ACFF-1024 ISM Bandpass Filter (2401 – 2482 MHz) Data Sheet Description Features The Avago ACFF-1024 is a miniaturized Bandpass Filter designed for use in the 2.4 GHz Industrial, Scientific and Medical (ISM) band. • 50 Ω Input/Output The ACFF-1024 is designed to enable concurrent operation of Wireless LAN and Bluetooth applications that coexist with other wireless standards, such as 2.5 GHz WiMAX, PCS, and LTE Bands 7 and 40, without performance degradations due to interference. • No external matching required • Low Insertion Loss, High Interference Rejection - Enables concurrent use of other 2.5 GHz Bands • Subminiature Size - 1.1 x 1.4 mm Footprint - 0.80 mm Max Height The ACFF-1024 is designed with Avago Technologies’ innovative Film Bulk Acoustic Resonator (FBAR) technology, which makes possible ultra-small, high-Q filters at a fraction of their usual size. • High Power Rating The ACFF-1024 also utilizes Avago Technologies’ advanced Microcap bonded-wafer technology. This chip scale miniaturization process results in a package size of only 1.4 x 1.1 mm and maximum height of 0.80 mm. - –40 °C to +85 °C • Environmental The ACFF-1024 is compatible with high volume, lead-free SMT soldering processes and can be direct surface mounted to a PCB or a transfer molded module. - TBBPA Free Specifications Functional Block Diagram • Performance guaranteed –30 °C to +85 °C Port 1 Port 2 TX/RX (Pin 1) ANT (Pin 4) - +27 dBm Abs Max Input Power • Operating Temperature Range - RoHS 6 Compliant - Halogen free • Low Insertion Loss • High Interferer Rejection Applications 802.11 b/g/n WLAN Access Point and Small Cell BTS with embedded WLAN functionality ACFF-1024 Electrical Specifications [2], Z0 = 50 Ω, Tc [1] -30 °C to +85 °C Units Min Typ [3] Max Symbol Parameter S21 Insertion Loss [4] 2402.5 – 2421.5 MHz 2407.5 – 2426.5 MHz 2412.5 – 2471.5 MHz 2457.5 – 2476.5 MHz 2462.5 – 2481.5 MHz ΔS21 Amplitude Ripple (p-p) [4], +25 °C 2402.5 – 2421.5 MHz (Wi-Fi Ch 1) 2407.5 – 2426.5 MHz (Wi-Fi Ch 2) 2412.5 – 2471.5 MHz (Wi-Fi Ch 3 – 11) 2457.5 – 2476.5 MHz (Wi-Fi Ch 12) 2462.5 – 2481.5 MHz (Wi-Fi Ch 13) dB S21 Attenuation, 800 – 2300 MHz dB S21 Attenuation [5] in LTE Band 40, 2300 – 2365 MHz dB S21 Attenuation [5] in LTE Band 40, 2365 – 2370 MHz –40 °C –30 °C to +25 °C +25 °C to +55 °C +55 °C to +85 °C dB Attenuation [5] in LTE Band 7 (WiMAX), 2500 – 2505 MHz –40 °C –30 °C to –10 °C –10 °C to +25 °C +25 °C to +85 °C dB S21 Attenuation [5] in LTE Band 7 (WiMAX), 2505 – 2690 MHz S21 Attenuation [5] in LTE Band 38, 2570 S21 2H S11, S22 S21 dB (Wi-Fi Ch 1) (Wi-Fi Ch 2) (Wi-Fi Ch 3 – 11) (Wi-Fi Ch 12) (Wi-Fi Ch 13) 1.6 1.4 1.3 1.5 1.7 2.6 2.2 2.0 2.1 3.0 -40 °C Typ 1.8 1.6 1.3 1.5 1.6 1.0 0.8 0.7 0.6 1.0 1.4 1.1 0.9 0.7 0.9 45 54 54 50 53 52 50 43 30 58 58 53 42 52 55 56 59 64 dB 57 67 68 dB 55 68 68 Attenuation, 2690 – 7500 MHz dB 40 55 55 2nd Harmonic Level, CW Tone, 2442 MHz, 22.5 dBm at Port 1 dBc 57 67 Return Loss (SWR), 2402.5 – 2481.5 MHz, +25 °C dB 9 16 (1.4) – 2620 MHz 58 64 (2.1) 16 (1.4) Notes: 1. Tc is the case temperature and is defined as the temperature of the underside of the Filter where it makes contact with the circuit board. 2. Min/Max specifications are guaranteed at the indicated temperature, unless otherwise noted. 3. Unless otherwise noted, Typical data is the average value (arithmetic mean) of the parameter over the indicated band at 25 °C. 4. Channel average Insertion Loss, which is obtained by averaging |S21| over the center 19 MHz of channels and converting to dB value. 