YAGEO ATV321DR-075DBL Chip resistors rf attenuator Datasheet

DATA SHEET
CHIP RESISTORS RF ATTENUATORS
ATV321 (Pb Free)
Product specification – Oct 12, 2004 V.0
SIZE 0404
Product specification
Chip Resistors RF Attenuators
AT
SERIES
2
7
V321 (0404) / Pb Free
SCOPE
This specification describes ATV321 series chip attenuators with lead-free terminations made by thick film process.
ORDERING INFORMATION
Part number is identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and
resistance value.
YAGEO ORDERING CODE
CTC
CODE
ATV321
X X X XX XXXX L
(1) (2) (3)
(4)
(5)
(6)
(1) TOLERANCE
B = ±0.2 dB
C = ±0.3 dB
D = ±0.5 dB
F = ±1 dB
G = ±2 dB
(2) PACKAGING TYPE
R = Paper/PE taping reel
(3) TEMPERATURE COEFFICIENT OF RESISTANCE
– = Not applicable
(4) TAPING REEL
07 = 7 inch dia. Reel
7H = Half quality packing on 7"reel
Attenuation value, tolerance v.s. 12 NC code
Attenuation Standard
value (dB) Tol.(dB) 12 NC
1
2
3
4
5
6
7
8
9
10
15
20
Optional
Tol.(dB) 12 NC
±0.3
2350 703 11012 L
±0.2
2350 703 11011 L
±0.3
2350 703 11022 L
±0.2
2350 703 11021 L
±0.3
2350 703 11032 L
±0.2
2350 703 11031 L
±0.3
2350 703 11042 L
±0.2
2350 703 11041 L
±0.3
2350 703 11052 L
±0.2
2350 703 11051 L
±0.5
2350 703 11063 L
±0.3
2350 703 11062 L
±0.5
2350 703 11073 L
±0.3
2350 703 11072 L
±0.5
2350 703 11083 L
±0.3
2350 703 11082 L
±0.5
2350 703 11093 L
±0.3
2350 703 11092 L
±0.5
2350 703 11103 L
±0.3
2350 703 11102 L
±1.0
2350 703 11154 L
±0.5
2350 703 11153 L
±2.0
2350 703 11205 L
±1.0
2350 703 11204 L
(non preferrend)
(5) ATTENUATION VALUE
1 dB to 20 dB shown in the table of “Attenuation value,
tolerance v.s. 12 NC code”.
ORDERING EXAMPLE
The ordering code of an ATV321 attenuator with
2±0.3 dB attenuation, supplied in 7-inch tape reel is:
ATV321CR-072dBL.
(6) RESISTOR TERMINATIONS
L = Lead free terminations (pure Tin)
NOTE
1. The “L” at the end of the code is only for ordering. On the reel
label, the standard CTC will be mentioned an additional stamp
“LFP”= lead free production.
2. Products with lead in terminations fulfil the same requirements
as mentioned in this datasheet.
3. Products with lead in terminations will be phased out in the
coming months (before July 1st, 2006)
www.yageo.com
Oct 12, 2004 V.0
Product specification
Chip Resistors RF Attenuators
AT
SERIES
3
7
V321 (0404) / Pb Free
MARKING
No marking.
CONSTRUCTION
The attenuators are constructed on a high-grade
ceramic body (aluminium oxide). The internal
circuit is applied to the top surface of the substrate,
and its design determines the required attenuation
value. The attenuation layer is covered with a
protective coating and a marking dot indicates input
pin 1 as shown in the connection diagram of Fig.1.
The rectangular marker designates input pin 1.
1
3
input
signal
Finally, the four external end terminations are
added. To guarantee optimum solderability the
outer layer of the terminations are lead free (pure
Tin).
attenuated
output signal
2
4
HBK077
Fig. 1 Connection diagram
DIMENSIONS
Table 1
TYPE
ATV321
L
P
L (mm)
1.0 ±0.10
W (mm)
1.0 ±0.10
T (mm)
0.35 ±0.05
A (mm)
0.33 ±0.10
B (mm)
0.15 ±0.10
P (mm)
0.65 ±0.10
D (mm)
0.25 ±0.10
T
A
B
D
W
SCR019
Fig. 2 Attenuator dimensions
For dimension see Table 1
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Oct 12, 2004 V.0
Product specification
Chip Resistors RF Attenuators
AT
ELECTRICAL CHARACTERISTICS
FOOTPRINT AND SOLDERING
PROFILES
Table 2
ATV321 / 40 mW
CHARACTERISTICS
Attenuation Range
1 dB to 20 dB
1 dB to 5 dB
Attenuation tolerance
4
7
V321 (0404) / Pb Free
SERIES
±0.3 dB (optional: ±0.2 dB)
6 dB and 10 dB
±0.5 dB (optional: ±0.3 dB)
15 dB
±1.0 dB (optional: ±0.5 dB)
20 dB
±2.0 dB (optional: ±1.0 dB)
Characteristic impedance
50 Ω
1 dB to 10 dB DC to 2.5 GHz
Frequency Range
15 dB and 20 dB DC to 2.0 GHz
VSWR
1.3 max.
Maximum permissible voltage
For recommended footprint and
soldering profiles, please see the
special data sheet “Chip resistors
mounting”.
