ON NCP5395G On board gate drivers for cpu application Datasheet

NCP5395G
2/3/4-Phase Controller with
On Board Gate Drivers for
CPU Applications
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Meets Intel’s VR11.1 and AMD’s 6 Bit Code Specifications
Enhanced Power Saving Function
• Internal Soft Start
Dual−edge PWM for Fastest Initial Response to Transient Loading
High Performance Operational Error Amplifier
Dynamic Reference Injection (Patent #US07057381)
DAC Range from 0.5 V to 1.6 V
DAC Feed Forward Function (Patient Pending)
±0.5% DAC Voltage Accuracy from 1.0 V to 1.6 V
True Differential Remote Voltage Sensing Amplifier
Phase−to−Phase Current Balancing
“Lossless” Differential Inductor Current Sensing
Accurate Current Monitoring (IMON)
Differential Current Sense Amplifiers for Each Phase
Adaptive Voltage Positioning (AVP)
Oscillator Frequency Range of 125 kHz − 1 MHz
Latched Over Voltage Protection (OVP)
Guaranteed Startup into Pre−Charged Loads
Threshold Sensitive Enable Pin for VTT Sensing
Power Good Output with Internal Delays
Output Disable Control Turn Off of Both Phase Pair MOSFETs
Thermally Compensated Current Monitoring
Adaptive−Non−Overlap Gate Drive Circuit
Thermal Shutdown Protection
• This is a Pb−Free Device
© Semiconductor Components Industries, LLC, 2012
February, 2012 − Rev. 2
1
QFN48, 7x7
CASE 485AJ
1 48
MARKING DIAGRAM
48
1
NCP5395G
AWLYYWWG
A
WL
YY
WW
G
48
1
BG3
PSI
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7/AMD
ROSC
ILIM
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
VBST3
TG3
SWN3
DRVON
BST2
TG2
SWN2
BG2
VCCP
SWN1
TG1
BST1
Features
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BG1
G4
VRRDY
EN
CS1N
CS1P
CS2N
CS2P
CS3N
CS3P
CS4N
CS4P
AGND
Down−bonded to
Exposed Flag
IMON
VSP
VSN
DIFFOUT
COMP
VFB
VDRP
VDFB
CSSUM
DAC
12VMON
VCC
The NCP5395G provides up to a four−phase buck solution which
combines differential voltage sensing, differential phase current
sensing, and adaptive voltage positioning to provide accurately
regulated power for both Intel and AMD processors. It also receives
power saving command (PSI) from CPU, and operates in a single
phase emulation diode mode to obtain a high efficiency at light load.
Dual−edge pulse−width modulation (PWM) combined with precise
inductor current sensing provides the fastest initial response to
dynamic load events both in power saving and normal modes.
Dual−edge multiphase modulation reduces the total bulk and ceramic
output capacitance required therefore reducing the system cost to meet
transient regulation specifications.
The on board gate drivers includes adaptive non overlap and power
saving operation. A high performance operational error amplifier is
provided to simplify compensation of the system. Patented Dynamic
Reference Injection further simplifies loop compensation by
eliminating the need to compromise between closed−loop transient
response and Dynamic VID performance.
ORDERING INFORMATION
Device
Package
Shipping†
NCP5395GMNR2G
QFN48
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Applications
• Graphic Cards, Desktop Processors
Publication Order Number:
NCP5395G/D
NCP5395G
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7/AMD
Flexible DAC
+
PSI
VCCP
Overvoltage
Protection
BST1
DAC
+
VSN
-
+
VSP
Phase 1
Gate Driver
with
Adaptive
Non−overlap
Diff Amp
TG1
SWN1
BG1
DIFFOUT
1.3 V
Error Amp
+
-
VFB
BST2
Phase 2
Gate Driver
with
Adaptive
Non−overlap
+
COMP
VDRP
-
+
-
VDFB
−2/3
CSSUM
CS1P
CS1N
CS2P
CS2N
CS3P
CS3N
CS4P
CS4N
TG2
SWN2
BG2
+
+
+
-
+
+
-
+
Gain = 6
BST3
+
Gain = 6
Phase 3
Gate Driver
with
Adaptive
Non−overlap
+
+
-
Gain = 6
+
+
TG3
SWN3
BG3
G4
-
Gain = 6
Oscillator
IMON
ROSC
DRVON
+
-
ILIM
EN
VCC
4.25 V
+
-
ILimit
Control,
Fault Logic
and
Monitor
Circuits
12VMON
VR_RDY
UVLO
GND (FLAG)
Figure 1. NCP5395G Functional Block Diagram
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2
NCP5395G
VTT
PSI#_CPU
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7
12V_FILTER
2 1
12V_FILTER
D
G
S
IMON
12
11
10
9
8
7
6
5
4
3
2
1
D
ILIM
ROSC
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
PSI
BG3
VCCP
RFB
CFB 13 IMON
14
VSP
15
16
RF
RFB
CH
RDRP
CDFB
RDFB
RISO
RT
12V_FILTER
17
18
CF
RISO
VBST3
19
20
R 21
22
23
VDRP
VDFB
DRVON 45
NCP5395G
48L 7x7 QFN
FLAG = GND
TG2 43
SWN2 42
12V_FILTER
BG2
12V_FILTER
41
VCCP 40
DAC
SWN1 39
2
1
D
G
TG1 38
CS4P
CS4N
CS3P
CS3N
CS2P
CS2N
CS1P
CS1N
EN
VR_RDY
G4
BG1
24 VCC
PWM3_SENSE_P
DRVON
BST2 44
CSSUM
12VMON
S
48
SWN3 46
DIFFOUT
VFB
PWM3_SENSE_N
G
S
TG3 47
VSN
COMP
D
G
25
26
27
28
29
30
31
32
33
34
35
36
BST1
S
37
D
D
C17
G
G
+5.0V
S
VTT
S
PWM1_SENSE_N
PWM1_SENSE_P
VCCP
PWM1_SENSE_P
PWM1_SENSE_N
ENABLE
PWM3_SENSE_P
PWM3_SENSE_N
Figure 2. Typical 2 Phase Application
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3
NCP5395G
VTT
R236
PSI#_CPU
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7
12V_FILTER
12V_FILTER
2 1
D
G
S
D
D
G
PWM3_SENSE_N
G
S
PWM3_SENSE_P
ILIM
ROSC
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
PSI
BG3
12
11
10
9
8
7
6
5
4
3
2
1
S
VCCP
RFB
CFB
VBST3
13 IMON
14 VSP
TG3
15 VSN
RF
RFB
CH
16 DIFFOUT
17
18
CF
RDRP 19
CDFB
RDFB
RT
RISO
RISO
12V_FILTER
SWN3
COMP
VFB
DRVON
NCP5395G
48L 7x7 QFN
FLAG = GND
BST2
TG2
VDRP
SWN2
20 VDFB
BG2
R 21
CSSUM
22
DAC
23 12VMON
SWN1
TG1
CS4P
CS4N
CS3P
CS3N
CS2P
CS2N
CS1P
CS1N
EN
VR_RDY
G4
BG1
24 VCC
VCCP
25
26
27
28
29
30
31
32
33
34
35
36
BST1
12V_FILTER
48
2
47
1
D
46
45
G
S
DRVON
44
43
D
D
S
S
41
12V_FILTER
PWM2_SENSE_N
G
G
42
40
39
PWM2_SENSE_P
12V_FILTER
38
2
1
37
D
G
S
C37
VCCP
+5.0V
D
D
G
VTT
