DUC2 SYNC_N is used
9:8
GPO1_SEL
RW
00
Selects the JESD SYNC_N signal coming out the GPO1 pin.
Both bits can be asserted which does an oring of the SYNC_N
signals from each multi-DUC.
bit 0 = 1 then multi-DUC1 SYNC_N used
bit 1 = 1 then multi-DUC2 SYNC_N is used
7
SPI4_ENA
RW
0
When set to a '1' the chip is in 4 pin SPI interface mode.
6
Reserved
RW
0
Reserved
ATEST
RW
000000
Select the analog test points
5:0
78
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8.5.3 Lane Single Detect Alarm Mask Register (address = 0x02) [reset = 0xFFFF]
Figure 78. Lane Single Detect Alarm Mask Register (ALM_SD_MASK)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 44. ALM_SD_MASK Field Descriptions
Bit
15:0
Field
Type
ALM_SD_MASK
R/W
Reset
Description
0xFFFF
Used to mask alarms
bit 15 - bit 8 : Reserved
bit7 : lane 7 loss of signal detect
bit6 : lane 6 loss of signal detect
bit5 : lane 5 loss of signal detect
bit4 : lane 4 loss of signal detect
bit3 : lane 3 loss of signal detect
bit2 : lane 2 loss of signal detect
bit1 : lane1 loss of signal detect
bit0 : lane 0 loss of signal detect
8.5.4 Clock Alarms Mask Register (address = 0x03) [reset = 0xFFFF
Figure 79. Clock Alarms Mask Register (ALM_CLK_MASK)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 45. ALM_CLK_MASK Field Descriptions
Bit
15:0
Field
ALM_CLK_MASK
Type
R/W
Reset
Description
0xFFFF
Used to mask alarms
bit 15 - bit 8 : Reserved
bit 7 : alarm_sysrefphase4
bit 6 : alarm_sysrefphase3
bit 5 : alarm_sysrefphase2
bit 4 : alarm_sysrefphase1
bit 3 : alarm_align_to_r3
bit 2 : alarm_align_to_r1
bit 1 : alarm_sd0_pll
bit 0 : alarm_sd1_pll
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8.5.5 SERDES Loss of Signal Detection Alarms Register (address = 0x04) [reset = 0x0000]
Figure 80. SERDES Loss of Signal Detection Alarms Register (ALM_SD_DET)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
0
W0C
5
0
W0C
4
0
W0C
3
0
W0C
2
1
W0C
1
0
W0C
0
0
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset
Table 46. ALM_SD_DET Field Descriptions
Bit
15:8
7:0
80
Field
Type
Reset
Description
Reserved
W0C
0x00
Reserved
0x00
Loss of signal detect outputs from the SERDES lanes:
bit 7 = lane7 loss of signal
bit 6 = lane6 loss of signal
bit 5 = lane5 loss of signal
bit 4 = lane4 loss of signal
bit 3 = lane3 loss of signal
bit 2 = lane2 loss of signal
bit 1 = lane1 loss of signal
bit 0 = lane0 loss of signal
ALM_SD_LOSDET
W0C
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8.5.6 SYSREF Alignment Circuit Alarms Register (address = 0x05) [reset = 0x0000]
Figure 81. SYSREF Alignment Circuit Alarms Register (ALM_SYSREF_DET)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
0
W0C
5
0
W0C
4
0
W0C
3
0
W0C
2
1
W0C
1
0
W0C
0
1
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset
Table 47. ALM_SYSREF_DET Field Descriptions
Bit
Field
Type
Reset
Description
Reserved
W0C
0000000
Reserved
8
ALM_SYSRPHASE4
W0C
0
If high the sysrefphase4 state has been observed in the
sysrefalign logic at least once since the last sysrefalign sync.
7
ALM_SYSRPHASE3
W0C
0
If high the sysrefphase3 state has been observed in the
sysrefalign logic at least once since the last sysrefalign sync.
6
ALM_SYSRPHASE2
W0C
0
If high the sysrefphase2 state has been observed in the
sysrefalign logic at least once since the last sysrefalign sync.
5
ALM_SYSRPHASE1
W0C
0
If high the sysrefphase1 state has been observed in the
sysrefalign logic at least once since the last sysrefalign sync.
4
ALM_ALIGN_TO_R3
W0C
0
If high the align_to_r3 state has been observed in the sysrefalign
logic at least once since the last sysrefalign sync. TI Internal use
only.
3
ALM_ALIGN_TO_R1
W0C
0
If high the align_to_r1 state has been observed in the sysrefalign
logic at least once since the last sysrefalign sync. TI Internal use
only.
2
ALM_SD0_PLL
W0C
0
Driven high if the PLL in the Serdes 0 block goes out of lock. A
false alarm is generated at startup when the PLL is locking. User
will have to reset this bit after start to monitor accurately.
1
ALM_SD1_PLL
W0C
0
Driven high if the PLL in the Serdes 1 block goes out of lock. A
false alarm is generated at startup when the PLL is locking. User
will have to reset this bit after start to monitor accurately.
0
PLL_LOCK
W0C
0
Asserted when PLL is unlocked.
15:9
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8.5.7 Temperature Sensor and PLL Loop Voltage Register (address = 0x06) [reset = variable]
Figure 82. Temperature Sensor and PLL Loop Voltage Register (TEMP_PLLVOLT)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
x
R
7
0
R
6
0
R
5
0
R
4
0
R
3
0
R
2
1
R
1
1
R
0
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 48. TEMP_PLLVOLT Field Descriptions
Bit
Field
Type
Reset
Description
15:8
TEMPDATA
R
0x00
8 bits of data from the tempurature sensor
7:5
PLL_LFVOLT
R
0b000
PLL Loop filter voltage
4:2
Reserved
R
0b000
Reserved
1
A fixed '1' that can be used to test the VOH condition on
SDO/SDIO.
0
A fixed '0' that can be used to test the VOL condition on
SDO/SDIO.
1
TITEST_VOH
0
TITEST_VOL
R
R
8.5.8 Page Set Register (address = 0x09) [reset = 0x0000]
Figure 83. Page Set Register (PAGE_SET)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 49. PAGE_SET Field Descriptions
Bit
Field
15:0
82
PAGE_SET
Type
R/W
Reset
Description
0x0000
Each bit selects a page that is active. Multiple pages can be
selected at the same time. No bits asserted means that
MASTER is the only page selected.
bit 0 = page0 : multi-DUC1
bit 1 = page1 : multi-DUC2
bit 2 = page2 : DIG_MISC
bit 3-15: Reserved
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8.5.9 SYSREF Align to r1 and r3 Count Register (address = 0x78) [reset = 0x0000]
Figure 84. SYSREF Align to r1 and r3 Count Register (SYSREF_ALIGN_R)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
x
R
7
0
R
6
1
R
5
1
R
4
1
R
3
1
R
2
0
R
1
0
R
0
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 50. SYSREF_ALIGN_R Field Descriptions
Bit
Field
Type
Reset
Description
15:8
ALIGN_TO_R1_CNT
R
0x00
Part of the SYSREF Align block
7:0
ALIGN_TO_R3_CNT
R
0x00
Part of the SYSREF Align block
8.5.10 SYSREF Phase Count 1 and 2 Register (address = 0x79) [reset = 0x0000]
Figure 85. SYSREF Phase Count 1 and 2 Register (SYSREF12_CNT)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
x
R
7
0
R
6
1
R
5
1
R
4
1
R
3
1
R
2
0
R
1
0
R
0
1
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 51. SYSREF12_CNT Field Descriptions
Field
Type
Reset
Description
15:8
Bit
PHASE2_CNT
R
0x00
Part of the SYSREF Align block
7:0
PHASE1_CNT
R
0x00
Part of the SYSREF Align block
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8.5.11 SYSREF Phase Count 3 and 4 Register (address = 0x7A) [reset = 0x0000]
Figure 86. SYSREF Phase Count 3 and 4 Register (SYSREF34_CNT)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
x
R
7
0
R
6
1
R
5
1
R
4
1
R
3
1
R
2
0
R
1
1
R
0
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 52. SYSREF34_CNT Field Descriptions
Bit
Field
Type
Reset
Description
15:8
PHASE4_CNT
R
0x00
Part of the SYSREF Align block
7:0
PHASE3_CNT
R
0x00
Part of the SYSREF Align block
8.5.12 Vendor ID and Chip Version Register (address = 0x7F) [reset = 0x0008]]
Figure 87. Vendor ID and Chip Version Register (VENDOR_VER)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
x
R
7
0
R
6
1
R
5
1
R
4
1
R
3
1
R
2
1
R
1
1
R
0
1
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 53. VENDOR_VER Field Descriptions
84
Bit
Field
Type
Reset
Description
15
AUTOLOAD_DONE
R
0
Asserted when the Fusefarm Autoload sequence is done
14:10
EFC_ERR
R
00000
The error output from the fuse farm.
9:5
Reserved
R
00000
Reserved
4:3
VENDORID
R
01
TI identification
2:0
VERSION
R
001
Bits to determine what version of build for the chip.
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8.5.13 Multi-DUC Configuration (PAP, Interpolation) Register (address = 0x0A) [reset = 0x02B0]
Figure 88. Multi-DUC Configuration (PAP, Interolation) Register (MULTIDUC_CFG1)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
1
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 54. MULTIDUC_CFG1 Field Descriptions
Bit
Field
Type
Reset
Description
15
DUAL_IQ
R/W
0
When asserted the SLICE uses both IQ paths
14
ISFIR_ENA
R/W
0
Turns on the inverse sync filter for the AB and CD paths when
programmed to 1.
13
Not used
R/W
0
Not used
12:8
INTERP
R/W
00010
Determines the interpolation amount.
00000: 1x
00001: 2x
00010: 4x
00011: 6x
00100: 8x
00101: 10x
00110: 12x
01000: 16x
01001: 18x
01010: 20x
01100: 24x
7
ALM_ZEROS_TXEN
R/W
1
When asserted any alarm that isn’t masked will mid-level the
DAC output by setting the txenable_from_dig to ‘0’
6
DAC_COMPLEMENT
R/W
0
When asserted the DAC output will be 2's complemented. This
helps with hookup at the board level.
5
ALM_ZEROS_JESD
R/W
1
When asserted any alarm that isn’t masked will zero the data
coming out of the JESD block.
4
ALM_OUT_ENA
R/W
1
When asserted the output from the selected SLICE will be
passed on to the MASTER alarm control if it is also turned on
then the alarm will be sent to the pad_alarm pin.
3
PAPA_ENA
R/W
0
Turns on the Power Amp Protection logic for path A.
2
PAPB_ENA
R/W
0
Turns on the Power Amp Protection logic for path B.
1
PAPC_ENA
R/W
0
Turns on the Power Amp Protection logic for path C.
0
PAPD_ENA
R/W
0
Turns on the Power Amp Protection logic for path D.
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8.5.14 Multi-DUC Configuration (Mixers) Register (address = 0x0C) [reset = 0x2402]
Figure 89. Multi-DUC Configuration (Mixers) Register (MULTIDUC_CFG2)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
1
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 55. MULTIDUC_CFG2 Field Descriptions
Bit
Field
Type
Reset
Description
DAC_BITWIDTH
R/W
0b00
Determines the bit width of the data going to the DAC
00: 14 bits
01: 14 bits
10: 12 bits
11: 11 bits
13
ZERO_INVLD_DATA
R/W
1
When asserted; the data from the JESD block is zeroed in the
mapper to prevent goofy output from the DAC. For test purposes
this bit should be desasserted
12
SHORTTEST_ENA
R/W
0
Turns on the JESD SHORT pattern test (5.1.6.2)
11
BIST_ENA
R/W
0
Turns on the BIST blocks in the SLICE.
10
BIST_ZERO
R/W
1
Zeros out the bists captures.
9
MIXERAB_ENA
R/W
0
Turns on the mixer for the A and B streams
8
MIXERCD_ENA
R/W
0
Turns on the mixer for the C and D streams
7
MIXERAB_GAIN
R/W
0
Adds 6dB of gain when asserted
6
MIXERCD_GAIN
R/W
0
Adds 6dB of gain when asserted
5
NCOAB_ENA
R/W
0
When high the full NCO block is turned on.
4
NCOCD_ENA
R/W
0
When high the full NCO block is turned on.
