STMicroelectronics EIMF02-AV01F3 Dual audio and video line ipad, emi filter and esd protection Datasheet

EMIF02-AV01F3
Dual audio and video line IPAD™, EMI filter and ESD protection
Features
■
High-density capacitor
■
EMI low-pass filter and ESD protection
■
High-efficiency in EMI filtering
■
Lead-free package
■
400 µm pitch
■
Very small PCB footprint: 0.91 mm x 1.31 mm
■
Very thin package: 0.605 mm
■
High reliability offered by monolithic integration
■
Reduction of parasitic elements thanks to CSP
integration
Flip Chip
5 bumps
Figure 1.
Pin configuration (bump side
view)
1
Complies with the following standards
■
■
A
IEC 61000-4-2 level 4 on external pin (A2, C2)
– 15 kV (air discharge)
– 8 kV (contact discharge)
B
IEC 61000-4-2 level 1 on internal pin (A1, C1)
– 2 kV (air discharge)
– 2 kV (contact discharge)
C
Figure 2.
Schematic
Application
■
2
R
A2
A1
Dual audio and video line interface protection
and filtering in mobile phones
C
2 kV
Description
15 kV
B2
Gnd
The EMIF02-AV01F3 is a highly integrated array
designed to suppress EMI / RFI noise and provide
impedance matching for mobile phones and
portable applications.
2 kV
The EMIF02-AV01F3 is in Flip Chip package to
offer space saving and high RF performance.
15 kV
C
C2
C1
R
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 3
1/7
www.st.com
7
Characteristics
1
EMIF02-AV01F3
Characteristics
Table 1.
Absolute maximum ratings (Tamb = 25 °C)
Symbol
Vpp
Tj
PTOT
Parameter
Unit
Internal pins (A1, C1)
ESD discharge IEC 61000-4-2, air discharge
ESD discharge IEC 61000-4-2, contact discharge
External pins (A2, C2)
ESD discharge IEC 61000-4-2, air discharge
ESD discharge IEC 61000-4-2, contact discharge
15
8
Maximum junction temperature
125
°C
Total Power Dissipation
200
mW
2
2
kV
Top
Operating temperature range
-40 to +85
°C
Tstg
Storage temperature range
-55 to 150
°C
Table 2.
Electrical characteristics (Tamb = 25 °C)
Symbol
Parameters
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
VCL
Clamping voltage
Rd
Dynamic impedance
IPP
Peak pulse current
RI/O
Series resistance between
input and output
Cline
Input capacitance per line
Symbol
Test conditions
VBR
IR = 1 mA
IRM
VRM = 3 V per line
RI/O
Cline
2/7
Value
Vline = 0 V, VOSC = 30 mV, F = 100 kHz
I
IPP
VCL VBR VRM
IR
IRM
IRM
IR
V
VRM VBR VCL
IPP
Min
Typ
14
Max
Unit
18
V
0.5
µA
12
15
18
Ω
2.56
3.2
3.84
nF
EMIF02-AV01F3
Figure 3.
0.00
Characteristics
S21 (dB) attenuation
Figure 4.
Analog crosstalk
dB
dB
0.00
-10.00
-10.00
-20.00
-30.00
-20.00
-40.00
-50.00
-30.00
-60.00
-70.00
-40.00
-80.00
-90.00
F (Hz)
10.0M
30.0M
100.0M
300.0M
Line 1
Figure 5.
F (Hz)
-100.00
-50.00
1.0G
1.0M
3.0G
3.0M
10.0M
30.0M
100.0M
300.0M
1.0G
3.0G
Xtalk 1/2
Line 2
Digital crosstalk
Figure 6.
ESD response to IEC 61000-4-2
(+15 kV air discharge) on one input
(VIN) and one output (VOUT)
INPUT : 10 V/Div
100 ns/Div
Vin = 1 V/d
OUTPUT : 10 V/Div
100 ns/Div
Vout = 5 mV/d
Figure 7.
ESD response to IEC 61000-4-2
(-15 kV air discharge) on one input
(VIN) and one output (VOUT)
Figure 8.
CLINE(nF)
INPUT : 10 V/Div
100 ns/Div
Line capacitance versus applied
voltage
3.5
F=100 kHz
VOSC=30 mVRMS
Tj=25 °C
3.0
2.5
2.0
OUTPUT : 10 V/Div
100 ns/Div
1.5
1.0
0.5
VLINE (V)
0.0
0
1
2
3
4
5
6
3/7
Ordering information scheme
2
EMIF02-AV01F3
Ordering information scheme
Figure 9.
Ordering information scheme
EMIF
yy
-
xx zz
Fx
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
or
2 letters = application
2 digits = version
Package
F = Flip Chip
x = 3: lead free, pitch = 400 µm, bump = 255 µm
3
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 10. Package dimensions
400 µm ± 40
400 µm ± 50
605 µm ± 55
1310 µm ± 30 µm
255 µm ± 40
910 µm ± 30 µm
4/7
255 µm
255 µm
EMIF02-AV01F3
Ordering information
Figure 11. Footprint
Figure 12. Marking
Dot
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Copper pad Diameter:
220 µm recommended
260 µm maximum
Solder mask opening:
300 µm minimum
E
x x z
y ww
Solder stencil opening:
220 µm recommended
Figure 13. Flip Chip tape and reel specification
Dot identifying Pin A1 location
3.5 ± 0.1
xxz
yww
ST E
1.41
xxz
yww
4 ± 0.1
User direction of unreeling
All dimensions in mm
Note:
ST E
xxz
yww
ST E
8 ± 0.3
1.01
0.71 ± 0.05
1.75 ± 0.1
Ø 1.5 ± 0.1
4 ± 0.1
Note: More information is available in the application note:
AN2348:"Flip Chip: Package description and recommendations for use"
AN1751: “EMI filters: Recommendations and measurements”
4
Ordering information
Table 3.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EIMF02-AV01F3
HH
Flip Chip
1.4 mg
5000
Tape and reel 7”
5/7
Revision history
5
EMIF02-AV01F3
Revision history
Table 4.
6/7
Document revision history
Date
Revision
Changes
06-Oct-2006
1
Initial release.
11-Oct-2006
2
Corrected test conditions for Cline in Table 2.
17-Apr-2008
3
Updated ECOPACK statement. Updated Figure 9, Figure 10 and
Figure 13. Reformatted to current standards.
EMIF02-AV01F3
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