PWM1_SENSE_P
G
S
S
PWM1_SENSE_N
PWM1_SENSE_P
PWM1_SENSE_N
PWM2_SENSE_P
ENABLE
PWM2_SENSE_N
PWM3_SENSE_P
PWM3_SENSE_N
Figure 3. Typical 3 Phase Application
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4
12V_FILTER
NCP5395G
VTT
PSI#_CPU
VID0
VID1
VID2
VID3
VID4
VID5
VID6
VID7
12V_FILTER
2 1
12V_FILTER
D
G
S
D
D
G
PWM3_SENSE_N
G
S
PWM3_SENSE_P
S
12
11
10
9
8
7
6
5
4
3
2
1
IMON
15
RFB
RF
16
17
CH
18
RDRP 19
CDFB
20
RDFB
21
RT
22
RISO
RISO
TG3
VSN
SWN3
DIFFOUT
COMP
VFB
DRVON
NCP5395G
48L 7x7 QFN
FLAG = GND
2
47
1
D
46
G
45 DRVON
S
BST2 44
43
TG2
VDRP
SWN2
VDFB
BG2
CSSUM
VCCP
DAC
SWN1
23 12VMON
VCC
24
48
TG1
BST1
D
D
G
42
S
41
12V_FILTER
40
PWM2_SENSE_N
G
PWM2_SENSE_P
S
12V_FILTER
39
38
2
1
37
D
G
S
25
26
27
28
29
30
31
32
33
34
35
36
12V_FILTER
VBST3
13 IMON
14
VSP
CS4P
CS4N
CS3P
CS3N
CS2P
CS2N
CS1P
CS1N
EN
VR_RDY
G4
BG1
RFB CFB
CF
12V_FILTER
ILIM
ROSC
VID7
VID6
VID5
VID4
VID3
VID2
VID1
VID0
PSI
BG3
VCCP
VCCP
VTT
ENABLE
D
D
+5.0V
PWM4_GATE
G
PWM1_SENSE_P
S
PWM3_SENSE_N
DRVON
PWM4_GATE
PWM4_SENSE_P
12V_FILTER
D
VCC BST
4 1 DRH
8
OD 7 SW
3
IN 5 DRL
2 PGND
6
NCP5359
PWM4_SENSE_N
Figure 4. Typical 4 Phase Application
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5
PWM1_SENSE_P
S
PWM1_SENSE_N
12V_FILTER
PWM2_SENSE_P
2 1
PWM2_SENSE_N
PWM3_SENSE_P
PWM1_SENSE_N
G
G
S
D
D
G
PWM4_SENSE_N
G
S
S
PWM4_SENSE_P
NCP5395G
Table 1. Pin Descriptions
Pin No.
Symbol
Description
1
BG3
Low side gate drive #3
2
PSI
Power Saving Control. Low = single phase operation; High = normal operation
3
VID0
Voltage ID DAC input
4
VID1
Voltage ID DAC input
5
VID2
Voltage ID DAC input
6
VID3
Voltage ID DAC input
7
VID4
Voltage ID DAC input
8
VID5
Voltage ID DAC input
9
VID6
Voltage ID DAC input
10
VID7/AMD
Voltage ID DAC input. Pull to VCC (5 V) to enable AMD 6−bit DAC code.
11
ROSC
A resistance from this pin to ground programs the oscillator frequency and provides a 2 V reference
for programming the ILIM voltage.
12
ILIM
Over current shutdown threshold setting. ILIM = VDRP − 1.3 V. Resistor divide ROSC to set threshold
13
IMON
0 to 1.1 V analog signal proportional to the output load current. VSN referenced Clamped to 1.1 Vmax
14
VSP
Non−inverting input to the internal differential remote sense amplifier
15
VSN
Inverting input to the internal differential remote sense amplifier
16
DIFFOUT
Output of the differential remote sense amplifier
17
COMP
Output of the compensation amplifier
18
VFB
Compensation amplifier voltage feedback
19
VDRP
Voltage output signal proportional to current used for current limit and output voltage droop
20
VDFB
Droop Amplifier Voltage Feedback
21
CSSUM
Inverted Sum of the Differential Current Sense inputs
22
DAC
DAC output used to provide feed forward for dynamic VID
23
12VMON
Monitor a 12 V input through a resistor divider
24
VCC
Power for the internal control circuits with UVLO monitor
25
CS4P
Non−inverting input to current sense amplifier #4
26
CS4N
Inverting input to current sense amplifier #4
27
CS3P
Non−inverting input to current sense amplifier #3
28
CS3N
Inverting input to current sense amplifier #3
29
CS2P
Non−inverting input to current sense amplifier #2
30
CS2N
Inverting input to current sense amplifier #2
31
CS1P
Non−inverting input to current sense amplifier #1
32
CS1N
Inverting input to current sense amplifier #1
33
EN
Threshold sensitive input. High = startup, Low =shutdown.
34
VR_RDY
Open collector output. High indicates that the output is regulating
35
G4
PWM output pulse to gate driver.
36
BG1
Low side gate drive #1
37
BST1
Upper MOSFET floating bootstrap supply for driver#1
38
TG1
High side gate drive #1
39
SWN1
Switch Node #1
40
VCCP
Power VCC for gate drivers with UVLO monitor
41
BG2
Low side gate drive #2
42
SWN2
Switch Node #2
43
TG2
High side gate drive #2
44
BST2
Upper MOSFET floating bootstrap supply for driver#2
45
DRVON
Bidirectional Gate Drive Enable
46
SWN3
Switch Node #3
47
TG3
High side gate drive #3
48
BST3
Upper MOSFET floating bootstrap supply for driver#3
FLAG
GND
Power supply return (QFN Flag)
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6
NCP5395G
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Controller Power Supply Voltages to GND
VCC
−0.3, 7
V
Driver Power Supply Voltages to GND
VCCP
−0.3, 15
V
High−Side Gate Driver Supplies: BSTx to SWNx
VBST − VSWN
35 V wrt/GND
40 V ≤ 50 ns wrt/GND
−0.3, 15 wrt/SWN
V
High−Side FET Gate Driver Voltages: TGx to SWNx
VTG − VSWN
BOOT + 0.3 V
35 V ≤ 50 ns wrt/GND
−0.3, 15 wrt/SWN
−5 V (200 ns)
V
VSWN
35
40 V ≤ 50 ns wrt/GND
−5 VDC
−10 V (200 ns)
V
VBG − AGND
VCC + 0.3 V
−5 V (200 ns)
V
VLOGIC
−0.3, 6
V
VGND
0
V
GND ±300
mV
1.1
V
−0.3, 5.5
V
30.5
°C/W
ELECTRICAL INFORMATION
Switch Node: SWNx
Low−Side Gate Drive: BGx
Logic Inputs
GND
V−
Imon Out
VIMON
All Other Pins
THERMAL INFORMATION
Thermal Characteristic
QFN Package (Note 1)
RqJA
Operating Junction Temperature Range (Note 2)
TJ
0 to 125
°C
Operating Ambient Temperature Range
TAMB
0 to +70
°C
Maximum Storage Temperature Range
TSTG
−55 to +150
°C
Moisture Sensitivity Level
QFN Package
MSL
1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*All signals referenced to GND unless noted otherwise.
*The maximum package power dissipation must be observed.
1. JESD 51−5 (1S2P Direct−Attach Method) with 0 LFM
2. Operation at −40°C to 0°C guaranteed by design, not production tested.
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NCP5395G
ELECTRICAL CHARACTERISTICS
0°C < TA < 70°C; 0°C < TJ < 125°C; 4.75 < VCC < 5.25 V; All DAC Codes; CVCC = 0.1 mF unless otherwise noted.
