HLMP-LG63 Precision Optical Performance Red 4mm Standard Oval LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight. • Well defined spatial radiation pattern • High brightness material • Superior resistance to moisture • Standoff Package • Tinted and diffused • Typical viewing angle 50° x100° Applications • Full color signs Package Dimensions 7.26±0.20 0.286±0.008 21.0 MIN. 0.827 1.25±0.20 0.049±0.008 1.0 MIN. 0.039 CATHODE LEAD NOTE 1 3.80±0.20 0.1496±0.008 10.00±0.50 0.394±0.020 +0.10 0.45 - 0.04 0.80 MAX. EPOXY MENISCUS 0.031 Notes: All dimensions in millimeters (inches). Tolerance is ± 0.20mm unless other specified. 1 +0.004 0.018 - 0.002 2.54±0.30 0.100±0.012 3.00±0.20 0.118±0.008 Device Selection Guide Part Number Color and Dominant Wavelength ld (nm) Typ Luminous Intensity Iv (mcd) at 20 mA-Min Luminous Intensity Iv (mcd) at 20 mA-Max HLMP-LG63-TX0ZZ Red 626 800 1990 Tolerance for each intensity limit is ± 15%. Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. Part Numbering System HLMP - L x 63 – x x x x x Packaging Option ZZ: Flexi Ammopacks Color Bin Selection 0: Open distribution Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide. Color G: Red 626 Package L: 4mm Standard Oval 50° x100° Note: Please refer to AB 5337 for complete information about part numbering system. Absolute Maximum Ratings TA = 25°C Parameter Red Unit DC Forward Current [1] 50 mA Peak Forward Current 100 [2] mA Power Dissipation 120 mW Reverse Voltage 5 (IR = 100 μA) V LED Junction Temperature 130 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 30%, frequency 1kHz. 2 Electrical / Optical Characteristics TA = 25°C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage VF 1.8 2.1 2.4 V IF = 20 mA Reverse Voltage VR 5 626 630 Dominant Wavelength [1] 620 V IR = 100 μA IF = 20 mA Peak Wavelength lPEAK 634 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Thermal Resistance RqJ-PIN 240 °C/W LED Junction-to pin Luminous Efficacy [2] hV 150 lm/W Emitted Luminous Power/Emitted Radiant Power Luminous Flux jV 1700 mlm IF = 20 mA Luminous Efficiency [3] he 40 lm/W Luminous Flux/Electrical Power IF = 20 mA Notes: 1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/hV where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens/watt. 3. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage. 3 1.0 50 0.8 40 FORWARD CURRENT - mA RELATIVE INTENSITY AlInGaP Red 0.6 0.4 0.2 0.0 550 600 650 WAVELENGTH - nm I F - FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 2 1.5 1 0.5 0 10 20 30 DC FORWARD CURRENT - mA 40 50 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation pattern-Major Axis 4 0 1 2 FORWARD VOLTAGE - V 3 55 50 45 40 35 30 25 20 15 10 5 0 0 10 20 30 40 50 60 70 80 110 100 120 120 T A - AMBIENT TEMPERATURE - °C Figure 4. Maximum Forward Current vs Ambient Temperature NORMALIZED INTENSITY NORMALIZED INTENSITY Figure 3. Relative Intensity vs Forward Current 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10 Figure 2. Forward Current vs Forward Voltage 2.5 0 20 0 700 Figure 1. Relative Intensity vs Wavelength 30 60 90 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 6. Radiation pattern-Minor Axis 60 90 Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) Red Color Range Intensity (mcd) at 20 mA Bin Min Max Min Dom T 800 960 620 U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Max Dom Xmin Ymin Xmax Ymax 630 0.6904 0.3094 0.689 0.2943 0.6726 0.3106 0.708 0.292 Tolerance for each bin limit is ± 0.5nm. Tolerance for each bin limit is ±15% VF Bin Table (V at 20mA) Bin ID Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 Notes: 1. Tolerance for each bin limit is ±0.05V 2. VF binning only applicable to Red color. Relative Light Output vs Junction Temperature RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) 10 1 0.1 -40 -20 0 20 40 60 TJ - JUNCTION TEMPERATURE - °C 5 80 100 120 Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250°C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: • Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. • LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm • ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. • Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 60 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max Anode InGaN connection Device between bottom surface of LED die and Note: Electrical the lead frame is achieved through conductive paste. • Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. Note: In order to further assist customer in designing jig accurately that fit Avago Technologies’ product, 3D model of the product is available upon request. • At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. • If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. • Recommended PC board plated through holes (PTH) size for LED component leads. Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) • Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) 6 • Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) TEMPERATURE (°C) 200 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 150 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 100 50 PREHEAT 0 10 20 30 40 60 50 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.5±1.00 0.8071±0.0394 9.125±0.625 0.3593±0.025 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 Ø 0.70±0.20 0.276±0.0079 VIEW A - A 4.00±0.20 TYP. 0.1575±0.0079 Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 7 Packaging Box for Ammo Packs Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: 8 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin “VB” 2: Color bin 2 only DISCLAIMER AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. AV02-1170EN - February 20, 2009