Reserved
R/W
00
Reserved
1
TWOS
R/W
1
When asserted the chip is expecting 2's complement data is
arriving through the JESD; otherwise offset binary is expected
0
Reserved
R/W
0
Reserved
15:14
3:2
86
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8.5.15 JESD FIFO Control Register (address = 0x0D) [reset = 0x1300]
Figure 90. JESD FIFO Control Register (JESD_FIFO)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 56. JESD_FIFO Field Descriptions
Bit
Field
Type
Reset
Description
15
FIFO_ZEROS_DATA
R/W
1
When asserted FIFO errors zero the data out of the JESD block.
For test purposes this could be turned off to allow test patterns
in the FIFO.
NOT USED
R/W
000
Not Used
12
SRDS_FIFO_ALM_CLR
R/W
0
Set to 1 to clear FIFO errors. Must be set to 0 for proper FIFO
operation
11
14:13
Not used
R/W
0
Not used
10:8
FIFO_OFFSET
R/W
0000
Used to set the difference between read and write pointers in
the JESD FIFO.
7:1
Reserved
R/W
0
Reserved
SPI_TXENABLE
R/W
0
When asserted the internal value of txenable = '1'
0
8.5.16 Alarm Mask 1 Register (address = 0x0E) [reset = 0x00FF]
Figure 91. Alarm Mask 1 Register (ALM_MASK1)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 57. ALM_MASK1 Field Descriptions
Bit
15:0
Field
Type
Reset
Description
ALM_MASK1
R/W
0x00FF
Each bit is used to mask an alarm. Assertion masks the alarm:
bit 15 = mask lane7 lane errors
bit 14 = mask lane6 lane errors
bit 13 = mask lane5 lane errors
bit 12 = mask lane4 lane errors
bit 11 = mask lane3 lane errors
bit 10 = mask lane2 lane errors
bit 9 = mask lane1 lane errors
bit 8 = mask lane0 lane errors
bit 7 = mask lane7 FIFO flags
bit 6 = mask lane6 FIFO flags
bit 5 = mask lane5 FIFO flags
bit 4 = mask lane4 FIFO flags
bit 3 = mask lane3 FIFO flags
bit 2 = mask lane2 FIFO flags
bit 1 = mask lane1 FIFO flags
bit 0 = mask lane0 FIFO flags
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8.5.17 Alarm Mask 2 Register (address = 0x0F) [reset = 0xFFFF]
Figure 92. Alarm Mask 2 Register (ALM_MASK2)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 58. ALM_MASK2 Field Descriptions
Bit
15:0
88
Field
Type
Reset
Description
ALMS_MASK2
R/W
0xFFFF
Each bit is used to mask an alarm. Assertion masks the alarm:
bit 15 = not used
bit 14 = not used
bit 13 = not used
bit 12 = mask SYSREF errors on link0
bit 11 = mask alarm from JESD shorttest
bit 10 = mask alarm from PAPD
bit 9 = mask alarm from PAPC
bit 8 = mask alarm from PAPB
bit 7 = mask alarm from PAPA
bit 6 = not used
bit 5 = not used
bit 4 = not used
bit 3 = not used
bit 2 = not used
bit 1 = mask alarm_clkdiv192_eq_zero
bit 0 = mask alarm_clkdiv192_eq_mult1
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8.5.18 Alarm Mask 3 Register (address = 0x10) [reset = 0xFFFF]
Figure 93. Alarm Mask 3 Register (ALM_MASK3)
15
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 59. ALM_MASK3 Field Descriptions
Bit
15:0
Field
Type
Reset
Description
ALMS_MASK3
R/W
0xFFFF
Each bit is used to mask an alarm. Assertion masks the alarm:
bit 15 = mask alarm_clkdiv8_eq_zero
bit 14 = mask alarm_clkdiv12_eq_zero
bit 13 = mask alarm_clkdiv16_eq_zero
bit 12 = mask alarm_clkdiv18_eq_zero
bit 11 = mask alarm_clkdiv20_eq_zero
bit 10 = mask alarm_clkdiv32_eq_zero
bit 9 = mask alarm_clkdiv36_eq_zero
bit 8 = mask alarm_clkdiv40_eq_zero
bit 7 = mask alarm_clkdiv48_eq_zero
bit 6 = mask alarm_clkdiv64_eq_zero
bit 5 = mask alarm_clkdiv72_eq_zero
bit 4 = mask alarm_clkdiv80_eq_zero
bit 3 = mask alarm_clkdiv96_eq_zero
bit 2 = maskalarm_ clkdiv128_eq_zero
bit 1 = mask alarm_clkdiv144_eq_zero
bit 0 = mask alarm_clkdiv160_eq_zero
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8.5.19 Alarm Mask 4 Register (address = 0x11) [reset = 0xFFFF]
Figure 94. Alarm Mask 4 Register (ALM_MASK4)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 60. ALM_MASK4 Field Descriptions
Bit
15:0
90
Field
Type
Reset
Description
ALMS_MASK4
R/W
0xFFFF
Each bit is used to mask an alarm. Assertion masks the alarm:
bit 15 = mask alarm_clkdiv8_eq_mult1
bit 14 = mask alarm_clkdiv12_eq_mult1
bit 13 = mask alarm_clkdiv16_eq_mult1
bit 12 = mask alarm_clkdiv18_eq_mult1
bit 11 = mask alarm_clkdiv20_eq_mult1
bit 10 = mask alarm_clkdiv32_eq_mult1
bit 9 = mask alarm_clkdiv36_eq_mult1
bit 8 = mask alarm_clkdiv40_eq_mult1
bit 7 = mask alarm_clkdiv48_eq_mult1
bit 6 = mask alarm_clkdiv64_eq_mult1
bit 5 = mask alarm_clkdiv72_eq_mult1
bit 4 = mask alarm_clkdiv80_eq_mult1
bit 3 = mask alarm_clkdiv96_eq_mult1
bit 2 = maskalarm_ clkdiv128_eq_mult1
bit 1 = mask alarm_clkdiv144_eq_mult1
bit 0 = mask alarm_clkdiv160_eq_mult1
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8.5.20 JESD Lane Skew Register (address = 0x12) [reset = 0x0000]
Figure 95. JESD Lane Skew Register (JESD_LN_SKEW)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
x
R
7
0
R
6
0
R
5
0
R
4
1
R
3
0
R
2
0
R
1
1
R
0
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 61. JESD_LN_SKEW Field Descriptions
Bit
Field
Type
Reset
Description
15:5
NOT USED
R
0x0000
Not used
4:0
MEMIN_LANE_SKEW
R
0b00000
Measure of the lane skew for each link only. Bits are
READ_ONLY
8.5.21 CMIX Configuration Register (address = 0x17) [reset = 0x0000]
Figure 96. CMIX Configuration Register (CMIX)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
1
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 62. CMIX Field Descriptions
Bit
Field
Type
Reset
Description
15:12
CMIX_AB
R/W
0x0
These bits turn on the different coarse mixing options.
Combining the different options together can result in every
possible n x Fs/8 [n=0->7]. Below is the valid programming
table:
cmix=(mem_fs8; mem_fs4; mem_fs2; mem_fsm4)
0000 : no mixing
0001 : -fs/4
0010 : fs/2
0100 : fs/4
1000 : fs/8
1100 : 3fs/8
1010 : 5fs/8
1110 : 7fs/8
11:4
Reserved
R/W
00000000
0
Reserved
0x0
These bits turn on the different coarse mixing options.
Combining the different options together can result in every
possible n x Fs/8 [n=0->7]. Below is the valid programming
table:
cmix=(mem_fs8; mem_fs4; mem_fs2; mem_fsm4)
0000 : no mixing
0001 : -fs/4
0010 : fs/2
0100 : fs/4
1000 : fs/8
1100 : 3fs/8
1010 : 5fs/8
1110 : 7fs/8
3:0
CMIX_CD
R/W
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8.5.22 Output Summation and Delay Register (address = 0x19) [reset = 0x0000]
Figure 97. Output Summation and Delay Register (OUTSUM)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
1
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 63. OUTSUM Field Descriptions
Bit
Field
Type
Reset
Description
15:12
OUTPUT_DELAY
R/W
0x0
Delays the output to the DAC 0 to 15 clock cycles
11:4
Reserved
R/W
0x00
Reserved
0x0
Selects the output summing functions. Each bit selects another
sample to sum. Multiple bits can be selected.
bit 0 = add the isfirab
bit 1 = add the isfircb
bit 2 = add adjacent slice AB sample
bit 3 = add adjacent slice CD sample
3:0
OUTSUM_SEL
R/W
8.5.23 NCO Phase Path AB Register (address = 0x1C) [reset = 0x0000]
Figure 98. NCO Phase Path AB Register (PHASE_NCOAB)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 64. PHASE_NCOAB Field Descriptions
Bit
15:0
Field
Type
Reset
Description
PHASE_NCO1
Auto
Sync
0x0000
The phase offset for the FULL NCO1 in the AB datapath.
8.5.24 NCO Phase Path CD Register (address = 0x1D) [reset = 0x0000]
Figure 99. NCO Phase Path CD Register (PHASE_NCOCD)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
0
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 65. PHASE_NCOCD Field Descriptions
Bit
15:0
92
Field
Type
Reset
Description
PHASE_NCO12
Auto
Sync
0x0000
The phase offset for the FULL NCO2 in the CD datapath.
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8.5.25 NCO Frequency Path AB Register (address = 0x1E-0x20) [reset = 0x0000 0000 0000]
Figure 100. NCO Frequency Path AB Register (FREQ_NCOAB)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 66. FREQ_NCOAB Field Descriptions
Bit
47:0
Field
Type
Reset
Description
FREQ_NCOAB
R/W
0x0000
0000
0000
NCO frequency word for AB data path.
8.5.26 NCO Frequency Path CD Register (address = 0x21-0x23) [reset = 0x0000 0000 0000]
Figure 101. NCO Frequency Path CD Register (FREQ_NCOCD)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 67. FREQ_NCOCD Field Descriptions
Bit
47:0
Field
FREQ_NCOCD
Type
Reset
Description
R/W
0x0000
0000
0000
NCO frequency word for CD data path.
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8.5.27 SYSREF Use for Clock Divider Register (address = 0x24) [reset = 0x0010]
Figure 102. SYSREF Use for Clock Divder Register (SYSREF_CLKDIV)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
0
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 68. SYSREF_CLKDIV Field Descriptions
94
Bit
Field
Type
Reset
Description
15
Reserved
R/W
0
Reserved
14:12
CDRVSER_SYSREF_DLY
R/W
000
Programmable delay the SYSREF by N dacclk cycles to the
CDRV_SER clock dividers. By offsetting the clock to the
different multi-DUC blocks, clock mixing could potentially be
reduced.
11:7
Not used
R/W
00000
Not used
6:4
SYSREF_MODE
R/W
001
Determines how SYSREF is used to sync the clock dividers in
the CDRV_SER block.
000 = Don’t use SYSREF pulse
001 = Use all SYSREF pulses
010 = Use only the next SYSREF pulse
011 = Skip one SYSREF pulse then use only the next one
100 = Skip one SYSREF pulse then use all pulses.
3:2
SYSREF_DLY
R/W
00
Delays the SYSREF into the CDRV_SER capture FF through 1
of 4 choices. This allows for extra delay in case the timing of the
clock or SYSREF path isn’t as good as we think.