Parameter
Test Conditions
Min
Typ
Max
Unit
ERROR AMPLIFIER
Open Loop DC Gain
CL = 60 pF to GND,
RL = 10 kW to GND
−
100
−
dB
Open Loop Unity Gain Bandwidth
CL = 60 pF to GND,
RL = 10 kW to GND
−
18
−
MHz
Open Loop Phase Margin
CL = 60 pF to GND,
RL = 10 kW to GND
−
70
−
°
Slew Rate
DVin = 100 mV, G = −10V/V,
DVout = 1.5 V − 2.5 V,
CL = 60 pF to GND,
DC Load = ±125 mA to GND
−
10
−
V/ms
Maximum Output Voltage
10 mV of Overdrive,
ISOURCE = 2.0 mA
3.0
−
−
V
Minimum Output Voltage
10 mV of Overdrive,
ISINK = 500 mA
−
−
75
mV
Output Source Current
10 mV of Overdrive,
Vout = 3.5 V
1.5
2.0
−
mA
Output Sink Current
10 mV of Overdrive,
Vout = 0.1 V
0.65
1.0
−
mA
DIFFERENTIAL SUMMING AMPLIFIER
V+ Input Pull down Resistance
DRVON = low
DRVON = high
−
−
0.6
6.0
−
−
kW
V+ Input Bias Voltage
DRVON = low
DRVON = high
−
0.8
0.05
0.88
0.1
0.95
V
−0.3
−
3.0
V
−
15
−
MHz
Input Voltage Range (Note 3)
−3 dB Bandwidth
CL = 80 pF to GND,
RL = 10 kW to GND
Closed Loop DC gain VS to Diffout
VS+ to VS− = 0.5 V to 1.6 V
0.98
1.0
1.02
V/V
Maximum Output Voltage
10 mV of Overdrive,
ISOURCE = 2 mA
3.0
−
−
V
Minimum Output Voltage
10 mV of Overdrive,
ISINK = 1 mA
−
−
0.5
V
Output Source Current
10 mV of Overdrive,
Vout = 3 V
1.5
2.0
−
mA
Output Sink Current
10 mV of Overdrive,
Vout = 0.2 V
1.0
1.5
−
mA
−2
0
+2
mV
INTERNAL OFFSET VOLTAGE
Offset Voltage to the (+) Pin of the Error Amp & the
VDRP Pin
3. Design guaranteed.
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8
NCP5395G
ELECTRICAL CHARACTERISTICS
0°C < TA < 70°C; 0°C < TJ < 125°C; 4.75 < VCC < 5.25 V; All DAC Codes; CVCC = 0.1 mF unless otherwise noted.
Test Conditions
Parameter
Min
Typ
Max
Unit
VDROOP AMPLIFIER
Inverting Voltage Range
0
1.3
3.0
V
Open Loop DC Gain
CL = 20 pF to GND including ESD
RL = 1 kW to GND
−
100
−
dB
Open Loop Unity Gain Bandwidth
CL = 20 pF to GND including ESD
RL = 1 kW to GND
−
18
−
MHz
Open Loop Phase Margin
CL = 20 pF to GND including ESD
RL = 1 kW to GND
−
70
−
°
Slew Rate
CL = 20 pF to GND including ESD
RL = 1 kW to GND
−
10
−
V/ms
Maximum Output Voltage
10 mV of Overdrive,
ISOURCE = 4.0 mA
3.0
−
−
V
Minimum Output Voltage
10 mV of Overdrive,
ISINK = 1.0 mA
−
−
1.0
V
Output Source Current
10 mV of Overdrive,
Vout = 3.0 V
4.0
−
−
mA
Output Sink Current
10 mV of Overdrive,
Vout = 1.0 V
1.0
−
−
mA
Current Sense Input to VDRP −3 dB Bandwidth
CL = 10 pF to GND,
RL = 10 kW to GND
−
12
−
MHz
Current Summing Amp Output Offset Voltage
CSx − CSNx = 0, CSx = 1.1 V
−13
−
8.0
mV
Maximum CSSUM Output Voltage
CSx − CSxN = −0.2 V
(all phases) ISOURCE = 1 mA
3.0
−
−
V
Minimum CSSUM Output Voltage
CSx − CSxN = 0.7 V
(all phases) ISINK = 1 mA
−
−
0.3
V
Output Source Current
Vout = 3.0 V
1.0
−
−
mA
Output Sink Current
Vout = 0.3 V
4.0
−
−
mA
−
−
1.0
mA
450
600
770
mV
−
100
−
ns
3.0
−
−
V
CSSUM AMPLIFIER
PSI
Enable High Input Leakage Current
External 1k Pull−up to 3.3 V
Threshold
Delay
DRVON
Output High Voltage
Sourcing 500 mA
Output Low Voltage
Sinking 500 mA
−
−
0.7
V
Delay Time
Propagation delays
−
10
−
ns
Rise Time
CL (PCB) = 20 pF,
DVo = 10% to 90%
−
10
−
ns
Fall Time
CL (PCB) = 20 pF,
DVo = 10% to 90%
−
10
−
ns
Internal Pull−Down Resistance
35
70
140
kW
VCC Voltage when DRVON Output Valid
−
−
2.0
V
−50
−
50
nA
Common Mode Input Voltage Range
−0.3
−
2.0
V
Differential Mode Input Voltage Range
−120
−
120
mV
−2.5
−
2.5
mV
CURRENT SENSE AMPLIFIERS
Input Bias Current
Current Sharing Offset CS1 to CSx (Note 3)
CSx = CSxN = 1.4 V
all VIOS
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NCP5395G
ELECTRICAL CHARACTERISTICS
0°C < TA < 70°C; 0°C < TJ < 125°C; 4.75 < VCC < 5.25 V; All DAC Codes; CVCC = 0.1 mF unless otherwise noted.
Parameter
Test Conditions
Min
Typ
Max
Unit
CURRENT SENSE AMPLIFIERS
Current Sense Input to PWM Gain
0 V < CSx − CSxN < 0.1 V,
5.45
5.75
6.05
V/V
Current Sense Input to CSSUM Gain
0 V < CSx − CSxN < 0.1 V
−3.834
−3.7
−3.574
V/V
VDRP to IMON Gain
1.325 V > VDRP > 1.75 V
1.965
−
2.02
V/V
Current Sense Input to VDRP −3 dB Bandwidth
CL = 30 pF to GND,
RL = 100 kW to GND
−
4.0
−
MHz
Output Referred Offset Voltage
VDRP = 1.5 V, ISOURCE = 0 mA
−5.0
25
50
mV
Minimum Output Voltage
VDRP = 1.3 V, ISINK = 25 mA
−
−
0.1
V
Maximum Output Voltage
Iout = 300 mA
1.0
−
−
V
Output Sink Current
Vout = 0.3 V
175
−
−
mA
Maximum Clamp Voltage
IMON − VSN VDRP = HIGH
RLOAD = Open
1.1
−
1.2
V
100
−
1100
kHz
−
−
5.0
%
IMON
OSCILLATOR
Switching Frequency Range
Switching Frequency Accuracy
200 kHz < FSW < 600 kHz
Switching Frequency Accuracy
100 kHz < FSW < 1 MHz
−
−
10
%
Switching Frequency Accuracy (2ph or 4ph)
ROSC = 16.2k
454
−
502
kHz
Switching Frequency Accuracy (3ph)
ROSC = 16.2k
468
−
518
kHz
1.93
2.00
2.05
V
−
30
−
ns
−
1.1
−
V
ROSC Output Voltage
MODULATORS (PWM Comparators)
Minimum Pulse Width
Fsw = 800 kHz
Magnitude of the PWM Ramp
0% Duty Cycle
COMP Voltage when the PWM
Outputs Remain LO
50
250
400
mV
100% Duty Cycle
COMP Voltage when the PWM
Outputs Remain HI
1.1
1.35
1.6
V
PWM Phase Angle Error
Between Adjacent Phases
−15
−
15
°
VR_RDY (Power Good) OUTPUT
VR_RDY Output Saturation Voltage
IPGD = 10 mA
−
−
0.4
V
VR_RDY Rise Time (Note 3)
External pull−up of 1 KW to 1.25 V,
CTOT = 45 pF, DVo = 10% to 90%
−
100
150
ns
VR_RDY Output Voltage at Power−up
VR_RDY pulled up to 5 V via 2 kW,
tR(VCC) ≤ 3 x tR(5V)
100 ms ≤ tR(VCC) ≤ 20 ms
−
−
1.0
V
VR_RDY High − Output Leakage Current
VR_RDY = 5.5 V via 1 K
−
−
0.1
mA
VR_RDY Upper Threshold Voltage (INTEL)
VCore Increasing, DAC = 1.3 V
−
300
250
mV
(below
DAC)
VR_RDY Lower Threshold Voltage (INTEL)
VCore Decreasing, DAC = 1.3 V
390
350
300
mV
(below
DAC)
VR_RDY Upper Threshold Voltage (AMD)
VCore Increasing, DAC = 1.3 V
−
−
142
mV
(below
DAC)
VR_RDY Lower Threshold Voltage (AMD)
VCore Decreasing, DAC = 1.3 V
282
−
192
mV
(below
DAC)
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10
NCP5395G
ELECTRICAL CHARACTERISTICS
0°C < TA < 70°C; 0°C < TJ < 125°C; 4.75 < VCC < 5.25 V; All DAC Codes; CVCC = 0.1 mF unless otherwise noted.
