Panasonic MN101C35 The lower limit for operation guarantee for eprom built-in type is 2.7 v Datasheet

MN101C35D
Type
MN101C35D
ROM (×× 8-bit)
64 K
RAM (×× 8-bit)
2K
Package
QFP100-P-1818B *Lead-free
Minimum Instruction
Execution Time
0.25 µs (at 2.7 V to 5.5 V, 8 MHz)
125 µs (at 2.2 V to 5.5 V, 32 kHz)*
* The lower limit for operation guarantee for EPROM built-in type is 2.7 V.
Interrupts
• RESET • Watchdog • External 0 • External 1 • External 2 • External 3 • External 4 • Timer 0
• Timer 1 • Timer 2 • Timer 3 • Timer 4 • Timer 5 • Time base • Serial 0 • Serial 1 • Serial 2
• Automatic transfer finish • A/D conversion finish • Key scan
Timer Counter
Timer counter 0 : 8-bit × 1 (square-wave/8-bit PWM output, event count, generation of remote control carrier)
Clock source ····················· 1/1, 1/4 of system clock frequency; 1/1 of OSC oscillation clock frequency;
external clock input
Interrupt source ················ coincidence with compare register 0
Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event)
Clock source ····················· 1/16, 1/64 of system clock frequency; 1/1 of XI oscillation clock frequency;
external clock input
Interrupt source ················ coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit × 1 (square-wave/8-bit PWM output, event count, synchronous output event)
Clock source ····················· 1/1, 1/4 of system clock frequency; 1/1 of XI oscillation clock frequency;
external clock input
Interrupt source ················ coincidence with compare register 2
Timer counter 3 : 8-bit × 1
(square-wave output, event count, generation of remote control carrier, serial 0 baud rate timer)
Clock source ····················· 1/4, 1/16 of system clock frequency; 1/1 of OSC oscillation clock frequency;
external clock input
Interrupt source ················ coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 4 : 16-bit × 1
(square-wave/16-bit PWM output, event count, synchronous output event, input capture)
Clock source ····················· 1/4, 1/16 of system clock frequency; 1/1 of OSC oscillation clock frequency;
external clock input
Interrupt source ················ coincidence with compare register 4
Time base timer (one-minute count setting, independently operable 8-bit timer counter 5)
Clock source ····················· 1/4 of system clock frequency; 1/1, 1/8192 of OSC oscillation clock frequency;
1/1, 1/8192 of XI oscillation clock frequency
Interrupt source ················ coincidence with compare register 5; 1/8192 prescaler overflow
Watchdog timer
Interrupt source ················ 1/2097152 of system clock frequency
Serial Interface
Serial 0 : synchronous type/simple UART (half-duplex) × 1
Clock source ····················· 1/2, 1/4, 1/16 of system clock frequency; 1/2 of timer counter 3 frequency
Serial 1 : synchronous type × 1
Clock source ····················· 1/2, 1/8, 1/64 of system clock frequency; 1/2 of timer counter 3 frequency
Serial 2 : synchronous type/simple I2C × 1
Clock source ····················· 1/1, 1/2, 1/4 of system clock frequency; 1/2 of timer counter 0 frequency
1
MAD00024DEM
MN101C35D
I/O Pins
I/O
36
• Common use : 28 • Specified pull-up resistor available • Input/output selectable (bit unit)
High Voltage
53
• Output: 29 • I/O: 24 • P-ch open drain (breakdown voltage −30V): FL drive: 53
• Specified pull-down resistor mask option: 35
A/D Inputs
8-bit × 8-ch. (with S/H)
FL
(35 to 43) segments × (18 to 10) digits
Special Ports
Buzzer output, remote control carrier signal output
Electrical Characteristics
Supply current
Limit
Parameter
Symbol
Condition
Unit
min
typ
max
IDD1
fosc = 8 MHz, VDD = 5 V
25
mA
IDD2
fx = 32 kHz, VDD = 3 V
120
µA
Supply current at HALT
IDD3
fx = 32 kHz, VDD = 3 V
10
µA
Supply current at STOP
IDD4
VDD = 3 V
10
µA
Operating supply current
P95(→SEG18)
P96(→SEG17)
P97(→SEG16)
P80(→SEG15)
P81(→SEG14)
P82(→SEG13)
P83(→SEG12)
P84(→SEG11)
P85(→SEG10)
P86(→SEG9)
P87(→SEG8)
P70(→SEG7/DGT0)
P71(→SEG6/DGT1)
P72(→SEG5/DGT2)
P73(→SEG4/DGT3)
P74(→SEG3/DGT4)
P75(→SEG2/DGT5)
P76(→SEG1/DGT6)
P77(→SEG0/DGT7)
P40(→DGT8)
P41(→DGT9)
P60(→DGT10)
P61(→DGT11)
P62(→DGT12)
P63(→DGT13)
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
Pin Assignment
P94(←SEG19)
76
50
P64(→DGT14)
P93(←SEG20)
77
49
P65(→DGT15)
P92(←SEG21)
78
48
P66(→DGT16)
P91(←SEG22)
79
47
P67(→DGT17)
P90(←SEG23)
80
46
P54
PC2(←SEG24)
81
45
P53
PC1(←SEG25)
82
44
P52
PC0(←SEG26)
83
43
P51
PB7(←SEG27)
84
42
P50
PB6(←SEG28)
85
41
P32(SBT2↔)
PB5(←SEG29)
86
40
P31(SBI2←)
39
P30(SBO2→)
38
P25
37
P24(←IRQ4)
PB4(←SEG30)
87
PB3(←SEG31)
88
PB2(←SEG32)
89
PB1(←SEG33)
90
36
P23(←IRQ3)
MN101C35D
12
13
14
15
16
17
18
19
20
21
22
23
24
25
XI
MMOD
VREF-
(AN0→)PA0
(AN1→)PA1
(AN2→)PA2
(AN3→)PA3
(AN4→)PA4
(AN5→)PA5
(AN6→)PA6
(AN7→)PA7
VREF+
P07
P27(NRST↔)
XO
26
11
P10(RMOUT→,TM0IO↔)
100
VPP
VSS
27
10
99
9
P11(TM1IO↔)
PD0(←SEG42)
OSC1
P12(TM2IO↔)
28
OSC2
29
98
8
97
PD1(←SEG41)
VDD
P13(TM3IO↔)
PD2(←SEG40)
7
30
6
96
(SBT1↔)P05
P14(TM4IO↔)
PD3(←SEG39)
(DK,BUZZER↔)P06
P15
31
5
32
95
(SBI1→)P04
94
PD4(←SEG38)
4
P20(←IRQ0)
PD5(←SEG37)
3
33
(SBT0↔)P02
93
(SBO1←)P03
P21(←SENS,IRQ1)
PD6(←SEG36)
2
P22(←IRQ2)
34
1
35
92
(RXD,SBI0→)P01
91
(TXD,SBO0←)P00
PB0(←SEG34)
PD7(←SEG35)
QFP100-P-1818B *Lead-free
See the next page for support tool.
MAD00024DEM
2
Support Tool
In-circuit Emulator
PX-ICE101C / D + PX-PRB101C35-QFP100-P-1818B
EPROM Built-in Type
Type
MN101CP35D
ROM (× 8-bit)
64 K
RAM (× 8-bit)
2K
Minimum instruction execution time
0.25 µs (at 2.7 V to 5.5 V, 8 MHz)
125 µs (at 2.7 V to 5.5 V, 32 kHz)
Package
3
QFP100-P-1818B *Lead-free
MAD00024DEM
MN101C35D
MAD00024DEM
4
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL
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