Diodes DMC1017UPD Complementary pair enhancement mode mosfet powerdiâ®5060-8 Datasheet

DMC1017UPD
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
POWERDI®5060-8
Product Summary
Device
Features and Benefits
•
Thermally Efficient Package-Cooler Running Applications
9.5A
•
•
High Conversion Efficiency
Low RDS(ON) – Minimizes On State Losses
25mΩ @ VGS = 2.5V
7.8A
•
Low Input Capacitance
32mΩ @ VGS = -4.5V
-6.9A
•
Fast Switching Speed
53mΩ @ VGS = -2.5V
-5.4A
•
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
RDS(ON)
ID
TA = +25°C
17mΩ @ VGS = 4.5V
V(BR)DSS
Q1
12V
Q2
-12V
Description and Applications
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
This new generation Complementary Pair Enhancement Mode
MOSFET has been designed to minimize RDS(on) and yet maintain
superior switching performance. This device is ideal for use in
Notebook battery power management and Loadswitch.
Mechanical Data
•
•
•
•
•
•
Notebook Battery Power Management
DC-DC Converters
Loadswitch
•
•
Case: POWERDI5060-8
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram Below
Weight: 0.097 grams (approximate)
D1
G1
D2
G2
S1
Top View
Pin1
Bottom View
Q1 N-Channel MOSFET
S2
S1
D1
G1
D1
S2
D2
G2
D2
Q2 P-Channel MOSFET
Top View
Pin Configuration
Ordering Information (Note 4)
Part Number
DMC1017UPD-13
Notes:
Case
POWERDI5060-8
Packaging
2500 / Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
D1
D1
D2
D2
= Manufacturer’s Marking
C1017UD = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 13 = 2013)
WW = Week (01 - 53)
C1017UD
YY WW
S1
G1
S2
G2
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Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 4.5V
Q1 Value
12
Q2 Value
-12
Units
V
VGSS
±8
±8
V
Steady
State
TA = +25°C
TA = +70°C
ID
9.5
7.6
-6.9
-5.5
A
t<10s
TA = +25°C
TA = +70°C
ID
13.0
10.4
-9.4
-7.5
A
Maximum Body Diode Forward Current
IS
2
-2
A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
IDM
50
-35
A
Avalanche Current (Note 6) L = 0.1mH
IAS
9.7
-9.2
A
Avalanche Energy (Note 6) L = 0.1mH
EAS
4.7
4.3
mJ
Thermal Characteristics
Characteristic
Symbol
TA = +25°C
Total Power Dissipation (Note 5)
PD
TA = +70°C
Steady state
t<10s
Thermal Resistance, Junction to Ambient (Note 5)
RθJC
1.5
54
29
4.1
TJ, TSTG
-55 to +150
RθJA
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
Value
2.3
Units
W
°C/W
°C
Electrical Characteristics Q1 N-Channel (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Symbol
Min
Typ
Max
Unit
BVDSS
12
⎯
V
VGS = 0V, ID = 250µA
Zero Gate Voltage Drain Current
IDSS
⎯
⎯
⎯
1
µA
VDS = 12V, VGS = 0V
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
IGSS
⎯
⎯
±100
nA
VGS = ±8V, VDS = 0V
VGS(th)
0.6
⎯
9.6
1.5
V
⎯
⎯
11
25
Static Drain-Source On-Resistance
RDS(ON)
17
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
VSD
⎯
0.7
1.2
Ciss
⎯
1787
⎯
Output Capacitance
Coss
⎯
297
⎯
Reverse Transfer Capacitance
Crss
⎯
265
⎯
Gate Resistance
RG
⎯
1.6
⎯
Total Gate Charge (VGS = 4.5V)
Qg
⎯
18.6
⎯
Total Gate Charge (VGS = 10V)
Qg
⎯
35.4
⎯
Gate-Source Charge
Qgs
⎯
2.7
⎯
mΩ
Test Condition
VDS = VGS, ID = 250µA
VGS = 4.5V, ID = 11.8A
VGS = 2.5V, ID = 9.8A
V
VGS = 0V, IS = 2.9A
pF
VDS = 6V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = 6V, ID = 11.8A
nS
VDD = 6V, RL = 6Ω
VGS = 4.5V, RG = 6Ω, ID = 1A
Gate-Drain Charge
Qgd
⎯
3.8
⎯
Turn-On Delay Time
tD(on)
⎯
6.9
⎯
Turn-On Rise Time
tr
⎯
10.9
⎯
tD(off)
⎯
70.3
⎯
Turn-Off Fall Time
tf
trr
⎯
—
31.8
Body Diode Reverse Recovery Time
13.1
⎯
—
nS
IF = 11.8A, di/dt = 100A/μs
Qrr
—
2.2
—
nC
IF = 11.8A, di/dt = 100A/μs
Turn-Off Delay Time
Body Diode Reverse Recovery Charge
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