Parameter
Test Conditions
Min
Typ
Max
Unit
VR_RDY (Power Good) OUTPUT
VR_RDY Rising Delay
VCore Increasing
−
250
−
ms
VR_RDY Falling Delay
VCore Decreasing
−
5.0
−
ms
3.0
−
−
V
PWM G4 OUTPUT
Output High Voltage
Sourcing 500 mA
Mid Output Voltage
1.4
1.5
1.6
V
Output Low Voltage
Sinking 500 mA
−
−
0.7
V
Delay + Rise Time (Note 3)
CL (PCB) = 50 pF,
DVo = VCC to GND
−
10
−
ns
Delay + Fall Time (Note 3)
CL (PCB) = 50 pF,
DVo = GND to VCC
−
10
−
ns
Tri−State Output Leakage (Note 3)
Gx = 2.5 V, x = 1−4
−
−
1.5
mA
Output Impedance −
HI or LO State
Max Resistance to VCC (HI) or
GND (LO)
−
75
150
W
−
−
2.0
V
Minimum VCC for Valid PWM Output Level
PWM 4 2/3/4 Phase Detection
2 Phase Mode
Note Gate 4 tied to VCC
3.2
−
VCC
V
4 Phase Mode
Note Gate Driver will pull to 1.5 V
1.2
−
2.8
V
3 Phase Mode
Note Gate 4 tied to GND
0
−
0.8
V
Soft−Start Ramp Time
DAC = 0 to DAC = 1.1 V
1.0
−
1.3
ms
VR11 Vboot time
Not used in Legacy Startup
400
500
600
ms
VID Threshold
450
600
770
mV
VR11 Input Bias Current
−100
−
100
nA
200
−
300
ns
−
−
4.8
V
3.33
−
−
V
DIGITAL SOFT−START
VID7/VR11/AMD/LEGACY INPUT
Delay Before Latching VID Change (VID Deskewing)
(Note 3)
Measured from the Edge of the 1st
VID Change
AMD Upper Threshold
Note: When above this threshold
the controller will ramp directly to
VID without stopping at Vboot
AMD Lower Threshold
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11
NCP5395G
ELECTRICAL CHARACTERISTICS
0°C < TA < 70°C; 0°C < TJ < 125°C; 4.75 < VCC < 5.25 V; All DAC Codes; CVCC = 0.1 mF unless otherwise noted.
Parameter
Test Conditions
Min
Typ
Max
Unit
ENABLE INPUT
Enable High Input Leakage Current
Pull−up to 1.3 V
VR11.1 Threshold
AMD Upper Threshold
AMD Lower Threshold
−
−
200
nA
450
600
770
mV
−
1.3
1.5
V
0.9
1.1
−
V
AMD Total Hysteresis
Rising− Falling Threshold
−
200
−
mV
Enable Delay Time
Measure time from Enable
transitioning HI to when SS begins
−
3.5
−
ms
0.97
1.00
1.03
V/V
CURRENT LIMIT
ILIM to VDRP Gain
ILIM to VRDP Gain in PSI 4 Phase
−
0.25
−
V/V
ILIM to VDRP Gain in PSI 3 Phase
−
0.333
−
V/V
ILIM to VDRP Gain in PSI 2 Phase
−
0.5
−
V/V
ILIM Pin Input Bias Current
−
0.1
1.0
mA
ILIM Pin Working Voltage Range
0.1
−
2.0
V
−25
−
25
mV
−
−
120
ns
VR11 Over Voltage Threshold
DAC+
400
DAC+
460
DAC+
550
mV
AMD Over Voltage Threshold
DAC+
400
DAC+
460
DAC+
550
mV
−
−
100
ns
VCC UVLO Start Threshold
4.0
4.25
4.5
V
VCC UVLO Stop Threshold
3.8
4.05
4.3
V
VCC UVLO Hysteresis
150
200
−
mV
ILIM accuracy
Measured with respect to the ILIM
setting
Delay
OVERVOLTAGE PROTECTION
Delay
UNDERVOLTAGE PROTECTION
12VMON UVLO
12VMON (High Threshold)
VCC Valid
−
0.6
0.8
v
12VMON (Low Threshold)
VCC Valid
0.4
0.5
−
v
DAC OUTPUT
Output Source Current
Vout = 1.6 V
0
−
5.0
mA
Output Sink Current
Vout = 0.3 V
5.0
−
16
mA
Threshold
450
600
770
mV
VR11 Mode Leakage
−100
−
100
nA
10
−
25
mA
200
−
300
ns
VID INPUTS
AMD Mode Input Bias Current
Delay before Latching VID Change
(VID Deskewing) (Note 3)
Measured from the edge of the
VID change
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12
1st
NCP5395G
ELECTRICAL CHARACTERISTICS
0°C < TA < 70°C; 0°C < TJ < 125°C; 4.75 < VCC < 5.25 V; All DAC Codes; CVCC = 0.1 mF unless otherwise noted.