1:0
Reserved
R/W
00
Reserved
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8.5.28 Serdes Clock Control Register (address = 0x25) [reset = 0x7700]
Figure 103. Serdes Clock Control Register (SERDES_CLK)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
0
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 69. SERDES_CLK Field Descriptions
Bit
15:12
Field
CLKJESD_DIV
Type
R/W
Reset
Description
0x7
This controls the selection of the clk_jesd output
0000 = div4
0001 = div8
0010 = div12
0011 = div16
0100 = div18
0101 = div20
0110 = div24
0111 = div32
1001 = div36
1010 = div48
1011 = div64
1100 = div5.333
1101 = div10.666
1110 = div21p333
11:8
CLKJESD_OUT_DIV
R/W
0x7
This controls the selection of the clk_jesd_out output
0000 = div8
0001 = div16
0010 = div32
0011 = div48
0100 = div64
0101 = div80
0110 = div96
0111 = div128
1000 = div144
1001 = div160
1010 = div192
7:0
Reserved
R/W
0x0
Reserved
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8.5.29 Sync Source Control 1 Register (address = 0x27) [reset = 0x1144]
Figure 104. Sync Source Control 1 Register (SYNCSEL1)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
0
R/W
2
1
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 70. SYNCSEL1 Field Descriptions
Bit
Field
15:12
11:8
7:4
3:0
96
SYNCSEL_MIXERAB
SYNCSEL_MIXERCD
SYNCSEL_NCOAB
SYNCSEL_NCOCD
Type
R/W
R/W
R/W
R/W
Reset
Description
0x1
Controls the syncing of the double buffered SPI registers for the
mixerAB block. These bits are enables so a ‘1’ in the bit place
allows the sync to pass to the block.
bit 0 = auto-sync from SPI register write
bit 1 = sysref
bit 2 = sync_out from JESD
bit 3 = mem_spi_sync
0x1
Controls the syncing of the double buffered SPI registers for the
mixerCD block. These bits are enables so a ‘1’ in the bit place
allows the sync to pass to the block.
bit 0 = auto-sync from SPI register write
bit 1 = sysref
bit 2 = sync_out from JESD
bit 3 = mem_spi_sync
0x4
Controls the syncing of NCOAB accumulators. These bits are
enables so a ‘1’ in the bit place allows the sync to pass to the
block.
bit 0 = ‘0’
bit 1 = sysref
bit 2 = sync_out from JESD
bit 3 = mem_spi_sync
0x4
Controls the syncing of NCOCD accumulators. These bits are
enables so a ‘1’ in the bit place allows the sync to pass to the
block.
bit 0 = ‘0’
bit 1 = sysref
bit 2 = sync_out from JESD
bit 3 = mem_spi_sync
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8.5.30 Sync Source Control 2 Register (address = 0x28) [reset = 0x0000]
Figure 105. Sync Source Control 2 Register (SYNCSEL2)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 71. SYNCSEL2 Field Descriptions
Bit
Field
Type
Reset
Description
15:12
Reserved
R/W
0x0
Reserved
11:8
SYNCSEL_PAPAB
R/W
0x0
Select the sync for the PAP A and B.
bit 0 = ‘0’
bit 1 = sysref
bit 2 = sync_out from JESD
bit 3 = mem_spi_sync
7:4
SYNCSEL_PAPCD
R/W
0x0
Select the sync for the PAP C and D.
bit 0 = ‘0’
bit 1 = sysref
bit 2 = sync_out from JESD
bit 3 = mem_spi_sync
3:2
Reserved
R/W
0b00
Reserved
1
SPI_SYNC
R/W
0
This is used to generate the SPI_SYNC signal
0
Reserved
R/W
0
Reserved
8.5.31 PAP path AB Gain Attenuation Step Register (address = 0x29) [reset = 0x0000]
Figure 106. PAP path AB Gain Attenuation Step Register (PAP_GAIN_AB)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 72. PAP_GAIN_AB Field Descriptions
Bit
15:10
9:0
Field
Type
Reset
Description
NOT USED
RW
000000
Not Used
0x000
Gain attenuation step
PAPAB_GAIN_STEP
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8.5.32 PAP path AB Wait Time Register (address = 0x2A) [reset = 0x0000]
Figure 107. PAP path AB Wait Time Register (PAP_WAIT_AB)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 73. PAP_WAIT_AB Field Descriptions
Bit
15:10
9:0
Field
Type
Reset
Description
Reserved
000000
R/W
Reserved
PAPAB_WAIT
0x000
R/W
Number of clock cycles to wait after gain = 0
8.5.33 PAP path CD Gain Attenuation Step Register (address = 0x2B) [reset = 0x0000]
Figure 108. PAP path CD Gain Attenuation Step Register (PAP_GAIN_CD)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 74. PAP_GAIN_CD Field Descriptions
Bit
15:10
9:0
Field
Type
Reset
Description
Not Used
R/W
000000
Not Used
PAPCD_GAIN_STEP
R/W
0x000
Gain attenuation step
8.5.34 PAP Path CD Wait Time Register (address = 0x2C) [reset = 0x0000]
Figure 109. PAP path CD Wait Time Register (PAP_WAIT_CD)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 75. PAP_WAIT_CD Field Descriptions
Bit
15:10
9:0
98
Field
Type
Reset
Description
Reserved
R/W
000000
Reserved
PAPCD_WAIT
R/W
0x000
Number of clock cycles to wait after gain = 0
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8.5.35 PAP path AB Configuration Register (address = 0x2D) [reset = 0x0FFF]
Figure 110. PAP path AB Configuration Register (PAP_CFG_AB)
15
0
R/W
14
0
R/W
13
Reserved
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 76. PAP_CFG_AB Field Descriptions
Bit
15:14
13
12:0
Field
Type
Reset
Description
PAPAB_SEL_DLY
R/W
00
Controls the length of the delayline in the PAP AB logic.
00 : N =32
01 : N = 64
10 : N = 128
11 : Not Valid
Reserved
R/W
0
Reserved
PAPAB_THRESH
R/W
0xFFF
The threshold for the PAP AB trigger.
8.5.36 PAP path CD Configuration Register (address = 0x2E) [reset = 0x0FFF]
Figure 111. PAP path CD Configuration Register (PAP_CFG_CD)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 77. PAP_CFG_CD Field Descriptions
Bit
15:14
13
12:0
Field
Type
Reset
Description
PAPCD_SEL_DLY
R/W
00
Controls the length of the delay line in the PAP CD logic.
00 : N = 32
01 : N = 64
10 : N = 128
11 : Not Valid
Reserved
R/W
0
Reserved
PAPCD_THRESH
R/W
0xFFF
The threshold for the PAP CD trigger.
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8.5.37 DAC SPI Configuration Register (address = 0x2F) [reset = 0x0000]
Figure 112. DAC SPI Constant 1 Register (SPIDAC_TEST1)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 78. SPIDAC_TEST1 Field Descriptions
Bit
Field
Type
Reset
Description
15
TITEST_SKIPJESD
R/W
0
Bypasses the JESD logic
Reserved
R/W
0x0000
Reserved
SPIDAC_ENA
R/W
0
When asserted the DAC output is set to the value in register
SPIDAC. This can be used for trim setting and other static tests.
14:1
0
8.5.38 DAC SPI Constant Register (address = 0x30) [reset = 0x0000]
Figure 113. DAC SPI Constant Register (SPIDAC_TEST2)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 79. SPIDAC_TEST2 Field Descriptions
Bit
15:0
100
Field
Type
Reset
Description
SPIDAC
R/W
0x0000
This value replaces the data at the output of the JESD so that
the DAC value can be controlled
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8.5.39 Gain for path AB Register (address = 0x32) [reset = 0x0000]
Figure 114. Gain for path AB Register (GAINAB)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 80. GAINAB Field Descriptions
Bit
Field
Type
Reset
Description
15
GAINAB_ENA
R/W
0
Turns on the path AB gain block
14:12
Reserved
R/W
0x0
Reserved
11:0
GAINAB
R/W
0x400
Extra control of gain in the GAINAB block. This allows a fix gain
to be added to the signal if needed.
8.5.40 Gain for path CD Register (address = 0x33) [reset = 0x0000]
Figure 115. Gain for path CD Register (GAINCD)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 81. GAINCD Field Descriptions
Bit
Field
Type
Reset
Description
15
GAINCD_ENA
R/W
0
Turns on the Path CD gain block
14:12
Reserved
R/W
0x0
Reserved
11:0
GAINCD
R/W
0x400
Extra control of gain in the GAINCD block. This allows a fix gain
to be added to the signal if needed.
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8.5.41 JESD Error Counter Register (address = 0x41) [reset = 0x0000]
Figure 116. JESD Error Counter Register (JESD_ERR_CNT)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
x
R
7
0
R
6
1
R
5
0
R
4
0
R
3
0
R
2
0
R
1
0
R
0
1
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 82. JESD_ERR_CNT Field Descriptions
Bit
15:0
Field
Type
Reset
Description
JESD_ERR_CNT
R
0x0000
This is the error count for the JESD link. This is a 16bit value
that is not cleared until the JESD synchronization is required or
errcnt_clr is programmed to '1'
8.5.42 JESD ID 1 Register (address = 0x46) [reset = 0x0044]
Figure 117. JESD ID 1 Register (JESD_ID1)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
x
R
7
0
R
6
1
R
5
0
R
4
0
R
3
0
R
2
1
R
1
1
R
0
0
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 83. JESD_ID1 Field Descriptions
Bit
Field
Type
Reset
Description
15:11
LID0
R/W
00000
JESD ID for lane 0
10:6
LID1
R/W
00001
JESD ID for lane 1
5:1
LID2
R/W
00010
JESD ID for lane 2
Reserved
R/W
0
Reserved
0
102
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8.5.43 JESD ID 2 Register (address = 0x47) [reset = 0x190A]
Figure 118. JESD ID 2 Register (JESD_ID2)
15
0
R
14
0
R
13
0
R
12
0
R
11
0
R
10
0
R
9
0
R
8
0
R
7
0
R
6
1
R
5
0
R
4
0
R
3
0
R
2
1
R
1
1
R
0
1
R
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 84. JESD ID 2 Register (JESD_ID2)
Bit
Field
Type
Reset
Description
15:11
LID3
R/W
00011
JESD ID for lane 3
10:6
LID4
R/W
00100
JESD ID for lane 4
5:1
LID5
R/W
00101
JESD ID for lane 5
Reserved
R/W
0
Reserved
0
8.5.44 JESD ID 3 and Subclass Register (address = 0x48) [reset = 0x31C3]
Figure 119. JESD ID 3 Register (JESD_ID3)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 85. JESD_ID3 Field Descriptions
Bit
Field
Type
Reset
Description
15:11
LID6
R/W
00110
JESD ID for lane 6
10:6
LID7
R/W
00111
JESD ID for lane 7
5:4
Reserved
R/W
00
Reserved
3:1
0
SUBCLASSV
R/W
001
Selects the JESD subclass supported. Note: “001” is subclass 1
and “000” is subclass 0 they are the only modes supported; not
used for operation but used for configuration. See field
MIN_LATENCY_ENA in register JESD_MATCH (9.5.46) for use
in subclass0
JESDV
R/W
1
Selects the version of JESD support(0=A; 1=B) NOTE: JESD
204B is only supported version.
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8.5.45 JESD Lane Enable Register (address = 0x4A) [reset = 0x0003]
Figure 120. JESD Lane Enable Register (JESD_LN_EN)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 86. JESD_LN_EN Field Descriptions
Bit
Field
15:8
Reset
Description
0x00
Turn on each lane as needed. Signal is active high.
bit 15 : lane7 enable
bit 14 : lane6 enable
bit 13 : lane5 enable
bit 12 : lane4 enable
bit 11 : lane3 enable
bit 10 : lane2 enable
bit 9 : lane1 enable
bit 8 : lane0 enable
7:6
JESD_TEST_SEQ
00
Set to select and verify link layer test sequences. The error for
these sequences comes out the lane alarms bit0. 1= a fail and 0
= pass.
00 : test sequence disabled
01 : verify repeating D.21.5 high frequency pattern for random
jitter
10 : verify repeating K.28.5 mixed frequency pattern for
deterministic jitter
11 : verify repeating ILA sequence
5:2
Reserved
0x0
Reserved
11
Used to tell the JESD block how many clock phases are being
used for lanes.
00 = 1 phase
01 = 2 phases
10 = 4 phases
11 = 8 phases
1:0
104
LANE_ENA
Type
JESD_PHASE_MODE
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8.5.46 JESD RBD Buffer and Frame Octets Register (address = 0x4B) [reset = 0x1300]
Figure 121. JESD RBD Buffer and Frame Octets Register (JESD_RBD_F)
15
14
13
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
0
R/W
R/W
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
0
R/W
3
2
0
R/W
1
1
R/W
0
1
R/W
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 87. JESD_RBD_F Field Descriptions
Bit
Field
Type
Reset
Description
15:13
Reserved
R/W
00
Reserved
12:8
RBD
R/W
10011
This controls the amount of elastic buffers being used in the
JESD. Larger numbers will mean more latency; but smaller
numbers may not hold enough data to capture the input skew.
