LITEON LTL1CHKEK-HF-002 Partthrough hole lamp Datasheet

Through Hole Lamp
Product Data Sheet
LTL1CHKEK-HF-002
Spec No.: DS20-2011-0140
Effective Date: 08/25/2011
Revision: -
LITE-ON DCC
RELEASE
BNS-OD-FC001/A4
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
LITE-ON TECHNOLOGY CORPORATION.
Property of Lite-On Ony
Features
* Halogen free.
* Lead (Pb) free product – RoHS compliant.
* High luminous intensity output.
* Low power consumption.
* High efficiency.
* Versatile mounting on P.C. Board or panel.
* I.C. Compatible/low current requirement.
* 3.1 mm diameter package.
Package Dimensions
Part No.
LTL1CHKEK-HF-002
Lens
Water
Clear
Source Color
AlInGaP Red
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. The LED lamp original is LTL1CHKEK-HF.
5. Lead spacing is measured where the leads emerge from the package.
6. Specifications are subject to change without notice.
Part
No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
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Absolute Maximum Ratings at TA=25℃
Parameter
Maximum Rating
Unit
75
mW
60
mA
Continuous Forward Current
30
mA
Derating Linear From 65℃
0.75
mA/℃
5
V
Power Dissipation
Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)
Reverse Voltage
Operating Temperature Range
-40℃ to + 80℃
Storage Temperature Range
-55℃ to + 100℃
Lead Soldering Temperature
[2 mm(.0787") From Body]
Part
No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
260℃ for 5 Seconds Max.
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Electrical / Optical Characteristics at TA=25℃
Parameter
Luminous Intensity
Symbol
Min.
Typ.
Max.
Unit
IV
240
680
1900
mcd
2θ1/2
45
deg
Peak Emission Wavelength
λP
632
nm
Dominant Wavelength
λd
Viewing Angle
613.5
624
Δλ
20
Forward Voltage
VF
2.05
Reverse Current
IR
Capacitance
C
Spectral Line Half-Width
40
633
nm
Test Condition
IF = 20mA
Note 1
Note 2 (Fig.5)
Measurement
@Peak (Fig.1)
Note 4
nm
2.4
V
100
μA
pF
IF = 20mA
VR = 5V
VF = 0 , f = 1MHz
NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Iv classification code is marked on each packing bag.
4. The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.
Part
No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
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Typical Electrical / Optical Characteristics
(25℃
Part
Ambient
No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
Temperature
Unless
Otherwise
Curves
Noted)
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Features
* Compatible with radial lead automatic insertion equipment.
* Most radial lead plastic lead lamps available packaged in tape and reel.
* 2.54mm (0.1") straight lead spacing available.
* Reel packaging simplifies handling and testing.
* Folding packaging is available by adding suffix “A” on option.
Package Dimensions
Specification
Item
Symbol
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
D
3.8
0.149
4.2
0.165
Component Lead Pitch
F
2.3
0.091
3.0
0.118
Front to Rear Deflection
∆H
--
--
2.0
0.078
Feed Hole to Bottom of Component
H1
17.5
0.688
18.5
0.728
Feed Hole to Overall Component Height
H2
22.4
0.882
24.0
0.945
11.0
0.433
Lead Length After Component Height
L
Feed Hole Pitch
P
12.4
0.488
13.0
0.511
Lead Location
P1
4.4
0.173
5.80
0.228
Center of Component Location
P2
5.05
0.198
7.65
0.301
Total Taped Thickness
T
--
--
0.90
0.035
Feed Hole Location
W0
8.5
0.334
9.75
0.384
Adhesive Tape Width
W1
14.5
0.571
15.5
0.610
Adhesive Tape Position
W2
0
0
3.0
0.118
Tape Width
W3
17.5
0.689
19.0
0.748
Part
No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
W0
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Packing Spec
2 reel per inner carton
total 3,000pcs per inner carton
6 Inner cartons per outer carton
total 18,000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
Part
No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
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Bin Table Specification
Luminous Intensity
Unit : mcd @20mA
Bin Code
Min.
Max.
JK0
240
400
LM0
400
680
NP0
680
1150
QR0
1150
1900
Dominant Wavelength
Part
Bin Code
Min.
Max.
H27
613.5
617.0
H28
617.0
621.0
H29
621.0
625.0
H30
625.0
629.0
H31
629.0
633.0
No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
Unit : nm @20mA
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CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office
equipment,
communication equipment and household applications).Consult Liteon’s Sales
in advance for information on applications in which exceptional reliability is required, particularly
when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in
aviation, transportation, traffic control equipment, medical and life support systems and safety
devices).
2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering
point.
Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.
Recommended soldering conditions :
Soldering iron
Temperature
Soldering time
350°C Max.
3 sec. Max.
(one time only)
Wave soldering
Pre-heat
Pre-heat time
Solder wave
Soldering time
100°C Max.
60 sec. Max.
260°C Max.
5 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
Part No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
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6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs
connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics
of those LEDs
7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
 Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
 All devices, equipment, and machinery must be properly grounded
 Work tables, storage racks, etc. should be properly grounded
 Use ion blower to neutralize the static charge which might have built up on surface of the LEDs
plastic lens as a result of friction between LEDs during storage and handing
ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low
forward voltage, or “no light up” at low currents. To verify for ESD damage, check for “light up” and
Vf of the suspect LEDs at low currents.
The Vf of “good” LEDs should be >[email protected] for InGaN product and >[email protected] for AlInGaP product.
Part
No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
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Suggested checking list :
Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or
conductive shoes with conductive flooring?
2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?
2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe
workstation?
3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?
3. Are audit records complete and on file?
Part No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
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8. Reliability Test
Classification
Test
Item
Operation Life
Endurance
Test
Environmental
Test
Test
Condition
Ta= Under Room Temperature As
Per Data Sheet Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)
Reference
Standard
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
High Temperature
High Humidity
Storage
Ta= 65±5°C
RH= 90 ~ 95%
High Temperature
Storage
Ta= 105±5°C
*Test Time= 1000HRS (-24HRS,+72HRS)
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
Low Temperature
Storage
Ta= -55±5°C
*Test Time=1000HRS (-24HRS,+72HRS)
JEITA ED-4701: 200 202(2001)
Temperature
Cycling
105°C ~ 25°C ~ -40°C ~ 25°C
30mins
5mins
30mins 5mins
50 Cycles
Thermal
Shock
105 ± 5°C ~ -30°C ± 5°C
15mins
15mins
50 cycles (< 20 secs transfer)
Test Time= 500HRS±2HRS
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
Solder
Resistance
(no pre-condition)
T.sol = 260 ℃Max.
Dwell time = 5 sec Max.
3mm from the base of the epoxy buib
MIL-STD-750D:2031 (1995)
JEITA ED-4701: 300 302(2001)
Solderability
(no pre-condition)
T.sol = 245 ± 5℃
Dwell time = 5 ± 0.5 sec
MIL-STD-750D:2026 (1995)
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
Soldering Iron
(no pre-condition)
T.sol = 350 ± 5℃
Dwell time = 3.5 ± 0.5 sec
MIL-STD-202G:208H (2002)
JEITA ED-4701: 300 302(2001)
9. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
Part No. : LTL1CHKEK-HF-002
BNS-OD-C131/A4
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