Parameter
Test Conditions
Min
Typ
Max
Unit
Slew Rate Limit (Intel Mode)
12.5
Slew Rate Limit (AMD Mode)
3.125
−
15
mV/ms
−
3.75
mV/ms
−
0.84
−
mV/ms
20
−
42
mA
VCCP UVLO Start Threshold
8.2
9.0
9.5
V
VCCP UVLO Stop Threshold
7.2
8.0
8.5
V
1.0
−
−
V
3.0
3.17
−
DIGITAL DAC SLEW RATE LIMITER
Soft−Start Slew Rate
INPUT SUPPLY CURRENT
VCC Operating Current
EN Low, No PWM
VCCP SUPPLY VOLTAGE
VCCP UVLO Hysteresis
VCCP POR
Voltage at which the Driver OVP
becomes active
BOOST PIN UVLO
BOOST VCC UVLO Start Threshold
3.45
4.15
V
BOOST VCC UVLO Stop Threshold
3.3
3.85
V
BOOST VCC UVLO Hysteresis
50
200
−
mV
BOOST SUPPLY CURRENT
IVCCP_NORM Standby Current
EN = VCC, VCCP = 12 V
−
−
2.5
mA
IBST1_SD Standby Current
IN = VCCP, VCCP = 12 V
−
0.25
2.5
mA
IBST2_SD Standby Current
IN = GND, VCCP = 12 V
−
0.25
2.5
mA
IBST3_SD Standby Current
IN = GND, VCCP = 12 V
−
0.25
2.5
mA
1.7
−
2.03
V
STARTUP HIGH SIDE SHORT TRIP (Active only during
Vswx Output Overvoltage Trip Threshold at Startup
1st
power on)
Power Startup time, VCC > 9 V
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13
NCP5395G
ELECTRICAL CHARACTERISTICS
0°C < TA < 70°C; 0°C < TJ < 125°C; 4.75 < VCC < 5.25 V; All DAC Codes; CVCC = 0.1 mF unless otherwise noted.
Test Conditions
Parameter
Min
Typ
Max
Unit
W
HIGH SIDE DRIVER
RH_TG Output Resistance, Sourcing
VBST − VSW = 12 V
−
1.8
5.0
RH_TG Output Resistance, Sinking
VBST − VSW = 12 V
−
1.0
2.5
TrDRVH Transition Time
CLOAD = 3 nF, VBST − VSW = 12 V
−
25
−
ns
TfDRVH Transition Time
CLOAD = 3 nF, VBST − VSW = 12 V
−
20
−
ns
TpdhDRVH Propagation Delay (Note 4)
Driving High, CLOAD = 3 nF,
VCCP = 12 V
−
15
−
ns
RH_BG Output Resistance, Sourcing
SW = GND
−
1.6
5.0
W
RL_BG Output Resistance, Sinking
SW = VCC
−
1.0
2.5
W
TrDRVL Transition Time
CLOAD = 3 nF
−
20
−
ns
TfDRVL Transition Time
CLOAD = 3 nF
−
20
−
ns
TpdhDRVL Propagation Delay (Note 4)
Driving High, CLOAD = 3 nF,
VCCP = 12 V
−
15
−
ns
−
−1.0
−
mV
150
170
−
°C
−
20
−
°C
−
−
−
−
−
−
±0.5
±5.0
±8.0
%
mV
mV
LOW SIDE DRIVER
VNCDT Negative Current Detector Threshold (Note 3)
THERMAL SHUTDOWN
Tsd Thermal Shutdown (Note 3)
Tsdhys Thermal Shutdown Hysteresis (Note 3)
VRM 11 DAC
System Voltage Accuracy
1.0 V < DAC < 1.6 V
0.8 V < DAC < 1.0 V
0.5 V < DAC < 0.8 V
4. For propagation delays, “tpdh” refers to the specified signal going high “tpdl” refers to it going low. Reference Gate Timing Diagram.
IN
tpdlDRVL
tfDRVL
DRVL
90%
90%
2V
10%
10%
tpdhDRVH
thDRVH
tpdlDRVH
90%
10%
tfDRVH
90%
2V
DRVH−SW
trDRVL
10%
tpdhDRVL
SW
Figure 5. Timing Diagram
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14
NCP5395G
Table 2. VRM11 VID CODES
VID7
800 mV
VID6
400 mV
VID5
200 mV
VID4
100 mV
VID3
50 mV
VID2
25 mV
VID1
12.5 mV
VID0
6.25 mV
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
1.60000
02
0
0
0
0
0
0
1
1
1.59375
03
0
0
0
0
0
1
0
0
1.58750
04
0
0
0
0
0
1
0
1
1.58125
05
0
0
0
0
0
1
1
0
1.57500
06
0
0
0
0
0
1
1
1
1.56875
07
0
0
0
0
1
0
0
0
1.56250
08
0
0
0
0
1
0
0
1
1.55625
09
0
0
0
0
1
0
1
0
1.55000
0A
0
0
0
0
1
0
1
1
1.54375
0B
0
0
0
0
1
1
0
0
1.53750
0C
0
0
0
0
1
1
0
1
1.53125
0D
0
0
0
0
1
1
1
0
1.52500
0E
0
0
0
0
1
1
1
1
1.51875
0F
0
0
0
1
0
0
0
0
1.51250
10
0
0
0
1
0
0
0
1
1.50625
11
0
0
0
1
0
0
1
0
1.50000
12
0
0
0
1
0
0
1
1
1.49375
13
0
0
0
1
0
1
0
0
1.48750
14
0
0
0
1
0
1
0
1
1.48125
15
0
0
0
1
0
1
1
0
1.47500
16
0
0
0
1
0
1
1
1
1.46875
17
0
0
0
1
1
0
0
0
1.46250
18
0
0
0
1
1
0
0
1
1.45625
19
0
0
0
1
1
0
1
0
1.45000
1A
0
0
0
1
1
0
1
1
1.44375
1B
0
0
0
1
1
1
0
0
1.43750
1C
0
0
0
1
1
1
0
1
1.43125
1D
0
0
0
1
1
1
1
0
1.42500
1E
0
0
0
1
1
1
1
1
1.41875
1F
0
0
1
0
0
0
0
0
1.41250
20
0
0
1
0
0
0
0
1
1.40625
21
0
0
1
0
0
0
1
0
1.40000
22
0
0
1
0
0
0
1
1
1.39375
23
0
0
1
0
0
1
0
0
1.38750
24
0
0
1
0
0
1
0
1
1.38125
25
0
0
1
0
0
1
1
0
1.37500
26
0
0
1
0
0
1
1
1
1.36875
27
0
0
1
0
1
0
0
0
1.36250
28
0
0
1
0
1
0
0
1
1.35625
29
0
0
1
0
1
0
1
0
1.35000
2A
0
0
1
0
1
0
1
1
1.34375
2B
0
0
1
0
1
1
0
0
1.33750
2C
0
0
1
0
1
1
0
1
1.33125
2D
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15
Voltage (V)
HEX
00
01
NCP5395G
Table 2. VRM11 VID CODES
VID7
800 mV
VID6
400 mV
VID5
200 mV
VID4
100 mV
VID3
50 mV
VID2
25 mV
VID1
12.5 mV
VID0
6.25 mV
Voltage (V)
HEX
0
0
1
0
1
1
1
0
1.32500
2E
0
0
1
0
1
1
1
1
1.31875
2F
0
0
1
1
0
0
0
0
1.31250
30
0
0
1
1
0
0
0
1
1.30625
31
0
0
1
1
0
0
1
0