5. Channel average Insertion Loss, which is obtained by averaging |S21| over 5 MHz channels and converting to dB value. Absolute Maximum Ratings [1] Parameter Unit Value Storage temperature °C –40 to +125 Maximum RF Input Power to Pin 1 (Port 1, Tx/Rx) [4] dBm +27 Maximum Recommended Operating Conditions [2] Parameter Unit Value Operating temperature, Tc [3] °C –40 to +85 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 3. Tc is defined as case temperature, the temperature of the underside of the Filter where it makes contact with the circuit board. 4. The ACFF-1024 is not symmetrical. Port 1 (Pin 1) is designed for higher power handling and is connected to the Tx/Rx blocks; Port 2 (Pin 4) is connected to the system antenna. 2 0 0 -0.5 -5 -1.0 -10 Return Loss (dB) Insertion Loss (dB) ACFF-1024 Typical Performance at Tc = 25 °C -1.5 -15 -2.0 -25 -3.0 2400 2410 2420 2430 2440 2450 Frequency (MHz) 2460 2470 2420 2430 2440 2450 Frequency (MHz) 2460 2470 2480 Figure 2. Input, Output Port Return Loss, 2400 – 2482 MHz 0 0 -10 -10 -20 -20 Insertion Loss (dB) Insertion Loss (dB) -30 2400 2410 2480 Figure 1. Insertion Loss, 2400 – 2482 MHz -30 -40 -50 -60 -70 -30 -40 -50 -60 -70 -80 2350 2400 2450 Frequency (MHz) 2500 -80 2550 Figure 3. Attenuation, 2350 – 2550 MHz 0 0 -10 -10 -20 -20 -30 -40 -50 -60 -30 -40 -50 -60 -70 -70 -80 1000 2000 3000 4000 5000 6000 7000 8000 Frequency (MHz) Figure 4. Wideband Attenuation, 100 – 8000 MHz Insertion Loss (dB) Insertion Loss (dB) S22 -20 -2.5 800 1000 1200 1400 1600 Frequency (MHz) Figure 5. Attenuation, 800 – 2300 MHz 3 S11 1800 2000 2200 -80 2300 2310 2320 2330 2340 2350 Frequency (MHz) Figure 6. Rejection in LTE Band 40 (2300 – 2370 MHz) 2360 2370 0 0 -10 -10 -20 -20 Insertion Loss (dB) Insertion Loss (dB) ACFF-1024 Typical Performance at Tc = 25 °C -30 -40 -50 -60 -70 2550 2600 Frequency (MHz) -50 -60 -80 2570 2650 Figure 7. Rejection in 2.5 GHz WiMAX and LTE Band 7 (2500 – 2690 MHz) -10 Group Delay (s) -20 -30 -40 -50 -60 -70 3000 4000 5000 6000 Frequency (MHz) 0.8 1 2590 2600 Frequency (MHz) 7000 50n 45n 40n 35n 30n 25n 20n 15n 10n 5n 0 2410 2420 2430 2440 2450 2460 2470 2480 Frequency (MHz) 0.8 1.5 1 1.5 0.6 2 0.4 2 0.4 3 3 4 0.2 4 5 0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 0.2 5 10 20 50 10 2050 -50 -20 -10 -0.2 -5 -4 0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 20 50 10 2050 -50 -20 -10 -0.2 -5 -4 -3 -0.4 -3 -0.4 -2 -0.6 -0.8 -1 -1.5 Figure 11. Input Port Impedance, 2400 – 2482 MHz 4 2610 Figure 10. Group Delay (ns), 2400 – 2482 MHz Figure 9. Attenuation, 2690 – 7500 MHz 0.6 2580 Figure 8. Rejection in LTE Band 38 (2570 – 2620 MHz) 0 Insertion Loss (dB) -40 -70 -80 2500 -80 -30 -2 -0.6 -0.8 -1 -1.5 Figure 12. Output Port Impedance, , 2400 – 2482 MHz ACFF-1024 Performance at Low Temperature Typical performance of the ACFF-1024 at low temperature is shown in Figure 13 and Figure 14 for Tc = 25 °C and –40 °C. 0 0 -10 -1.0 Insertion Loss (dB) Insertion Loss (dB) -0.5 Tc = –40 °C -1.5 Tc = +25 °C -2.0 -2.5 Tc = –40 °C -20 Tc = +25 °C -30 -40 -50 -60 -70 -3.0 2400 2410 2420 2430 2440 2450 Frequency (MHz) 2460 -80 2350 2470 2480 Figure 13. Insertion Loss, 2400 – 2482 MHz, +25 °C and –40 °C 2400 2450 Frequency (MHz) 2500 2550 Figure 14. Attenuation, 2350 – 2550 MHz, +25 °C and –40 °C Note: These data are measured on units different from those in previous performance graphs. 1.40 (1.48 MAX) GND (3) 0.69 (0.80 MAX) 0.500 0.500 GND (2) BYW XXXX ANT (4) PIN 1 MARK (2) TX/RX (1) (3) (1) 1.10 (1.18 MAX) 0.575 0.288 GND (5) (5) (4) 0.075 TOP VIEW Notes: 1. Dimensions in millimeters 2. Tolerance: X.XX ± 0.05 X.XXX ± 0.025 3. Dimensions nominal unless otherwise noted 4. Contact areas are gold plated 5. Package marking: A = Avago logo B = ACFF-1024 Y = Year (last digit) W = Work Week XXXX = Lot number Figure 15. Package Outline Drawing and Marking 5 SIDE VIEW BOTTOM VIEW Pin Connections: 0.325 1 Port 1 (TX/RX) 2, 3, 5 GND 4 Port 2 (ANT) 0.250 PAD DETAIL 0.100 4×9×2 ARRAY, 0.500 PITCH Ø 0.250 THRU VIAS 0.245 Notes: 1. Dimensions in mm 2. Top View Ø 0.100 