TI1 M38510/32504BSA Octal, hex, and quad d-type flip-flop Datasheet

SN54LS377, SN54LS378, SN54LS379,
SN74LS377, SN74LS378, SN74LS379
OCTAL, HEX, AND QUAD D-TYPE FLIP-FLOPS WITH ENABLE
SDLS167 – OCTOBER 1976 – REVISED MARCH 1988
Copyright  1988, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54LS377, SN54LS378, SN54LS379,
SN74LS377, SN74LS378, SN74LS379
OCTAL, HEX, AND QUAD D-TYPE FLIP-FLOPS WITH ENABLE
SDLS167 – OCTOBER 1976 – REVISED MARCH 1988
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LS377, SN54LS378, SN54LS379,
SN74LS377, SN74LS378, SN74LS379
OCTAL, HEX, AND QUAD D-TYPE FLIP-FLOPS WITH ENABLE
SDLS167 – OCTOBER 1976 – REVISED MARCH 1988
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54LS377, SN54LS378, SN54LS379,
SN74LS377, SN74LS378, SN74LS379
OCTAL, HEX, AND QUAD D-TYPE FLIP-FLOPS WITH ENABLE
SDLS167 – OCTOBER 1976 – REVISED MARCH 1988
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-8992501EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8992501EA
SNJ54LS378J
JM38510/32504BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32504BRA
JM38510/32504BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32504BRA
JM38510/32504BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32504BSA
JM38510/32504BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32504BSA
M38510/32504BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32504BRA
M38510/32504BRA
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32504BRA
M38510/32504BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32504BSA
M38510/32504BSA
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510/
32504BSA
SN54LS377J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS377J
SN54LS377J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS377J
SN54LS378J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS378J
SN54LS378J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS378J
SN54LS379J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS379J
SN54LS379J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SN54LS379J
SN74LS377DW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS377
SN74LS377DW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS377
SN74LS377DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS377
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74LS377DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS377
SN74LS377DWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS377
SN74LS377DWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS377
SN74LS377N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS377N
SN74LS377N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS377N
SN74LS377N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
0 to 70
SN74LS377N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
0 to 70
SN74LS377NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS377N
SN74LS377NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS377N
SN74LS377NSR
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS377
SN74LS377NSR
ACTIVE
SO
NS
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
74LS377
SN74LS378D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS378
SN74LS378D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS378
SN74LS378DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS378
SN74LS378DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LS378
SN74LS378N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS378N
SN74LS378N
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN74LS378N
SN74LS378N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SN74LS378N3
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SN74LS379D
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN74LS379D
OBSOLETE
SOIC
D
16
TBD
Call TI
Call TI
0 to 70
SN74LS379J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
0 to 70
SN74LS379J
OBSOLETE
CDIP
J
16
TBD
Call TI
Call TI
0 to 70
SN74LS379N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SN74LS379N
OBSOLETE
PDIP
N
16
TBD
Call TI
Call TI
0 to 70
SNJ54LS377J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS377J
SNJ54LS377J
ACTIVE
CDIP
J
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS377J
SNJ54LS377W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS377W
SNJ54LS377W
ACTIVE
CFP
W
20
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS377W
SNJ54LS378FK
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
SNJ54LS378FK
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
SNJ54LS378J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8992501EA
SNJ54LS378J
SNJ54LS378J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
5962-8992501EA
SNJ54LS378J
SNJ54LS379FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
379FK
SNJ54LS379FK
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
SNJ54LS
379FK
SNJ54LS379J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS379J
SNJ54LS379J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
SNJ54LS379J
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2015
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS377, SN54LS378, SN54LS379, SN74LS377, SN74LS378, SN74LS379 :
• Catalog: SN74LS377, SN74LS378, SN74LS379
• Military: SN54LS377, SN54LS378, SN54LS379
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
SN74LS377DWR
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
SN74LS377NSR
SO
NS
20
2000
330.0
24.4
9.0
13.0
2.4
12.0
24.0
Q1
SN74LS378DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Aug-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LS377DWR
SOIC
DW
20
2000
367.0
367.0
45.0
SN74LS377NSR
SO
NS
20
2000
367.0
367.0
45.0
SN74LS378DR
SOIC
D
16
2500
333.2
345.9
28.6
Pack Materials-Page 2
PACKAGE OUTLINE
DW0020A
SOIC - 2.65 mm max height
SCALE 1.200
SOIC
C
10.63
TYP
9.97
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
20
1
13.0
12.6
NOTE 3
18X 1.27
2X
11.43
10
11
B
7.6
7.4
NOTE 4
20X
0.51
0.31
0.25
C A B
2.65 MAX
0.33
TYP
0.10
SEE DETAIL A
0.25
GAGE PLANE
0 -8
0.3
0.1
1.27
0.40
DETAIL A
TYPICAL
4220724/A 05/2016
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side.
5. Reference JEDEC registration MS-013.
www.ti.com
EXAMPLE BOARD LAYOUT
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
(R0.05)
TYP
10
11
(9.3)
LAND PATTERN EXAMPLE
SCALE:6X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4220724/A 05/2016
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DW0020A
SOIC - 2.65 mm max height
SOIC
20X (2)
SYMM
1
20
20X (0.6)
18X (1.27)
SYMM
11
10
(9.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
4220724/A 05/2016
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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