1.30000
32
0
0
1
1
0
0
1
1
1.29375
33
0
0
1
1
0
1
0
0
1.28750
34
0
0
1
1
0
1
0
1
1.28125
35
0
0
1
1
0
1
1
0
1.27500
36
0
0
1
1
0
1
1
1
1.26875
37
0
0
1
1
1
0
0
0
1.26250
38
0
0
1
1
1
0
0
1
1.25625
39
0
0
1
1
1
0
1
0
1.25000
3A
0
0
1
1
1
0
1
1
1.24375
3B
0
0
1
1
1
1
0
0
1.23750
3C
0
0
1
1
1
1
0
1
1.23125
3D
0
0
1
1
1
1
1
0
1.22500
3E
0
0
1
1
1
1
1
1
1.21875
3F
0
1
0
0
0
0
0
0
1.21250
40
0
1
0
0
0
0
0
1
1.20625
41
0
1
0
0
0
0
1
0
1.20000
42
0
1
0
0
0
0
1
1
1.19375
43
0
1
0
0
0
1
0
0
1.18750
44
0
1
0
0
0
1
0
1
1.18125
45
0
1
0
0
0
1
1
0
1.17500
46
0
1
0
0
0
1
1
1
1.16875
47
0
1
0
0
1
0
0
0
1.16250
48
0
1
0
0
1
0
0
1
1.15625
49
0
1
0
0
1
0
1
0
1.15000
4A
0
1
0
0
1
0
1
1
1.14375
4B
0
1
0
0
1
1
0
0
1.13750
4C
0
1
0
0
1
1
0
1
1.13125
4D
0
1
0
0
1
1
1
0
1.12500
4E
0
1
0
0
1
1
1
1
1.11875
4F
0
1
0
1
0
0
0
0
1.11250
50
0
1
0
1
0
0
0
1
1.10625
51
0
1
0
1
0
0
1
0
1.10000
52
0
1
0
1
0
0
1
1
1.09375
53
0
1
0
1
0
1
0
0
1.08750
54
0
1
0
1
0
1
0
1
1.08125
55
0
1
0
1
0
1
1
0
1.07500
56
0
1
0
1
0
1
1
1
1.06875
57
0
1
0
1
1
0
0
0
1.06250
58
0
1
0
1
1
0
0
1
1.05625
59
0
1
0
1
1
0
1
0
1.05000
5A
0
1
0
1
1
0
1
1
1.04375
5B
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16
NCP5395G
Table 2. VRM11 VID CODES
VID7
800 mV
VID6
400 mV
VID5
200 mV
VID4
100 mV
VID3
50 mV
VID2
25 mV
VID1
12.5 mV
VID0
6.25 mV
Voltage (V)
HEX
0
1
0
1
1
1
0
0
1.03750
5C
0
1
0
1
1
1
0
1
1.03125
5D
0
1
0
1
1
1
1
0
1.02500
5E
0
1
0
1
1
1
1
1
1.01875
5F
0
1
1
0
0
0
0
0
1.01250
60
0
1
1
0
0
0
0
1
1.00625
61
0
1
1
0
0
0
1
0
1.00000
62
0
1
1
0
0
0
1
1
0.99375
63
0
1
1
0
0
1
0
0
0.98750
64
0
1
1
0
0
1
0
1
0.98125
65
0
1
1
0
0
1
1
0
0.97500
66
0
1
1
0
0
1
1
1
0.96875
67
0
1
1
0
1
0
0
0
0.96250
68
0
1
1
0
1
0
0
1
0.95625
69
0
1
1
0
1
0
1
0
0.95000
6A
0
1
1
0
1
0
1
1
0.94375
6B
0
1
1
0
1
1
0
0
0.93750
6C
0
1
1
0
1
1
0
1
0.93125
6D
0
1
1
0
1
1
1
0
0.92500
6E
0
1
1
0
1
1
1
1
0.91875
6F
0
1
1
1
0
0
0
0
0.91250
70
0
1
1
1
0
0
0
1
0.90625
71
0
1
1
1
0
0
1
0
0.90000
72
0
1
1
1
0
0
1
1
0.89375
73
0
1
1
1
0
1
0
0
0.88750
74
0
1
1
1
0
1
0
1
0.88125
75
0
1
1
1
0
1
1
0
0.87500
76
0
1
1
1
0
1
1
1
0.86875
77
0
1
1
1
1
0
0
0
0.86250
78
0
1
1
1
1
0
0
1
0.85625
79
0
1
1
1
1
0
1
0
0.85000
7A
0
1
1
1
1
0
1
1
0.84375
7B
0
1
1
1
1
1
0
0
0.83750
7C
0
1
1
1
1
1
0
1
0.83125
7D
0
1
1
1
1
1
1
0
0.82500
7E
0
1
1
1
1
1
1
1
0.81875
7F
1
0
0
0
0
0
0
0
0.81250
80
1
0
0
0
0
0
0
1
0.80625
81
1
0
0
0
0
0
1
0
0.80000
82
1
0
0
0
0
0
1
1
0.79375
83
1
0
0
0
0
1
0
0
0.78750
84
1
0
0
0
0
1
0
1
0.78125
85
1
0
0
0
0
1
1
0
0.77500
86
1
0
0
0
0
1
1
1
0.76875
87
1
0
0
0
1
0
0
0
0.76250
88
1
0
0
0
1
0
0
1
0.75625
89
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NCP5395G
Table 2. VRM11 VID CODES
VID7
800 mV
VID6
400 mV
VID5
200 mV
VID4
100 mV
VID3
50 mV
VID2
25 mV
VID1
12.5 mV
VID0
6.25 mV
Voltage (V)
HEX
1
0
0
0
1
0
1
0
0.75000
8A
1
0
0
0
1
0
1
1
0.74375
8B
1
0
0
0
1
1
0
0
0.73750
8C
1
0
0
0
1
1
0
1
0.73125
8D
1
0
0
0
1
1
1
0
0.72500
8E
1
0
0
0
1
1
1
1
0.71875
8F
1
0
0
1
0
0
0
0
0.71250
90
1
0
0
1
0
0
0
1
0.70625
91
1
0
0
1
0
0
1
0
0.70000
92
1
0
0
1
0
0
1
1
0.69375
93
1
0
0
1
0
1
0
0
0.68750
94
1
0
0
1
0
1
0
1
0.68125
95
1
0
0
1
0
1
1
0
0.67500
96
1
0
0
1
0
1
1
1
0.66875
97
1
0
0
1
1
0
0
0
0.66250
98
1
0
0
1
1
0
0
1
0.65625
99
1
0
0
1
1
0
1
0
0.65000
9A
1
0
0
1
1
0
1
1
0.64375
9B
1
0
0
1
1
1
0
0
0.63750
9C
1
0
0
1
1
1
0
1
0.63125
9D
1
0
0
1
1
1
1
0
0.62500
9E
1
0
0
1
1
1
1
1
0.61875
9F
1
0
1
0
0
0
0
0
0.61250
A0
1
0
1
0
0
0
0
1
0.60625
A1
1
0
1
0
0
0
1
0
0.60000
A2
1
0
1
0
0
0
1
1
0.59375
A3
1
0
1
0
0
1
0
0
0.58750
A4
1
0
1
0
0
1
0
1
0.58125
A5
1
0
1
0
0
1
1
0
0.57500
A6
1
0
1
0
0
1
1
1
0.56875
A7
1
0
1
0
1
0
0
0
0.56250
A8
1
0
1
0
1
0
0
1
0.55625
A9
1
0
1
0
1
0
1
0
0.55000
AA
1
0
1
0
1
0
1
1
0.54375
AB
1
0
1
0
1
1
0
0
0.53750
AC
1
0
1
0
1
1
0
1
0.53125
AD
1
0
1
0
1
1
1
0
0.52500
AE
1
0
1
0
1
1
1
1
0.51875
AF
1
0
1
1
0
0
0
0
0.51250
B0
1
0
1
1
0
0
0
1
0.50625
B1
1
0
1
1
0
0
1
0
0.50000
B2
1
1
1
1
1
1
1
0
OFF
FE
1
1
1
1
1
1
1
1
OFF
FF
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NCP5395G
Test Condition
Parameter
MIN
TYP
MAX
Units
−
−
−
−
−
−
±0.5
±1.0
−2.0, +3.0
%
%
%
AMD DAC
1.0 V < DAC < 1.55V
0.6 V ≤ DAC < 1.0V
0.375 V < DAC < 0.6V
System Voltage Accuracy
5. NOTE: Internal DAC voltage is centered 19 mV below the listed voltage for VR11.1. No DAC offset is implemented for AMD operation.