This value must always be ≤ mem_k
7:0
F_M1
R/W
0x00
This is the number of octets in the frame - 1
8.5.47 JESD K and L Parameters Register (address = 0x4C) [reset = 0x1303]
Figure 122. JESD K and L Parameters Register (JESD_K_L)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 88. JESD_K_L Field Descriptions
Field
Type
Reset
Description
15:13
Bit
Reserved
R/W
000
Reserved
12:8
K_M1
R/W
10011
The number of frames in a multi-frame - 1. 0 ≤ k - 1 < 32
7:5
Reserved
R/W
0
Reserved
4:0
L_M1
R/W
00011
The number of lanes used by the JESD - 1. 0 ≤ L -1 < 8
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8.5.48 JESD M and S Parameters Register (address = 0x4D) [reset = 0x0100]
Figure 123. JESD M and S Parameters Register (JESD_M_S)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
0
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 89. JESD_M_S Field Descriptions
Bit
Field
Type
Reset
Description
15:8
M_M1
R/W
0x01
The number of streams per frame - 1. 0 ≤ M - 1 < 256
7:5
Reserved
R/W
000
Reserved
4:0
S_M1
R/W
00000
The number of samples per stream per frame - 1.
8.5.49 JESD N, HD and SCR Parameters Register (address = 0x4E) [reset = 0x0F4F]
Figure 124. JESD N, HD and SCR Parameters Register (JESD_N_HD_SCR)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
0
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 90. JESD_N_HD_SCR Field Descriptions
Field
Type
Reset
Description
15:13
Bit
Reserved
R/W
000
Reserved
12:8
106
NPRIME_M1
R/W
01111
The number of adjusted bits per sample - 1
7
Reserved
R/W
0
Reserved
6
HD
R/W
1
High density mode. Samples can cross the lane boundary
5
SCR
R/W
0
Turn on the scrambler
4:0
N_M1
R/W
01111
The number of bits per sample - 1
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8.5.50 JESD Character Match and Other Register (address = 0x4F) [reset = 0x1CC1]
Figure 125. JESD Character Match and Other Parameters Register (JESD_MATCH)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 91. JESD_MATCH Field Descriptions
Bit
Field
Type
Reset
Description
MATCH_DATA
R/W
0x1C
The character to match for buffer release. Normally it is a
/R/=/K28.0/-0x1C but with these bits the user can program the
value.
7
MATCH_SPECIFIC
R/W
1
Match a specific charater to start the JESD buffering when
asserted; otherwise the first non-K will start the buffering.
6
MATCH_CTRL
R/W
1
When asserted the match character is a CONTROL character
instead of a DATA character.
5
NO_LANE_SYNC
R/W
0
Assert if the TX side does not support lane initialization. This
way the RX won’t flag errors in the configuration portion of the
ILA.
Not Used
R/W
000
Not Used
1
MIN_LATENCY_ENA
R/W
0
Enable minimum latency when set. This is needed for subclass
0 support.
0
JESD_COMMAALIGN_ENA
R/W
1
When asserted the JESD block SERDES comma align signal
will be added with the SERDES ALIGN bit(0) to control when to
shut off comma alignment. When this bit is deasserted; then the
programmed bit(spi_config62(11)) is the only control.
15:8
4:2
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8.5.51 JESD Link Configuration Data Register (address = 0x50) [reset = 0x0000]
Figure 126. JESD Link Configuration Data Register (JESD_LINK_CFG)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 92. JESD_Link_CFG Field Descriptions
Bit
Field
Type
Reset
Description
15-12
ADJCNT
R/W
0x0
Lane configuration data for link. Reserved by DAC38RF8x
except for lane configuration checking.
11
ADJDIR
R/W
0
Lane configuration data for link. Reserved by DAC38RF8x
except for lane configuration checking.
10-7
BID
R/W
0x0
Lane configuration data for link. Reserved by DAC38RF8x
except for lane configuration checking.
6-2
CF
R/W
00000
Lane configuration data for link. Reserved by DAC38RF8x
except for lane configuration checking.
1-0
CS
R/W
00
Lane configuration data for link. Reserved by DAC38RF8x
except for lane configuration checking.
8.5.52 JESD Sync Request Register (address = 0x51) [reset = 0x00FF]
Figure 127. JESD Sync Request Register (JESD_SYNC_REQ)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 93. JESD_SYNC_REQ Field Descriptions
Bit
15:8
7:0
108
Field
Type
Reset
Description
DID
R/W
0x00
Lane configuration
0xFF
These bits select which errors cause a sync request. Sync
requests take priority over the error notification; so if sync
request isn’t desired; set these bits to a ‘0’.
bit 7 = multi-frame alignment error
bit 6 = frame alignment error
bit 5 = link configuration error
bit 4 = elastic buffer overflow (bad RBD value)
bit 3 = elastic buffer end char mismatch (match_ctrl match_data)
bit 2 = code synchronization error
bit 1 = 8b/10b not-in-table code error
bit 0 = 8b/10b disparity error
SYNC_REQUEST
R/W
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8.5.53 JESD Error Output Register (address = 0x52) [reset = 0x00FF]
Figure 128. JESD Error Output Register (JESD_ERR_OUT)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 94. JESD_ERR_OUT Field Descriptions
Bit
Field
Type
Reset
Description
Reserved
R/W
000000
Reserved
9
DISABLE_ERR_RPT
R/W
0
Assertion means that errors will not be reported on the sync_n
output.
8
PHADJ
R/W
0
Lane configuration
0xFF
These bits select the errors generated are counted in the err_c
for the link. The bits also control what signals are sent out the
pad_syncb pin for error notification.
bit 7 = multi-frame alignment error
bit 6 = frame alignment error
bit 5 = link configuration error
bit 4 = elastic buffer overflow (bad RBD value)
bit 3 = elastic buffer end char mismatch (match_ctrl match_data)
bit 2 = code synchronization error
bit 1 = 8b/10b not-in-table code error
bit 0 = 8b/10b disparity error
15:10
7:0
ERR_ENA
R/W
8.5.54 JESD ILA Check 1 Register (address = 0x53) [reset = 0x0100]
Figure 129. JESD ILA Check 1 Register (JESD_ILA_CFG1)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 95. JESD_ILA_CFG1 Field Descriptions
Bit
Field
Type
Reset
Description
15:8
ILA_M
R/W
0x01
JESD M-1 configuration value used only for ILA checking; may
be set independently of the actual JESD mode
7:0
ILA_F
R/W
0x00
JESD F-1 configuration value used only for ILA checking; may
be set independently of the actual JESD mode
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8.5.55 JESD ILA Check 2 Register (address = 0x54) [reset = 0x8E60]
Figure 130. JESD ILA Check 2 Register (JESD_ILA_CFG2)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 96. JESD_ILA_CFG2 Field Descriptions
Bit
Field
Type
Reset
Description
15
ILA_HD
R/W
1
JESD HD configuration value used only for ILA checking; may
be set independently of the actual JESD mode
14:10
ILA_L
R/W
00011
JESD L-1 configuration value used only for ILA checking; may
be set independently of the actual JESD mode
9:5
ILA_K
R/W
10011
JESD K-1 configuration value used only for ILA checking; may
be set independently of the actual JESD mode
4:0
ILA_S
R/W
00000
JESD S-1 configuration value used only for ILA checking; may
be set independently of the actual JESD mode
8.5.56 JESD SYSREF Mode Register (address = 0x5C) [reset = 0x0001]
Figure 131. JESD SYSREF Mode Register (JESD_SYSR_MODE)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 97. JESD_SYSR_MODE Field Descriptions
Bit
15:4
3
2:0
110
Field
Type
Reset
Description
Reserved
R/W
0x000
Reserved
ERR_CNT_CLR
R/W
0
A transition from 0->1 causes the error_cnt to be cleared
001
Determines how SYSREF is used in the JESD synchronizing
block.
000 = Don’t use SYSREF pulse
001 = Use all SYSREF pulses
010 = Use only the next SYSREF pulse
011 = Skip one SYSREF pulse then use only the next one
100 = Skip one SYSREF pulse then use all pulses.
101 = skip two SYSREFs and then use one
110 = skip two SYSREFs and then use all
SYSREF_MODE
R/W
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8.5.57 JESD Crossbar Configuration 1 Register (address = 0x5F) [reset = 0x0123]
Figure 132. JESD Crossbar Configuration 1 Register (JESD_CROSSBAR1)
15
Reserved
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
Reserved
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 98. JESD_CROSSBAR1 Field Descriptions
Bit
Field
Type
Reset
Description
15
Reserved
R/W
0
Reserved
14:12
11
10:8
7
6:4
3
2:0
OCTETPATH0_SEL
R/W
000
These bits are used by the cross-bar switch to map any lane to
any other lane. The 3 bit term tells the mapper block what lane
this particular lane is supposed to be treated as.
000 = treat as lane0
001 = treat as lane1
010 = treat as lane2
011 = treat as lane3
100 = treat as lane4
101 = treat as lane5
110 = treat as lane6
111 = treat as lane7
Reserved
R/W
0
Reserved
OCTETPATH1_SEL
R/W
001
These bits are used by the cross-bar switch to map any lane to
any other lane. The 3 bit term tells the mapper block what lane
this particular lane is supposed to be treated as.
000 = treat as lane0
001 = treat as lane1
010 = treat as lane2
011 = treat as lane3
100 = treat as lane4
101 = treat as lane5
110 = treat as lane6
111 = treat as lane7
Reserved
R/W
0
Reserved
OCTETPATH2_SEL
R/W
010
These bits are used by the cross-bar switch to map any lane to
any other lane. The 3 bit term tells the mapper block what lane
this particular lane is supposed to be treated as.
000 = treat as lane0
001 = treat as lane1
010 = treat as lane2
011 = treat as lane3
100 = treat as lane4
101 = treat as lane5
110 = treat as lane6
111 = treat as lane7
Reserved
R/W
0
Reserved
011
These bits are used by the cross-bar switch to map any lane to
any other lane. The 3 bit term tells the mapper block what lane
this particular lane is supposed to be treated as.
000 = treat as lane0
001 = treat as lane1
010 = treat as lane2
011 = treat as lane3
100 = treat as lane4
101 = treat as lane5
110 = treat as lane6
111 = treat as lane7
OCTETPATH3_SEL
R/W
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8.5.58 JESD Crossbar Configuration 2 Register (address = 0x60) [reset = 0x4567]
Figure 133. JESD_CROSSBAR2 Field DBits to Determine What Version of Build for the chip.escriptions
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
1
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 99. JESD_CROSSBAR2 Field Descriptions
Bit
Field
Type
Reset
Description
15
Reserved
R/W
0
Reserved
14:12
11
10:8
7
6:4
3
2:0
112
OCTETPATH4_SEL
R/W
100
These bits are used by the cross-bar switch to map any lane to
any other lane. The 3 bit term tells the mapper block what lane
this particular lane is supposed to be treated as.
000 = treat as lane0
001 = treat as lane1
010 = treat as lane2
011 = treat as lane3
100 = treat as lane4
101 = treat as lane5
110 = treat as lane6
111 = treat as lane7
Reserved
R/W
0
Reserved
OCTETPATH5_SEL
R/W
101
These bits are used by the cross-bar switch to map any lane to
any other lane. The 3 bit term tells the mapper block what lane
this particular lane is supposed to be treated as.
000 = treat as lane0
001 = treat as lane1
010 = treat as lane2
011 = treat as lane3
100 = treat as lane4
101 = treat as lane5
110 = treat as lane6
111 = treat as lane7
Reserved
R/W
0
Reserved
OCTETPATH6_SEL
R/W
110
These bits are used by the cross-bar switch to map any lane to
any other lane. The 3 bit term tells the mapper block what lane
this particular lane is supposed to be treated as.
000 = treat as lane0
001 = treat as lane1
010 = treat as lane2
011 = treat as lane3
100 = treat as lane4
101 = treat as lane5
110 = treat as lane6
111 = treat as lane7
Reserved
R/W
0
Reserved
111
These bits are used by the cross-bar switch to map any lane to
any other lane. The 3 bit term tells the mapper block what lane
this particular lane is supposed to be treated as.
