1 of 3 Creation Date : May 11, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012JB1E156M125AC TDK item description C2012JB1E156MT**** Applications Commercial Grade Feature General General (Up to 50V) Series C2012 [EIA 0805] Status Production Size Length(L) 2.00mm ±0.20mm Width(W) 1.25mm ±0.20mm Thickness(T) 1.25mm ±0.20mm Terminal Width(B) 0.20mm Min. Terminal Spacing(G) 0.50mm Min. 1.00mm to 1.30mm(Flow Soldering) Recommended Land Pattern (PA) 0.90mm to 1.20mm(Reflow Soldering) 1.00mm to 1.20mm(Flow Soldering) Recommended Land Pattern (PB) 0.70mm to 0.90mm(Reflow Soldering) 0.80mm to 1.10mm(Flow Soldering) Recommended Land Pattern (PC) 0.90mm to 1.20mm(Reflow Soldering) Electrical Characteristics Capacitance 15μF ±20% Rated Voltage 25VDC Temperature Characteristic JB(±10%) Dissipation Factor (Max.) 10% Insulation Resistance (Min.) 6MΩ Other Soldering Method Wave (Flow) Reflow AEC-Q200 No Packing Blister (Plastic)Taping [180mm Reel] Package Quantity 2000pcs ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 2 of 3 Creation Date : May 11, 2017 (GMT) Multilayer Ceramic Chip Capacitors C2012JB1E156M125AC Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.) Impedance C2012JB1E156M125AC ESR C2012JB1E156M125AC Capacitance C2012JB1E156M125AC C2012JB1E156M125AC Temperature Characteristic C2012JB1E156M125AC(No Bias) DC Bias Characteristic C2012JB1E156M125AC(DC Bias = 12.5V ) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. Ripple Temperature Rising C2012JB1E156M125AC(100kHz) C2012JB1E156M125AC(500kHz) C2012JB1E156M125AC(1MHz) Multilayer Ceramic Chip Capacitors C2012JB1E156M125AC Associated Images Land Pattern (Terminal Connection) ! Images are for reference only and show exemplary products. ! This PDF document was created based on the data listed on the TDK Corporation website. ! All specifications are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved. 3 of 3 Creation Date : May 11, 2017 (GMT)