DAC should be equal to the Nominal Vout shown in the table.
Table 3. AMD PROCESSOR 6−BIT VID CODE
(VID) Codes
VID5
VID4
VID3
VID2
VID1
VID0
Nominal
Vout
Units
0
0
0
0
0
0
1.550
V
0
0
0
0
0
1
1.525
V
0
0
0
0
1
0
1.500
V
0
0
0
0
1
1
1.475
V
0
0
0
1
0
0
1.450
V
0
0
0
1
0
1
1.425
V
0
0
0
1
1
0
1.400
V
0
0
0
1
1
1
1.375
V
0
0
1
0
0
0
1.350
V
0
0
1
0
0
1
1.325
V
0
0
1
0
1
0
1.300
V
0
0
1
0
1
1
1.275
V
0
0
1
1
0
0
1.250
V
0
0
1
1
0
1
1.225
V
0
0
1
1
1
0
1.200
V
0
0
1
1
1
1
1.175
V
0
1
0
0
0
0
1.150
V
0
1
0
0
0
1
1.125
V
0
1
0
0
1
0
1.100
V
0
1
0
0
1
1
1.075
V
0
1
0
1
0
0
1.050
V
0
1
0
1
0
1
1.025
V
0
1
0
1
1
0
1.000
V
0
1
0
1
1
1
0.975
V
0
1
1
0
0
0
0.950
V
0
1
1
0
0
1
0.925
V
0
1
1
0
1
0
0.900
V
0
1
1
0
1
1
0.875
V
0
1
1
1
0
0
0.850
V
0
1
1
1
0
1
0.825
V
0
1
1
1
1
0
0.800
V
0
1
1
1
1
1
0.775
V
1
0
0
0
0
0
0.7625
V
1
0
0
0
0
1
0.7500
V
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NCP5395G
Table 3. AMD PROCESSOR 6−BIT VID CODE
(VID) Codes
VID5
VID4
VID3
VID2
VID1
VID0
Nominal
Vout
Units
1
0
0
0
1
0
0.7375
V
1
0
0
0
1
1
0.7250
V
1
0
0
1
0
0
0.7125
V
1
0
0
1
0
1
0.7000
V
1
0
0
1
1
0
0.6875
V
1
0
0
1
1
1
0.6750
V
1
0
1
0
0
0
0.6625
V
1
0
1
0
0
1
0.6500
V
1
0
1
0
1
0
0.6375
V
1
0
1
0
1
1
0.6250
V
1
0
1
1
0
0
0.6125
V
1
0
1
1
0
1
0.6000
V
1
0
1
1
1
0
0.5875
V
1
0
1
1
1
1
0.5750
V
1
1
0
0
0
0
0.5625
V
1
1
0
0
0
1
0.5500
V
1
1
0
0
1
0
0.5375
V
1
1
0
0
1
1
0.5250
V
1
1
0
1
0
0
0.5125
V
1
1
0
1
0
1
0.5000
V
1
1
0
1
1
0
0.4875
V
1
1
0
1
1
1
0.4750
V
1
1
1
0
0
0
0.4625
V
1
1
1
0
0
1
0.4500
V
1
1
1
0
1
0
0.4375
V
1
1
1
0
1
1
0.4250
V
1
1
1
1
0
0
0.4125
V
1
1
1
1
0
1
0.4000
V
1
1
1
1
1
0
0.3875
V
1
1
1
1
1
1
0.3750
V
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NCP5395G
FUNCTIONAL DESCRIPTIONS
General
V Diffout + V out ) 1.3 V * V dac * V outreturn
The NCP5395G dual edge modulated multiphase PWM
controller is specifically designed with the necessary
features for a high current CPU system. The IC consists of
the following blocks: Precision Flexible DAC, Differential
Remote Voltage Sense Amplifier, High Performance
Voltage Error Amplifier, Differential Current Feedback
Amplifiers, Precision Oscillator and Saw−tooth Generator,
and PWM Comparators with Hysteresis. The controller also
supports power saving mode as per Intel VR11.1 by
accurately monitoring the current and switching between
multi−phase and single phase operations as requested by the
microprocessor system. Protection features include:
Undervoltage Lockout, Soft−Start, Overcurrent Protection,
Overvoltage Protection, and Power Good Monitor.
This signal then goes through a standard compensation
circuit and into the inverting input of the error amplifier. The
non−inverting input of the error amplifier is also connected
to the 1.3 V reference. The 1.3 V reference then is subtracted
out and the error signal at the comp pin of the error amplifier
is as normally expected:
V comp + V dac * V out
The non−inverting input of the remote sense amplifier is
pulled low through a small current sink during a fault condition
to prevent accidental charging of the regulator output.
2/3/4 Phase Operation
The part can be configured to 2−, 3−, or 4−phase mode. In
2− or 3−phase mode, the internal drivers will be used. In
4−phase mode, an external driver must be used to drive
phase 4. The NCP5359 driver is suggested to be used with
the controller. The input to G4 pin will decide which phase
mode the system is in operation. Please refer to the
Application Schematics for more information.
Precision Programmable DAC
A precision flexible DAC is provided. The DAC will
conform to 2 different specifications: AMD or VR11.1. The
VID7/AMD pin is provided to determine which DAC
specification will be used and which soft−start mode the part
will use for power up. There are two soft−start modes. If
VID7/AMD is above it’s threshold the device will soft−start
and ramp directly to the DAC code present on the VID
inputs. The following truth table describes the functionality:
VID7/AMD Pin
VID7
Enable Pin
Mode
Soft−Start
Mode
Above AMD
Threshold
Not active
AMD
Thresholds
Ramp to
VID
Below AMD
Threshold
Active
VR11.1
Thresholds
Ramp to
Vboot
High Performance Voltage Error Amplifier
A high performance voltage error amplifier is provided.
The error amplifier’s inverting input is VFB and its output
is COMP. A standard type 3 compensation circuit is used
compensate the system. This involves a 3 pole, 2 zero
compensation network. The comp pin is pulled to ground
before soft−start for smooth start up.
Differential Current Sense
VID0−VID7 control the target regulation voltage during
normal operation. In AMD mode the VID capture is enabled
just before soft−start. In VR11 mode the VID capture is
enabled at the end of the VBOOT waiting period. If the VID
is valid the DAC will track to it. If an invalid VID occurs it
will be ignored for 10 ms before the controller shuts down.
Four differential amplifiers are provided to sense the
output current of each phase. These current sense amplifiers
sense the current through the corresponding phase. A
voltage is generated across a current sense element such as
an inductor or sense resistor. The sense element should be
between 0.3 mW and 1.5 mW. It is possible to sense both
negative and positive going current. The information is used
to create the signal CSSUM and provide feedback for
current sharing.