000 = treat as lane0
001 = treat as lane1
010 = treat as lane2
011 = treat as lane3
100 = treat as lane4
101 = treat as lane5
110 = treat as lane6
111 = treat as lane7
OCTETPATH7_SEL
R/W
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8.5.59 JESD Alarms for Lane 0 Register (address = 0x64) [reset = 0x0000]
Figure 134. JESD Alarms for Lane 0 Register (JBits to determine what version of build for the
chip.ESD_ALM_L0)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
0
W0C
2
1
W0C
1
0
W0C
0
0
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 100. JESD_ALM_L0 Field Descriptions
Bit
Field
Type
Reset
Description
15:8
ALM_LANE0_ERR
W0C
0x00
Lane0 errors:
bit 15 = multiframe alignment error
bit 14 = frame alignment error
bit 13 = link configuration error
bit 12 = elastic buffer overflow (bad RBD value)
bit 11 = elastic buffer match error. The first non-/K/ doesn’t
match “match_ctrl” and “match_data” programmed values.
bit 10 = code synchronization error
bit 9 = 8b/10b not-in-table code error
bit 8 = 8b/10b disparity error
7:4
Reserved
W0C
0x0
Reserved
0x0
Lane0 FIFO errors:
bit 3 = write_error : High if write request and FIFO is full (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 2 = write_full : FIFO is FULL
bit 1 = read_error : High if read request with empty FIFO (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 0 = read_empty : FIFO is empty
3:0
ALM_FIFO0_FLAGS
W0C
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8.5.60 JESD Alarms for Lane 1 Register (address = 0x65 01100101) [reset = 0x0000]
Figure 135. JESD Alarms for Lane 1 Register (JESD_ALM_L1)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
0
W0C
2
1
W0C
1
0
W0C
0
1
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 101. JESD_ALM_L1 Field Descriptions
Bit
Type
Reset
Description
15:8
ALM_LANE1_ERR
W0C
0x00
Lane1 errors:
bit 15 = multiframe alignment error
bit 14 = frame alignment error
bit 13 = link configuration error
bit 12 = elastic buffer overflow (bad RBD value)
bit 11 = elastic buffer match error. The first non-/K/ doesn’t
match “match_ctrl” and “match_data” programmed values.
bit 10 = code synchronization error
bit 9 = 8b/10b not-in-table code error
bit 8 = 8b/10b disparity error
7:4
Reserved
W0C
0x0
Reserved
0x0
Lane1 FIFO errors:
bit 3 = write_error : High if write request and FIFO is full (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 2 = write_full : FIFO is FULL
bit 1 = read_error : High if read request with empty FIFO (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 0 = read_empty : FIFO is empty
3:0
114
Field
ALM_FIFO1_FLAGS
W0C
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8.5.61 JESD Alarms for Lane 2 Register (address = 0x66) [reset = 0x0000]
Figure 136. JESD Alarms for Lane 2 Register (JESD_ALM_L2)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
0
W0C
2
1
W0C
1
1
W0C
0
0
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 102. JESD_ALM_L2 Field Descriptions
Bit
Field
Type
Reset
Description
15:8
ALM_LANE2_ERR
W0C
0x00
Lane2 errors:
bit 15 = multiframe alignment error
bit 14 = frame alignment error
bit 13 = link configuration error
bit 12 = elastic buffer overflow (bad RBD value)
bit 11 = elastic buffer match error. The first non-/K/ doesn’t
match “match_ctrl” and “match_data” programmed values.
bit 10 = code synchronization error
bit 9 = 8b/10b not-in-table code error
bit 8 = 8b/10b disparity error
7:4
Reserved
W0C
0x0
Reserved
0x0
Lane2 FIFO errors:
bit 3 = write_error : High if write request and FIFO is full (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 2 = write_full : FIFO is FULL
bit 1 = read_error : High if read request with empty FIFO (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 0 = read_empty : FIFO is empty
3:0
ALM_FIFO2_FLAGS
W0C
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8.5.62 JESD Alarms for Lane 3 Register (address = 0x67) [reset = 0x0000]
Figure 137. JESD Alarms for Lane 3 Register (JESD_ALM_L3)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
0
W0C
2
1
W0C
1
1
W0C
0
1
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 103. JESD_ALM_L3 Field Descriptions
Bit
Type
Reset
Description
15:8
ALM_LANE3_ERR
W0C
0x00
Lane3 errors:
bit 15 = multiframe alignment error
bit 14 = frame alignment error
bit 13 = link configuration error
bit 12 = elastic buffer overflow (bad RBD value)
bit 11 = elastic buffer match error. The first non-/K/ doesn’t
match “match_ctrl” and “match_data” programmed values.
bit 10 = code synchronization error
bit 9 = 8b/10b not-in-table code error
bit 8 = 8b/10b disparity error
7:4
Reserved
W0C
0x0
Reserved
0x0
Lane3 FIFO errors:
bit 3 = write_error : High if write request and FIFO is full (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 2 = write_full : FIFO is FULL
bit 1 = read_error : High if read request with empty FIFO (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 0 = read_empty : FIFO is empty
3:0
116
Field
ALM_FIFO3_FLAGS
W0C
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8.5.63 JESD Alarms for Lane 4 Register (address = 0x68) [reset = 0x0000]
Figure 138. JESD Alarms for Lane 4 Register (JESD_ALM_L4)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
1
W0C
2
0
W0C
1
0
W0C
0
0
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 104. JESD_ALM_L4 Field Descriptions
Bit
Field
Type
Reset
Description
15:8
ALM_LANE4_ERR
W0C
0x00
Lane4 errors:
bit 15 = multiframe alignment error
bit 14 = frame alignment error
bit 13 = link configuration error
bit 12 = elastic buffer overflow (bad RBD value)
bit 11 = elastic buffer match error. The first non-/K/ doesn’t
match “match_ctrl” and “match_data” programmed values.
bit 10 = code synchronization error
bit 9 = 8b/10b not-in-table code error
bit 8 = 8b/10b disparity error
7:4
Reserved
W0C
0x0
Reserved
0x0
Lane4 FIFO errors:
bit 3 = write_error : High if write request and FIFO is full (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 2 = write_full : FIFO is FULL
bit 1 = read_error : High if read request with empty FIFO (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 0 = read_empty : FIFO is empty
3:0
ALM_FIFO4_FLAGS
W0C
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8.5.64 JESD Alarms for Lane 5 Register (address = 0x69) [reset = 0x0000]
Figure 139. 8.4.60 JESD Alarms for Lane 5 Register (address = 0x69) [reset = 0x0000]
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
1
W0C
2
0
W0C
1
0
W0C
0
1
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 105. JESD_ALM_L5 Field Descriptions
Bit
Type
Reset
Description
15:8
ALM_LANE5_ERR
W0C
0x00
Lane5 errors:
bit 15 = multiframe alignment error
bit 14 = frame alignment error
bit 13 = link configuration error
bit 12 = elastic buffer overflow (bad RBD value)
bit 11 = elastic buffer match error. The first non-/K/ doesn’t
match “match_ctrl” and “match_data” programmed values.
bit 10 = code synchronization error
bit 9 = 8b/10b not-in-table code error
bit 8 = 8b/10b disparity error
7:4
Reserved
W0C
0x0
Reserved
0x0
Lane5 FIFO errors:
bit 3 = write_error : High if write request and FIFO is full (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 2 = write_full : FIFO is FULL
bit 1 = read_error : High if read request with empty FIFO (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 0 = read_empty : FIFO is empty
3:0
118
Field
ALM_FIFO5_FLAGS
W0C
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8.5.65 JESD Alarms for Lane 6 Register (address = 0x6A [reset = 0x0000]
Figure 140. JESD Alarms for Lane 6 Register (JESD_ALM_L6)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
1
W0C
2
0
W0C
1
1
W0C
0
0
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 106. JESD_ALM_L6 Field Descriptions
Bit
Field
Type
Reset
Description
15:8
ALM_LANE6_ERR
W0C
0x00
Lane6 errors:
bit 15 = multiframe alignment error
bit 14 = frame alignment error
bit 13 = link configuration error
bit 12 = elastic buffer overflow (bad RBD value)
bit 11 = elastic buffer match error. The first non-/K/ doesn’t
match “match_ctrl” and “match_data” programmed values.
bit 10 = code synchronization error
bit 9 = 8b/10b not-in-table code error
bit 8 = 8b/10b disparity error
7:4
Reserved
W0C
0x0
Reserved
0x0
Lane6 FIFO errors:
bit 3 = write_error : High if write request and FIFO is full (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 2 = write_full : FIFO is FULL
bit 1 = read_error : High if read request with empty FIFO (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 0 = read_empty : FIFO is empty
3:0
ALM_FIFO6_FLAGS
W0C
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8.5.66 JESD Alarms for Lane 7 Register (address = 0x6B) [reset = 0x0000]
Figure 141. JESD Alarms for Lane 7 Register (JESD_ALM_L7)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
1
W0C
2
0
W0C
1
1
W0C
0
1
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 107. JESD Alarms for Lane 7 Register (JESD_ALM_L7)
Bit
Field
Type
Reset
Description
15:8
ALM_LANE7_ERR
W0C
0x00
Lane7 errors:
bit 15 = multiframe alignment error
bit 14 = frame alignment error
bit 13 = link configuration error
bit 12 = elastic buffer overflow (bad RBD value)
bit 11 = elastic buffer match error. The first non-/K/ doesn’t
match “match_ctrl” and “match_data” programmed values.
bit 10 = code synchronization error
bit 9 = 8b/10b not-in-table code error
bit 8 = 8b/10b disparity error
7:4
Reserved
W0C
0x0
Reserved
0x0
Lane7 FIFO errors:
bit 3 = write_error : High if write request and FIFO is full (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 2 = write_full : FIFO is FULL
bit 1 = read_error : High if read request with empty FIFO (NOTE:
only released when JESD block is initialize with mem_init_state)
bit 0 = read_empty : FIFO is empty
3:0
ALM_FIFO7_FLAGS
W0C
8.5.67 SYSREF and PAP Alarms Register (address = 0x6C) [reset = 0x0000]
Figure 142. SYSREF and PAP Alarms Register (ALM_SYSREF_PAP)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
1
W0C
2
1
W0C
1
0
W0C
0
0
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 108. ALM_SYSREF_PAP Field Descriptions
Bit
Field
Type
Reset
Description
Reserved
W0C
0
Reserved
12
ALM_SYSREF_ERR
W0C
Alarm caused when the sysref is placed at an incorrect location
11
ALM_FROM_SHORTTEST
W0C
This is the alarm from JESD during the SHORT TEST checking.
10:7
ALM_PAP
W0C
0x0
The alarms from the PAP blocks indicated which PAP was
triggered. bit0 = PAPA bit1 = PAPB bit2 = PAPC bit3 = PAPD
6:2
Reserved
W0C
0x0
Reserved
1
ALM_DIV192_ZERO
W0C
0
This is asserted if the clkdiv192 in the CDRV_SER shift register
is all zeros.
0
Not Used
W0C
0
Not Used
15:13
120
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8.5.68 Clock Divider Alarms 1 Register (address = 0x6D) [reset = 0x0000]
Figure 143. Clock Divider Alarms 1 Register (ALM_CLKDIV1)
15
0
W0C
14
0
W0C
13
0
W0C
12
0
W0C
11
0
W0C
10
0
W0C
9
0
W0C
8
x
W0C
7
0
W0C
6
1
W0C
5
1
W0C
4
0
W0C
3
1
W0C
2
1
W0C
1
0
W0C
0
1
W0C
LEGEND: R/W = Read/Write; R = Read only; W0C = Write 0 to clear bit; -n = value after reset; -n = value after reset
Table 109. ALM_CLKDIV1 Field Descriptions
Bit
Field
Type
Reset
Description
15
ALM_DIV8_ZERO
W0C
0
Asserted if the clkdiv8 in the CDRV_SER shift register is all
zeros.
14
ALM_DIV12_ZERO
W0C
0
Asserted if the clkdiv12 in the CDRV_SER shift register is all
zeros.
13
ALM_DIV16_ZERO
W0C
0
Asserted if the clkdiv16 in the CDRV_SER shift register is all
zeros.
12
ALM_DIV24_ZERO
W0C
0
Asserted if the clkdiv24 in the CDRV_SER shift register is all
zeros. (Connected to the div18 port)
11
ALM_DIV20_ZERO
W0C
0
Asserted if the clkdiv20 in the CDRV_SER shift register is all
zeros.
10
ALM_DIV32_ZERO
W0C
0
Asserted if the clkdiv32 in the CDRV_SER shift register is all
zeros.
9
ALM_DIV36_ZERO
W0C
0
Asserted if the clkdiv36 in the CDRV_SER shift register is all
zeros.
8
ALM_DIV40_ZERO
W0C
0
Asserted if the clkdiv40 in the CDRV_SER shift register is all
zeros.
7
ALM_DIV48_ZERO
W0C
0
Asserted if the clkdiv48 in the CDRV_SER shift register is all
zeros.
6
ALM_DIV64_ZERO
W0C
0
Asserted if the clkdiv64 in the CDRV_SER shift register is all
zeros.