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20.0
20
VGS = 8.0V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
16
VGS = 4.0V
15.0
VGS = 3.0V
VGS = 2.5V
VGS = 1.5V
VGS = 2.0V
10.0
VDS = 5.0V
18
VGS = 4.5V
5.0
14
12
10
8
6
TA = 150°C
4
VGS = 1.3V
0
0.5
1
1.5
2
2.5
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1 Typical Output Characteristics
0.015
0.012
VGS = 2.5V
0.009
VGS = 4.5V
0.006
0.003
0
0
2
0
3
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.0
4
6
8
10 12 14 16 18
ID, DRAIN-SOURCE CURRENT (A)
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
20
TA = -55°C
0
0.5
1
1.5
2
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2 Typical Transfer Characteristics
2.5
0.015
VGS = 4.5V
TA = 125°C
0.012
TA = 150°C
T A = 85°C
0.009
TA = 25°C
TA = -55°C
0.006
0.003
0
0
2
4
6
8 10 12 14 16 18
ID, DRAIN CURRENT (A)
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
20
0.015
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
2.5
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
TA = 25°C
2
VGS = 1.2V
T A = 85°C
T A = 125°C
2
VGS = 2.5 V
ID = 5A
1.5
1
VGS = 4.5V
ID = 10A
0.5
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 5 On-Resistance Variation with Temperature
VGS = 2 .5V
ID = 5A
0.01
VGS = 4.5V
ID = 10A
0.005
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 6 On-Resistance Variation with Temperature
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1.5
20
VGS(th), GATE THRESHOLD VOLTAGE (V)
18
IS, SOURCE CURRENT (A)
16
1
ID = 1mA
ID = 250µA
0.5
14
12
10
8
6
4
2
0
-50
0
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 7 Gate Threshold Variation vs. Ambient Temperature
10000
TA = 150°C
TA = 85°C
TA = 125°C
TA = 25°C
T A = -55°C
0
0.3
0.6
0.9
1.2
1.5
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 8 Diode Forward Voltage vs. Current
8
VGS GATE THRESHOLD VOLTAGE (V)
CT, JUNCTION CAPACITANCE (pF)
f = 1MHz
Ciss
1000
Coss
Crss
100
10
0
2
4
6
8
10
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 9 Typical Junction Capacitance
12
6
VDS = 6V
ID = 11.8A
4
2
0
0
5
10
15
20
25
30
35
Qg, TOTAL GATE CHARGE (nC)
Figure 10 Gate Charge
40
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Electrical Characteristics Q2 P-Channel (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 6)
Symbol
Min
Typ
Max
Drain-Source Breakdown Voltage
BVDSS
Zero Gate Voltage Drain Current
IDSS
Gate-Source Leakage
Unit
Test Condition
-12
⎯
⎯
V
VGS = 0V, ID = -250µA
⎯
⎯
-1
µA
VDS = -12V, VGS = 0V
IGSS
⎯
⎯
±100
nA
VGS = ±8V, VDS = 0V
Gate Threshold Voltage
VGS(th)
-0.6
⎯
-1.5
V
VDS = VGS, ID = -250µA
Static Drain-Source On-Resistance
RDS(ON)
⎯
21
32
⎯
41
53
VSD
⎯
-0.7
-1.2
Input Capacitance
Ciss
⎯
2100
⎯
Output Capacitance
Coss
⎯
872
⎯
Reverse Transfer Capacitance
Crss
⎯
626
⎯
Gate Resistance
RG
⎯
23.1
⎯
Total Gate Charge (VGS = -4.5V)
Qg
⎯
23.7
⎯
Total Gate Charge (VGS = -8V)
Qg
⎯
38.8
⎯
Gate-Source Charge
Qgs
⎯
5.3
⎯
Gate-Drain Charge
Qgd
⎯
9.8
⎯
Turn-On Delay Time
tD(on)
⎯
10.6
⎯
Turn-On Rise Time
tr
⎯
25.5
⎯
Turn-Off Delay Time
tD(off)
⎯
144
⎯
Turn-Off Fall Time
tf
⎯
129
⎯
Body Diode Reverse Recovery Time
trr
—
48.9
Body Diode Reverse Recovery Charge
Qrr
—
15.3
ON CHARACTERISTICS (Note 6)
Diode Forward Voltage
mΩ
VGS = -4.5V, ID = -8.9A
VGS = -2.5V, ID = -6.9A
V
VGS = 0V, IS = -2.9A
pF
VDS = -6V, VGS = 0V,
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
VDS = -6V, ID = -8.9A
nS
VDD = -6V, RL = 6Ω
VGS = -4.5V, RG = 6Ω, ID = -1A
—
nS
IF = -8.9A, di/dt = -100A/μs
—
nC
IF = -8.9A, di/dt = -100A/μs
DYNAMIC CHARACTERISTICS (Note 7)
Notes:
6. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C.
