ETC2 MSFC110 Thyristor/diode module Datasheet

MSFC110
Thyristor/Diode Modules
VRRM / VDRM
IFAV / ITAV
800 to 1600V
110Amp
Applications




Circuit
Features


MSFC
1
2
Power Converters
Lighting Control
DC Motor Control and Drives
Heat and temperature control
3


5
4


International standard package
High Surge Capability
Glass passivated chip
Simple Mounting
Heat transfer through aluminum oxide
DBCceramic isolated metal baseplate
UL E243882 approved
Module Type
TYPE
VRRM/VDRM
VRSM
MSFC110-08
MSFC110-12
MSFC110-16
800V
1200V
1600V
900V
1300V
1700V
◆Diode
Maximum Ratings
Symbol
Values
Units
ID
Output Current(D.C.)
Tc=85℃
110
A
IFSM
Surge forward current
t=10mS Tvj =45℃
2250
A
25000
As
2
it
Visol
Tvj
Tstg
Mt
Item
Circuit Fusing Consideration
Isolation Breakdown Voltage(R.M.S)
3000
V
-40 to +125
℃
Storage Temperature
-40 to +125
℃
To terminals(M5)
3±15%
Nm
To heatsink(M6)
5±15%
Nm
100
g
Mounting Torque
Module(Approximately)
Thermal Characteristics
Symbol
Item
Rth(j-c) Thermal Impedance, max.
Rth(c-s)
a.c.50HZ;r.m.s.;1min
2
Operating Junction Temperature
Ms
Weight
Conditions
Thermal Impedance, max.
Values
Units
Junction to Case
Conditions
0.14
℃/W
Case to Heatsink
0.10
℃/W
Electrical Characteristics
Symbol
Item
VFM
Forward Voltage Drop, max.
IRRM
Repetitive Peak Reverse Current,
max.
Document Number: MSFC110
Sep.06,2013
Conditions
T=25℃ IF =300A
Tvj =25℃ VRD=VRRM
Tvj =125℃ VRD=VRRM
Values
Min.
Typ.
Max.
1.65
≤0.5
≤6
Units
V
mA
mA
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MSFC110
◆Thyristor
Maximum Ratings
Symbol
Values
Units
ITAV
Average On-State Current
Sine 180 ;Tc=85℃
110
A
ITSM
Surge On-State Current
TVJ =45℃ t=10ms, sine
TVJ =125℃ t=10ms, sine
2250
1900
A
Circuit Fusing Consideration
TVJ =45℃ t=10ms, sine
TVJ =125℃ t=10ms, sine
25000
18000
A2s
Isolation Breakdown Voltage(R.M.S)
a.c.50HZ;r.m.s.;1min
3000
V
Operating Junction Temperature
-40 to +130
℃
Storage Temperature
-40 to +125
℃
To terminals(M5)
3±15%
Nm
To heatsink(M6)
5±15%
Nm
2
it
Visol
Tvj
Tstg
Mt
Item
Mounting Torque
Ms
Conditions
o
di/dt
Critical Rate of Rise of On-State
Current
TVJ= TVJM , 2/3VDRM ,IG =500mA
Tr<0.5us,tp>6us
150
A/us
dv/dt
Critical Rate of Rise of Off-State
Voltage, min.
TJ=TVJM ,2/3VDRM linear voltage rise
1000
V/us
a
Maximum allowable acceleration
50
m/s
Values
Units
Junction to Case
0.28
℃/W
Case to Heatsink
0.20
℃/W
Thermal Characteristics
Symbol
Item
Thermal Impedance, max.
Rth(j-c)
Rth(c-s)
Thermal Impedance, max.
Conditions
2
Electrical Characteristics
Symbol
Item
VTM
Peak On-State Voltage, max.
Repetitive Peak Reverse Current,
max. / Repetitive Peak Off-State
Current, max.
Conditions
Values
Min. Typ. Max.
Units
1.72
V
TVJ=TVJM ,VR=VRRM ,VD=
VDRM
20
mA
On state threshold voltage
For power-loss
calculations only
(TVJ =125℃)
0.9
V
Value of on-state
slope resistance. max
TVJ =TVJM
2
mΩ
VGT
Gate Trigger Voltage, max.
TVJ =25℃ , VD =6V
3
V
IGT
Gate Trigger Current, max.
TVJ =25℃ , VD =6V
150
mA
VGD
Non-triggering gate voltage, max.
TVJ=125℃,VD =2/3VDRM
0.25
V
IGD
IRRM/IDRM
VTO
rT
T=25℃ IT =300A
Non-triggering gate current, max.
TVJ =125℃, VD =2/3VDRM
6
mA
IL
Latching current, max.
TVJ =25℃ , RG = 33 Ω
300
600
mA
IH
Holding current, max.
TVJ =25℃ , VD =6V
150
250
mA
tgd
Gate controlled delay time
TVJ=25℃,
IG=1A, diG/dt=1A/us
tq
Circuit commutated turn-off time
TVJ =TVJM
Document Number: MSFC110
Sep.06,2013
1
us
100
us
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2
MSFC110
Performance Curves
200
200
W
rec.120
A
sin.180
DC
150
DC
160
rec.60
120
rec.30
sin.180
100
rec.120
80
rec.60
50
rec.30
40
PTAV
ITAVM
0
0
ITAV
50
100
A 150
0
0
Fig1. Power dissipation
50
100
2500
Zth(j-S)
℃/ W
Zth(j-C)
0.25
0.001
t 0.01
0.1
1
10
S 100
50HZ
A
1250
0
Fig3. Transient thermal impedance
10
100
ms 1000
Fig4. Max Non-Repetitive Forward Surge
Current
300
A
℃ 130
Fig2.Forward Current Derating Curve
0.50
0
Tc
150 ℃
Typ.
200
max.
100
25℃
- - -125℃
IT
0
0
VTM
0.5
1.0
1.5
V 2.0
Fig5. Forward Characteristics
Document Number: MSFC110
Sep.06,2013
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3
MSFC110
100
1/2·MSFC110
V
20V;20Ω
15
10
10
50
W
(8
VGT
0W
(0
m
.5
m
s)
0W
(0
.1
m
s)
s)
∧
1
VG
Tvj
IGT
VGD125℃
0.1
1.1 0.001
PG(tp)
-40℃
25℃
125℃
IGD125℃
IG
0.01
0.1
1
10
A 100
Fig6. Gate trigger Characteristics
Package Outline Information
CASE: F1
×
Dimensions in mm
Document Number: MSFC110
Sep.06,2013
www.smsemi.com
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