µVIA ARRAY 0.200 PITCH, LAYERS 1-2 PLUGGED AND SMOOTHED 0.180 0.109 0.109 Figure 16. PCB Layout A circuit board layout using the principles illustrated in Figure 16 is recommended to optimize performance of the ACFF-1024. Note: The ACFF-1024 is not symmetrical. Pin 1 (Port 1) is designed for higher power handling and should be connected to the Tx/Rx block; Pin 4 (Port 2) is connected to the system antenna. High isolation between Input and Output is achieved by: Due to the limitation of the PCB via to PCB thickness aspect ratio, micro vias (Ǿ 0.100) are used in the area between land pads to connect metal Layer1 and Layer2. For all other areas, larger thru vias are used to connect all layers. Ground vias under the ACFF-1024 mounting area also provide heat sinking for the device to minimize shifting of the pass band over temperature. 1. Maintaining a continuous ground plane around the I/O connections and filter land print area, and 2. Surrounding the I/O ports with sufficient ground vias to enclose the connections in a “Faraday cage.” Table 1. PCB Stack-up Layer Type Material Thickness (mm) Layer 1 Conductor Copper 0.055 Dielectric Nelco N4000 13EP 0.075 Conductor Copper 0.040 Dielectric Nelco N4000 13EP 0.590 Conductor Copper 0.040 Dielectric Nelco N4000 13EP 0.075 Conductor Copper 0.055 Layer 2 Layer 3 Layer 4 6 Dielectric Constant (εr) 3.4 3.4 3.4 1.000 0.420 0.135 TYP* 2×0.250×0.325 LAND PAD 0.486 0.288 0.700 (REF) 2×0.550×0.070, CHAMFER 0.100×45° GROUND PLANE OPENING FOR LAND PAD Notes: 1. Dimensions in mm 2. Top View 3. Width of transmission line (*) is adjusted for 50 Ω 0.155 0.553 Figure 17. Recommended PCB Layout A recommended PCB layout design is shown in Figure 17. Transmission line dimensions (*) should be adjusted to maintain Zo of 50 Ω. The land pads of this PCB pattern are 1:1 with the ACFF1024 bottom metal pads. 5 x 0.250 x 0.325 0.575 0.200 (Typ) 0.500 0.500 Figure 18. Recommended Solder Mask (Dimensions in mm) 7 0.200 (Typ) 5 x 0.250 x 0.325 R 0.050 min 0.575 0.500 0.500 Figure 19. Recommended Solder Stencil (Dimensions in mm) A minimum corner radius of 50 µm is recommended to increase reliability of solder paste release from the stencil. The recommended solder stencil is designed such that the apertures match the opening in the solder mask 1:1. 2.00 ± 0.05 4.0 ± 0.10 ∅ 1.50 + 0.10 4.0 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 +0.30 8.00 –0.10 ∅ 0.50 ± 0.05 Figure 20. SMT Tape Packing PACKAGE PIN 1 ORIENTATION POCKET CAVITY Figure 21. Orientation in Tape 8 BYW XXXX BYW XXXX BYW XXXX BYW XXXX BYW XXXX SPROCKET HOLES TAPE WIDTH FRONT VIEW 1.5 min. 13.0 ± 0.2 21.0 ± 0.8 BACK VIEW NOTES: 1. Reel shall be labeled with the following information (as a minimum). a. manufacturer’s name or symbol b. Avago Technologies part number c. purchase order number d. date code e. quantity of units 2. A certificate of compliance (c of c) shall be issued and accompany each shipment of product. 3. Reel must not be made with or contain ozone depleting materials. 4. All dimensions in millimeters (mm) Shading indicates thru slots 18.4 max. 178 +0.4 -0.2 50 min. 25 min wide (ref) Slot for carrier tape insertion for attachment to reel hub (2 places 180° apart) Figure 22. SMT Reel Drawing 9 12.4 +2.0 -0.0 Package Moisture Sensitivity Feature Test Method Performance Moisture Sensitivity Level (MSL) at 260 °C JESD22-A113D Level 3 300 250 Temperature, °C 200 150 100 50 Tested profile shown. 0 0 50 100 150 200 250 300 PROFILE.GRF PROFILE. WMF 6 February 2003 R. Waugh Time, seconds Figure 23. Verified SMT Solder Profile Ordering Information Part Number No. of Devices Container ACFF-1024-BLK 100 Tape strip in Anti-static bag ACFF-1024-TR1 3000 7-inch (178 mm) Reel For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-3973EN - October 2, 2014