7. Short duration pulse test used to minimize self-heating effect.
20.0
20
VGS = -8.0V
16
VGS = -2.5V
VGS = -3.5V
-ID, DRAIN CURRENT (A)
-ID, DRAIN CURRENT (A)
VGS = -4.0V
15.0
VDS = -5.0V
18
VGS = -4.5V
VGS = -3.0V
10.0
5.0
14
12
10
8
6
TA = 150°C
4
VGS = -2.0V
0.0
VGS = -1.8V
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
-VDS, DRAIN -SOURCE VOLTAGE (V)
Figure 11 Typical Output Characteristics
TA = 125°C
2
5
0
TA = 85°C
TA = 25°C
TA = -55° C
0
0.5
1
1.5
2
2.5
3
3.5
-VGS, GATE-SOURCE VOLTAGE (V)
Figure 12 Typical Transfer Characteristics
4
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0.03
0.07
0.06
VGS = -2.5V
0.05
0.04
0.03
VGS = -4.5V
0.02
0.01
0
0
2
4
6
8 10 12 14 16 18
-ID, DRAIN SOURCE CURRENT (A)
Figure 13Typical On-Resistance vs.
Drain Current and Gate Voltage
20
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
0.08
VGS = -4.5V
0.027
TA = 125°C
0.024
TA = 85°C
0.021
TA = 25°C
0.018
TA = -55°C
0.015
0.012
0.009
0
2
4
6
8 10 12 14 16 18
-ID, DRAIN SOURCE CURRENT (A)
Figure 14 Typical On-Resistance vs.
Drain Current and Temperature
20
0.05
RDS(on), DRAIN-SOURCE ON-RESISTANCE (Ω)
RDS(ON), DRAIN-SOURCE
ON-RESISTANCE (NORMALIZED)
2
VGS = -4.5V
ID = -10A
1.5
1
VGS = -2.5V
ID = -5A
0.5
0
-50
VGS = -2.5V
ID = -5A
0.045
0.04
0.035
0.03
0.025
VGS = -4.5V
ID = -10A
0.02
0.015
0.01
0.005
0
-50
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 15 On-Resistance Variation with Temperature
-25
0
25
50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 16 On-Resistance Variation with Temperature
2
20
18
16
1.5
-IS, SOURCE CURRENT (A)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
TA = 150°C
-ID = 1mA
-ID = 250µA
1
0.5
14
12
10
8
TA= 150°C
6
T A= 125 °C
4
2
0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Figure 17 Gate Threshold Variation vs. Ambient Temperature
0
TA= 85°C
T A= 25 °C
TA= -55° C
0
0.3
0.6
0.9
1.2
1.5
-VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 18 Diode Forward Voltage vs. Current
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8
10000
-VGS, GATE-SOURCE VOLTAGE (V)
CT, JUNCTION CAPACITANCE (pF)
f = 1MHz
Ciss
1000
Coss
Crss
100
0
2
4
6
8
10
-VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 19 Typical Junction Capacitance
r(t), TRANSIENT THERMAL RESISTANCE
1
12
6
4
VDS = -6V
ID = -8.9A
2
0
0
5
10
15
20
25
30
35
40
Qg, TOTAL GATE CHARGE (nC)
Figure 20 Gate-Charge Characteristics
D = 0.9
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
D = 0.005
RθJA(t) = r(t) * RθJA
RθJA = 104°C/W
Duty Cycle, D = t1/ t2
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t1, PULSE DURATION TIMES (sec)
Figure 21 Transient Thermal Resistance
10
100
1000
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D
1
D
PowerDI5060-8
Dim
Min
Max
Typ
A
0.90
1.10
1.00
A1
0
0.05
0.02
b
0.33
0.51
0.41
b1
0.300 0.366 0.333
b2
0.20
0.35
0.25
c
0.23
0.33 0.277
D
5.15 BSC
D1
4.85
4.95
4.90
D2
1.40
1.60
1.50
D3
3.98
E
6.15 BSC
E1
5.75
5.85
5.80
E2
3.56
3.76
3.66
e
1.27BSC
k
1.27
k1
0.56
L
0.51
0.71
0.61
La
0.51
0.71
0.61
L1
0.05
0.20 0.175
L4
0.125
M
3.50
3.71 3.605
x
1.400
y
1.900
θ
10°
12°
11°
θ1
6°
8°
7°
All Dimensions in mm
x
4
0
︵ ︶
E
1
E
1
A
c
x
e
n
a
l
P
g
n
i
t
a
e
S
y
e
1
x
4
1
0
0
3
0
.
0
±
7
0
.
0
h
t
p
e
D
0
0
0
.
1
Ø
︵ ︶
A
L
I
A
T
E
D
x
8
1
b
︵ ︶
2
/
e
x
8 1
b
︵ ︶
x
2
2
b
L
k
3
D
︵ ︶
A
1
k
4
L
A
L
I
A
T
E
D
2
D
M
2
D
2
E
1
L
a
L
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
4
X
8
Dimensions
1
Y
C
G
G1
X
X1
X2
X3
X4
Y
Y1
Y2
Y3
2
X
3
X
2
Y
3
Y
1
G
1
X
x
4
Y
︵ ︶
1
Value
(in mm)
1.270
0.660
0.820
0.610
3.910
1.650
1.650
4.420
1.270
1.020
3.810
6.610
G
C
X
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final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
POWERDI is a registered trademark of Diodes Incorporated.
DMC1017UPD
Document number: DS36903 Rev. 1 - 0
9 of 9
www.diodes.com
April 2014
© Diodes Incorporated
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