5
ALM_DIV72_ZERO
W0C
0
Asserted if the clkdiv72 in the CDRV_SER shift register is all
zeros.
4
ALM_DIV80_ZERO
W0C
0
Asserted if the clkdiv80 in the CDRV_SER shift register is all
zeros.
3
ALM_DIV96_ZERO
W0C
0
Asserted if the clkdiv96 in the CDRV_SER shift register is all
zeros.
2
ALM_DIV128_ZERO
W0C
0
Asserted if the clkdiv128 in the CDRV_SER shift register is all
zeros.
1
ALM_DIV144_ZERO
W0C
0
Asserted if the clkdiv144 in the CDRV_SER shift register is all
zeros.
0
ALM_DIV160_ZERO
W0C
0
Asserted if the clkdiv160 in the CDRV_SER shift register is all
zeros.
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8.5.69 Clock Configuration Register (address = 0x0A) [reset = 0xF000]
Figure 144. Clock Configuration Register (CLK_CONFIG)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 110. CLK_CONFIG Field Descriptions
Bit
Field
Type
Reset
Description
15
RCLK_SYNC_ENA
RW
1
When asserted the sysref is used to sync the clock divider in the
centralclkdiv. This should be disabled after initial syncing.
14
FRCLK_DIV_ENA
RW
1
When asserted the full rate clock divider that provides the DIV4
phases to the DACs is enabled
13
DACA_FRCLK_ENA
RW
1
When asserted the full rate clock to the DACA block is enabled
12
DACB_FRCLK_ENA
RW
1
When asserted the full rate clock to the DACB block is enabled
11
DACA_DUMDATA
RW
0
Enables dummy data generation for DACA when set high
10
DACB_DUMDATA
RW
0
Enables dummy data generation for DACB when set high
9:2
Reserved
RW
0x000
Reserved
1
QRCLOCK_DACA_ENA
RW
1
Turns on the quarter rate clock for DACA when '1'
0
QRCLOCK_DACB_ENA
RW
1
Turns on the quarter rate clock for DACB when '1'
8.5.70 Sleep Configuration Register (address = 0x0B) [reset = 0x0022]
Figure 145. Clock Configuration Register (SLEEP_CONFIG)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 111. SLEEP_CONFIG Field Descriptions
Bit
15:9
122
Field
Type
Reset
Description
Reserved
RW
0000000
Reserved
8
VBGR_SLEEP
RW
0
Turns off the 'bandgap-over-R' bias
7
Reserved
RW
0
Reserved
6
TSENSE_SLEEP
RW
0
Turns off the temperature sensor
5
PLL_SLEEP
RW
1
Puts the PLL into sleep mode (FUSE Controlled)
4
CLKRECV_SLEEP
RW
0
When asserted the clock input receiver gets put into sleep
mode. This also affects the FIFO_OSTR receiver as well.
3
DACA_SLEEP
RW
0
Puts the DACA into sleep mode
2
DACB_SLEEP
RW
0
Puts the DACB into sleep mode
1
CLK_TX_SLEEP
RW
1
When asserted the PLL TX clock output is in low power mode.
0
Reserved
RW
0
Reserved
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8.5.71 Divided Output Clock Configuration Register (address = 0x0C) [reset = 0x8000]
Figure 146. Divided Output Clock Configuration Register (CLK_OUT)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 112. CLK_OUT Field Descriptions
Bit
Field
Type
Reset
Description
15
CLK_TX_IDLE
R/W
1
When high puts the CLK_TX circuitry in idle mode during which
the CLKTX+ and CLKTX- output pins are driven to the proper
common-mode levels in order to charge the external AC
coupling caps. When low allows the divided clock to be driven
onto the CLKTX+ and CLKTX- output pins.
CLK_TX_DIVSELECT
R/W
01
Selects either div2, div3 or div 4 output.
00 = divided by 3
01 = divided by 4
10 = divided by 2
11 = not valid
14:13
Reserved
R/W
0
Reserved
11:8
12
CLK_TX_SWING
R/W
0x0
Sets desired swing on CLKTX+ and CLKTX- outputs in mVppdiff
0x0 125
0x1 232
0x2 337
0x3 440
0x4 540
0x5 639
0x6 736
0x7 831
0x8 924
0x9 1012
0xA 1097
0xB 1178
0xC 1255
0xD 1329
0xE 1398
0xF 1462
7:3
Reserved
R/W
00000
Reserved
2
CLK_TX_FLIP
R/W
0
Flips the polarity of CLKTX
1
TX_SYNC_ENA
R/W
1
Syncs the CLKTX with SYSREF when asserted
0
EXTREF_ENA
R/W
0
Allows the chip to use an external refernce(1) or the internal
reference(0)
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8.5.72 DAC Fullscale Current Register (address = 0x0D) [reset = 0xF000]
Figure 147. DAC Fullscale Current Register (DACFS)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 113. DACFS Field Descriptions
Bit
Field
Type
Reset
Description
15:12
DACFS
R/W
0xF
Scales the output current is 16 equal steps from 10-40mA
(10mA + 2mA*DACFS)
10:0
Reserved
R/W
0x000
Reserved
8.5.73 Internal SYSREF Generator Register (address = 0x10) [reset = 0x0000]
Figure 148. Internal SYSREF Register (LCMGEN)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 114. LCMGEN Field Descriptions
Bit
Field
Type
Reset
Description
Reserved
R/W
0x00
Reserved
3
LCMGEN_ENA
R/W
0
Enables the LCM custom logic
2
LCMGEN_RESET
R/W
0
Reset the LCM custom logic
1
LCMGEN_SPI_SYSREF_ENA
R/W
0
TBD
0
LCM_SYSREF_OUTSEL
R/W
0
Chooses between internal and external SYSREF
15:4
8.5.74 Counter for Internal SYSREF Generator Register (address = 0x11) [reset = 0x0000]
Figure 149. Counter for Internal SYSREF Generator Register (LCMGEN_DIV)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 115. LCMGEN_DIV Field Descriptions
Bit
15:0
124
Field
Type
Reset
Description
LCMGEN_DIV
R/W
0x00
Counter setting for the LCMGEN block
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8.5.75 SPI SYSREF for Internal SYSREF Generator Register (address = 0x12) [reset = 0x0000]
Figure 150. SPI SYSREF for Internal SYSREF Generator Register (LCMGEN_SPISYSREF)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 116. LCMGEN_SPISYSREF Field Descriptions
Bit
15:1
0
Field
Type
Reset
Description
Reserved
R/W
0x00
Reserved
LCMGEN_SPI_SYSREF
R/W
0
SPI SYSREF for the LCMGEN block
8.5.76 Digital Test Signals Register (address = 0x1B) [reset = 0x0000]
Figure 151. Digital Test Signals Register (DTEST)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 117. DTEST Field Descriptions
Bit
Field
Type
Reset
Description
15
Reserved
R/W
0
Reserved
DTEST_LANE
R/W
000
Selects the lane to check for the signals selected by field
DTEST
14:12
11:8
DTEST
R/W
0x0
Allows digital test signals to come out the ALARM pin.
0000 : Test disabled; normal ALARM pin function
0001 : SERDES lanes 0 – 3 PLL clock/80
0010 : SERDES lanes 4 – 7 PLL clock/80
0011 : TESTFAIL (lane selected by field DTEST_LANE)
0100 : SYNC (lane selected by field DTEST_LANE)
0101 : OCIP (lane selected by field DTEST_LANE)
0110 : EQUNDER (lane selected by field DTEST_LANE)
0111 : EQOVER (lane selected by field DTEST_LANE)
1000 – 1111 : not used
7:0
Reserved
R/W
0x00
Reserved
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8.5.77 Sleep Pin Control Register (address = 0x23) [reset = 0xFFFF]
These fields control the routing of the SLEEP signal to different blocks. Assertion means that the SLEEP signal
will be sent to the block. These bits do not override the SPI bits; just the SLEEP signal from the PAD.
Figure 152. Sleep Pin Control Register (SLEEP_CNTL)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 118. SLEEP_CNTL Field Descriptions
Bit
15:10
Type
Reset
Description
Reserved
R/W
11111
Reserved
9
CLKOUT_SLEEP
R/W
1
Allows the output clock to sleep
8
BG_SLEEP
R/W
1
Allows the band gap to sleep
7
TEMP_SLEEP
R/W
1
Allows the temp sensor to sleep
6
PLL_CP_SLEEP
R/W
1
Allows the PLL charge pump to sleep
5
PLL_SLEEP
R/W
1
Allows the PLL to sleep
4
CLK_RECV_SLEEP
R/W
1
Allows the clock receiver to sleep
3:2
126
Field
Reserved
R/W
11
Reserved
1
DACB_SLEEP
R/W
1
Allows DACB to sleep
0
DACA_SLEEP
R/W
1
Allows DACA to sleep
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8.5.78 SYSREF Capture Circuit Control Register (address = 0x24) [reset = 0x1000]
Figure 153. SYSREF Capture Circuit Control Register (SYSR_CAPTURE)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
1
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 119. SYSR_CAPTURE Field Descriptions
Bit
15:14
13:12
11
10:2
1
0
Field
SYSR_PHASE_WDW
SYSR_ALIGN_DLY
Type
R/W
R/W
Reset
Description
00
sysref phase alignment tolerance window Centers sysref capture
window as follows:
00 = Centered on phase φ12 (**DEFAULT**)
01 = Centered on phase φ23
10 = Centered on phase φ34
11 = Centered on phase φ41
01
sysref alignment offset delay Optional alignment offset that
allows system designer to work around hardware (e.g. PCB)
alignment errors by letting him specify that the sysref pulse
should be treated as occurring one device clock earlier or later
than its observed position. Legal settings are as follows:
00 = Offset by -1 device clock cycles. Treat sysref as if it were
captured 1 cycle earlier.
01 = No offset (**DEFAULT**)
10 = Offset by +1 device clock cycles. Treat sysref as if it were
captured 1 cycle later.
11 = Reserved
SYSR_STATUS_ENA
R/W
0
Enable alignment status monitoring Enable logic that generates
sysref alignment status information and accumulates statistics
that can be read by the user.
0 = Disable sysref alignment status outputs (**DEFAULT**).
Used during normal operation.
1 = Enable sysref alignment status outputs. Used when
characterizing sysref capture timing.
Reserved
R/W
0x000
Reserved
SYSR_ALIGN_SYNC
R/W
0
Write a ‘1’ to this bit to clear accumulated sysref align statistics
0
Bypass sysref alignment logic. Bypass the 4x oversampled
sysref alignment logic and instead capture the sysref signal
using the legacy implementation of a flip-flop clocked directly by
the rising edge of the device clock.
0 = Capture sysref using full-featured alignment circuit
(**DEFAULT**)
1 = Bypass sysref alignment logic
NOTE: When mem_sysref_bypass_align is enabled, the other
sysref alignment controls have no effect.
SYSR_BYPS_ALIGN
R/W
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8.5.79 Clock Input and PLL Configuration Register (address = 0x31) [reset = 0x0200]
Figure 154. Clock Input and PLL Configuration Register (CLK_PLL_CFG)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 120. Clock Input and PLL Configuration Register (CLK_PLL_CFG)
Bit
Field
Type
Reset
Description
Reserved
R/W
00
Reserved
13
SEL_EXTCLK_DIFFSE
R/W
0
Selects the external differential or single ended clock for
DACCLK.
0 = differential
1 = single ended
12
PLL_RESET
R/W
0
When set the M divider; N divider and PFD are held reset
11
PLL_NDIVSYNC_ENA
R/W
0
When asserted; the SYSREF input is used to sync the N
dividers of the PLL.
10
PLL_ENA
R/W
0
Enables the PLL output as the DAC clock when set; the clock
provided at the DACCLKP/N is used as the PLL reference clock.
When cleared; the PLL is bypassed and the clock provided at
the DACCLKP/N pins is used as the DAC clock
9
PLL_CP_SLEEP
R/W
1
Must be set to '0' for proper PLL operation.
1 = Charge pump is put to sleep and can be driven by external
source through the ATEST pins.
