TI1 INA240A3QPWRQ1 Current-sense amplifier Datasheet

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INA240-Q1
SBOS808 – AUGUST 2016
1 Features
3 Description
•
•
The INA240-Q1 device is a automotive-qualified,
voltage-output, current-sense amplifier family with
enhanced PWM rejection that can sense drops
across shunt resistors over a wide common-mode
voltage range from –4 V to 80 V, independent of the
supply voltage. The negative common-mode voltage
allows the device to operate below ground,
accommodating the flyback period of typical solenoid
applications. Enhanced PWM rejection provides high
levels of suppression for large common-mode
transients (dV/dt) in systems that use pulse width
modulation (PWM) signals (such as motor drives and
solenoid control systems). This feature allows for
accurate current measurements without large
transients and associated recovery ripple on the
output voltage.
1
•
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature
Range
– Device HBM ESD Classification Level H2
– Device CDM ESD Classification Level C5
Enhanced PWM Rejection
Excellent CMRR
– > 120-dB DC CMRR
– 93-dB AC CMRR at 50 kHz
Wide Common-Mode Range: –4 V to 80 V
Gain Error: 0.25% (Maximum) With 10 ppm/°C
Maximum Drift
Offset Voltage: ±100 μV With 0.3 μV/°C Maximum
Drift
Available Gains:
– INA240A1-Q1: 20 V/V
– INA240A2-Q1: 50 V/V
– INA240A3-Q1: 100 V/V
– INA240A4-Q1: 200 V/V
Quiescent Current: 2.5 mA (Maximum)
This device operates from a single 2.7-V to 5.5-V
power supply, drawing a maximum of 2.5 mA of
supply current. Four fixed gains are available: 20 V/V,
50 V/V, 100 V/V, and 200 V/V. The low offset of the
zero-drift architecture enables current sensing with
maximum drops across the shunt as low as 10-mV
full-scale. All versions are specified over the extended
operating temperature range (–40°C to +125°C), and
are offered in an 8-pin TSSOP package.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
2 Applications
INA240-Q1
•
•
•
•
•
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Electronic Power Steering
Stability Control
Traction Control
Motor and Actuator Control
Solenoid and Valve Control
TSSOP (8)
Typical Application
3.00 mm × 4.40 mm
Enhanced PWM Rejection
300
8
Common Mode Step
INA240 Vout
IN-
IN+
+
OUT
REF1
REF2
Common Mode Step(V)
Supply
(2.7V to 5.5V)
7.2
260
6.4
240
5.6
220
4.8
200
4
180
3.2
160
2.4
140
1.6
120
0.8
100
0
80
-0.8
60
-1.6
40
-2.4
20
-3.2
0
-4
-20
-40
-1
INA240 Vout(V)
280
-4.8
-5.6
0
1
2
3
4
Time(uS)
5
6
7
8
9
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
PRODUCT PREVIEW
INA240-Q1 Automotive, Wide Common-Mode Range, Voltage Output, High- or Low-Side
Bidirectional, Zero-Drift, Current-Sense Amplifier With Enhanced PWM Rejection
INA240-Q1
SBOS808 – AUGUST 2016
www.ti.com
Table of Contents
1
2
3
4
5
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device and Documentation Support....................
1
1
1
2
3
5.1 Receiving Notification of Documentation Updates.... 3
5.2
5.3
5.4
5.5
6
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
3
3
3
3
Mechanical, Packaging, and Orderable
Information ............................................................. 4
4 Revision History
DATE
REVISION
NOTES
August 2016
SBOS808*
Initial release.
PRODUCT PREVIEW
2
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: INA240-Q1
INA240-Q1
www.ti.com
SBOS808 – AUGUST 2016
5 Device and Documentation Support
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: INA240-Q1
3
PRODUCT PREVIEW
5.3 Trademarks
INA240-Q1
SBOS808 – AUGUST 2016
www.ti.com
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PRODUCT PREVIEW
4
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: INA240-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jul-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
INA240A1QPWRQ1
PREVIEW
TSSOP
PW
8
2000
TBD
Call TI
Call TI
-40 to 125
INA240A2QPWRQ1
PREVIEW
TSSOP
PW
8
2000
TBD
Call TI
Call TI
-40 to 125
INA240A3QPWRQ1
PREVIEW
TSSOP
PW
8
2000
TBD
Call TI
Call TI
-40 to 125
INA240A4QPWRQ1
PREVIEW
TSSOP
PW
8
2000
TBD
Call TI
Call TI
-40 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jul-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
SCALE 2.800
SMALL OUTLINE PACKAGE
C
6.6
TYP
6.2
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
1
3.1
2.9
NOTE 3
2X
1.95
4
5
B
4.5
4.3
NOTE 4
SEE DETAIL A
8X
0.30
0.19
0.1
C A
1.2 MAX
B
(0.15) TYP
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
1
8
(R0.05)
TYP
SYMM
6X (0.65)
5
4
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
(R0.05) TYP
1
8
SYMM
6X (0.65)
5
4
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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