ENVIRONMENTAL DATA
For material declaration
information (IMDS-data) of the
products, please see the
separated info “Environmental
data”.
50 V (DC or RMS)
Power rating
40 mW
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
PRODUCT TYPE
PACKING STYLE
REEL DIMENSION
ATV321
Paper / PE Taping Reel (R)
7" (178 mm)
QUANTITY PER REEL
10,000 units
7" (half quality packing)
5,000 units / not preferred
NOTE
1. For Paper/PE tape and reel specification/dimensions, please see the special data sheet “Packing” document.
FUNCTIONAL DESCRIPTION
POWER RATING
ATV321rated power at 70°C is 40 mW
RATED VOLTAGES
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by
the following formula:
V=√(P X R)
Where
V=Continuous rated DC or
AC (rms) working voltage (V)
P=Rated power (W)
ndbook,
P halfpage
MLB206
max
(%Prated )
100
50
0
55
0
50
70
100 125
o
Tamb ( C)
Fig. 3 Maximum dissipation (Pmax) in percentage of rated power
as a function of the operating ambient temperature (Tamb )
R=Resistance value (X)
www.yageo.com
Oct 12, 2004 V.0
Product specification
Chip Resistors RF Attenuators
AT
SERIES
5
7
V321 (0404) / Pb Free
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Thermal Shock
TEST METHOD
PROCEDURE
REQUIREMENTS
MIL-STD-202F-method 107G;
At –65 (+0/–10) °C for 2 minutes and at +125
(+10/–0) °C for 2 minutes; 25 cycles
Max.: ±0.3 dB
2.5 × RCWV applied for 5 seconds at room
temperature
Max.: ±0.3 dB
IEC 60115-1 4.13
MIL-STD-202F-method 302;
RCOV for 1 minute
≥10 GΩ
IEC 60115-1 4.6.1.1
Type
IEC 60115-1 4.19
Short Time
Overload
Insulation
Resistance
MIL-R-55342D-Para 4.7.5;
Voltage (DC)
Resistance to
Soldering
Heat
MIL-STD-202F-method 210C;
Life
MIL-STD-202F-method 108A;
Solderability
Bending
Strength
No visible damage
No visible damage
ATV321
50 V
Unmounted chips; 260 ±5 °C for 10 ±1
seconds
Max.: ±0.1 dB
Max.: ±0.3 dB
IEC 60115-1 4.25.1
At 70±2 °C for 1,000 hours; RCWV applied for
1.5 hours on and 0.5 hour off
MIL-STD-202F-method 208A;
Solder bath at 245±3 °C
Well tinned (≥95% covered)
IEC 60115-1 4.17
Dipping time: 2±0.5 seconds
No visible damage
Resistors mounted on a 90 mm glass epoxy
resin PCB (FR4)
Max.: ±0.3 dB
IEC 60115-1 4.18
JIS C 5202.6.14;
IEC 60115-1 4.15
No visible damage
No visible damage
Bending: 5 mm
Humidity
(steady state)
Leaching
Moisture
Resistance
Heat
JIS C 5202 7.5;
1,000 hours; 40±2 °C; 93(+2/–3)% RH
IEC 60115-8 4.24.8
RCWV applied for 1.5 hours on and 0.5 hour off
EIA/IS 4.13B;
Solder bath at 260±5 °C
IEC 60115-8 4.18
Dipping time: 30±1 seconds
MIL-STD-202F-method 106F;
42 cycles; total 1,000 hours
Max.: ±0.3 dB
IEC 60115-1 4.24.2
Shown as Fig. 4
No visible damage
Max.: ±0.3 dB
No visible damage
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Oct 12, 2004 V.0
Product specification
Chip Resistors RF Attenuators
75
AT
80 − 98%
RH
90 − 98% RH
temperature
[°C]
SERIES
90 − 98% RH
80 − 98%
RH
6
7
V321 (0404) / Pb Free
90 − 98% RH
initial drying
24 hours
rate of change of temperature is unspecified,
however, specimens shall not be subjected to
radiant heating from chamber conditioning processes
50
end of final cycle;
measurements
as specified in 2.7
+10 °C (+18 °F)
−2 °C (−3.6 °F)
25
initial measurements
as specified in 2.2
0
temperature
tolerance
±2 °C (±3.6 °F)
unless otherwise
specified
voltage applied as specified in 2.4
STEP1
STEP2
prior to first
cycle only
HBK073
optional sub-cycle if specified
(2.3); sub-cycle performed during
any 5 of the first 9 cycles; humidity
uncontrolled during sub-cycle
circulation of conditioning air shall be at a
minimum cubic rate per minute equivalent to
10 times the volume of the chamber
STEP3
STEP4
STEP5
STEP6
STEP7
one cycle 24 hours; repeat as specified in 2.5
0
5
10
15
20
25
time [h]
Fig. 4 Moisture resistance test requirements
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Oct 12, 2004 V.0
Product specification
Chip Resistors RF Attenuators
AT
SERIES
7
7
V321 (0404) / Pb Free
REVISION HISTORY
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 0
Oct 12, 2004
-
- First issue of this specification for ATV321 series with lead-free
terminations
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Oct 12, 2004 V.0
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