8
15:14
128
Reserved
R/W
0
Reserved
7:3
PLL_N_M1
R/W
00000
Reference clock divider; divide by is N+1
2:0
LOCKDET_ADJ
R/W
000
Adjusts the lock detector sensitivity. Upper bit isn't used:
x00 - highest sensitivity x11 - lowest sensitivity
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8.5.80 PLL Configuration 1 Register (address = 0x32) [reset = 0x0308]
Figure 155. PLL Configuration 1 Register (PLL_CONFIG1)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 121. CONFIG1 Field Descriptions
Bit
Field
Type
Reset
Description
15:8
PLL_M_M1
R/W
0x03
VCO feedback divider; divide by is 4(M+1)
7:4
Reserved
R/W
0x0
Reserved
3:0
PLL_VCO_RDAC
R/W
0x8
Controls the VCO amplitude
8.5.81 PLL Configuration 2 Register (address = 0x33) [reset = 0x4018]
Figure 156. PLL Configuration 2 Register (PLL_CONFIG2)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 122. PLL_CONFIG2 Field Descriptions
Bit
Field
Type
Reset
Description
15
PLL_VCOSEL
R/W
0
Selects between two VCOs
0 = 5.9 GHz VCO(2 turn inductor in upper VCO)
1 = 8.9 GHz VCO (1 turn in the lower VCO)
14:8
PLL_VCO
R/W
1000000
VCO frequency range
7:6
Reserved
R/W
000
Reserved
5:2
PLL_CP_ADJ
R/W
0110
Adjusts the charge pump current; 0 to 1.55 mA in 50 µA steps.
Setting to 0000 will hold the LPF pin at 0 V
1
Reserved
R/W
0
Reserved
0
GSMPLL_ENA
R/W
0
Enables the GSM PLL (coupled VCOs) if asserted
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8.5.82 LVDS Output Configuration Register (address = 0x34) [reset = 0x0000]
Figure 157. LVDS Output Configuration Register (LVDS_CONFIG)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
0
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 123. LVDS_CONFIG Field Descriptions
Bit
Field
Type
Reset
Description
15
LVDS_LOPWRB
R/W
0
LVDS Output current control LSB; allows output current to be
scaled from ~2 mA to ~4 mA
14
LVDS_LOPWRA
R/W
0
LVDS Output current control MSB; allows output current to be
scaled from ~2 mA to ~4 mA
13
LVDS_LPSEL
R/W
0
SYNC LVDS output on chip termination control; 100 Ω when
cleared; 200 Ω
Output current settings for the combination of bits 15:13
110 = 4.00 mA
010 = 3.50 mA
100 = 3.00 mA
000 = 2.50 mA – Default current
111 = 4.00 mA
011 = 3.33 mA
101 = 2.66 mA
001 = 2.00 mA
12
LVDS_EFUSE_SEL
R/W
0
Enable LVDS bias bandgap reference voltage to the ATEST
multiplexer.
LVDS_TRIM
R/W
00
Adjusts the LVDS 1.2 V reference. LVDS_TRIM_ENA must be
set and LVDS_EFUSE_SEL must be cleared for these bits to
have any effect.
10 +70 mV
00 -70 mV
01 default
11 -20 mV.
9
LVDS_TRIM_ENA
R/W
0
When set and LVDS_EFUSE_SEL is cleared; the LVDS_TRIM
adjustment is enabled. When cleared; the LVDS_TRIM has no
effect.
8
LVDS_SYNC0\_PD
R/W
0
The SYNC0 LVDS output is in power down.
7
Reserved
R/W
0
Reserved
6
LVDS_SYNC0\_CM
R/W
0
SYNC0 LVDS output common mode is 1.2 V when cleared; 0.9
V when set.
Reserved
R/W
0x00
Reserved
11:10
5:0
130
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8.5.83 Fuse Farm clock divider Register (address = 0x35) [reset = 0x0018]
Figure 158. Fuse Farm clock divider Register (PLL_FDIV)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/1W
4
1
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after rese1t
Table 124. PLL_FDIV Field Descriptions
Bit
Field
Type
Reset
Description
15
SERDES_CLK_SEL
R/W
0
Select either the PLL output of the DACCLK from the pad.
0 = DACCLK pad
1 = PLL output
14:11
SERDES_REFCLK_DIV
R/W
0x0
The divide amount for the serdes REFCLK
10:2
Reserved
R/W
0x000
Reserved
10
These bits select the pre-divide on the DACCLK input clock
before the DACCLK is used in the dividers used in the SERDES
PLL REFCLK and the Fusefarm SYSCLK.
00 = if DACCLK input ≤ 2 GHz; prediv is set to div1
01 = if DACCLK input is ≤ 4 GHz and > 2 GHz, prediv is set to
div2
10 = if DACCLK input is ≤ 9 GHz and > 4 GHz, prediv is set to
div4
11 = Not valid
1:0
SERDES_REFCLK_PREDIV
R/W
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8.5.84 Serdes Clock Configuration Register (address = 0x3B) [reset = 0x0002]
Figure 159. Serdes Clock Configuration Register (SRDS_CLK_CFG)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/1W
4
1
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after rese1t
Table 125. SRDS_CLK_CFG Field Descriptions
Bit
Field
Type
Reset
Description
15
SERDES_CLK_SEL
R/W
0
Select either the PLL output of the DACCLK from the pad.
0 = DACCLK pad
1 = PLL output
14:11
SERDES_REFCLK_DIV
R/W
0x0
The divide amount for the serdes REFCLK
10:2
Reserved
R/W
0x000
Reserved
10
These bits select the pre-divide on the DACCLK input clock
before the DACCLK is used in the dividers used in the SERDES
PLL REFCLK and the Fusefarm SYSCLK.
00 = if DACCLK input ≤ 2 GHz; prediv is set to div1
01 = if DACCLK input is ≤ 4 GHz and > 2 GHz, prediv is set to
div2
10 = if DACCLK input is ≤ 9 GHz and > 4 GHz, prediv is set to
div4
11 = Not valid
1:0
SERDES_REFCLK_PREDIV
R/W
8.5.85 Serdes PLL Configuration Register (address = 0x3C) [reset = 0x8228]
Figure 160. Serdes PLL Configuration Register (SRDS_PLL_CFG)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 126. SRDS_PLL_CFG Field Descriptions
Bit
Field
Type
Reset
Description
15
ENDIVCLK
R/W
1
Enable divided by 5 output clock
14:3
CLKBYP
R/W
00
Serdes clock bypass
12:11
LB
R/W
00
Serdes PLL loop bandwidth
10
SLEEPPLL
R/W
0
Serdes PLL Sleep
9
VRANGE
R/W
1
Serdes PLL loop filter range
MPY
R/W
00010100
Serdes reference clock multiply factor
CORRECT
R/W
0
AND'ed with LANE_ENA so it must be set to 1 for correct
behavior
8:1
0
132
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8.5.86 Serdes Configuration 1 Register (address = 0x3D) [reset = 0x0x0088]
Figure 161. Serdes Configuration 1 Register (SRDS_CFG1)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 127. RDS_CFG1 Field Descriptions
Bit
Field
Type
Reset
Description
15
Reserved
R/W
0
Reserved
TESTPATT
R/W
000
Test pattern
11
BSINRXN
R/W
0
Enable boundary scan - pins
10
BSINRXP
R/W
0
Enable boundary scan + pins
9:8
14:12
LOOPBACK
R/W
00
Enable loopback
7
ENOC
R/W
1
Enable Serdes offset compensation
6
EQHLD
R/W
0
Equalizer hold
5:3
EQ
R/W
001
Serdes equalizer
2:0
CDR
R/W
000
Clock data recovery algorithm settings
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8.5.87 Serdes Configuration 2 Register (address = 0x3E) [reset = 0x0x0909]
Figure 162. Serdes Configuration 2 Register (SRDS_CFG2)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 128. SRDS_CFG2 Field Descriptions
Bit
Field
Type
Reset
Description
15:13
LOS
R/W
000
Enables loss of signal detection.
000 - Enable detection
100 - Disable detection
other - reserved
12:11
ALIGN
R/W
01
Enables external or internal symbol alignment
TERM
R/W
001
Valid programming:
001 – AC coupling with common mode = 0.7 V
100 – 0 V common mode.
101 – 0.25 V common mode
111 – DC coupling with common mode of 0.6 V.
(NOTE: This is not compatible with JESD)
Reserved
R/W
0
Reserved
6:5
RATE
R/W
00
Selects full, half, quarter or eighth rate operation.
4:2
BUSWIDTH
R/W
010
Selects the parallel interface width (16 or 20 bits)
1
SLEEPRX
R/W
0
Powers the receiver down into the sleep (fast power up) state
when high.
0
Reserved
R/W
1
Reserved
10:8
7
134
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8.5.88 Serdes Polarity Control Register (address = 0x3F) [reset = 0x0000]
Figure 163. Serdes Polarity Control Register (SRDS_POL)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/W
4
1
R/W
3
1
R/W
2
1
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 129. SRDS_POL Field Descriptions
Bit
15:8
7:0
Field
Type
Reset
Description
Reserved
R/W
0x00
Reserved
0x00
Allows the PN pairs of the different lanes to be inverted.
bit 7 = lane7
bit 6 = lane6
bit 5 = lane5
bit 4 = lane4
bit 3 = lane3
bit 2 = lane2
bit 1 = lane1
bit 0 = lane0
INVPAIR
R/W
8.5.89 JESD204B SYNCB OUTPUT Register (address = 0x76) [reset = 0x0000]
Figure 164. JESD204B SYNCB OUTPUT Register (SYNCBOUT)
15
0
R/W
14
0
R/W
13
0
R/W
12
0
R/W
11
0
R/W
10
0
R/W
9
0
R/W
8
x
R/W
7
0
R/W
6
0
R/W
5
1
R/1W
4
1
R/W
3
1
R/W
2
0
R/W
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; -n = value after rese1t
Table 130. SYNCBOUT Field Descriptions
Bit
Field
Type
Reset
Description
Reserved
R/W
0x00
Reserved
1
SYNCBOUT1
R/W
0
If the CMOS SYNC outputs are turned on, this bit will show the
status of the JESD SYNCB1 signal
0
SYNCBOUT0
R/W
0
If the CMOS SYNC outputs are turned on, this bit will show the
status of the JESD SYNCB0 signal
15:2
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
9.1.1 Start-up Sequence
PULL TXENABLE
LOW
x
x
x
x
Provide all 1V supply rails, 1.8V rails and -1.8V rail.
Pull TRSTB pin of the JTAG port low
Provide a clock to the differential or single ended clock input
Toggle RESETB pin low then high (recommended pulse duration
>10us)
Bits[15:10] B 10000b
Read SPI Page 0, Register 0x7F
Bits[15:10]=10000b
Configure the SPI resgisters for the desired mode
On chip PLL
mode
YES
Read page 0, address 0x06
Die temp = bits[15:8]
LF voltage = bits[7:5]
Increment/decrement
VCO tune value
SPI Page 4, address
0x33, bits 14:8
NO
85C < Die temp < 105C, LF Voltage =5
40C <Die temp < 85C, LF Voltage =3 or 4
-20C <Die temp < 40C, LF Voltage =3
-40C <Die temp < -20C, LF Voltage =2
Start SYSREF Generation
x
x
x
x
Reset CDRV block and :
Write 0x0000 to page 1/ page 2:address 0x24 and 0x5C
Write 0x5C03 to page 4:address 0x0A
Write 0x7C03 to page 4: address 0x0A
Put JESD204B core in reset
Write 0x4003 to page 0: address 0x00
Sync CDRV and JESD204B blocks
Write 0x0030 to page1:address 0x24
Write 0x0020 to page2:address 0x24
Write 0x0002 to page1:address 0x5C
Write 0x0003 to page2:address 0x5C
Take JESD Core out of reset
Write 0x4000 to page0:address 0x00
x
Clear all DAC alarms: Write 0x0000 to alarm registers on
Page0: 0x04, 0x05 and Page1/2: 0x64 to 0x6D
Stop SYSREF generation to DAC (optional)
Pull TXENABLE HIGH
Figure 165. DAC38RF8xx Recommended Startup Sequence
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9.2 Typical Application: Multi-band Radio Frequency Transmitter
The DAC38RF8xx device family can be used in RF transmitters designed to support multiple operating bands.
The two transmit antennae system shown in Figure 166 uses DAC38RF8xx to convert digital baseband signals
from an FPGA directly to RF signals in LTE downlink band 1 (2110 MHz - 2170 MHz) and band 3 (1805 MHz 1880 MHz).