Remote Sense Amplifier
Precision Oscillator
VID Inputs
A high performance differential amplifier is provided to
accurately sense the output voltage of the regulator. The
non−inverting input should be connected to the regulator’s
output voltage. The inverting input should be connected to
the return line of the regulator. Both connection points are
intended to be at a remote point so that the most accurate
reading of the output voltage can be obtained. The amplifier
is configured in a very unique way. First, the gain of the
amplifier is internally set to unity. Second, both the inverting
and non−inverting inputs of the amplifier are summing
nodes. The inverting input sums the output voltage return
voltage with the DAC voltage. The non−inverting input
sums the remote output voltage with a 1.3 V reference. The
resulting voltage at the output of the remote sense amplifier is:
A programmable precision oscillator is provided. This
oscillator is programmed by the summed resistance of an
oscillator resistor and a current limit resistor. The output
voltage of this pin is 2V used as the reference for the current
limit. The oscillator frequency range is 125 KHz/phase to
1000 KHz/phase. The oscillator frequency is proportional to
the current drawn out of the OSC pin. Connecting a resistor
(Rosc) from OSC pin to the ground will set the target
oscillator frequency. The relation between the Rosc and Fsw
can be described as below:
Rosc = 15530 x Fsw^(-1.111)
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NCP5395G
PWM Comparators
voltage exceeds the DAC voltage by 185 mV, or 285 mV if
in AMD mode, the VR_RDY flag will transition low the
high side gate drivers set to low, and the low side gate drivers
are all brought to high until the voltage falls below the OVP
threshold. The OVP will not shut down the controller if it
occurs during soft−start. This is to allow the controller to
pull the output down to the DAC voltage and start up into a
pre−charged output.
Four PWM comparators are incorporated within the IC.
The non−inverting input of the comparators is connected to
the output of the error amplifier. The inverting input is
connected to a summed output of the phase current and the
oscillator ramp voltage with an offset. The output of the
comparator generates the PWM control signals.
During steady state operation, the duty cycle will center
on the valley of the saw−tooth waveform. During a transient
event, the controller will operate somewhat hysteretic, with
the duty cycle climbing along either the down ramp, up
ramp, or both.
VCCP Power ON Reset OVP
The VCCP power on reset OVP feature is used to protect
the CPU during start up. When VCCP is higher than 3.2 V, the
gate driver will monitor the switching node SW pin. If
SWNx pin higher than 1.9 V, the bottom gate will be forced
to high for discharge of the output capacitor. This works best
if the 5 volt standby is diode OR’ed into VCCP with the 12 V
rail. The fault mode will be latched and the DRVON pin will
be forced to low, unless VCCP is reduced below the UVLO
threshold.
Soft−Start
Soft−start is implemented internally. A digital counter
steps the DAC up from zero to the target voltage based on the
predetermined rate in the spec table. There are 2 possible
soft start modes: VR11 and AMD. AMD mode simply ramps
Vcore from 0 V directly to the DAC setting. The VR11 mode
ramps DAC to 1.1 V, pauses for 500 ms, reads the DAC
setting, then ramps to the final DAC setting.
Power Saving Mode
The controller is designed to allow power saving
operation to maintain a maximum efficiency. When a low
PSI signal from microcontroller is received, the controller
will keep one phase operating while shedding other phases.
The active one phase will operate in diode emulation mode,
minimizing power losses in light load. The device also
maintains an RPM operation in power saving mode. The
12VMON input will be used for two purposes: feedforward
input supply information for RPM mode and secondary
power input voltage UVLO. When the low PSI signal is
de−asserted, the dropped phases will be pulled back in to be
ready for heavy load and the device will be back to regular
PWM mode.
Digital Slew Rate Limiter / Soft−Start Block
The slew rate limiter and the soft−start block are to be
implemented with a digital up/down counter controlled by
an oscillator that is synchronized to VID line changes.
During soft−start the DAC will ramp at the soft−start rate,
after soft start is complete the ramp rate will follow either the
Intel or the AMD slew rate depending on the mode.
Under Voltage Lockouts
An under voltage circuit senses the VCC input of the
controller and the VCCP input of the driver. During power up
the input voltage to the controller is monitored. The PWM
outputs and the soft start circuit are disabled until the input
voltage exceeds the threshold voltage of the comparators.
Hysteresis is incorporated within the comparators.
The DRVON is held low until VCCP reaches the start
threshold during startup. If VCCP decreases below the stop
threshold, the output gate will be forced low unit input
voltage VCCP rises above the startup threshold.
Adaptive Non−overlap
The non−overlap dead time control is used to avoid shoot
through damage to the power MOSFETs. When the PWM
signal pull high, DRVL will go low after a propagation
delay, the controller monitors the switching node (SWN) pin
voltage and the gate voltage of the MOSFET to know the
status of the MOSFET. When the low side MOSFET status
is off an internal timer will delay turn on of the high–side
MOSFET. When the PWM pull low, gate DRVH will go low
after the propagation delay (tpdDRVH). The time to turn off
the high side MOSFET is depending on the total gate charge
of the high−side MOSFET. A timer will be triggered once
the high side MOSFET is turn off to delay the turn on the
low−side MOSFET.
Over Current Latch
A programmable over current latch is incorporated within
the IC. The oscillator pin provides the reference voltage for
this pin. A resistor divider from the OSC pin generates the
ILIM voltage. The latch is set when the current information
on Vdroop exceeds the programmed voltage plus a 1.3 V
offset. DRVON is immediately set low. To recover the part
must be reset by the EN pin or by cycling VCC.
Layout Guidelines
Layout is very important thing for design a DC−DC
converter. Bootstrap capacitor and Vin capacitor are most
critical items, it should be placed as close as to the controller
IC. Another item is using a GND plane. Ground plane can
provide a good return path for gate drives for reducing the
ground noise. Therefore GND pin should be directly
connected to the ground plane and close to the low−side
MOSFET source pin. Also, the gate drive trace should be
UVLO Monitor
If the output voltage falls greater than 300 mV below the
DAC voltage for more than 5 ms the UVLO comparator will
trip sending the VR_RDY signal low.
Over Voltage Protection
The output voltage is monitored at the input of the
differential amplifier. During normal operation, if the output
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NCP5395G
considered. The gate drives has a high di/dt when switching,
therefore a minimized gate drives trace can reduce the di/dv,
raise and fall time for reduce the switching loss.
1.25 V
ENABLE
VID Captured
1.25 V
VID Not Valid
VID Valid
1 ms − 20 ms
Rise Time
5V
12 V
12 V
1 ms − 20 ms
Rise Time
5 and 12 Good
DRVON
VR11 Soft−start
Mode Latched
3.5 ms
Calibration Time
Soft−start
Slew Rate
DAC Setting
1.10 V
Soft−start
Slew Rate
500 ms
VOUT/DAC
500 ms
VR_RDY
Figure 6. VR11.1 Start Up Timing Diagram
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NCP5395G
ENABLE
5V
VID7/AMD
1 ms − 20 ms
Rise Time
VCC
5V
1 ms − 20 ms
Rise Time
12 V
9.5 V
VCCP
VCC and VCCP
UVLO
AMD/Legacy Soft Start
Mode Latched
3.5 ms
Calibration Time
DRVON
DAC Setting
SS Slew
Rate
VOUT/DAC
500 ms
VR_RDY
Figure 7. AMD / Legacy Start Up Timing Diagram
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NCP5395G
PACKAGE DIMENSIONS
QFN48, 7x7, 0.5P
CASE 485AJ
ISSUE O
ÈÈ
ÈÈ
PIN 1
LOCATION
D
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO THE PLATED
TERMINAL AND IS MEASURED ABETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
E
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L
2X
0.15 C
DETAIL A
OPTIONAL CONSTRUCTION
2X SCALE
2X
0.15 C
TOP VIEW
(A3)
0.05 C
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
7.00 BSC
5.00
5.20
7.00 BSC
5.00
5.20
0.50 BSC
0.20
−−−
0.30
0.50
A
0.08 C
SOLDERING FOOTPRINT*
A1
NOTE 4
C
SIDE VIEW
D2
DETAIL A
2X
SEATING
PLANE
5.20
1
K
13
25
12
2X
7.30
48X
0.63
E2
1
48
48X
L
48X
36
37
e
e/2
48X
BOTTOM VIEW
0.30
b
0.10 C A B
0.05 C
NOTE 3
0.50 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
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