Device clock
SYSREF
Band1 and Band3
PLL
syncb
2:1
PA
CH B
4 lanes
Band1 and Band3
50 Q
2:1
PA
CH A
4 lanes
50 Q
DAC38RFxx
FPGA
syncb
2:1
ADC
8 lanes
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Figure 166. Two antennae multi-band Radio Frequency Transmitter
9.2.1 Design Requirements
Table 131. Dual band LTE downlink transmitter
Parameter
Value
Operating bands
Band 1 (2110 MHz - 2170 MHz) and Band 3 (1805 MHz to 1880 MHz)
Data rate (baseband)
368.64 MHz
Sampling frequency
8847.36 MHz
Interpolation
24
JESD204B Interface
configuration
L-M-F-S-Hd = 8-8-2-1-0
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9.2.2 Detailed Design Procedure
Two complex data streams of 20MHz LTE data generated in a baseband processor (FPGA/ASIC) is formatted
based on Table 18and transmitted to DAC38RF8xx. Inside DAC38RF8xx, the complex input data at a rate of
368.64 MSPS is interpolated 24 times to the final output sampling rate of 8847.36 MSPS. This enables the final
RF output to be positioned in the first Nyquist zone for minimal attenuation due to sinc(x) roll off. After
interpolation, the output complex data stream is digitally mixed to the final RF frequencies. The digital mixing
eliminates system imperfections such as local oscillator (LO) feed-through and sideband images that are inherent
in analog mixers. Detailed block diagram is shown in (Figure 167)
To simplify the system clocking, a low frequency clock (or device clock) is provided as a reference to the on-chip
PLL (Internal PLL/VCO) of DAC38RF8xx. The PLL generates a low phase noise, high frequency sampling clock
from the low frequency reference.
Serdes Interface
FPGA
DAC38RF8xx
RF output
Q data
-184.32M
0
+184.32M
I data
Q data
-184.32M
0
JESD Interface
I data
24x
interpolation
1.8425 GHz
0
1.84G
2.14G
Fs/2
24x
interpolation
2.14 GHz
+184.32M
Figure 167. Dual band LTE Downlink Transmitter Block Diagram
9.2.2.1 Calculating the JESD204B Serdes Rate
Serdes rate = 1.25 x (M/L) x Baseband data rate x Number of bits per sample (16)
M is a JESD204B interface parameter that refers to the number of data streams from FPGA to DAC
L is a JESD204B interface parameter that refers to the number of serdes lanes used to transmit data
1.25 is a factor due to the 8B10B encoding of the baseband data
Example,
if the baseband data rate = 368.64 MSPS and L-M-F-S-Hd = 8-8-2-1-0
Serdes rate = 1.25 x (8/8) x 368.64 x 16 = 7.3728 Gbps
(19)
9.2.2.2 Calculating valid JESD204B SYSREF Frequency
Valid SYSREF frequencies depend on the following parameters:
1. Sample clock frequency
2. JESD204B internal clock divider value (CLKJESD_DIV). This depends on the DAC JESD204B L-M-F-S
mode and interpolation
3. Number of octets in a frame (F)
4. Number of frames in a multi-frame (K)
Maximum SYSREF frequency = (Sample clock frequency/N),
where N =LCM(CLKJESD_DIV,4 x K x F). N is the Least common multiple of 4 x K x F and CLKJESD_DIV.
All valid SYSREF frequencies are integer divisors of the maximum SYSREF frequency.
Example:
138
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Given sampling clock frequency = 8.84736 GSPS, Interpolation = 24, DAC Mode=L-M-F-S=8-8-2-1 and K=20:
CLKJESD_DIV = 24 (CLKJESD_DIV)
Maximum SYSREF Frequency = 8847.36 MHz/240 = 36.864 MHz
Valid SYSREF Frequencies = 36.864 MHz/n, where n is any positive integer.
9.2.3 Application Curves
Figure 168. Dual band ACPR Performance in Downlink Band 3 with On-chip PLL
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DAC38RF85, DAC38RF90, DAC38RF93
SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
Figure 169. Dual band ACPR Performance in Downlink Band 1 with On-chip PLL
140
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
10 Power Supply Recommendations
Internally, DAC38RFxx comprises a digital subsystem, an analog subsystem, and a clock subsystem. Ideally, the
power supply scheme should be partitioned according to these three relatively independent blocks to minimize
interactions between them. Most importantly, sensitive analog and clock circuit power supply must be separated
from digital switching noise to reduce direct coupling and mixing of switching spurs. Table 132 shows the power
supply rails for DAC38RFxx grouped under their respective domains.
Table 132. Power Supply Domains
Supply rail
Nominal voltage (V)
VDDIG1
+1.0
VDDIO18
+1.8
VDDR18
+1.8
VDDS18
+1.8
VDDT1
+1.0
VDDE1
+1.0
VDDL1_1
+1.0
VEE18N
-1.8
VDDA1
+1.0
VDDA18
+1.8
VDDOUT18
+1.8
VDDPLL1
+1.0
VDDAPLL18
+1.8
VDDAVCO18
+1.8
VDDCLK1
+1.0
VDDL2_1
+1.0
VDDTX1
+1.0
VDDTX18
+1.8
Domain
Digital
Analog
Clock
An example power supply scheme suitable for most applications of DAC38RFxx is shown in Figure 170. It is
recommended to use ferrite beads (FB) to isolate the individual rails from each other.
Figure 170. Power Supply Scheme for DAC38RFxx
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10.1 Power Supply Sequencing
There are no power supply sequencing requirements for all the 1-V and 1.8-V power supplies. For the -1.8 V
VEE18 rail, it is recommended that this supply is the last to be enabled. Enabling VEE18 (while other supply
voltages are disabled) can cause a small negative voltage to be present at the other rails (that is, VDDA1 and
VDDDIG1). This small negative voltage can interfere with the startup of some DC-DC converters or LDO's
connected to the 1 V and 1.8 V input power rails.
142
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
11 Layout
11.1 Layout Guidelines
•
DAC RF output traces
– DAC38RF80, DAC38RF90, DAC38RF84: Single-ended 50 Ω co-planar wave guide for output traces is
recommended.
– DAC38RF83, DAC38RF93, DAC38RF85: Differential 100 Ω co-planar wave guide for output traces is
recommended.
– Use short RF traces. Place DAC close to edge of PCB to shorten the length of output and clock traces.
This helps to minimize PCB loss and coupling
– Stitch the ground plane with ground vias uniformly along the output trace. An example is shown in
Figure 171
– Avoid width/spacing differences when entering a landing pad (eg. a balun) by tapering or by redefining
width/space rules for the traces
Figure 171. Single-ended, 50-Ω Coplanar Wave Guide RF Output Trace Example
•
Power supply planes
– Ensure sufficient lateral spacing between two power planes (about 3x the thickness of the plane is
recommended)
– Insert ground plane between adjacent power planes where possible
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www.ti.com
Layout Guidelines (continued)
Figure 172. Example Power Plane Routing
•
Bypass Capacitors
– Use bypass capacitors with in-pad vias and place between the pin and the power plane. Avoid sharing
ground vias or pads of bypass caps used for different power rails
– Minimize stubs on bypass capacitors to avoid parasitic inductance
Figure 173. Bypass Capacitors Placed on the Power Supply Pin with In-pad Vias
•
144
High speed serdes traces
– Route all serdes traces straight and minimized sharp curves or serpentines. Route for best signal integrity
– Some skew between serdes traces can be tolerated. It is recommended to limit skew between traces to
320ps or less
– Place ground planes between the serdes traces for improved isolation
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
Layout Guidelines (continued)
Figure 174. Layout Example of High Speed Serdes Traces
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
www.ti.com
11.2 Layout Example
xx
xx
xx
xx
xx
xx
xxxxx
x
xx
xx
xx
xxxx
xx
xx
A
B
C
D
12
11
10
9
x
x
x
x
x
x
x
x
8
7
x
x
x
x
6
5
4
3
x
x
x
x
x
2
1
xx
xx
xx
xx
xx
xx
xx
xx
xx
xxxx
xx
xxxx
xxxx
xxxxx
xx
xxxxx
xxxx
xx
xx
xx
xxxx
xxxx
E
F
G
H
J
K
L
M
Rbias
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Bottom Trace
Top Trace
Capacitor
Resistor
x
Via
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x
Figure 175. Layout Example of DAC38RFxx
146
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SLASEA3A – DECEMBER 2016 – REVISED FEBRUARY 2017
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 133. Related Links
PARTS
PRODUCT FOLDER
ORDER NOW
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DAC38RF80
Click here
Click here
Click here
Click here
Click here
DAC38RF83
Click here
Click here
Click here
Click here
Click here
DAC38RF84
Click here
Click here
Click here
Click here
Click here
DAC38RF85
Click here
Click here
Click here
Click here
Click here
DAC38RF90
Click here
Click here
Click here
Click here
Click here
DAC38RF93
Click here
Click here
Click here
Click here
Click here
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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DAC38RF83 DAC38RF93
147
PACKAGE OPTION ADDENDUM
www.ti.com
26-Feb-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC38RF80IAAV
PREVIEW
FCBGA
AAV
144
168
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF80I
DAC38RF80IAAVR
PREVIEW
FCBGA
AAV
144
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF80I
DAC38RF83IAAV
ACTIVE
FCBGA
AAV
144
168
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF83I
DAC38RF83IAAVR
ACTIVE
FCBGA
AAV
144
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF83I
DAC38RF84IAAV
PREVIEW
FCBGA
AAV
144
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF84I
DAC38RF84IAAVR
PREVIEW
FCBGA
AAV
144
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF84I
DAC38RF85IAAV
PREVIEW
FCBGA
AAV
144
168
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF85I
DAC38RF85IAAVR
PREVIEW
FCBGA
AAV
144
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF85I
DAC38RF90IAAV
PREVIEW
FCBGA
AAV
144
168
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF90I
DAC38RF90IAAVR
PREVIEW
FCBGA
AAV
144
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF90I
DAC38RF93IAAV
ACTIVE
FCBGA
AAV
144
168
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF93I
DAC38RF93IAAVR
ACTIVE
FCBGA
AAV
144
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
-40 to 85
DAC38RF93I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Feb-2017
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Feb-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DAC38RF83IAAVR
FCBGA
AAV
144
1000
330.0
24.4
10.3
10.3
2.5
4.0
24.0
Q1
DAC38RF93IAAVR
FCBGA
AAV
144
1000
330.0
24.4
10.3
10.3
2.5
4.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Feb-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC38RF83IAAVR
FCBGA
AAV
144
1000
336.6
336.6
31.8
DAC38RF93IAAVR
FCBGA
AAV
144
1000
336.6
336.6
31.8
Pack Materials-Page 2
PACKAGE OUTLINE
AAV0144A
FCBGA - 1.94 mm max height
SCALE 1.400
BALL GRID ARRAY
10.15
9.85
A
B
BALL A1 CORNER
10.15
9.85
( 8)
(0.68)
(0.5)
1.94 MAX
C
SEATING PLANE
NOTE 4
BALL TYP
0.405
TYP
0.325
0.2 C
8.8 TYP
(0.6) TYP
SYMM
0.8 TYP
(0.6) TYP
M
L
K
J
H
SYMM
8.8
TYP
G
F
E
D
0.51
144X
0.41
0.15
C A B
0.08
C NOTE 3
C
B
A
1
2
3
4
5
6
7
8
9
10
11 12
0.8 TYP
4219578/A 04/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Dimension is measured at the maximum solder ball diameter, parallel to primary datum C.
4. Primary datum C and seating plane are defined by the spherical crowns of the solder balls.
www.ti.com
EXAMPLE BOARD LAYOUT
AAV0144A
FCBGA - 1.94 mm max height
BALL GRID ARRAY
(0.8) TYP
A
1
2
3
4
5
6
7
8
10
9
11
12
B
(0.8) TYP
C
D
144X ( 0.4)
E
F
SYMM
G
H
J
K
L
M
SYMM
LAND PATTERN EXAMPLE
SCALE:8X
( 0.4)
METAL
0.05 MAX
METAL UNDER
SOLDER MASK
0.05 MIN
( 0.4)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4219578/A 04/2016
NOTES: (continued)
5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SPRU811 (www.ti.com/lit/spru811).
www.ti.com
EXAMPLE STENCIL DESIGN
AAV0144A
FCBGA - 1.94 mm max height
BALL GRID ARRAY
144X ( 0.4)
(0.8) TYP
A
1
2
3
4
5
6
7
8
9
10
11
12
B
(0.8)
TYP
C
D
E
F
SYMM
G
H
J
K
L
M
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.15 mm THICK STENCIL
SCALE:8X
4219578/A 04/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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